Heat pipe heat sink module

Abstract

A heat pipe heat dissipation module includes a plurality of first heat pipes, each of the first heat pipes having a plurality of narrow grooves and a first copper powder sintered on the outside of the narrow grooves; a plurality of second heat pipes, each of the second heat pipes having a plurality of wide grooves and a second copper powder sintered in the wide grooves; and at least one heat dissipation device, each of the first heat pipes and each of the second heat pipes being fixed to the heat dissipation device at one end, and the other end of each of the first heat pipes being located between the other end of each of the second heat pipes. By fixing the other end of each of the first heat pipes to the heat source of a processor and fixing the other end of each of the second heat pipes to the position adjacent to the outside of the processor, the heat generated by the processor can be more efficiently and evenly transferred compared to using the same specification heat pipe.

Description

Technical Field

[0001] This invention relates to a heat dissipation device, and more particularly to a heat pipe heat dissipation module for cooling a processor. Background Technology

[0002] As processor performance increases year by year, the heat generated by the internal chips also increases accordingly. High temperatures can reduce the overall performance of the chips and even affect their lifespan. Therefore, products with heat dissipation functions have emerged. Currently, the mainstream heat dissipation devices mainly use heat pipes to cool the processor. The main structure of a heat pipe includes a tube body, which is a sealed space. Multiple grooves are formed on the inner wall of the tube body, and a sintered part made of copper powder is formed on the surface of each groove. The tube body is filled with a working fluid. One end of the tube body is connected to the processor as the heat absorption end, and the other end is connected to a heat dissipation device as the heat dissipation end. The working fluid in the tube body is vaporized at the heat absorption end, moves to the heat dissipation end, liquefies, and is then transported to the heat absorption end through the capillary structure of the sintered part. This continuous cycle of vapor-liquid two-phase change and back-and-forth convection enables the tube body to achieve the effect of heat transfer.

[0003] Currently, heat pipes are classified into grooved heat pipes, sintered heat pipes, braided heat pipes, and composite heat pipes based on their internal capillary structures. Each capillary structure has its own advantages and limitations. Composite heat pipes mainly improve upon the shortcomings of existing heat pipes. Specifically, because the working fluid inside a heat pipe undergoes two-phase changes of vapor and liquid, and the liquid and vapor phases flow in opposite directions, they interfere with each other during the flow process, thus affecting the heat dissipation efficiency of the heat pipe. Composite heat pipes are composed of two or more capillary structures, such as grooves plus sintering, or grooves plus braided mesh, thereby improving heat transfer and the flow efficiency of the two-phase flow.

[0004] However, even with composite heat pipes, the increased volume of their internal capillary structure, while improving the flow efficiency of the liquid working fluid, actually reduces the flow space of the gaseous working fluid inside the pipe, thus affecting heat dissipation efficiency. Therefore, how to effectively utilize the characteristics of composite heat pipes to maximize heat dissipation efficiency is a problem worthy of in-depth consideration and improvement. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the present invention provides a heat pipe heat dissipation module, which achieves the purpose of uniform heat dissipation for the processor by providing a first heat pipe and a second heat pipe.

[0006] To achieve the above-mentioned objectives, the present invention employs a technical means of designing a heat pipe heat dissipation module, which includes:

[0007] Multiple first heat pipes, each of which has multiple narrow grooves and a first copper powder formed in the inner wall surface of the first heat pipe, each of which extends from one end of the first heat pipe toward the other end, and the first copper powder is fixed outside the groove opening of each narrow groove.

[0008] Multiple second heat pipes, each of which has multiple wide grooves and a second copper powder formed in the inner wall surface of the second heat pipe. Each wide groove extends from one end of the second heat pipe toward the other end, and the second copper powder is fixed and fills each wide groove.

[0009] At least one heat dissipation device, one end of each of the first heat pipes is fixed to the heat dissipation device, one end of each of the second heat pipes is fixed to the heat dissipation device, and the other end of each of the first heat pipes is located between the other ends of each of the second heat pipes.

[0010] Furthermore, in the heat pipe heat dissipation module, the outer diameter of the first copper powder is larger than the width of each of the narrow grooves.

[0011] Furthermore, in the heat pipe heat dissipation module, the outer diameter of the second copper powder is smaller than the width of each of the wide grooves.

[0012] Furthermore, the heat pipe heat dissipation module further includes a connecting piece, which is a metal sheet, and the other end of each of the first heat pipes and the other end of each of the second heat pipes are fixed to one side of the connecting piece.

[0013] Furthermore, in the heat pipe cooling module, the cooling device consists of multiple cooling fins arranged at intervals.

[0014] Furthermore, in the heat pipe heat dissipation module, the other end of each of the first heat pipes and the other end of each of the second heat pipes are located on the same horizontal plane.

[0015] The advantage of this invention lies in the fact that by fixing one end of each first heat pipe to the heat source position of the processor and one end of each second heat pipe to a position near the outer side of the processor, this invention can utilize the characteristics of the first heat pipe to conduct the high-temperature heat generated by the processor's heat source to the other end for heat dissipation in a manner where the amount of heat conducted per unit time is small but the number of cycles is large. Utilizing the characteristics of the second heat pipe, namely, its rapid heat absorption but slow working fluid return, it can conduct the lower-temperature heat generated on the outer side of the processor to the other end for heat dissipation in a manner where the amount of heat conducted per unit time is large but the number of cycles is small. Compared to using heat pipes of the same specification, this method can more evenly distribute the heat generated by the processor, reduce the temperature difference between different parts of the processor body, and thereby improve the heat dissipation efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the appearance of the present invention.

[0017] Figure 2 This is a partially enlarged view of the first heat pipe of the present invention.

[0018] Figure 3 This is a partially enlarged view of the second heat pipe of the present invention.

[0019] Figure 4 This is a schematic diagram of another embodiment of the present invention. Detailed Implementation

[0020] The following, in conjunction with the accompanying drawings and preferred embodiments of the present invention, further illustrates the technical means employed by the present invention to achieve its intended purpose.

[0021] Please see Figure 1 As shown, the heat pipe heat dissipation module of the present invention includes a plurality of first heat pipes 10, a plurality of second heat pipes 20, and at least one heat dissipation device 30.

[0022] Please see Figure 1 and Figure 2 As shown, the inner wall surface of each first heat pipe 10 is concave to form multiple narrow grooves 11 and a first copper powder 12. Each narrow groove 11 extends from one end of the first heat pipe 10 to the other end. From the cross-section, each narrow groove 11 forms an annular wave shape. The first copper powder 12 is located outside the groove opening of each narrow groove 11. In other words, the first copper powder 12 is fixed to the inner wall surface of the first heat pipe 10 but not fixed in each narrow groove 11, so that the inside of each narrow groove 11 can be kept as a smooth space. In this embodiment, the outer diameter of the first copper powder 12 is larger than the width of each narrow groove 11, but it is not limited to this. It is only necessary to ensure that the first copper powder 12 is not fixed in each narrow groove 11.

[0023] Please see Figure 1 and Figure 3 As shown, the inner wall surface of each second heat pipe 20 is concave to form multiple wide grooves 21 and second copper powder 22. Each wide groove 21 extends from one end of the second heat pipe 20 to the other end. From the cross-section, each wide groove 21 forms an annular wave shape. The second copper powder 22 is fixedly filled in each wide groove 21. In this embodiment, the outer diameter of the second copper powder 22 is smaller than the width of each wide groove 21, but this is not a limitation. It is only necessary to ensure that the second copper powder 22 is fixedly filled in each wide groove 21.

[0024] One end of each first heat pipe 10 is fixed to the heat dissipation device 30, and one end of each second heat pipe 20 is fixed to the heat dissipation device 30. The other end of each first heat pipe 10 is located between the other ends of each second heat pipe 20. In this embodiment, the heat dissipation device 30 consists of multiple heat dissipation fins, which are arranged at intervals. One end of each first heat pipe 10 and one end of each second heat pipe 20 are fixed to the heat dissipation device 30. The other end of each first heat pipe 10 and the other end of each second heat pipe 20 are located on the same horizontal plane, but this is not a limitation. The form of the heat dissipation device 30 can be changed according to the user's needs.

[0025] When using this invention, please refer to [the relevant documentation / reference]. Figures 1 to 3 As shown, this can be implemented in conjunction with a processor 40. The other end of each first heat pipe 10 and the other end of each second heat pipe 20 are fixed to one side of the processor 40. Specifically, the other end of each first heat pipe 10 is fixed near the center of the processor 40, where the center is the heat source and typically has the highest temperature. The other end of each second heat pipe 20 is fixed near the outer side of the processor 40, where the temperature is typically lower. This configuration is primarily based on the characteristics of the first heat pipe 10 and the second heat pipe 20. The first heat pipe 10 has a structure with unobstructed narrow grooves 11 and flow space on both sides of the first copper powder 12, thus exhibiting high-power characteristics of slow heat absorption but fast working fluid return. This allows the processor 40 to... The high-temperature heat generated by the heat source is conducted to the other end for heat dissipation in a manner where the amount of heat conducted per unit time is small but the number of cycles is large. The second heat pipe 20 is characterized by the second copper powder 22 filling the wide groove 21, making the inner wall surface of the second heat pipe 20 smooth. Compared with the first heat pipe 10, it has the characteristics of low thermal resistance with fast heat absorption but slow working fluid return. It can conduct the lower-temperature heat generated on the outside of the processor 40 to the other end for heat dissipation in a manner where the amount of heat conducted per unit time is large but the number of cycles is small. Compared with the existing technology that uses heat pipes of the same specification, it can more efficiently and evenly transfer the heat generated by the processor 40, reduce the temperature difference between different parts of the processor 40, and thereby improve the heat dissipation effect.

[0026] Please see Figure 4 As shown, another embodiment of the present invention is presented, wherein the first heat pipe 10, the second heat pipe 20, and the heat dissipation device 30 are the same as those in the aforementioned embodiment. The main difference is that a connecting piece 50 is further included. The connecting piece 50 is a metal sheet with good thermal conductivity, such as a copper sheet. The other end of each first heat pipe 10 and the other end of each second heat pipe 20 are fixed to one side of the connecting piece 50, but this is not a limitation. The form of the connecting piece 50 can be changed according to the user's needs. In use, the other side of the connecting piece 50 is covered and fixed to one side of the processor 40, thereby increasing the contact area with the processor 40 and improving the heat conduction efficiency.

[0027] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content as equivalent embodiments without departing from the scope of the technical solution of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A heat pipe cooling module, characterized in that, Include: Multiple first heat pipes, each of which has multiple narrow grooves and a first copper powder formed in the inner wall surface of the first heat pipe, each of which extends from one end of the first heat pipe toward the other end, and the first copper powder is fixed outside the groove opening of each narrow groove. Multiple second heat pipes, each of which has multiple wide grooves and a second copper powder formed in the inner wall surface of the second heat pipe. Each wide groove extends from one end of the second heat pipe toward the other end, and the second copper powder is fixed and fills each wide groove. At least one heat dissipation device, one end of each of the first heat pipes is fixed to the heat dissipation device, one end of each of the second heat pipes is fixed to the heat dissipation device, and the other end of each of the first heat pipes is located between the other ends of each of the second heat pipes.

2. The heat pipe cooling module as described in claim 1, characterized in that, The outer diameter of the first copper powder is larger than the width of each of the narrow grooves.

3. The heat pipe cooling module as described in claim 1 or 2, characterized in that, The outer diameter of the second copper powder is smaller than the width of each of the wide grooves.

4. The heat pipe cooling module as described in claim 3, characterized in that, It further includes a connecting piece, which is a metal sheet, and the other end of each of the first heat pipes and the other end of each of the second heat pipes are fixed to one side of the connecting piece.

5. The heat pipe cooling module as described in claim 4, characterized in that, The heat dissipation device consists of multiple heat dissipation fins, which are arranged at intervals.

6. The heat pipe cooling module as described in claim 5, characterized in that, The other end of each of the first heat pipes and the other end of each of the second heat pipes are located on the same horizontal plane.

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