Circuit board repairing device with repair point polishing function and method thereof

Abstract

The application discloses a circuit board repairing device with a maintenance point polishing function and a method thereof, and belongs to the technical field of circuit board processing. The device comprises a bottom plate, a position adjusting assembly for plane driving is fixedly connected to the top of the bottom plate, a special-shaped part clamping assembly for clamping a circuit board is connected to the driving end of the position adjusting assembly, the special-shaped part clamping assembly comprises a fixed support assembly and a movable support assembly, a fixing frame is further fixedly connected to the top of the bottom plate, a detection assembly for detection and a vertical adjusting assembly for vertical position adjustment are fixedly connected to the fixing frame from left to right, and the vertical adjusting assembly has two groups; a polishing assembly for maintenance point polishing and a tin repairing assembly for repairing are respectively connected to the driving end of the vertical adjusting assembly. The application has the following effects: the application realizes fast repairing of a circuit board; meanwhile, the position of the movable support assembly can be adjusted according to needs, and the special-shaped part clamping assembly can clamp a special-shaped circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and specifically to a circuit board repair device and method with a repair point grinding function. Background Technology

[0002] PCB, or Printed Circuit Board, may have solder joint defects during production, which need to be repaired using equipment.

[0003] For example, patent CN112362098B discloses an integrated circuit solder joint detection structure and method, belonging to the field of integrated circuit testing technology. It includes a mounting frame, a moving component, a circuit board fixing component, a desoldering detection component, a first solder joint detection component, a second solder joint detection component, and a solder joint repair component. The moving component is mounted on the mounting frame, the circuit board fixing component is mounted on the moving component, the desoldering detection component is located on top of the mounting frame, the first solder joint detection component is located on top of the mounting frame, the second solder joint detection component is located on top of the mounting frame, and the solder joint repair component includes a work frame, a solder joint repair component, and a circuit board cleaning component. The work frame is vertically mounted on top of the mounting frame, the solder joint repair component is mounted on the work frame and slides with the work frame, and the circuit board cleaning component is mounted on the solder joint repair component. This invention can achieve automatic detection of solder joints on circuit boards.

[0004] However, as mentioned above, the circuit board fixing components can only clamp relatively regular circuit boards. Irregularly shaped circuit boards will have protruding parts, and some of these protrusions are small. Clamping on small protrusions can easily result in large single-point clamping, which may cause damage and is not conducive to actual repair. In addition, the bottom of the repair grinding disc is flat, and during grinding, the solder pad pillars will be completely ground flat, which is not conducive to the absorption, cooling and forming of molten solder.

[0005] Based on this, the present invention designs a circuit board repair device and method with a repair point grinding function to solve the above problems. Summary of the Invention

[0006] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a circuit board repair device and method with a repair point grinding function.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A circuit board repair device with a repair point grinding function includes a base plate:

[0009] A position adjustment assembly for planar drive is fixedly connected to the top of the base plate;

[0010] The position adjustment component drive end is connected to a shaped part clamping component for holding the circuit board;

[0011] The irregular part clamping assembly includes a fixed support assembly and a movable support assembly. The fixed support assembly is connected to the movable support assembly at equal intervals. The fixed support assembly is in support contact with one end of the circuit board, and the movable support assembly is in contact with the other end of the circuit board at multiple points.

[0012] A fixing frame is also fixedly connected to the top of the base plate. From left to right, the fixing frame is fixedly connected to a detection component for detection and a vertical adjustment component for vertical position adjustment. There are two sets of vertical adjustment components.

[0013] The vertical adjustment component drive end is connected to a polishing component for polishing the repair point and a soldering component for repair.

[0014] The detection component, polishing component, and soldering component are all located above the position adjustment component.

[0015] Furthermore, the position adjustment assembly includes an X-axis drive assembly and a Y-axis drive assembly. The mounting cover of the X-axis drive assembly is fixedly installed on the top of the base plate, the mounting cover of the Y-axis drive assembly is fixedly installed on the drive end of the X-axis drive assembly, and the irregular part clamping assembly is fixedly installed on the drive end of the Y-axis drive assembly.

[0016] Furthermore, the fixed support assembly includes a first L-shaped plate and a first side groove. The first L-shaped plate is fixedly installed on the drive end of the Y-axis drive assembly. The first side groove is provided at the top front end of the protruding part at the rear end of the first L-shaped plate. The inner wall of the first side groove is in contact with one end of the circuit board.

[0017] Furthermore, the movable support assembly includes a cross-shaped slider, a first spring, a second L-shaped plate, a button, a second side groove, a first horizontal groove, a second horizontal groove, a fixing rod, a slide cylinder, a straight plate, a positioning hole, an insert plate, an inclined groove, a push rod, a second spring, a straight hole, and a connecting plate. The first L-shaped plate has a first horizontal groove at its front end. The first L-shaped plate has second horizontal grooves at equal intervals at the top of the first horizontal groove. A straight plate is fixedly connected at equal intervals to the top of the first L-shaped plate within the first horizontal groove. The straight plate is located on one side of the second horizontal groove. Positioning holes are equally spaced on the side wall of the straight plate near the second horizontal groove. The cross-shaped slider has second side grooves at both ends, and the inner wall of the second side groove is in contact with and slidably connected to the first L-shaped plate at the location of the second horizontal groove. The cross-shaped slider is close to the first... A first spring and a fixing rod are fixedly connected to the end face of the side groove. The end of the first spring near the first side groove is fixedly connected to the second L-shaped plate. The end of the second L-shaped plate away from the first side groove is fixedly connected to the slide cylinder. The outer wall of the fixing rod is slidably connected to the inner wall of the slide cylinder. A straight hole is opened at the top of the cross-shaped slider. A second spring is fixedly connected to the bottom of the straight hole. The top of the second spring is fixedly connected to the top of the button. The outer wall of the button is slidably connected to the inner wall of the straight hole. A connecting plate is fixedly connected to the top of the button. A push rod is fixedly connected to the lower end of the side wall of the connecting plate. An inclined groove is opened in the part of the insert plate in the straight hole. The inner wall of the inclined groove is slidably connected to the outer wall of the push rod. The insert plate is slidably connected to the moving hole opened in the cross-shaped slider. The outer end of the insert plate is inserted into the positioning hole.

[0018] Furthermore, when the push rod contacts the top of the inclined groove, the insert plate is inserted into the positioning hole; when the push rod contacts the bottom of the inclined groove, the insert plate is completely separated from the positioning hole.

[0019] Furthermore, the detection components include a supplementary light, a horizontal support frame, and a CCD camera. The horizontal support frame is fixedly installed on the side wall of the mounting bracket, and the CCD camera is installed in the mounting hole of the horizontal support frame. A supplementary light for supplementary lighting is connected to the lower end of the CCD camera.

[0020] Furthermore, the vertical adjustment assembly includes a cylinder, a fixed plate, a guide rail assembly, and a mounting plate. The fixed plate is fixedly installed on the side wall of the fixed frame. A cylinder is fixedly connected to the top of the fixed plate. The cylinder drive end is connected to the mounting plate. The mounting plate is fixedly connected to the slider of the guide rail assembly. The guide rail of the guide rail assembly is fixedly connected to the side wall of the upright part of the fixed plate. The bottom of the mounting plate is fixedly connected to the polishing assembly and the soldering assembly respectively.

[0021] Furthermore, the grinding assembly includes a motor, a first connecting frame, a suction pipe, a grinding blade, and a grinding motor. The motor is fixedly connected to a set of mounting plates, and the first connecting frame is fixedly connected to the output end of the motor. The suction pipe and the grinding motor are symmetrically installed at both ends of the first connecting frame. The grinding blade is fixedly connected to the drive end of the grinding motor. The radius of revolution of the grinding blade is the same as the diameter of the solder pad post of the solder joint, and the central axis of the motor coincides with the central axis of the solder pad post of the solder joint.

[0022] Furthermore, the soldering assembly includes a wire guide tube, a second connecting frame, a soldering iron, solder wire, and a fixing cylinder. The second connecting frame is fixedly connected to a set of mounting plates. The second connecting frame is connected to the fixing cylinder and the soldering iron. The top of the fixing cylinder is fixedly connected to the wire guide tube. The wire guide tube and the inner wall of the fixing cylinder are slidably connected to the solder wire, and the wire guide tube is connected to the external solder wire plastic assembly.

[0023] A repair method for a circuit board repair device with a repair point polishing function includes the following steps:

[0024] Step 1: Move the button on the movable support component of the irregular part clamping assembly downwards. The button drives the push rod downwards via the connecting plate. The push rod moves to the bottom of the inclined groove and pushes the insert plate until it is completely separated from the positioning hole. Push the button, and the button drives the second L-shaped plate to the front end. Place one end of the circuit board on the first side groove of the fixed support component. The button drives the push rod downwards via the connecting plate. The push rod moves to the bottom of the inclined groove and pushes the insert plate until it is completely separated from the positioning hole. Push the button, and the button drives the second L-shaped plate to the position corresponding to the other end of the circuit board and contact the other end of the circuit board. Release the button, and the second spring pushes the button downwards. The button drives the connecting plate upwards, and the connecting plate drives the push rod upwards. The push rod moves to the upper end of the inclined groove. The inclined groove and the push rod work together to push the insert plate into the positioning hole. The positioning hole and the insert plate work together to fix the cross-shaped slider. The first spring, the fixing rod, and the slide cylinder work together to ensure that the second L-shaped plate is always in contact with the other end of the circuit board, and the position of the second L-shaped plate is adjusted according to the corresponding position of the other end of the circuit board to achieve irregular part fixing.

[0025] Step 2: The X-axis drive component of the position adjustment component drives the Y-axis drive component to move in the X-axis direction, and the Y-axis drive component drives the irregular part clamping component to move in the Y-axis direction, so that the circuit board on the irregular part clamping component moves horizontally.

[0026] Step 3: The position adjustment component moves the circuit board held by the irregular part clamping component to the under the supplement light of the detection component. The CCD camera and the supplement light take pictures of the circuit board and send the pictures to the external system. The external system uses comparison technology to detect the location of the solder joints that need to be repaired.

[0027] Step 4: Based on the test results, the position adjustment component moves the solder joint to be repaired on the circuit board to below the grinding component. The vertical adjustment component at the grinding component moves the mounting plate downwards, and the mounting plate moves the motor of the grinding component downwards. The motor moves the grinding blade to the position of the solder joint to be repaired. The grinding motor drives the grinding blade to rotate, and at the same time, the motor drives the first connecting frame to rotate, realizing the revolution and rotation of the grinding blade. The grinding blade grinds the repair point, and the original solder pad pillars of the solder joint are preserved. The dust and debris generated by grinding are collected by the dust pipe, realizing the pre-repair treatment.

[0028] Step 5: The position adjustment component moves the solder joint position after the circuit board has been polished to below the solder repair component. The vertical adjustment component at the solder repair component moves the mounting plate downwards, which in turn moves the second connecting bracket of the solder repair component downwards. The second connecting bracket moves the fixing cylinder and the soldering iron downwards, and the heating end of the soldering iron contacts the solder joint on the circuit board at a 45-degree angle. The external solder wire plastic component delivers the guide wire to the solder joint, and the soldering iron heats and melts the guide wire. After the molten solder cools, a new solder joint is formed, thus repairing the solder joint.

[0029] The present invention has the following technical effects:

[0030] This invention places the circuit board on the fixed support component of the irregular part clamping assembly. The fixed support component makes contact with one end of the circuit board. By changing the shape of the circuit board and adjusting the position of each movable support component, each movable support component makes contact with the corresponding contact point at the other end of the circuit board, thus clamping and fixing the circuit board. The position adjustment component drives the clamped circuit board to move below the detection component. The detection component detects the circuit board. Based on the structure detected by the detection component, the position adjustment component moves the solder joints that need to be repaired on the circuit board to below the grinding component. The grinding component is connected to the vertical adjustment component to drive the grinding assembly. The component moves to the solder joint that needs repair. The grinding component grinds and removes dust from the solder joint, while preserving the original solder pads to facilitate the absorption and cooling of molten solder. After grinding, the position adjustment component moves the solder joint that needs repair to below the solder replenishment component based on the structure detected by the detection component. The solder replenishment component, connected to the solder replenishment component, moves to the solder joint that needs repair and resolders it, achieving rapid circuit board repair. At the same time, since the position of the movable support component can be adjusted as needed, the irregular part clamping component can clamp irregularly shaped circuit boards.

[0031] This invention moves the button of the movable support component of the irregular part clamping assembly downwards. The button drives the push rod downwards via the connecting plate. The push rod moves to the bottom of the inclined groove and pushes the insert plate until it is completely separated from the positioning hole. Pushing the button moves the second L-shaped plate to the foremost position, placing one end of the circuit board on the first side groove of the fixed support component. The button drives the push rod downwards via the connecting plate. The push rod moves to the bottom of the inclined groove and pushes the insert plate until it is completely separated from the positioning hole. Pushing the button moves the second L-shaped plate to the position corresponding to the other end of the circuit board and makes contact with the other end of the circuit board. Releasing the button causes the second spring to push the button downwards, which in turn drives the connecting plate upwards. The connecting plate drives the push rod upwards, and the push rod moves to the upper end of the inclined groove. The inclined groove and the push rod work together to push the insert plate into the positioning hole. The positioning hole and the insert plate work together to fix the cross-shaped slider. The first spring, the fixing rod, and the slide cylinder work together to ensure that the second L-shaped plate is always in contact with the other end of the circuit board, and the position of the second L-shaped plate is adjusted according to the corresponding position of the other end of the circuit board to achieve irregular part fixing.

[0032] The present invention comprises a position adjustment component, a detection component, a vertical adjustment component, a polishing component, and a soldering component, which work together to repair solder joints. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0034] Figure 1 This invention provides a three-dimensional circuit board repair device with a repair point polishing function. Figure 1 ;

[0035] Figure 2 This is a front view of a circuit board repair device with a repair point polishing function according to the present invention;

[0036] Figure 3 This invention provides a three-dimensional circuit board repair device with a repair point polishing function. Figure 2 ;

[0037] Figure 4 This invention provides a three-dimensional circuit board repair device with a repair point polishing function. Figure 3 ;

[0038] Figure 5 This invention provides a three-dimensional circuit board repair device with a repair point polishing function. Figure 4 ;

[0039] Figure 6 A three-dimensional view of the irregular part clamping assembly and its connection structure;

[0040] Figure 7 A front view of the irregular part clamping assembly and its connection structure;

[0041] Figure 8 Left view of the irregular part clamping assembly and its connection structure;

[0042] Figure 9 for Figure 8 A sectional view along the AA direction;

[0043] Figure 10 for Figure 9 Enlarged view of the structure at point B.

[0044] The labels in the diagram represent:

[0045] 1. Base plate 2. Position adjustment assembly 21. X-axis drive assembly 22. Y-axis drive assembly 3. Irregular part clamping assembly 31. First L-shaped plate 32. First side groove 33. Cross-shaped slider 34. First spring 35. Second L-shaped plate 36. Button 37. Second side groove 38. First horizontal groove 39. Second horizontal groove 310. Fixing rod 311. Slide cylinder 312. Straight plate 313. Positioning hole 314. Insert plate 315. Angled groove 316. Push rod 317. Second spring 318. Spring; 319. Straight hole; 4. Connecting plate; 5. Fixing bracket; 51. Detection component; 52. Fill light; 53. Horizontal support bracket; 6. CCD camera; 61. Vertical adjustment component; 62. Cylinder; 63. Fixing plate; 64. Guide rail component; 7. Mounting plate; 71. Grinding component; 72. Motor; 73. First connecting bracket; 74. Dust suction pipe; 75. Grinding knife; 86. Grinding motor; 87. Soldering component; 81. Wire guide tube; 82. Second connecting bracket; 83. Soldering iron; 84. Solder wire; 85. Fixing cylinder. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0047] The present invention will be further described below with reference to embodiments.

[0048] The terms "left," "right," "front," "back," "up," and "down" used in the following description refer to the orientation from the perspective of the front view.

[0049] Example 1

[0050] Please refer to the instruction manual appendix. Figure 1-10 A circuit board repair device with a repair point grinding function includes a base plate 1:

[0051] A position adjustment assembly 2 for planar drive is fixedly connected to the top of the base plate 1;

[0052] The position adjustment component 2 is connected to the irregular part clamping component 3 for clamping the circuit board at the drive end;

[0053] The irregular part clamping assembly 3 includes a fixed support assembly and a movable support assembly. The fixed support assembly is connected to the movable support assembly at equal intervals. The fixed support assembly is in support contact with one end of the circuit board, and the movable support assembly is in multi-point contact with the other end of the circuit board.

[0054] The top of the base plate 1 is also fixedly connected to a fixing frame 4. From left to right, the fixing frame 4 is fixedly connected to a detection component 5 for detection and a vertical adjustment component 6 for vertical position adjustment. There are two sets of vertical adjustment components 6.

[0055] The vertical adjustment component 6 is connected to a polishing component 7 for polishing the repair point and a soldering component 8 for repair at the drive end.

[0056] The detection component 5, polishing component 7, and soldering component 8 are all located above the position adjustment component 2.

[0057] The circuit board is placed on the fixed support component of the irregular part clamping assembly 3. The fixed support component makes contact with one end of the circuit board. The shape of the circuit board is changed to adjust the position of each movable support component. Each movable support component makes contact with the corresponding contact point at the other end of the circuit board to clamp and fix the circuit board. The position adjustment component 2 drives the clamped circuit board to move below the detection component 5. The detection component 5 detects the circuit board. The position adjustment component 2 moves the solder joint position that needs to be repaired on the circuit board to below the grinding component 7 according to the structure detected by the detection component 5. The grinding component 7 is connected to the vertical adjustment component 6 to drive the grinding component 7. The component moves to the solder joint that needs repair, and the grinding component 7 grinds and removes dust from the solder joint. The original solder pads are preserved to facilitate the absorption and cooling of the molten solder. After grinding, the position adjustment component 2 moves the position of the solder joint that needs repair to below the solder replenishment component 8 according to the structure detected by the detection component 5. The solder replenishment component 8 is moved to the solder joint that needs repair, and the solder replenishment component 8 re-solders the ground solder joint to achieve rapid circuit board repair. At the same time, since the position of the movable support component can be adjusted as needed, the irregular part clamping component 3 can clamp irregularly shaped circuit boards.

[0058] The position adjustment assembly 2 includes an X-axis drive assembly 21 and a Y-axis drive assembly 22. The mounting cover of the X-axis drive assembly 21 is fixedly installed on the top of the base plate 1, and the mounting cover of the Y-axis drive assembly 22 is fixedly installed on the drive end of the X-axis drive assembly 21. The irregular part clamping assembly 3 is fixedly installed on the drive end of the Y-axis drive assembly 22.

[0059] The X-axis drive component 21 of the position adjustment component 2 drives the Y-axis drive component 22 to move in the X-axis direction, and the Y-axis drive component 22 drives the irregular part clamping component 3 to move in the Y-axis direction, so that the circuit board on the irregular part clamping component 3 moves horizontally.

[0060] The fixed support assembly includes a first L-shaped plate 31 and a first side groove 32. The first L-shaped plate 31 is fixedly installed on the drive end of the Y-axis drive assembly 22. The first side groove 32 is provided at the top front end of the protruding part at the rear end of the first L-shaped plate 31. The inner wall of the first side groove 32 is in contact with one end of the circuit board.

[0061] The movable support assembly includes a cross-shaped slider 33, a first spring 34, a second L-shaped plate 35, a button 36, a second side groove 37, a first horizontal groove 38, a second horizontal groove 39, a fixing rod 310, a slide cylinder 311, a straight plate 312, a positioning hole 313, an insert plate 314, an inclined groove 315, a push rod 316, a second spring 317, a straight hole 318, and a connecting plate 319. The front end of the first L-shaped plate 31 has a first horizontal groove 38, and the first L-shaped plate 31 is located at the top of the first horizontal groove 38. A second transverse groove 39 is provided at equal intervals. A straight plate 312 is fixedly connected at equal intervals to the top of the first L-shaped plate 31 within the first transverse groove 39. The straight plate 312 is located on one side of the second transverse groove 39. Positioning holes 313 are provided at equal intervals on the side wall of the straight plate 312 near the second transverse groove 39. A second side groove 37 is provided at both ends of the cross-shaped slider 33. The inner wall of the second side groove 37 is in close contact with the first L-shaped plate 31 at the position of the second transverse groove 39 and is slidably connected. The cross-shaped slider 33 is close to the first side groove. A first spring 34 and a fixing rod 310 are fixedly connected to the end face of 32. The end of the first spring 34 near the first side groove 32 is fixedly connected to the second L-shaped plate 35. The end of the second L-shaped plate 35 away from the first side groove 32 is fixedly connected to the slide cylinder 311. The outer wall of the fixing rod 310 is slidably connected to the inner wall of the slide cylinder 311. A straight hole 318 is opened at the top of the cross-shaped slider 33. A second spring 317 is fixedly connected to the bottom of the straight hole 318. The top of the second spring 317 is connected to the button 3. The top of the button 36 is fixedly connected, the outer wall of the button 36 is slidably connected to the inner wall of the straight hole 318, the top of the button 36 is fixedly connected to the connecting plate 319, the lower end of the side wall of the connecting plate 319 is fixedly connected to the push rod 316, the insert plate 314 has a slanted groove 315 in the part of the straight hole 318, the inner wall of the slanted groove 315 is slidably connected to the outer wall of the push rod 316, the insert plate 314 is slidably connected to the moving hole of the cross-shaped slider 33, and the outer end of the insert plate 314 is inserted into the positioning hole 313;

[0062] When the push rod 316 contacts the top of the inclined groove 315, the insert plate 314 is inserted into the positioning hole 313; when the push rod 316 contacts the bottom of the inclined groove 315, the insert plate 314 is completely separated from the positioning hole 313.

[0063] The bottom of the first side groove 32 is flush with the top of the horizontal part of the second L-shaped plate 35;

[0064] The button 36 of the movable support component of the irregular part clamping assembly 3 is moved downward. The button 36 drives the push rod 316 downward through the connecting plate 319. The push rod 316 moves to the bottom of the inclined groove 315 and pushes the insert plate 314 until it is completely separated from the positioning hole 313. The button 36 is then pushed, and the button 36 drives the second L-shaped plate 35 to the foremost position. One end of the circuit board is placed on the first side groove 32 of the fixed support assembly. The button 36 drives the push rod 316 downward through the connecting plate 319. The push rod 316 moves to the bottom of the inclined groove 315 and pushes the insert plate 314 until it is completely separated from the positioning hole 313. The button 36 is then pushed, and the button 36 drives the second L-shaped plate 35 to move to the other side groove of the circuit board. When the button 36 is released, the second spring 317 pushes the button 36 downward, which in turn moves the connecting plate 319 upward. The connecting plate 319 then moves the push rod 316 upward. The push rod 316 moves to the upper end of the inclined groove 315. The inclined groove 315 and the push rod 316 work together to push the insert plate 314 into the positioning hole 313. The positioning hole 313 and the insert plate 314 work together to fix the cross-shaped slider 33. The first spring 34, the fixing rod 310, and the slide cylinder 311 work together to ensure that the second L-shaped plate 35 is always in contact with the other end of the circuit board. The position of the second L-shaped plate 35 is adjusted according to the corresponding position of the other end of the circuit board to achieve irregular shape fixing.

[0065] The detection component 5 includes a supplementary light 51, a horizontal support frame 52 and a CCD camera 53. The horizontal support frame 52 is fixedly installed on the side wall of the fixed frame 4. The CCD camera 53 is installed in the mounting hole of the horizontal support frame 52, and the lower end of the CCD camera 53 is connected to the supplementary light 51 for supplementary lighting.

[0066] The position adjustment component 2 moves the circuit board held by the irregular part clamping component 3 to below the supplementary light 51 of the detection component 5. The CCD camera 53 and the supplementary light 51 take pictures of the circuit board and send the pictures to the external system. The external system uses comparison technology to detect the location of the solder joints that need to be repaired.

[0067] The vertical adjustment assembly 6 includes a cylinder 61, a fixed plate 62, a guide rail assembly 63, and a mounting plate 64. The fixed plate 62 is fixedly installed on the side wall of the fixed frame 4. The top of the fixed plate 62 is fixedly connected to the cylinder 61. The driving end of the cylinder 61 is connected to the mounting plate 64. The mounting plate 64 is fixedly connected to the slider of the guide rail assembly 63. The guide rail of the guide rail assembly 63 is fixedly connected to the side wall of the upright part of the fixed plate 62. The bottom of the mounting plate 64 is fixedly connected to the polishing assembly 7 and the soldering assembly 8 respectively.

[0068] The position adjustment component 2 moves the solder joints of the circuit board to below the polishing component 7. The vertical adjustment component 6 at the polishing component 7 moves the mounting plate 64 downward, and the mounting plate 64 moves the polishing component 7 downward. The position adjustment component 2 moves the position of the solder joints after polishing to below the solder replenishment component 8. The vertical adjustment component 6 at the solder replenishment component 8 moves the mounting plate 64 downward, and the mounting plate 64 moves the solder replenishment component 8 downward, thereby realizing the vertical position adjustment of the polishing component 7 and the solder replenishment component 8.

[0069] The grinding assembly 7 includes a motor 71, a first connecting frame 72, a dust suction pipe 73, a grinding blade 74, and a grinding motor 75. The motor 71 is fixedly connected to a set of mounting plates 64. The output end of the motor 71 is fixedly connected to the first connecting frame 72. The dust suction pipe 73 and the grinding motor 75 are symmetrically installed at both ends of the first connecting frame 72. The driving end of the grinding motor 75 is fixedly connected to the grinding blade 74. The revolution radius of the grinding blade 74 is the same as the diameter of the solder pad post of the solder joint, and the central axis of the motor 71 coincides with the central axis of the solder pad post of the solder joint.

[0070] The suction pipe 73 is connected to external dust removal equipment via a pipe;

[0071] The guide rail assembly 63 drives the motor 71 of the polishing assembly 7 to move downwards. The motor 71 drives the polishing blade 74 to move to the position of the solder joint to be repaired. The polishing motor 75 drives the polishing blade 74 to rotate. At the same time, the motor 71 drives the first connecting frame 72 to rotate, realizing the revolution and rotation of the polishing blade 74. The polishing blade 74 polishes the repair point, and the original solder pad pillars of the solder joint are retained. The dust and debris generated by the dust and debris are collected by the dust and debris generated by the polishing, realizing the pre-repair treatment. The original solder pad pillars of the solder joint are retained, which is conducive to the adsorption and cooling of the molten solder.

[0072] The soldering assembly 8 includes a wire guide tube 81, a second connecting frame 82, a soldering iron 83, solder wire 84, and a fixing cylinder 85. The second connecting frame 82 is fixedly connected to a set of mounting plates 64. The second connecting frame 82 is connected to the fixing cylinder 85 and the soldering iron 83. The top of the fixing cylinder 85 is fixedly connected to the wire guide tube 81. The inner wall of the wire guide tube 81 and the fixing cylinder 85 are slidably connected to the solder wire 84, and the wire guide tube 81 is connected to the external solder wire plastic assembly.

[0073] The guide rail assembly 63 drives the second connecting frame 82 of the soldering assembly 8 to move downward. The second connecting frame 82 drives the fixed cylinder 85 and the soldering iron 83 to move downward. The heating end of the soldering iron 83 is in contact with the solder joint of the circuit board at a 45-degree angle. The external soldering wire plastic assembly delivers the guide wire tube 81 to the solder joint. The soldering iron 83 heats and melts the guide wire tube 81. After the molten solder cools, a new solder joint is formed, thus achieving solder joint repair.

[0074] A repair method for a circuit board repair device with a repair point polishing function includes the following steps:

[0075] Step 1: Move the button 36 of the movable support component of the irregular part clamping assembly 3 downwards. The button 36 drives the push rod 316 downwards via the connecting plate 319. The push rod 316 moves to the bottom of the inclined groove 315, pushing the insert plate 314 until it is completely separated from the positioning hole 313. Push the button 36, which drives the second L-shaped plate 35 to the foremost position, placing one end of the circuit board on the first side groove 32 of the fixed support assembly. The button 36 drives the push rod 316 downwards via the connecting plate 319. The push rod 316 moves to the bottom of the inclined groove 315, pushing the insert plate 314 until it is completely separated from the positioning hole 313. Push the button 36, which drives the second L-shaped plate 35 to the position of the circuit board. The other end of the circuit board is in contact with the other end of the circuit board. When the button 36 is released, the second spring 317 pushes the button 36 downward. The button 36 drives the connecting plate 319 upward. The connecting plate 319 drives the push rod 316 upward. The push rod 316 moves to the upper end of the inclined groove 315. The inclined groove 315 and the push rod 316 cooperate to push the insert plate 314 into the positioning hole 313. The positioning hole 313 and the insert plate 314 cooperate to fix the cross-shaped slider 33. The first spring 34, the fixing rod 310 and the slide cylinder 311 cooperate to ensure that the second L-shaped plate 35 is always in contact with the other end of the circuit board. The position of the second L-shaped plate 35 is adjusted according to the corresponding position of the other end of the circuit board to achieve irregular shape fixation.

[0076] Step 2: The X-axis drive component 21 of the position adjustment component 2 drives the Y-axis drive component 22 to move in the X-axis direction, and the Y-axis drive component 22 drives the irregular part clamping component 3 to move in the Y-axis direction, so that the circuit board on the irregular part clamping component 3 moves horizontally.

[0077] Step 3: Position adjustment component 2 moves the circuit board held by irregular part clamping component 3 to below the supplement light 51 of detection component 5. CCD camera 53 and supplement light 51 take pictures of the circuit board and send the pictures to the external system. The external system uses comparison technology to detect the location of solder joints that need to be repaired.

[0078] Step 4: Based on the test results, the position adjustment component 2 moves the solder joints of the circuit board to be repaired below the grinding component 7. The vertical adjustment component 6 at the grinding component 7 drives the mounting plate 64 to move downward. The mounting plate 64 drives the motor 71 of the grinding component 7 to move downward. The motor 71 drives the grinding blade 74 to move to the position of the repaired solder joint. The grinding motor 75 drives the grinding blade 74 to rotate. At the same time, the motor 71 drives the first connecting frame 72 to rotate, realizing the revolution and rotation of the grinding blade 74. The grinding blade 74 grinds the repair point, and the original solder pads are preserved. The dust and debris generated by the grinding are collected by the suction pipe 73, realizing the pre-repair treatment.

[0079] Step 5: Position adjustment component 2 moves the position of the solder joint after the circuit board is polished to below the solder repair component 8. Vertical adjustment component 6 at the solder repair component 8 moves the mounting plate 64 downward. Mounting plate 64 moves the second connecting bracket 82 of solder repair component 8 downward. The second connecting bracket 82 moves the fixing cylinder 85 and soldering iron 83 downward. The heating end of soldering iron 83 is in contact with the solder joint of the circuit board at a 45-degree angle. External solder wire plastic component delivers the guide tube 81 to the solder joint. Soldering iron 83 heats and melts the guide tube 81. After the solder cools, a new solder joint is formed, thus repairing the solder joint.

[0080] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit board repair device with a repair point grinding function, comprising a base plate (1), characterized in that: The top of the base plate (1) is fixedly connected to a position adjustment assembly (2) for planar drive; The position adjustment component (2) is connected to a shaped part clamping component (3) for clamping circuit boards at its drive end. The irregular part clamping assembly (3) includes a fixed support assembly and a movable support assembly. The fixed support assembly is connected to the movable support assembly at equal intervals. The fixed support assembly is in support contact with one end of the circuit board, and the movable support assembly is in multi-point contact with the other end of the circuit board. The top of the base plate (1) is also fixedly connected to a fixing frame (4). The fixing frame (4) is fixedly connected from left to right to a detection component (5) for detection and a vertical adjustment component (6) for vertical position adjustment. There are two sets of vertical adjustment components (6). The vertical adjustment component (6) is connected to a polishing component (7) for polishing the repair point and a soldering component (8) for repair. The detection component (5), polishing component (7) and soldering component (8) are all located above the position adjustment component (2); The vertical adjustment assembly (6) includes a cylinder (61), a fixing plate (62), a guide rail assembly (63), and a mounting plate (64). The fixing plate (62) is fixedly installed on the side wall of the fixing frame (4). The top of the fixing plate (62) is fixedly connected to the cylinder (61). The driving end of the cylinder (61) is connected to the mounting plate (64). The mounting plate (64) is fixedly connected to the slider of the guide rail assembly (63). The guide rail of the guide rail assembly (63) is fixedly connected to the side wall of the upright part of the fixing plate (62). The bottom of the mounting plate (64) is fixedly connected to the polishing assembly (7) and the soldering assembly (8) respectively. The grinding assembly (7) includes a motor (71), a first connecting frame (72), a dust suction pipe (73), a grinding blade (74), and a grinding motor (75). The motor (71) is fixedly connected to a set of mounting plates (64). The output end of the motor (71) is fixedly connected to the first connecting frame (72). The dust suction pipe (73) and the grinding motor (75) are symmetrically installed at both ends of the first connecting frame (72). The driving end of the grinding motor (75) is fixedly connected to the grinding blade (74). The revolution radius of the grinding blade (74) is the same as the diameter of the solder pad post of the solder joint, and the central axis of the motor (71) coincides with the central axis of the solder pad post of the solder joint. The soldering assembly (8) includes a wire guide tube (81), a second connecting frame (82), a soldering iron (83), solder wire (84), and a fixing cylinder (85). The second connecting frame (82) is fixedly connected to a set of mounting plates (64). The second connecting frame (82) is connected to the fixing cylinder (85) and the soldering iron (83). The top of the fixing cylinder (85) is fixedly connected to the wire guide tube (81). The inner walls of the wire guide tube (81) and the fixing cylinder (85) are slidably connected to the solder wire (84). The wire guide tube (81) is connected to the external solder wire plastic assembly.

2. The circuit board repair device with repair point polishing function according to claim 1, characterized in that, The position adjustment assembly (2) includes an X-axis drive assembly (21) and a Y-axis drive assembly (22). The mounting cover of the X-axis drive assembly (21) is fixedly installed on the top of the base plate (1), and the mounting cover of the Y-axis drive assembly (22) is fixedly installed on the drive end of the X-axis drive assembly (21). The irregular part clamping assembly (3) is fixedly installed on the drive end of the Y-axis drive assembly (22).

3. A circuit board repair device with a repair point grinding function according to claim 2, characterized in that, The fixed support assembly includes a first L-shaped plate (31) and a first side groove (32). The first L-shaped plate (31) is fixedly installed on the drive end of the Y-axis drive assembly (22). The first side groove (32) is provided at the top front end of the protruding part at the rear end of the first L-shaped plate (31). The inner wall of the first side groove (32) is in contact with one end of the circuit board.

4. A circuit board repair device with a repair point grinding function according to claim 3, characterized in that, The movable support assembly includes a cross-shaped slider (33), a first spring (34), a second L-shaped plate (35), a button (36), a second side groove (37), a first horizontal groove (38), a second horizontal groove (39), a fixing rod (310), a slide cylinder (311), a straight plate (312), a positioning hole (313), an insert plate (314), an inclined groove (315), a push rod (316), a second spring (317), a straight hole (318), and a connecting plate (319). The front end of the first L-shaped plate (31) has a first horizontal groove (38). The first L-shaped plate (31) has a first horizontal groove (38) at the front end. A second transverse groove (39) is provided at equal intervals at the top of the transverse groove (38). A straight plate (312) is fixedly connected at equal intervals to the top of the first L-shaped plate (31) inside the first transverse groove (38). The straight plate (312) is located on one side of the second transverse groove (39). Positioning holes (313) are provided at equal intervals on the side wall of the straight plate (312) near the second transverse groove (39). A second side groove (37) is provided at both ends of the cross-shaped slider (33). The inner wall of the second side groove (37) is in close contact with the part of the first L-shaped plate (31) at the second transverse groove (39). The cross-shaped slider (33) is close to the second side groove (39). A first spring (34) and a fixing rod (310) are fixedly connected to the end face of the first side groove (32). The end of the first spring (34) near the first side groove (32) is fixedly connected to the second L-shaped plate (35). The end of the second L-shaped plate (35) away from the first side groove (32) is fixedly connected to the slide cylinder (311). The outer wall of the fixing rod (310) is slidably connected to the inner wall of the slide cylinder (311). A straight hole (318) is opened at the top of the cross-shaped slider (33). A second spring (317) is fixedly connected to the bottom of the straight hole (318). The top of the second spring (317) is connected to the pressing rod (310). The top of the button (36) is fixedly connected, the outer wall of the button (36) is slidably connected to the inner wall of the straight hole (318), the top of the button (36) is fixedly connected to the connecting plate (319), the lower end of the side wall of the connecting plate (319) is fixedly connected to the push rod (316), the insert plate (314) has a slanted groove (315) in the part of the straight hole (318), the inner wall of the slanted groove (315) is slidably connected to the outer wall of the push rod (316), the insert plate (314) is slidably connected to the moving hole of the cross-shaped slider (33), and the outer end of the insert plate (314) is inserted into the positioning hole (313).

5. A circuit board repair device with a repair point polishing function according to claim 4, characterized in that, When the push rod (316) contacts the top of the inclined groove (315), the insert plate (314) is inserted into the positioning hole (313). When the push rod (316) contacts the bottom of the inclined groove (315), the insert plate (314) is completely separated from the positioning hole (313).

6. A circuit board repair device with a repair point polishing function according to claim 5, characterized in that, The detection component (5) includes a fill light (51), a horizontal support frame (52) and a CCD camera (53). The horizontal support frame (52) is fixedly installed on the side wall of the fixed frame (4). The CCD camera (53) is installed in the mounting hole of the horizontal support frame (52), and the lower end of the CCD camera (53) is connected to a fill light (51) for filling light.

7. A repair method for a circuit board repair device with a repair point polishing function as described in claim 6, characterized in that, Includes the following steps: Step 1: Move the button (36) of the movable support component of the irregular part clamping assembly (3) downwards. The button (36) drives the push rod (316) downwards through the connecting plate (319). The push rod (316) moves to the bottom of the inclined groove (315) and pushes the insert plate (314) until it is completely separated from the positioning hole (313). Push the button (36). The button (36) drives the second L-shaped plate (35) to the front end. Place one end of the circuit board on the first side groove (32) of the fixed support assembly. The button (36) drives the push rod (316) downwards through the connecting plate (319). The push rod (316) moves to the bottom of the inclined groove (315) and pushes the insert plate (314) until it is completely separated from the positioning hole (313). Push the button (36) to move. The button (36) drives the second L-shaped plate (35) to the front end. When the other end of the circuit board contacts the other end of the circuit board, the button (36) is released. The second spring (317) pushes the button (36) downward. The button (36) drives the connecting plate (319) upward. The connecting plate (319) drives the push rod (316) upward. The push rod (316) moves to the upper end of the inclined groove (315). The inclined groove (315) and the push rod (316) work together to push the insert plate (314) into the positioning hole (313). The positioning hole (313) and the insert plate (314) work together to fix the cross-shaped slider (33). The first spring (34), the fixing rod (310) and the slide cylinder (311) work together to ensure that the second L-shaped plate (35) is always in contact with the other end of the circuit board. The position of the second L-shaped plate (35) is adjusted according to the corresponding position of the other end of the circuit board to achieve irregular shape fixing. Step 2: The X-axis drive assembly (21) of the position adjustment assembly (2) drives the Y-axis drive assembly (22) to move in the X-axis direction, and the Y-axis drive assembly (22) drives the irregular part clamping assembly (3) to move in the Y-axis direction, so that the circuit board on the irregular part clamping assembly (3) moves horizontally; Step 3: The position adjustment component (2) moves the circuit board held by the irregular part clamping component (3) to the underside of the supplement light (51) of the detection component (5). The CCD camera (53) and the supplement light (51) take pictures of the circuit board and send the pictures to the external system. The external system uses comparison technology to detect the location of the solder joints that need to be repaired. Step 4: Based on the test results, the position adjustment component (2) moves the solder joints of the circuit board to be repaired below the grinding component (7). The vertical adjustment component (6) at the grinding component (7) drives the mounting plate (64) to move downward. The mounting plate (64) drives the motor (71) of the grinding component (7) to move downward. The motor (71) drives the grinding blade (74) to move to the position of the repaired solder joint. The grinding motor (75) drives the grinding blade (74) to rotate. At the same time, the motor (71) drives the first connecting frame (72) to rotate, realizing the revolution and rotation of the grinding blade (74). The grinding blade (74) grinds the repair point, and the original solder pad pillars of the solder joint are retained. The dust suction pipe (73) collects the dust and debris generated by grinding, realizing the pre-repair treatment. Step 5: The position adjustment component (2) moves the solder joint position of the circuit board after grinding to below the solder replenishment component (8). The vertical adjustment component (6) at the solder replenishment component (8) drives the mounting plate (64) to move downward. The mounting plate (64) drives the second connecting frame (82) of the solder replenishment component (8) to move downward. The second connecting frame (82) drives the fixed cylinder (85) and the soldering iron (83) to move downward. The heating end of the soldering iron (83) is in contact with the solder joint of the circuit board at a 45-degree angle. The external soldering wire plastic component sends the guide tube (81) to the solder joint. The soldering iron (83) heats and melts the guide tube (81). After the solder cools down, a new solder joint is formed, thus realizing the solder joint repair.

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