模场适配器的封装方法、装置、系统及存储介质
By optimizing the dispensing path and automated equipment, the problem of poor encapsulation effect of the mold field adapter was solved, enabling effective wrapping and efficient encapsulation of optical fibers of different diameters, reducing complexity and cost.
CN117805976BActive Publication Date: 2026-07-17WUHAN RAYCUS FIBER LASER TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- WUHAN RAYCUS FIBER LASER TECHNOLOGY CO LTD
- Filing Date
- 2023-12-29
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
The existing packaging process for mold field adapters suffers from poor packaging performance.
Method used
By optimizing the dispensing path, optical fibers of different diameters are effectively wrapped, avoiding contact with the metal wall of the base. Automated equipment is used for encapsulation, including automatic feeding, dispensing, and curing. The dispensing path of the yellow adhesive is optimized to ensure effective wrapping of the optical fibers.
Benefits of technology
It improves the encapsulation effect of the mold field adapter, reduces defects such as mixed glue, leakage, incomplete curing, adhesion to the wall, and glue biased to one side of the optical fiber, thus improving encapsulation efficiency and reliability.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN117805976B_ABST
Abstract
本申请涉及一种模场适配器的封装方法、装置、系统及存储介质，包括：将封装基板粘接于底座上；将待封装的模场适配器固定于封装基板上；按照预设点胶路径对模场适配器的第一光纤进行点胶，预设点胶路径包括两条相对且平行设置的第一侧边以及连接两条第一侧边的第一横边，第一侧边平行于第一光纤的第一中心轴线，两条第一侧边对称设置于第一中心轴线的相对两侧，第一侧边与第一中心轴线在第一方向上的第一间隔距离大于或等于第一光纤的一半直径，且第一侧边与封装基板的边缘在第一方向上的间隔距离大于零，第一方向垂直于第一中心轴线，且平行于封装基板，从而通过优化预设点胶路径，即可实现对不同直径光纤的有效包裹，并避免贴底座金属壁。
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