Processing technology and processing device of rapid paving type ceramic tile

Abstract

This invention discloses a processing technology and apparatus for rapid-installation ceramic tiles, comprising the following steps: First, tongue and groove joints for splicing and grooves for installing adhesive strips are formed around the sidewalls of a substrate, resulting in board A. Then, board A and the ceramic tile are glued together, with the grooves located at the glued joint between board A and the tile, and insertion slots for installing adhesive strips formed between the outer end of the tile and the sidewalls of board A, resulting in board B. Finally, adhesive strips are fastened into the grooves around board B, resulting in the finished board. This invention facilitates installation by workers and reduces damage to ceramic tiles during installation and use.

Description

Technical Field

[0001] This invention relates to a ceramic tile processing technology, and more particularly to a rapid-installation ceramic tile processing technology and processing device. Background Technology

[0002] Traditional tile installation requires soaking the tiles for at least two hours, allowing them to dry slightly before applying cement mortar. After installation, a curing period of about a week is needed to allow the cement mortar to fully harden and achieve a stable bond. However, this method is not only complex and time-consuming, but also demands a high level of skill from the installers, easily leading to problems such as hollow tiles and uneven gaps due to technical defects. Furthermore, the long installation time and lack of recyclability after installation make tiles unsuitable for temporary setups and dismantling, such as in exhibition halls and stages, thus limiting their applicability.

[0003] To address the aforementioned issues, some manufacturers are attempting to combine tiles and substrates. This involves laying tiles on a wooden or inorganic substrate, allowing for rapid tile installation through splicing. This significantly improves installation efficiency compared to cement tiling and enables repeated installation. However, this structure has drawbacks. Because the substrate requires interlocking grooves and fasteners around its perimeter, and these are engaged during installation through flipping and tapping, the tiles are prone to chipping and cracking when their edges are flush with the substrate. This increases installation difficulty and scrap rates. Conversely, leaving gaps around the tiles for substrate splicing results in excessively large grout lines after installation, reducing the overall aesthetics and significantly decreasing waterproofing.

[0004] Furthermore, while wood-based substrates offer advantages over inorganic substrates such as better thermal insulation and lower cost, the difference in thermal expansion coefficients between wood and ceramic tiles leads to variations in their shape when the external environment changes. This can cause the wood and ceramic tiles to separate at the adhesive joint. Secondly, wood is also affected by moisture content during daily use, resulting in shrinkage and expansion. This further reduces the adhesive stability between the wood and ceramic tiles. Additionally, when the gaps between adjacent tiles are insufficient, the expansion and contraction of the wood substrate can cause the tiles to collide and squeeze, increasing the likelihood of tile cracking.

[0005] Therefore, the existing method of combining tiles and substrates for installation suffers from poor installation stability and high damage rate. Summary of the Invention

[0006] The purpose of this invention is to provide a processing technology and apparatus for rapid tile installation. This facilitates installation by workers and reduces damage to the tiles during installation and use.

[0007] The technical solution of this invention: a processing technology for rapid-installation ceramic tiles, comprising the following steps:

[0008] a. Tongue and groove for splicing and groove for installing adhesive strips are respectively opened on the four sides of the side wall of the substrate to obtain board A;

[0009] b. Adhere A board and the tile together, and place the groove at the joint between A board and the tile, and form a socket for installing the insert between the outer end of the tile and the four sides of A board to obtain B board;

[0010] c. Fasten the adhesive strips into the grooves around board B to obtain the finished board.

[0011] In the aforementioned processing technology of a quick-laying tile, during the installation of the finished tiles in step c, adjacent finished tiles are first spliced ​​together with tongue and groove joints, and then inserts the insert strip into the joint between adjacent tiles. The bottom of the insert strip is pressed and fixed by the adhesive strips on both sides, so that the insert strip fills the installation gap between the tiles on both sides after installation.

[0012] In the aforementioned processing technology for rapid-installation ceramic tiles, the substrate in step a is an inorganic substrate, and the bonding method between board A and the ceramic tile in step b specifically includes the following steps:

[0013] b1. Sand the surface of plate A to obtain plate B1;

[0014] b2. Apply PUR adhesive to the sanded surface of board B1 to obtain board B2;

[0015] b3. Lay the tiles on the surface of the B2 board, so that the B2 board and the tiles are bonded together with PUR adhesive to obtain the B3 board;

[0016] b4. Roller press B3 board to remove air and eliminate the gaps between B2 board and the tile at the bonding point to obtain board B.

[0017] In the aforementioned processing technology for rapid-installation ceramic tiles, the substrate in step a is a wooden substrate, and the bonding method between board A and the ceramic tile in step b specifically includes the following steps:

[0018] b1. Sand the surface of plate A to obtain plate B1;

[0019] b2. Multiple positioning grooves are made on the sanded surface of plate B1, and annular stepped grooves are made at the four edges of the sanded surface to obtain plate B2.

[0020] b3. Using an inorganic board as an intermediate board, and opening multiple positioning holes on the intermediate board to match the positioning grooves, we obtain board B3;

[0021] b4. Apply adhesive to the sanded surface of board B2 and the back of board B3 respectively. Then, bond board B3 and board B2 together with adhesive. The positioning groove of board B2 and the positioning hole of board B3 are interlocked with positioning pins. After bonding, board B3 covers the stepped groove on the top of board B2 and forms a groove to obtain board B4.

[0022] b5. After applying adhesive to the back of the tile, bond the tile and B4 board together with the adhesive to obtain board B.

[0023] Based on the aforementioned processing device used in the processing technology of a rapid-laying tile, in step b4, plates B2 and B3 and the positioning pin are interlocked and formed into plate B4 in one step by the processing device. In step b5, the tile and plate B4 are bonded together by the processing device to form plate B. The processing device includes a base, guide columns are provided around the base, and a pressure plate assembly is provided above the base and slidably connected to the guide columns. The pressure plate assembly includes an upper pressure plate, a driving component is connected to the top of the upper pressure plate, a limiting plate is connected to the bottom of the upper pressure plate, a plurality of limiting holes are distributed on the limiting plate, and elastic components for squeezing and limiting the positioning pin are interlocked in the limiting holes. A plurality of extrusion columns that cooperate with the limiting holes are distributed at the bottom of the upper pressure plate.

[0024] In the aforementioned processing device, the elastic element includes a metal collar, and several inwardly extending spring pieces are distributed around the metal collar. The bottom of the limiting hole is provided with a first stepped groove for axially limiting the metal collar. When the metal collar is installed, it is fastened and connected to the limiting hole from above the limiting plate.

[0025] In the aforementioned processing device, the upper pressure plate and the limiting plate are connected to each other around their perimeter by guide rods. A compression spring is sleeved on the guide rods at the gap between the upper pressure plate and the limiting plate. The limiting plate is provided with a pad for limiting the height of the upper pressure plate.

[0026] The aforementioned processing device also includes a first stop bar that is fastened to the guide post. The cross-sectional shape of the first stop bar is U-shaped. The lower end of the first stop bar extends into the fastening groove and fits against the inner end face of the fastening groove. The upper end of the first stop bar extends above the B4 plate and has a folded edge that fits against the upper surface of the B4 plate.

[0027] In the aforementioned processing device, the bottom of the limiting plate is detachably connected to a mounting plate, and the mounting plate has an inclined surface on the side near the first stop bar for squeezing and limiting the first stop bar.

[0028] In the aforementioned processing device, a second stop bar is also attached to the guide post, the lower end of the second stop bar extends into the fastening groove, and the upper end of the second stop bar and the side wall of the intermediate plate are in contact with each other.

[0029] In the aforementioned processing device, the bottom of the limiting plate is detachably connected to a mounting plate, and the mounting plate has an inclined surface on the side near the first stop bar for squeezing and limiting the first stop bar and the second stop bar.

[0030] Compared with the prior art, the present invention has the following characteristics:

[0031] (1) This invention lays the tiles on the surface of the substrate and uses tongue and groove openings around the substrate to allow the tiles to be formed by each other during installation, thereby achieving rapid installation and repeated use of the tiles. On this basis, through the structural cooperation of the groove, adhesive strip and socket, on the one hand, the socket is left for the workers to flip and knock when the adjacent tiles are spliced, thereby avoiding the tiles from colliding with each other and causing damage during installation. On the other hand, after the tiles are installed, the workers can use the socket to fill the socket, thereby improving the aesthetics and waterproof effect of the tiles after installation. Furthermore, when the tiles are heated or deformed and warped due to the influence of the substrate during later use, the socket can also limit and buffer the tiles, avoiding direct collision damage between adjacent tiles.

[0032] (2) Based on this, the present invention further optimizes the overall structure of the ceramic tile for the wood substrate. By interlocking the intermediate board and the substrate with positioning pins, the intermediate board can limit the substrate after interlocking, thereby reducing the deformation range of the wood substrate after being affected by the external environment, that is, improving the bonding stability of the ceramic tile. At the same time, since the physical properties of the inorganic intermediate board and the ceramic tile are relatively similar, the difference in size change between the ceramic tile and the intermediate board under the influence of the external environment can also be relatively small, thereby reducing the possibility of separation between the ceramic tile and the intermediate board. Under the interlocking and fixing action of the positioning pins, the connection strength and deformation resistance of the intermediate board and the substrate can be greatly improved, thereby effectively preventing the peeling of the adhesive joint due to the difference in deformation range.

[0033] (3) Regarding the snap-fit ​​connection structure of the intermediate plate and the base plate, the present invention further defines a corresponding processing device, which enables the processing device to hot-press and fix the intermediate plate and the base plate after gluing, and to achieve stable snap-fit ​​of each positioning pin during the hot-pressing process, thereby improving the assembly efficiency and stability of the intermediate plate and the base plate; on this basis, through the structural cooperation of the first stop strip and the mounting plate, the first stop strip can be squeezed and limited by the downward pressure of the limiting plate when the tile is laid, thereby ensuring the positioning accuracy of the tile and the intermediate plate, and thus improving the installation stability of the insert strip; after the tile is positioned, the operator can pull out the first stop strip horizontally, thereby effectively preventing the first stop strip from sticking during the hot pressing process of the tile, and improving the working stability of the processing device; under the above cooperation, the present invention can complete the hot pressing and forming process of the tile in two steps on the processing device, that is, improve the processing efficiency of the tile;

[0034] Therefore, this invention can facilitate the installation by workers and reduce the damage to tiles during installation and use. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the tile splicing in Example 1;

[0036] Figure 2 This is a schematic diagram of the tile splicing in Example 2;

[0037] Figure 3 This is a schematic diagram of the processing device in its initial state with the substrate and intermediate plate in the middle.

[0038] Figure 4 yes Figure 3 A magnified view from direction A;

[0039] Figure 5 This is a schematic diagram of the processing device after the substrate and intermediate plate are fully pressed together.

[0040] Figure 6 This is a schematic diagram of the processing device after the ceramic tile is fully pressed together.

[0041] The markings in the attached diagram are as follows: 100-tile, 200-substrate, 300-tongue and groove, 400-groove, 500-adhesive strip, 600-insertion, 700-insertion strip, 800-intermediate plate, 900-positioning pin, 1-base, 2-guide post, 3-upper pressure plate, 4-driving component, 5-limiting plate, 6-limiting hole, 7-elastic component, 8-extrusion post, 9-guide rod, 10-compression spring, 11-pad, 12-first stop bar, 13-stepping plate, 14-second stop bar, 701-metal collar, 702-spring piece, 121-folded edge. Detailed Implementation

[0042] The present invention will be further described below with reference to the accompanying drawings and embodiments, but this should not be construed as limiting the present invention.

[0043] Example 1. A processing method for rapid-installation ceramic tiles, comprising the following steps:

[0044] a. Tongue and groove for splicing and groove for installing adhesive strips are respectively opened on the four sides of the side wall of the substrate to obtain board A;

[0045] b. Adhere board A and a 5mm thick ceramic tile to each other, and place the groove at the joint between board A and the ceramic tile, and form a socket for installing the insert between the outer end of the ceramic tile and the four sides of board A to obtain board B.

[0046] c. Fasten the adhesive strips into the grooves around board B to obtain the finished board;

[0047] In step c, during installation, adjacent finished panels are first spliced ​​together using tongue and groove joints. Then, insert strips are inserted into the joints between adjacent tiles, and the bottom of the insert strips is pressed and fixed by adhesive strips on both sides, so that the insert strips fill the installation gaps between the tiles on both sides after installation.

[0048] The composition of the finished board is as follows Figure 1 As shown, the assembly includes a tile 100 and a substrate 200 bonded together. The substrate 200 has tongue and groove joints 300 and snap-fit ​​grooves 400 around its perimeter. An adhesive strip 500 is connected inside the snap-fit ​​groove 400. An insertion port 600 is formed at the top of the tile 100 and the substrate 200. After adjacent finished panels are spliced ​​together, the insertion ports 600 on both sides are interconnected and connected with an insert strip 700. The lower end of the insert strip 700 extends to the inside of the tile 100 and is in contact with the adhesive strip 500. The adhesive strip 500 is used to rub and limit the insertion strip 700 after it is inserted by squeezing and deforming it.

[0049] The substrate in step a is an inorganic substrate, and the bonding method between board A and the ceramic tile in step b specifically includes the following steps:

[0050] b1. Sand the surface of plate A to obtain plate B1;

[0051] b2. Apply an adhesive and then PUR adhesive sequentially to the sanded surface of the B1 board. The amount of PUR adhesive applied is 30-35 g / m². 2 The amount of adhesive applied is 20-25 g / m². 2 , get B2 board;

[0052] b3. After applying an adhesive to the back of the tile, lay it on the surface of the B2 board. The amount of adhesive applied should be 20-25 g / m². 2 This allows the B2 board and the ceramic tile to be bonded together with PUR adhesive and an adhesive agent, resulting in the B3 board.

[0053] b4. Roll the B3 board with a 35-degree hardness rubber roller to remove air and eliminate the gap between the B2 board and the tile at the bonding point, thus obtaining the B board.

[0054] This embodiment uses an inorganic substrate 200 and a tile 100 bonded together, with tongue and groove joints 300 around the substrate 200. This allows the substrate 200 to be interlocked, replacing the traditional cement mortar for tile installation, significantly improving installation efficiency. It also enables the removal and reuse of the tiles after installation, increasing their utilization rate. Furthermore, the interlocking strips 700 and adhesive strips 500 fill gaps in the tile 100 after installation, improving aesthetics and waterproofing. They also buffer and limit changes in tile size later, enhancing installation stability. The interlocking strips 700 and grooves 600 provide space for workers to assemble the substrate 200, reducing the possibility of breakage due to collisions during installation.

[0055] Example 2. A processing method for rapid-installation ceramic tiles, comprising the following steps:

[0056] a. Tongue and groove for splicing and groove for installing adhesive strips are respectively opened on the four sides of the side wall of the substrate to obtain board A;

[0057] b. Adhere board A and a 5mm thick ceramic tile to each other, and place the groove at the joint between board A and the ceramic tile, and form a socket for installing the insert between the outer end of the ceramic tile and the four sides of board A to obtain board B.

[0058] c. Fasten the adhesive strips into the grooves around board B to obtain the finished board;

[0059] In step c, during installation, adjacent finished panels are first spliced ​​together using tongue and groove joints. Then, insert strips are inserted into the joints between adjacent tiles, and the bottom of the insert strips is pressed and fixed by adhesive strips on both sides, so that the insert strips fill the installation gaps between the tiles on both sides after installation.

[0060] The composition of the finished board is as follows Figure 2As shown, the assembly includes a tile 100, a middle plate 800, and a base plate 200, which are glued together sequentially from top to bottom. The base plate 200 has tongue and groove joints 300 around its perimeter. The connecting surfaces of the base plate 200 and the middle plate 800 form grooves 400 around their perimeter. Adhesive strips 500 are connected within the grooves 400. The middle portions of the base plate 200 and the middle plate 800 each have several mutually cooperating positioning grooves and positioning holes. Positioning pins 900 are fastened and connected within the positioning grooves and positioning holes. Insertion openings 600 are formed around the tile 100 and the middle plate 800. After adjacent finished plates are spliced ​​together, the insertion openings 600 on both sides are interconnected and fastened with insert strips 700. The lower end of the insert strips 700 extends to the inside of the tile 100 and adheres to the adhesive strips 500. The adhesive strips 500 are squeezed and deformed after the insert strips 700 are inserted to rub and limit the insertion strips 700.

[0061] The substrate in step a is a wooden substrate, and the gluing method between board A and the tile in step b specifically includes the following steps:

[0062] b1. Sand the surface of plate A to obtain plate B1;

[0063] b2. Multiple positioning grooves are made on the sanded surface of plate B1, and annular stepped grooves are made at the four edges of the sanded surface to obtain plate B2.

[0064] b3. Using an inorganic board as an intermediate board, and opening multiple positioning holes on the intermediate board to match the positioning grooves, we obtain board B3;

[0065] b4. Apply adhesive to the sanded surface of board B2 and the back of board B3 respectively. Then, bond board B3 and board B2 together with adhesive. The positioning groove of board B2 and the positioning hole of board B3 are interlocked with positioning pins. After bonding, board B3 covers the stepped groove on the top of board B2 and forms a groove to obtain board B4.

[0066] b5. After applying adhesive to the back of the tile, bond the tile and B4 board together with the adhesive to obtain board B.

[0067] In step b4, plates B2 and B3, along with the positioning pin, are joined together in one step by a processing device to form plate B4. In step b5, the ceramic tile and plate B4 are bonded together by the processing device to form plate B. The processing device is configured as follows: Figure 3-6As shown, the device includes a base 1, with guide posts 2 around its perimeter. The lower ends of the guide posts 2 are inserted into the base 1. A pressure plate assembly is slidably connected to the guide posts 2 above the base 1. The pressure plate assembly includes an upper pressure plate 3. A driving component 4 is connected to the top of the upper pressure plate 3. The driving component 4 can be a hydraulic rod with pressure sensing function. A limiting plate 5 is connected to the lower part of the upper pressure plate 3. Several limiting holes 6 are distributed on the limiting plate 5. An elastic component 7 for pressing and limiting the positioning pin is fastened in the limiting holes 6. Several pressing posts 8 that cooperate with the limiting holes 6 are distributed at the bottom of the upper pressure plate 3. The outer diameter of the pressing posts 8 is smaller than the outer diameter of the positioning pin. The upper pressure plate 3 can be formed by riveting two single plates together. After the two single plates are connected to each other, they form a circular groove for fastening and connecting the pressing posts 8. The pressing posts 8 are fixed in the circular groove by screws.

[0068] The elastic element 7 includes a metal collar 701, around which several inwardly extending spring pieces 702 are distributed. The spring pieces 702 contract and deform to limit the positioning pin 900. The bottom of the limiting hole 6 is provided with a first stepped groove for axially limiting the metal collar 701. During installation, the metal collar 701 is fastened and connected to the limiting plate 5 from above into the limiting hole 6. The limiting plate 5 can be formed by riveting two single plates together, and the two single plates form the first stepped groove after being assembled. Alternatively, the manufacturer can use parts with friction limiting ability, such as nylon sleeves, to replace the elastic element 7 for the insertion and positioning of the positioning pin 900.

[0069] The upper pressure plate 3 and the limiting plate 5 are connected to each other around the perimeter by guide rods 9. The guide rods 9 are located on the outside of the guide post 2 in the horizontal direction. A compression spring 10 is sleeved on the guide rods 9 at the gap between the upper pressure plate 3 and the limiting plate 5. The limiting plate 5 is provided with a pad 11 for limiting the height of the upper pressure plate 3.

[0070] It also includes a first stop bar 12 that is fastened to the guide post 2. The cross-sectional shape of the first stop bar 12 is U-shaped. The lower end of the first stop bar 12 extends into the fastening groove and fits against the inner end face of the fastening groove. The upper end of the first stop bar 12 extends above the B4 plate and is provided with a folded edge 121 that fits against the upper surface of the B4 plate.

[0071] It also includes a second stop bar 14 that is fastened to the guide post 2. The lower end of the second stop bar 14 extends into the fastening groove, and the upper end of the second stop bar 14 is in contact with the side wall of the intermediate plate.

[0072] The bottom of the limiting plate 5 is detachably connected to a mounting plate 13. The mounting plate 13 has an inclined surface on the side near the first stop bar 12 for squeezing and limiting the first stop bar 12 and the second stop bar 14. The mounting plate 13 can be directly disengaged and removed from the top of the limiting plate 5. The guide post 2 can be provided with a step for supporting the first stop bar 12 and the second stop bar 14. The perimeter of the limiting plate 5 can be provided with a second step groove to accommodate the first stop bar 12 and the second stop bar 14 as needed.

[0073] The inner side of the base 1 is provided with a heating plate for heating. The B2 board, B3 board and ceramic tile are bonded together with PUR adhesive, and the amount of PUR adhesive applied is 30-35 g / m². 2 The temperature of the base 1 during heating is 20-50℃.

[0074] Compared with Example 1, this example further optimizes the assembly structure of the tile 100 for the wooden substrate 200. By setting the intermediate plate 800, the positioning pins 900 and the substrate 200 can be fastened together to improve the connection strength between the two and limit the size of the substrate 200 by the intermediate plate 800, thereby reducing the deformation range of the substrate 200. On the other hand, the physical properties of the intermediate plate 800 are similar to those of the wooden substrate and the tile 100, so that the deformation range of the two under the influence of the external environment is relatively small, thereby improving the bonding stability of the tile 100 and the intermediate plate 800.

[0075] Based on the above, this embodiment specifically includes a processing device for gluing and hot-pressing the structure. This allows the operator to place the substrate 200 and the intermediate plate 800 together on the base 1 after gluing, and to horizontally limit their positions using the guide post 2 and the second stop 14, aligning their positioning grooves and holes. After the substrate 200 and the intermediate plate 800 are placed, the operator places the pressure plate assembly with positioning pins 900 onto the guide post 2 and applies downward pressure to the pressure plate assembly using the drive member 4. This causes the pressure plate assembly to descend and press the substrate 200 and the intermediate plate 800 below. When the pressure plate assembly is pressed down, the limiting plate 5 first contacts the intermediate plate 800 to form a height limit. Then, the upper pressure plate 3 continues to descend under the action of the drive member 4, causing the extrusion post 8 to press the positioning pin 900 inside the elastic member 7. Under the extrusion action, the positioning pin 900 disengages from the elastic member 7 and the limiting plate 5 and snaps into the substrate 200 and the intermediate plate 800 below. When the upper pressure plate 3 is pressed down to the contact pad 11, the upper pressure plate 3 and the limiting plate 5 are in a fully retracted state. At this time, the action of the driving component 4 will drive the pressure plate assembly to continue pressing down, that is, to reach the specified pressure. After the substrate 200 and the intermediate plate 800 are pressed together, the operator will pull out the second stop bar 14 horizontally to prevent the second stop bar 14 and the intermediate plate 800 from sticking together.

[0076] After pressing is complete, the drive unit 4 rises and resets. Then, the operator removes the pressure plate assembly and installs the first stop strips 12 on the guide posts 2 around the perimeter, ensuring that the ends of the first stop strips 12 and the inner end faces of the grooves 400 are in contact with each other. This ensures that the folded edges 121 are parallel to the edge lines of the substrate 200 after positioning, reaching the limit position. After the first stop strips 12 are installed, the operator places the tile 100 coated with adhesive on the intermediate plate 800 between each folded edge 121. Then, the pressure plate assembly or a conventional pressure plate is placed back on the guide posts 2, and the tile 100 is pressed and fixed by the drive unit 4. During the pressing process, the pressure plate assembly uses the mounting plate 13 to squeeze and position the first stop strips 12, thus preventing the tile 100 from shifting during pressing. After the tile 100 is fully pressed, the operator can remove the mounting plate 13 and the first stop strips 12 in sequence to prevent the first stop strips 12 and the tile 100 from sticking together.

[0077] During the pressing process of ceramic tile 100, the operator can insert the positioning pin 900 into the limiting holes 6 of another pressure plate group, thereby improving the operator's processing efficiency.

Claims

1. A processing technology for rapid-installation ceramic tiles, characterized in that, Includes the following steps: a. Tongue and groove for splicing and groove for installing adhesive strips are respectively opened on the four sides of the side wall of the substrate to obtain board A; b. Adhere A board and the tile together, and place the groove at the joint between A board and the tile, and form a socket for installing the insert between the outer end of the tile and the four sides of A board to obtain B board; c. Fasten the adhesive strips into the grooves around board B to obtain the finished board; The substrate in step a is a wooden substrate, and the gluing method between board A and the tile in step b specifically includes the following steps: b1. Sand the surface of plate A to obtain plate B1; b2. Multiple positioning grooves are made on the sanded surface of plate B1, and annular stepped grooves are made at the four edges of the sanded surface to obtain plate B2. b3. Using an inorganic board as an intermediate board, and opening multiple positioning holes on the intermediate board to match the positioning grooves, we obtain board B3; b4. Apply adhesive to the sanded surface of board B2 and the back of board B3 respectively. Then, bond board B3 and board B2 together with adhesive. The positioning groove of board B2 and the positioning hole of board B3 are interlocked with positioning pins. After bonding, board B3 covers the stepped groove on the top of board B2 and forms a locking groove to obtain board B4. b5. After applying adhesive to the back of the tile, bond the tile and B4 board together with the adhesive to obtain board B.

2. The processing technology for a rapid-installation ceramic tile according to claim 1, characterized in that, In step c, during installation, adjacent finished panels are first spliced ​​together using tongue and groove joints. Then, insert strips are inserted into the joints between adjacent tiles, and the bottom of the insert strips is pressed and fixed by the adhesive strips on both sides, so that the insert strips fill the installation gaps between the tiles on both sides after installation.

3. The processing apparatus used in the processing technology of rapid-laying ceramic tiles according to claim 1, characterized in that: In step b4, plates B2 and B3 and the positioning pin are joined together by a processing device to form plate B4. In step b5, the ceramic tile and plate B4 are bonded together by a processing device to form plate B. The processing device includes a base (1), guide posts (2) are provided around the base (1), and a pressure plate assembly is provided above the base (1) and slidably connected to the guide posts (2). The pressure plate assembly includes an upper pressure plate (3), a driving member (4) is connected to the top of the upper pressure plate (3), a limiting plate (5) is connected to the bottom of the upper pressure plate (3), a plurality of limiting holes (6) are distributed on the limiting plate (5), and an elastic member (7) for squeezing and limiting the positioning pin is fastened in the limiting hole (6). A plurality of squeezing posts (8) that cooperate with the limiting holes (6) are distributed at the bottom of the upper pressure plate (3).

4. The processing apparatus according to claim 3, characterized in that: The elastic element (7) includes a metal collar (701), and several inwardly extending spring pieces (702) are distributed around the metal collar (701). The bottom of the limiting hole (6) is provided with a first step groove for axially limiting the metal collar (701). When the metal collar (701) is installed, it is fastened and connected to the limiting hole (6) from above the limiting plate (5).

5. The processing apparatus according to claim 3, characterized in that: The upper pressure plate (3) and the limiting plate (5) are connected to each other by a guide rod (9). A compression spring (10) is sleeved on the guide rod (9) at the gap between the upper pressure plate (3) and the limiting plate (5). A pad (11) is provided on the limiting plate (5) for limiting the height of the upper pressure plate (3).

6. The processing apparatus according to claim 3, characterized in that: It also includes a first stop bar (12) that is fastened to the guide post (2). The cross-sectional shape of the first stop bar (12) is U-shaped. The lower end of the first stop bar (12) extends into the fastening groove and fits against the inner end face of the fastening groove. The upper end of the first stop bar (12) extends to the top of the B4 plate and is provided with a folded edge (121) that fits against the upper surface of the B4 plate.

7. The processing apparatus according to claim 6, characterized in that: It also includes a second stop (14) that is fastened to the guide post (2), the lower end of the second stop (14) extending into the fastening groove, and the upper end of the second stop (14) and the side wall of the intermediate plate fitting together.

8. The processing apparatus according to claim 7, characterized in that: The bottom of the limiting plate (5) is detachably connected to a step plate (13), and the step plate (13) has an inclined surface on the side near the first stop (12) for squeezing and limiting the first stop (12) and the second stop (14).

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