MRC magnetron sputtering platform with high precision and high automation

Abstract

The application relates to the technical field of MRC magnetron sputtering platforms, in particular to a high-precision and high-automation MRC magnetron sputtering platform, which comprises a cavity support, the outer part of the cavity support is provided with a main cavity mounting plate, the outer part of the cavity support is fixedly connected with a feeding and discharging base, the outer part of the feeding and discharging base is provided with a feeding and discharging mechanism, the feeding and discharging mechanism comprises a placing table symmetrically arranged on the outer part of the feeding and discharging base, the outer part of the feeding and discharging base is slidably connected with a control base, and the outer part of the control base is fixedly connected with a material control motor, in the application, effective feeding processing is realized through the feeding and discharging mechanism, in large-scale manufacturing, there is good consistency and repeatability, the centering mechanism is used to avoid processing failure caused by deviation of the feeding position in the wafer processing process, meanwhile, the equipment can be combined with an automatic control system to improve equipment utilization and production speed, reduce manual intervention and operation time, and improve production efficiency.

Description

Technical Field

[0001] This invention relates to the field of MRC magnetron sputtering stage technology, and in particular to a high-precision and highly automated MRC magnetron sputtering stage. Background Technology

[0002] MRC magnetron sputtering stages are advanced equipment that provides R&D, manufacturing, and process solutions for semiconductor thin film deposition in the automotive electronics, medical electronics, optical coating, and defense industries through high precision and automated control. These industries have extremely high requirements for the performance and quality of thin films, and MRC magnetron sputtering stages are designed to meet these demands. In the optical coating industry, MRC magnetron sputtering stages can be used to prepare high-quality optical thin films, such as mirrors, lenses, and filters. These films need to possess characteristics such as high transmittance, low reflectivity, and dispersion control to improve the performance and accuracy of optical equipment. Meanwhile, in the defense industry, MRC magnetron sputtering stages can be used to prepare semiconductor thin films to support critical technology needs in defense and security fields, such as sensors, infrared lenses, and optoelectronic devices. These films play a vital role in military and security applications and require durability, high reliability, and special functions to meet the requirements of complex environments.

[0003] In the existing technology, traditional MRC magnetron sputtering stages usually require manual operation and parameter adjustment, which may lead to human error and wasted time in the production process, limiting the improvement of production efficiency. Therefore, a high-precision and highly automated MRC magnetron sputtering stage is proposed. Summary of the Invention

[0004] The purpose of this invention is to solve the problem that traditional MRC magnetron sputtering stages in the prior art usually require manual operation and parameter adjustment, which may lead to human error and wasted time in the production process, thus limiting the improvement of production efficiency. The invention proposes a high-precision and highly automated MRC magnetron sputtering stage.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A high-precision and highly automated MRC magnetron sputtering stage includes a cavity support, a main cavity mounting plate externally mounted on the cavity support, a loading / unloading base fixedly connected to the outside of the cavity support, a loading / unloading mechanism externally mounted on the loading / unloading base, the loading / unloading mechanism including placement platforms symmetrically arranged outside the loading / unloading base, a control base slidably connected to the outside of the loading / unloading base, a material control motor fixedly connected to the outside of the control base, a control shaft at the output end of the material control motor, a material control slider slidably connected to the outside of the control shaft, a transfer plate fixedly connected to the outside of the material control slider, and a centering mechanism externally mounted on the loading / unloading base, the centering mechanism including a centering shaft externally mounted on the outside of the loading / unloading base. A control base plate is rotatably connected to the outside of the main cavity mounting plate. A control motor is fixedly connected to the outside of the control base plate. A transfer platform is provided at the output end of the control motor. A control motor is fixedly connected to the outside of the main cavity mounting plate. A rotating disk is provided at the output end of the control motor. A main cavity door is rotatably connected to the outside of the main cavity mounting plate. A process chamber is provided outside the main cavity door. A substrate deposition stage is provided outside the rotating disk. A cover is rotatably connected to the outside of the main cavity mounting plate. The entire equipment is controlled by a combination of PC and Siemens PLC, designed according to Industry 4.0 standards. I / O interaction is handled by the PLC, with a processing speed within milliseconds. The motion servo motors of the material control motor, control motor, and other equipment are controlled by IRT. The PC terminal combines vision programming, LabVIEW and other control technologies to achieve the integration of control and process. The bus adopts multi-servo control, real-time equipment diagnostic system, web terminal access to archived database, and process data is presented in the form of historical curves.

[0006] The above plan further includes: The control shaft is externally fixedly connected to a material control base, and the material control base is slidably connected to the material control slider.

[0007] A centering frame is fixedly connected to the outside of the placement platform, a centering platform is fixedly connected to the outside of the centering frame, a centering motor is fixedly connected to the outside of the centering platform, a centering shaft is provided at the output end of the centering motor, a centering frame is fixedly connected to the outside of the centering motor, and a vision camera is provided outside the centering frame.

[0008] The main cavity mounting plate is rotatably connected to a connecting shaft, the control base plate is fixedly connected to the connecting shaft, the output end of the control motor is provided with a transmission gear, the transmission gear is externally meshed with a transmission shaft, and the transmission shaft is fixedly connected to the transfer platform.

[0009] A feeding box is fixedly connected to the outside of the main cavity mounting plate. A rodless cylinder is installed outside the feeding box. A control gear is meshed with the output end of the rodless cylinder. A control rod is fixedly connected to the outside of the control gear. A sliding body is slidably connected inside the feeding box.

[0010] A switch cylinder is fixedly connected to the outside of the feeding box. A rotating block is provided at the output end of the switch cylinder. A connecting block is rotatably connected to the outside of the rotating block. The connecting block is rotatably connected to the feeding box. A control shaft is fixedly connected to the outside of the connecting block. A control gear is fixedly connected to the outside of the control shaft. A control cover is fixedly connected to the outside of the control gear.

[0011] The control gears are provided in two sets, and the control gears mesh with each other. One set of control gears is rotatably connected to the feeding box.

[0012] The process chamber is externally rotatably connected to the process chamber door. The process chamber is provided with five sets. The main chamber mounting plate is externally rotatably connected to a flip-top cylinder. The output end of the flip-top cylinder is provided with a connector. The connector is externally fixedly connected to a rotating shaft. The rotating shaft is fixedly connected to the cover body. The main chamber mounting plate is rotatably connected to the rotating shaft.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: In this invention, the loading and unloading mechanism enables efficient loading and processing, providing excellent consistency and repeatability in large-scale manufacturing. The centering mechanism prevents processing failures caused by deviations in the loading position during wafer processing. At the same time, the equipment can be combined with an automated control system to improve equipment utilization and production speed, reduce manual intervention and operation time, and improve production efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of an MRC magnetron sputtering stage with high precision and high automation proposed in this invention; Figure 2 This is a schematic diagram of the external structure of the present invention; Figure 3 This is a schematic diagram of the first part of the structure of the present invention; Figure 4 This is a schematic diagram of the second part of the structure of the present invention; Figure 5 This is a schematic diagram of the third part of the present invention; Figure 6 This is a schematic diagram of the fourth part of the present invention; Figure 7 This is a schematic diagram of the fifth part of the present invention; Figure 8 This is a schematic diagram of the sixth part of the present invention; Figure 9 for Figure 1 Enlarged diagram of part A in the middle; Figure 10 for Figure 1 Enlarged diagram of section B; Figure 11 for Figure 1 Enlarged diagram of section C; Figure 12 for Figure 1 Enlarged diagram of section D in the middle; Figure 13 for Figure 1 Enlarged diagram of section E in the middle; Figure 14 for Figure 1 Enlarged schematic diagram of section F in the middle; Figure 15 for Figure 5 Enlarged schematic diagram of section G in the middle.

[0015] In the diagram: 1. Cavity support; 2. Loading / unloading base; 3. Main cavity mounting plate; 4. Placement platform; 5. Material control motor; 6. Control shaft; 7. Control base; 8. Transfer plate; 9. Material control base; 10. Material control slider; 11. Centering platform; 12. Centering motor; 13. Centering shaft; 14. Vision camera; 15. Centering frame; 16. Control motor; 17. Transmission gear; 18. Conveyor shaft; 19. Connecting shaft; 20. Control base plate; 21. Transfer platform ; 22. Feeding box; 23. Rodless cylinder; 24. Control motor; 25. Cover; 26. Flip-top cylinder; 27. Connector; 28. Rotating shaft; 29. ​​Switching cylinder; 30. Rotating block; 31. Connecting block; 32. Control shaft; 33. Control gear; 34. Control cover; 35. Control rod; 36. Sliding body; 37. Rotating disk; 38. Process chamber door; 39. Main chamber door; 40. Process chamber; 41. Deposition substrate stage; 42. Control gear. Detailed Implementation

[0016] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0017] Please see Figure 1-15 As shown, the present invention is a high-precision and highly automated MRC magnetron sputtering stage, including a cavity support 1, a main cavity mounting plate 3 disposed outside the cavity support 1, a loading and unloading base 2 fixedly connected to the outside of the cavity support 1, a loading and unloading mechanism disposed outside the loading and unloading base 2, the loading and unloading mechanism including a placement platform 4 symmetrically disposed outside the loading and unloading base 2, a control base 7 slidably connected to the outside of the loading and unloading base 2, a material control motor 5 fixedly connected to the outside of the control base 7, a control shaft 6 disposed at the output end of the material control motor 5, a material control slider 10 slidably connected to the outside of the control shaft 6, a transfer plate 8 fixedly connected to the outside of the material control slider 10, and a centering mechanism disposed outside the loading and unloading base 2, the centering mechanism including a centering shaft 13 disposed outside the loading and unloading base 2; A control base plate 20 is rotatably connected to the outside of the main cavity mounting plate 3. A control motor 16 is fixedly connected to the outside of the control base plate 20. A transfer platform 21 is provided at the output end of the control motor 16. A control motor 24 is fixedly connected to the outside of the main cavity mounting plate 3. A rotating disk 37 is provided at the output end of the control motor 24. A main cavity door 39 is rotatably connected to the outside of the main cavity mounting plate 3. A process chamber 40 is provided outside the main cavity door 39. A deposition substrate stage 41 is provided outside the rotating disk 37. A cover 25 is rotatably connected to the outside of the main cavity mounting plate 3.

[0018] The working principle of the MRC magnetron sputtering stage with high precision and high automation proposed in this invention is as follows: the wafer is placed on the placement stage 4, and the transfer plate 8 is moved to a suitable height by controlling the sliding of the control base 7. The transfer plate 8 is moved below the wafer by the control slider 10, and the control base 7 is moved upward to transfer the wafer from the placement stage 4 to the transfer plate 8. The horizontal position angle is changed by rotating the control motor 5, the horizontal position distance is changed by sliding the control slider 10, and the height is changed by controlling the sliding of the control base 7, so that the wafer is moved to the centering mechanism, thereby centering the wafer and facilitating subsequent processing. After alignment, the transfer plate 8 moves the wafer to the position of the transfer platform 21 by the cooperation of the material control motor 5, the control base 7 and the material control slider 10. The control base 20 is rotated, and the control motor 16 is then controlled to rotate the transfer platform 21, thereby moving the wafer into the main cavity mounting plate 3. The deposition substrate stage 41 fixes the wafer to enable further processing, transferring atoms or molecules from the source target to the wafer surface, connecting the various components in the IC to form a fully functional and powerful IC. After processing is completed, the processed wafers are transferred again to the placement stage 4 for unloading via the transfer platform 21 and the loading and unloading mechanism.

[0019] In one embodiment, for the control shaft 6, a material control base 9 is fixedly connected to the outside of the control shaft 6, and the material control base 9 is slidably connected to the material control slider 10.

[0020] In one embodiment, for the aforementioned placement platform 4, a centering frame 15 is fixedly connected to the outside of the placement platform 4, a centering platform 11 is fixedly connected to the outside of the centering frame 15, a centering motor 12 is fixedly connected to the outside of the centering platform 11, a centering shaft 13 is provided at the output end of the centering motor 12, a centering frame 15 is fixedly connected to the outside of the centering motor 12, and a vision camera 14 is provided outside the centering frame 15.

[0021] In one embodiment, for the control motor 16, the output end of the control motor 16 is provided with a transmission gear 17, the transmission gear 17 is externally meshed with a transmission shaft 18, and the transmission shaft 18 is fixedly connected to the transfer platform 21.

[0022] In one embodiment, for the main cavity mounting plate 3, a feeding box 22 is fixedly connected to the outside of the main cavity mounting plate 3, a rodless cylinder 23 is provided outside the feeding box 22, a control gear 42 is meshed at the output end of the rodless cylinder 23, a control rod 35 is fixedly connected to the outside of the control gear 42, and a slider 36 is slidably connected inside the feeding box 22.

[0023] The working principle of the MRC magnetron sputtering stage with high precision and high automation proposed in this invention is as follows: the rodless cylinder 23 controls the movement of its output end, and the movement of its output end drives the control gear 42 to rotate. The rotation of the control gear 42 drives the control rod 35 to rotate. During the rotation of the control rod 35, it squeezes the sliding body 36, thereby causing the sliding body 36 to slide.

[0024] In one embodiment, for the above-mentioned feeding box 22, a switching cylinder 29 is fixedly connected to the outside of the feeding box 22, a rotating block 30 is provided at the output end of the switching cylinder 29, a connecting block 31 is rotatably connected to the outside of the rotating block 30, the connecting block 31 is rotatably connected to the feeding box 22, a control shaft 32 is fixedly connected to the outside of the connecting block 31, a control gear 33 is fixedly connected to the outside of the control shaft 32, and a control cover 34 is fixedly connected to the outside of the control gear 33.

[0025] In one embodiment, the control gear 33 is provided in two sets, and the control gears 33 mesh with each other. One set of control gears 33 is rotatably connected to the feeding box 22.

[0026] The working principle of the MRC magnetron sputtering stage with high precision and high automation proposed in this invention is as follows: A switch cylinder 29 is activated, which controls the movement of a rotating block 30. The movement of the rotating block 30 causes the connecting block 31 to rotate. The connecting block 31 is rotatably connected to the control shaft 32. The rotation of the connecting block 31 causes the control shaft 32 to rotate, which in turn causes the control gear 33 to rotate. The rotation of the control gear 33 then causes another control gear 33 to rotate in reverse and synchronously. The rotation of the control gear 33 causes the control cover 34 to rotate, thereby opening both control covers 34.

[0027] In one embodiment, for the above-mentioned process cavity 40, the process cavity 40 is externally rotatably connected to the process cavity door 38, the process cavity 40 is provided with five sets, the main cavity mounting plate 3 is externally rotatably connected to the flip cover cylinder 26, the output end of the flip cover cylinder 26 is provided with a connector 27, the connector 27 is externally fixedly connected to the rotating shaft 28, the rotating shaft 28 is fixedly connected to the cover 25, and the main cavity mounting plate 3 is rotatably connected to the rotating shaft 28.

[0028] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A high-precision, highly automated MRC magnetron sputtering stage, comprising a cavity support (1), characterized in that, The cavity support (1) is provided with a main cavity mounting plate (3) outside the cavity support (1). The cavity support (1) is fixedly connected to a loading and unloading base (2). The loading and unloading base (2) is provided with a loading and unloading mechanism outside the loading and unloading base (2). The loading and unloading mechanism includes a placement platform (4) symmetrically arranged outside the loading and unloading base (2). The loading and unloading base (2) is slidably connected to a control base (7). The control base (7) is fixedly connected to a material control motor (5). The output end of the material control motor (5) is provided with a control shaft (6). The control shaft (6) is slidably connected to a material control slider (10). The material control slider (10) is fixedly connected to a transfer plate (8). The loading and unloading base (2) is provided with a centering mechanism outside the loading and unloading base (2). The centering mechanism includes a centering shaft (13) arranged outside the loading and unloading base (2). The main cavity mounting plate (3) is rotatably connected to a control base plate (20), and the control base plate (20) is fixedly connected to a control motor (16). The output end of the control motor (16) is provided with a transfer platform (21). The main cavity mounting plate (3) is fixedly connected to a control motor (24), and the output end of the control motor (24) is provided with a rotating disk (37). The main cavity mounting plate (3) is rotatably connected to a main cavity door (39), and a process chamber (40) is provided outside the main cavity door (39). A deposition substrate stage (41) is provided outside the rotating disk (37). The main cavity mounting plate (3) is rotatably connected to a cover (25).

2. The MRC magnetron sputtering stage with high precision and high automation according to claim 1, characterized in that, The control shaft (6) is externally fixedly connected to a material control base (9), and the material control base (9) is slidably connected to the material control slider (10).

3. The MRC magnetron sputtering stage with high precision and high automation according to claim 1, characterized in that, The placement platform (4) is fixedly connected to a centering frame (15), the centering frame (15) is fixedly connected to a centering platform (11), the centering platform (11) is fixedly connected to a centering motor (12), the output end of the centering motor (12) is provided with a centering shaft (13), the centering motor (12) is fixedly connected to the centering frame (15), and a vision camera (14) is provided outside the centering frame (15).

4. The MRC magnetron sputtering stage with high precision and high automation according to claim 1, characterized in that, The main cavity mounting plate (3) is externally rotatably connected to a connecting shaft (19), the control base plate (20) is fixedly connected to the connecting shaft (19), the output end of the control motor (16) is provided with a transmission gear (17), the transmission gear (17) is externally meshed with a transmission shaft (18), and the transmission shaft (18) is fixedly connected to the transfer platform (21).

5. The MRC magnetron sputtering stage with high precision and high automation according to claim 1, characterized in that, The main cavity mounting plate (3) is fixedly connected to the outside of the feeding box (22). The feeding box (22) is equipped with a rodless cylinder (23). The output end of the rodless cylinder (23) is meshed with a control gear (42). The control gear (42) is fixedly connected to the outside of the control rod (35). The feeding box (22) is slidably connected with a slider (36).

6. The MRC magnetron sputtering stage with high precision and high automation according to claim 5, characterized in that, A switch cylinder (29) is fixedly connected to the outside of the feeding box (22). A rotating block (30) is provided at the output end of the switch cylinder (29). A connecting block (31) is rotatably connected to the outside of the rotating block (30). The connecting block (31) is rotatably connected to the feeding box (22). A control shaft (32) is fixedly connected to the outside of the connecting block (31). A control gear (33) is fixedly connected to the outside of the control shaft (32). A control cover (34) is fixedly connected to the outside of the control gear (33).

7. The MRC magnetron sputtering stage with high precision and high automation according to claim 6, characterized in that, The control gears (33) are provided in two sets, and the control gears (33) mesh with each other. One set of control gears (33) is rotatably connected to the feeding box (22).

8. The MRC magnetron sputtering stage with high precision and high automation according to claim 1, characterized in that, The process chamber (40) is rotatably connected to the process chamber door (38). The process chamber (40) is provided with five sets. The main chamber mounting plate (3) is rotatably connected to the cover cylinder (26). The output end of the cover cylinder (26) is provided with a connector (27). The connector (27) is fixedly connected to the rotating shaft (28). The rotating shaft (28) is fixedly connected to the cover (25). The main chamber mounting plate (3) is rotatably connected to the rotating shaft (28).

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