Conformable device

Abstract

This application discloses a bonding device, including a feeding and receiving device, a connecting device, a bonding table, a feeding device, a bonding device, and a pressure holding device. The feeding and receiving device is used to supply workpieces and collect workpieces for bonding. The connecting device includes a rotatable and movable connecting head for adapting to and receiving workpieces. The bonding table has upper and lower feeding positions, a bonding position, and a pressure holding position, as well as a fixture that can move between the upper and lower feeding positions, the bonding position, and the pressure holding position. The fixture is used to receive workpieces and expose the inner surface of the workpieces within the bonding area. The feeding device is used to supply the bonding components. The bonding device is used to bond the bonding components to the workpieces. The pressure holding device includes a pressure holding head that can be elastically extended and moved, and the pressure holding head is used to press the bonding components bonded to the inner surface of the workpieces. The above-mentioned bonding device achieves the effect of automatically bonding components to the inner surface of workpieces, can achieve a uniform bonding standard, is conducive to improving production yield, can also improve bonding efficiency, and save labor costs.

Description

Technical Field

[0001] This application relates to the field of bonding small parts to the inner surface of workpieces, and specifically to a bonding device. Background Technology

[0002] In actual production, it is often necessary to attach small parts to the inner surface of a workpiece to ensure the workpiece meets production requirements. Since the attachment point is inside the workpiece, manual attachment is currently the common method. However, due to the small size of these parts, they are prone to deformation. Manual attachment is inefficient, impacting production productivity. Furthermore, inconsistent manual techniques can lead to damage to the parts and workpiece, affecting yield and increasing costs. Summary of the Invention

[0003] In view of the above, it is necessary to propose a bonding device to achieve automated bonding of the inner surface of the workpiece, thereby improving production yield and efficiency and saving costs.

[0004] This application provides a bonding device for bonding an adhesive to the inner surface of a workpiece. The device includes a feeding and receiving device, a connecting device, a bonding table, a feeding device, a bonding device, and a pressure holding device. The feeding and receiving device supplies the workpiece and retrieves the workpiece from which the adhesive is bonded. The connecting device is correspondingly arranged with the feeding and receiving device and includes a rotatable and movable connecting head for receiving the workpiece supplied by the feeding and receiving device. The bonding table is correspondingly arranged with the connecting device and has upper and lower feeding positions, a bonding position, and a pressure holding position. The bonding table includes a fixture movable between the upper and lower feeding positions, the bonding position, and the pressure holding position. The fixture receives the workpiece on the connecting head at the upper and lower feeding positions, exposing the inner surface of the workpiece to the bonding area. Inside, the connector is also used to receive the workpiece with the adhesive patch on the fixture at the loading and unloading positions; the feeding and receiving device is used to retrieve the workpiece with the adhesive patch from the connector; the feeding device is arranged adjacent to the bonding table and is used to supply the adhesive patch; the bonding device is arranged corresponding to the feeding device and to the bonding position, and is used to pick up the adhesive patch from the feeding device and bond the adhesive patch to the inner side of the workpiece on the fixture that has moved to the bonding position; the pressure holding device is arranged adjacent to the bonding table and to the pressure holding position, and includes a pressure holding head that can be elastically extended and moved, and the pressure holding head is used to press the adhesive patch bonded to the inner side of the workpiece so that the adhesive patch is bonded to the inner side of the workpiece.

[0005] The aforementioned bonding equipment exposes the inner surface of the workpiece to the bonding area through the fixture of the bonding table. The bonding device can effectively bond the component to the inner surface of the workpiece, and the pressure holding device ensures that the component is effectively bonded to the inner surface of the workpiece. The bonding equipment achieves automated bonding of the component to the inner surface of the workpiece, achieving a uniform bonding standard and improving production yield. Due to the automated bonding, it can also improve bonding efficiency and save labor costs. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of the bonding device provided in the embodiments of this application.

[0007] Figure 2 yes Figure 1 A schematic diagram of the bonding device from another angle.

[0008] Figure 3 yes Figure 1 The diagram shows the structure of the raw material supply mechanism, clinker recycling mechanism, calibration mechanism, feeding and conveying assembly, material tray buffer assembly, and clinker buffer assembly of the feeding and receiving device in the bonding equipment shown.

[0009] Figure 4 yes Figure 3 This is a structural schematic diagram from another angle of the raw material supply mechanism, clinker recycling mechanism, correction mechanism, feeding and conveying assembly, material tray buffer assembly, and clinker buffer assembly.

[0010] Figure 5 yes Figure 3 The diagram shows the state of the raw material supply mechanism, clinker recycling mechanism, calibration mechanism, feeding and conveying assembly, material tray buffer assembly and clinker buffer assembly respectively carrying the material tray and the workpiece.

[0011] Figure 6 yes Figure 1 The diagram shows the structure of the loading and unloading mechanism of the feeding and receiving device in the bonding equipment.

[0012] Figure 7 yes Figure 1 The diagram shows the structure of the splicing device, bonding table, pressure holding device, and testing device in the bonding equipment.

[0013] Figure 8 yes Figure 7 An exploded view of the fixture for the bonding station shown.

[0014] Figure 9 yes Figure 7 The diagram shows the structural schematic of the pushing mechanism of the adhesive table.

[0015] Figure 10 yes Figure 7The diagram shows the structure of the connecting device.

[0016] Figure 11 yes Figure 7 The diagram shows the structure of the pressure-holding device.

[0017] Figure 12 yes Figure 1 The diagram shows the structure of the film feeding mechanism and the material transfer mechanism of the bonding device and the feeding device in the bonding equipment shown.

[0018] Figure 13 yes Figure 12 This is a schematic diagram of the film feeding mechanism and the transfer mechanism of the bonding device and the feeding device from another angle.

[0019] Figure 14 yes Figure 1 The diagram shows the structure of the patch feeding mechanism and the bonding mechanism of the feeding device in the bonding equipment.

[0020] Figure 15 yes Figure 14 A schematic diagram of the patch feeding mechanism and bonding mechanism of the feeding device shown from another angle.

[0021] Figure 16 yes Figure 12 The diagram shows the structure of the film feeding mechanism.

[0022] Figure 17 yes Figure 12 The diagram shows the structure of the material transfer mechanism.

[0023] Figure 18 yes Figure 17 The diagram shows the material transfer mechanism from another angle.

[0024] Explanation of main component symbols

[0025] Lamination Equipment 1 Feeding Drive Module 4112

[0026] Feeding and receiving device 10, chuck gripper 4113

[0027] Raw material supply mechanism 11, tray conveying module 4114

[0028] Raw material support plate 111, pallet conveyor plate 4115

[0029] Raw material power assembly 112, suction cup bracket 4116

[0030] Raw material lifting plate 113, suction cup cylinder 4117

[0031] Raw material limit rod 114, suction cup head 4118

[0032] Raw material guide rail 115, recycling tray 4119

[0033] Raw material clamping assembly 116; Material handling assembly 412

[0034] Clinker recycling mechanism 12 Power components 4121

[0035] Clinker support plate 121, material handling seat 4122

[0036] Clinker power assembly 122, linear component 4123

[0037] Clinker lifting plate 123, material handling component 4124

[0038] Clinker limit rod 124, material handling mounting plate 4125

[0039] Clinker slide rail 125, film feeding mechanism 42

[0040] Clinker clamping assembly 126 Roller assembly 421

[0041] Loading and unloading mechanism 13 Feeding rack 4211

[0042] Feeding assembly 131, receiving rack 4212

[0043] Feeding suction head 1311, receiving motor 4213

[0044] Feeding connector 1312, receiving cylinder 4214

[0045] Material feeding assembly 132, roller module 4215

[0046] Feeding suction head 1321, pressing cylinder 4216

[0047] Material feeding drive component 1322, support block 4217

[0048] Loading / unloading drive assembly 133 Support assembly 422

[0049] Loading / unloading mounting base 134 Flexible component 4221

[0050] Detection component 135, support plate 4222

[0051] Detector 1351 Film movement assembly 423

[0052] Test connection plate 1352, film mounting plate 424

[0053] Correction mechanism 14, bonding mechanism 43

[0054] Correction head 141 Fitting motion component 431

[0055] Correction drive assembly 142 Adhesion suction head 432

[0056] Material feeding and conveying assembly 15, and bonding and detection module 433

[0057] Material tray buffer assembly 16 and lower bonding detection module 434

[0058] Material tray linear module 161, material transfer mechanism 44

[0059] Material tray slider 162, rotating material transfer component 441

[0060] Material tray linear cylinder 163, material transfer base plate 442

[0061] Material tray mounting base 164, material transfer assembly 443

[0062] Material tray suction head 165, material transfer base 4431

[0063] Material tray connecting block 166 First moving part 4432

[0064] Clinker Buffer Component 17, Receiving Part 4433

[0065] Clinker support 171 Second moving part 4434

[0066] Clinker connector 172 Third moving part 4435

[0067] Connecting device 20, shielding component 4436

[0068] Connector 21, Mounting plate 4437

[0069] Connecting base 22, receiving groove 4438

[0070] Flip-up part 23 L-shaped bracket 445

[0071] Flip-over component 24, bonding tester 446

[0072] Linear drive component 25; Adhesion device 50

[0073] Connecting mounting plate 26, motion mechanism 51

[0074] 30 bonding stage, 52 image capturing mechanism

[0075] Material loading / unloading position 301; suction mechanism 53

[0076] Adhesion position 302, suction rotating assembly 531

[0077] Pressure holding position 303, suction head 532

[0078] Detection point 304, Image sensor 54

[0079] Fixture 31, Scrap Box 55

[0080] Container 311 Pressure holding device 60

[0081] Body 312, Pressure Holding Head 61

[0082] Pressure-holding component 313, pressure-maintaining base 62

[0083] Rotating part 3131 Pressure holding drive component 63

[0084] Pressure-holding part 3132 Pressure-holding mounting block 64

[0085] Connecting part 3133, QR code holder 65

[0086] Fixture suction head 314, barcode scanner 66

[0087] Magnet 315 Detection Device 70

[0088] Blocking component 316, detection drive mechanism 71

[0089] 317 clearance groove, 72 laser detector

[0090] Pushing mechanism 32, camera detector 73

[0091] Push-drive component 321, worktable 80

[0092] Push-off part 322, base platform 81

[0093] Push-mount plate 323 Mounting bracket 82

[0094] Turntable 33, Mounting Part 2

[0095] Rotary drive base 34 Film 201

[0096] Feeding device 40, patch 202

[0097] 41 SMT feeding mechanism, 3 workpieces

[0098] Feeding assembly 411, tray 4

[0099] Feeding bracket 4111 Carrier tray 5 Detailed Implementation

[0100] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0101] In the description of this application, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, it should be noted that "a plurality of" means two or more, unless otherwise explicitly specified.

[0102] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication between the two components; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0103] The following will describe some embodiments of this application in detail with reference to the accompanying drawings.

[0104] Please refer to the following: Figure 1 and Figure 2 As shown, this application embodiment provides a bonding device 1, which is used to bond a component 2 (such as...) Figure 8 As shown) bonded to workpiece 3 (e.g. Figure 8 The inner side of the bonding device 1 (as shown). The bonding device 1 includes a feeding and receiving device 10, a connecting device 20, a bonding table 30, a feeding device 40, a bonding device 50, and a pressure holding device 60.

[0105] The feeding and receiving device 10 is used to supply workpiece 3 (raw material) and recycle the adhesive-bonded parts 2 (cooked material). The connecting device 20 is correspondingly provided with the feeding and receiving device 10, and the connecting device 20 includes a rotatable and movable connecting head 21 (e.g., ...). Figure 10As shown), the connector 21 is used to adapt and receive the workpiece 3 supplied by the receiving device 10. The bonding table 30 is correspondingly arranged with the connector 20, and the bonding table 30 is provided with upper and lower material positions 301 (e.g., ...). Figure 7 As shown), adhesive part 302 (as shown) Figure 7 (as shown) and pressure holding position 303 (as shown) Figure 7 As shown), the loading / unloading position 301 is used for loading the workpiece 3 and unloading the adhesive patch 2, the adhesive position 302 is used for adhesiveting the patch 2 to the workpiece 3, and the pressure holding position 303 is used for holding the patch 2 under pressure and adhesiveting it to the workpiece 3. The adhesive table 30 includes a fixture 31 (e.g., a jig that can move between the loading / unloading position 301, the adhesive position 302, and the pressure holding position 303) that can move between the loading / unloading position 301, the adhesive position 302, and the pressure holding position 303. Figure 7 As shown, the fixture 31 is used to receive the workpiece 3 on the connector 21 at the loading / unloading position 301, exposing the inner surface of the workpiece 3 to the bonding area. The connector 21 is also used to receive the workpiece 3 with the adhesive patch 2 on the fixture 31 at the loading / unloading position 301. The receiving device 10 is used to retrieve the workpiece 3 with the adhesive patch 2 from the connector 21. The feeding device 40 is provided adjacent to the bonding table 30 and is used to supply the patch 2. The bonding device 50 is provided corresponding to the feeding device 40 and to the bonding position 302. The bonding device 50 is used to pick up the patch 2 from the feeding device 40 and bond the patch 2 to the inner surface of the workpiece 3 on the fixture 31 that has moved to the bonding position 302. It can be understood that the bonding area is the visible range within which the bonding device 50 can bond the patch 2 to the inner surface of the workpiece 3. The pressure holding device 60 is disposed adjacent to the bonding table 30 and corresponds to the pressure holding position 303. The pressure holding device 60 includes a pressure holding head 61 that can be elastically telescopically moved (e.g., Figure 11 As shown), the pressure head 61 is used to press against the patch 2 that is bonded to the inner side of the workpiece 3, so that the patch 2 is bonded to the inner side of the workpiece 3.

[0106] In actual use, the aforementioned bonding equipment 1 has the following steps: the fixture 31 of the bonding table 30 moves to the loading / unloading position 301, where the receiving device 10 supplies the workpiece 3; the connector 21 of the connecting device 20 receives the workpiece 3 supplied by the receiving device 10 and places it on the fixture 31 at the loading / unloading position 301. When the workpiece 3 is placed on the fixture 31, its inner surface is exposed within the bonding area. After the workpiece 3 is placed on the fixture 31, the fixture 31 moves to the bonding position 302, where the feeding device 40 supplies the adhesive 2. The bonding device 50 picks up the adhesive 2 from the feeding device 40 and bonds it to the inner surface of the workpiece 3 on the fixture 31 at the bonding position 302. After part 2 is bonded to the inner side of workpiece 3, fixture 31 moves to pressure holding position 303. Pressure holding head 61 of pressure holding device 60 elastically presses part 2 bonded to the inner side of workpiece 3 so that part 2 is stably bonded to the inner side of workpiece 3. After part 2 is stably bonded to the inner side of workpiece 3, fixture 31 moves to loading / unloading position 301. Connecting head 21 of connecting device 20 receives workpiece 3 with bonded part 2 on fixture 31 at loading / unloading position 301 and places the received workpiece 3 with bonded part 2 on feeding / receiving device 10. Feeding / receiving device 10 collects workpiece 3 with bonded part 2 and supplies workpiece 3 again. This cycle repeats to bond part 2 to workpiece 3.

[0107] In this embodiment of the application, the bonding equipment 1 further includes a worktable 80, on which the feeding and receiving device 10, the connecting device 20, the bonding table 30, the feeding device 40, the bonding device 50 and the pressure holding device 60 are all disposed, so that the bonding equipment 1 can be centrally set up.

[0108] Please refer to the following: Figures 3 to 6As shown in the embodiment of this application, the feeding and receiving device 10 includes a raw material supply mechanism 11, a clinker recycling mechanism 12, and a loading and unloading mechanism 13. The raw material supply mechanism 11 is used to supply workpieces 3, and the clinker recycling mechanism 12 is arranged adjacent to the raw material supply mechanism 11 and is used to recycle workpieces 3 of the adhesive patch 2. The loading and unloading mechanism 13 includes a loading component 131 and a unloading component 132 that can move synchronously. The loading component 131 and the unloading component 132 are staggered. Specifically, the loading component 131 and the unloading component 132 are staggered vertically. The loading component 131 is used to pick up workpieces 3 from the raw material supply mechanism 11 and place the workpieces 3 on the connector head 21 of the connecting device 20. The unloading component 132 is used to pick up workpieces 3 of the adhesive patch 2 from the connector head 21 of the connecting device 20 and place the workpieces 3 of the adhesive patch 2 on the clinker recycling mechanism 12. Thus, by setting up the raw material supply mechanism 11, the clinker recycling mechanism 12 and the loading and unloading mechanism 13, the raw material is supplied between the raw material supply mechanism 11 and the connecting device 20, and the clinker is recycled between the connecting device 20 and the clinker recycling mechanism 12, wherein the raw material is the workpiece 3 of the patch 2 to be attached, and the clinker is the workpiece 3 of the adhesive patch 2.

[0109] Specifically, the raw material supply mechanism 11 is used to supply material trays 4 that carry workpieces 3, wherein each material tray 4 can hold multiple workpieces 3. The raw material supply mechanism 11 includes a raw material bearing plate 111, a raw material power assembly 112, a raw material lifting plate 113, a raw material limiting rod 114, a raw material slide rail 115, and a raw material clamping assembly 116. There are two raw material slide rails 115, which are spaced apart on the base 81 of the worktable 80 (e.g., ...). Figure 1As shown, a raw material support plate 111 is slidably mounted on two raw material slide rails 115. The raw material support plate 111 is used to support multi-layered material trays 4, each tray 4 bearing multiple workpieces 3. There are multiple raw material limiting rods 114, which are all mounted on the raw material support plate 111 and arranged according to the outline of the trays 4. The multiple raw material limiting rods 114 are used to limit the material trays 4 supported by the raw material support plate 111. The raw material power assembly 112 is located at the bottom of the base platform 81. The raw material lifting plate 113 is connected to the raw material power assembly 112. Driven by the raw material power assembly 112, the raw material lifting plate 113 can fit through the through hole on the raw material support plate 111 to lift the stacked multi-layer material trays 4 upwards, so as to continuously supply material. The raw material power assembly 112 can be a mechanism composed of a lead screw, motor, etc. The raw material power assembly 112 can also be a telescopic cylinder or other functional mechanism that can drive the raw material lifting plate 113 to move linearly. There are two raw material clamping components 116. The two raw material clamping components 116 are located on both sides of the material tray 4. The two raw material clamping components 116 cooperate to clamp the material tray 4. The raw material clamping components 116 can be composed of cylinders, clamping rods, etc. The cylinder drives the clamping rods to move closer to or away from the material tray 4 so as to clamp or release the material tray 4. The raw material clamping components 116 can also be other functional mechanisms that can clamp the material tray 4.

[0110] Thus, by setting the specific structure of the raw material supply mechanism 11, the raw material bearing plate 111 is slidably mounted on two raw material slide rails 115. Pulling out the raw material bearing plate 111 and multiple raw material limiting rods 114 allows the stacked multi-layer material trays 4 to be placed on the raw material bearing plate 111 and limited by the multiple raw material limiting rods 114. After placing the multi-layer material trays 4, pushing in the raw material bearing plate 111, multiple raw material limiting rods 114, and multi-layer material trays 4, the raw material power assembly 112 drives the raw material lifting plate 113 through the through-holes in the raw material bearing plate 111 to lift the multi-layer material trays. The tray 4 is lifted upwards, so that the current uppermost tray 4 is located between the two raw material clamping components 116. The two raw material clamping components 116 clamp the tray 4 so that the feeding component 131 can pick up the material from the tray 4. When the workpiece 3 on the current uppermost tray 4 is completely removed, the current uppermost tray 4 is removed. The raw material power component 112 drives the raw material lifting plate 113 to continue to move upwards, so that the current uppermost tray 4 is now located between the two raw material clamping components 116. The two raw material clamping components 116 clamp the current uppermost tray 4 again, and so on, to supply workpiece 3.

[0111] The clinker recycling mechanism 12 is used to recycle the tray 4 that carries the workpiece 3 of the adhesive patch 2. The clinker recycling mechanism 12 includes a clinker bearing plate 121, a clinker power assembly 122, a clinker lifting plate 123, clinker limiting rods 124, clinker slide rails 125, and a clinker clamping assembly 126. There are two clinker slide rails 125, which are spaced apart on the base 81 of the worktable 80 and arranged parallel to the two raw material slide rails 115. The clinker bearing plate 121 is slidably mounted on the two clinker slide rails 125. The clinker bearing plate 121 is used to carry the multi-layered clinker tray 4. There are multiple clinker limiting rods 124, which are all mounted on the clinker bearing plate 121 and arranged according to the outline of the tray 4. The multiple clinker limiting rods 124 are used to limit the tray 4 carried by the clinker bearing plate 121. A clinker power assembly 122 is located at the bottom of the base platform 81. A clinker lifting plate 123 is connected to the clinker power assembly 122. Driven by the clinker power assembly 122, the clinker lifting plate 123 can fit through the through hole on the clinker support plate 121 to drive the stacked multi-layer material trays 4 downwards, so as to continuously collect the material trays 4 containing clinker. The clinker power assembly 122 is generally similar to the raw material power assembly 112. There are two clinker clamping assemblies 126, which are located on both sides of the material tray 4. The two clinker clamping assemblies 126 cooperate to clamp the material tray 4. The clinker clamping assemblies 126 are generally similar to the raw material clamping assemblies 116.

[0112] Thus, by setting the specific structure of the clinker recycling mechanism 12, two clinker clamping components 126 clamp the material tray 4 to facilitate the placement of clinker on the tray 4. After the uppermost material tray 4 is filled with clinker, the clinker power component 122 drives the clinker lifting plate 123 to pass through the through hole on the clinker bearing plate 121 to abut against the uppermost material tray 4. Driven by the clinker power component 122, the clinker lifting plate 123 moves the abutted material tray 4 downwards, so that the two clinker clamping components 126 can clamp the material tray 4 again. When the material tray 4 is filled with clinker, the clinker power component 122 drives the clinker lifting plate 123 to move upwards to abut against the material tray 4 again and stack the material tray 4. Driven by the clinker power component 122, the clinker is lifted. Plate 123 drives the stacked material trays 4 that it abuts to move downwards, so that the two clinker clamping components 126 can clamp the material trays 4 again. This cycle is repeated to collect clinker. When the material trays 4 that hold clinker are stacked to a preset number, the clinker power component 122 drives the clinker support plate 121 downwards through the clinker support plate 121, so that the stacked multi-layer material trays 4 are placed on the clinker support plate 121. The clinker support plate 121 is slidably set on the two clinker slide rails 125, and the clinker support plate 121, multiple clinker limiting rods 124 and multi-layer material trays 4 that hold clinker are pulled out, so that the stacked multi-layer material trays 4 can be unloaded. After the multi-layer material trays 4 are unloaded, the clinker support plate 121 and multiple clinker limiting rods 124 are pushed in, so that the material trays 4 that hold clinker can be collected again.

[0113] In this embodiment, the feeding and receiving device 10 further includes a feeding conveyor assembly 15, a tray buffer assembly 16, and a clinker buffer assembly 17. The feeding conveyor assembly 15 is located adjacent to the raw material supply mechanism 11 and the clinker recycling mechanism 12. The feeding conveyor assembly 15 is mounted on a base platform 81 and can be a belt conveyor mechanism. The feeding conveyor assembly 15 is used to transport unqualified workpieces 3 of the adhesive bonding component 2 to a designated location, such as a waste recycling area or a waste recycling bin. The tray buffer assembly 16 is correspondingly located to the raw material supply mechanism 11 and the clinker recycling mechanism 12. The tray buffer assembly 16 is mounted on the base platform 81 and is used to pick up the tray 4 containing the workpieces 3 from the raw material supply mechanism 11. It is also used to place the picked-up tray 4 at the clinker recycling mechanism 12 so that the tray 4 can receive the workpieces 3 of the adhesive bonding component 2. The clinker buffer assembly 17 is located adjacent to the clinker recycling mechanism 12 and is located on the feeding conveyor assembly 15. The clinker buffer assembly 17 is used to buffer the workpiece 3 of the adhesive patch 2 picked up by the feeding assembly 132.

[0114] Thus, by setting up the above-mentioned feeding conveyor component 15, material tray buffer component 16, and clinker buffer component 17, when the feeding component 132 picks up two or more clinkers at a time, if there are unqualified clinkers among them, the feeding component 132 places the unqualified clinkers on the feeding conveyor component 15 to transport the unqualified clinkers to the designated position. When the material tray 4 at the clinker recycling mechanism 12 is full of clinkers or can only hold one more clinker, the feeding component 132 places all the clinkers on the clinker buffer component 17 or places one clinker on the material tray 4 and the remaining clinkers on the clinker buffer component 17. On the one hand, this achieves the effect of full placement of the material tray 4, and on the other hand, it improves the feeding efficiency of the feeding component 132 and prevents the feeding component 132 from being in a waiting state for feeding. When the raw material on the tray 4 at the raw material supply mechanism 11 is depleted, but the tray 4 at the clinker recycling mechanism 12 is not yet full of clinker, the tray 4 at the raw material supply mechanism 11 can be removed by the tray buffer component 16 so that the raw material supply mechanism 11 can continue to supply raw material. At the same time, when the tray 4 at the clinker recycling mechanism 12 is full of clinker, the tray buffer component 16 will place the tray 4 at the clinker recycling mechanism 12, thereby achieving the effect of full clinker placement and the effect of tray 4 buffering. For example, in this embodiment of the application, the feeding component 132 can simultaneously pick up three clinker. When two of the three clinker picked up by the feeding component 132 are unqualified, the feeding component 132 places the unqualified clinker on the feeding conveying component 15, and then places the remaining qualified clinker on the clinker buffer component 17. When one of the three clinker picked up by the feeding component 132 again is unqualified, the feeding component 132 places the unqualified quantity on the feeding conveying component 15, and then picks up one previously buffered clinker from the clinker buffer component 17, thereby simultaneously placing three clinker on the material tray 4 to achieve the effect of full clinker placement on the material tray 4.

[0115] Specifically, the tray buffer assembly 16 includes a tray linear module 161, a tray slider 162, a tray linear cylinder 163, a tray mounting base 164, a tray suction head 165, and a tray connecting block 166. The material tray linear module 161 is mounted on the base platform 81. The material tray slider 162 is connected to the material tray linear module 161 to move linearly under the drive of the material tray linear module 161. The material tray linear cylinder 163 is mounted on the material tray slider 162 and moves synchronously with the material tray slider 162. One end of the material tray mounting base 164 is rotatably mounted on the material tray slider 162. The other end of the material tray mounting base 164 can extend above the raw material supply mechanism 11 and the clinker recycling mechanism 12. There are multiple material tray suction heads 165. Multiple material tray suction heads 165 are mounted on the other end of the material tray mounting base 164 for picking up the material tray 4. The material tray connecting block 166 is vertically connected to the other end of the material tray mounting base 164 and rotatably connected to the material tray linear cylinder 163. Thus, the aforementioned tray buffer assembly 16 extends or retracts via the tray linear cylinder 163, causing the multiple tray suction heads 165 to approach or move away from the tray 4, thereby enabling the tray 4 to pick up and lift itself, thus achieving buffering of the tray 4. The tray linear module 161 can drive the picked-up tray 4 from the raw material supply mechanism 11 to the clinker recycling mechanism 12, thereby realizing the transfer of the tray 4.

[0116] The clinker buffer assembly 17 includes a clinker support 171 disposed on the feeding conveying assembly 15 and a clinker receiving joint 172 disposed on the clinker support 171. The clinker receiving joint 172 is used to adapt and receive the workpiece 3. The clinker support 171 is approximately L-shaped so that the clinker receiving joint 172 can be located above the feeding conveying assembly 15.

[0117] In this embodiment, the loading and unloading mechanism 13 further includes a loading and unloading drive component 133 and a loading and unloading mounting base 134. The loading and unloading drive component 133 is a multi-axis linear module, such as a two-axis linear module. The loading and unloading drive component 133 is mounted on the mounting frame 82 of the workbench 80 and is located above the raw material supply mechanism 11, the clinker recycling mechanism 12, and other mechanisms. The loading and unloading mounting base 134 is mounted on the loading and unloading drive component 133. The loading component 131 and the unloading component 132 are both mounted on the loading and unloading mounting base 134 so as to achieve synchronous movement under the drive of the loading and unloading drive component 133.

[0118] Specifically, the feeding assembly 131 includes a feeding suction head 1311 and a feeding connector 1312. The feeding connector 1312 is mounted on the loading / unloading mounting base 134. The feeding suction head 1311 is connected to the feeding connector 1312 and is used to suck up the workpiece 3 by negative pressure. The unloading assembly 132 includes an unloading suction head 1321 and an unloading drive 1322. The unloading drive 1322 is a cylinder and is mounted on the loading / unloading mounting base 134 and spaced apart from the feeding connector 1312. The feeding connector 1312 is approximately L-shaped. The unloading suction head 1321 is connected to the unloading drive 1322 to move downward or upward under the drive of the unloading drive 1322. This not only creates a misalignment with the feeding suction head 1311 to avoid interference, but also improves the flexibility of the unloading suction head 1321.

[0119] In this embodiment, the loading / unloading mechanism 13 further includes a detection component 135. The detection component 135 is correspondingly arranged with the loading component 131 and moves synchronously with the loading component 131 and the unloading component 132. The detection component 135 is used to perform error-proof detection on the workpiece 3 picked up by the loading component 131 from the raw material supply mechanism 11, such as detecting the direction or angle of the workpiece 3. Specifically, the detection component 135 includes a detector 1351 and a detection connecting plate 1352. The detection connecting plate 1352 is connected to the loading / unloading drive component 133 and is arranged parallel to the loading / unloading mounting base 134. The detector 1351 is located on the detection connecting plate 1352. The number of detectors 1351, loading suction head 1311 and unloading suction head 1321 are equal and correspond one-to-one. The detector 1351 can be a CCD camera or other instruments capable of detecting the workpiece 3. For example, the detector 1351 is specifically used to detect whether the direction or angle of the picked-up workpiece 3 meets the preset requirements. In other embodiments, the detector 1351 may also be directly mounted on the loading / unloading mounting base 134.

[0120] In this embodiment, the feeding and receiving device 10 further includes a correction mechanism 14. The correction mechanism 14 is mounted on the raw material supply mechanism 11 or the base platform 81. The correction mechanism 14 receives workpieces 3 that fail the error-proof detection by the detection component 135 and corrects the orientation of the workpieces 3. Specifically, the correction mechanism 14 includes a rotatable correction head 141 and a correction drive component 142 for driving the correction head 141 to rotate. The correction head 141 carries the workpieces 3 that fail the error-proof detection and rotates them through the driving action of the correction drive component 142 to correct the orientation of the workpieces 3. When the detection component 135 detects that the angle of the workpiece 3 picked up by the loading component 131 does not meet the preset requirements, the loading and unloading drive component 133 drives the loading component 131 to move to the correction mechanism 14. The loading component 131 places the workpiece 3 that fails the error prevention test on the correction head 141. The correction drive component 142 drives the correction head 141 to rotate 180°, thereby correcting the placement angle of the workpiece 3 held by the correction head 141. After the workpiece 3 is correctly placed, the loading component 131 picks up the workpiece 3 on the correction head 141 and transfers it to the connection head 21 of the connection device 20. In this way, the incorrect placement direction of the workpiece can be avoided from affecting the bonding of the patch 2 and the workpiece 3, which facilitates the accurate subsequent bonding operation. The correction drive assembly 142 comprises, for example, a motor, a rack, and multiple gears. The gears are connected to both the motor and the correction head 141. The motor drives the rack to move via the gears, and the rack then drives the gear connected to the correction head 141 to rotate, thus enabling multiple correction heads 141 to rotate simultaneously to correct the workpiece 3. In other embodiments, when there is only one correction head 141, the correction drive assembly 142 can also be a motor, which can be directly connected to the correction head 141.

[0121] In this embodiment of the invention, the feeding assembly 131 includes three feeding suction heads 1311, which can simultaneously pick up three workpieces 3 and use three corresponding detectors 1351 to perform error-proof detection on the three workpieces 3 respectively. The number of correction heads 141 of the correction mechanism 14 can also be set to three. If the orientation of the three workpieces 3 picked up by the feeding assembly 131 is incorrect, the three workpieces 3 are placed on the three correction heads 141 of the correction mechanism 14 for correction. If one or two of the three workpieces 3 picked up by the feeding assembly 131 are incorrect in orientation, the workpieces 3 with one or two incorrect orientations are placed on one or two correction heads 141 of the correction mechanism 14 for correction. The detectors 1351 can detect reference marks on the workpieces 3 (e.g., notches on the front or back of the workpieces). If the orientation of the reference marks matches the preset direction, the workpieces are correctly positioned. If the orientation of the reference marks is opposite to the preset direction, they need to be sent to the correction head 141 for correction. After the correction head 141 rotates 180°, the position of the workpieces 3 can be straightened.

[0122] Please see Figure 7 As shown in this embodiment, the bonding table 30 further includes a rotatable turntable 33 and a rotary drive base 34 for driving the turntable 33 to rotate. The rotary drive base 34 is mounted on the base platform 81, and the turntable 33 is connected to the rotary drive base 34. The loading / unloading positions 301, the bonding position 302, and the pressure holding position 303 are arranged around the rotation axis of the turntable 33. The fixture 31 is mounted on the turntable 33 and moves with the turntable 33 between the loading / unloading positions 301, the bonding position 302, and the pressure holding position 303. Thus, by setting the turntable 33 and the rotary drive base 34, the loading / unloading positions 301, the bonding position 302, and the pressure holding position 303 are arranged around the turntable 33, thereby reducing the size of the bonding table 30, further reducing the size of the bonding equipment 1, and reducing the floor space occupied. The rotary drive base 34 is generally composed of a motor, a housing, bearings, etc.

[0123] In this embodiment, the bonding table 30 is further provided with a detection position 304, which is used to detect the workpiece 3 of the bonded patch 2. The detection position 304, along with the loading / unloading position 301, the bonding position 302, and the pressure holding position 303, are evenly arranged on the periphery of the turntable 33. The fixture 31 can move between the loading / unloading position 301, the bonding position 302, the pressure holding position 303, and the detection position 304. Correspondingly, the bonding equipment 1 also includes a detection device 70, which is disposed adjacent to the bonding table 30 and corresponds to the detection position 304. The detection device 70 is disposed on the base 81 and is used to detect the workpiece 3 of the bonded patch 2 on the fixture 31 that has moved to the detection position 304. The detection device 70 includes at least one of a laser detector 72 and a camera detector 73. Thus, by providing the above-mentioned detection device 70, the detection of the workpiece 3 of the bonded patch 2 is realized, thereby increasing the functionality of the bonding equipment 1.

[0124] Specifically, the inspection device 70 includes an inspection drive mechanism 71, a laser inspector 72, and a camera inspector 73. The inspection drive mechanism 71 is mounted on the base platform 81 and adjacent to the turntable 33. The inspection drive mechanism 71 can be a single-axis linear module. The laser inspector 72 and the camera inspector 73 are spaced apart on the inspection drive mechanism 71 and move synchronously under the drive of the inspection drive mechanism 71. The laser inspector 72 is used to detect the position of the patch 2 on the inner side of the workpiece 3, and the camera inspector 73 is used to detect whether the patch 2 is attached to the inner side of the workpiece 3. In this way, by setting the above-mentioned inspection drive mechanism 71, when the fixture 31 can support multiple workpieces 3, the inspection drive mechanism 71 drives the laser inspector 72 and the camera inspector 73 to inspect multiple workpieces 3, thereby improving the inspection efficiency of the inspection device 70.

[0125] In this embodiment, four fixtures 31 are respectively provided on the turntable 33. The four fixtures 31 correspond to the loading / unloading position 301, the bonding position 302, the pressure holding position 303, and the detection position 304. In this way, by providing four fixtures 31 on the turntable 33, the bonding table 30 can simultaneously perform loading / unloading, bonding, pressure holding, and detection, thereby further improving the working efficiency of the bonding equipment 1.

[0126] Please see Figure 8 As shown in the embodiments of this application, each fixture 31 can support three workpieces 3. In other embodiments, each fixture 31 can support more or fewer workpieces 3. It is understood that the number of corresponding supporting mechanisms such as the loading component 131, the unloading component 132, the pressure holding head 61, and the connecting head 21 are all matched with the fixture 31. The embodiments of this application will not be described in detail here.

[0127] Specifically, the fixture 31 has a receiving groove 311, which is inclined relative to the base 81. The receiving groove 311 is used to accommodate the workpiece 3 and to tilt the workpiece 3 so that the inner surface of the workpiece 3 is exposed within the bonding area. Thus, by providing the receiving groove 311 on the fixture 31, the workpiece 3 is positioned by accommodating it, and the workpiece 3 is tilted so that its inner surface is exposed within the bonding area.

[0128] The fixture 31 includes a body 312 and a pressing member 313. A receiving groove 311 is formed on the body 312. The pressing member 313 includes a rotating part 3131, a pressing part 3132 and a contact part 3133. The pressing part 3132 and the contact part 3133 are respectively provided at both ends of the rotating part 3131 and extend in opposite directions. The end of the rotating part 3131 near the pressing part 3132 is rotatably provided on the body 312 and located below the receiving groove 311. The pressing part 3132 extends upward to the receiving groove 311. The pressing part 3132 is used to press the workpiece 3 located in the receiving groove 311 under the action of the contact part 3133 and the rotating part 3131. Thus, by setting the body 312 and the pressing member 313 of the aforementioned fixture 31, the pressing member 313 rotates under the gravity of the abutting part 3133, thereby allowing the pressing part 3132 to extend to the receiving groove 311, thereby pressing against the workpiece 3 in the receiving groove 311. The body 312 is also provided with a fixture suction head 314, the end of which is located at the bottom of the receiving groove 311. The fixture suction head 314 uses negative pressure to adsorb the workpiece 3, thereby further positioning the workpiece 3.

[0129] In this embodiment, the jig 31 further includes a magnet 315, which is disposed on the body 312 and adjacent to the receiving groove 311. The magnet 315 is located below the receiving groove 311 and is used to magnetically attract the pressing part 3132. The pressing part 3132 may contain iron or other materials that can be attracted by the magnet 315. Thus, by providing the magnet 315, the pressing part 3132 is attracted, preventing the pressing part 3132 from detaching from the body 312 and thus effectively pressing the workpiece 3.

[0130] In this embodiment of the application, the jig 31 further includes a stop member 316, which is disposed on the body 312 and located below the pressing member 313. The stop member 316 is used to limit the pressing member 313 and prevent the pressing member 313 from detaching from the body 312.

[0131] Please refer to the embodiments in this application. Figure 7 and Figure 9 As shown, the bonding table 30 also includes a pushing mechanism 32. The pushing mechanism 32 is located at the upper and lower material positions 301 and below the turntable 33. The pushing mechanism 32 is used to push the abutting part 3133 of the fixture 31 that has moved to the upper and lower material positions 301 upward, so that the abutting part 3133 drives the rotating part 3131 to rotate, thereby causing the rotating part 3131 to drive the pressing part 3132 away from the receiving groove 311, so as to remove the workpiece 3 of the bonding patch 2 from the receiving groove 311, or so as to make the receiving groove 311 receive the workpiece 3 on the connector 21. Specifically, the pushing mechanism 32 includes a pushing drive 321, pushing members 322, and a pushing mounting plate 323. The pushing drive 321 is mounted on the rotary drive base 34 and can be a cylinder. Three pushing members 322 are spaced apart on the pushing mounting plate 323, which is connected to the pushing drive 321. The pushing drive 321 drives the three pushing members 322 to move synchronously through the turntable 33 via the pushing mounting plate 323, simultaneously pushing against the three abutment portions 3133 on the fixture 31. This allows the pressing portions 3132 of the corresponding fixture 31 to move away from the receiving groove 311, facilitating simultaneous loading and unloading of materials into the receiving groove 311. Thus, by providing the aforementioned pushing mechanism 32, it is convenient to load and unload materials from the fixture 31.

[0132] Please see Figure 7 and Figure 10As shown in the embodiment of this application, the connecting device 20 further includes a connecting base 22, a flipping member 23, a flipping drive member 24, and a linear drive member 25. The connecting base 22 is generally a U-shaped frame, and is mounted on the base platform 81. The flipping member 23 is rotatably mounted on the connecting base 22 and is generally T-shaped. The flipping drive member 24 is located on one side of the connecting base 22 and connected to the flipping member 23. The flipping drive member 24 is used to drive the flipping member 23 to rotate so that the flipping member 23 rotates to a predetermined angle. The flipping drive member 24 can be a motor, a rotary cylinder, etc. The linear drive member 25 is mounted on the flipping member 23 and rotates synchronously with the flipping member 23. The linear drive member 25 is connected to three connecting heads 21 through a connecting mounting plate 26. The linear drive member 25 is used to simultaneously drive the three connecting heads 21 to move linearly through the connecting mounting plate 26 so that the connecting heads 21 send the workpiece 3 into the fixture 31. The connecting heads 21 are used to pick up the workpiece 3.

[0133] Thus, when the connector 21 receives the workpiece 3 picked up by the feeding assembly 131, the flipping drive 24 drives the flipping member 23 to a vertical state so that the connector 21 can receive and hold the workpiece 3 on the feeding assembly 131. After the connector 21 receives the workpiece 3, the flipping drive 24 drives the flipping member 23 to a direction that is approximately parallel to the receiving groove 311. The linear drive 25 drives the connector 21 to move toward the receiving groove 311 so that the connector 21 places the workpiece 3 in the receiving groove 311. The connector 21 releases the workpiece 3 and is held by the fixture suction head 314 on the fixture 31. The linear drive 25 drives the connector 21 to move away from the receiving groove 311. The pushing mechanism 32 releases the abutting part 3133 of the fixture 31 so that the pressing part 3132 rotates toward the receiving groove 311 to press against the workpiece 3. When the workpiece 3 of the adhesive patch 2 is removed from the receiving groove 311, the flipping drive 24 drives the flipping member 23 to be in a direction approximately parallel to the receiving groove 311, the pushing mechanism 32 pushes the abutting part 3133 to release the workpiece 3, the linear drive 25 drives the connector 21 to move toward the receiving groove 311 to insert into the workpiece 3, the fixture suction head 314 of the fixture 31 releases the workpiece 3 and the connector 21 sucks up the workpiece 3, the linear drive 25 drives the connector 21 to move the workpiece 3 away from the fixture 31, and the flipping drive 24 drives the flipping member 23 to be in a vertical state so that the unloading assembly 132 can pick up the workpiece 3 of the adhesive patch 2 from the connector 21.

[0134] Please refer to the following: Figure 7 and Figure 11As shown in the embodiment of this application, the pressure holding device 60 further includes a pressure holding base 62, a pressure holding drive 63, and a pressure holding mounting block 64. The pressure holding base 62 is generally a gantry frame and is mounted on the base platform 81. The pressure holding drive 63 is a cylinder and is mounted on the pressure holding base 62. The pressure holding mounting block 64 is connected to the pressure holding drive 63, and the pressure holding head 61 is elastically connected to the pressure holding mounting block 64. For example, the pressure holding head 61 is elastically telescopically connected to the pressure holding mounting block 64 through a spring, a sliding sleeve, etc. Thus, by setting the specific structure of the pressure holding device 60, when the fixture 31 carrying the workpiece 3 bearing the adhesive patch 2 moves to the pressure holding position 303, the pressure holding drive 63 drives the pressure holding mounting block 64 to move toward the workpiece 3 on the fixture 31, so that the pressure holding head 61 can elastically press the patch 2 on the workpiece 3. After the pressure holding time is preset, the pressure holding drive 63 drives the pressure holding mounting block 64 to move away from the workpiece 3 on the fixture 31, so as to achieve pressure holding of the patch 2.

[0135] In this embodiment, the pressure holding device 60 further includes a barcode scanner 65 and a barcode scanner 66. The barcode scanner 65 is mounted on the pressure holding base 62 and extends toward the loading / unloading position 301 opposite to the pressure holding position 303. The barcode scanner 66 is mounted on the barcode scanner 65 and corresponds to the fixture 31 at the loading / unloading position 301. Correspondingly, the fixture 31 is also provided with a clearance groove 317 (e.g., Figure 8 The clearance groove 317 is connected to the receiving groove 311. Thus, by setting the barcode scanner 66 and the clearance groove 317 as described above, the barcode scanner 66 can scan the workpiece 3 on the fixture 31 through the clearance groove 317, thereby obtaining the information of the workpiece 3, which is convenient for subsequent tracking of the bonding process of the workpiece 3.

[0136] Please see Figure 12 As shown in the embodiment of this application, the bonding device 50 includes a motion mechanism 51, an image-taking mechanism 52, and a material-suction mechanism 53. The motion mechanism 51 is disposed on the base 81 (e.g., Figure 1As shown, the image-capturing mechanism 52 is mounted on the motion mechanism 51 and moves under the drive of the motion mechanism 51. The image-capturing mechanism 52 is used to acquire an image of the workpiece 3 to be bonded (2). The suction mechanism 53 is mounted on the motion mechanism 51 and is located adjacent to the image-capturing mechanism 52. The suction mechanism 53 and the image-capturing mechanism 52 move synchronously under the drive of the motion mechanism 51. The suction mechanism 53 is used to pick up the workpiece 2 from the feeding device 40 and place the workpiece 2 on the inner side of the fixture 31 that has moved to the bonding position 302. Thus, by setting the specific structure of the bonding device 50, the suction mechanism 53 picks up the workpiece 2, and the image-capturing mechanism 52 acquires an image of the workpiece 3. With the cooperation of the image-capturing mechanism 52 and the motion mechanism 51, the suction mechanism 53 accurately bonds the workpiece 2 to the inner side of the workpiece 3, thereby achieving the bonding of the workpiece 2. The motion mechanism 51 can be a multi-axis linear module, such as a three-axis linear module, and the image-capturing mechanism 52 can be a CCD camera.

[0137] In this embodiment, the material suction mechanism 53 includes a material suction rotation assembly 531 and a material suction head 532. The material suction rotation assembly 531 is mounted on the motion mechanism 51, and the material suction head 532 is connected to the material suction rotation assembly 531 to rotate under the drive of the material suction rotation assembly 531. Thus, after the image acquisition mechanism 52 acquires an image of the workpiece 3, the angle of the material suction head 532 and the suction-loaded part 2 can be adjusted through the material suction rotation assembly 531, so that the part 2 can be accurately bonded to the inner surface of the workpiece 3, improving the bonding yield of the part 2. The material suction rotation assembly 531 can be a motor or a rotary cylinder.

[0138] In this embodiment, the bonding device 50 further includes an image sensor 54 and a waste container 55. The image sensor 54 and the waste container 55 are spaced apart on the base platform 81. The image sensor 54 is used to acquire an image of the part 2 picked up by the suction mechanism 53 to detect whether the part 2 meets the requirements, such as whether the part 2 is damaged or has defects such as air bubbles. When the image sensor 54 detects that the part 2 picked up by the suction mechanism 53 is defective, the suction mechanism 53 discards the defective part 2 into the waste container 55 to achieve the recycling of the defective part 2. In this way, by setting the image sensor 54 and the waste container 55, the detection of the part 2 is achieved, improving the yield of bonding of the workpiece 3; in addition, by setting the waste container 55, the defective part 2 can be recycled in a timely manner, avoiding environmental pollution, while improving the suction efficiency of the suction mechanism 53.

[0139] Please see Figure 8 As shown in the embodiment of this application, the patch 2 includes a film 201 and a patch 202, wherein the film 201 can be a double-sided adhesive, and the patch 202 is bonded to the inner side of the workpiece 3 through the film 201.

[0140] Please refer to the following: Figure 1 , Figure 2 as well as Figures 12 to 15 As shown in the embodiment of this application, the feeding device 40 includes a patch feeding mechanism 41, a film feeding mechanism 42, a bonding mechanism 43, and a transfer mechanism 44. The patch feeding mechanism 41, film feeding mechanism 42, bonding mechanism 43, and transfer mechanism 44 are all mounted on a base platform 81. The patch feeding mechanism 41 supplies patches 202, and the film feeding mechanism 42 is located adjacent to the patch feeding mechanism 41 and supplies films 201. The bonding mechanism 43 is located corresponding to the patch feeding mechanism 41 and the film feeding mechanism 42, and is used to pick up the patch 202 from the patch feeding mechanism 41 and attach the patch 202 to the film 201 at the film feeding mechanism 42. The transfer mechanism 44 is provided corresponding to the film feeding mechanism 42 and the bonding device 50. The transfer mechanism 44 is used to receive the patch 2 (i.e., the film 201 for pasting patch 202) from the film feeding mechanism 42 and transfer the patch 2 to the bonding device 50, thereby supplying the patch 2 to the bonding device 50. In this way, by setting the specific structure of the feeding device 40, the patch 202 and the film 201 are supplied by the patch feeding mechanism 41 and the film feeding mechanism 42 respectively, and then the bonding mechanism 43 pastes the patch 202 onto the film 201 to form the patch 2. Finally, the transfer mechanism 44 transfers the patch 2 to the bonding device 50, thereby realizing the supply of the patch 2. Since the patch 202 and the film 201 are supplied by the patch feeding mechanism 41 and the film feeding mechanism 42 respectively, there is no need to purchase the pre-made patch 2 with higher costs, which helps to reduce production costs. Understandably, in other embodiments, the feeding device 40 may also directly supply the pre-made patch 2.

[0141] Please refer to the following: Figure 14 and Figure 15 As shown in the embodiment of this application, the surface mount feeding mechanism 41 includes a feeding assembly 411 and a picking assembly 412. The feeding assembly 411 is disposed on the base 81 (e.g., Figure 1 As shown, the feeding assembly 411 is used to supply the carrier 5 that carries the patches 202, and the carrier 5 holds multiple patches 202 (such as...). Figure 8 (As shown). The pick-up component 412 is mounted on the feeding component 411. The pick-up component 412 is used to pick up the patch 202 from the carrier tray 5 and flip the patch 202. In this way, by setting the feeding component 411 and the pick-up component 412 as described above, the supply and flipping of the patch 202 are realized, so that the patch 202 can be accurately pasted onto the film 201.

[0142] Specifically, the feeding assembly 411 includes a feeding bracket 4111, a feeding drive module 4112, a chuck gripper 4113, a tray conveying module 4114, a tray conveying plate 4115, a suction cup bracket 4116, a suction cup cylinder 4117, a suction cup head 4118, and a recovery tray 4119. The feeding bracket 4111 is mounted on the base platform 81 and is roughly a gantry frame. The feeding drive module 4112 is mounted on the feeding bracket 4111 and is roughly composed of multiple cylinders. The chuck gripper 4113 is connected to the feeding drive module 4112. Under the drive of the feeding drive module 4112, the chuck gripper 4113 can move up and down and can open or close to clamp or release the tray 5. The tray conveying module 4114 is mounted on the base platform 81 and located within the feeding bracket 4111. The tray conveying plate 4115 is connected to the tray conveying module 4114 to move linearly under the drive of the tray conveying module 4114. The suction cup bracket 4116 is mounted on the base platform 81 and spans across the tray conveying module 4114. The suction cup cylinder 4117 is mounted on the suction cup bracket 4116. The suction cup head 4118 is connected to the suction cup cylinder 4117 to move up and down under the drive of the suction cup cylinder 4117. The recovery tray 4119 is located below the tray conveying module 4114 and is used to receive and recover the tray 5 after the patch 202 has been removed.

[0143] Thus, by setting the specific structure of the feeding component 411, the chuck gripper 4113 clamps the stacked multi-layered carrier trays 5 under the drive of the feeding drive module 4112. The feeding drive module 4112 drives the chuck gripper 4113 to move toward the carrier tray conveyor plate 4115. The feeding drive module 4112 drives the chuck gripper 4113 to open so that the current bottommost carrier tray 5 is placed on the carrier tray conveyor plate 4115. The feeding drive module 4112 drives the chuck gripper 4113 to move upward and tighten to clamp the remaining carrier trays 5 except for the current bottommost one. The feeding drive module 4112 drives the chuck gripper 4113 to drive the remaining carrier trays 5 to move upward. The carrier tray conveyor module 4114 conveys the carrier trays 5 through the carrier tray conveyor plate 4115 so that the picking component 412 can pick up the patch 202 from the carrier tray 5. After the patch 202 on the carrier plate 5 is removed, the suction head 4118, driven by the suction cylinder 4117, approaches the carrier plate 5 that has removed the patch 202 and sucks up the carrier plate 5. The carrier plate conveying plate 4115, driven by the carrier plate conveying module 4114, moves to below the clamping gripper 4113 to receive the carrier plate 5 again. When the carrier plate conveying plate 4115 moves to below the clamping gripper 4113, the suction cylinder 4117 drives the suction head 4118 and the carrier plate 5 to move downwards to place the carrier plate 5 into the recovery tray 4119. After the carrier plate 5 is placed in the recovery tray 4119, the suction cylinder 4117 drives the suction head 4118 to reset so that the carrier plate conveying module 4114 can continue to convey the carrier plate 5 through the carrier plate 4115 to avoid interference with the suction head 4118. The carrier plate 5 is then recovered by pulling out the recovery tray 4119. Understandably, multiple layers of trays 5 can be stacked in the recycling tray 4119 before the recycling tray 4119 is pulled out, in order to reduce the number of times the trays are pulled out and save on work intensity.

[0144] In this embodiment, there are two material-grabbing components 412. Both components are mounted on the suction cup bracket 4116 and located on either side of the suction cup cylinder 4117. The structures of the two components are largely similar. Specifically, each component includes a power element 4121, a material-grabbing seat 4122, a linear element 4123, and a material-grabbing element 4124. The power element 4121 is mounted on the suction cup bracket 4116 of the feeding component 411. The power element 4121 can be a rotary cylinder, a motor, or a combination of cylinders, racks, and gears, depending on the specific requirements. The material-grabbing seat 4122 is connected to the power element 4121 and rotates under its drive. The linear element 4123 is mounted on the material-grabbing seat 4122 and rotates with it. The linear element 4123 can be a cylinder. There are multiple picking components 4124. The multiple picking components 4124 are connected to the straight component 4123 through the picking mounting plate 4125 so that they move synchronously closer to or away from the carrier plate 5 under the drive of the straight component 4123. The picking components 4124 are used to pick up the patch 202 on the carrier plate 5.

[0145] Thus, by setting the specific structure of the picking component 412, when the tray conveying module 4114 of the feeding component 411 conveys the tray 5 through the tray conveying plate 4115, the power component 4121 of the picking component 412 drives the linear component 4123 and the picking component 4124 to flip above the tray 5 through the picking seat 4122. The linear component 4123 drives the picking component 4124 to move towards the tray 5, so that multiple picking components 4124 can simultaneously pick up multiple patches 202. After the picking component 4124 picks up the patch 202, the linear component 4123 drives the picking component 4124 to move towards the tray 5. 23 drives the picking component 4124 away from the carrier tray 5. Simultaneously, the power component 4121 drives the linear component 4123 and the picking component 4124 to flip through the picking seat 4122, causing the patch 202 picked up by the picking component 4124 to flip, so that the bonding mechanism 43 can pick up the patch 202 from the picking component 4124. At the same time, after the picking component 4124 picks up the patch 202 from the carrier tray 5, the carrier tray conveying module 4114 conveys the carrier tray 5 to move through the carrier tray conveying plate 4115, so that the picking component 4124 can pick up the patch 202 from the carrier tray 5 again. It can be understood that the feeding assembly 411 supplies the patch 202 in a step-by-step manner, that is, after taking away one row of patches 202 on the carrier tray 5, it takes away another row of patches 202 on the carrier tray 5.

[0146] Please see Figure 15 As shown in the embodiment of this application, the bonding mechanism 43 includes a bonding motion component 431, a bonding suction head 432, an upper bonding detection module 433, and a lower bonding detection module 434. The bonding motion component 431 is mounted on the feeding bracket 4111 of the feeding component 411. The bonding motion component 431 is a multi-axis linear module, such as a three-axis linear module. The bonding suction head 432 is mounted on the bonding motion component 431 and moves under the drive of the bonding motion component 431. The bonding suction head 432 is used to pick up the patch 202 (e.g., ...). Figure 8 (As shown) and has the function of rotating the patch 202, the upper bonding detection module 433 is set on the bonding motion assembly 431 and moves synchronously with the bonding suction head 432. The upper bonding detection module 433 is used to detect the position and orientation of the film 201 on which the patch 202 is to be bonded, so as to accurately bond the patch 202 onto the film 201. The lower bonding detection module 434 is set on the base platform 81. The lower bonding detection module 434 is used to detect the patch 202 picked up by the bonding suction head 432 to determine whether the picked-up patch 202 is damaged, has air bubbles or other defects. Both the upper bonding detection module 433 and the lower bonding detection module 434 can be CCD cameras. Thus, by setting the specific structure of the bonding mechanism 43, the picking up and detection of the patch 202 are achieved. With the cooperation of the upper bonding detection module 433, the patch 202 can be accurately bonded onto the film 201.

[0147] Please see Figure 16 As shown in the embodiment of this application, the film feeding mechanism 42 includes a roller assembly 421 and a support assembly 422. The roller assembly 421 is used to rotatably supply film 201 (e.g., film adhered to a carrier tape (not shown)) to a carrier tape. Figure 8 (As shown) and recycle the carrier tape. The support assembly 422 is correspondingly arranged with the roller assembly 421. The support assembly 422 is used to receive the carrier tape of the adhesive film 201 and to recycle the carrier tape by the roller assembly 421 after passing through the support assembly 422. A flexible element 4221 is provided on the support assembly 422. The bonding mechanism 43 applies the adhesive film 202 (as shown) to the flexible element 4221. Figure 8 As shown, the film 201 is pasted onto the adhesive film 202. The adhesive film 201 is then peeled off from the carrier tape and moved to the transfer mechanism 44 by the carrier tape. Thus, by setting the specific structure of the above-mentioned film feeding mechanism 42, the film 201 is supplied, and support is provided during the pasting of the film 201 and the adhesive film 202. The flexible component 4221 also prevents damage to the film 201 or the adhesive film 202, ensuring the yield of the adhesive film 2.

[0148] Specifically, the film feeding mechanism 42 also includes a film moving assembly 423 and a film mounting plate 424. The film moving assembly 423 can be a linear module, and the film mounting plate 424 is mounted on the film moving assembly 423 to move linearly under the drive of the film moving assembly 423. The roller assembly 421 and the support assembly 422 are both mounted on the film mounting plate 424. In this way, by setting the film moving assembly 423, the support assembly 422 and the roller assembly 421 can be moved closer to or further away from the transfer mechanism 44, thereby adjusting according to the actual situation and improving the flexibility of the feeding device 40.

[0149] The roller assembly 421 includes a feeding frame 4211, a receiving frame 4212, a receiving motor 4213, a receiving cylinder 4214, a roller module 4215, a pressing cylinder 4216, and a support block 4217. The feeding frame 4211 is rotatably mounted on the film mounting plate 424 and is used to hang the carrier tape of the wound adhesive film 201. The receiving frame 4212 is rotatably mounted on the film mounting plate 424 and connected to the receiving motor 4213 mounted on the film mounting plate 424. An empty receiving cylinder 4214 is hung on the receiving frame 4212. The receiving motor 4213 is used to drive the receiving frame 4212 to rotate, so that the receiving cylinder 4214 can rotate to wind the carrier tape, thereby providing power to the roller assembly 421 and enabling the carrier tape to be conveyed. The roller module 4215 is rotatably mounted on the film mounting plate 424. The roller module 4215 consists of multiple rollers, and the carrier belt shuttles between the multiple rollers. The pressing cylinder 4216 and the support block 4217 are both mounted on the film mounting plate 424, with the pressing cylinder 4216 located above the support block 4217. The carrier belt passes between the pressing cylinder 4216 and the support block 4217. In this way, the carrier belt exits from the feed rack 4211 and passes sequentially between some rollers of the roller module 4215, between the pressing cylinder 4216 and the support block 4217, between the support assembly 422, and between other rollers of the roller module 4215 to the take-up cylinder 4214, thereby realizing the supply of film 201 and the recycling of carrier belt. The pressing cylinder 4216 is used to press the carrier tape onto the support block 4217 so that the bonding mechanism 43 can attach the patch 2 onto the film 201. Understandably, the pressing cylinder 4216 is designed to avoid contact with the film 201 on the carrier tape (e.g., by creating a groove-like structure to avoid contact), so as not to detach the film 201 from the carrier tape.

[0150] The support assembly 422 also includes a support plate 4222, which is disposed on the film mounting plate 424, and the flexible element 4221 is disposed on the support plate 4222. Thus, by setting the support plate 4222, the flexible element 4221 is supported, and the film 201 is supported when it is pasted with the patch 202.

[0151] Please refer to the following: Figure 17 and Figure 18 As shown, the material transfer mechanism 44 includes a material transfer rotating component 441, a material transfer base plate 442, and a material transfer assembly 443. The material transfer rotating component 441 is located on the base platform 81 (e.g., Figure 1As shown, the material transfer rotating component 441 is roughly composed of a motor, bearings, and a housing. The material transfer base plate 442 is connected to the material transfer rotating component 441 and rotates under the drive of the material transfer rotating component 441. There are two material transfer assemblies 443, which are respectively located at both ends of the material transfer base plate 442. The two material transfer assemblies 443 rotate synchronously with the material transfer base plate 442, so that one of them corresponds to the film feeding mechanism 42 and the other corresponds to the bonding device 50. The material transfer assembly 443 corresponding to the film feeding mechanism 42 is used to receive the bonding component 2 (such as...) from the film feeding mechanism 42. Figure 8 As shown, the transfer assembly 443 corresponding to the adhesive device 50 is used to allow the adhesive device 50 to pick up the adhesive piece 2 from the transfer assembly 443. In this way, by setting the specific structure of the transfer mechanism 44, the function of receiving and supplying the adhesive piece 2 can be realized at the same time, which helps to improve the efficiency of the transfer mechanism 44.

[0152] Specifically, each material transfer assembly 443 includes a material transfer base 4431, a first moving member 4432, a receiving member 4433, a second moving member 4434, a third moving member 4435, and a blocking member 4436, wherein the first moving member 4432, the second moving member 4434, and the third moving member 4435 can all be cylinders. The material transfer base 4431 is connected to the material transfer base plate 442, wherein the shape of the material transfer base 4431 is adapted to accommodate the installation of the first moving member 4432, the receiving member 4433, the second moving member 4434, the third moving member 4435, and the blocking member 4436. In this embodiment, the shape of the material transfer base 4431 is not limited. The first moving member 4432 is rotatably mounted on the material transfer base 4431 via a mounting plate 4437. The receiving component 4433 is disposed on the mounting plate 4437 and connected to the first moving component 4432. Under the drive of the first moving component 4432, the receiving component 4433 approaches the film feeding mechanism 42. The receiving component 4433 is provided with receiving grooves 4438. There are multiple receiving grooves 4438. The receiving grooves 4438 are used to receive the patch 2 from the film feeding mechanism 42. The bottom of the receiving groove 4438 is set as a non-adhesive surface, that is, the bottom of the receiving groove 4438 will not adhere to the film 201. For example, the bottom of the receiving groove 4438 is an oleophobic layer. One end of the second moving part 4434 is rotatably connected to the transfer base 4431, and the other end of the second moving part 4434 is rotatably connected to the mounting plate 4437. That is, the other end of the second moving part 4434 is connected to one side of the first moving part 4432 through the mounting plate 4437. The second moving part 4434 is used to drive the mounting plate 4437, the first moving part 4432 and the receiving part 4433 to rotate relative to the transfer base 4431 so that the receiving part 4433 is in an inclined state. The third moving part 4435 is provided on the transfer base 4431 and is arranged parallel to the second moving part 4434. The blocking part 4436 is connected to the third moving part 4435. The blocking part 4436 moves to the receiving part 4433 under the drive of the third moving part 4435 and blocks the receiving groove 4438 to prevent the patch 2 in the receiving groove 4438 from falling out. The blocking part 4436 is an inclined plate.

[0153] Thus, by setting the specific structure of the aforementioned transfer component 443, corresponding to the transfer component 443 of the film feeding mechanism 42, the first moving member 4432 drives the receiving member 4433 to approach the film feeding mechanism 42, so that the receiving member 4433 is adjacent to the carrier tape supplied by the film feeding mechanism 42. While the carrier tape is being conveyed and recycled, it carries the patch 2 on the carrier tape into the receiving groove 4438. After the patch 2 moves into the receiving groove 4438, the first moving member 4432 drives the receiving member 4433 away from the film feeding mechanism 42, and the second moving member 4432... The drive plate 4437, the first moving part 4432, and the receiving part 4433 are tilted, so that the receiving part 4433 is roughly parallel to the blocking part 4436. The third moving part 4435 drives the blocking part 4436 to move upward so that the blocking part 4436 blocks the receiving groove 4438. The material transfer rotating part 441 drives the material transfer base plate 442 to rotate, so that the material transfer assembly 443 that receives the patch 2 rotates to the adhesive device 50, so as to supply the patch 2 to the adhesive device 50, thereby realizing the receiving and supply of the patch 2.

[0154] In this embodiment, the transfer mechanism 44 further includes an L-shaped bracket 445 and a bonding detector 446 mounted on the L-shaped bracket 445. The bonding detector 446 can be a CCD camera. The bonding detector 446 corresponds to the receiving groove 4438 of the receiving member 4433 of the transfer assembly 443 at the patch feeding mechanism 41. The bonding detector 446 is used to detect whether the patch 2 is received in the receiving groove 4438 of the receiving member 4433. When the bonding detector 446 detects that the patch 2 is received in the receiving groove 4438, the transfer rotating member 441 drives the transfer base plate 442 to rotate. Thus, by setting the bonding detector 446, the effect of detecting whether the receiving groove 4438 receives the patch 2 is achieved.

[0155] The bonding equipment 1 provided in this application embodiment exposes the inner surface of the workpiece 3 to the bonding range through the fixture 31 of the bonding table 30. The bonding device 50 can effectively bond the patch 2 to the inner surface of the workpiece 3, and the pressure holding device 60 can effectively bond the patch 2 to the inner surface of the workpiece 3. The bonding equipment 1 realizes the effect of automatically bonding the patch 2 to the inner surface of the workpiece 3, can achieve a uniform bonding standard, and is conducive to improving production yield. Since the automatic bonding is realized, the bonding efficiency can also be improved and labor costs can be saved.

[0156] The bonding equipment 1 provided in this embodiment further utilizes the detection function of the detection device 70 to detect the bonding effect of the workpiece 3, thereby improving the automation level of the bonding equipment 1. By setting the specific structure of each device, the bonding equipment 1 has a compact structure, a high degree of automation, and multiple functions, which helps to save procurement costs and thus reduce production costs.

[0157] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application.

[0158] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A bonding device for bonding an adhesive to the inner surface of a workpiece, characterized in that, include: A material receiving device for supplying the workpiece and collecting the workpiece for bonding the patch; A connecting device is provided corresponding to the feeding and receiving device. The connecting device includes a rotatable and movable connecting head, which is used to adapt to receive the workpiece supplied by the feeding and receiving device. A bonding table, corresponding to the connecting device, is provided with loading / unloading positions, a bonding position, and a pressure holding position. The bonding table includes a fixture movable between the loading / unloading positions, the bonding position, and the pressure holding position. The fixture is used to receive the workpiece on the connecting head at the loading / unloading position, exposing the inner surface of the workpiece within the bonding area. The connecting head is also used to receive the workpiece with the bonded patch on the fixture at the loading / unloading position. The feeding / receiving device is used to retrieve the workpiece with the bonded patch from the connecting head. The fixture includes a body and a pressing member. The upper part has a receiving groove for accommodating and accommodating the workpiece and allowing the workpiece to be placed at an angle so that the inner surface of the workpiece is exposed within the bonding area; the pressing member includes a rotating part, a pressing part, and a contacting part. The pressing part and the contacting part are respectively located at both ends of the rotating part and extend in opposite directions. The end of the rotating part near the pressing part is rotatably disposed on the body and located below the receiving groove. The pressing part extends to the receiving groove and is used to press against the workpiece located in the receiving groove under the action of the contacting part and the rotating part. A feeding device is disposed adjacent to the bonding table, and the feeding device is used to supply the adhesive; An adhesive device is provided corresponding to the feeding device and the adhesive position. The adhesive device is used to pick up the adhesive from the feeding device and adhesive the adhesive to the inner side of the workpiece on the fixture that has been moved to the adhesive position. A pressure-holding device is disposed adjacent to the bonding table and corresponding to the pressure-holding position. The pressure-holding device includes a pressure-holding head that can be elastically telescopically moved. The pressure-holding head is used to press the adhesive patch bonded to the inner side of the workpiece so that the adhesive patch is bonded to the inner side of the workpiece.

2. The bonding device as described in claim 1, characterized in that, The bonding table further includes a pushing mechanism located at the loading and unloading positions. The pushing mechanism is used to push the abutting part of the fixture that has moved to the loading and unloading positions to move, so that the abutting part drives the rotating part to rotate, thereby causing the rotating part to drive the pressing part away from the receiving groove, so as to remove the workpiece with the adhesive patch from the receiving groove, or to make the receiving groove receive the workpiece on the connector.

3. The bonding device as described in claim 2, characterized in that, The fixture also includes a magnet, which is disposed on the body and adjacent to the receiving groove. The magnet is located below the receiving groove and is used to magnetically attract the pressing part.

4. The bonding device as described in claim 1, characterized in that, The bonding table also includes a rotatable turntable. The loading / unloading positions, the bonding position, and the pressure holding position are arranged around the rotation axis of the turntable. The fixture is disposed on the turntable and moves with the turntable between the loading / unloading positions, the bonding position, and the pressure holding position.

5. The bonding device as described in claim 1, characterized in that, The bonding table is also provided with a detection position, and the fixture can move between the loading and unloading positions, the bonding position, the pressure holding position and the detection position; The bonding device also includes: A detection device is provided adjacent to the bonding stage and corresponding to the detection position. The detection device is used to detect the workpiece on which the adhesive is bonded to the fixture after it has been moved to the detection position. The detection device includes at least one of a laser detector and a camera detector.

6. The bonding device as described in claim 1, characterized in that, The connection device also includes: A connecting base is disposed adjacent to the feeding and receiving device and the bonding table; A flip-up component is rotatably mounted on the connecting base; A flipping drive is provided on the connecting base and connected to the flipping component. The flipping drive is used to drive the flipping component to rotate so that the flipping component rotates to a predetermined angle. A linear drive is disposed on the flipping member and rotates synchronously with the flipping member. The linear drive is connected to the connector and is used to drive the connector to move linearly so that the connector can deliver the workpiece to the fixture. The connector is used to pick up the workpiece.

7. The bonding device as described in claim 1, characterized in that, The feeding and receiving device includes: Raw material supply mechanism, used to supply the workpiece; A clinker recycling mechanism for recycling the workpieces used to bond the patches; The loading and unloading mechanism includes a loading component and an unloading component that can move synchronously. The loading component and the unloading component are staggered. The loading component is used to pick up the workpiece from the raw material supply mechanism and place the workpiece on the connecting head of the connecting device. The unloading component is used to pick up the workpiece with the adhesive attached from the connecting head of the connecting device and place the workpiece with the adhesive attached on the clinker recycling mechanism.

8. The bonding device as described in claim 7, characterized in that, The loading and unloading mechanism also includes a detection component, which is correspondingly arranged with the loading component and moves synchronously with the loading component. The detection component is used to perform a mistake-proof detection on the workpiece picked up by the loading component from the raw material supply mechanism to detect whether the direction or angle of the workpiece is qualified. The feeding and receiving device also includes: A calibration mechanism, disposed on the raw material supply mechanism, is used to receive the workpiece that fails the error prevention test and to correct the orientation or angle of the workpiece. The calibration mechanism includes a rotatable calibration head and a calibration drive assembly for driving the calibration head to rotate. The calibration head is used to carry the workpiece that fails the error prevention test and to drive the workpiece to rotate in order to correct the workpiece.

9. The bonding device as described in claim 7, characterized in that, The raw material supply mechanism is used to supply the material tray that carries the workpiece, and the clinker recycling mechanism is disposed adjacent to the raw material supply mechanism. The clinker recycling mechanism is used to recycle the material tray that carries the workpiece that is bonded to the patch. The feeding and receiving device also includes: A feeding conveyor assembly is disposed adjacent to the raw material supply mechanism and the clinker recycling mechanism. The feeding conveyor assembly is used to convey the workpiece with the defective adhesive patch to a designated position. A material tray buffer assembly is provided corresponding to the raw material supply mechanism and the clinker recycling mechanism. The material tray buffer assembly is used to pick up the empty material tray after the workpiece has been picked up from the raw material supply mechanism, and is also used to place the picked-up empty material tray in the clinker recycling mechanism so that the material tray can receive the workpiece to which the adhesive is bonded. A clinker buffer assembly is disposed adjacent to the clinker recycling mechanism, and the clinker buffer assembly is used to buffer the workpiece with the adhesive patch picked up by the feeding assembly.

10. The bonding device as described in claim 1, characterized in that, The adhesive device includes: Sports organizations; An image-capturing mechanism is provided on the motion mechanism and moves under the drive of the motion mechanism. The image-capturing mechanism is used to acquire an image of the workpiece to which the adhesive is to be bonded. A material suction mechanism is provided on the motion mechanism and adjacent to the image acquisition mechanism. The material suction mechanism and the image acquisition mechanism move synchronously under the drive of the motion mechanism. The material suction mechanism is used to pick up the adhesive from the feeding device and place the adhesive on the inner side of the workpiece on the fixture that has been moved to the bonding position.

11. The bonding device as described in claim 1, characterized in that, The component includes a film and a patch, the patch being adhered to the film; the feeding device includes: A chip feeding mechanism for supplying the chip; A film feeding mechanism for supplying the film; A bonding mechanism is provided corresponding to the patch feeding mechanism and the film feeding mechanism, for picking up the patch from the patch feeding mechanism and bonding the patch onto the film at the film feeding mechanism; A transfer mechanism, corresponding to the film feeding mechanism and the bonding device, is used to receive the adhesive from the film feeding mechanism and transfer the adhesive to the bonding device.

12. The bonding device as described in claim 11, characterized in that, The material transfer mechanism includes: Rotating transfer component; A transfer base plate is connected to the transfer rotating component to rotate under the drive of the transfer rotating component; The transfer components are respectively located at both ends of the transfer base plate. The two transfer components rotate synchronously with the transfer base plate so that one of them corresponds to the film feeding mechanism and the other corresponds to the bonding device. The transfer components are used to receive the adhesive from the film feeding mechanism, and the bonding device is used to pick up the adhesive from the transfer components.

13. The bonding device as described in claim 12, characterized in that, The transfer assembly includes: A material transfer base is connected to the material transfer base plate; The first movable component is rotatably mounted on the material transfer base; A receiving component is connected to the first moving component to approach the film feeding mechanism under the drive of the first moving component. The receiving component has a receiving groove for receiving the adhesive from the film feeding mechanism. The bottom of the receiving groove is set as a non-adhesive surface. The second moving part is disposed on the material transfer base and connected to one side of the first moving part, and is used to drive the first moving part and the receiving part to rotate relative to the material transfer base so that the receiving part is in an inclined state. The third moving component is disposed on the material transfer base and is arranged parallel to the second moving component; A shielding member is connected to the third moving member so that it moves to the receiving member and shields the receiving groove under the drive of the third moving member.

14. The bonding device as described in claim 11, characterized in that, The patch feeding mechanism includes: A feeding assembly for supplying a carrier tray that carries the patch; A pick-up component, disposed on the feeding component, is used to pick up the patch from the carrier tray and flip the patch.

15. The bonding device as described in claim 14, characterized in that, The material handling component includes: A power component is mounted on the feeding assembly; The material handling unit is connected to the power component and rotates under the drive of the power component; A linear component is provided on the material picker and rotates with the material picker; The material-picking component, connected to the straight component, moves closer to or further away from the carrier plate under the action of the straight component, for picking up the patch on the carrier plate.

16. The bonding device as described in claim 11, characterized in that, The film feeding mechanism includes: A roller assembly for rotatably supplying the film adhered to the carrier tape and for retrieving the carrier tape; A support assembly, corresponding to the roller assembly, is used to receive the carrier tape on which the adhesive film is pasted and to recycle the carrier tape after it passes through the support assembly. The support assembly is provided with a flexible member, and the bonding mechanism pastes the patch onto the adhesive film on the flexible member. The adhesive film on which the patch is pasted is peeled off from the carrier tape and moves to the transfer mechanism under the drive of the carrier tape.

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