A chip transfer device, a chip transfer system, and a transfer method

Abstract

The present application relates to a kind of chip transfer device, chip transfer system and transfer method, chip transfer device is by being equipped with multiple alignment through hole for receiving chip to be transferred on support plate, first guide plate and second guide plate of eccentric mode rotation connection are symmetrically arranged at both ends of alignment through hole, and let the length of first guide plate and second guide plate at the side of first support surface be greater than the length at the side of second support surface, so that first guide plate and second guide plate form a opening facing the horn mouth shape of receiving chip to be transferred side under the action of weight difference, let the chip to be transferred falling more easily falls into horn mouth, simultaneously, since first guide plate and second guide plate are rotationally connected with alignment through hole, chip to be transferred will first guide plate and second guide plate be extruded to both sides in the process of sliding in horn mouth, can slow down the falling speed of chip to be transferred, to improve the transfer precision of chip and production yield, reduce the difficulty of later repair.

Description

Technical Field

[0001] This invention relates to the field of chip transfer technology, and in particular to a chip transfer apparatus, a chip transfer system, and a transfer method. Background Technology

[0002] Micro-LED is an emerging display technology. Compared with conventional display technologies, displays based on Micro-LED technology have the characteristics of fast response speed, self-illumination, high contrast, long lifespan, and high photoelectric efficiency.

[0003] The current mass transfer process requires multiple chip flipping operations, which reduces the yield. Direct bonding transfer is limited by chip arrangement, resulting in low chip utilization. Therefore, the current mass transfer process generally has problems of low yield and difficulty in subsequent repair.

[0004] Therefore, improving the production yield of chip transfer and reducing the difficulty of subsequent repairs are urgent problems to be solved. Summary of the Invention

[0005] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a chip transfer device, a chip transfer system and a transfer method, which aims to solve the problems of low yield and difficulty in subsequent repair in the current chip transfer process.

[0006] A chip transfer device, comprising:

[0007] A support plate is provided with a plurality of alignment through holes for receiving chips to be transferred. Each alignment through hole is provided with a chip transfer unit. The side of the support plate for receiving the chips to be transferred is a first support surface, and the opposite side is a second support surface.

[0008] The chip transfer unit includes a first guide plate and a second guide plate; the first guide plate and the second guide plate respectively penetrate the first support surface and the second support surface, and are symmetrically arranged on the two opposite inner walls of the alignment through hole;

[0009] The first guide plate and the second guide plate are eccentrically connected in the alignment through hole, and the length of the first guide plate and the second guide plate on the first support surface side is greater than the length on the second support surface side.

[0010] The aforementioned chip transfer device includes a support plate with multiple alignment through holes for receiving chips to be transferred. A first guide plate and a second guide plate are symmetrically and eccentrically connected at both ends of the alignment through holes, with the length of the first guide plate and the second guide plate on the first support surface being greater than the length on the second support surface. This weight difference causes the first guide plate and the second guide plate to form a flared shape with the opening facing the chip to be transferred, making it easier for the falling chip to fall into the flared shape. At the same time, since the first guide plate and the second guide plate are rotatably connected to the alignment through holes, the chip to be transferred pushes the first guide plate and the second guide plate to the sides as it slides down into the flared shape, which can slow down the falling speed of the chip, thereby improving the chip transfer accuracy and production yield, and reducing the difficulty of subsequent repairs.

[0011] Optionally, it may also include a first limiting structure and a second limiting structure;

[0012] The first limiting structure is disposed on the surface of the first guide plate facing the first inner wall, or on the surface of the second support surface. The first limiting structure is used to limit the angle between the surface of the first guide plate facing the first inner wall and the second support surface to be greater than or equal to 90°.

[0013] The second limiting structure is disposed on the surface of the second guide plate facing the second inner wall, or on the surface of the second support surface. The second limiting structure is used to limit the angle between the surface of the second guide plate facing the second inner wall and the second support surface to be greater than or equal to 90°.

[0014] The aforementioned chip transfer device includes a first limiting structure to limit the angle between the surface of the first guide plate facing the first inner wall and the second support surface to be greater than or equal to 90°; and a second limiting structure to limit the angle between the surface of the second guide plate facing the second inner wall and the second support surface to be greater than or equal to 90°. By providing the first and second limiting structures, it is possible to prevent the portions of the first guide plate and the second guide plate located on the first support surface from rotating into the alignment through hole under certain conditions, such as vibration.

[0015] Based on the same inventive concept, this application also provides a chip transfer system, including the chip transfer device and transfer auxiliary device provided in this application;

[0016] The transfer assist device is configured to assist in transferring the chip to be transferred, located at the alignment via, to the display backplane.

[0017] The aforementioned chip transfer system includes the chip transfer device and the transfer auxiliary device provided in this application. Because the chip transfer device is added to the chip transfer system, the transfer auxiliary device can transfer the chip to be transferred located at the alignment via to the display backplane with higher accuracy, thereby improving production yield and reducing repair difficulty.

[0018] Based on the same inventive concept, this application also provides a transfer method, comprising:

[0019] The chip transfer apparatus and backplate described in this application are provided, wherein the backplate is placed below the chip transfer apparatus, parallel to the support plate, and has a gap between it and the chip transfer apparatus;

[0020] Provide a chip to be transferred, and drop the chip to be transferred onto the surface of the backplate through the alignment via;

[0021] Pressure is applied to the chip to be transferred to bond the chip to the surface of the backplane.

[0022] The above-mentioned transfer method places the backplate below the chip transfer device, parallel to the support plate, and with a gap between them. This results in higher alignment accuracy when the chip to be transferred falls onto the surface of the backplate through the alignment via. Then, the chip to be transferred is bonded to the surface of the backplate, which can effectively improve the production yield and reduce the difficulty of subsequent repairs. Attached Figure Description

[0023] Figure 1 This is a side view of a chip transfer device provided in an embodiment of the present invention;

[0024] Figure 2 This is a front view of a chip transfer device provided in an embodiment of the present invention;

[0025] Figure 3 A schematic diagram of the front structure of a chip transfer device provided in another optional embodiment of the present invention;

[0026] Figure 4 Side view diagrams of two chip transfer devices provided in another optional embodiment of the present invention;

[0027] Figure 5 A side view of a chip transfer system provided in another optional embodiment of the present invention;

[0028] Figure 6 A side view of a chip transfer system provided in another optional embodiment of the present invention;

[0029] Figure 7A schematic diagram of the flow steps of a transfer method provided in another optional embodiment of the present invention;

[0030] Figure 8 This is a schematic diagram of the manufacturing process of a transfer method provided in another optional embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures:

[0032] 100-Chip transfer device; 101-Support plate; 102-Alignment through hole; 103-First guide plate; 104-Second guide plate; 105-First movable bearing; 106-Second movable bearing; 107-First inner wall; 108-Second inner wall; 109-First limiting structure; 110-Second limiting structure; 200-Back plate; 201-Chip bonding area; 300-Bonding device; 301-Bonding head; 400-Transfer plate; 401-Chip to be transferred; A-First support surface; B-Second support surface. Detailed Implementation

[0033] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0035] The current mass transfer process requires multiple chip flipping operations, which reduces the yield. Direct bonding transfer is limited by chip arrangement, resulting in low chip utilization. Therefore, the current mass transfer process generally has problems of low yield and difficulty in subsequent repair.

[0036] Therefore, this application aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in subsequent embodiments.

[0037] This embodiment provides a chip transfer apparatus, which includes:

[0038] A support plate is provided with a plurality of alignment through holes for receiving chips to be transferred. Each alignment through hole is provided with a chip transfer unit. The side of the support plate for receiving the chips to be transferred is a first support surface, and the opposite side is a second support surface.

[0039] The chip transfer unit includes a first guide plate and a second guide plate; the first guide plate and the second guide plate respectively penetrate the first support surface and the second support surface, and are symmetrically arranged on the two opposite inner walls of the alignment through hole;

[0040] The first guide plate and the second guide plate are eccentrically connected in the alignment through hole, and the length of the first guide plate and the second guide plate on the first support surface side is greater than the length on the second support surface side.

[0041] The chip transfer device provided in this embodiment can be applied to the chip transfer production process, as well as the post-transfer repair process. Therefore, the number and position of the alignment vias on the support plate in this embodiment can be adjusted according to the number of chips to be transferred and the location of the transferred chips.

[0042] In this embodiment, a chip transfer device provides a first guide plate and a second guide plate that are eccentrically connected in an alignment through-hole, with the length of the first guide plate and the second guide plate on the first support surface side being greater than the length on the second support surface side. This eccentric connection allows the first and second guide plates to naturally form a flared shape due to their weight difference, with a larger opening on the first support surface side and a smaller opening on the second support surface side. This facilitates the reception of the chip to be transferred falling from the first support surface side. Furthermore, when the chip falls between the first and second guide plates, the falling speed can be slowed by pushing the first and second guide plates outwards to widen the opening.

[0043] In this embodiment, a chip transfer device has alignment through holes on a support plate for receiving chips to be transferred. The chips to be transferred eventually need to fall onto a back plate and complete bonding or soldering. Therefore, a back plate or a substrate for temporary transfer is usually provided below the support plate. The back plate or substrate usually has a bonding area or soldering area for the chips to be transferred to complete bonding at the position corresponding to the alignment through holes.

[0044] In this embodiment, in order to ensure the accuracy of the falling of the chip to be transferred, the opening of the alignment through hole and the opening when the first guide plate and the second guide plate are in a parallel state are slightly larger than the chip to be transferred, and each alignment through hole can only allow one chip to be transferred to pass through.

[0045] In this embodiment, considering that the transfer chip is prone to bouncing and displacement or malfunction if it falls directly onto the backplate or substrate below the support plate during its descent, a first guide plate and a second guide plate are respectively provided on the symmetrical sides of the alignment through-hole, passing through the first support surface and the second support surface of the support plate. The side of the support plate used to receive the chip to be transferred is the first support surface, and the opposite side is the second support surface. The first guide plate and the second guide plate are eccentrically connected to the alignment through-hole, and the length of the first guide plate and the second guide plate on the side of the first support surface is greater than the length on the side of the second support surface. The length of one side of the support surface allows the horn opening on the first support surface to be larger than the horn opening on the second support surface due to the weight difference between the first and second guide plates. This makes it easier for the transfer chip falling from the first support surface to fall into the horn opening between the first and second guide plates. At the same time, since the first and second guide plates hold the chip to be transferred in the horn opening, the chip can slowly slide down between the first and second guide plates through their rotation, slowing down the falling speed of the chip and thus improving the alignment accuracy of the transfer chip.

[0046] One structure of the chip transfer device can be found in [reference needed]. Figure 1 and Figure 2 , Figure 1 This is a side view of a chip transfer device provided in this embodiment. Figure 2 This is a front view of a chip transfer device provided in this embodiment. The chip transfer device 100 includes: a support plate 101, on which a plurality of alignment through holes 102 for receiving chips to be transferred are formed, and a chip transfer unit is provided at each alignment through hole 102. The side of the support plate 101 for receiving chips to be transferred is a first support surface A, and the opposite side is a second support surface B. The chip transfer unit includes a first guide plate 103 and a second guide plate 104. The first guide plate 103 and the second guide plate 104 respectively penetrate the first support surface A and the second support surface B, and are symmetrically arranged on two opposite inner walls of the alignment through holes 102. The first guide plate 103 and the second guide plate 104 are eccentrically rotatably connected in the alignment through holes 102, and the length of the first guide plate 103 and the second guide plate 104 on the side of the first support surface A is greater than the length on the side of the second support surface B.

[0047] Figure 1 and Figure 2In this configuration, the support plate 101 is positioned above the chip bonding area 201 on the side of the backplate 200. The distance between the support plate 101 and the backplate 200 is required to be greater than the length of the first guide plate 103 and the second guide plate 104 on the side of the second support surface B when they are perpendicular to the support plate 101. This allows the first guide plate 103 and the second guide plate 104 to rotate smoothly on the support plate 101, allowing the chip to be transferred to fall smoothly onto the chip bonding area 201.

[0048] It should be noted that, Figure 1 and Figure 2 The first guide plate 103 and the second guide plate 104 are symmetrically arranged on the left and right sides of the alignment through hole 102. In some other embodiments, the first guide plate 103 and the second guide plate 104 are symmetrically arranged on the upper and lower sides of the alignment through hole 102.

[0049] It should be noted that, Figure 1 and Figure 2 The alignment via 102 is rectangular. In other embodiments, the shape of the alignment via 102 may include, but is not limited to, circles, ellipses, prisms, hexagons, and octagons. In general, the shape of the alignment via 102 is the same as the shape of the transfer chip.

[0050] It should be noted that, in order for the first guide plate 103 and the second guide plate 104 to better receive the falling chip to be transferred, the deflection direction of the first guide plate 103 and the second guide plate 104 in their natural state is required to be as follows: Figure 1 As shown, the angle between the outer surface of the first guide plate 103 and the second guide plate 104 and the first support surface A of the support plate 101 is an acute angle, or the angle between the outer surface of the first guide plate 103 and the second guide plate 104 and the second support surface B of the support plate 101 is an obtuse angle. This arrangement allows the first guide plate 103 and the second guide plate 104 to form a flared shape that is larger at the top and smaller at the bottom, making it easier to catch the falling chip to be transferred. Furthermore, because the lower end of the flared opening is smaller, the chip to be transferred can also gradually expand the opening of the flared opening by rotating the first guide plate 103 and the second guide plate 104, thereby slowly sliding onto the chip bonding area 201. This avoids the chip to be transferred from directly falling onto the chip bonding area 201 and causing jumping, displacement, and malfunctions.

[0051] It should be noted that, since the chip to be transferred needs to slide down through the flared opening formed by the first guide plate 103 and the second guide plate 104 onto the chip bonding area 201, the distance between the first guide plate 103 and the second guide plate 104 when they are rotated to a parallel state must be slightly greater than the width of the chip to be transferred.

[0052] This embodiment provides a chip transfer device 100, including: a support plate 101, on which a plurality of alignment through holes 102 for receiving chips to be transferred are formed, and a chip transfer unit is provided at each alignment through hole 102. The side of the support plate 101 for receiving the chips to be transferred is a first support surface A, and the opposite side is a second support surface B. The chip transfer unit includes a first guide plate 103 and a second guide plate 104. The first guide plate 103 and the second guide plate 104 respectively penetrate the first support surface A and the second support surface B, and are symmetrically arranged on two opposite inner walls of the alignment through holes 102. The first guide plate 103 and the second guide plate 104 are eccentrically rotatably connected in the alignment through holes 102, and the length of the first guide plate 103 and the second guide plate 104 on the side of the first support surface A is greater than the length on the side of the second support surface B. By opening multiple alignment through holes 102 on the support plate 101 for receiving the chip to be transferred, and symmetrically rotatably connecting a first guide plate 103 and a second guide plate 104 at both ends of the alignment through holes 102, and making the length of the first guide plate 103 and the second guide plate 104 on the side of the first support surface A greater than the length on the side of the second support surface B, the first guide plate 103 and the second guide plate 104 form a flared shape with the opening facing the side of the chip to be transferred under the action of the weight difference. This makes it easier for the falling chip to be transferred to fall into the flared shape. At the same time, since the first guide plate 103 and the second guide plate 104 are rotatably connected to the alignment through holes 102, the chip to be transferred pushes the first guide plate 103 and the second guide plate 104 to both sides during the process of sliding down in the flared shape, which can slow down the falling speed of the chip to be transferred, thereby improving the chip transfer accuracy and production yield, and reducing the difficulty of subsequent repair.

[0053] Another optional embodiment of the present invention:

[0054] This embodiment is another optional embodiment based on the chip transfer device provided in the above embodiments. The specific embodiment is as follows:

[0055] In another optional embodiment, the chip transfer unit further includes a first movable bearing 105 and a second movable bearing 106, and the two opposing inner walls of the alignment through hole 102 are a first inner wall 107 and a second inner wall 108, respectively.

[0056] The first movable bearing 105 connects the first guide plate 103 between the first inner wall 107 and the second inner wall 108; the second movable bearing 106 connects the second guide plate 104 between the first inner wall 107 and the second inner wall 108.

[0057] See also Figure 3 , Figure 3This is a side view of another chip transfer device provided in this embodiment. Figure 3 A first movable bearing 105 is provided between the first guide plate 103 and the first inner wall 107, and a second movable bearing 106 is provided between the second guide plate 104 and the second inner wall 108. The first movable bearing 105 enables the rotation of the first guide plate 103 and its fixation in the alignment through hole 102, and the second movable bearing 106 enables the rotation of the second guide plate 104 and its fixation in the alignment through hole 102. It should be noted that the first guide plate 103 and the second guide plate 104 are eccentrically fixed in the alignment through hole 102, and the position of their rotation axis is different from that of the guide plate 104. Figure 3 In addition to what is shown, it can also be as follows: Figure 1 The position shown is on the side of the first guide plate 103 and the second guide plate 104 in the thickness direction. Of course, in addition to the above position, there can be other rotation and fixing positions and methods.

[0058] In another optional embodiment, a first limiting structure 109 and a second limiting structure 110 are also included;

[0059] The first limiting structure 109 is disposed on the surface of the first guide plate 103 facing the first inner wall 107, or on the surface of the second support surface B. The first limiting structure 109 is used to limit the angle between the surface of the first guide plate 103 facing the first inner wall 107 and the second support surface B to be greater than or equal to 90°.

[0060] The second limiting structure 110 is provided on the surface of the second guide plate 104 facing the second inner wall 108, or on the surface of the second support surface B. The second limiting structure 110 is used to limit the angle between the surface of the second guide plate 104 facing the second inner wall 108 and the second support surface B to be greater than or equal to 90°.

[0061] like Figure 4 As shown, Figure 4 This is a side view diagram of two other chip transfer devices provided in this embodiment. Figure 4 The first limiting structure 109 can be optionally set on the surface of the first guide plate 103 facing the first inner wall 107 as shown in 4-2, or on the surface of the second support surface B as shown in 4-1. The first limiting structure 109 is set to limit the angle between the surface of the first guide plate 103 facing the first inner wall 107 and the second support surface B to be greater than or equal to 90°. Figure 4The second limiting structure 110 can optionally be disposed on the surface of the second guide plate 104 facing the second inner wall 108, as shown in 4-2, or on the surface of the second support surface B, as shown in 4-1. The second limiting structure 110 is used to limit the angle between the surface of the second guide plate 104 facing the second inner wall 108 and the second support surface B to be greater than or equal to 90°. By setting the first limiting structure 109 and the second limiting structure 110, it is possible to prevent the first guide plate 103 and the second guide plate 104 from reversing and causing the horn opening to be located on one side of the second support surface B.

[0062] In another alternative embodiment, the first support surface A of the support plate 101 further includes a first identifier for identifying the first support surface A.

[0063] Since the first support surface A of the support plate 101 in this embodiment corresponds to the side of the chip to be transferred, in order to accurately find which side of the support plate 101 needs to face the chip to be transferred, a first mark for identifying the first support surface A can be set on the first support surface A.

[0064] In another alternative embodiment, the distance between the first guide plate 103 and the second guide plate 104 when they are parallel to each other is greater than or equal to the width of the chip to be transferred.

[0065] Since the chip to be transferred needs to slide through the flared opening between the first guide plate 103 and the second guide plate 104 onto the chip bonding area 201 below the support plate 101, the distance between the first guide plate 103 and the second guide plate 104 when they are parallel to each other is greater than or equal to the width of the chip to be transferred.

[0066] In another alternative embodiment, each of the alignment through holes 102 is arranged in an array on the support plate 101.

[0067] The chip transfer device 100 provided in this embodiment has alignment vias 102 on the support plate 101 corresponding to the transfer position of the chip to be transferred and the chip bonding area 201. Therefore, when the chip transfer device is applied to the mass transfer process, the alignment vias 102 on the support plate 101 can be arranged in an array similar to the chip bonding area 201 on the back plate.

[0068] Another optional embodiment of the present invention:

[0069] This embodiment provides a chip transfer system, which includes: the chip transfer device 100 and the transfer auxiliary device as described in any one of the claims of this application;

[0070] The transfer assist device is configured to assist in transferring the chip 401 to be transferred, located at the alignment via 102, to the display backplane.

[0071] See also Figure 5 and Figure 6 , Figure 5 and Figure 6 These are side view diagrams of a chip transfer system provided in this embodiment. The chip transfer system includes a chip transfer device 100 and a transfer auxiliary device provided in this application; wherein, the transfer auxiliary device is configured to assist in transferring the chip to be transferred located at the alignment via 102 to the display backplane.

[0072] Figure 5 and Figure 6 The transfer auxiliary device includes: a transfer plate 400, which carries the chip 401 to be transferred, and the chip 401 can be peeled off from the transfer plate 400 by laser; and a bonding device 300, which uses a bonding head 301 to bond the chip 401 to the chip bonding area 201 on the backplate 200. The backplate 200 can be a display backplate or a temporary substrate.

[0073] In another alternative embodiment, the transfer aid is an air blowing device;

[0074] The air blowing device includes at least one exhaust port, and each exhaust port is arranged vertically and vertically corresponding to each of the alignment through holes 102.

[0075] Can participate Figure 5 When the chip to be transferred 401 falls between the first guide plate 103 and the second guide plate 104, if the chip to be transferred 401 cannot rely on its own weight and falling speed to push the first guide plate 103 and the second guide plate 104 to the sides, and thus cannot fall onto the chip bonding area 201, then external force is needed to make the chip to be transferred 401 slide onto the chip bonding area 201. In this embodiment, the options include, but are not limited to, a blowing device, which blows the chip to be transferred 401 onto the chip bonding area 201 by discharging gas through the exhaust port of the blowing device; or a mechanical alignment device can be set, which pushes the chip to be transferred 401 onto the chip bonding area 201 by applying mechanical force through the mechanical alignment device.

[0076] In another alternative embodiment, the transfer aid is a bonding device 300;

[0077] The bonding device 300 includes at least one bonding head 301, and each bonding head 301 is arranged vertically corresponding to each alignment through hole 102.

[0078] See also Figure 6The bonding device 300 is used after the chip to be transferred 401 has fallen onto the chip bonding area 201. The bonding head 301 on the bonding device 300 bonds the chip to be transferred 401 to the chip bonding area 201 together.

[0079] This embodiment provides a chip transfer system, including a chip transfer device 100 and a transfer auxiliary device provided in this application. The transfer auxiliary device is configured to assist in transferring the chip 401 to be transferred, located at the alignment via 102, to a display backplane. The chip transfer system, including the chip transfer device 100 and the transfer auxiliary device provided in this application, achieves higher transfer accuracy by adding the chip transfer device 100, thus improving production yield and reducing repair difficulty.

[0080] Another optional embodiment of the present invention:

[0081] This embodiment provides a transfer method, including: providing a chip transfer device 100 and a backplate 200 of this application, placing the backplate 200 below the chip transfer device 100, parallel to the support plate 101, and having a distance between the backplate 200 and the chip transfer device 100;

[0082] A chip 401 to be transferred is provided, and the chip 401 to be transferred is dropped onto the surface of the backplate 200 through the alignment through hole 102;

[0083] Pressure is applied to the chip to be transferred 401 to bond the chip to be transferred 401 to the surface of the backplate 200.

[0084] For detailed steps of the transfer method, please refer to [link / reference]. Figure 7 , Figure 7 This is a schematic diagram illustrating the process steps of a transfer method provided in this embodiment. Figure 8 This is a schematic diagram illustrating the manufacturing process of a transfer method provided in this embodiment.

[0085] The specific steps of the transfer method include the following:

[0086] S701. Provide the chip transfer device 100 and backplate 200 of this application, wherein the backplate 200 is placed below the chip transfer device 100, parallel to the support plate 101, and has a distance from the chip transfer device 100.

[0087] S702, Provide a chip to be transferred 401, and drop the chip to be transferred 401 onto the surface of the backplate through the alignment through hole 102.

[0088] S703. Apply pressure to the chip to be transferred 401 to bond the chip to be transferred 401 to the surface of the backplate 200.

[0089] This embodiment provides a transfer method comprising: providing a chip transfer device 100 and a backplate 200; placing the backplate 200 below the chip transfer device 100, parallel to a support plate 101, and having a gap between them; providing a chip 401 to be transferred; dropping the chip 401 to be transferred onto the surface of the backplate 200 via an alignment via 102; and applying pressure to the chip 401 to be transferred to bond it to the surface of the backplate 200. By placing the backplate 200 below the chip transfer device 100, parallel to the support plate 101, and having a gap between them, the above transfer method achieves higher alignment accuracy when the chip 401 to be transferred drops onto the surface of the backplate 200 via the alignment via 102. Bonding the chip 401 to the surface of the backplate 200 at this point effectively improves production yield and reduces the difficulty of subsequent repairs.

[0090] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A chip transfer device, characterized in that, include: A support plate is provided with a plurality of alignment through holes for receiving chips to be transferred. Each alignment through hole is provided with a chip transfer unit. The side of the support plate for receiving the chips to be transferred is a first support surface, and the opposite side is a second support surface. The chip transfer unit includes a first guide plate and a second guide plate; the first guide plate and the second guide plate respectively penetrate the first support surface and the second support surface, and are symmetrically arranged on the two opposite inner walls of the alignment through hole; The first guide plate and the second guide plate are eccentrically connected in the alignment through hole, and the length of the first guide plate and the second guide plate on the side of the first support surface is greater than the length on the side of the second support surface; The first guide plate and the second guide plate, due to their weight difference, make the horn opening on the first support surface side larger than the horn opening on the second support surface side. The distance between the first guide plate and the second guide plate when they are parallel to each other is greater than or equal to the width of the chip to be transferred.

2. The chip transfer apparatus as described in claim 1, characterized in that, The chip transfer unit further includes a first movable bearing and a second movable bearing, and the two opposing inner walls of the alignment through hole are the first inner wall and the second inner wall, respectively. The first movable bearing connects the first guide plate between the first inner wall and the second inner wall; the second movable bearing connects the second guide plate between the first inner wall and the second inner wall.

3. The chip transfer apparatus as described in claim 2, characterized in that, It also includes a first limiting structure and a second limiting structure; The first limiting structure is disposed on the surface of the first guide plate facing the first inner wall, or on the surface of the second support surface. The first limiting structure is used to limit the angle between the surface of the first guide plate facing the first inner wall and the second support surface to be greater than or equal to 90°. The second limiting structure is provided on the surface of the second guide plate facing the second inner wall, or on the surface of the second support surface. The second limiting structure is used to limit the angle between the surface of the second guide plate facing the second inner wall and the second support surface to be greater than or equal to 90°.

4. The chip transfer apparatus as described in claim 1, characterized in that, The first support surface of the support plate also includes a first identifier for identifying the first support surface.

5. The chip transfer apparatus according to any one of claims 1-4, characterized in that, The alignment through holes are arranged in an array on the support plate.

6. A chip transfer system, characterized in that, Includes the chip transfer apparatus and transfer auxiliary apparatus as described in any one of claims 1-5; The transfer assist device is configured to assist in transferring the chip to be transferred, located at the alignment via, to the display backplane.

7. The chip transfer system as described in claim 6, characterized in that, The transfer auxiliary device is an air blowing device; The air blowing device includes multiple exhaust ports, and each exhaust port is arranged vertically and vertically corresponding to each of the alignment through holes.

8. The chip transfer system as described in claim 6, characterized in that, The transfer aid is a bonding device; The bonding device includes at least one bonding head, and each bonding head is arranged vertically and vertically corresponding to each of the alignment through holes.

9. A transfer method, characterized in that, include; A chip transfer apparatus and a backplate as described in any one of claims 1 to 5 are provided, wherein the backplate is placed below the chip transfer apparatus, parallel to the support plate, and has a distance between it and the chip transfer apparatus; Provide a chip to be transferred, and drop the chip to be transferred onto the surface of the backplate through the alignment via; Pressure is applied to the chip to be transferred to bond the chip to the surface of the backplane.

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