LED light strip packaging equipment

Abstract

An LED lamp strip packaging equipment is characterized in that: comprising a lamp strip pay-off device, a lamp strip stripping device, a first carrier lifting device, a soldering device, a lamp strip take-up device arranged in sequence along the transmission direction of the lamp strip, and a rotary workbench, a patch carrier and a patch feeding device arranged vertically below the lamp strip and located at the first carrier lifting device; the two ends of the lamp strip are connected with the lamp strip pay-off and take-up devices for horizontal step movement; the lamp strip comprises a plurality of parallel arranged enameled wires; in the manner that the patch carrier actively flatters the lamp strip, the packaging process of simultaneously soldering and shadowless glue curing multiple LED chips on the conductor core is realized, and the production efficiency is significantly improved.

Description

Technical Field

[0001] This invention relates to the field of LED light strip processing equipment technology, and specifically to an LED light strip packaging equipment. Background Technology

[0002] LED light strips are made by assembling LEDs onto a strip-shaped FPC (flexible printed circuit board) or PCB (rigid PCB), and are named for their strip-like shape. LED light strips can be divided into rigid LED strips and flexible LED light strips. They are widely used for decoration and lighting in buildings, bridges, roads, gardens, courtyards, floors, ceilings, furniture, automobiles, ponds, underwater areas, advertisements, signs, and other applications.

[0003] The widespread use of LED light strips has led to increasingly higher quality requirements for them. Traditional product welding is mainly done by manual electroplating. Due to the inaccurate positioning of manual electroplating, the thickness and uniformity of the weld are easily affected, resulting in missed welds and off-center welds, which can cause the welds to be weak or even the product to fall off directly, resulting in generally poor quality of LED light strips.

[0004] Moreover, the existing LED light strip manufacturing process involves peeling off the enamel coating of the two enameled wires that serve as the positive and negative electrodes to expose the conductor core wires. Then, the positive and negative electrodes of the LED chip are soldered onto the conductor core wires. Finally, UV adhesive is applied to the soldered areas, and after curing, the LED chip and conductor core wires are encapsulated and protected to complete the entire encapsulation.

[0005] However, this traditional LED string structure with two positive and negative enameled wires is simple and can only display limited light source variations. To achieve richer light source performance, multiple rows of wires are required. This is because current processes cannot integrate multiple rows of wires into a single package.

[0006] The challenge lies in how to precisely and densely install multiple LED chips on various production lines in an orderly manner during automated production. Furthermore, because the gaps between multiple LED chips are small, they cannot be soldered simultaneously. Therefore, maintaining a stable relationship between multiple LED chips and the conductor core during individual soldering is also a problem that needs to be overcome.

[0007] Therefore, if we can design LED light strings with multiple lead groups and achieve automated packaging of such light strings, it will greatly expand the application scenarios and market for light strings. Summary of the Invention

[0008] To address the shortcomings of the aforementioned technologies, this invention provides an LED strip packaging device. The technical solution of this invention is as follows: An LED strip packaging device includes a strip feeding device, a strip strip stripping device, a first carrier lifting device, a soldering device, and a strip take-up device arranged sequentially along the strip's transmission direction; a rotary worktable, a chip mounter, and a chip mount feeding device are located vertically below the strip and at the first carrier lifting device; the two ends of the strip are connected to the feeding and take-up devices respectively, allowing for horizontal stepping movement; the strip comprises several parallel enameled wires.

[0009] The patch carrier is configured with first grooves for a plurality of parallel enameled wires with spacing and contours. The cross-section of the first groove is a "V" shape with the opening facing vertically upward. The enameled wires pass through the patch carrier horizontally through the first grooves. Several chip slots are provided vertically below the first grooves. Each chip slot is close to at least two adjacent enameled wires at both ends.

[0010] The rotary worktable is equally loaded with several patch carriers, and the rotary worktable includes a loading station near the patch loading device and a unloading station near the first carrier lifting device.

[0011] The chip loading device picks up several LED chips and places them into each chip slot. The rotary table reciprocates to transport the chip carrier carrying the LED chips to the unloading station.

[0012] The first carrier lifting device includes a lifting rail, a lifting drive mechanism, a lifting platform and a pneumatic gripper. The lifting platform is set on the lifting rail for vertical sliding engagement, including a gripping station near the unloading station and a soldering station near the soldering device. The lifting drive mechanism drives the lifting platform and the pneumatic gripper to reciprocate vertically between the two stations. The pneumatic gripper is equipped with a pair of claws adapted to the contour of the surface mount carrier and grabs the surface mount carrier from the unloading station to the soldering station.

[0013] The soldering device includes an automatic soldering machine, which solders the positive and negative terminals of the LED chips in each chip slot to the corresponding enameled wire conductor cores at the soldering station.

[0014] The pneumatic gripper returns the empty carrier to the unloading station, and the LED strip feeding and winding device drives the enameled wire to move horizontally, carrying the soldered LED chip.

[0015] The above technical solution is adopted, as shown in the appendix to the instruction manual. Figure 7As shown, multiple LED chips are soldered across parallel line groups ae. The LED strip's circuit board controls the alternating flashing of different LED chips by switching power on lines ab (positive and negative) while temporarily de-energizing other lines, or vice versa. This maximizes the variation of LED chips on the strip with fewer line groups. However, this dense, multi-LED chip packaging and soldering automated process presents significant challenges in terms of precise chip alignment, packaging efficiency, and accuracy if traditional methods of individual chip packaging are used.

[0016] Therefore, this invention designs a chip mounting carrier and a carrier transfer process, in which the enameled wire is suspended and transported horizontally. After the LED chip is placed into the chip slot by the chip loading device, the chip mounting carrier is moved and raised to the soldering station by the rotating worktable and the first carrier lifting device. At this time, the chip mounting carrier meets the enameled wire from bottom to top, and the first wire groove guides the enameled wire to embed, so as to ensure that the conductor core is stable and does not shake during soldering.

[0017] As per the instruction manual Figure 6 As shown, as the mounting carrier rises, the positive and negative terminals of the LED chips in the chip slots align with their respective conductor cores. Then, the automatic soldering machine starts, driving the soldering iron tip to precisely move to the positive and negative terminals of each chip. The 27 solder tubes move with the soldering iron tip and, under the control of the control system, discharge an appropriate amount of solder to the positive and negative terminals and conductor cores, completing the soldering process.

[0018] Then the mounting carrier descends back to the rotary table, and the LED chip in the chip slot remains on the light strip because it is fixed to the conductor chip by soldering, thus completing the encapsulation.

[0019] LED strip cable feeding devices and LED strip cable winding devices are common cable winding equipment and will not be described again.

[0020] A further feature of the present invention is that the patch feeding device includes a feeding track, several feeding robots, a sliding frame, a horizontal sliding track, a frame drive mechanism, a lifting cylinder, several suction cup mechanisms, and a suction cup lifting platform.

[0021] The feeding track is provided with several feeding channels that are aligned with the chip slots of the chip carrier at the loading station. The end of the feeding channel near the loading station is the installation station. The several feeding robots pick up LED chips and put them into the feeding channels, and push the LED chips toward the installation station.

[0022] The horizontal sliding track is connected between the waiting station and the loading station. The sliding frame slides with the horizontal sliding track. The frame drive mechanism includes a drive motor and a drive gear fixedly mounted on the sliding frame. The horizontal sliding track is provided with a rack that meshes with the drive gear. The drive motor drives the drive gear to rotate forward and backward, causing the sliding frame to reciprocate between the waiting station and the loading station.

[0023] The sliding frame is vertically positioned with lifting slots corresponding to the chip slots. Several suction cup mechanisms are respectively installed in the lifting slots for sliding cooperation. Each suction cup mechanism includes a slider, a vacuum suction cup, and a vacuum pump. The vacuum suction cup is fixed to the slider and faces the chip slot. The slider has air holes that connect to the vacuum suction cup. Each air hole is connected to a vacuum pump hose. The vacuum pump controls each vacuum suction cup to pick up or put down the LED chip.

[0024] The lifting platform is fixedly connected to each slider component and connected to the piston rod of the lifting cylinder. The lifting cylinder drives each vacuum suction cup to move synchronously closer to or away from the material conveying trough and chip trough.

[0025] Using the above technical solution, due to the small size of the LED chip body and the relatively dense arrangement of the chips in this invention, the efficiency of picking them up one by one is low. Therefore, by dragging multiple sets of robotic arms to pick up the chips and place them onto the feeding track, and then using multiple suction cup mechanisms to pick them up and place them into the chip slots at the same time, the chip placement accuracy and efficiency are improved.

[0026] A further feature of the present invention is that a UV adhesive station is provided between the soldering device and the LED strip take-up device. The UV adhesive station is equipped with a shadowless adhesive carrier, a second carrier lifting device, and an ultraviolet curing lamp. The shadowless adhesive carrier is located vertically below the LED strip in the UV adhesive station. The shadowless adhesive carrier is equipped with an adhesive tank facing the LED strip, an adhesive delivery pipe connected to the adhesive tank, and a second wire groove corresponding to the spacing and outline of several parallel enameled wires.

[0027] The second carrier lifting device clamps the shadowless glue carrier close to or away from the light strip. When it is close to the light strip, the enameled wire is embedded in the second wire groove and the LED chip is embedded in the glue tank. The glue delivery pipe releases shadowless glue into the glue tank to immerse the LED chip and conductor fiber core.

[0028] The ultraviolet curing lamp is positioned vertically above the UV adhesive station to irradiate the UV adhesive and cure and coat the LED chip and conductor fiber core; the adhesive delivery pipe is positioned relatively far from the ultraviolet fixing lamp and its vertical height is higher than the height of the LED chip in the adhesive tank.

[0029] Using the above technical solution, after the LED chip is soldered and fixed to the conductor fiber core, it is easily damaged when exposed. Therefore, a shadowless adhesive curing coating is used for protection.

[0030] However, the automation of the UV-curing adhesive application has become a challenge, especially since each light source point of the LED strip in this application is equipped with multiple LED chips. The key is to effectively cover the UV-curing adhesive without causing overflow.

[0031] Therefore, in this design, the effective range of the UV adhesive immersion in each LED chip is constrained by the structure of the UV adhesive carrier, preventing irregular overflow of the UV adhesive. Then, the UV adhesive is cured by a UV curing lamp positioned vertically above, completing the curing and coating process. After curing, the UV adhesive carrier is driven to descend and separate from the chip coating. The LED strip moves forward, and the next light source point arrives at the UV adhesive station. The carrier rises to stabilize the LED string, and the UV adhesive is discharged again, completing the UV adhesive coating process in an automated cycle.

[0032] The placement of the glue delivery pipe prevents it from being blocked by ultraviolet rays. If necessary, a light shield or other protective device can be installed to prevent the delivery pipe from being exposed to sunlight.

[0033] A further feature of the present invention is that the strip light strip stripping device includes a lead tube and a blade. The lead tube has a central hole that matches the contour of the strip light. The outer circumferential surface of the lead tube has a radial adjustment seat and a blade groove that extends into the central hole. The radial adjustment seat has an elongated hole along the radial direction. The blade is inserted into the blade groove and has a threaded shaft on its side that extends into the elongated hole for sliding engagement. The threaded shaft passes through the elongated hole and is fixed with a nut.

[0034] By adopting the above technical solution, the radial distance between the blade and the enameled wire can be adjusted to adapt to cutting paint of different thicknesses.

[0035] A further feature of the present invention is that the automatic soldering machine includes a frame, an X-axis track, a Y-axis track, a servo drive system, a servo control system, a solder dispensing control unit, and a soldering control unit.

[0036] Using the above technical solution, the automatic soldering machine adopts a planar XY degree of freedom model so as to accurately move to the positive and negative terminals of each LED chip.

[0037] A further feature of the present invention is that the device also includes a detection mechanism, which is a photosensitive sensor disposed between the UV adhesive station and the LED strip winding station.

[0038] The above technical solution is used to detect whether the LED chip can be lit after soldering, and to detect, record, and alarm the components.

[0039] A further feature of the present invention is that the ends of the plurality of feeding tracks near the placement carrier are stopping ends, and the spacing between the stopping ends and the chip slots they are aligned with is the same. When the lifting slots corresponding to the positions of each chip slot move to the loading station, they are aligned with the chip positions of each stopping end.

[0040] By adopting the above technical solution, each suction cup mechanism on the sliding frame can accurately align with the stopping end or chip slot when it stops during the reciprocating movement of a fixed distance.

[0041] The beneficial effects of the present invention: The packaging equipment structure design of the present invention, by actively accommodating the light strip with the surface mount carrier, realizes the packaging process of simultaneously soldering and curing multiple LED chips onto the conductor fiber core with shadowless adhesive, which significantly improves production efficiency. Attached Figure Description

[0042] Figure 1 The structure of this embodiment of the invention Figure 1 ;

[0043] Figure 2 The structure of this embodiment of the invention Figure 2 ;

[0044] Figure 3 The structure of this embodiment of the invention Figure 3 ;

[0045] Figure 4 The structure of this embodiment of the invention Figure 4 ;

[0046] Figure 5 The structure of this embodiment of the invention Figure 5 ;

[0047] Figure 6 for Figure 4 Post a larger image at point A;

[0048] Figure 7 This is a structural diagram of the light strip according to an embodiment of the present invention;

[0049] Figure 8 This is a structural diagram of the wire stripping device according to an embodiment of the present invention.

[0050] Among them, 1-first carrier lifting device, 11-lifting rail, 12-lifting drive mechanism, 13-lifting platform, 14-starting amplification, 2-soldering device, 21-frame, 22-X-axis rail, 23-Y-axis rail, 24-Y-axis rack, 25-X-axis rack, 26-soldering tip, 27-solder tube, 28-moving seat, 3-rotary worktable, 4-placement carrier, 41-first wire groove, 42-chip groove, 5-placement feeding device, 51-material conveying rail, 52-sliding frame, 521-drive gear. 531-Rack and pinion, 522-Lifting groove, 53-Horizontal sliding rail, 54-Lifting mechanism, 55-Suction cup lifting platform, 56-Sliding block, 57-Vacuum suction cup, 58-Hose, 6-Light strip, 61-Enameled wire, 62-LED chip, 63-Radial adjustment seat, 64-Knife groove, 65-Threaded shaft, 66-Lead tube, 67-Blade, 71-Shadowless adhesive carrier, 711-Glue tank, 712-Glue delivery pipe, 713-Second groove, 72-Second carrier lifting device, 73-Ultraviolet curing lamp.

[0051] To better illustrate this embodiment, some parts in the accompanying drawings may be omitted, enlarged, or reduced, and do not represent the actual size of the product. Furthermore, the accompanying drawings are for illustrative purposes only and should not be construed as limiting this patent. Detailed Implementation

[0052] To make the technical solution and advantages of this application clearer, the technical solution of this application will be described in a clearer and more complete manner below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some embodiments of this application, and are only used to explain this application, not to limit this application. It should be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings. Other related parts can be referred to the general design. In the absence of conflict, the embodiments and technical features in the embodiments of this application can be combined with each other to obtain new embodiments.

[0053] like Figure 1-8 As shown, an LED strip 6 packaging device includes a strip 6 wire feeding device, a strip 6 wire stripping device, a first carrier lifting device 1, a soldering device 2, and a strip 6 wire take-up device arranged sequentially along the transmission direction of the strip 6; and a rotary worktable 3, a chip mounting carrier 4, and a chip mounting feeding device 5 arranged vertically below the strip 6 and located at the first carrier lifting device 1; the two ends of the strip 6 are respectively connected to the strip 6 wire feeding and take-up devices to move horizontally; the strip 6 includes a plurality of parallel enameled wires 61;

[0054] The patch carrier 4 corresponds to a first groove 41 with a spacing and outline of several parallel enameled wires 61. The cross-section of the first groove 41 is a "V" shape with the opening facing vertically upward. The enameled wires 61 pass through the patch carrier 4 horizontally through the first groove 41. Several chip slots 42 are provided vertically below the first groove 41. The first and last ends of each chip slot 42 are close to at least two adjacent enameled wires 61.

[0055] The rotary worktable 3 is evenly loaded with a number of patch carriers 4 (a limiting groove is set on the rotary worktable to fit the outline of the patch carrier, so as to engage the patch carrier without affecting the vertical clamping movement of the first carrier lifting device). The rotary worktable 3 includes a loading station near the patch loading device 5 and a unloading station near the first carrier lifting device 1.

[0056] The chip loading device 5 picks up a number of LED chips 62 and places them into each chip slot 42. The rotary table 3 reciprocates to transport the chip carrier 4 carrying the LED chips 62 to the unloading station.

[0057] The first carrier lifting device 1 includes a lifting rail 11, a lifting drive mechanism 12, a lifting platform 13, and a pneumatic gripper 14. The lifting platform 13 is arranged on the lifting rail 11 for vertical sliding engagement, including a gripping station near the unloading station and a soldering station near the soldering device 2. The lifting drive mechanism 12 drives the lifting platform 13 and the pneumatic gripper 14 to reciprocate vertically between the two stations. The pneumatic gripper 14 is provided with a pair of claws that are adapted to the contour of the surface mount carrier 4 and grabs the surface mount carrier 4 from the unloading station to the soldering station.

[0058] The soldering device 2 includes an automatic soldering machine, which solders the positive and negative terminals of the LED chips 62 in each chip slot 42 to the corresponding wire cores of the enameled wires 61 at the soldering station.

[0059] The pneumatic gripper 14 returns the empty carrier to the unloading station, and the wire feeding and winding device of the LED strip 6 drives the enameled wire 61 to move horizontally, carrying the soldered LED chip 62.

[0060] As per the instruction manual Figure 7 As shown, multiple LED chips 62 are soldered across parallel line groups ae. The circuit board of the LED strip 6 controls the alternating flashing of different LED chips 62 on the strip by controlling the switching of power on lines ab (positive and negative) while other lines are temporarily de-energized, or vice versa. This maximizes the variation of LED chips 62 on the strip 6 with fewer line groups. However, this dense, automated soldering process for multiple LED chips 62 presents significant challenges in terms of precise alignment, packaging efficiency, and accuracy if traditional methods of individual chip packaging are used.

[0061] Therefore, the present invention designs a chip carrier 4 and a carrier transfer process, in which the enameled wire 61 is suspended and transported in the horizontal direction. After the LED chip 62 is placed into the chip slot 42 by the chip loading device 5, the chip carrier 4 is moved and raised to the soldering station by the rotating worktable 3 and the first carrier lifting device 1. At this time, the chip carrier 4 meets the enameled wire 61 from bottom to top. The first wire slot 41 guides the enameled wire 61 to be embedded, so as to ensure that the conductor core is stable and does not shake during soldering.

[0062] As per the instruction manual Figure 6 As shown, as the mounting carrier 4 rises, the positive and negative electrodes of the LED chips 62 in the chip slot 42 are aligned with their respective conductor cores. Then, the automatic soldering machine starts, driving the soldering iron tip to move precisely to the positive and negative electrodes of each chip. The solder tube 27 moves with the soldering iron tip and, under the control of the control system, discharges an appropriate amount of solder to the positive and negative electrodes and conductor cores, completing the soldering process.

[0063] Then the mounting carrier 4 descends back to the rotary table 3, and the LED chip 62 in the chip slot 42 remains on the light strip 6 because it is fixed by soldering with the conductor chip, thus completing the encapsulation.

[0064] The cable feeding device and cable take-up device for LED strip 6 are common cable winding equipment and will not be described again.

[0065] The patch feeding device 5 includes a feeding track 51, several feeding robots, a sliding frame 52, a horizontal sliding track 53, a frame 21 drive mechanism, a lifting cylinder 54, several suction cup mechanisms, and a suction cup lifting platform 55.

[0066] The feeding track 51 is provided with several feeding channels that are aligned with the chip slots 42 of the chip carrier 4 at the feeding station. The end of the feeding channel near the feeding station is the loading station. The several feeding robots pick up the LED chips 62 and put them into the feeding channels, and push the LED chips 62 toward the loading station.

[0067] The horizontal sliding track 53 is connected between the waiting station and the loading station. The sliding frame 52 is slidably engaged with the horizontal sliding track 53. The drive mechanism of the frame 21 includes a drive motor and a drive gear 521 fixedly mounted on the sliding frame 52. The horizontal sliding track 53 is provided with a rack 531 that meshes with the drive gear 521. The drive motor drives the drive gear 521 to rotate forward and backward, thereby driving the sliding frame 52 to reciprocate between the waiting station and the loading station.

[0068] The sliding frame 52 is vertically positioned with lifting slots 522 corresponding to the positions of each chip slot 42. Several suction cup mechanisms are respectively installed in the lifting slots 522 for sliding cooperation. Each suction cup mechanism includes a slider 56, a vacuum suction cup 57 and a vacuum pump. The vacuum suction cup 57 is fixed to the slider 56 and faces the chip slot 42. The slider 56 has air holes that communicate with the vacuum suction cup 57. Each air hole is connected to the vacuum pump hose 58. The vacuum pump controls each vacuum suction cup 57 to pick up or put down the LED chip 62.

[0069] The lifting platform 13 is fixedly connected to each slider 56 and connected to the piston rod of the lifting cylinder 54. The lifting cylinder 54 drives each vacuum suction cup 57 to move synchronously closer to or away from the material conveying trough and chip slot 42.

[0070] Because the LED chips 62 are small in size and arranged densely in this invention, picking them up one by one is inefficient. Therefore, by dragging multiple sets of robotic arms to pick up the chips and place them on the feeding track 51, and then using multiple suction cup mechanisms to pick them up and put them into the chip slot 42 at the same time, the chip placement accuracy and efficiency are improved.

[0071] A UV adhesive station is also provided between the soldering device 2 and the LED strip 6 winding device. The UV adhesive station is equipped with a shadowless adhesive carrier 71, a second carrier lifting device 72, and an ultraviolet curing lamp 73. The shadowless adhesive carrier 71 is located vertically below the LED strip 6 in the UV adhesive station. The shadowless adhesive carrier 71 is equipped with an adhesive tank 711 facing the LED strip 6, an adhesive delivery pipe 712 connected to the adhesive tank 711, and a second wire groove 713 corresponding to the spacing and outline of several parallel enameled wires 61.

[0072] The second carrier lifting device 72 clamps the shadowless glue carrier 71 to move closer to or away from the light strip 6. When it moves closer to the light strip 6, the enameled wire 61 is embedded in the second wire groove 713, and the LED chip 62 is embedded in the glue tank 711. The glue delivery pipe 712 releases shadowless glue into the glue tank 711 to immerse the LED chip 62 and the conductor fiber core.

[0073] The ultraviolet curing lamp 73 is positioned vertically above the UV adhesive station to irradiate the UV adhesive and cure and coat the LED chip 62 and conductor fiber core; the adhesive delivery pipe is positioned relatively far from the ultraviolet fixing lamp, and its vertical height is higher than the height of the LED chip 62 in the adhesive tank 711.

[0074] After the LED chip 62 is soldered to the conductor fiber core, it is easily damaged when exposed. Therefore, it is protected by a UV-curing adhesive coating.

[0075] However, the automation of the shadowless adhesive implementation has become a challenge, especially since each light source point of the light strip 6 in this application is equipped with multiple LED chips 62. How to effectively cover the shadowless adhesive without overflowing has become the key.

[0076] Therefore, in this design, the structure of the UV adhesive carrier 71 is used to constrain the effective range of the UV adhesive immersion in each LED chip 62, preventing irregular overflow of the UV adhesive. Then, the UV adhesive is cured using an ultraviolet curing lamp 73 positioned vertically above, completing the curing and coating process. After curing, the UV adhesive carrier 71 is driven to descend and separate from the chip coating. The LED strip moves 6 steps, and the next light source point arrives at the UV adhesive station. The carrier rises to stabilize the LED string, and the UV adhesive is discharged again, completing the UV adhesive coating process in an automated cycle.

[0077] The placement of the glue delivery pipe prevents it from being blocked by ultraviolet rays. If necessary, a light shield or other protective device can be installed to prevent the delivery pipe from being exposed to sunlight.

[0078] The stripping device for the LED strip 6 includes a lead tube 66 and a blade 67. The lead tube 66 has a central hole that matches the contour of the LED strip 6. The outer circumferential surface of the lead tube 66 has a radial adjustment seat 63 and a blade groove 64 that extends into the central hole. The radial adjustment seat 63 has an elongated hole along the radial direction. The blade 67 is inserted into the blade groove 64 and has a threaded shaft 65 extending into the elongated hole for sliding engagement on its side. The threaded shaft 65 passes through the elongated hole and is fixed to a nut.

[0079] The radial distance between the adjustable blade 67 and the enameled wire 61 can be adapted to cut paint of different thicknesses.

[0080] The automatic soldering machine includes a frame 21, an X-axis track 22, a Y-axis track 23, a servo drive system, a servo control system, a solder dispensing control unit, and a soldering control unit.

[0081] The automatic soldering machine adopts a planar XY degree of freedom model in order to accurately move to the positive and negative terminals of each LED chip 62.

[0082] Specifically, the frame 21 slides on the Y-axis track 23. The frame 21 is equipped with an X-axis track 22, a Y-axis rack 24, and a Y-axis rack 25. The soldering control unit includes a soldering tip and a moving base 28. The soldering tip slides on the X-axis track 22 along the moving base 28. The solder dispensing control unit includes a solder dispensing tube 27, which is integrally connected with the soldering tip 26 to dispensing solder. The servo drive system is a commonly used drive structure for automated equipment. This application adopts an active gear and fixed rack structure. The active gear and motor are respectively set on the base and the moving base 28, driving the frame 21 to move along the Y-axis and the moving base 28 to move along the X-axis, thereby achieving precise movement of the soldering tip in the XY-axis direction for soldering.

[0083] The packaging equipment structure design of the present invention, by having the chip carrier 4 actively align with the light strip 6, realizes the packaging process of simultaneously soldering and curing multiple LED chips 62 onto the conductor fiber core, significantly improving production efficiency. The technical solution of this application has now been described in conjunction with the preferred embodiments shown in the accompanying drawings. Those skilled in the art should understand that the scope of protection of this application is obviously not limited to these specific embodiments. Without departing from the principles of this application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of this application.

Claims

1. An LED strip packaging device, characterized in that: The device includes a light strip feeding device, a light strip stripping device, a first carrier lifting device, a soldering device, and a light strip take-up device arranged sequentially along the light strip transmission direction; as well as a rotary worktable, a patch carrier, and a patch loading device located vertically below the light strip and at the first carrier lifting device; the two ends of the light strip are respectively connected to the light strip feeding and take-up devices and move horizontally; the light strip includes several parallel enameled wires. The patch carrier is configured with first grooves for a plurality of parallel enameled wires with spacing and contour. The cross-section of the first groove is a "V" shape with the opening facing vertically upward. The enameled wires pass through the patch carrier horizontally through the first grooves. Several chip slots are provided vertically below the first grooves. Each chip slot is close to at least two adjacent enameled wires at both ends. The rotary worktable is equally loaded with several patch carriers, and the rotary worktable includes a loading station near the patch loading device and a unloading station near the first carrier lifting device. The chip loading device picks up several LED chips and places them into each chip slot. The rotary table reciprocates to transport the chip carrier carrying the LED chips to the unloading station. The first carrier lifting device includes a lifting rail, a lifting drive mechanism, a lifting platform and a pneumatic gripper. The lifting platform is set on the lifting rail for vertical sliding engagement, including a gripping station near the unloading station and a soldering station near the soldering device. The lifting drive mechanism drives the lifting platform and the pneumatic gripper to reciprocate vertically between the two stations. The pneumatic gripper is equipped with a pair of claws that are adapted to the contour of the surface mount carrier and grabs the surface mount carrier from the unloading station to the soldering station. The soldering device includes an automatic soldering machine, which solders the positive and negative terminals of the LED chips in each chip slot to the corresponding enameled wire conductor cores at the soldering station. The pneumatic gripper returns the empty carrier to the unloading station, and the LED strip feeding and winding device drives the enameled wire to move horizontally, carrying the soldered LED chip.

2. The LED strip packaging equipment according to claim 1, characterized in that: The patch feeding device includes a feeding track, several feeding robots, a sliding frame, a horizontal sliding track, a frame drive mechanism, a lifting cylinder, several suction cup mechanisms, and a suction cup lifting platform; The feeding track is provided with several feeding channels that are aligned with the chip slots of the chip carrier at the loading station. The end of the feeding channel near the loading station is the installation station. The several feeding robots pick up LED chips and put them into the feeding channels, and push the LED chips toward the installation station. The horizontal sliding track is connected between the waiting station and the loading station. The sliding frame slides with the horizontal sliding track. The frame drive mechanism includes a drive motor and a drive gear fixedly mounted on the sliding frame. The horizontal sliding track is provided with a rack that meshes with the drive gear. The drive motor drives the drive gear to rotate forward and backward, causing the sliding frame to reciprocate between the waiting station and the loading station. The sliding frame is vertically positioned with lifting slots corresponding to the chip slots. Several suction cup mechanisms are respectively installed in the lifting slots for sliding cooperation. Each suction cup mechanism includes a slider, a vacuum suction cup, and a vacuum pump. The vacuum suction cup is fixed to the slider and faces the chip slot. The slider has air holes that connect to the vacuum suction cup. Each air hole is connected to a vacuum pump hose. The vacuum pump controls each vacuum suction cup to pick up or put down the LED chip. The lifting platform is fixedly connected to each slider component and connected to the piston rod of the lifting cylinder. The lifting cylinder drives each vacuum suction cup to move synchronously closer to or away from the material conveying trough and chip trough.

3. The LED strip packaging equipment according to claim 2, characterized in that: A UV adhesive station is also provided between the soldering device and the LED strip take-up device. The UV adhesive station is equipped with a shadowless adhesive carrier, a second carrier lifting device, and an ultraviolet curing lamp. The shadowless adhesive carrier is located vertically below the LED strip in the UV adhesive station. The shadowless adhesive carrier is equipped with an adhesive tank facing the LED strip, an adhesive delivery pipe connected to the adhesive tank, and a second wire groove with a corresponding spacing and outline of several parallel enameled wires. The second carrier lifting device clamps the shadowless glue carrier close to or away from the light strip. When it is close to the light strip, the enameled wire is embedded in the second wire groove and the LED chip is embedded in the glue tank. The glue delivery pipe releases shadowless glue into the glue tank to immerse the LED chip and conductor fiber core. The ultraviolet curing lamp is positioned vertically above the UV adhesive station to irradiate the UV adhesive and cure and coat the LED chip and conductor fiber core; the adhesive delivery pipe is positioned relatively far from the ultraviolet fixing lamp and its vertical height is higher than the height of the LED chip in the adhesive tank.

4. The LED strip packaging equipment according to claim 3, characterized in that: The LED strip stripping device includes a lead tube and a blade. The lead tube has a central hole that matches the outline of the LED strip. The outer circumference of the lead tube has a radial adjustment seat and a blade groove that extends into the central hole. The radial adjustment seat has an elongated hole along the radial direction. The blade is inserted into the blade groove and has a threaded shaft on its side that extends into the elongated hole for sliding engagement. The threaded shaft passes through the elongated hole and is fixed with a nut.

5. The LED strip packaging equipment according to claim 4, characterized in that: The automatic soldering machine includes a frame, an X-axis track, a Y-axis track, a servo drive system, a servo control system, a solder dispensing control unit, and a soldering control unit.

6. The LED strip packaging equipment according to claim 5, characterized in that: The equipment also includes a detection mechanism, which is a photosensitive sensor located between the UV adhesive station and the LED strip winding station.

7. The LED strip packaging equipment according to claim 6, characterized in that: The several material conveying tracks have a stopping end near the end of the placement carrier. The stopping end is spaced at the same distance from the chip slot it is aligned with. When the lifting slots corresponding to the positions of each chip slot move to the loading station, they are aligned with the chip positions of each stopping end.

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