Display module

Abstract

The display module provided by the present disclosure comprises a display assembly, a cover plate assembly and a support assembly. The display assembly comprises a display panel and a circuit board. The display panel has a display part and a connecting part connected in sequence. The circuit board is connected to the side of the connecting part away from the display part. The cover plate assembly is arranged on the light-emitting side of the display assembly. The display assembly is connected with the cover plate assembly. The support assembly is arranged on the backlight side of the display assembly. The display assembly is connected with the support assembly. The orthographic projection of the cover plate assembly and / or the support assembly on a first reference plane covers and exceeds the orthographic projection of the display assembly on the first reference plane. The cover plate assembly and / or the support assembly are connected with the circuit board. The first reference plane is the plane where the display panel is located. The display module in the present disclosure is not prone to shaking when being unfolded for delivery, thereby reducing the risk of damage to the display panel during the unfolding and delivery process.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically to a display module. Background Technology

[0002] Flexible OLEDs (Organic Light-Emitting Diodes) are gradually entering medium and large-size display applications due to their wider viewing angles and absence of Newton's rings compared to rigid OLEDs, particularly in applications such as monitors and automotive lighting. Currently, for monitors and automotive applications, some terminal manufacturers do not require narrow bezels at the bottom, demanding that flexible OLED modules be shipped flat, meaning the flexible OLED modules are not folded. However, when flexible OLED modules are not folded, the weight of the circuit board during transfer within the production line, shipment to the customer, and assembly inevitably causes the flexible display panel to sway, resulting in pulling and causing defects and functional malfunctions. Summary of the Invention

[0003] This disclosure aims to address at least one of the technical problems existing in the prior art by proposing a display module.

[0004] To achieve the above objectives, this disclosure provides a display module, comprising:

[0005] The display assembly includes a display panel and a circuit board. The display panel has a display portion and a connecting portion connected in sequence. The circuit board is connected to the connecting portion on the side away from the display portion.

[0006] A cover plate assembly is disposed on the light-emitting side of the display component, and the display component is connected to the cover plate assembly;

[0007] A support component is disposed on the backlight side of the display component, the display component is connected to the support component, the orthographic projection of the cover plate component and / or the support component on the first reference surface covers and exceeds the orthographic projection of the display component on the first reference surface, and the cover plate component and / or the support component is connected to the circuit board; the first reference surface is the plane where the display panel is located.

[0008] In some alternative embodiments, the cover plate assembly includes:

[0009] A cover plate having a light-transmitting area and a light-blocking area, wherein the orthographic projection of the light-transmitting area onto the display panel overlaps with the display unit;

[0010] A first connecting layer is disposed between the light-transmitting area of ​​the display unit and the cover plate, and is connected to the display unit and the cover plate.

[0011] A second connection layer is disposed between the light-shielding area of ​​the circuit board and the cover plate, and is connected to the circuit board and the cover plate. The second connection layer includes a shielding sublayer, the orthographic projection of which covers and extends beyond the device area of ​​the circuit board.

[0012] In some alternative embodiments, the second connecting layer further includes a first foam adhesive layer for connecting the cover plate and the circuit board.

[0013] The shielding sublayer is located between the first foam adhesive layer and the cover plate; or

[0014] The shielding sublayer is located between the first foam adhesive layer and the circuit board.

[0015] In some alternative embodiments, when the shielding sublayer is located between the first foam adhesive layer and the cover plate, the shielding sublayer is connected to the cover plate and the first foam adhesive layer, and the shielding sublayer includes conductive cloth.

[0016] In some alternative embodiments, the second connection layer includes a circuit board protection layer located between the foam adhesive and the circuit board, and the shielding sublayer located within the circuit board protection layer.

[0017] In some alternative embodiments, the support component includes:

[0018] Support substrate;

[0019] A first support layer is disposed between the display unit and the support substrate, and is connected to both the display unit and the support substrate.

[0020] The second support layer is disposed between the circuit board and the support substrate and is connected to both the circuit board and the support substrate. The orthographic projection of the second support layer on the second reference surface covers and extends beyond the orthographic projection of the circuit board on the second reference surface. The second reference surface is the plane where the circuit board is located. The surface of the first support layer facing the support substrate and the surface of the second support layer facing the support substrate are located on the same plane.

[0021] In some alternative embodiments, the surface of the circuit board facing the supporting substrate has a grounded copper drain area, the second supporting layer has a via, and the orthographic projection of the grounded copper drain area on the second supporting layer overlaps with the via. The supporting substrate includes:

[0022] A substrate body, wherein the first support layer and the second support layer are disposed on the substrate body;

[0023] A connecting post extends from the substrate body toward the circuit board, and passes through the connecting hole to be electrically connected to the grounded copper drain area;

[0024] A conductive layer is located within the substrate body and the connecting post.

[0025] In some alternative embodiments, the substrate body has an opening for at least a portion of the frame to pass through, the orthographic projection of the grounding copper drain area on the substrate body overlaps with the opening, and at least a portion of the frame passes through the opening, the connecting hole and the grounding copper drain area in sequence.

[0026] In some alternative embodiments, the first support layer and the second support layer are spaced apart to form a void area, and the support substrate has a cutout area, the orthographic projection of the void area on the support substrate covering and extending beyond the cutout area.

[0027] In some alternative embodiments, the first support layer includes a second foam adhesive layer and a first bonding adhesive layer stacked sequentially in a direction away from the support substrate, and the second support layer includes a third foam adhesive layer that contacts the circuit board.

[0028] In some alternative embodiments, the first support layer includes a second foam adhesive layer and a first connecting adhesive layer stacked sequentially in a direction away from the support substrate, the second support layer includes a third foam adhesive layer and a second connecting adhesive layer stacked sequentially in a direction away from the support substrate, the second foam adhesive layer and the third foam adhesive layer are connected to form an integral foam layer, and the first connecting adhesive layer and the second connecting adhesive layer are spaced apart.

[0029] In some alternative embodiments, the support assembly further includes a third connecting adhesive layer located between the connecting portion and the integrated foam layer and connected to the integrated foam layer. Attached Figure Description

[0030] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0031] Figure 1 A schematic diagram of the display module structure is shown in one optional embodiment of this disclosure;

[0032] Figure 2 A schematic diagram of the display module structure is shown in another alternative embodiment of this disclosure;

[0033] Figure 3A schematic diagram of the display module structure is shown in another alternative embodiment of this disclosure;

[0034] Figure 4 It shows Figure 3 Schematic diagram of the middle cover plate assembly;

[0035] Figure 5 A schematic diagram of the cover plate assembly in another alternative embodiment of this disclosure is shown;

[0036] Figure 6 A schematic diagram of the display module structure is shown in another alternative embodiment of this disclosure;

[0037] Figure 7 A schematic diagram of the display module structure is shown in another alternative embodiment of this disclosure;

[0038] Figure 8 A schematic diagram of the display module structure is shown in another alternative embodiment of this disclosure;

[0039] Figure 9 A schematic diagram of the display module structure is shown in another alternative embodiment of this disclosure;

[0040] Figure 10 A schematic diagram of the display module structure is shown in another alternative embodiment of this disclosure;

[0041] Figure 11 It shows Figure 10 Schematic diagram of the broken state of the central support component;

[0042] Figure 12 It shows Figure 10 A view of one angle of the supporting component;

[0043] Figure 13 It shows Figure 10 Top view of the central support component;

[0044] Figure 14 A top view of the support component is shown in another alternative embodiment of this disclosure.

[0045] 10. Display component; 11. Display panel; 111. Display section; 112. Connecting section; 12. Circuit board; 121. Grounding copper leakage area; 122. Component area; 20. Cover plate assembly; 21. Cover plate; 211. Light-transmitting area; 212. Light-shielding area; 22. First connecting layer; 221. Optical adhesive layer; 222. Polarizing film; 23. Second connecting layer; 231. Shielding sublayer; 232. First foam adhesive layer; 233. Circuit board protective layer; 30. Support assembly; 31. Support Substrate; 311, Substrate body; 312, Connecting post; 313, Opening; 314, Cutout area; 315, Through hole; 32, First support layer; 321, Second foam adhesive layer; 322, First connecting adhesive layer; 33, Second support layer; 331, Connecting hole; 332, Third foam adhesive layer; 333, Second connecting adhesive layer; 34, Third connecting adhesive layer; 40, Empty area; 50, Ink layer; 60, First back film; 70, Bucky tube; 80, Second back film; 90, Support layer. Detailed Implementation

[0046] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0048] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0049] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0050] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0051] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0052] Figure 1 A schematic diagram of the structure of a display module in one embodiment of this disclosure is shown. Figure 1 As can be seen, the display module includes a display component 10, a cover plate assembly 20, and a support assembly 30. The cover plate assembly 20 is disposed on the light-emitting side of the display component 10, and the display component 10 is connected to the cover plate assembly 20. The cover plate assembly 20 protects the display component 10 and prevents external structures from damaging the display panel 11. The support assembly 30 is disposed on the backlight side of the display component 10, and the display component 10 is connected to the support assembly 30. The support assembly supports the display component 10 to ensure stable operation of the display component 10.

[0053] The display component 10 includes a display panel 11 and a circuit board 12. The display panel 11 has a display part 111 and a connecting part 112 connected in sequence. The circuit board 12 is connected to the side of the connecting part 112 away from the display part 111. The display part 111 is mainly used to display images.

[0054] In the embodiments of this disclosure, please refer to Figure 1The cover plate assembly 20's orthographic projection on the first reference surface covers and extends beyond the orthographic projection of the display assembly 10 on the first reference surface, and the cover plate assembly 20 is connected to the circuit board 12. The first reference surface is the plane where the display panel 11 is located. This arrangement allows the cover plate assembly 20 to be connected to the circuit board 12, so that the circuit board 12 is fixed on the cover plate assembly 20, effectively reducing the shaking of the circuit board 12, thereby preventing the circuit board 12 from causing the display panel 11 to shake, reducing the pulling on the display panel 11, ensuring the functionality of the display panel 11, and also facilitating the flattening and shipping of the display module.

[0055] Optionally, the edge of the cover plate assembly 20 projected onto the first reference surface extends beyond the edge of the display assembly 10 projected onto the first reference surface by a length greater than or equal to 0.5 mm.

[0056] In the embodiments of this disclosure, please refer to Figure 1 The cover plate assembly 20 includes a cover plate 21, a first connecting layer 22, and a second connecting layer 23. The cover plate 21 has a light-transmitting area 211 and a light-shielding area 212. The orthographic projection of the light-transmitting area 211 onto the display panel 11 overlaps with the display unit 111. The first connecting layer 22 is disposed between the display unit 111 and the light-transmitting area 211 of the cover plate 21, and is connected to both the display unit 111 and the cover plate 21. The second connecting layer 23 is disposed between the circuit board 12 and the light-shielding area 212 of the cover plate 21, and is connected to both the circuit board 12 and the cover plate 21. The display unit 111 is used to display images, and the light emitted by the display unit 111 is emitted through the light-transmitting area 211. The light-shielding area 212 is used to block non-display parts to improve the overall aesthetics of the display module. The first connecting layer 22 connects the display unit 111 and the cover plate 21. On the one hand, it protects the display unit 111, and on the other hand, it prevents the display unit 111 from shaking, thus ensuring the flatness of the display unit 111 and facilitating the normal display of the image by the display module. The second connecting layer 23 connects the circuit board 12 and the cover plate 21 to prevent the circuit board 12 from shaking, thereby preventing the circuit board 12 from causing the display panel 11 to shake, reducing the pulling on the display panel 11, and facilitating the flattening and shipping of the display module.

[0057] It should be noted that the light-shielding area 212 is the area set on the cover plate 21. It means that after the final display device is formed, the light-shielding area 212 is an opaque area, while the light-transmitting area 211 is a light-transmitting area.

[0058] exist Figure 1 In the specific embodiment shown, the first connecting layer 22 includes an optical adhesive layer 221 and a polarizer 222. By setting the polarizer 222, external ambient light can be prevented from shining into the display module and generating reflected light, thus ensuring the display performance of the display module. The optical adhesive layer 221 is used to connect the cover plate 21 and the polarizer 222.

[0059] Optionally, the polarizer 222 is an elliptical polarizer used to eliminate the influence of external light on the displayed image.

[0060] exist Figure 1 In the specific embodiment shown, the cover plate 21 is a transparent cover plate made of glass or other materials, and the ink layer 50 completely blocks the light-shielding area 212 on the cover plate 21.

[0061] exist Figure 2 In the specific embodiment shown, the ink layer 50 covers the first part of the light-shielding area 212, which is directly opposite the connecting part 112. No ink layer 50 is provided in the second part of the light-shielding area 212, which is directly opposite the circuit board 12. The subsequent overall structure shields the second part of the area. This arrangement reduces ink usage and lowers production costs.

[0062] exist Figures 1 to 3 In the specific embodiment shown, the display component 10 further includes a first back film 60, a second back film 80, and a support layer 90. The second back film 80 is disposed on the backlight side of the display section 111, and the support layer 90 is disposed on the side of the second back film 80 away from the display panel 11 to support the display panel 11 and ensure that the display panel 11 works stably. The first back film 60 is disposed on the backlight side of the connecting section 112, and the area covered by the first back film 60 is smaller than the surface area of ​​the backlight side of the connecting section 112. The first back film 60 is preferably disposed in the bonding area in the connecting section 112.

[0063] exist Figures 1 to 3 In the specific embodiment shown, the display component 10 further includes a bucky tube 70, which is disposed on the side of the circuit board 12 away from the cover plate component 20.

[0064] exist Figure 3 and Figure 4 In the specific embodiment shown, the second connection layer 23 includes a shielding sublayer 231. The orthographic projection of the shielding sublayer 231 on the circuit board 12 covers and extends beyond the device area 122 of the circuit board 12. The shielding sublayer 231 can shield electromagnetic signals to reduce the generation of static electricity and reduce electromagnetic signal interference, thereby ensuring the stable operation of the devices in the device area 122.

[0065] In some alternative embodiments, please refer to Figure 1 The second connecting layer 23 also includes a first foam adhesive layer 232, which connects the cover plate 21 to the circuit board 12. A shielding sub-layer 231 is located between the first foam adhesive layer 232 and the cover plate 21, and is connected to both the cover plate 21 and the first foam adhesive layer 232. The cover plate 21 has a planar structure, which facilitates the attachment of the shielding sub-layer 231 to the cover plate 21, simplifying the attachment process.

[0066] Optionally, the shielding sublayer 231 includes conductive cloth.

[0067] In some alternative embodiments, the shielding sublayer 231 is located between the first foam adhesive layer 232 and the circuit board 12. The shielding sublayer 231 can be directly attached to the circuit board 12, or it can be spaced apart from the circuit board 12.

[0068] exist Figure 5 In the specific embodiment shown, the first foam adhesive layer 232 is directly connected to the ink layer 50, and there is no shielding sublayer 231 between them. In this case, the shielding sublayer 231 can be set inside the circuit board protective layer 233.

[0069] exist Figure 1 and Figure 2 In the specific embodiment shown, the second connection layer 23 includes a circuit board protective layer 233, which is located between the foam adhesive and the circuit board 12, and a shielding sublayer 231 is located within the circuit board protective layer 233. The circuit board protective layer 233 is used to protect the devices in the device area 122 on the circuit board 12, preventing external structures from affecting the devices. Placing the shielding sublayer 231 within the circuit board protective layer 233 helps to provide electrostatic and electromagnetic protection for the device area 122, improving the stability of the devices operating in the device area 122.

[0070] In other embodiments, the orthographic projection of the support component 30 on the first reference surface covers and extends beyond the orthographic projection of the display component 10 on the first reference surface. The support component 30 is connected to the circuit board 12, and the first reference surface is the plane where the display panel 11 is located. This arrangement allows the support component 30 to be connected to the circuit board 12, thereby fixing the circuit board 12 on the support component 30. This effectively reduces the shaking of the circuit board 12, thereby preventing the circuit board 12 from causing the display panel 11 to shake, reducing the pulling on the display panel 11, ensuring the functionality of the display panel 11, and also facilitating the flattening and shipping of the display module.

[0071] It should be noted that in the display module of this disclosure, the cover plate assembly 20 may be connected to the circuit board 12 while the support assembly 30 is not connected to the circuit board 12; the support assembly 30 may be connected to the circuit board 12 while the cover plate assembly 20 is not connected to the circuit board 12; or the cover plate assembly 20 may be connected to the circuit board 12 while the support assembly 30 is connected to the circuit board 12.

[0072] In some alternative embodiments, please refer to Figure 6The support assembly 30 includes a support substrate 31, a first support layer 32, and a second support layer 33. The first support layer 32 is disposed between the display unit 111 and the support substrate 31, and is connected to both the display unit 111 and the support substrate 31. The second support layer 33 is disposed between the circuit board 12 and the support substrate 31, and is connected to both the circuit board 12 and the support substrate 31. The orthographic projection of the second support layer 33 on a second reference surface covers and extends beyond the orthographic projection of the circuit board 12 on the second reference surface, where the second reference surface is the plane where the circuit board 12 is located. The first support layer 32 supports the display unit 111 to ensure stable operation of the display unit 111. The second support layer 33 supports the circuit board 12 to reduce the shaking of the circuit board 12, thereby avoiding pulling on the display panel 11 and ensuring the stability of the display panel 11 during operation.

[0073] It should be noted that the thickness of the first support layer 32 and the thickness of the second support layer 33 can be the same or different. The thickness of the first support layer 32 and the second support layer 33 can be adjusted according to the thickness of the display unit 111 and the circuit board 12. It is only necessary to ensure that the first support layer 32 and the second support layer 33 can be horizontally attached to the support substrate 31.

[0074] exist Figure 6 In the specific embodiment shown, the surface of the first support layer 32 facing the support substrate 31 and the surface of the second support layer 33 facing the support substrate 31 are located on the same plane. This arrangement is beneficial for the first support layer 32 and the second support layer 33 to be horizontally attached to the support substrate 31, and is beneficial for the uniform distribution of the display module thickness.

[0075] In some alternative embodiments, please refer to the following for details. Figure 7 The surface of the circuit board 12 facing the support substrate 31 has a grounding copper drain area 121, and the second support layer 33 has a connecting hole 331. The orthographic projection of the grounding copper drain area 121 on the second support layer 33 overlaps with the connecting hole 331, so that the grounding copper drain area 121 is exposed in the connecting hole 331.

[0076] exist Figure 7In the specific embodiment shown, the support substrate 31 includes a substrate body 311, connecting posts 312, and a conductive layer. A first support layer 32 and a second support layer 33 are disposed on the substrate body 311. The connecting posts 312 extend from the substrate body 311 toward the circuit board 12 and pass through a through hole 331 to be electrically connected to the grounded copper drain area 121. The conductive layer is located inside the substrate body 311 and the connecting posts 312. After passing through the through hole 331, the connecting posts 312 are electrically connected to the grounded copper drain area 121, so that the static electricity generated on the support substrate 31 flows out to the outside of the display module through the grounded copper drain area 121, thereby eliminating the static electricity on the support substrate 31, improving the anti-static discharge (ESD) capability and surge protection capability of the display module, and improving the stability of the display module operation.

[0077] In some alternative embodiments, please refer to Figure 8 The substrate body 311 has an opening 313 for at least a portion of the frame to pass through. The orthographic projection of the grounding copper drain area 121 on the substrate body 311 overlaps with the opening 313. At least a portion of the frame passes through the opening 313 and the connecting hole 331 in sequence and is electrically connected to the grounding copper drain area 121. In this embodiment, the connecting post 312 is electrically connected to the grounding copper drain area 121, and at the same time, at least a portion of the frame is electrically connected to the grounding copper drain area 121, so that the static electricity generated on the frame flows out to the outside of the display module through the grounding copper drain area 121, further improving the anti-static discharge capability and surge protection capability of the display module, while also fixing the circuit board 12.

[0078] In some alternative embodiments, please refer to Figures 6 to 9 The first support layer 32 includes a second foam adhesive layer 321 and a first connecting adhesive layer 322 sequentially stacked in a direction away from the support substrate 31. The second support layer 33 includes a third foam adhesive layer 332 and a second connecting adhesive layer 333 sequentially stacked in a direction away from the support substrate 31. The second foam adhesive layer 321 and the third foam adhesive layer 332 are connected to form an integral foam layer. The first connecting adhesive layer 322 and the second connecting adhesive layer 333 are spaced apart. Connecting the second foam adhesive layer 321 and the third foam adhesive layer 332 to form an integral foam layer connects the first support layer 32 and the second support layer 33 together, which helps to improve the structural strength of the support assembly 30 and reduce the risk of the circuit board 12 shaking.

[0079] In some alternative embodiments, please refer to Figure 9 The support component 30 also includes a third connecting adhesive layer 34, which is located between the connecting portion 112 and the integrated foam layer and is connected to the integrated foam layer. The third connecting adhesive layer 34 provides support for the connecting portion 112, thereby supporting the connecting portion 112, further improving its resistance to strong mechanical vibration, reducing the shaking of the connecting portion 112, and further reducing damage caused by shaking of the display panel 11.

[0080] In some alternative embodiments, please refer to Figures 10 to 14 A first support layer 32 and a second support layer 33 are spaced apart to form a void area 40. The support substrate 31 has a cutout area 314. The orthographic projection of the void area 40 onto the support substrate 31 covers and extends beyond the cutout area 314. By providing the cutout area 314 on the support substrate 31, the structural strength of the support substrate 31 at the cutout area 314 is reduced, which facilitates breaking the support substrate 31 to divide it into two parts. The first part of the support substrate 31 is connected to the first support layer 32, and the second part of the support substrate 31 is connected to the second support layer 33. This facilitates the peeling of the second part of the support substrate 31 and the second support layer 33 from the circuit board 12, thereby reducing the thickness of the display module at the circuit board 12. At the same time, this arrangement reduces the pulling on the display panel 11 during the transportation of the display module, thus protecting the display panel 11.

[0081] For example, in display modules where there are special requirements for the thickness of the bottom bezel, a method can be adopted. Figures 10 to 14 The technical solution shown can meet the requirements for the thickness of the lower bezel, and can also avoid damage to the display panel 11 caused by bumps during transportation, thus protecting the display panel 11.

[0082] exist Figure 10 In a specific embodiment, the hollow area 314 has multiple densely packed through holes 315 penetrating the support substrate 31, which can realize the function of rapid breakage of the hollow area 314. The structure after breakage is as follows: Figure 11 As shown.

[0083] Multiple through holes 315 can be arranged orthogonally, for example, according to Figure 13 The arrangement shown can also be a staggered arrangement, for example, according to... Figure 14 The arrangement shown can be used in other ways, and there are no specific restrictions here.

[0084] Optionally, the through hole 315 can be circular, elliptical, polygonal, or formed by arcs and straight lines; no specific restrictions are imposed here.

[0085] In some alternative embodiments, please refer to Figures 10 to 14The first support layer 32 includes a second foam adhesive layer 321 and a first connecting adhesive layer 322 sequentially stacked in a direction away from the support substrate 31. The second support layer 33 includes a third foam adhesive layer 332, which contacts the circuit board 12. In this embodiment, the third foam adhesive layer 332 is in direct contact with the circuit board 12, avoiding excessive adhesion between the second support layer 33 and the circuit board 12, and facilitating the peeling of the second support layer 33 from the circuit board 12. The first support layer 32 includes a second foam adhesive layer 321 and a first connecting adhesive layer 322, which is connected to the display panel 11 to prevent the first support layer 32 from detaching from the display panel 11.

[0086] In some alternative embodiments, the cover assembly 20 is not connected to the circuit board 12, and the cover assembly 20 covers the circuit board 12. The support assembly 30 adopts... Figures 10 to 14 The structure shown can reduce damage to the display panel 11 caused by the shaking of the circuit board 12. The display module in this embodiment can also be folded back. When the display module needs to be folded back, the second support layer 33 is peeled off from the circuit board 12, and then the display panel 11 is folded back. Using the structure in this embodiment, not only can the display module be shipped flat, but the display panel 11 can also be folded back when needed, effectively improving the versatility of the display module's use.

[0087] Optionally, in Figures 6 to 11 In the specific embodiment shown, there is no separate support layer 90; the side of the second back film 80 furthest from the display panel 11 is directly connected to the first support layer 32. Of course, a support layer 90 can also be provided between the second back film 80 and the first support layer 32; no specific limitation is made here.

[0088] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display module, characterized in that, include: The display assembly includes a display panel and a circuit board. The display panel has a display portion and a connecting portion connected in sequence. The circuit board is connected to the connecting portion on the side away from the display portion. A cover plate assembly is disposed on the light-emitting side of the display component, and the display component is connected to the cover plate assembly; A support component is disposed on the backlight side of the display component, the display component is connected to the support component, the orthographic projection of the cover plate component and / or the support component on the first reference surface covers and exceeds the orthographic projection of the display component on the first reference surface, and the cover plate component and / or the support component is connected to the circuit board. The first reference plane is the plane where the display panel is located; The support components include: Support substrate; A first support layer is disposed between the display unit and the support substrate, and is connected to both the display unit and the support substrate. The second support layer is disposed between the circuit board and the support substrate and is connected to the circuit board and the support substrate. The orthographic projection of the second support layer on the second reference surface covers and extends beyond the orthographic projection of the circuit board on the second reference surface. The second reference surface is the plane where the circuit board is located. The surface of the first support layer facing the support substrate and the surface of the second support layer facing the support substrate are located on the same plane. The first support layer and the second support layer are spaced apart to form a void area, and the support substrate has a hollow area. The orthogonal projection of the void area on the support substrate covers and extends beyond the hollow area. The cutout area is used to break the support substrate into a first part and a second part, the first part being connected to the display panel and the second part being peeled off from the circuit board.

2. The display module according to claim 1, characterized in that, The cover plate assembly includes: A cover plate having a light-transmitting area and a light-blocking area, wherein the orthographic projection of the light-transmitting area onto the display panel overlaps with the display unit; A first connecting layer is disposed between the light-transmitting area of ​​the display unit and the cover plate, and is connected to the display unit and the cover plate. A second connection layer is disposed between the light-shielding area of ​​the circuit board and the cover plate, and is connected to the circuit board and the cover plate. The second connection layer includes a shielding sublayer, the orthographic projection of which covers and extends beyond the device area of ​​the circuit board.

3. The display module according to claim 2, characterized in that, The second connecting layer further includes a first foam adhesive layer, which is used to connect the cover plate and the circuit board. The shielding sublayer is located between the first foam adhesive layer and the cover plate; or The shielding sublayer is located between the first foam adhesive layer and the circuit board.

4. The display module according to claim 3, characterized in that, When the shielding sublayer is located between the first foam adhesive layer and the cover plate, the shielding sublayer is connected to the cover plate and the first foam adhesive layer, and the shielding sublayer includes conductive cloth.

5. The display module according to claim 3, characterized in that, The second connection layer includes a circuit board protective layer, which is located between the first foam adhesive layer and the circuit board, and the shielding sublayer is located within the circuit board protective layer.

6. The display module according to any one of claims 1 to 5, characterized in that, The circuit board has a grounded copper drain area on its surface facing the supporting substrate. The second supporting layer has a connecting hole. The orthographic projection of the grounded copper drain area onto the second supporting layer overlaps with the connecting hole. The supporting substrate includes: A substrate body, wherein the first support layer and the second support layer are disposed on the substrate body; A connecting post extends from the substrate body toward the circuit board, and passes through the connecting hole to be electrically connected to the grounded copper drain area; A conductive layer is located within the substrate body and the connecting post.

7. The display module according to claim 6, characterized in that, The substrate body has an opening for at least a portion of the frame to pass through, the orthographic projection of the grounding copper drain area on the substrate body overlaps with the opening, and at least a portion of the frame passes through the opening, the connecting hole and the grounding copper drain area in sequence.

8. The display module according to any one of claims 1 to 5, characterized in that, The first support layer includes a second foam adhesive layer and a first connecting adhesive layer stacked sequentially in a direction away from the support substrate, and the second support layer includes a third foam adhesive layer, which is in contact with the circuit board.

Images