An encapsulation system and method for an ultrahigh vacuum tube

Abstract

The application discloses an encapsulation system and method of ultrahigh vacuum pipeline, which comprises a spherical ultrahigh vacuum pressure stabilization cavity, a transition cavity, an inflation cavity, an encapsulation joint flange, a data acquisition and control unit, a vacuum pumping unit, a protective gas source and an adjustable support platform. The spherical ultrahigh vacuum pressure stabilization cavity, the transition cavity and the inflation cavity are connected through a vacuum plug valve, and the encapsulation joint flange is connected to the other side of the inflation cavity. During encapsulation, the vacuum pipeline to be encapsulated is connected to the joint flange, and the adjustable support platform is adjusted and supported according to the height of the vacuum pipeline; after the encapsulation vacuum chamber is pumped to a predetermined vacuum degree through the vacuum pumping unit, the second vacuum plug valve is closed, the protective gas source is opened to inject gas into the vacuum pipeline, and when the encapsulation pressure is reached, the brass pipe at the front end of the vacuum pipeline is pinched off to realize encapsulation. The system and method can satisfy the simultaneous encapsulation of four pipelines in one group, the encapsulation operation is continuous, and the encapsulation efficiency is greatly improved; and the system and method have strong applicability to different shapes of vacuum pipelines.

Description

Technical Field

[0001] This invention belongs to the field of vacuum equipment, specifically relating to an encapsulation system and method for ultra-high vacuum pipelines. Background Technology

[0002] With the rapid development of science and technology, ultra-high vacuum technology is becoming increasingly important in nuclear physics fields such as particle colliders, nuclear fusion, and synchrotron radiation sources. In these fields, slender vacuum tubes are mainly used to form the ultra-high vacuum circuitry of devices, providing a highly clean vacuum environment for particle acceleration. This allows particles to move at high speeds undisturbed within the tubes to achieve predetermined particle extraction velocities and qualities, thus ensuring better utilization for experiments. However, due to the slender length and low conductivity of the vacuum tubes, obtaining a uniform and stable ultra-high vacuum directly within the tube using vacuum pumping equipment is extremely difficult. Currently, the common practice is to coat the inner wall of the vacuum tube with a getter film to achieve distributed pumping and improve the uniformity of pressure distribution within the vacuum tube, effectively solving problems such as large pressure gradients and insufficient vacuum levels in traditional slender vacuum tubes.

[0003] The getter film on the inner wall is reactive, and to avoid irreversible contamination, the vacuum tubing needs to be sealed and preserved before final installation. Research has revealed no reports of methods or systems for sealing slender ultra-high vacuum tubing. Therefore, considering the current state of vacuum technology development in my country, providing a method and system for sealing ultra-high vacuum tubing is a pressing technical problem that needs to be solved. Summary of the Invention

[0004] The purpose of this invention is to fill the gap in existing technology and provide a packaging system and method for ultra-high vacuum pipelines. The main technical solutions are as follows:

[0005] An ultra-high vacuum pipeline encapsulation system includes a spherical ultra-high vacuum stabilizing chamber, a transition chamber, a gas filling chamber, an encapsulation joint flange, a data acquisition and control unit, a high-temperature baking unit, a vacuum pumping unit, a gas source, and an adjustable support platform. The first interface of the spherical ultra-high vacuum stabilizing chamber is connected to the first interface of the transition chamber, and the second interface of the transition chamber is connected to the first interface of the gas filling chamber via a first vacuum gate valve and a second vacuum gate valve, respectively. The second interface of the gas filling chamber is connected to the encapsulation joint flange. During encapsulation, the vacuum pipeline to be encapsulated is connected to the encapsulation joint of the encapsulation joint flange, and the height of the adjustable support platform is adjusted according to the height of the vacuum pipeline to stably support the vacuum pipeline for the encapsulation operation.

[0006] Furthermore, the high-temperature baking unit is wrapped around the outer walls of the spherical ultra-high vacuum stabilizing cavity, the transition cavity, and the gas filling cavity, and an insulation layer is wrapped around the outer layer of the high-temperature baking unit.

[0007] Furthermore, the vacuum pumping unit includes a No. 1 molecular pump, a No. 2 molecular pump, a forepump, an NEG pump, and a sputtering ion pump.

[0008] Furthermore, the spherical ultra-high vacuum stabilizing cavity provides two types of interfaces: one is the fifth interface of the spherical stabilizing cavity for connecting the hot cathode gauge; the other is the second, third, and fourth interfaces of the spherical stabilizing cavity for connecting the vacuum pumping unit. The second interface of the spherical stabilizing cavity connects the No. 1 molecular pump and the foreboard pump for rough pumping and high vacuum pumping; the third interface of the spherical stabilizing cavity connects to the NEG pump to obtain ultra-high vacuum; and the fourth interface of the spherical stabilizing cavity connects to the sputtering ion pump as a sustaining pump.

[0009] Furthermore, the transition cavity is a four-way valve, with the third interface of the transition cavity used to connect to the cold cathode gauge; the fourth interface of the transition cavity is used to connect the second molecular pump and the forepump.

[0010] Furthermore, a connecting pipeline is provided between the No. 1 molecular pump and the No. 2 molecular pump. When one of the molecular pumps fails and stops, the valve of the connecting pipeline is opened and the failed molecular pump is shut down, while the other molecular pump maintains normal gas pumping.

[0011] Furthermore, the encapsulation connector flange has four encapsulation connectors for connecting the encapsulation vacuum pipe; and the four encapsulation connectors are distributed vertically, so that the connected vacuum pipe is divided into two layers.

[0012] Furthermore, the adjustable support platform can be adjusted by manually rotating a handwheel to accommodate vacuum pipes of different shapes.

[0013] Furthermore, the data acquisition and control unit is integrated into a single module device, whose functions include displaying vacuum level, baking control, valve opening and closing, and pump start and stop.

[0014] This invention also proposes a method for packaging ultra-high vacuum pipes, the method comprising the following:

[0015] S1: After the ultra-high vacuum sealing system at the front end of the vacuum pipeline is debugged, connect the four vacuum pipelines to the sealing joint flange in a group, open the first vacuum gate valve and the second vacuum gate valve, and run the fore-pump to pre-pump the vacuum chamber composed of the ultra-high vacuum stabilizing chamber, the transition chamber and the gas filling chamber. When the vacuum degree reaches below 10Pa, start the No. 1 molecular pump and the No. 2 molecular pump.

[0016] S2: When the pressure inside the vacuum chamber is lower than 1×10 -3 After Pa, the high-temperature baking unit is opened through the data acquisition and control unit to perform high-temperature baking and degassing.

[0017] S3: When the vacuum degree is better than 1×10-5 After Pa, turn off molecular pumps No. 1 and No. 2, and turn on the NEG pump and sputtering ion pump to degas together until the vacuum level is better than 1×10⁻⁶. -8 Pa;

[0018] S4: Close the second vacuum gate valve and open the inflation valve between the protective gas source and the inflation chamber, so that the protective gas source enters the vacuum pipeline through the third interface of the inflation chamber.

[0019] S5: When the pressure transmitter reading on the gas source inlet pipe reaches the upper limit of the sealing pressure, close the protective gas source charging valve and clamp the brass tube at the front end of the vacuum pipeline to achieve sealing.

[0020] S6: Install another set of vacuum pipes, close the first vacuum gate valve, open the second vacuum gate valve, start the fore-pump to pre-pump the transition chamber, the gas filling chamber and the vacuum pipes, and start the second molecular pump when the vacuum level reaches below 10Pa.

[0021] S7: When the reading of the cold cathode gauge is better than 1×10 -5 After Pa, open the first vacuum gate valve and use the NEG pump and sputtering ion pump together to remove gas until the vacuum level is better than 1×10⁻⁶. -8 Pa;

[0022] S8: Repeat S4 and subsequent operations to achieve efficient continuous packaging.

[0023] The packaging system and method for ultra-high vacuum pipes provided by this invention have the following advantages compared with the prior art:

[0024] This invention addresses a gap in existing technology by proposing a method for achieving stable and reliable ultra-high vacuum (better than 1×10⁻⁶) operation of slender vacuum pipes in ultra-high vacuum environments. -8 A high-efficiency, continuous packaging system and method under Pa) conditions.

[0025] Specifically, this invention achieves several advantages by directly connecting the spherical ultra-high vacuum stabilizing chamber, the transition chamber, and the gas filling chamber. Firstly, it effectively improves the flow conductance of the vacuum pumping unit during evacuation, enabling the vacuum pipe opening to quickly reach the required vacuum level. Secondly, it minimizes the gas filling and sealing space, reducing protective gas source loss and saving on sealing costs. Thirdly, it enables vacuum differential treatment of each chamber, requiring only evacuation of the transition and gas filling chambers during subsequent sealing, while the spherical ultra-high vacuum stabilizing chamber maintains a constant ultra-high vacuum. Once the preset vacuum level is reached, the vacuum gate valve is opened, and the three chambers are directly connected for sealing, significantly reducing evacuation time and improving the efficiency of the sealing system.

[0026] It is worth noting that, considering the stability and reliability of the packaging system, this invention is equipped with two molecular pumps, which are respectively connected to the spherical vacuum stabilizing chamber and the transition chamber. A connecting pipeline is provided between the two molecular pumps. When one of the molecular pumps, No. 1 and No. 2, fails and stops for maintenance, the valve of the connecting pipeline can be opened, and the other pump can maintain normal gas pumping, so as not to affect the operation of the packaging system.

[0027] The vacuum pipe encapsulation system provided by this invention can simultaneously encapsulate four pipes in a group, further improving encapsulation efficiency. Furthermore, the four encapsulation connectors are arranged vertically, dividing the connected vacuum pipes into two layers: firstly, facilitating support; and secondly, making the system compact.

[0028] Furthermore, the vacuum tube support of this invention is an adjustable support platform. The height of the support plate can be adjusted by manually rotating a handwheel, accommodating vacuum tubes of different sizes and types, thus improving the applicability of the packaging system. Secondly, considering the varying lengths of the vacuum tubes, the adjustable support platform can be extended, further enhancing the flexibility of the packaging system.

[0029] Finally, the ultra-high vacuum pipeline packaging system disclosed in this invention has the characteristics of high integration and good controllability. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below.

[0031] Figure 1 A framework diagram of an ultra-high vacuum pipe packaging system and method provided by the present invention;

[0032] Figure 2 A packaging flowchart of an ultra-high vacuum pipeline packaging system and method provided by the present invention;

[0033] Figure 3 A spherical ultra-high vacuum voltage stabilizing cavity structure diagram for an ultra-high vacuum pipeline packaging system and method provided by the present invention;

[0034] Figure 4 A transition cavity structure diagram of an ultra-high vacuum pipeline packaging system and method provided by the present invention;

[0035] Figure 5 A structural diagram of the gas-filling cavity of an ultra-high vacuum pipeline encapsulation system and method provided by the present invention;

[0036] Figure 6 The diagram shows the structure of the encapsulation joint flange of the encapsulation system and method for ultra-high vacuum pipelines provided by this invention.

[0037] Figure label:

[0038] 1. Spherical ultra-high vacuum stabilizing chamber; 101. Fifth interface of spherical stabilizing chamber; 102. Third interface of spherical stabilizing chamber; 103. First interface of spherical stabilizing chamber; 104. Base of spherical stabilizing chamber; 105. Fourth interface of spherical stabilizing chamber; 106. Second interface of spherical stabilizing chamber; 2. Transition chamber; 201. First interface of transition chamber; 202. Second interface of transition chamber; 203. Third interface of transition chamber; 204. Fourth interface of transition chamber; 3. Gas filling chamber; 301. First interface of gas filling chamber; 302. Second interface of gas filling chamber; 303. Third interface of gas filling chamber; 4. Sealing connector flange; 401. Sealing connector. Detailed Implementation

[0039] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0040] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0041] In the description of this invention, terms such as greater than, less than, exceeding, and better than are understood to exclude the stated number.

[0042] In the description of this invention, it should be understood that specific data descriptions, such as 10 Pa, 1 × 10⁻⁶, are involved. -3 Pa, 1×10 -5 Pa, 1×10 -8 Pa et al. are merely specific descriptions of one aspect of the present invention, and any modifications to technical parameters within the scope of the method of the present invention are within the protection scope of the present invention.

[0043] In the description of this invention, unless otherwise explicitly defined, terms such as setting, installing, assembling, and connecting should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0044] Please refer to the following: Figures 1 to 6 The encapsulation system and method for ultra-high vacuum pipelines provided in the embodiments of the present invention will now be described.

[0045] like Figures 1 to 6As shown, the ultra-high vacuum pipeline encapsulation system of this invention includes a spherical ultra-high vacuum pressure stabilizing chamber 1, a transition chamber 2, a gas filling chamber 3, an encapsulation connector flange 4, a data acquisition and control unit, a high-temperature baking unit, a vacuum pumping unit, a protective gas source, and an adjustable support platform. The first interface 103 of the spherical pressure stabilizing chamber is connected to the first interface 201 of the transition chamber, and the second interface 202 of the transition chamber is connected to the first interface 301 of the gas filling chamber via a first vacuum gate valve and a second vacuum gate valve, respectively. The second interface 302 of the gas filling chamber is connected to the encapsulation connector flange 4. During encapsulation, the vacuum pipeline is connected to the encapsulation connector flange 4, and the height of the adjustable support platform is adjusted according to the height of the vacuum pipeline to stably support the vacuum pipeline for the encapsulation operation.

[0046] The working method of the ultra-high vacuum pipe packaging system disclosed in this invention is as follows: Figure 2 As shown: Ultra-high vacuum (better than 1×10⁻⁶) is obtained by using a vacuum pumping unit and a high-temperature baking unit. -8 (Pa), and in conjunction with a protective gas source, the vacuum pipeline is sealed. When the pressure inside the vacuum pipeline reaches the sealing pressure requirement, the brass section at the front end of the sealing pipeline is clamped off to achieve sealing. Specifically, the steps include:

[0047] S1: After the ultra-high vacuum sealing system at the front end of the vacuum pipeline is debugged, connect the four vacuum pipelines to the sealing joint flange 4 as a group, open the first vacuum gate valve and the second vacuum gate valve, and run the fore-pump to pre-pump the vacuum chamber. When the vacuum degree reaches below 10Pa, start the No. 1 molecular pump and the No. 2 molecular pump.

[0048] S2: When the pressure inside the vacuum chamber is below 1×10 -3 After Pa, the baking unit is opened through the data acquisition and control unit to perform high-temperature baking and degassing;

[0049] S3: When the vacuum degree is better than 1×10 -5 After Pa, turn off molecular pumps No. 1 and No. 2, and turn on the NEG pump and sputtering ion pump to degas together until the vacuum level is better than 1×10⁻⁶. -8 Pa;

[0050] S4: Close the second vacuum gate valve and open the inflation valve so that the protective gas source enters the vacuum pipeline through the third inflation chamber interface 303;

[0051] S5: When the pressure transmitter reading on the gas source inlet pipe reaches the upper limit of the sealing pressure, close the protective gas source charging valve and clamp the brass tube at the front end of the vacuum pipeline to achieve sealing.

[0052] S6: Install another set of vacuum pipes, close the first vacuum gate valve, open the second vacuum gate valve, start the fore-pump to pre-pump the transition chamber 2, the gas filling chamber 3 and the vacuum pipes, and start the second molecular pump when the vacuum degree reaches below 10Pa.

[0053] S7: When the cold cathode gauge reading is better than 1×10 -5 After Pa, open the first vacuum gate valve and use the NEG pump and sputtering ion pump together to remove gas until the vacuum level is better than 1×10⁻⁶. -8 Pa;

[0054] S8: Repeat S4 and subsequent operations to achieve efficient continuous encapsulation of the vacuum pipeline.

[0055] For example, to ensure that the packaging system obtains an ultra-high vacuum environment (vacuum degree better than 1×10⁻⁶), -8 Pa), as in the embodiments of the present invention Figure 3 The spherical ultra-high vacuum stabilizing cavity 1 shown is as follows: Figure 4 The transition cavity 2 shown and as shown Figure 5 The outer wall of the gas filling chamber 3 shown is wrapped with a high-temperature heating unit, and the outer layer of the high-temperature heating unit is covered with a heat insulation layer. On the one hand, high-temperature baking is used for degassing during evacuation; on the other hand, it can make the baking temperature uniform and the baking power consumption low. In addition, the spherical ultra-high vacuum stabilizing chamber 1 provides two types of interfaces: one type is the fifth interface 101 of the spherical stabilizing chamber for connecting the hot cathode vacuum gauge; the other type is the second interface 106, the third interface 102, and the fourth interface 105 of the spherical stabilizing chamber for connecting the vacuum pumping unit. The fifth interface 101 of the spherical stabilizing chamber is located inside the spherical stabilizing chamber base 104. The second interface 106 of the spherical stabilizing chamber is connected to a molecular pump No. 1 and a backing pump for rough pumping and high vacuum pumping. The third interface 102 of the spherical stabilizing chamber is connected to an NEG pump to obtain ultra-high vacuum. The fourth interface 105 of the spherical stabilizing chamber is connected to a sputtering ion pump as a maintenance pump. The transition cavity is a four-way valve, with the third interface 203 used to connect to the cold cathode gauge; the fourth interface 204 used to connect the second molecular pump and the forepump.

[0056] For example, considering the stability and reliability of the packaging system, the present invention provides two molecular pumps, which are respectively connected to the spherical vacuum stabilizing chamber 1 and the transition chamber 2. A connecting pipeline is provided between the two molecular pumps. When one of the molecular pumps 1 and 2 fails and stops for maintenance, the valve of the connecting pipeline can be opened, and the other external molecular pump can maintain normal gas pumping, so as not to affect the operation of the packaging system.

[0057] For example, simultaneously encapsulating four slender vacuum pipes as a group can further achieve high-efficiency encapsulation. Additionally, the four encapsulation connectors 401 on the encapsulation flange 4 are arranged vertically, facilitating support for the vacuum pipes and making the system compact. Figure 6 As shown.

[0058] For example, to improve the applicability of the packaging system, the support for the vacuum tube being packaged is an adjustable support platform. The height of the support platform can be adjusted by manually rotating a handwheel, accommodating vacuum tubes of different shapes and improving the applicability of the packaging system. Secondly, considering the varying lengths of the packaged vacuum tubes, the adjustable support platform can be extended to further enhance the flexibility of the packaging system.

[0059] For example, the data acquisition and control unit is integrated into a single module device, whose functions include displaying vacuum level, baking control, valve opening and closing, and pump start and stop. This enables the disclosed ultra-high vacuum pipeline packaging system to have high integration and good interoperability.

[0060] For example, the transition cavity 2 is connected to the cold cathode gauge, which can effectively prevent the gauge tube from melting or burning when the transition cavity 2 is punctured, and further ensure the stable operation of the packaging system.

[0061] In summary, the packaging system and method for ultra-high vacuum pipes provided by this invention have the following advantages compared with the prior art:

[0062] This invention addresses a gap in existing technology by proposing a method for achieving stable and reliable ultra-high vacuum (better than 1×10⁻⁶) operation of slender vacuum pipes in ultra-high vacuum environments. -8 A high-efficiency, continuous packaging system and method under Pa) conditions.

[0063] Specifically, by directly connecting the spherical ultra-high vacuum stabilizing chamber 1, the transition chamber 2, and the gas filling chamber 3, the following advantages are achieved: First, the flow conductance of the vacuum pumping unit during evacuation of the vacuum chamber is effectively improved, enabling the vacuum pipe opening to quickly reach the base vacuum level for packaging. Second, the gas filling and packaging space is minimized, reducing the loss of protective gas source and saving packaging costs. Third, vacuum differential is achieved for each chamber, requiring only the transition chamber 2 and the gas filling chamber 1 to be evacuated during the next packaging, while the spherical ultra-high vacuum stabilizing chamber 1 remains in an ultra-high vacuum state. Once the preset vacuum level is reached, the vacuum gate valve is opened, and the three-chamber direct-connection packaging is then performed, greatly reducing the vacuuming time and improving the working efficiency of the packaging system.

[0064] Secondly, considering the stability and reliability of the packaging system, the present invention is equipped with two molecular pumps, which are respectively connected to the spherical vacuum stabilizing chamber 1 and the transition chamber 2. A connecting pipeline is provided between the two molecular pumps. When one of the molecular pumps fails and stops for maintenance, the valve of the connecting pipeline can be opened, and the other standby molecular pump can maintain normal gas pumping, so as not to affect the operation of the packaging system.

[0065] Furthermore, the vacuum pipe encapsulation system provided by this invention can simultaneously encapsulate four pipes in a group, further improving encapsulation efficiency. The four encapsulation connectors 401 are distributed vertically, making the connected vacuum pipes divided into two layers, which facilitates support and makes the system compact.

[0066] Furthermore, the packaging vacuum pipe support of the present invention is an adjustable support platform. The height of the support plate can be adjusted by manually rotating a handwheel, accommodating packaging vacuum pipes of different sizes and types, thus improving the applicability of the packaging system. Secondly, considering the varying lengths of the packaging vacuum pipes, the adjustable support platform can be extended, further enhancing the flexibility of the packaging system.

[0067] Finally, the ultra-high vacuum pipeline packaging system disclosed in this invention has the characteristics of high integration and good controllability.

[0068] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A packaging system for an ultra-high vacuum pipeline, characterized in that, The system includes a spherical ultra-high vacuum stabilizing chamber, a transition chamber, a gas filling chamber, a sealing connector flange, a data acquisition and control unit, a high-temperature baking unit, a vacuum pumping unit, a gas source, and an adjustable support platform. The first interface of the spherical ultra-high vacuum stabilizing chamber is connected to the first interface of the transition chamber, and the second interface of the transition chamber is connected to the first interface of the gas filling chamber via a first vacuum gate valve and a second vacuum gate valve, respectively. The second interface of the gas filling chamber is connected to the sealing connector flange. During sealing, the vacuum pipe to be sealed is connected to the sealing connector of the sealing connector flange, and the height of the adjustable support platform is adjusted according to the height of the vacuum pipe to stably support the vacuum pipe for the sealing operation. The spherical ultra-high vacuum stabilizing cavity, the transition cavity, and the outer wall of the gas filling cavity are wrapped with the high-temperature baking unit, and the high-temperature baking unit is covered with a heat insulation layer. The vacuum pumping unit includes a No. 1 molecular pump, a No. 2 molecular pump, a forepump, an NEG pump, and a sputtering ion pump. The spherical ultra-high vacuum stabilizing cavity provides two types of interfaces: one is the fifth interface of the spherical stabilizing cavity for connecting the hot cathode gauge; the other is the second, third, and fourth interfaces of the spherical stabilizing cavity for connecting the vacuum pumping unit. The second interface of the spherical stabilizing cavity connects the No. 1 molecular pump and the foreboard pump for rough pumping and high vacuum pumping. The third interface of the spherical stabilizing cavity connects to the NEG pump to obtain ultra-high vacuum. The fourth interface of the spherical stabilizing cavity connects to the sputtering ion pump as a sustaining pump.

2. The packaging system for an ultra-high vacuum pipeline according to claim 1, characterized in that, The transition cavity is a four-way valve, with the third interface of the transition cavity used to connect to the cold cathode gauge; the fourth interface of the transition cavity is used to connect the second molecular pump and the forepump.

3. The packaging system for an ultra-high vacuum pipeline according to claim 1, characterized in that, A connecting pipeline is provided between the No. 1 molecular pump and the No. 2 molecular pump. When one of the molecular pumps fails and stops, the valve of the connecting pipeline is opened and the failed molecular pump is shut down, while the other molecular pump maintains normal gas pumping.

4. The packaging system for an ultra-high vacuum pipeline according to claim 1, characterized in that, The encapsulation connector flange has four encapsulation connectors for connecting the encapsulated vacuum pipe; and the four encapsulation connectors are distributed vertically, so that the connected vacuum pipe is divided into two layers.

5. The packaging system for an ultra-high vacuum pipeline according to claim 1, characterized in that, The adjustable support platform can be adjusted by manually rotating a handwheel to accommodate vacuum pipes of different shapes.

6. The packaging system for an ultra-high vacuum pipeline according to claim 1, characterized in that, The data acquisition and control unit is integrated into a single module device, whose functions include displaying vacuum level, baking control, valve opening and closing, and pump start and stop.

7. A method for encapsulating an ultra-high vacuum pipe, comprising encapsulating the pipe using an encapsulation system as described in any one of claims 1-6, characterized in that, The method includes the following steps: S1: After the ultra-high vacuum sealing system at the front end of the vacuum pipeline is debugged, connect the four vacuum pipelines to the sealing joint flange in a group, open the first vacuum gate valve and the second vacuum gate valve, and run the fore-pump to pre-pump the vacuum chamber composed of the ultra-high vacuum stabilizing chamber, the transition chamber and the gas filling chamber. When the vacuum degree reaches below 10 Pa, start the No. 1 molecular pump and the No. 2 molecular pump. S2: When the pressure inside the vacuum chamber is lower than 1×10 -3 After Pa, the high-temperature baking unit is opened through the data acquisition and control unit to perform high-temperature baking and degassing. S3: When the vacuum degree is better than 1×10 -5 After Pa, turn off molecular pumps No. 1 and No. 2, and turn on the NEG pump and sputtering ion pump to degas together until the vacuum level is better than 1×10⁻⁶. -8 Pa; S4: Close the second vacuum gate valve and open the inflation valve between the protective gas source and the inflation chamber, so that the protective gas source enters the vacuum pipeline through the third interface of the inflation chamber. S5: When the pressure transmitter reading on the gas source inlet pipe reaches the upper limit of the sealing pressure, close the protective gas source charging valve and clamp the brass tube at the front end of the vacuum pipeline to achieve sealing. S6: Install another set of vacuum pipes, close the first vacuum gate valve, open the second vacuum gate valve, start the fore-pump to pre-pump the transition chamber, the gas filling chamber and the vacuum pipes, and start the second molecular pump when the vacuum level reaches below 10 Pa. S7: When the reading of the cold cathode gauge is better than 1×10 -5 After Pa, open the first vacuum gate valve and use the NEG pump and sputtering ion pump together to remove gas until the vacuum level is better than 1×10⁻⁶. -8 Pa; S8: Repeat S4 and subsequent operations to achieve efficient continuous packaging.

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