Dewar heating and outgassing apparatus and method
CN117815713BActive Publication Date: 2026-08-28ZHEJIANG JUEXIN MICROELECTRONICS CO LTD
Patent Information
- Application Number
- CN202410019448.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-05
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2044-01-05
AI Technical Summary
Technical Problem
上述的传统零部件加热除气方法严重影响了杜瓦整个封装效率
Benefits of technology
[0030]本申请中，能方便地根据除气零件更换不同大小、不同型号的除气炉，也可以灵活控制除气装置所占空间，结构简单，便于维护。在粘接芯片后，杜瓦仍然能够通过分区加热，对胶水(含气率最大的材料)进行充分除气。胶水除气后有效提升了真空寿命的同时，且不影响芯片工作性能。本发明可同批次对不同耐热性零部件进行同批次除气，大大提高了除气炉对零部件的除气效率。通过分区加热方法，单个零件除气效果有大幅度提升，且不被同批次其它型号零部件的耐热性影响。
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Abstract
The application discloses a device and a method for Dewar heating and degassing, which comprises: a degassing furnace cavity composed of a base, a furnace wall and a furnace door, wherein the furnace wall is made of glass; a supporting component located in the degassing furnace cavity and used for fixing degassing parts; a laser located outside the degassing furnace; one or more laser heads located between the laser and the glass furnace wall and used for adjusting the beam morphology and size of the laser; and one or more galvanometer mirrors located between the laser head and the glass furnace wall and used for adjusting the irradiation position of the beam. The Dewar degassing device can perform same-batch different-temperature degassing on different heat-resistant parts or different heat-resistant materials on the same part, thereby greatly improving the degassing efficiency of the degassing furnace on the parts.
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Citation Information
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