server

Abstract

The application relates to the technical field of data processing equipment, and provides a server. The server comprises a computing board, a hard disk backboard and a supply control board; the computing board comprises a first circuit board, a central processing unit, a power supply and a pair of first connectors, the central processing unit is arranged on the first circuit board, the power supply is arranged adjacent to the central processing unit and is electrically connected with the central processing unit; the hard disk backboard comprises a second circuit board and a second connector, the second connector is plugged and matched with the corresponding first connector; the supply control board comprises a third circuit board and a third connector, and the third connector is plugged and matched with the corresponding first connector. The application can adapt to the original case layout, effectively reduce the flow loss and heat generation, and is beneficial to the improvement of the subsequent server computing power.

Description

Technical Field

[0001] This application relates to the field of data processing equipment technology, and more particularly to a server. Background Technology

[0002] With the development of computer applications such as artificial intelligence and big data, the demand for computing power from servers is growing rapidly. To meet these demands, server power supply architecture and power supply unit product structures need continuous improvement and optimization. However, current technological development has encountered some problems and challenges.

[0003] Specifically, as computing power demands increase exponentially, the power required for server power supplies increases exponentially in stages. This leads to increasingly prominent issues with transmission efficiency and overall heat dissipation in server power supply architectures and power supply unit product structures. These problems have severely constrained subsequent goals for improving server computing power.

[0004] Taking a 2U general-purpose server chassis based on an Intel CPU platform (a computer platform using Intel processors) as an example, many functional unit cards are now modularized and have specific forms, mainly including external dimensions and interface definitions. This long-term technological iteration and the industrialization of different component units have led to a relatively fixed internal structure of the entire server, making effective upgrades and optimizations difficult. The power supply components for the typical CPU (Central Processing Unit) load inside a server are distributed around the CPU, mostly composed of discrete devices such as power MOS (Metal-Oxide-Semiconductor), resistors, capacitors, inductors, and control chips. This traditional power supply method has several problems, such as long current paths, high current density, and difficulty in meeting design requirements for temperature rationing. Furthermore, due to space constraints, it is difficult to maintain a close distance to the CPU load; in most cases, the power supply and load current paths are relatively long. Large currents result in significant current losses along the current path, making it difficult to meet design requirements for current density and temperature rationing. Summary of the Invention

[0005] The purpose of this application is to provide a server that solves the problem that traditional power supply methods are limited by spatial structure, making it difficult to shorten the distance between the power supply unit and the CPU load. The power supply and load current path is long, resulting in large current loss and serious heat generation, which in turn restricts the subsequent improvement of server computing power.

[0006] This application provides a server, including:

[0007] A computing board includes a first circuit board, a central processing unit (CPU), a power supply, and a pair of first connectors. The CPU is disposed on the upper side of the first circuit board, the power supply is disposed adjacent to the CPU and electrically connected to the CPU, and the pair of first connectors are disposed at opposite ends of the first circuit board.

[0008] The hard disk backplane includes a second circuit board and a second connector disposed at the end of the second circuit board. The second circuit board is disposed parallel to the first circuit board and located on the lower side of the computing board. The second connector is inserted into the first connector at the corresponding end of the computing board in a direction perpendicular to the first circuit board.

[0009] The power control board includes a third circuit board and a third connector. The third circuit board is arranged parallel to the first circuit board and located below the first circuit board. The third connector is inserted into the first connector at the corresponding end of the computing board in a direction perpendicular to the first circuit board.

[0010] According to a server provided by the present invention, the power supply includes a first power supply module, which is located on the lower side of the first circuit board;

[0011] The first power supply module includes multiple first two-phase sub-units;

[0012] The plurality of first two-phase sub-units are arranged and electrically connected to the corresponding loads of the central processing unit in a direction perpendicular to the first circuit board.

[0013] According to a server provided by the present invention, the power supply includes a second power supply module, which is located on the upper side of the first circuit board;

[0014] The second power supply module includes multiple second two-phase sub-units, which are distributed around the central processing unit.

[0015] The plurality of second two-phase sub-units are arranged adjacently and electrically connected to the corresponding loads of the central processing unit in a direction parallel to the first circuit board.

[0016] According to a server provided by the present invention, the first connector is provided with a plurality of first plug-in structures, and the second connector and the third connector are each provided with a plurality of second plug-in structures corresponding to the first plug-in structures;

[0017] The first plug-in structure and the second plug-in structure are adapted to be plugged in along a direction perpendicular to the first circuit board, and the first plug-in structure is electrically connected to the second plug-in structure at any mating position where the first plug-in structure and the second plug-in structure form a connection.

[0018] According to a server provided by the present invention, one of the first plug-in structure and the second plug-in structure is a sliding groove, and the other is a sliding block;

[0019] The chute extends in a direction perpendicular to the first circuit board and forms an opening on one side parallel to the direction of the first circuit board. The inner wall of the chute is provided with a first metal piece extending in a direction perpendicular to the first circuit board.

[0020] The slider has a second metal part extending in a direction perpendicular to the first circuit board on its side wall. The slider is inserted into the groove, and the second metal part is in contact with the first metal part.

[0021] According to a server provided by the present invention, a first groove is provided at the end of the first circuit board, and the first connector is disposed at the position of the first groove;

[0022] And / or, the end of the second circuit board is provided with a second groove, and the second connector is disposed at the position of the second groove;

[0023] And / or, the end of the third circuit board is provided with a third groove, and the third connector is disposed at the position of the third groove.

[0024] According to a server provided by the present invention, it further includes a chassis and a heat-conducting structure, wherein the heat-conducting structure is sleeved on the outside of the first power supply module and the heat-conducting structure is in contact with the inner wall of the chassis.

[0025] According to a server provided by the present invention, the heat-conducting structure includes a heat-conducting shell surrounding the outside of a first power supply module, the heat-conducting shell being in contact with the inner wall of the chassis;

[0026] Alternatively, the heat-conducting structure includes a heat-conducting shell surrounding the outside of the first power supply module and a flexible heat-dissipating filling material, wherein the flexible heat-dissipating filling material is disposed between the heat-conducting shell and the chassis.

[0027] A server according to the present invention further includes:

[0028] A liquid cooling device is connected to the inner cavity of the chassis and is used to provide an immersion liquid cooling environment inside the chassis.

[0029] According to a server provided by the present invention, the liquid cooling device includes:

[0030] Circulation box;

[0031] A radiator is fixedly connected to the circulation tank, with the bottom of the radiator located inside the circulation tank and in contact with the coolant inside the circulation tank;

[0032] The first liquid inlet pipe has one end connected to the bottom of the circulation tank and the other end connected to the top of the chassis;

[0033] A first circulation pump is installed in the first inlet pipe;

[0034] A first control valve is installed in the first inlet pipe;

[0035] The second liquid inlet pipe has one end connected to the bottom of the circulation tank and the other end connected to one side of the bottom of the chassis.

[0036] The second circulation pump is installed in the second inlet pipe;

[0037] The second control valve is located in the second inlet pipe;

[0038] A return pipe, one end of which is connected to the bottom of the chassis on the other side, and the other end of which is connected to the top of the circulation tank;

[0039] A reflux pump is installed in the return pipe;

[0040] A third control valve is located in the return pipe;

[0041] An vent pipe, one end of which is connected to the top of the circulation tank and the other end of which is connected to the top of the chassis;

[0042] The fourth control valve is located in the drain pipe;

[0043] A first temperature sensor is installed on the computing board to collect the temperature of the central processing unit;

[0044] A second temperature sensor is disposed on the heat-conducting shell and is used to collect the temperature of the first power supply module;

[0045] The controller is connected to the first circulating pump, the first control valve, the second circulating pump, the second control valve, the reflux pump, the third control valve, the fourth control valve, the first temperature sensor, and the second temperature sensor, respectively. The controller is configured to control the first circulating pump, the first control valve, the second circulating pump, the second control valve, the reflux pump, the third control valve, and the fourth control valve based on the temperature of the central processing unit and the temperature of the first power supply module.

[0046] The heat-conducting shell is provided with multiple cooling grooves, which extend from the side of the heat-conducting shell near the second liquid inlet pipe to the side of the heat-conducting shell near the liquid return pipe, and the upper side of the cooling groove extends to the contact position between the heat-conducting shell and the first power supply module.

[0047] Multiple drainage components are provided on the upper bottom side of the chassis. The multiple drainage components are located on the side of the heat-conducting shell near the second liquid inlet pipe. The multiple drainage components correspond one-to-one with the multiple cooling tanks. A drainage groove is formed on the inner side of the drainage component. The width of the drainage groove near the cooling tank is smaller than the width of the cooling tank, and the width of the drainage groove away from the cooling tank is larger than the width of the cooling tank.

[0048] The server provided in this application, on the one hand, achieves this by dividing the server's motherboard structure into three parts—a compute board, a hard drive backplane, and a power control board—in a partitioned and decoupled design, and by designing connectors between the compute board, the hard drive backplane, and the power control board. This allows for raising the height of the central processing unit (first circuit board) while maintaining consistency with the design positions of hard drive backplanes and power control boards in other servers, thus creating conditions for placing the power supply adjacent to the central processing unit. On the other hand, by placing the power supply adjacent to the central processing unit, the distance between the power supply and the central processing unit is reduced, shortening the current path. Therefore, this application can adapt to existing chassis layouts, effectively reducing current loss and heat generation, which is beneficial for subsequent improvements in server computing power. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0050] Figure 1 This is a structural diagram showing the positional relationship between the server performance computing board, the hardboard backplane, and the power control board provided in this application;

[0051] Figure 2 This is one of the schematic diagrams of the connection structure between the server performance computing board and the power control board provided in this application;

[0052] Figure 3 This is the second schematic diagram of the connection structure between the server performance computing board and the power control board provided in this application;

[0053] Figure 4 This is one of the schematic diagrams of the server performance power supply structure provided in this application;

[0054] Figure 5This is the second schematic diagram of the server power supply structure provided in this application;

[0055] Figure 6 This is a schematic diagram of the server thermal conductive shell structure provided in this application;

[0056] Figure 7 This is a schematic diagram of the server performance liquid cooling device provided in this application;

[0057] Figure 8 This is a cross-sectional view of the server presentation header structure provided in this application;

[0058] 100. Computing board; 110. First circuit board; 120. Central processing unit; 130. Power supply; 131. First power supply module; 132. Second power supply module; 133. Heat-conducting shell; 134. Cooling tank; 140. First connector; 141. Slide; 142. First metal part;

[0059] 200. Hard drive backplane; 210. Second circuit board;

[0060] 300. Supply control board; 310. Third circuit board; 320. Third connector; 330. Slider;

[0061] 400. Chassis; 410. Drainage component; 411. Drainage channel;

[0062] 501. Circulation tank; 502. Radiator; 503. First inlet pipe; 504. First circulation pump; 505. First control valve; 506. Second inlet pipe; 507. Second circulation pump; 508. Second control valve; 509. Return pipe; 510. Return pump; 511. Third control valve; 512. Drain pipe; 513. Fourth control valve. Detailed Implementation

[0063] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0064] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0065] In existing technologies, the server chassis consists of a front-panel hard drive, a vertical hard drive backplane, a fan module, a server motherboard, a rear RISER (Riser Card), a DCSCM (Data Center Site Card Manager) card, and an OCPNIC (Open Compute Project Network Interface Card). Through long-term technological iteration and the development of the industrial ecosystem for different component units, many functional unit cards are now modularized and have specific forms, mainly including dimensions and interface definitions, resulting in a relatively fixed internal structure for the entire server. The central processing unit (CPU) is a typical load within the server, and its external power supply components are distributed around it, mostly composed of discrete devices such as power MOSFETs, resistors, capacitors, inductors, and control chips. Due to space constraints, it is difficult to maintain a close proximity to the CPU load; in most cases, the current path between the power supply and the CPU load is relatively long. With peak currents exceeding thousands of amps, significant current losses occur along the CPU load current path, making it difficult to meet design requirements for current density and temperature rated.

[0066] Current technological trends may lead to problems such as long power supply traces, large voltage drops on the board, high losses, increased heat dissipation requirements, and high thermal design pressure. These problems not only increase design and manufacturing costs but also make it difficult to meet green and energy-saving design requirements. For example, with a 0.8V power supply PCB board and a line impedance of 100uΩ, a 1000A power supply current can result in line losses as high as 100W. Furthermore, to handle these losses, additional heat dissipation components are needed, and these components require additional power to operate effectively. This further exacerbates the overall losses in data centers and servers. Therefore, it is necessary to develop a new power supply architecture and power supply unit product structure to improve server performance and energy efficiency to meet the ever-increasing computing demands and comply with green and energy-saving design requirements. The server provided in this invention aims to solve the above-mentioned problems.

[0067] The server provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples.

[0068] Combination Figure 1 and Figure 2 The server provided in this application embodiment includes: a computing board 100, a hard disk backplane 200, and a power control board 300.

[0069] The computing board 100 includes a first circuit board 110, a central processing unit (CPU) 120, a power supply 130, and a pair of first connectors 140. The CPU 120 is disposed on the upper side of the first circuit board 110. The power supply 130 is disposed adjacent to the CPU 120 and electrically connected to the CPU 120, providing power to the CPU 120. The pair of first connectors 140 are located at opposite ends of the first circuit board 110. Optionally, the computing board 100 may also include memory connectors and memory, etc.

[0070] The hard disk backplane 200 includes a second circuit board 210 and a second connector disposed at the end of the second circuit board 210. The second circuit board 210 is arranged parallel to the first circuit board 110 and located below the computing board 100. The second connector is inserted into and engaged with the first connector 140 at the corresponding end of the computing board 100 in a direction perpendicular to the first circuit board 110. Optionally, the hard disk backplane 200 also includes peripheral functional units, hard disk connectors, etc., wherein the hard disk connectors are used to connect hard disks, and the hard disk connectors are provided with different connector interfaces to be compatible with different hard disk specifications.

[0071] The power control board 300 includes a third circuit board 310 and a third connector 320. The third circuit board 310 is arranged parallel to the first circuit board 110 and located below the first circuit board 110. The third connector 320 is inserted into the corresponding first connector 140 of the computing board 100 in a direction perpendicular to the first circuit board 110. Optionally, the power control board 300 also includes other functional units such as a PSU (power supply unit) and a BMC (Baseboard Management Controller) disposed on the third circuit board 310.

[0072] It is understood that in this embodiment, the server is decoupled based on the location of the central processing unit 120, forming three parts: a computing board 100, a hard disk backplane 200, and a power control board 300. The hard disk, memory, power supply, and other units are designed with regional separation. The computing board 100, hard disk backplane 200, and power control board 300 are assembled using connectors (first connector 140, second connector, and third connector 320) that interlock vertically along the first circuit board 110. Therefore, the relative height between the computing board 100, hard disk backplane 200, and power control board 300 can be adjusted. Based on this design, this embodiment allows the power supply 130 to be placed near the central processing unit 120 without altering the structure of the chassis 400, thus shortening the power flow path and avoiding the influence of the positions of other components and the chassis 400.

[0073] In this embodiment, the first connector 140, the second connector, and the third connector 320 can all be one or a combination of power supply connectors and signal connectors, wherein the power supply connector can provide 12V power supply.

[0074] Combination Figure 3 and Figure 4 In some embodiments of the present invention, the power supply 130 includes a first power supply module 131, which is located on the lower side of the first circuit board 110. The first power supply module 131 includes a plurality of first two-phase sub-units. The plurality of first two-phase sub-units are arranged and electrically connected to the corresponding loads of the central processing unit 120 in a direction perpendicular to the first circuit board 110.

[0075] In this embodiment, the first two-phase sub-unit is a modular design that integrates two phases, with the power devices and inductors of those two phases modularly packaged to form a small sub-unit module. Multiple first two-phase sub-units are stacked according to the required total number of phases, placed in different positions to power different loads of the CPU, and combined to form the overall first power supply module 131. The first two-phase sub-units in the first power supply module 131 and their corresponding loads in the central processing unit 120 are arranged and electrically connected along a direction perpendicular to the first circuit board 110, which effectively shortens the current path and reduces line losses and heat generation.

[0076] Combination Figure 5 In some embodiments of the present invention, the power supply 130 includes a second power supply module 132, which is located on the upper side of the first circuit board 110. The second power supply module 132 includes a plurality of second two-phase sub-units, which are disposed around the central processing unit 120. The plurality of second two-phase sub-units and the corresponding loads of the central processing unit 120 are arranged adjacent to each other and electrically connected in a direction parallel to the first circuit board 110.

[0077] In this embodiment, the second two-phase sub-unit is a modular design that incorporates two phases of the phase count. The power devices and inductors of these two phases are modularly packaged to form a small sub-unit module. Multiple second two-phase sub-units are distributed around the central processing unit 120, providing power to the corresponding loads on the outermost side of the central processing unit 120, and are compatible with horizontal power supply paths.

[0078] It is worth noting that the first power supply module 131 and the second power supply module 132 can be installed simultaneously, or only the first power supply module 131 can be installed. The design of the first power supply module 131 and the second power supply module 132 in this embodiment, while shortening the current path, does not affect the installation of other components. For example, when the second power supply module 132 is installed, since it is located around the central processing unit 120, the CPU heatsink 502 can contact the central processing unit 120 to achieve normal heat dissipation. Furthermore, the heat dissipation function of the CPU heatsink 502 can also be used to cool the second power supply module 132. In addition, since the computing board 100 and the hard disk backplane 200 are connected via a connection between one of the first connectors 140 and the second connector, and the computing board 100 and the power control board 300 are connected via a connection between the other connector and the third connector 320, the computing board 100 can be raised, increasing the gap between its bottom and the bottom plate of the server chassis 400, thus facilitating the placement of a heat dissipation structure at the location of the first power supply module 131.

[0079] The mating structure between the first connector 140 and the second and third connectors 320 will be described below as an example.

[0080] See you later Figure 2 and Figure 3 The first connector 140 is provided with a plurality of first plug-in structures, and the second connector and the third connector 320 are each provided with a plurality of second plug-in structures corresponding to the first plug-in structures. The first plug-in structures and the second plug-in structures are suitable for plugging into each other in a direction perpendicular to the first circuit board 110, and at any mating position where the first plug-in structure and the second plug-in structure form a connection, the first plug-in structure is electrically connected to the second plug-in structure.

[0081] Two first connectors 140, located at opposite ends of the first circuit board 110, are positioned back-to-back, with their first insertion structures facing opposite directions. The second insertion structure on the second connector faces the insertion structure of the third connector 320. Therefore, by using two first connectors 140 with identical structures, and by setting the second and third connectors 320 to have identical structures, the manufacturing difficulty of the two first connectors 140 and the second and third connectors 320 is reduced, and installation difficulty is also reduced.

[0082] Optionally, one of the first and second plug-in structures is a groove 141, and the other is a slider 330. For example, the first plug-in structure is a groove 141, and the second plug-in structure is a slider 330. For ease of description, this configuration will be used in the following description.

[0083] The slide groove 141 extends in a direction perpendicular to the first circuit board 110 and passes through the first connector 140. An opening is formed on one side of the slide groove 141 parallel to the direction of the first circuit board 110. The inner wall of the slide groove 141 is provided with a first metal member 142 extending in a direction perpendicular to the first circuit board 110. The first metal member 142 can be a copper sheet structure. The first metal member 142 is used to realize electrical connection with other connectors.

[0084] The sidewall of the slider 330 is provided with a second metal member extending in a direction perpendicular to the first circuit board 110. The slider 330 is inserted into the slide groove 141 and is adapted to slide along the slide groove 141 in a direction perpendicular to the first circuit board 110. The second metal member can be a copper sheet structure. The second metal member contacts and engages with the first metal member 142 to realize the electrical connection between the first insertion structure and the second insertion structure.

[0085] Optionally, multiple first and second plug-in structures are provided at intervals along a direction parallel to the first circuit board 110, and there is a one-to-one correspondence between the multiple first plug-in structures and the multiple second plug-in structures.

[0086] In this embodiment, the cooperation structure between the slider 330 and the groove 141 facilitates the insertion between the first connector 140 and the second and third connectors 320, and allows for relative sliding in the direction perpendicular to the first circuit board 110 to adjust the relative position between the computing board 100, the hard disk backplane 200, and the power control board 300.

[0087] Optionally, the first circuit board 110 has a first groove at its end, and the first connector 140 is disposed in the first groove. The second circuit board 210 has a second groove at its end, and the second connector is disposed in the second groove. The third circuit board 310 has a third groove at its end, and the third connector 320 is disposed in the third groove. The first, second, and third grooves can be rectangular grooves. Since the first circuit board 110, the second circuit board 210, and the third circuit board 310 are offset from each other in a direction perpendicular to the first circuit board 110, when at least one of the first connector 140, the second connector, and the third connector 320 is disposed in the groove structure, the first circuit board 110, the second circuit board 210, and the third circuit board 310 do not affect the connection between the first connector 140 and the second connector and the third connector 320 respectively. Furthermore, the portions of the first circuit board 110 located on both sides of the first groove, the portions of the second circuit board 210 located on both sides of the second groove, and the portions of the third circuit board 310 located on both sides of the third groove facilitate positioning and make installation more convenient. In addition, the portions of the second circuit board 210 located on both sides of the second groove and the portions of the third circuit board 310 located on both sides of the third groove can extend below the first circuit board 110, and the portions of the first circuit board 110 located on both sides of the first groove can extend above the second circuit board 210 and the third circuit board 310, thus having a larger arrangement area.

[0088] Combination Figure 6 In some embodiments of the present invention, the server further includes a chassis 400 and a heat-conducting structure. The heat-conducting structure is sleeved on the outside of the first power supply module 131 and contacts the inner wall of the chassis 400. The heat-conducting structure conducts heat from the first power supply module 131 to the chassis 400, where it is used for heat dissipation. This eliminates the need for a separate heat sink 502 for the power supply 130, reduces the required height at the back, and utilizes the overall structure of the server to dissipate heat from the power supply 130.

[0089] In the first embodiment, the heat-conducting structure includes a heat-conducting shell 133 surrounding the outside of the first power supply module 131, and the heat-conducting shell 133 is in contact with the inner wall of the chassis 400. The heat-conducting shell 133 can be made of a phase change material. Utilizing the characteristics of phase change materials—that is, absorbing heat and storing it as latent heat when the temperature rises, and releasing the stored heat when the temperature drops—it can effectively absorb and store the heat generated by the power supply module to maintain the temperature stability of the power supply module. The contact between the heat-conducting shell 133 and the inner wall of the chassis 400 also facilitates heat transfer to the chassis 400, achieving a heat dissipation effect.

[0090] In the second scheme, the heat-conducting structure includes a heat-conducting shell 133 surrounding the first power supply module 131 and a flexible heat-dissipating filler material, which is disposed between the phase change material and the chassis 400. The flexible heat-dissipating filler material further optimizes heat conduction and dissipation. It can adapt to the small gaps between the power supply module and the chassis 400, forming a tighter contact, thus facilitating heat transfer and diffusion. Simultaneously, the flexible heat-dissipating filler material also acts as a buffer, effectively preventing direct collision between the server chassis 400 and the first power supply module 131, further improving system stability and reliability. The flexible heat-dissipating filler material can serve as a thermal pad, has a long service life, and is beneficial for the long-term use of the equipment.

[0091] The two methods described above can improve the stability and lifespan of the power supply module, effectively absorb and store the heat generated by the power supply module, prevent the power supply module from overheating, and thus improve its stability and lifespan.

[0092] Combination Figure 7 and Figure 8 In some embodiments of the present invention, the server further includes a liquid cooling device that communicates with the interior cavity of the chassis 400. The liquid cooling device provides an immersion liquid cooling environment inside the chassis 400. The communication between the liquid cooling device and the interior cavity of the chassis 400 means that the liquid cooling device can form good heat exchange with the interior of the chassis 400. Through the immersion liquid cooling environment, the liquid cooling device can absorb and remove heat from inside the chassis 400, thereby effectively reducing the server temperature. Compared with traditional air cooling technology, this liquid cooling technology has higher cooling efficiency and better heat dissipation. The liquid cooling device can perform heat exchange more directly, rapidly removing heat while reducing the risk of equipment failure and performance degradation caused by high temperatures. Furthermore, the use of a liquid cooling device can improve the server's energy efficiency. During the cooling process, the liquid cooling device can convert the absorbed heat into other forms of energy, such as electrical or thermal energy, thereby achieving energy recycling. This improvement in energy efficiency helps reduce energy consumption and operating costs, while also helping to reduce environmental impact.

[0093] The liquid cooling device includes a circulation tank 501, a radiator 502, a first liquid inlet pipe 503, a first circulation pump 504, a first control valve 505, a second liquid inlet pipe 506, a second circulation pump 507, a second control valve 508, a return pipe 509, a reflux pump 510, a third control valve 511, an vent pipe 512, a fourth control valve 513, a first temperature sensor, a second temperature sensor, and a controller.

[0094] The Circulation Box 501 adopts a rectangular, square, or other arbitrary shape enclosure structure, allowing it to adapt to different server sizes and layout requirements. The coolant inside the Circulation Box 501 circulates, absorbing and carrying away the heat generated by the server, thus effectively cooling it.

[0095] The fixed connection between the heat sink 502 and the circulation tank 501 ensures close contact between them, thereby improving the efficiency of heat transfer. The bottom of the heat sink 502 is in contact with the coolant inside the circulation tank 501, allowing the heat sink 502 to absorb heat from the coolant. The upper part of the heat sink 502 is located outside the circulation tank 501, dissipating the absorbed heat into the environment. This design achieves efficient heat transfer and dissipation, effectively reducing the server's temperature.

[0096] The heat sink 502 is made of materials such as copper and aluminum, which have good thermal conductivity, allowing heat to be quickly transferred from the bottom to the top of the heat sink 502 and dissipated through the heat dissipation fins. The heat dissipation fins increase the heat dissipation area of ​​the heat sink 502, thereby improving heat dissipation efficiency.

[0097] The connection between the circulation tank 501 and the heat sink 502 forms a seal, ensuring that the coolant does not leak and preventing outside air from entering the circulation tank 501 and affecting the cooling effect. This sealed design improves the reliability and stability of the system, enabling the server to operate continuously in a good cooling environment.

[0098] The design of the circulation tank 501 and the heat sink 502 achieves efficient cooling and heat dissipation, contributing to improved server stability and lifespan. Furthermore, optimized design and material selection can further enhance the performance and efficiency of the cooling system.

[0099] One end of the first inlet pipe 503 is connected to the bottom of the circulation tank 501, and the other end is connected to the top of the chassis 400, thus connecting the circulation tank 501 and the chassis 400. A first circulation pump 504 is installed on the first inlet pipe 503. When the first circulation pump 504 is running, it pumps the coolant from the circulation tank 501 into the chassis 400. A first control valve 505 is installed on the first inlet pipe 503, which controls the opening and closing of the first inlet pipe 503. The coolant flowing in through the first inlet pipe 503 flows under the computing board 100, hard disk backplane 200, and power control board 300, and mainly flows through these components, thus removing heat from their undersides.

[0100] One end of the second inlet pipe 506 is connected to the bottom of the circulation tank 501, and the other end is connected to the bottom side of the chassis 400. A second circulation pump 507 is installed on the second inlet pipe 506; when the first circulation pump 504 is running, it pumps the coolant from the circulation tank 501 into the chassis 400. A second control valve 508 is installed on the second inlet pipe 506 and can control the opening and closing of the second inlet pipe 506. The coolant flowing in through the first inlet pipe 503 flows from the lower side of the computing board 100, hard disk backplane 200, and power control board 300, and mainly flows through these components, carrying away heat from the upper sides of these components.

[0101] The first inlet pipe 503 and the second inlet pipe 506 are connected to the circulation tank 501 on the same side of the circulation tank 501.

[0102] One end of the return pipe 509 is connected to the bottom of the chassis 400 on the other side, and the other end is connected to the top of the circulation tank 501. A return pump 510 is installed on the return pipe 509, which allows the coolant in the chassis 400 to flow back to the circulation tank 501 when it is running. A third control valve 511 is installed on the return pipe 509 to control the opening and closing of the return pipe 509.

[0103] One end of the drain pipe 512 is connected to the top of the circulation tank 501, and the other end is connected to the top of the chassis 400. A fourth control valve 513 is located on the drain pipe 512 to control its opening and closing. During normal cooling, the drain pipe 512 is inactive, and the fourth control valve 513 is closed. When it is necessary to drain the coolant from the chassis 400, the first circulation pump 504, the second circulation pump 507, the first control valve 505, and the second control valve 508 are closed, while the return pump 510, the third control valve 511, and the fourth control valve 513 are open. During the process of the return pump 510 pumping coolant from the chassis 400 into the circulation tank 501, coolant from the circulation tank 501 is replenished into the chassis 400, and air from the circulation tank 501 enters the chassis 400. After the coolant in the chassis 400 is drained, the return pump 510, the third control valve 511, and the fourth control valve 513 are closed. Whether the coolant inside the chassis 400 has been drained can be determined by a level sensor located at the bottom of the chassis 400.

[0104] A first temperature sensor is located on the computing board 100 to collect the temperature of the central processing unit 120. A second temperature sensor is located on the heat-conducting shell 133 to collect the temperature of the first power supply module 131. The controller is connected to the first circulating pump 504, the first control valve 505, the second circulating pump 507, the second control valve 508, the reflux pump 510, the third control valve 511, the fourth control valve 513, the first temperature sensor, and the second temperature sensor, respectively. The controller is configured to control the first circulating pump 504, the first control valve 505, the second circulating pump 507, the second control valve 508, the reflux pump 510, the third control valve 511, and the fourth control valve 513 based on the temperature of the central processing unit 120 and the temperature of the first power supply module 131. For example, when the temperature of the central processing unit 120 exceeds a first threshold and / or the temperature of the first power supply module 131 exceeds a second threshold, the controller controls the first circulation pump 504, the second circulation pump 507, and the return pump 510 to increase their operating power and improve the coolant circulation speed. When the temperature of the central processing unit 120 is less than a third threshold and / or the temperature of the first power supply module 131 is less than a fourth threshold, the controller controls the first circulation pump 504, the second circulation pump 507, and the return pump 510 to decrease their operating power and reduce the coolant circulation speed. The third and fourth thresholds are less than the first and second thresholds. Therefore, the temperature of the central processing unit 120 can be controlled between the third and first thresholds, and the temperature of the first power supply module 131 can be controlled between the fourth and second thresholds.

[0105] Optionally, the controller is also configured to be electrically connected to an alarm device. When the first circulating pump 504, the second circulating pump 507, and the return pump 510 operate at maximum power for a duration exceeding a preset time, and the temperature of the central processing unit 120 exceeds a first threshold or the temperature of the first power supply module 131 exceeds a second threshold, the controller will activate the alarm device to issue an alarm message. The alarm device can be a buzzer, alarm light, etc. Therefore, when the cooling system cannot meet the heat dissipation requirements or malfunctions, it can promptly alert users to troubleshoot and prevent damage from high temperatures.

[0106] The heat-conducting housing 133 is provided with multiple cooling grooves 134. The cooling grooves 134 extend from the side of the heat-conducting housing 133 near the second liquid inlet pipe 506 to the side of the heat-conducting housing 133 near the liquid return pipe 509. The upper side of the cooling grooves 134 extends to the contact position between the heat-conducting housing 133 and the first power supply module 131. When the coolant flows from the connection position between the second liquid inlet pipe 506 and the chassis 400 to the connection position between the liquid return pipe 509 and the chassis 400, it can pass through the cooling grooves 134, thereby increasing the cooling effect on the first power supply module 131.

[0107] Multiple flow guides 410 are provided on the upper bottom side of the chassis 400. The multiple flow guides 410 are located on the side of the heat conduction shell 133 near the second liquid inlet pipe 506. The multiple flow guides 410 correspond one-to-one with multiple cooling tanks 134. The inner side of the flow guide 410 forms a flow guide groove 411. The width of the end of the flow guide groove 411 near the cooling tank 134 is smaller than the width of the cooling tank 134, and the width of the end of the flow guide groove 411 away from the cooling tank 134 is larger than the width of the cooling tank 134. In this embodiment, the guide member 410 can play a guiding role. Specifically, when the coolant enters the guide channel 411 from the end of the guide member 410 away from the cooling tank 134, the flow rate increases as the width of the guide channel 411 decreases. As a result, when the coolant flows out of the guide channel 411 and into the cooling tank 134, the flow rate is higher than the coolant flow rate at other locations, making it easier for the coolant to pass through the cooling tank 134. Furthermore, it can cause the coolant on both sides of the cooling tank 134 to converge into the cooling tank 134, achieving a better cooling effect.

[0108] The server provided in this application, on the one hand, achieves this by dividing the server's motherboard structure into three parts—a computing board 100, a hard disk backplane 200, and a power control board 300—in a partitioned and decoupled design, and by designing connectors between the computing board 100, the hard disk backplane 200, and the power control board 300. This allows for raising the height of the central processing unit 120 mounting section (first circuit board 110) while maintaining consistency with the design positions of the hard disk backplane 200 and the power control board 300 of other servers. This creates conditions for the power supply 130 to be placed adjacent to the central processing unit 120. On the other hand, by placing the power supply 130 adjacent to the central processing unit 120, the distance between the power supply 130 and the central processing unit 120 is reduced, shortening the current path. Therefore, this application can adapt to the existing chassis 400 layout, effectively reducing current loss and heat generation, which is beneficial for improving the computing power of the server in the future.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A server, characterized in that, include: A computing board includes a first circuit board, a central processing unit (CPU), a power supply, and a pair of first connectors. The CPU is disposed on the upper side of the first circuit board, the power supply is disposed adjacent to the CPU and electrically connected to the CPU, and the pair of first connectors are disposed at opposite ends of the first circuit board. The hard disk backplane includes a second circuit board and a second connector disposed at the end of the second circuit board. The second circuit board is disposed parallel to the first circuit board and located on the lower side of the computing board. The second connector is inserted and engaged with the first connector at the corresponding end of the computing board in a direction perpendicular to the first circuit board. The power supply control board includes a third circuit board and a third connector. The third circuit board is arranged parallel to the first circuit board and located below the first circuit board. The third connector is inserted into the first connector at the corresponding end of the computing board in a direction perpendicular to the first circuit board. The first connector is provided with a plurality of first plug-in structures, and the second connector and the third connector are each provided with a plurality of second plug-in structures corresponding to the first plug-in structures; the first plug-in structure and the second plug-in structure are adapted to be plugged in along a direction perpendicular to the first circuit board, and at any mating position where the first plug-in structure and the second plug-in structure form a connection, the first plug-in structure is electrically connected to the second plug-in structure. One of the first plug-in structure and the second plug-in structure is a sliding groove, and the other is a slider; the sliding groove extends in a direction perpendicular to the first circuit board and forms an opening on one side parallel to the direction of the first circuit board, and the inner wall of the sliding groove is provided with a first metal member extending in a direction perpendicular to the first circuit board; the side wall of the slider is provided with a second metal member extending in a direction perpendicular to the first circuit board, the slider is plugged into the sliding groove, and the second metal member is in contact with the first metal member.

2. The server according to claim 1, characterized in that, The power supply includes a first power supply module, which is located on the lower side of the first circuit board. The first power supply module includes multiple first two-phase sub-units; The plurality of first two-phase sub-units are arranged and electrically connected to the corresponding loads of the central processing unit in a direction perpendicular to the first circuit board.

3. The server according to claim 2, characterized in that, The power supply includes a second power supply module, which is located on the upper side of the first circuit board; The second power supply module includes multiple second two-phase sub-units, which are distributed around the central processing unit. The plurality of second two-phase sub-units are arranged adjacently and electrically connected to the corresponding loads of the central processing unit in a direction parallel to the first circuit board.

4. The server according to claim 1, characterized in that, The first circuit board has a first groove at its end, and the first connector is disposed at the position of the first groove; And / or, the end of the second circuit board is provided with a second groove, and the second connector is disposed at the position of the second groove; And / or, the end of the third circuit board is provided with a third groove, and the third connector is disposed at the position of the third groove.

5. The server according to claim 2 or 3, characterized in that, It also includes a chassis and a heat-conducting structure, the heat-conducting structure being sleeved on the outside of the first power supply module, and the heat-conducting structure contacting and engaging with the inner wall of the chassis.

6. The server according to claim 5, characterized in that, The heat-conducting structure includes a heat-conducting shell surrounding the outside of the first power supply module, and the heat-conducting shell is in contact with the inner wall of the chassis. Alternatively, the heat-conducting structure includes a heat-conducting shell surrounding the outside of the first power supply module and a flexible heat-dissipating filling material, wherein the flexible heat-dissipating filling material is disposed between the heat-conducting shell and the chassis.

7. The server according to claim 6, characterized in that, Also includes: A liquid cooling device is connected to the inner cavity of the chassis and is used to provide an immersion liquid cooling environment inside the chassis.

8. The server according to claim 7, characterized in that, The liquid cooling device includes: Circulation box; A radiator is fixedly connected to the circulation tank, with the bottom of the radiator located inside the circulation tank and in contact with the coolant inside the circulation tank; The first liquid inlet pipe has one end connected to the bottom of the circulation tank and the other end connected to the top of the chassis; A first circulation pump is installed in the first inlet pipe; A first control valve is installed in the first inlet pipe; The second liquid inlet pipe has one end connected to the bottom of the circulation tank and the other end connected to one side of the bottom of the chassis. The second circulation pump is installed in the second inlet pipe; The second control valve is located in the second inlet pipe; A return pipe, one end of which is connected to the bottom of the chassis on the other side, and the other end of which is connected to the top of the circulation tank; A reflux pump is installed in the return pipe; A third control valve is located in the return pipe; An vent pipe, one end of which is connected to the top of the circulation tank and the other end of which is connected to the top of the chassis; The fourth control valve is located in the drain pipe; A first temperature sensor is installed on the computing board to collect the temperature of the central processing unit; A second temperature sensor is disposed on the heat-conducting shell and is used to collect the temperature of the first power supply module; The controller is connected to the first circulating pump, the first control valve, the second circulating pump, the second control valve, the reflux pump, the third control valve, the fourth control valve, the first temperature sensor, and the second temperature sensor, respectively. The controller is configured to control the first circulating pump, the first control valve, the second circulating pump, the second control valve, the reflux pump, the third control valve, and the fourth control valve based on the temperature of the central processing unit and the temperature of the first power supply module. The heat-conducting shell is provided with multiple cooling grooves, which extend from the side of the heat-conducting shell near the second liquid inlet pipe to the side of the heat-conducting shell near the liquid return pipe, and the upper side of the cooling groove extends to the contact position between the heat-conducting shell and the first power supply module. Multiple drainage components are provided on the upper bottom side of the chassis. The multiple drainage components are located on the side of the heat-conducting shell near the second liquid inlet pipe. The multiple drainage components correspond one-to-one with the multiple cooling tanks. A drainage groove is formed on the inner side of the drainage component. The width of the drainage groove near the cooling tank is smaller than the width of the cooling tank, and the width of the drainage groove away from the cooling tank is larger than the width of the cooling tank.

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