An epoxy resin material, a preparation method and application thereof

Abstract

The present application relates to the technical field of epoxy resin composition, in particular to an epoxy resin material and its preparation method and application. The raw materials for preparing the epoxy resin material contain a first epoxy resin, a curing agent, an inorganic filler, an ion capture agent, a low stress modifier, a coupling agent, a curing accelerator, a flame retardant, a colorant and a release agent, wherein the release agent is prepared by mixing a second epoxy resin, a wetting dispersant and a release agent compound under the conditions of inert atmosphere and 120-160 DEG C for 3-6h, and the release agent compound is a mixture of Montan S wax, micro powder polishing wax and micro powder polypropylene wax. The epoxy resin material has high anti-dirt capacity on the product surface, and the product surface is normal and free of sticking after 400 continuous packaging, and the product has good delamination performance after three times of reflow soldering, which can meet the requirements of customers in packaging SOP / SOT products.

Description

Technical Field

[0001] This invention relates to the field of epoxy resin composition technology, specifically to an epoxy resin material, its preparation method, and its application. Background Technology

[0002] As semiconductor packaging technology gradually moves towards miniaturization, thinning, and integration, it faces an increasing number of packaging problems, ranging from appearance defects to reliability failures. Under the same conditions, product appearance is undoubtedly the most direct and fundamental standard for evaluating the quality of packaging materials. For SOP / SOT packaged products, appearance defects mainly include mold sticking, overflow, incomplete sealing, uneven surface color, pores, and pitting. Improving uneven surface color depends on the specific defects. The cause of uneven surface color may be uneven dispersion of colorants in the system or poor dispersion of release agents. For the latter, the common practice in the industry is to screen different release agents or add some dispersing agents to the system. Summary of the Invention

[0003] The purpose of this invention is to address the problem of uneven surface color in SOP / SOT packaged products caused by poor dispersibility of the release agent in existing technologies. This invention proposes an epoxy resin material, its preparation method, and its application. This epoxy resin material utilizes a specific type of release agent reacting with a wetting and dispersing agent and epoxy resin under certain conditions to obtain a release agent chemical. Using this release agent chemical to prepare the epoxy resin material can significantly alleviate the problem of uneven surface color in SOP / SOT packaged products, thereby improving the product appearance.

[0004] To achieve the above objectives, the first aspect of the present invention provides an epoxy resin material, wherein the raw materials for preparing the epoxy resin molding material contain a first epoxy resin, a curing agent, an inorganic filler, an ion scavenger, a low-stress modifier, a coupling agent, a curing accelerator, a flame retardant, a colorant, and a release agent compound, wherein the release agent compound is obtained by mixing a second epoxy resin, a wetting and dispersing agent, and a release agent compound under an inert atmosphere and at 120-160°C for 3-6 hours, and the release agent compound is a mixture of montan S wax, micronized polishing wax, and micronized polypropylene wax.

[0005] Preferably, the weight ratio of the second epoxy resin, the wetting and dispersing agent and the release agent compound is 1:0.01-0.2:0.25-1.

[0006] Preferably, the weight ratio of the montana S wax, the micronized polypropylene wax and the micronized polishing wax is 1-4:0.5-2:1.

[0007] Preferably, based on the total weight of the raw materials for preparing the epoxy resin material (100% by weight), the content of the first epoxy resin is 2-8% by weight, the content of the curing agent is 2-7% by weight, the content of the inorganic filler is 70-90% by weight, the content of the ion scavenger is 0.1-1% by weight, the content of the low-stress modifier is 0.1-1% by weight, the content of the coupling agent is 0.1-1% by weight, the content of the curing accelerator is 0.1-1% by weight, the content of the flame retardant is 1-10% by weight, the content of the colorant is 0.1-0.9% by weight, and the content of the release agent is 0.1-2% by weight.

[0008] Preferably, the first epoxy resin and the second epoxy resin are each independently selected from one or more of the following: biphenyl crystalline epoxy resin, phenol phenylalkyl epoxy resin, phenol biphenyl epoxy resin, and dicyclopentadiene epoxy resin.

[0009] Preferably, the curing agent is selected from linear phenolic resins and / or polycyclic aromatic phenolic resins.

[0010] Preferably, the inorganic filler is molten silica and / or titanium dioxide.

[0011] Preferably, the ion-scavenging agent is hydrotalcite.

[0012] Preferably, the coupling agent is selected from one or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane.

[0013] Preferably, the curing accelerator is selected from one or more of triphenylphosphine, triphenylphosphine-p-benzoquinone adduct, and diazabicyclohexane.

[0014] Preferably, the flame retardant is selected from one or more of phosphorus-based flame retardants, nitrogen-based flame retardants, phosphorus-nitrogen flame retardants, and hydroxide flame retardants.

[0015] Preferably, the colorant is carbon black.

[0016] A second aspect of the present invention provides a method for preparing the epoxy resin material described above, the method comprising: pulverizing the raw materials for preparing the epoxy resin material, and then mixing, cooling, and pulverizing them to obtain the epoxy resin material.

[0017] Preferably, the mixing conditions include: a temperature of 70-90°C and a time of 7-15 minutes.

[0018] A third aspect of the present invention provides the application of the epoxy resin material described above or the epoxy resin material prepared by the method described above as an SOP / SOT encapsulation material.

[0019] Compared with the prior art, the present invention has the following main advantages:

[0020] This invention obtains a release agent chemical by reacting a specific type of release agent under certain conditions. This can improve the dispersibility of the release agent in the resin system. Therefore, the epoxy resin material prepared using this release agent chemical can significantly improve the appearance quality of SOP / SOT type packaging products. The maximum number of times the product becomes dirty on the surface is greater than 400, while maintaining high reliability. Detailed Implementation

[0021] The following provides a detailed description of specific embodiments of the present invention. It should be understood that the specific embodiments described herein are for illustrative and explanatory purposes only and are not intended to limit the scope of the invention.

[0022] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0023] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of technical features indicated. Therefore, unless otherwise stated, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0024] The first aspect of this invention provides an epoxy resin material, the raw materials for which the epoxy resin material is prepared contain a first epoxy resin, a curing agent, an inorganic filler, an ion scavenger, a low-stress modifier, a coupling agent, a curing accelerator, a flame retardant, a colorant, and a release agent compound. The release agent compound is obtained by mixing a second epoxy resin, a wetting and dispersing agent, and a release agent compound under an inert atmosphere and at 120-160°C for 3-6 hours. The release agent compound is a mixture of montan S wax, micronized polishing wax, and micronized polypropylene wax.

[0025] In a preferred embodiment, both the micronized polishing wax and the micronized polypropylene wax were purchased from Tianshi New Materials Technology Co., Ltd.

[0026] In the epoxy resin material of the present invention, in a specific embodiment, based on the total weight of the raw materials for preparing the epoxy resin molding material as 100% by weight, the content of the first epoxy resin is 2-8% by weight, the content of the curing agent is 2-7% by weight, the content of the inorganic filler is 70-90% by weight, the content of the ion scavenger is 0.1-1% by weight, the content of the low-stress modifier is 0.1-1% by weight, the content of the coupling agent is 0.1-1% by weight, the content of the curing accelerator is 0.1-1% by weight, the content of the flame retardant is 1-10% by weight, the content of the colorant is 0.1-0.9% by weight, and the content of the release agent is 0.1-2% by weight.

[0027] In a preferred embodiment, based on the total weight of the raw materials for preparing the epoxy resin material as 100% by weight, the content of the first epoxy resin is 2-7% by weight, the content of the curing agent is 2-6% by weight, the content of the inorganic filler is 75-88% by weight, the content of the ion scavenger is 0.1-0.8% by weight, the content of the low-stress modifier is 0.1-0.8% by weight, the content of the coupling agent is 0.1-0.8% by weight, the content of the curing accelerator is 0.2-1% by weight, the content of the flame retardant is 1-9% by weight, the content of the colorant is 0.1-0.8% by weight, and the content of the release agent is 0.2-2% by weight.

[0028] Furthermore, based on the total weight of the raw materials used in the preparation of the epoxy resin material as 100% by weight, the content of the first epoxy resin is 2-6% by weight, the content of the curing agent is 2-5% by weight, the content of the inorganic filler is 80-87% by weight, the content of the ion scavenger is 0.1-0.7% by weight, the content of the low-stress modifier is 0.2-0.8% by weight, the content of the coupling agent is 0.2-0.8% by weight, the content of the curing accelerator is 0.2-0.9% by weight, the content of the flame retardant is 2-9% by weight, the content of the colorant is 0.1-0.7% by weight, and the content of the release agent is 0.5-2% by weight.

[0029] In the epoxy resin material described in this invention, in specific embodiments, the first epoxy resin and the second epoxy resin can be conventional choices in the art. In a preferred embodiment, the first epoxy resin and the second epoxy resin are each independently selected from one or more of biphenyl crystalline epoxy resin, phenol phenylalkyl epoxy resin, phenol biphenyl epoxy resin, and dicyclopentadiene epoxy resin.

[0030] In the epoxy resin material described in this invention, in specific embodiments, the curing agent can be a conventional choice in the art. In a preferred embodiment, the curing agent is selected from linear phenolic resins and / or polycyclic aromatic phenolic resins.

[0031] In the epoxy resin material described in this invention, in specific embodiments, the inorganic filler can be a conventional choice in the art. In a preferred embodiment, the inorganic filler is fused silica and / or titanium dioxide.

[0032] In the epoxy resin material described in this invention, in specific embodiments, the ion scavenger can be a conventional choice in the art, for example, selected from one or more of anion scavengers, cationic scavengers, and anion-cation composite ion scavengers. In a preferred embodiment, the ion scavenger is hydrotalcite. In a more preferred embodiment, the hydrotalcite is magnesium aluminum carbonate type hydrotalcite: Mg6Al2(OH). 16 CO3·4H2O.

[0033] In the epoxy resin material described in this invention, in specific embodiments, the low-stress modifier can be a conventional choice in the art. In a preferred embodiment, the low-stress modifier is a core-shell elastomer, specifically, the core-shell elastomer is purchased from Kaneka Corporation of Japan, with the brand name MZ-120.

[0034] In the epoxy resin material described in this invention, in specific embodiments, the coupling agent can be a conventional choice in the art. In a preferred embodiment, the coupling agent is selected from one or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane.

[0035] In the epoxy resin material described in this invention, in specific embodiments, the curing accelerator can be a conventional choice in the art. In a preferred embodiment, the curing accelerator is selected from one or more of triphenylphosphine, triphenylphosphine-p-benzoquinone adduct, and diazabicyclohexane.

[0036] In the epoxy resin material described in this invention, in specific embodiments, the flame retardant can be a conventional choice in the art. In a preferred embodiment, the flame retardant is selected from one or more of phosphorus-based flame retardants, nitrogen-based flame retardants, phosphorus-nitrogen flame retardants, and hydroxide flame retardants. In a more preferred embodiment, the flame retardant is hexaphenoxycyclotriphosphazene.

[0037] In the epoxy resin material described in this invention, in specific embodiments, the colorant can be a conventional choice in the art. In a preferred embodiment, the colorant is carbon black.

[0038] In a specific embodiment, the preparation method of the release agent compound is as follows: the second epoxy resin is put into a reaction vessel at 120℃-160℃, an inert gas is introduced, and after the second epoxy resin is completely melted, stirring is started, and the wetting and dispersing agent and the release agent compound are added in sequence, and stirring is continued for 3-6 hours, with an inert gas atmosphere maintained throughout the process.

[0039] In the epoxy resin material described in this invention, in specific embodiments, the wetting and dispersing agent can be a conventional choice in the art. In a preferred embodiment, the wetting and dispersing agent is a commercially available product, SLC-7835, purchased from Silicon Coating (Shanghai) New Materials Co., Ltd.

[0040] In the epoxy resin material described in this invention, in order to improve the dispersibility of the release agent in the resin system, improve the appearance of SOP / SOT type packaged products, and give the product a high resistance to surface contamination, in a specific embodiment, the weight ratio of the second epoxy resin, the wetting and dispersing agent and the release agent compound is 1:0.01-0.2:0.25-1, for example, it can be 1:0.05:0.25, 1:0.07:0.25, 1:0.1:0.3, 1:0.1:0.35, 1:0.1:0.45, 1:0.1:0.5, 1:0.15:0.75 or 1:0.2:1.

[0041] In a preferred embodiment, the weight ratio of the second epoxy resin, the wetting and dispersing agent and the release agent compound is 1:0.05-0.1:0.25-0.5.

[0042] In this invention, preferably, the release agent compound is prepared by mixing a second epoxy resin, a wetting and dispersing agent, and a release agent compound under an inert atmosphere and at 140-150°C for 4-5 hours. Specifically, the inert atmosphere used is nitrogen.

[0043] In the epoxy resin material described in this invention, to ensure that the obtained epoxy resin molding material has high resistance to surface contamination when encapsulating SOP / SOT type products, the maximum number of times the product surface becomes dirty is higher than 400. In a specific embodiment, the weight ratio of the montana S wax, the micronized polypropylene wax, and the micronized polishing wax is 1-4:0.5-2:1, for example, it can be 1:1:1, 1.3:1:1, 1.3:0.7:1, 1.5:1:1, 3:1:1, 3:2:1, 4:1:1, or 4:2:1.

[0044] In this invention, the micronized polypropylene wax was purchased from Tianshi New Materials Technology Co., Ltd., and its grade is Twax0506.

[0045] In this invention, the micro-powder polishing wax was purchased from Tianshi New Material Technology Co., Ltd., and its brand name is PPW-0936.

[0046] A second aspect of the present invention provides a method for preparing the epoxy resin material described above, the method comprising: pulverizing the raw materials for preparing the epoxy resin molding material, and then mixing, cooling, and pulverizing them to obtain the epoxy resin material.

[0047] In the method described in this invention, in a specific embodiment, the mixing conditions include: a temperature of 70-90°C and a time of 7-15 minutes.

[0048] A third aspect of the present invention provides the application of the epoxy resin material described above or the epoxy resin material prepared by the method described above as an SOP / SOT encapsulation material.

[0049] The present invention will be described in detail below through embodiments, but the scope of protection of the present invention is not limited thereto.

[0050] In the following examples and comparative examples:

[0051] A1 (Epoxy Resin): Biphenyl crystalline epoxy resin, purchased from Regina Electronic Materials (Shanghai) Co. Ltd, grade 1100AL;

[0052] A2 (Epoxy Resin): Phenolic phenylalkyl type epoxy resin, purchased from Nippon Kayaku Co. Ltd, grade NC3000;

[0053] B1 (curing agent): linear phenolic resin, purchased from Japan DIC Corporation, brand name TD-2131;

[0054] B2 (curing agent): Phenolic phenylalkyl phenolic resin, purchased from Meiwa Plastic Inductries Ltd, brand name MEH-7851ss;

[0055] C (Inorganic filler): Fused silica powder, purchased from Jiangsu Lianrui New Material Co., Ltd., grade NQ-101;

[0056] D1 (curing accelerator): Triphenylphosphine, commercially available;

[0057] D2 (curing accelerator): Diazabicyclohexane, commercially available;

[0058] E (low-stress modifier): Core-shell structure elastomer, purchased from Kaneka Corporation of Japan, brand name MZ-120;

[0059] F (coupling agent): γ-mercaptopropyltrimethoxysilane, commercially available;

[0060] G (Flame retardant): Hexaphenoxycyclotriphosphazene, commercially available;

[0061] H (colorant): Carbon black;

[0062] I (ion scavenger): Magnesium aluminum carbonate root-type hydrotalcite: Mg6Al2(OH) 16 CO3·4H2O, commercially available;

[0063] Wetting and dispersing agent: purchased from Silicon Coating (Shanghai) New Materials Co., Ltd., brand name SLC-7835;

[0064] Montana S Wax: Commercially available;

[0065] Micronized polishing wax: purchased from Tianshi New Materials Technology Co., Ltd., brand name PPW-0936;

[0066] Micronized polypropylene wax: purchased from Tianshi New Materials Technology Co., Ltd., brand name Twax0506.

[0067] The raw material formulations for preparing epoxy resin materials in Examples 1-8 are shown in Table 1.

[0068] Example 1

[0069] Preparation of the release agent compound: Biphenyl crystalline epoxy resin was placed in a reaction vessel at 140°C and nitrogen gas was introduced. After the biphenyl crystalline epoxy resin was completely melted, a wetting and dispersing agent and a release agent compound (a mixture of montana S wax, micronized polishing wax and micronized polypropylene wax) were added sequentially under stirring and mixed for 4 hours to obtain the release agent compound. The weight ratio of biphenyl crystalline epoxy resin, montana S wax, micronized polishing wax, micronized polypropylene wax and dispersing and wetting agent was 1:0.2:0.15:0.15:0.1.

[0070] Preparation of epoxy resin material: The raw materials for preparing epoxy resin material (see Table 1) are crushed, then mixed at 80℃ for 8 minutes, cooled and crushed to obtain epoxy resin material.

[0071] Example 2

[0072] Preparation of the release agent compound: Biphenyl crystalline epoxy resin was placed in a reaction vessel at 120°C and nitrogen gas was introduced. After the biphenyl crystalline epoxy resin was completely melted, a wetting and dispersing agent and a release agent compound (a mixture of montana S wax, micronized polishing wax and micronized polypropylene wax) were added sequentially under stirring and mixed for 6 hours to obtain the release agent compound. The weight ratio of biphenyl crystalline epoxy resin, montana S wax, micronized polishing wax, micronized polypropylene wax and dispersing and wetting agent was 1:0.25:0.1:0.15:0.1.

[0073] Preparation of epoxy resin material: The raw materials for preparing epoxy resin material (see Table 1) are crushed, then mixed at 70℃ for 15 min, cooled and crushed to obtain epoxy resin material.

[0074] Example 3

[0075] Preparation of the release agent compound: Biphenyl crystalline epoxy resin was placed in a reaction vessel at 160°C and nitrogen gas was introduced. After the biphenyl crystalline epoxy resin was completely melted, a wetting and dispersing agent and a release agent compound (a mixture of montana S wax, micronized polishing wax and micronized polypropylene wax) were added sequentially under stirring and mixed for 3 hours to obtain the release agent compound. The weight ratio of biphenyl crystalline epoxy resin, montana S wax, micronized polishing wax, micronized polypropylene wax and dispersing and wetting agent was 1:0.25:0.05:0.2:0.1.

[0076] Preparation of epoxy resin material: The raw materials for preparing epoxy resin material (see Table 1) are crushed, then mixed at 90℃ for 7 minutes, cooled and crushed to obtain epoxy resin material.

[0077] The raw material formulations for preparing epoxy resin materials in Examples 4-8 are shown in Table 1. The preparation methods of the release agent and epoxy resin materials were carried out in accordance with Example 1.

[0078] Comparative Example 1

[0079] The process was carried out in accordance with Example 1, except that nitrogen was not introduced during the preparation of the release agent.

[0080] Comparative Example 2

[0081] The process was carried out in accordance with Example 1, except that the temperature in the reaction vessel was 100°C during the preparation of the release agent.

[0082] Comparative Example 3

[0083] The process was carried out in accordance with Example 1, except that the temperature in the reaction vessel was 180°C during the preparation of the release agent.

[0084] Comparative Example 4

[0085] The procedure was carried out as described in Example 1, except that the wetting and dispersing agent and the release agent compound were replaced with carnauba wax in the preparation of the release agent compound. The specific process is as follows:

[0086] Preparation of release agent: Biphenyl crystalline epoxy resin was placed in a reaction vessel at 140°C and nitrogen gas was introduced. After the biphenyl crystalline epoxy resin was completely melted, carnauba wax was added under stirring and mixed for 4 hours to obtain the release agent. The weight ratio of biphenyl crystalline epoxy resin to carnauba wax was 1:0.6.

[0087] Comparative Example 5

[0088] The procedure was carried out as described in Example 1, except that the release agent compound was replaced with OP wax (commercially available Mondan OP wax).

[0089] Preparation of release agent: Biphenyl crystalline epoxy resin was placed in a reaction vessel at 140°C and nitrogen gas was introduced. After the biphenyl crystalline epoxy resin was completely melted, wetting and dispersing agent and OP wax (a mixture of montmorillonite S wax, micronized polishing wax and micronized polypropylene wax) were added sequentially under stirring and mixed for 4 hours to obtain the release agent. The weight ratio of biphenyl crystalline epoxy resin, OP wax and dispersing and wetting agent was 1:0.5:0.1.

[0090] Table 1: Raw material ratios for Examples 1-8

[0091]

[0092]

[0093] Test case

[0094] The gelation time, flowability, copper sheet adhesion, mold opening flexural strength and mold opening flexural modulus, Shore D hardness, product appearance test and reliability test of the products prepared in Examples 1-8 and Comparative Examples 1-5 were measured respectively.

[0095] (1) Gelation time: Heat the hot plate to 175±1℃, take 0.1-0.5g of sample and place it on the iron plate. Stir continuously with a flat spatula and test the time it takes for the sample to change from a fluid to a gel state.

[0096] (2) Flowability (spiral flow length): Take 20-25g of sample and use a resin transfer injection molding machine with a spiral flow metal mold for measurement. The injection pressure is 70 bar and the mold temperature is 175±1℃.

[0097] (3) Copper sheet adhesion: Take 15-20g of sample and prepare test sample using a resin transfer injection molding machine and adhesion sample mold. The injection pressure is 70 bar and the mold temperature is 175±1℃. The sample is tested on a universal testing machine.

[0098] (4) Opening bending strength and opening bending modulus: 110g of powdered epoxy resin composition was put into the injection molding machine. Under the conditions of injection pressure of 70 bar and injection time of 15s, the material was injected into a special bending strength test mold at 175℃ to make a sample block with specifications of 15.41*10.78*125mm. After curing for 120s, the resin product hardened and was formed. The thermosetting sample was quickly taken out within 10s and tested on a universal testing machine.

[0099] (5) Shore D hardness: Take 20-25g of sample and use a resin transfer injection molding machine to prepare the sample with the help of a hardness sample mold. The injection pressure is 70 bar and the mold temperature is 175±1℃. After curing for 120s, the resin product hardens and is formed. The thermo-cured sample is quickly taken out within 10s and tested with a Shore D hardness tester.

[0100] (6) Product appearance test: The product was tested using a client's MGP molding press. The product was SOP8, and the injection pressure was 60 kg / cm². 2 Mold closing pressure 180 kg / cm 2 The injection time is 10 seconds, and the curing time is 110 seconds. The product appearance is judged by visual inspection and microscopic observation. After cleaning the mold, the number of times the product surface has uneven color or dirtiness is counted is the maximum number of times.

[0101] (7) Reliability testing: Take the last batch of continuously packaged products and perform three reflow soldering tests, and scan for delamination. If OK, it indicates that the reliability meets the customer's basic requirements.

[0102] The gelation time, flowability, copper sheet adhesion, mold opening flexural strength and mold opening flexural modulus, Shore D hardness test, product appearance test and reliability test results of the epoxy resin materials prepared in Examples 1-8 and Comparative Examples 1-5 are shown in Table 2.

[0103] Table 2

[0104]

[0105] A comparison of the test results of Examples 1-8 and Comparative Examples 1-5 shows that the epoxy resin material described in this invention has a high resistance to surface contamination. After 400 consecutive encapsulation cycles, the product surface remains normal and there is no sticking. At the same time, the product delamination is acceptable after three reflow soldering cycles, which can meet the customer's requirements for encapsulating SOP / SOT type products. In contrast, the material prepared in the comparative examples showed a maximum surface contamination of less than 400 cycles.

[0106] The above are merely embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. An epoxy resin material, characterized in that, The raw materials for preparing this epoxy resin material include a first epoxy resin, a curing agent, an inorganic filler, an ion scavenger, a low-stress modifier, a coupling agent, a curing accelerator, a flame retardant, a colorant, and a release agent compound. The release agent compound is obtained by mixing a second epoxy resin, a wetting and dispersing agent, and a release agent compound under an inert atmosphere and at 120-160°C for 3-6 hours. The release agent compound is a mixture of montana S wax, micronized polishing wax, and micronized polypropylene wax. The micronized polishing wax was purchased from Tianshi New Materials Technology Co., Ltd., and its brand name is Twax0506. Based on the total weight of the raw materials used in the preparation of the epoxy resin material as 100% by weight, the content of the first epoxy resin is 2-8% by weight, the content of the curing agent is 2-7% by weight, the content of the inorganic filler is 70-90% by weight, the content of the ion scavenger is 0.1-1% by weight, the content of the low-stress modifier is 0.1-1% by weight, the content of the coupling agent is 0.1-1% by weight, the content of the curing accelerator is 0.1-1% by weight, the content of the flame retardant is 1-10% by weight, the content of the colorant is 0.1-0.9% by weight, and the content of the release agent is 0.1-2% by weight.

2. The epoxy resin material according to claim 1, characterized in that, The weight ratio of the second epoxy resin, the wetting and dispersing agent and the release agent compound is 1:0.01-0.2:0.25-1.

3. The epoxy resin material according to claim 1 or 2, characterized in that, The weight ratio of the amount of Mondan S wax, the amount of micronized polypropylene wax and the amount of micronized polishing wax is 1-4:0.5-2:

1.

4. The epoxy resin material according to claim 1, characterized in that, The first epoxy resin and the second epoxy resin are each independently selected from one or more of the following: biphenyl crystalline epoxy resin, phenol phenylalkyl epoxy resin, phenol biphenyl epoxy resin, and dicyclopentadiene epoxy resin.

5. The epoxy resin material according to claim 1, characterized in that, The curing agent is selected from linear phenolic resins and / or polycyclic aromatic phenolic resins.

6. The epoxy resin material according to claim 1, characterized in that, The inorganic filler is molten silica and / or titanium dioxide.

7. The epoxy resin material according to claim 1, characterized in that, The ion-scavenging agent is hydrotalcite.

8. The epoxy resin material according to claim 1, characterized in that, The coupling agent is selected from one or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane.

9. The epoxy resin material according to claim 1, characterized in that, The curing accelerator is selected from one or more of triphenylphosphine, triphenylphosphine-p-benzoquinone adduct, and diazabicyclohexane.

10. The epoxy resin material according to claim 1, characterized in that, The flame retardant is selected from one or more of phosphorus-based flame retardants, nitrogen-based flame retardants, phosphorus-nitrogen flame retardants, and hydroxide flame retardants.

11. The epoxy resin material according to claim 1, characterized in that, The colorant is carbon black.

12. A method for preparing the epoxy resin material according to any one of claims 1-11, characterized in that, The method includes: pulverizing the raw materials for preparing the epoxy resin material, then mixing, cooling, and pulverizing them to obtain the epoxy resin material.

13. The method according to claim 12, characterized in that, The mixing conditions include a temperature of 70-90℃ and a time of 7-15 minutes.

14. The use of an epoxy resin material according to any one of claims 1-11, or an epoxy resin material prepared by the method according to claim 12 or 13, as an SOP / SOT encapsulation material.

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