Semiconductor processing apparatus

Abstract

The application discloses a semiconductor process equipment, and relates to the field of semiconductor equipment. The semiconductor process equipment comprises a process chamber, a bearing device, a flexible connecting device and an electrode. The flexible connecting device is arranged on the bearing device and can be moved into or out of the process chamber along the axial direction of the process chamber with the bearing device. One end of the electrode extends into the process chamber. When the bearing device is moved into the process chamber, the flexible connecting device is connected with the electrode, so that the electrode, the flexible connecting device and the bearing device are sequentially conducted. When the bearing device is moved out of the process chamber, the flexible connecting device is disconnected from the electrode. The application can solve the problems that the poor dynamic connection effect between a graphite boat and an electrode rod leads to a large impedance and easy ablation.

Description

Technical Field

[0001] This application belongs to the field of semiconductor equipment technology, specifically relating to a semiconductor process equipment. Background Technology

[0002] In HJT (High-Jet Thin-Film) cells, the amorphous silicon film plays a crucial role in improving the cell's turn-on voltage. Amorphous silicon contains a large number of hydrogen ions, which can saturate defects in the silicon substrate, acting as hydrogen passivation. Currently, the mainstream technologies for depositing amorphous silicon in HJT cells are plate-type PECVD and tubular PECVD. Tubular PECVD has advantages such as smaller equipment footprint, lower cost, and larger batch wafer loading. However, with the development of solar cell technology, the low-frequency (20–400 kHz) power supply used in traditional tubular PECVD equipment cannot meet the process requirements of current HJT thin-film cells.

[0003] To meet process requirements, tubular PECVD equipment incorporates radio frequency (RF) power (2–60 MHz), resulting in high-density plasma with low ion energy bombardment. This leads to denser deposited films with less damage, satisfying the requirements for HJT thin-film batteries. In this equipment, the connection between the movable graphite boat and the electrode rod is a dynamic connection; the stability of this connection is a bottleneck for the equipment's pressure and current resistance.

[0004] In related technologies, the dynamic connection between the graphite boat and the electrode rod is not effective, and point contact is prone to occur. This results in a large impedance at the dynamic connection, which causes the current passing through this point to generate severe heat. This can easily lead to ablation at the dynamic connection, thereby increasing the equipment failure rate. Summary of the Invention

[0005] The purpose of this application is to provide a semiconductor process device that can solve problems such as poor dynamic connection between the graphite boat and the electrode rod, resulting in high impedance and easy ablation.

[0006] To solve the above-mentioned technical problems, this application is implemented as follows:

[0007] This application provides a semiconductor process apparatus, including: a process chamber, a carrier device, a flexible connection device, and electrodes;

[0008] The flexible connecting device is disposed on the supporting device and can move into or out of the process chamber along the axial direction of the process chamber along the supporting device;

[0009] One end of the electrode extends into the process chamber;

[0010] When the carrier device is moved into the process chamber, the flexible connection device is connected to the electrode so that the electrode, the flexible connection device, and the carrier device are sequentially connected; when the carrier device is moved out of the process chamber, the flexible connection device is disconnected from the electrode.

[0011] In this embodiment, a flexible connection device enables electrical conduction between the electrode and the carrier device, allowing radio frequency power to be transmitted to the carrier device via the flexible connection device, thereby powering the carrier device to meet process requirements. Furthermore, the flexible connection device can achieve flexible docking even when the electrode and the carrier device are misaligned due to flexible deformation, ensuring sufficient connection and good electrical conduction between the electrode and the carrier device. This solves the problem of insufficient connection caused by misalignment between the electrode and the carrier device, resulting in severe heat generation and burn-out at the connection point when current flows through it. Therefore, it ensures that the connection between the electrode and the carrier device always maintains good contact, reducing the failure rate of semiconductor process equipment and ensuring its normal operation. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of the semiconductor process equipment disclosed in the embodiments of this application;

[0013] Figure 2 This is a partial schematic diagram of the structure of the support device, flexible connection device, guide device, electrode, etc. disclosed in the embodiments of this application;

[0014] Figure 3 This is a partial schematic diagram of the structure of the supporting device, guiding device, electrode, etc. disclosed in the embodiments of this application;

[0015] Figure 4 This is a partial schematic diagram of the connection point of the flexible connection device and the electrode disclosed in the embodiments of this application;

[0016] Figure 5 This is a schematic diagram of the flexible connection device disclosed in the embodiments of this application;

[0017] Figure 6 This is a first structural schematic diagram of the flexible component disclosed in an embodiment of this application;

[0018] Figure 7 This is a schematic diagram of the second structure of the flexible component disclosed in the embodiments of this application;

[0019] Figure 8 This is a schematic diagram of the structure of the guiding device disclosed in the embodiments of this application;

[0020] Figure 9This is a schematic diagram of the first state of the transmission carrier device disclosed in the embodiments of this application;

[0021] Figure 10 This is a schematic diagram of the second state of the transmission carrier device disclosed in the embodiments of this application;

[0022] Figure 11 This is a schematic diagram of the third state of the transmission bearer device disclosed in the embodiments of this application;

[0023] Figure 12 This is a schematic diagram of the fourth state of the transmission bearer device disclosed in the embodiments of this application;

[0024] Figure 13 This is a schematic diagram of the fifth state of the transmission carrier device disclosed in the embodiments of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] 100 - Process chamber; 110 - Quartz tube; 120 - First valve plate; 130 - Second valve plate;

[0027] 200 - Load-bearing device; 210 - Support leg;

[0028] 300 - Electrode; 310 - First connecting part; 311 - Columnar segment; 312 - Tip segment; 320 - Electrode rod;

[0029] 400 - Flexible connecting device; 410 - Second connecting part; 411 - Stepped groove; 412 - Extensional structure; 420 - Flexible component; 421 - First connecting plate; 422 - Second connecting plate; 423 - Flexible connecting strip; 424 - First guide; 425 - Second guide; 430 - Fixing part;

[0030] 500 - Guide device; 510 - First guide rail; 511 - First guide groove; 520 - Second guide rail; 521 - Second guide groove;

[0031] 600 - Conveying device; 610 - First driving mechanism; 620 - Conveying arm; 630 - Second driving mechanism. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0034] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0035] This application discloses a semiconductor process apparatus that can be applied to the field of HJT (High-Jet Thin-Layer) batteries to facilitate the fabrication of amorphous silicon films in HJT batteries. Of course, the semiconductor process apparatus can also be applied to other conditions, and this application does not specifically limit its application to these applications.

[0036] refer to Figures 1 to 13 The disclosed semiconductor process equipment includes a process chamber 100, a carrier device 200, a flexible connection device 400, and an electrode 300. The flexible connection device 400 is disposed on the carrier device 200 and can be moved into or out of the process chamber 100 along the axial direction of the process chamber 100 with the carrier device 200. One end of the electrode 300 extends into the process chamber 100.

[0037] The process chamber 100 is a basic component that provides a base for housing and installing components such as the carrier device 200, flexible connection device 400, and electrode 300. It also allows for process reactions to take place within the process chamber 100. The carrier device 200 is used to support the product to be processed, ensuring its stability during the process reaction and thus improving process accuracy. The electrode 300 is used to transmit radio frequency power to the carrier device 200 to power it. The flexible connection device 400 is used to achieve a flexible connection between the carrier device 200 and the electrode 300.

[0038] Optionally, the support device 200 can be a graphite boat, or other components, which are not specifically limited in this embodiment. When the support device 200 is a graphite boat, it may be provided with support feet 210 on its side. These support feet 210 are used to contact the inner wall of the process chamber 100 to support the main body of the support device 200. For example, the support feet 210 can be ceramic structures to avoid interfering with the process reaction.

[0039] In some embodiments, the process chamber 100 may have a cavity into which both the carrier device 200 and the flexible connecting device 400 can be moved, and one end of the electrode 300 can be inserted into the cavity. Thus, the cavity provides space for the carrier device 200 and the flexible connecting device 400, and allows the product to be processed, carried on the carrier device 200, to undergo a process reaction within the cavity to meet process requirements. The other end of the electrode 300 extends outside the cavity to facilitate electrical connection with an external power supply device, thereby powering the carrier device 200.

[0040] Considering that some process reactions need to be carried out in a closed space, and that the carrier device 200 carrying the product to be processed needs to be moved into or out of the process chamber 100, the process chamber 100 in this embodiment can be opened or closed, so that when opened it is convenient to move the carrier device 200 and the product it carries into or out, and when closed it forms a closed cavity to meet process requirements.

[0041] Based on the above configuration, when the carrier device 200 moves into the process chamber 100, the flexible connection device 400 is connected to the electrode 300 so that the electrode 300, the flexible connection device 400 and the carrier device 300 are sequentially connected; conversely, when the carrier device 200 moves out of the process chamber 100, the flexible connection device 400 is disconnected from the electrode 300.

[0042] In this embodiment, the flexible connection device 400 enables electrical conduction between the electrode 300 and the carrier device 200, allowing radio frequency power to be transmitted to the carrier device 200 via the electrode 300 and the flexible connection device 400, thereby powering the carrier device 200 to meet process requirements. Furthermore, the flexible connection device 400 can undergo flexible deformation, ensuring a flexible connection between the electrode 300 and the carrier device 200 even when they are relatively misaligned. This also guarantees sufficient connection and good electrical conduction between the electrode 300 and the carrier device 200, solving the problem of insufficient connection caused by relative misalignment, which leads to severe overheating and erosion at the connection point when current flows. Therefore, it ensures that the connection between the electrode 300 and the carrier device 200 always maintains good contact, reducing the failure rate of semiconductor process equipment and ensuring its normal operation.

[0043] refer to Figures 4 to 5In some embodiments, the flexible connection device 400 may include a second connection portion 410, a flexible component 420, and a fixing portion 430. The second connection portion 410 is used to cooperate with and connect to a first connection portion 310 provided at one end of the electrode 300. The fixing portion 430 is connected to the support device 200. The flexible component 420 connects the second connection portion 410 and the fixing portion 430 so that the second connection portion 410 and the fixing portion 430 can move relative to each other in a first direction.

[0044] The first direction is perpendicular to the axial direction of the process chamber 100. Specifically, the first direction can be any direction in the plane perpendicular to the axial direction of the process chamber 100, depending on the actual working conditions. For example, when the axial direction of the process chamber 100 is horizontal, the first direction can be vertical, or it can be an inclined direction at a certain angle to the vertical direction.

[0045] It should be noted that the flexible connecting device 400 can deform in the first direction. Therefore, during the installation of the electrode 300 and the support device 200, the deformation effect of the flexible connecting device 400 can facilitate the assembly of the electrode 300 and the support device 200, and can also cause the electrode 300 and the support device 200 to move out of alignment, that is, to move relative to each other in the first direction. This can overcome the problem of insufficient connection caused by relative misalignment when the electrode 300 and the support device 200 are rigidly connected.

[0046] Optionally, the first connecting portion 310 and the second connecting portion 410 can be detachably connected to facilitate the connection or separation between the electrode 300 and the flexible connecting device 400. For example, one of the first connecting portion 310 and the second connecting portion 410 can be a male connector and the other a female connector. Through the insertion and engagement of the male and female connectors, a stable electrical conduction effect can be achieved, while also facilitating connection or separation.

[0047] In some embodiments, the first connecting part 310 can be a rigid metal component with high strength and wear resistance, so as to extend the service life and ensure good electrical conductivity.

[0048] The second connecting part 410 can be a rigid metal component, which also has high strength and wear resistance to extend service life, and can also ensure good electrical conductivity.

[0049] The fixing part 430 can be a rigid metal component with a certain rigidity, which will not deform when bearing load. In addition, the fixing part 430 also has high strength and wear resistance to extend its service life. On the other hand, it can also ensure good electrical conductivity.

[0050] At least a portion of the flexible component 420 is made of a flexible metal material, which can ensure good electrical conductivity and generate flexible deformation to accommodate the relative movement between the second connecting part 410 and the fixed part 430 in the first direction.

[0051] In addition, a rigid connection is used between the second connecting part 410 and the flexible component 420 to ensure the firmness and stability of the connection between the two, so that the second connecting part 410 and the flexible component 420 will not separate when bearing a load; similarly, a rigid connection is used between the fixing part 430 and the bearing device 200 to ensure the firmness and stability of the connection between the two, so that the fixing part 430 and the bearing device 200 will not separate when bearing a load.

[0052] refer to Figures 6 to 7 In some embodiments, the flexible component 420 may include a first connecting plate 421, a second connecting plate 422, and a plurality of flexible connecting strips 423, wherein the first connecting plate 421 and the second connecting plate 422 are spaced apart along a first direction, the plurality of flexible connecting strips 423 are connected between the first connecting plate 421 and the second connecting plate 422, the first connecting plate 421 is connected to the second connecting portion 410, and the second connecting plate 422 is connected to the fixing portion 430.

[0053] Optionally, the first connecting plate 421 can be a rigid metal component, and the second connecting plate 422 can be a rigid metal component, which can ensure good electrical conductivity and prevent deformation when bearing load, thereby extending their respective service life.

[0054] The flexible connecting strip 423 can be a flexible metal component, which can ensure good conductivity and deform under load. In this way, the first connecting plate 421 and the second connecting plate 422 can be electrically connected, and the relative movement between the first connecting plate 421 and the second connecting plate 422 can be realized. This allows the relative movement between the second connecting part 410 and the fixing part 430. Furthermore, when the bearing device 200 and the electrode 300 move relative to each other in the first direction, the sufficiency and good connection between the first connecting part 310 and the second connecting part 410 can be ensured.

[0055] Optionally, one end of the flexible connecting strip 423 is welded and fixed to the first connecting plate 421, and the other end of the flexible connecting strip 423 is welded and fixed to the second connecting plate 422, thereby ensuring close contact between the flexible connecting strip 423 and the first connecting plate 421 and the second connecting plate 422 respectively.

[0056] To enable the first connecting plate 421 and the second connecting plate 422 to move relative to each other along a first direction, the flexible component 420 may further include a first guide 424 and a second guide 425. The first guide 424 is disposed on the side of the first connecting plate 421 facing the second connecting plate 422, and the second guide 425 is disposed on the side of the second connecting plate 422 facing the first connecting plate 421. The first guide 424 and the second guide 425 are slidably engaged along the first direction. Based on this, under the guiding and limiting action of the first guide 424 and the second guide 425, the first connecting plate 421 and the second connecting plate 422 can move relatively closer or further apart along the first direction, but cannot move along other directions. This ensures the movement accuracy between the first connecting plate 421 and the second connecting plate 422, and consequently, ensures the movement accuracy of the supporting device 200 within the process chamber 100.

[0057] Optionally, the first guide member 424 can be a first guide post, and the second guide member 425 can be a second guide post. One of the first and second guide posts has a guide channel, and the other is slidably disposed within the guide channel. This avoids misalignment caused by relative movement between the first connecting plate 421 and the second connecting plate 422 in directions other than the first direction, ensuring the movement accuracy of the first connecting plate 421 and the second connecting plate 422 in the first direction.

[0058] In addition, the first guide member 424 can be welded to one side of the first connecting plate 421, and the second guide member 425 can be welded to one side of the second connecting plate 422, thereby ensuring the firmness and stability of the connection.

[0059] It should be noted that the sliding engagement of the first guide 424 and the second guide 425 can prevent the first connecting part 310 from shifting in the axial direction of the process chamber 100 when the second connecting part 410 and the first connecting part 310 are connected, thus avoiding affecting the connection effect between the second connecting part 410 and the first connecting part 310. In addition, the relative sliding between the first guide 424 and the second guide 425 may result in gaps between them, preventing a tight connection, which may adversely affect the conductivity. Therefore, the first guide 424 and the second guide 425 can be used as electrical connection devices instead of electrical connection devices. Instead, multiple flexible connecting strips 423 are tightly connected to the first connecting plate 421 and the second connecting plate 422 respectively, and they can be made of flexible metal material, giving them better conductivity. Thus, multiple flexible connecting strips 423 serve as electrical connection devices to achieve electrical conduction between the first connecting plate 421 and the second connecting plate 422.

[0060] To achieve a good fit between the first connecting part 310 and the second connecting part 410, refer to Figure 4In some embodiments, the first connecting portion 310 may include a columnar segment 311 and a tip segment 312, wherein the columnar segment 311 is connected to the electrode rod 320 of the electrode 300, and the tip segment 312 is disposed at one end of the columnar segment 311 away from the electrode rod 320; correspondingly, the second connecting portion 410 may have a stepped groove 411, the opening section of which is adapted to the columnar segment 311, and the inner groove section of which is adapted to the tip segment 312.

[0061] Specifically, the cross-sectional dimension of the columnar segment 311 is larger than that of the tip segment 312. Correspondingly, the cross-sectional dimension of the opening segment of the stepped groove 411 is larger than that of the inner groove segment. This makes the opening of the stepped groove 411 larger and the interior smaller, which facilitates the insertion and mating with the first connecting part 310. At the same time, through the mating of the columnar segment 311 and the opening segment, and the mating of the tip segment 312 and the inner groove segment, the stability of the mating between the first connecting part 310 and the second connecting part 410 can be ensured, and the contact area between the two is increased, making the connection more complete. This ensures good electrical conductivity between the first connecting part 310 and the second connecting part 410, thus overcoming the problem of easy overheating and ablation at the connection point caused by point contact in related technologies.

[0062] Optionally, the columnar segment 311 can be a cylindrical segment, and the pointed segment 312 can be a conical segment. Correspondingly, the opening segment of the stepped groove 411 can be a circular groove, and the inner groove segment can be a conical groove. Based on this, the first connecting part 310 and the second connecting part 410 can be easily processed, reducing the processing difficulty.

[0063] In some embodiments, the semiconductor process equipment may include two flexible connection devices 400 and two electrodes 300 with opposite polarities. The two flexible connection devices 400 are disposed at intervals on the carrier device 200 so that the two flexible connection devices 400 can move into or out of the process chamber 100 with the carrier device 200. In addition, the two flexible connection devices 400 and the carrier device 200 are also conductive to ensure good conductivity.

[0064] Furthermore, one end of each of the two electrodes 300 extends into the process chamber 100 and is connected to the two flexible connection devices 400 in a corresponding manner. In this way, the two flexible connection devices 400 can respectively realize the flexible connection between the two electrodes 300 and the carrier device 200, thereby effectively solving the problem of poor contact between the electrodes 300 and the carrier device 200 caused by the misalignment of the carrier device 200 and the two electrodes 300 in the first direction, and thus ensuring good conductivity between the two electrodes 300 and the carrier device 200.

[0065] refer to Figure 2 or Figure 3In some embodiments, the semiconductor process equipment may further include a guiding device 500, which is disposed within the process chamber 100 and extends along the axial direction of the process chamber 100. The second connecting portion 410 is slidably connected to the guiding device 500. Based on this, the guiding device 500 allows the second connecting portion 410 to move along the axial direction of the process chamber 100, thereby ensuring that the second connecting portion 410 does not displace in a direction perpendicular to the axis, and thus ensuring that the second connecting portion 410 can accurately mate with the first connecting portion 310. Exemplarily, one end of the guiding device 500 may be fixed to the inner wall of one end of the process chamber 100 to ensure the robustness and stability of the guiding device 500.

[0066] Further, refer to Figure 8 The guiding device 500 may include a first guide rail 510 and a second guide rail 520 spaced apart from each other. The first guide rail 510 has a first guide groove 511 on one side adjacent to the second guide rail 520, and the second guide rail 520 has a second guide groove 521 on one side adjacent to the first guide rail 510. Correspondingly, the two opposite sides of the second connecting portion 410 are respectively provided with extension structures 412, one side of which slides with the first guide groove 511, and the other side of which slides with the second guide groove 521. Based on this, by having the extension structures 412 on both sides slide with the first guide groove 511 and the second guide groove 521 respectively, the second connecting portion 410 can slide stably and accurately along the first guide rail 510 and the second guide rail 520, ensuring the positional accuracy of the second connecting portion 410. This allows the second connecting portion 410 to accurately align with the first connecting portion 310, preventing deviations in the movement direction of the second connecting portion 410 that would affect the adequacy of the connection with the first connecting portion 310.

[0067] It should be noted that the supporting device 200 also moves along the axial direction of the process chamber 100, and the supporting device 200 drives the flexible connecting device 400 to move synchronously, so as to realize that the second connecting part 410 moves along the guide device 500.

[0068] Furthermore, the guide device 500 is an insulating component, which includes an insulating ceramic component. Of course, the insulating component can also be a component made of other materials, and this embodiment does not specifically limit this. Based on this, using an insulating component can alleviate or even avoid the dissipation of radio frequency power through the guide rail, thereby ensuring that the radio frequency power can be fully fed into the carrier device 200, thus reducing energy consumption.

[0069] In this embodiment, a conveying device 600 can be used to move the carrying device 200 into or out of the process chamber 100 to complete the transfer of the product. Exemplarily, the conveying device 600 may include a first driving mechanism 610 and a conveying arm 620. The conveying arm 620 is driveably connected to the output end of the first driving mechanism 610 to drive the conveying arm 620 to reciprocate along the axial direction of the process chamber 100. The conveying arm 620 drives the carrying device 200 to reciprocate along the axial direction of the process chamber 100, thereby realizing the entry or exit of the carrying device 200.

[0070] Furthermore, in order to enable the carrying device 200 to move along the first direction, the conveying device 600 may also include a second drive mechanism 630, the output end of which is connected to the first drive mechanism 610 to drive the first drive mechanism 610 to reciprocate in the first direction.

[0071] In some embodiments, the process chamber 100 may include a quartz tube 110, a first valve plate 120, and a second valve plate 130. The first valve plate 120 is openably or closably disposed at one end of the quartz tube 110 to open the quartz tube 110 when a product needs to be moved in or out, and to close the quartz tube 110 during the process. The second valve plate 130 is disposed at the other end of the quartz tube 110 to seal the other end of the quartz tube 110. Thus, the first valve plate 120, the second valve plate 130, and the quartz tube 110 can together form the cavity of the process chamber 100 to provide process space.

[0072] For example, one end of the guide device 500 is connected to the inner side of the second valve plate 130 and extends toward the first valve plate 120, thus ensuring the robustness and stability of the guide device 500.

[0073] In addition, the electrode 300 is inserted into the cavity of the quartz tube 110 via the second valve plate 130 so as to dock with the flexible connecting device 400 which moves into the cavity of the quartz tube 110 along with the carrying device 200.

[0074] refer to Figures 9 to 13 In this embodiment of the application, taking a graphite boat as the carrier device 200 and a quartz tube 110 with a first valve plate 120 and a second valve plate 130 as an example, the specific process of transferring the carrier device 200 into the process chamber 100 and connecting it to the electrode 300 is as follows:

[0075] The first valve plate 120 is opened, and the graphite boat is placed on the transfer arm 620. The first drive mechanism 610 drives the transfer arm 620 to move along the axis of the process chamber 100 to move the graphite boat into the quartz tube 110. Figure 9As shown; the conveyor arm 620 carries the graphite boat forward along the axis of the quartz tube 110 until the second connecting part 410 of the flexible connecting device 400 on the graphite boat aligns with the first connecting part 310 of the electrode 300, as shown. Figure 10 As shown; the second drive mechanism 630 drives the first drive mechanism 610, the conveying arm 620, and the graphite boat to move along the first direction (e.g., downward) until the support foot 210 of the graphite boat contacts the inner wall of the quartz tube 110. During this process, the second connecting part 410 is supported by the guide device 500 and cannot move along the first direction, while the graphite boat drives the fixing part 430 to move along the first direction, thereby stretching the multiple flexible connecting strips 423 of the flexible component 420. At this time, it is ensured that the second connecting part 410 and the first connecting part 310 are located in the same horizontal plane, so that the second connecting part 410 and the first connecting part 310 always maintain a tight connection, that is, surface contact, such as... Figure 11 As shown; the second drive mechanism 630 continues to drive the first drive mechanism 610 and the conveyor arm 620 to move along the first direction, causing the conveyor arm 620 to detach from the graphite boat, and then the first drive mechanism 610 drives the conveyor arm 620 to exit the quartz tube 110, as shown. Figure 12 As shown; after the transmission arm 620 retracts from the quartz tube 110, the second valve plate 130 closes, thus completing the radio frequency connection process, as follows. Figure 13 As shown.

[0076] It should be noted that after the first connecting part 310 and the second connecting part 410 are connected, the first guide 424 and the second guide 425 can prevent the second connecting part 410 from being displaced in the axial direction of the process chamber 100. At the same time, the second connecting part 410 is connected to the guide device 500, which can limit the displacement of the second connecting part 410 in the first direction, but does not limit the movement of the flexible component 420 and the fixing part 430 along the first direction. Thus, it can ensure the sufficiency of the connection between the second connecting part 410 and the first connecting part 310, and can also accommodate the movement of the bearing device 200 along the first direction.

[0077] During the movement of the support device 200 along the first direction, the second connecting part 410 is held in place by the guide device 500, keeping it stationary in the first direction. The fixing part 430 is connected to the support device 200, and moves along the first direction with the support device 200, thereby stretching the multiple flexible connecting strips 423. Thus, after the support device 200 moves to the preset position, the first connecting part 310 and the second connecting part 410 remain on the same horizontal plane, ensuring close contact between them and improving the adequacy of the connection.

[0078] In summary, the embodiments of this application can change the connection method between the electrode 300 and the support device 200 by using the flexible connection device 400, replacing the point contact method with a surface contact method, thereby ensuring a more sufficient connection between the electrode 300 and the support device 200, overcoming the problem of electrode 300 ablation caused by point contact, and at the same time reducing the equipment failure rate and effectively improving production efficiency.

[0079] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A semiconductor process apparatus, characterized in that, include: Process chamber (100), support device (200), flexible connection device (400) and electrode (300); The flexible connecting device (400) is disposed on the bearing device (200) and can move into or out of the process chamber (100) along the axial direction of the process chamber (100) with the bearing device (200); wherein, the flexible connecting device (400) includes a flexible component (420), the flexible component (420) includes a first connecting plate (421), a second connecting plate (422) and a plurality of flexible connecting strips (423), the first connecting plate (421) and the second connecting plate (422) are spaced apart along the first direction, and the plurality of flexible connecting strips (423) are all connected between the first connecting plate (421) and the second connecting plate (422); One end of the electrode (300) extends into the process chamber (100); When the carrier device (200) moves into the process chamber (100), the flexible connecting device (400) is connected to the electrode (300) so that the electrode (300), the flexible connecting device (400) and the carrier device (200) are sequentially connected; when the carrier device (200) moves out of the process chamber (100), the flexible connecting device (400) is disconnected from the electrode (300).

2. The semiconductor process equipment according to claim 1, characterized in that, One end of the electrode (300) is provided with a first connecting part (310); The flexible connecting device (400) further includes a second connecting part (410) and a fixing part (430). The second connecting part (410) is used to cooperate with the first connecting part (310) for connection. The fixing part (430) is connected to the bearing device (200). The flexible component (420) connects the second connecting part (410) and the fixing part (430) so that the second connecting part (410) and the fixing part (430) can move relative to each other in a first direction, wherein the first direction is perpendicular to the axial direction.

3. The semiconductor process equipment according to claim 2, characterized in that, The first connecting plate (421) is connected to the second connecting part (410), and the second connecting plate (422) is connected to the fixing part (430).

4. The semiconductor process equipment according to claim 3, characterized in that, The flexible component (420) further includes a first guide (424) and a second guide (425); The first guide (424) is disposed on the side of the first connecting plate (421) facing the second connecting plate (422), and the second guide (425) is disposed on the side of the second connecting plate (422) facing the first connecting plate (421); The first guide (424) and the second guide (425) slide in cooperation along the first direction.

5. The semiconductor process equipment according to claim 4, characterized in that, The first connecting part (310) includes a columnar section (311) and a tip section (312). The columnar section (311) is connected to the electrode rod (320) of the electrode (300), and the tip section (312) is disposed at the end of the columnar section (311) away from the electrode rod (320). The second connecting part (410) has a stepped groove (411), the opening section of the stepped groove (411) is adapted to the columnar section (311), and the inner groove section of the stepped groove (411) is adapted to the tip section (312).

6. The semiconductor process equipment according to any one of claims 1 to 5, characterized in that, The semiconductor process equipment includes two of the flexible connection devices (400) and two electrodes (300) with opposite polarities. Two flexible connection devices (400) are disposed at intervals on the support device (200), and one end of each of the two electrodes (300) extends into the process chamber (100) and is connected to the two flexible connection devices (400) in a one-to-one correspondence.

7. The semiconductor process equipment according to claim 2, characterized in that, The semiconductor process equipment also includes a guide device (500) disposed within the process chamber (100), the guide device (500) extending along the axial direction; The second connecting part (410) is slidably connected to the guide device (500).

8. The semiconductor process equipment according to claim 7, characterized in that, The guiding device (500) includes a first guide rail (510) and a second guide rail (520) spaced apart from each other. A first guide groove (511) is provided on the side of the first guide rail (510) adjacent to the second guide rail (520), and a second guide groove (521) is provided on the side of the second guide rail (520) adjacent to the first guide rail (510). The two opposite sides of the second connecting part (410) are respectively provided with an extension structure (412), wherein the extension structure (412) on one side is slidably engaged with the first guide groove (511), and the extension structure (412) on the other side is slidably engaged with the second guide groove (521).

9. The semiconductor process equipment according to claim 7 or 8, characterized in that, The guide device (500) is an insulating component, which includes an insulating ceramic component.

10. The semiconductor process equipment according to claim 3, characterized in that, The second connecting part (410) is a rigid metal component, and the fixing part (430) is a rigid metal component; And / or, the first connecting plate (421) is a rigid metal component, the second connecting plate (422) is a rigid metal component, and the flexible connecting strip (423) is a flexible metal component.

11. The semiconductor process equipment according to claim 7 or 8, characterized in that, The process chamber (100) includes a quartz tube (110), a first valve plate (120), and a second valve plate (130). The first valve plate (120) is disposed at one end of the quartz tube (110) in an openable or closed manner, and the second valve plate (130) is disposed at the other end of the quartz tube (110); One end of the guide device (500) is connected to the inner side of the second valve plate (130) and extends toward the first valve plate (120); The electrode (300) is inserted into the lumen of the quartz tube (110) via the second valve plate (130).

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