A method for manufacturing a half-matrix

Abstract

The present application relates to a kind of special manufacturing method of half-hole plate, according to the following steps S1: pretreatment, S2: plug hole processing, S3: print first solder resist A surface oil, S4: first pre-baking, S5: print first solder resist B surface oil, S6: second pre-baking, S7: first exposure, development, S8: first inspection, S9: post-curing treatment, S10: cleaning treatment, S11: print second solder resist A surface oil, S12: third pre-baking, S13: print second solder resist B surface oil, S14: fourth pre-baking, S15: second exposure, development, S16: second inspection.The present application is creatively used "aluminum sheet screen plug hole+underlay white paper, special air guide plate+77T block point screen printing first solder resist surface oil, post-curing, 77T empty screen printing second solder resist surface oil" special half-hole plate manufacturing method, solve the technical problem of false copper and half-hole wall residual ink of through hole.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and more particularly to a method for manufacturing a half-hole board. Background Technology

[0002] For rigid PCBs with pre-riveted half-holes, the solder mask process presents significant challenges due to the fact that the edges of the SET (a panel of several units assembled together) are all pre-riveted half-holes: there are no support points around the unit, making it impossible to use double-sided printing simultaneously, and the vias may have pseudo-exposed copper (e.g., Figure 1 (as shown) and residual ink on the walls of the semi-holes (such as) Figure 2 (As shown) has become the focus of the industry. There are currently three main printing methods: 1. Traditional printing method: pre-treatment → aluminum sheet plugging + white paper suction for each board → pre-baking → printing the first side → pre-baking → printing the second side → pre-baking → exposure → development → inspection. In this method, when white paper is suctioned after plugging the holes, some of the ink that has been plugged in the holes will be carried out. After pre-baking, the ink shrinks, which means that when printing the second side, the surface ink cannot completely cover the severely shrunken holes, resulting in dotted pseudo-exposed copper and reddish spots at the hole openings. 2. Blank Screen Printing Method: Because the product unit has open areas around it, during blank screen printing, ink on the screen corresponding to the open areas on the board surface will seep into the holes due to the printing pressure. It cannot be completely washed away during development, and filamentous solder resist ink will remain on the hole walls. To ensure that the ink inside the holes is completely developed, a second development operation may be performed. This operation can cause the solder resist bridges between IC pins to be overdeveloped and fall off, and the ink inside the holes may not be completely developed. During customer placement, there is a risk of short circuits and open circuits in the components.

[0003] 3.43T or 36T dot-matrix printing method: Due to the small spacing between the half-hole and the lines of different networks in some products, the ink on the lines is not completely covered, which can cause the lines to appear abnormally red.

[0004] To overcome the aforementioned problems, we have invented a method for manufacturing a semi-perforated plate. Summary of the Invention

[0005] The purpose of this invention is to solve the problems of pseudo-exposed copper in vias and residual ink on the walls of half-holes in existing pre-soldered half-hole PCBs during the solder mask process, as well as the shortcomings of the three existing printing methods. The specific solution is as follows: A method for manufacturing a semi-perforated plate, comprising the following steps: Step 1, Pre-treatment: Remove oxidation and stains from the PCB board surface and increase the roughness of the copper surface; Step 2, via plugging: Add solder resist via plugging ink to the aluminum stencil, and then plug the vias of the PCB board by printing. When plugging, a piece of white paper larger than the size of the PCB board needs to be placed under each PCB board. Step 3, Print the first solder mask A-side surface coating: Place the special air guide plate on the printing machine worktable, with the PCB board A-side facing up on the special air guide plate, and use a 77T dot screen to print the first solder mask A-side surface coating. During printing, some of the surface coating enters into the plug holes, making the ink in the plug holes more full. The 77T dot screen blocks the half-hole area of ​​the PCB board and does not print surface coating. Step 4, First Pre-baking: The PCB board with the first solder mask A side printed is pre-cured. Pre-baking parameters: 75℃*20min; Step 5, Print the first solder mask B-side surface oil: Place the PCB board with the B-side facing up on the printing machine table, and use a 77T dot screen to print the second solder mask B-side surface oil. During printing, some of the surface oil enters into the plug holes, making the ink in the plug holes more full. The 77T dot screen blocks the half-hole area of ​​the PCB board and does not print surface oil. Step 6, Second pre-bake: Pre-cur the PCB board with the first solder mask B side printed on it. Pre-bake parameters: 75℃*30min; Step 7, First Exposure and Development: Use film to expose the ink on the PCB board surface to ultraviolet light to cure it, and use alkaline solution to develop the copper traces and pads on the PCB board. Step 8, First Inspection: This step focuses on inspecting for oil entering half-holes and incomplete development. Step 9, Post-curing treatment: Completely cure the first solder resist ink. Post-baking parameters: 80℃*30min+90℃*30min+110℃*30min+130℃*30min+150℃*10min; Step 10, Cleaning process: The PCB board is subjected to acid washing, water washing and drying processes respectively; Step 11, Print the second solder resist A-side surface oil: Use a 77T blank screen to print the second solder resist A-side surface oil, increase the overall thickness of the solder resist ink, and at the same time make up for the part of the half hole position that was not printed due to obstruction, so that the entire board surface is covered with ink evenly. Step 12, Third Pre-baking: Pre-cur the PCB board with the second solder mask ink printed on side A. Pre-baking parameters: 75℃*20min; Step 13, Print the second solder resist B-side surface coat: Use a 77T blank screen to print the second solder resist B-side surface coat, increase the overall thickness of the solder resist ink, and at the same time make up for the part of the half hole position that was not coated with ink due to obstruction, so that the entire board surface is covered with ink evenly. Step 14, Fourth Pre-baking: Pre-cur the PCB board with the second solder mask ink printed on the B side. Pre-baking parameters: 75℃*30min; Step 15, Second Exposure and Development: Using film exposed to ultraviolet light, the ink on the PCB board surface is photocured, and the copper traces and pads on the PCB board are created by developing with alkaline solution. Step 16, Second Inspection: This time, a comprehensive solder mask inspection is performed on half-holes with solder mask, incomplete development, red-hot circuits, and red-hot vias. After the inspection is OK, the board is released to the next process.

[0006] Furthermore, before the hole plugging process in step 2, holes are drilled on the aluminum stencil corresponding to the locations on the PCB board VIA holes that need to be plugged, according to the customer's requirements for plugging the PCB board VIA holes.

[0007] Furthermore, after the hole-filling process in step 2, the standard for hole filling is that the ink is applied evenly to the hole-filling positions on the entire sheet of white paper when visually inspected.

[0008] Furthermore, the method for manufacturing the special air guide plate in step 3 is as follows: a PCB substrate material is used to make a fixing hole, and a fixing hole with a diameter of 1.5mm is drilled on the PCB substrate at the location where the PCB board VIA hole needs to be plugged.

[0009] Furthermore, the design method for the half-hole blocking dots of the 77T blocking dot mesh used in steps 3 and 5 is as follows: half-hole blocking dots are set on the 77T blocking dot mesh corresponding to the half-hole positions on the A and B sides of the PCB board, respectively. The half-hole blocking dots are formed by coating the photosensitive paste onto the entire 77T blocking dot mesh and then performing semi-curing, film exposure, and development processes.

[0010] Furthermore, the hole of the half-hole blocking point is 10mil larger on one side than the half-hole on the A and B sides of the PCB board.

[0011] Furthermore, after the hole-filling process in step 2 is completed, the first solder resist A-side surface oil is printed directly in step 3 without pre-baking.

[0012] Furthermore, before printing the second solder resist A-side surface oil in step 11, a piece of white paper needs to be placed on the A-side of the PCB board and solder resist surface oil needs to be printed on the white paper first to prevent ink from accumulating on the empty mesh at the corresponding position of the half hole and entering the half hole. Then the white paper is removed.

[0013] Furthermore, before printing the second solder resist B-side surface oil in step 13, a piece of white paper needs to be placed on the B-side of the PCB board and solder resist surface oil needs to be printed on the white paper first to prevent ink from accumulating on the empty mesh at the corresponding position of the half hole and entering the half hole. Then the white paper is removed.

[0014] Furthermore, when printing the second solder resist in steps 11 and 13, the thickness of the solder resist on the PCB board is controlled to be less than the thickness of the solder resist when printing the first solder resist in steps 3 and 5, respectively.

[0015] In summary, the technical solution of the present invention has the following beneficial effects: This invention solves the problems of pseudo-exposed copper in the through-holes and residual ink on the half-hole walls in the solder mask process of existing pre-riveted half-hole PCBs, as well as the shortcomings of the three existing printing methods. This innovative solution employs a semi-hole board manufacturing method involving "aluminum sheet screen printing with hole plugging + underlay of white paper, a dedicated air guide plate + 77T screen printing for the first solder resist, post-curing, and 77T screen printing for the second solder resist." Mass production verification shows that the traditional method (existing technology) resulted in a 12.60% defect rate (36.51% for semi-hole solder resist and 28.57% for via reddening) and a 87.40% yield. In contrast, this optimized solution achieved a mere 4.40% defect rate (0% for semi-hole solder resist and 0% for via reddening) and a 95.60% yield. This demonstrates the significant effectiveness of this solution in addressing the technical problems of "false copper exposure in vias (i.e., via reddening) and residual ink on the semi-hole walls (i.e., semi-hole solder resist)." In this solution, the pretreatment improves the adhesion of the solder resist ink to the board surface. In step 3, a special air guide plate is placed between the underside of the PCB board and the printing press table, allowing direct printing of the A-side solder resist without pre-baking, preventing the via-filling ink from adhering to the air guide plate and the table. The second printing of the solder resist using a 77T screen prints a second layer, increasing the overall thickness of the solder resist ink and compensating for any areas where ink was not applied due to obstruction at half-hole locations, ensuring uniform ink coverage across the entire board. This solution includes a five-stage post-curing process, preventing ink corrosion and damage (e.g., preventing solder resist ink from peeling off between IC pins). The first... The printing dot screen design is 10mil larger than the single side of the half-hole, which solves the problem of printing alignment difficulty. At the same time, ink will not enter the half-hole. Since the first printing has already prepared the bottom layer of ink on the board surface, the second printing only requires a light layer of ink to be covered by a 77T open screen. This improves the problem of reddish lines on the hole edge caused by the dot screen and the problem of ink entering the hole due to the large amount of ink applied in one printing. Before printing the second solder mask, place a piece of white paper on the PCB board and print the solder mask on the white paper first. This can effectively prevent ink from accumulating on the open screen at the corresponding position of the half-hole and entering the half-hole. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only a part of the embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort. Figure 1 This is a schematic diagram of pseudo-exposed copper in vias (i.e., reddening of VIA vias) in the background art, with the arrow pointing to the defective area; Figure 2 This is a schematic diagram of residual ink on the wall of a half-hole (i.e., ink entering the half-hole) in the background art. The arrow points to the defective part, and the half-hole in the figure is a cross-section. Figure 3 This is a flowchart of a method for manufacturing a semi-perforated plate according to the present invention; Figure 4 A schematic diagram illustrating the via-free red color of a PCB board produced by the method of the present invention; Figure 5 This is a schematic diagram of the method of the present invention for producing PCB boards without half-hole oil inlet, where the half-hole is shown in cross-section. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0018] Technical parameter explanation: In the background technology, "43T or 36T dotted mesh" means that 43T has 43 mesh openings per inch and 36T has 36 mesh openings per inch. In this solution, "77T dotted mesh" and "77T empty mesh" mean that 77T has 77 mesh openings per inch. The more mesh openings per inch, the denser the mesh.

[0019] like Figure 3 As shown, a method for manufacturing a semi-perforated plate is carried out according to the following steps: S1, Pretreatment: Remove oxidation and stains from the PCB board surface and increase the roughness of the copper surface; S2, Via plugging treatment: Add solder resist and via plugging ink to the aluminum stencil, and then plug the PCB board vias by printing. When plugging vias, a piece of white paper larger than the size of the PCB board needs to be placed under each PCB board. S3, Printing the first solder mask A-side surface oil: Place the special air guide plate on the printing machine worktable, with the PCB board A-side facing up on the special air guide plate, and use a 77T dot screen to print the first solder mask A-side surface oil. During printing, some of the surface oil enters into the plug hole, making the ink in the plug hole more full. The 77T dot screen blocks the half-hole area of ​​the PCB board and does not print surface oil. S4, First Pre-baking: The PCB board with the first solder mask A side printed is initially semi-cured. Pre-baking parameters: 75℃*20min; S5, Printing the first solder mask B-side surface oil: Place the PCB board with the B-side facing up on the printing machine table, and use a 77T dot screen to print the second solder mask B-side surface oil. During printing, some of the surface oil enters into the plug holes, making the ink in the plug holes more saturated. The 77T dot screen blocks the half-hole area of ​​the PCB board from printing surface oil. S6, Second pre-bake: The PCB board with the first solder mask B-side surface oil printed is initially semi-cured. Pre-bake parameters: 75℃*30min. S7, First Exposure and Development: Using film and ultraviolet light source for exposure, the ink on the PCB board surface is photocured, and the copper traces and pads on the PCB board are made by developing with alkaline solution. S8, First Inspection: This inspection will focus on oil entry into half-holes and incomplete development. S9, Post-curing treatment: Completely cure the first solder resist ink. Post-baking parameters: 80℃*30min+90℃*30min+110℃*30min+130℃*30min+150℃*10min. S10, Cleaning process: The PCB board is subjected to pickling, washing and drying processes respectively; S11, Printing the second solder resist A-side surface oil: Use 77T blank screen to print the second solder resist A-side surface oil, increase the overall thickness of the solder resist ink, and at the same time make up for the part that was not printed due to the obstruction at the half hole position, so that the ink is evenly covered on the entire board surface. S12, Third Pre-baking: The PCB board with the second solder mask ink printed on side A is pre-cured. Pre-baking parameters: 75℃*20min; S13, Printing the second solder resist B-side surface oil: Use 77T blank screen to print the second solder resist B-side surface oil, increase the overall thickness of the solder resist ink, and at the same time make up for the part that was not printed due to the obstruction at the half hole position, so that the ink is evenly covered on the entire board surface. S14, Fourth Pre-baking: The PCB board with the second solder mask ink printed on the B side is pre-cured. Pre-baking parameters: 75℃*30min. S15, Second exposure and development: Using film to expose to ultraviolet light, the ink on the PCB board is photocured, and the copper traces and pads on the PCB board are made by developing with alkaline solution. S16, Second Inspection: This time, a comprehensive solder mask inspection is performed on half-holes with oil, incomplete development, red-hot circuits, and red-hot vias. After the inspection is OK, the board is released to the next process.

[0020] Specifically, before the hole plugging process in S2, holes are drilled on the aluminum stencil corresponding to the locations on the PCB board where the VIA holes need to be plugged, based on the customer's requirements for plugging the VIA holes on the PCB board.

[0021] Specifically, after the hole-filling process in S2, the standard for hole filling is that the ink is applied evenly to the hole-filling positions on the entire sheet of white paper when visually inspected.

[0022] Specifically, the method for manufacturing the special air guide plate in S3 is as follows: a PCB substrate material is used to make a fixing hole, which is drilled on the part of the PCB substrate corresponding to the VIA hole of the PCB board that needs to be plugged. The diameter of the fixing hole is 1.5mm.

[0023] Specifically, the half-hole blocking design method of the 77T blocking mesh used in S3 and S5 is as follows: half-hole blocking points are set on the 77T blocking mesh corresponding to the half-hole positions on the A and B sides of the PCB board, respectively. The half-hole blocking points are formed by coating the photosensitive emulsion onto the entire 77T blocking mesh and then going through the semi-curing, film exposure, and development processes.

[0024] Specifically, the hole at the half-hole blocking point is 10mil larger on one side than the half-hole on side A and side B of the PCB board.

[0025] Specifically, after the via plugging process of S2 is completed, the first solder mask A-side surface oil is printed directly in S3 without pre-baking.

[0026] Specifically, before printing the second solder mask A-side surface oil in S11, a piece of white paper needs to be placed on the A-side of the PCB board and solder mask surface oil needs to be printed on the white paper first to prevent ink from accumulating on the empty mesh at the corresponding position of the half hole and entering the half hole. Then the white paper is removed.

[0027] Specifically, before printing the second solder mask B-side surface oil in S13, a piece of white paper needs to be placed on the B-side of the PCB board and solder mask surface oil needs to be printed on the white paper first to prevent ink from accumulating on the empty mesh at the corresponding position of the half hole and entering the half hole. Then the white paper is removed.

[0028] Specifically, when printing the second solder resist in S11 and S13, the thickness of the solder resist on the PCB board is controlled to be less than the thickness of the solder resist when printing the first solder resist in S3 and S5, respectively.

[0029] Mass production verification showed that the defect rate of PCB boards produced using the traditional method (i.e., the existing technology) was 12.60% (of which the defect rate for half-hole ink penetration was 36.51% and the defect rate for via reddening was 28.57%), and the yield rate was 87.40%. In contrast, the defect rate using this solution (i.e., the optimized production method) was only 4.40% (of which the defect rate for half-hole ink penetration was 0% and the defect rate for via reddening was 0%), and the yield rate was 95.60%. Specific comparative test data are shown in the table below.

[0030] The effectiveness of this solution in addressing the technical problems of "false copper exposure in vias (i.e., via glowing red) and residual ink on the walls of half-holes (i.e., ink penetration into half-holes)" is highly significant. This invention eliminates the issue of via glowing red. Figure 4 As shown, the present invention has no semi-hole oil inlet as... Figure 5 As shown.

[0031] In summary, the technical solution of the present invention has the following beneficial effects: This invention solves the problems of pseudo-exposed copper in the through-holes and residual ink on the half-hole walls in the solder mask process of existing pre-riveted half-hole PCBs, as well as the shortcomings of the three existing printing methods. This innovative solution employs a semi-hole board manufacturing method involving "aluminum sheet screen printing with hole plugging + underlay of white paper, a dedicated air guide plate + 77T screen printing for the first solder resist, post-curing, and 77T screen printing for the second solder resist." Mass production verification shows that the traditional method (existing technology) resulted in a 12.60% defect rate (36.51% for semi-hole solder resist and 28.57% for via reddening) and a 87.40% yield. In contrast, this optimized solution achieved a mere 4.40% defect rate (0% for semi-hole solder resist and 0% for via reddening) and a 95.60% yield. This demonstrates the significant effectiveness of this solution in addressing the technical problems of "false copper exposure in vias (i.e., via reddening) and residual ink on the semi-hole walls (i.e., semi-hole solder resist)." In this solution, the pretreatment improves the adhesion of the solder resist ink to the board surface. In step 3, a special air guide plate is placed between the underside of the PCB board and the printing press table, allowing direct printing of the A-side solder resist without pre-baking, preventing the via-filling ink from adhering to the air guide plate and the table. The second printing of the solder resist using a 77T screen prints a second layer, increasing the overall thickness of the solder resist ink and compensating for any areas where ink was not applied due to obstruction at half-hole locations, ensuring uniform ink coverage across the entire board. This solution includes a five-stage post-curing process, preventing ink corrosion and damage (e.g., preventing solder resist ink from peeling off between IC pins). The first... The printing dot screen design is 10mil larger than the single side of the half-hole, which solves the problem of printing alignment difficulty. At the same time, ink will not enter the half-hole. Since the first printing has already prepared the bottom layer of ink on the board surface, the second printing only requires a light layer of ink to be covered by a 77T open screen. This improves the problem of reddish lines on the hole edge caused by the dot screen and the problem of ink entering the hole due to the large amount of ink applied in one printing. Before printing the second solder mask, place a piece of white paper on the PCB board and print the solder mask on the white paper first. This can effectively prevent ink from accumulating on the open screen at the corresponding position of the half-hole and entering the half-hole.

[0032] The embodiments described above do not constitute a limitation on the scope of protection of this technical solution. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the above embodiments should be included within the scope of protection of this technical solution.

Claims

1. A method for manufacturing a semi-perforated plate, characterized in that, Follow these steps: Step 1, Pre-treatment: Remove oxidation and stains from the PCB board surface and increase the roughness of the copper surface; Step 2, via plugging: Add solder resist via plugging ink to the aluminum stencil, and then plug the vias of the PCB board by printing. When plugging, a piece of white paper larger than the size of the PCB board needs to be placed under each PCB board. Step 3, Print the first solder mask A-side surface coating: Place the special air guide plate on the printing machine worktable, with the PCB board A-side facing up on the special air guide plate, and use a 77T dot screen to print the first solder mask A-side surface coating. During printing, some of the surface coating enters into the plug holes, making the ink in the plug holes more full. The 77T dot screen blocks the half-hole area of ​​the PCB board and does not print surface coating. Step 4, First Pre-baking: The PCB board with the first solder mask A side printed is pre-cured; Step 5, Print the first solder mask B-side surface oil: Place the PCB board with the B-side facing up on the printing machine table, and use a 77T dot screen to print the second solder mask B-side surface oil. During printing, some of the surface oil enters into the plug holes, making the ink in the plug holes more full. The 77T dot screen blocks the half-hole area of ​​the PCB board and does not print surface oil. Step 6, Second pre-baking: Pre-curing the PCB board with the first solder mask B-side printed on it; Step 7, First Exposure and Development: Use film to expose the ink on the PCB board surface to ultraviolet light to cure it, and use alkaline solution to develop the copper traces and pads on the PCB board. Step 8, First Inspection: This step focuses on inspecting for oil entering half-holes and incomplete development. Step 9, Post-curing treatment: Completely cure the first solder resist ink; Step 10, Cleaning process: Clean the PCB boards separately; Step 11, Print the second solder resist A-side surface oil: Use a 77T blank screen to print the second solder resist A-side surface oil, increase the overall thickness of the solder resist ink, and at the same time make up for the part of the half hole position that was not printed due to obstruction, so that the entire board surface is covered with ink evenly. Step 12, Third Pre-baking: Pre-curing the PCB board with the second solder mask ink printed on side A; Step 13, Print the second solder resist B-side surface coat: Use a 77T blank screen to print the second solder resist B-side surface coat, increase the overall thickness of the solder resist ink, and at the same time make up for the part of the half hole position that was not coated with ink due to obstruction, so that the entire board surface is covered with ink evenly. Step 14, Fourth Pre-baking: Pre-curing the PCB board with the second solder mask ink printed on side B; Step 15, Second Exposure and Development: Using film exposed to ultraviolet light, the ink on the PCB board surface is photocured, and the copper traces and pads on the PCB board are created by developing with alkaline solution. Step 16, Second Inspection: This time, a comprehensive solder mask inspection is performed on half-holes with solder mask, incomplete development, red-hot circuits, and red-hot vias. After the inspection is OK, the board is released to the next process.

2. The method for manufacturing a semi-perforated plate according to claim 1, characterized in that: Before the hole plugging process in step 2, holes are drilled on the aluminum stencil corresponding to the locations on the PCB board VIA holes that need to be plugged, according to the customer's requirements for plugging the VIA holes on the PCB board.

3. The method for manufacturing a semi-perforated plate according to claim 1, characterized in that, After the hole-filling process in step 2, the standard for hole filling is that the ink is applied evenly to the hole-filling positions on the entire sheet of white paper when visually inspected.

4. The method for manufacturing a semi-perforated plate according to claim 1, characterized in that, The method for manufacturing the special air guide plate in step 3 is as follows: a PCB substrate material is used to make a fixing hole, and a fixing hole with a diameter of 1.5mm is drilled on the PCB substrate at the location where the PCB board VIA hole needs to be plugged.

5. The method for manufacturing a semi-perforated plate according to claim 1, characterized in that, The half-hole blocking design method of the 77T blocking mesh used in steps 3 and 5 is as follows: half-hole blocking points are set on the 77T blocking mesh corresponding to the half-hole positions on the A and B sides of the PCB board, respectively. The half-hole blocking points are formed by coating the photosensitive paste onto the entire 77T blocking mesh and then performing semi-curing, film exposure, and development processes.

6. The method for manufacturing a semi-perforated plate according to claim 5, characterized in that: The hole of the half-hole stop is 10mil larger on one side than the half-hole on the A and B sides of the PCB board.

7. The method for manufacturing a semi-perforated plate according to claim 1, characterized in that: After the hole plugging process in step 2 is completed, step 3 can be performed directly without pre-baking to print the first solder resist A-side surface oil.

8. The method for manufacturing a semi-perforated plate according to claim 1, characterized in that: Before printing the second solder mask A-side surface coating in step 11, a piece of white paper needs to be placed on the A-side of the PCB board and solder mask surface coating is printed on the white paper first to prevent ink from accumulating on the empty mesh at the corresponding position of the half-hole and entering the half-hole. Then the white paper is removed. Before printing the second solder mask B-side surface coating in step 13, a piece of white paper needs to be placed on the B-side of the PCB board and solder mask surface coating is printed on the white paper first to prevent ink from accumulating on the empty mesh at the corresponding position of the half-hole and entering the half-hole. Then the white paper is removed.

9. The method for manufacturing a semi-perforated plate according to claim 1, characterized in that, The pre-baking parameters for the first pre-baking in step 4 and the third pre-baking in step 12 are 75℃ for 20 minutes; the pre-baking parameters for the second pre-baking in step 6 and the fourth pre-baking in step 14 are 75℃ for 30 minutes.

10. The method for manufacturing a semi-perforated plate according to claim 1, characterized in that: When printing the second solder resist in steps 11 and 13, the thickness of the solder resist on the PCB board is controlled to be less than the thickness of the solder resist when printing the first solder resist in steps 3 and 5.

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