Polishing head life detection method and device, computer device and storage medium

Abstract

The present application relates to the technical field of chemical mechanical polishing, and discloses a polishing head service life detection method and device, computer equipment and a storage medium, comprising: obtaining the use time of the to-be-detected polishing head to the current stage; determining the judgment parameter of the to-be-detected polishing head based on the use time; determining the service life stage corresponding to the to-be-detected polishing head based on the judgment parameter, which is used to determine whether the polishing head needs to be replaced. According to the use time of the to-be-detected polishing head to the current time, the present application determines the judgment parameter of the to-be-detected polishing head by using the data obtained through pressure test experiments at the use time, and then determines whether the polishing head needs to be replaced, thereby realizing accurate identification and judgment of the service life stage of the polishing head, getting rid of the dependence on artificial experience, making the judgment of the replacement time of the polishing head more accurate and reliable, saving production cost, and improving the production yield.

Description

Technical Field

[0001] This invention relates to the field of chemical mechanical polishing technology, specifically to a method, apparatus, computer equipment, and storage medium for testing the lifespan of polishing heads. Background Technology

[0002] With the rapid development of very large-scale integrated circuits (VLSI), integrated circuit manufacturing processes are becoming increasingly complex and sophisticated, placing ever higher demands on the flatness of wafer surfaces. Many existing traditional planarization processes cannot achieve global planarization. However, CMP (Chemical-Mechanical Planarization) equipment can achieve better global planarization results, making CMP a core technology in integrated circuit manufacturing for wafer surface planarization. The wafer planarization effect of CMP equipment is influenced by factors such as polishing time, polishing head pressure, polishing head usage time, polishing pad usage time, and polishing slurry flow rate type.

[0003] In current production, the lifespan of polishing heads is generally determined by manual experience, and the heads are replaced accordingly. This reliance on the tester's experience can lead to errors, such as replacing the polishing head too early or too late. If the polishing head is replaced too early, it cannot achieve its maximum effect, increasing production costs. If it is replaced too late, the wafer yield may decrease due to wear and tear on the polishing head. Therefore, manual determination of polishing head lifespan lacks accuracy and reliability, resulting in significant unnecessary production losses. Summary of the Invention

[0004] In view of this, the present invention provides a polishing head life detection method, device, computer equipment and storage medium to solve the problems of insufficient accuracy and reliability in manually identifying polishing head life and the inability to replace polishing heads in a timely manner.

[0005] In a first aspect, the present invention provides a method for detecting the lifespan of a polishing head, the method comprising:

[0006] Obtain the usage time of the polishing head under test up to the current stage;

[0007] Based on usage time, the judgment parameters of the polishing head to be tested are determined. The judgment parameters are one-to-one with the usage time and are obtained in advance based on the pressure test data of the polishing head under the usage time.

[0008] Based on the judgment parameters, the corresponding life stage of the polishing head under test is determined. The life stage is used to determine whether the polishing head needs to be replaced.

[0009] In this invention, based on the usage time of the polishing head under test up to the current moment, and by utilizing data obtained from a pressure test experiment under the pre-existing usage time, the judgment parameters of the polishing head under test are determined, thereby determining the lifespan stage of the polishing head and whether it needs to be replaced. This enables accurate identification and judgment of the polishing head's lifespan stage without the need for manual judgment, eliminating reliance on human experience. This makes the judgment of when to replace the polishing head more accurate and reliable, greatly saving production costs. Timely replacement of the polishing head helps reduce the defect rate during the production process and further improves the yield rate.

[0010] In one optional implementation, the judgment parameters of the polishing head under test are determined based on usage time, including:

[0011] Based on usage time, the current slope of the pre-fitted curve of the relationship between test time and usage time is determined for the polishing head under test at the current usage time, and the current slope is used as the judgment parameter.

[0012] In this method, by pre-fitting the relationship between test time and usage time, the slope of the current usage time of the polishing head under test at the corresponding position of the relationship curve is determined. Using the slope as a judgment parameter, the life stage of the polishing head can be accurately identified and judged.

[0013] In one optional implementation, fitting a curve showing the relationship between test time and usage time includes:

[0014] A pressure test was performed on the sample polishing head to obtain the test time for the sample polishing head to reach the target pressure from the initial state and the usage time of the sample polishing head corresponding to each test time. The sample polishing head is a polishing head of the same type as the polishing head under test.

[0015] Based on the test time and usage time, a curve showing the relationship between the test time and usage time of the sample polishing head was obtained by fitting.

[0016] In this method, by conducting experiments using a sample polishing head, a curve showing the relationship between the test time and usage time of the same sample polishing head as the polishing head under test is obtained. This facilitates the determination of the lifespan of the polishing head under test after obtaining its usage time, and thus makes it easier to replace the polishing head.

[0017] In one optional implementation, a pressure test is performed on the sample polishing head to obtain the test time for the sample polishing head to reach the target pressure from its initial state and the usage time of the sample polishing head corresponding to each test time, including:

[0018] Pressure tests were conducted on the sample polishing head at different usage times. Pressure data and test time were collected as the sample polishing head progressed from the initial pressure to the target pressure. The usage time of the sample polishing head corresponding to the test time was recorded.

[0019] In this method, by recording the test time taken for the sample polishing head to reach the target pressure under different usage times, it is easy to fit the relationship curve between the test time and usage time of the sample polishing head.

[0020] In one optional implementation, a pressure test is performed on the sample polishing head, and pressure data and test time are collected as the sample polishing head progresses from the initial pressure to the target pressure, including:

[0021] At preset time intervals, the real-time pressure value of the sample polishing head is collected, and the real-time pressure value corresponding to the preset time interval is used as the pressure data until the real-time pressure value reaches the target pressure. The time when the sample polishing head reaches the target pressure is used as the test time.

[0022] In this method, the pressure value of the sample polishing head is collected at preset time intervals, and the process curve of the sample polishing head reaching the target pressure is recorded. This enables the accurate determination of the test time when the sample polishing head reaches the target pressure, making the relationship curve between the fitted test time and the usage time more accurate, and further improving the accuracy and reliability of judging the service life of the polishing head.

[0023] In one optional implementation, the lifespan stage of the polishing head under test is determined based on judgment parameters, including:

[0024] The judgment parameters are compared with the preset slope threshold. Based on the comparison results, the life stage of the polishing head under test is determined. The preset slope threshold is used to characterize the slope of the test time and usage time curve when the polishing head under test needs to be replaced.

[0025] In this method, by comparing the judgment parameters with the preset threshold, the current lifespan stage of the polishing head under test can be clearly determined based on the comparison results, and thus it can be accurately determined whether the polishing head under test needs to be replaced.

[0026] In one alternative implementation, when it is determined that the polishing head under test needs to be replaced, the user is prompted to replace the polishing head under test.

[0027] In this method, when it is determined that the polishing head under test needs to be replaced, the user is prompted to replace the polishing head in a timely manner, so as to avoid wear and tear of the polishing head or premature replacement that prevents the polishing head from achieving its maximum effect, thereby avoiding unnecessary production losses.

[0028] Secondly, the present invention provides a polishing head life detection device, the device comprising:

[0029] The time acquisition module is used to acquire the usage time of the polishing head under test up to the current stage;

[0030] The judgment parameter determination module is used to determine the judgment parameters of the polishing head under test based on the usage time. The judgment parameters are one-to-one with the usage time and are obtained in advance based on the pressure test data of the polishing head under the usage time.

[0031] The lifespan stage determination module is used to determine the corresponding lifespan stage of the polishing head under test based on judgment parameters. The lifespan stage is used to determine whether the polishing head needs to be replaced.

[0032] Thirdly, the present invention provides a computer device, comprising: a memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the computer instructions to perform the polishing head life detection method of the first aspect or any corresponding embodiment described above.

[0033] Fourthly, the present invention provides a computer-readable storage medium storing computer instructions for causing a computer to perform the polishing head life detection method of the first aspect or any corresponding embodiment described above. Attached Figure Description

[0034] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0035] Figure 1 This is a schematic flowchart of a polishing head life detection method according to an embodiment of the present invention.

[0036] Figure 2 This is a schematic flowchart of another polishing head life detection method according to an embodiment of the present invention.

[0037] Figure 3 This is a schematic diagram illustrating the relationship between the test time and usage time of a polishing head reaching the target pressure according to an embodiment of the present invention.

[0038] Figure 4 This is a schematic flowchart of another polishing head life detection method according to an embodiment of the present invention.

[0039] Figure 5This is a schematic diagram illustrating the relationship between real-time pressure value and test time according to an embodiment of the present invention.

[0040] Figure 6 This is a structural block diagram of a polishing head life detection device according to an embodiment of the present invention.

[0041] Figure 7 This is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] In current production, polishing head lifespan is typically determined and replaced manually based on experience. This reliance on the tester's experience can lead to errors, such as replacing the polishing head too early or too late. If the polishing head is replaced too early, it cannot achieve its maximum effect, increasing production costs. If it is replaced too late, the wafer yield may decrease due to polishing head wear. Therefore, manual determination of polishing head lifespan lacks accuracy and reliability, resulting in significant unnecessary production losses.

[0044] To address the aforementioned problems, this invention provides a polishing head life detection method for use in a computer device. It should be noted that the executing entity can be a polishing head life detection device, which can be implemented as part or all of the computer device through software, hardware, or a combination of both. The computer device can be a terminal, client, or server. The server can be a single server or a server cluster composed of multiple servers. In this embodiment, the terminal can be a smartphone, personal computer, tablet computer, or other smart hardware device. The following method embodiments all use a computer device as the executing entity for illustration.

[0045] The computer equipment in this embodiment is suitable for applications involving the detection of the lifespan stage of polishing heads in CMP equipment. The polishing head lifespan detection method provided by this invention determines the judgment parameters of the polishing head based on its usage time up to the present moment, using data obtained from pressure tests conducted under pre-existing usage time. This allows for the determination of the polishing head's lifespan stage and whether replacement is necessary. This method achieves accurate identification and judgment of the polishing head's lifespan stage without the need for manual judgment, eliminating reliance on human experience. This makes the determination of when to replace the polishing head more accurate and reliable, significantly reducing production costs. Timely replacement of the polishing head helps prevent defects during production and further improves the yield rate.

[0046] According to an embodiment of the present invention, a method for detecting the lifespan of a polishing head is provided. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0047] This embodiment provides a method for detecting the lifespan of a polishing head, which can be used in the aforementioned computer equipment. Figure 1 This is a flowchart of a polishing head life detection method according to an embodiment of the present invention, such as... Figure 1 As shown, the process includes the following steps:

[0048] Step S101: Obtain the usage time of the polishing head to be tested up to the current stage.

[0049] In one example, the usage time can be defined as the specific duration in which the polishing head under test is used at the current stage.

[0050] Step S102: Determine the judgment parameters of the polishing head to be tested based on the usage time.

[0051] In this embodiment of the invention, the judgment parameter is one-to-one with the usage time and is obtained in advance based on the pressure test data of the polishing head under the usage time.

[0052] In one example, there are corresponding judgment parameters for each usage time, which are determined by fitting data obtained from pressure testing of the polishing head.

[0053] Step S103: Based on the judgment parameters, determine the life stage corresponding to the polishing head to be tested.

[0054] In this embodiment of the invention, the lifespan stage is used to determine whether the polishing head needs to be replaced.

[0055] In one example, the judgment parameters can be used to determine which part of the life cycle the polishing head under test is currently in, and thus determine whether the polishing head under test needs to be replaced.

[0056] The polishing head life detection method provided in this embodiment determines the judgment parameters of the polishing head based on the usage time of the polishing head up to the current moment and by using data obtained from a pressure test experiment under the usage time. This allows for the determination of the life stage of the polishing head and whether it needs to be replaced. This method can accurately identify and judge the life stage of the polishing head without manual judgment, eliminating reliance on human experience. This makes the judgment of the polishing head replacement time more accurate and reliable, greatly saving production costs. Timely replacement of the polishing head helps reduce the defect rate in the production process and further improves the production yield.

[0057] This embodiment provides a method for detecting the lifespan of a polishing head, which can be used in the aforementioned computer equipment. Figure 2 This is a flowchart of another polishing head life detection method according to an embodiment of the present invention, such as... Figure 2 As shown, the process includes the following steps:

[0058] Step S201: Obtain the usage time of the polishing head under test up to the current stage. For details, please refer to [link to relevant documentation]. Figure 1 Step S101 of the illustrated embodiment will not be described again here.

[0059] Step S202: Determine the judgment parameters of the polishing head to be tested based on the usage time.

[0060] Specifically, step S202 includes:

[0061] Step S2021: Based on the usage time, determine the current slope of the pre-fitted curve of the relationship between test time and usage time for the polishing head under test at the current usage time, and use the current slope as a judgment parameter.

[0062] In one example, the LifeTime stage of the polishing head can be obtained based on the pressure-time relationship, specifically including: (1) Calculating the slope k of the tangent line of the relationship curve between test time t and usage time t=θ(T) based on the relationship between test time t and usage time T. i , i∈(1,n), where n is the number of samples. Figure 3 This is a schematic diagram illustrating the relationship between the test time and usage time for a polishing head to reach the target pressure according to an embodiment of the present invention. Figure 3 As shown.

[0063] Step S203: Based on the judgment parameters, determine the life stage corresponding to the polishing head to be tested.

[0064] Specifically, step S203 includes:

[0065] Step S2031: Compare the judgment parameters with the preset slope threshold, and determine the life stage of the polishing head to be tested based on the comparison results.

[0066] In this embodiment of the invention, a preset slope threshold is used to characterize the slope of the curve between the test time and the usage time at which the polishing head under test needs to be replaced.

[0067] In one example, the usage time threshold T at which threshold K is reached is obtained by comparing the slope with the threshold K. m Wherein, the time threshold T m This is the lifetime of the polishing head. Based on the current usage time T, the lifetime stage T / t of the polishing head is calculated. Based on the stage the polishing head is in, it is determined whether the polishing head needs to be replaced.

[0068] Step S204: When it is determined that the polishing head to be tested needs to be replaced, the user is prompted to replace the polishing head to be tested.

[0069] The polishing head life detection method provided in this embodiment determines the slope of the current usage time of the polishing head under test at the corresponding position of the relationship curve by pre-fitting the relationship between test time and usage time. Using the slope as a judgment parameter, the life stage of the polishing head can be accurately identified and judged. By comparing the judgment parameter with a preset threshold, the current life stage of the polishing head under test can be clearly identified based on the comparison result, thus accurately determining whether the polishing head needs to be replaced. When it is determined that the polishing head under test needs to be replaced, the user is prompted to replace it in a timely manner, avoiding wear and tear on the polishing head or premature replacement that prevents the polishing head from reaching its maximum effect, thereby avoiding unnecessary production losses.

[0070] This embodiment provides a method for detecting the lifespan of a polishing head, which can be used in the aforementioned computer equipment. Figure 4 This is a flowchart of another polishing head life testing method according to an embodiment of the present invention, such as... Figure 4 As shown, the process includes the following steps:

[0071] Step S401: Obtain the usage time of the polishing head under test up to the current stage.

[0072] Step S402: Perform a pressure test on the sample polishing head to obtain the test time for the sample polishing head to reach the target pressure from the initial state and the usage time of the sample polishing head corresponding to each test time. The sample polishing head is a polishing head of the same type as the polishing head to be tested.

[0073] In some optional implementations, step S402 above includes:

[0074] Step S4021: At different usage times of the sample polishing head, pressure tests are performed on the sample polishing head, and pressure data and test time are collected during the process of the sample polishing head reaching the target pressure from the initial pressure. The usage time of the sample polishing head corresponding to the test time is recorded.

[0075] In some optional implementations, step S4021 above includes:

[0076] Step a1: Collect the real-time pressure value of the sample polishing head at preset time intervals, and use the real-time pressure value corresponding to the preset time interval as pressure data until the real-time pressure value reaches the target pressure. Use the time when the sample polishing head reaches the target pressure as the test time.

[0077] In one example, the experimental method for obtaining the "stress-time" relationship through DOE (Design of Experiments) includes: (1) selecting a polishing head zone at different times of the polishing head's LifeTime. j , j∈(1,N), where N is the number of Zones in the polishing head. Test time and pressure data are collected at preset time intervals during the process of the sample polishing head progressing from the initial pressure P0 to the target pressure P, and the usage time of the polishing head is recorded. In this invention, there are no restrictions on the selection and number of polishing head regions.

[0078] (2) Based on the test time and pressure data of the sample polishing head collected in step (1) from the initial pressure P0 to the target pressure P, and the usage time of the polishing head is recorded, the relationship between the polishing head pressure and time at different periods is obtained: P=φ(t), which means the change of pressure of the sample polishing head with the pressurization time from the initial pressure P0 to the target pressure P. Figure 5 This is a schematic diagram illustrating the relationship between real-time pressure value and test time according to an embodiment of the present invention, such as... Figure 5 As shown, by repeatedly bringing the polishing head from the same initial pressure to the target pressure, the change in the curve of the polishing head reaching the target pressure P over time can be observed, leading to the conclusion that the time it takes for the polishing head to reach the target pressure changes as the usage time increases.

[0079] (3) Based on the data collected in step (1) and the time required to reach the target pressure obtained in step (2), the relationship between the time required for the polishing head to reach the target pressure P and the polishing head usage time is obtained: t=θ(T), T∈(0,m), where t is the test time required for the polishing head to reach the target pressure from the initial state, T is the polishing head usage time, and m is the polishing head service life. The formula is used to characterize the relationship between the test time required for the selected area of ​​the polishing head to reach the target pressure and the usage time.

[0080] Step S403: Based on the test time and usage time, fit the relationship curve between the test time and usage time of the sample polishing head.

[0081] Step S404: Determine the judgment parameters for the polishing head under test based on usage time. For details, please refer to [link to relevant documentation]. Figure 2 Step S202 of the illustrated embodiment will not be described again here.

[0082] Step S405: Based on the judgment parameters, determine the corresponding lifespan stage of the polishing head under test. For details, please refer to [link to relevant documentation]. Figure 2 Step S203 of the illustrated embodiment will not be described again here.

[0083] The polishing head life testing method provided in this embodiment utilizes a sample polishing head for experimentation. A curve showing the relationship between test time and usage time of the sample polishing head (identical to the one under test) is fitted, facilitating the assessment of the polishing head's lifespan after obtaining its usage time, thus enabling replacement. By recording the test time taken for the sample polishing head to reach the target pressure under different usage periods, a curve showing the relationship between test time and usage time can be fitted. By collecting pressure values ​​from the sample polishing head at preset time intervals and recording the process curve of the sample polishing head reaching the target pressure, the test time for the sample polishing head to reach the target pressure is accurately determined. This makes the fitted curve showing the relationship between test time and usage time more precise, further improving the accuracy and reliability of polishing head lifespan assessment.

[0084] This embodiment also provides a polishing head life detection device, which is used to implement the above embodiments and preferred embodiments, and will not be repeated as already described. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0085] This embodiment provides a polishing head life detection device, such as... Figure 6 As shown, it includes:

[0086] The time acquisition module 601 is used to acquire the usage time of the polishing head under test up to the current stage. For details, please refer to [link / reference needed]. Figure 1 Step S101 of the illustrated embodiment will not be described again here.

[0087] The judgment parameter determination module 602 is used to determine the judgment parameters of the polishing head under test based on the usage time. These judgment parameters are one-to-one corresponding to the usage time and are obtained in advance based on pressure test data of the polishing head under the usage time. For details, please refer to [link to details]. Figure 1 Step S102 of the illustrated embodiment will not be described again here.

[0088] The lifespan stage determination module 603 is used to determine the corresponding lifespan stage of the polishing head under test based on judgment parameters. The lifespan stage is used to determine whether the polishing head needs to be replaced. For details, please refer to [link to relevant documentation]. Figure 1 Step S103 of the illustrated embodiment will not be described again here.

[0089] In some optional implementations, the parameter determination module 602 includes:

[0090] The judgment parameter determination unit is used to determine the current slope of the pre-fitted relationship curve between test time and usage time for the polishing head under test at the current usage time, based on the usage time, and use the current slope as the judgment parameter.

[0091] In some alternative implementations, the polishing head life detection device includes:

[0092] The pressure testing module is used to perform pressure tests on the sample polishing head, obtain the test time for the sample polishing head to reach the target pressure from the initial state, and the usage time of the sample polishing head corresponding to each test time. The sample polishing head is a polishing head of the same type as the polishing head under test.

[0093] The relationship fitting module is used to fit the relationship curve between the test time and the usage time of the sample polishing head based on the test time and usage time.

[0094] In some alternative implementations, the stress testing module includes:

[0095] The data acquisition unit is used to perform pressure tests on the sample polishing head at different usage times, collect pressure data and test time during the process of the sample polishing head reaching the target pressure from the initial pressure, and record the usage time of the sample polishing head corresponding to the test time.

[0096] In some alternative implementations, the data acquisition unit includes:

[0097] The data acquisition subunit is used to collect the real-time pressure value of the sample polishing head at preset time intervals, and use the real-time pressure value corresponding to the preset time interval as the pressure data until the real-time pressure value reaches the target pressure. The time when the sample polishing head reaches the target pressure is used as the test time.

[0098] In some alternative implementations, the lifespan stage determination module 603 includes:

[0099] The lifespan stage determination unit is used to compare the judgment parameters with the preset slope threshold. Based on the comparison results, the lifespan stage corresponding to the polishing head under test is determined. The preset slope threshold is used to characterize the slope of the test time and usage time curve when the polishing head under test needs to be replaced.

[0100] In some alternative implementations, the polishing head life detection device further includes:

[0101] The replacement prompt unit is used to prompt the user to replace the polishing head when it is determined that the polishing head under test needs to be replaced.

[0102] Further functional descriptions of the above modules and units are the same as those in the corresponding embodiments described above, and will not be repeated here.

[0103] In this embodiment, the polishing head life detection device is presented in the form of a functional unit. Here, a unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that execute one or more software or fixed programs, and / or other devices that can provide the above functions.

[0104] This invention also provides a computer device having the above-described features. Figure 6 The polishing head life testing device shown.

[0105] Please see Figure 7 , Figure 7 This is a schematic diagram of the structure of a computer device provided in an optional embodiment of the present invention, such as... Figure 7As shown, the computer device includes one or more processors 10, memory 20, and interfaces for connecting the components, including high-speed interfaces and low-speed interfaces. The components communicate with each other via different buses and can be mounted on a common motherboard or otherwise installed as needed. The processors can process instructions executed within the computer device, including instructions stored in or on memory to display graphical information of a GUI on external input / output devices (such as display devices coupled to the interfaces). In some alternative implementations, multiple processors and / or multiple buses can be used with multiple memories and multiple memory modules, if desired. Similarly, multiple computer devices can be connected, each providing some of the necessary operations (e.g., as a server array, a group of blade servers, or a multiprocessor system). Figure 7 Take a processor 10 as an example.

[0106] Processor 10 may be a central processing unit, a network processor, or a combination thereof. Processor 10 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a combination thereof. The programmable logic device may be a complex programmable logic device (CAMP), a field-programmable gate array (FPGA), a general-purpose array logic (GDA), or any combination thereof.

[0107] The memory 20 stores instructions executable by at least one processor 10 to cause the at least one processor 10 to perform the method shown in the above embodiments.

[0108] The memory 20 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the computer device. Furthermore, the memory 20 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some alternative embodiments, the memory 20 may optionally include memory remotely located relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0109] The memory 20 may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, hard disk or solid-state drive; the memory 20 may also include a combination of the above types of memory.

[0110] The computer device also includes a communication interface 30 for communicating with other devices or communication networks.

[0111] This invention also provides a computer-readable storage medium. The methods described above according to embodiments of the invention can be implemented in hardware or firmware, or implemented as computer code that can be recorded on a storage medium, or implemented as computer code downloaded via a network and originally stored on a remote storage medium or a non-transitory machine-readable storage medium and then stored on a local storage medium. Thus, the methods described herein can be processed by software stored on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. The storage medium can be a magnetic disk, optical disk, read-only memory, random access memory, flash memory, hard disk, or solid-state drive, etc.; further, the storage medium can also include combinations of the above types of memory. It is understood that computers, processors, microprocessor controllers, or programmable hardware include storage components capable of storing or receiving software or computer code, which, when accessed and executed by the computer, processor, or hardware, implements the methods shown in the above embodiments.

[0112] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A method for testing the lifespan of a polishing head, characterized in that, The method includes: Obtain the usage time of the polishing head under test up to the current stage; Based on the usage time, the judgment parameters of the polishing head to be tested are determined, wherein the judgment parameters are one-to-one with the usage time and are obtained in advance based on the pressure test data of the polishing head under the usage time; Based on the judgment parameters, the life stage corresponding to the polishing head to be tested is determined, and the life stage is used to determine whether the polishing head needs to be replaced. The determination of the judgment parameters for the polishing head under test based on the usage time includes: Based on the usage time, the current slope of the pre-fitted relationship curve between test time and usage time for the polishing head under test is determined at the current usage time, and the current slope is used as the judgment parameter. The relationship curve between the test time and the usage time was obtained by fitting, including: A pressure test is performed on the sample polishing head to obtain the test time for the sample polishing head to reach the target pressure from the initial state and the usage time of the sample polishing head corresponding to each test time. The sample polishing head is a polishing head of the same type as the polishing head to be tested. Based on the test time and the usage time, a curve showing the relationship between the test time and usage time of the sample polishing head was obtained by fitting.

2. The method according to claim 1, characterized in that, The pressure test on the sample polishing head, to obtain the test time for the sample polishing head to reach the target pressure from the initial state and the usage time of the sample polishing head corresponding to each test time, includes: Pressure tests were performed on the sample polishing head at different usage times. Pressure data and test time were collected as the sample polishing head progressed from the initial pressure to the target pressure. The usage time of the sample polishing head corresponding to the test time was recorded.

3. The method according to claim 2, characterized in that, The pressure test on the sample polishing head, including collecting pressure data and test time as the sample polishing head reaches the target pressure from the initial pressure, includes: At preset time intervals, the real-time pressure value of the sample polishing head is collected, and the real-time pressure value corresponding to the preset time interval is used as the pressure data until the real-time pressure value reaches the target pressure. The time when the sample polishing head reaches the target pressure is used as the test time.

4. The method according to claim 1, characterized in that, The step of determining the lifespan stage of the polishing head under test based on the judgment parameters includes: The judgment parameters are compared with a preset slope threshold. Based on the comparison results, the life stage corresponding to the polishing head under test is determined. The preset slope threshold is used to characterize the slope of the test time versus usage time curve when the polishing head under test needs to be replaced.

5. The method according to claim 1, characterized in that, When it is determined that the polishing head under test needs to be replaced, the user is prompted to replace the polishing head under test.

6. A polishing head life detection device, characterized in that, The device includes: The time acquisition module is used to acquire the usage time of the polishing head under test up to the current stage; The judgment parameter determination module is used to determine the judgment parameters of the polishing head under test based on the usage time, wherein the judgment parameters are one-to-one with the usage time and are obtained in advance based on the pressure test data of the polishing head under the usage time; the judgment parameter determination module includes: a judgment parameter determination unit, used to determine the current slope of the relationship curve between the test time and the usage time of the polishing head under test at the current usage time based on the usage time, and use the current slope as the judgment parameter; The lifespan stage determination module is used to determine the lifespan stage corresponding to the polishing head under test based on the judgment parameters, and the lifespan stage is used to determine whether the polishing head needs to be replaced. The polishing head life testing device further includes: a pressure testing module, used to perform pressure testing on the sample polishing head, to obtain the test time for the sample polishing head to reach the target pressure from the initial state and the usage time of the sample polishing head corresponding to each test time, wherein the sample polishing head is a polishing head of the same type as the polishing head to be tested; and a relationship fitting module, used to fit the relationship curve between the test time and the usage time of the sample polishing head based on the test time and the usage time.

7. A computer device, characterized in that, include: A memory and a processor are communicatively connected, the memory stores computer instructions, and the processor executes the polishing head life detection method according to any one of claims 1 to 5 by executing the computer instructions.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing the computer to perform the polishing head life detection method according to any one of claims 1 to 5.

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