Refrigerator-freezer device

CN117847911BActive Publication Date: 2026-10-09QINDAO HAIER REFRIGERATOR CO LTD +1
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Patent Information

Application Number
CN202211218081.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-09-30
Publication Date
2026-10-09
Estimated Expiration
2042-09-30

AI Technical Summary

Technical Problem

[0003]发明人认识到,现有技术中的部分氧气处理装置采用电化学反应来处理氧气,电化学反应过程会产生热量,导致氧气处理装置的温度升高

Benefits of technology

[0031] The refrigeration and freezing apparatus of the present invention, by incorporating a condensation prevention component and utilizing the adjustment unit of the condensation prevention component to regulate the surface state of the oxygen treatment device, can reduce or avoid condensation generated in the oxygen treatment device due to electrochemical reactions. Since condensation is virtually nonexistent in the oxygen treatment device of the present invention, compared to solutions that address condensation only after it has occurred, the present invention avoids the risk of condensation at its source, thus eliminating the need for cumbersome condensation removal measures.

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Abstract

The application provides a refrigeration and freezing device, comprising: a cabinet, the inside of which defines a storage space; an oxygen treatment device, which is in airflow communication with the storage space and is configured to treat oxygen in the storage space through an electrochemical reaction under the action of an electrolysis voltage; and a condensation prevention and control component, which comprises a regulation part connected to the oxygen treatment device to adjust the surface state of the oxygen treatment device, thereby preventing surface condensation of the oxygen treatment device. By arranging the condensation prevention and control component and adjusting the surface state of the oxygen treatment device by the regulation part of the condensation prevention and control component, condensation of the oxygen treatment device due to the electrochemical reaction can be reduced or avoided. Since the oxygen treatment device of the application hardly condenses, compared with the solution of taking condensation elimination measures after the oxygen treatment device condenses, the solution of the application can avoid the condensation risk of the oxygen treatment device from the root, thereby omitting the cumbersome condensation elimination measures.
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Description

Technical Field

[0001] This invention relates to modified atmosphere storage technology, and in particular to refrigeration and freezing equipment. Background Technology

[0002] Modified atmosphere storage (MAP) technology extends the shelf life of food by adjusting the composition of gases in the environment. Refrigeration and freezing systems with MAP capabilities are widely popular. Among the many gas components, oxygen is of particular interest. Oxygen treatment devices can process oxygen in the working environment to produce oxygen-deficient or oxygen-enriched gases, thereby regulating the oxygen content.

[0003] The inventors recognized that some existing oxygen treatment devices use electrochemical reactions to process oxygen, and these electrochemical reactions generate heat, causing the temperature of the oxygen treatment device to rise. When the oxygen treatment device adjusts the oxygen content in the storage space, the low-temperature gas from the storage space flows to the higher-temperature oxygen treatment device, causing condensation on the surface of the device.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0005] One object of the present invention is to overcome at least one technical defect in the prior art and to provide a refrigeration and freezing apparatus.

[0006] A further object of the present invention is to reduce or avoid condensation in oxygen treatment devices due to electrochemical reactions.

[0007] Another further objective of this invention is to employ a simple method to effectively mitigate the risk of condensation in oxygen treatment devices and reduce the cost of condensation prevention in oxygen treatment devices.

[0008] Another further objective of the present invention is to reduce the dependence of the oxygen treatment device on the scene structure during assembly, improve the assembly flexibility of the oxygen treatment device in refrigeration and freezing equipment, and expand the application range of the oxygen treatment device.

[0009] In particular, the present invention provides a refrigeration and freezing apparatus, comprising:

[0010] The box-like structure defines the storage space within it;

[0011] An oxygen treatment device, connected to the airflow of the storage space, is configured to treat the oxygen in the storage space through an electrochemical reaction under the action of an electrolytic voltage; and

[0012] A condensation prevention component includes a control unit connected to the oxygen treatment device to adjust the surface state of the oxygen treatment device, thereby preventing condensation on the surface of the oxygen treatment device.

[0013] Optionally, the surface condition of the oxygen treatment device includes surface temperature; and

[0014] The control unit includes a voltage supply circuit electrically connected to the oxygen treatment device to provide the oxygen treatment device with the electrolysis voltage required for the electrochemical reaction, and to controllably adjust the electrical parameters of the oxygen treatment device to regulate the surface temperature of the oxygen treatment device.

[0015] Optionally, the voltage supply circuit has a power supply whose output voltage is controllably adjustable and configured to reduce its output voltage when the surface temperature of the oxygen treatment device is determined to reach or approach the dew point temperature, thereby reducing the electrolytic voltage of the oxygen treatment device and causing the surface temperature of the oxygen treatment device to deviate from the dew point temperature.

[0016] Optionally, the condensation control component further includes a detection unit, which includes a first detection element disposed at the oxygen treatment device and configured to detect the surface temperature of the oxygen treatment device to determine whether the surface temperature of the oxygen treatment device reaches or approaches the dew point temperature.

[0017] Optionally, the detection unit is further configured to detect the temperature of the oxygen treatment device again at a preset time interval after the voltage supply circuit reduces the electrolysis voltage of the oxygen treatment device, in order to determine whether the temperature of the oxygen treatment device deviates from the dew point temperature; and

[0018] The voltage supply circuit is also configured to switch to an open circuit state when it is determined that the temperature of the oxygen processing device has not deviated from the dew point temperature.

[0019] Optionally, the surface condition of the oxygen treatment device also includes surface wind speed;

[0020] The control unit further includes an airflow actuator disposed within an airflow channel between the storage space and the airflow actuator, for connection to the oxygen treatment device via the airflow channel, and configured to rotate in a controlled manner to pressurize the airflow passing through the airflow channel; and

[0021] The rotational speed of the airflow actuator is controllably and adjustable to regulate the surface wind speed of the oxygen treatment device.

[0022] Optionally, the airflow actuation device is configured to increase the rotational speed when it is determined that the temperature of the oxygen treatment device has reached or is close to the dew point temperature, thereby increasing the surface wind speed of the oxygen treatment device.

[0023] Optionally, the detection unit is further configured to detect the temperature of the oxygen treatment device again at a preset time interval after the control unit adjusts the surface state of the oxygen treatment device, in order to determine whether the temperature of the oxygen treatment device deviates from the dew point temperature; and

[0024] The airflow actuator is also configured to switch to a preset maximum speed when it is determined that the temperature of the oxygen processing device has not deviated from the dew point temperature.

[0025] Optionally, the refrigeration and freezing unit also includes:

[0026] The mounting box has an air inlet and an air outlet for connecting the storage space, and its interior defines an airflow space connecting the air inlet and the air outlet; and

[0027] The oxygen treatment device is disposed within the airflow space and configured to treat the gas flowing into the airflow space from the air inlet through an electrochemical reaction under the action of an electrolytic voltage, so as to generate oxygen-deficient gas or oxygen-enriched gas; the oxygen-deficient gas or the oxygen-enriched gas is sent out through the air outlet, thereby adjusting the oxygen content of the storage space.

[0028] Optionally, the refrigeration and freezing unit also includes:

[0029] An air intake pipe, connecting the air outlet of the storage space to the air intake interface, is configured to guide the gas in the storage space to the airflow space; and

[0030] The return air pipeline connects the air outlet to the air inlet of the storage space and is configured to guide the oxygen-deficient gas or the oxygen-enriched gas to the storage space.

[0031] The refrigeration and freezing apparatus of the present invention, by incorporating a condensation prevention component and utilizing the adjustment unit of the condensation prevention component to regulate the surface state of the oxygen treatment device, can reduce or avoid condensation generated in the oxygen treatment device due to electrochemical reactions. Since condensation is virtually nonexistent in the oxygen treatment device of the present invention, compared to solutions that address condensation only after it has occurred, the present invention avoids the risk of condensation at its source, thus eliminating the need for cumbersome condensation removal measures.

[0032] Furthermore, the refrigeration and freezing apparatus of the present invention adjusts the electrical parameters of the oxygen treatment device by utilizing a voltage supply circuit to regulate the surface temperature of the oxygen treatment device, thereby preventing the surface condition of the oxygen treatment device from meeting condensation conditions. This method is simple and has significant advantages in condensation control. Therefore, based on the solution of the present invention, a simple method can be used to effectively avoid the risk of condensation in the oxygen treatment device and reduce the cost of condensation prevention for the oxygen treatment device.

[0033] Furthermore, in the refrigeration and freezing apparatus of the present invention, an oxygen treatment device is disposed within a housing, and an air inlet and an air outlet are provided on the housing. Gas from the storage space can flow into the airflow space through the air inlet and be processed by the electrode pair to form oxygen-deficient or oxygen-enriched gas, which is then discharged from the air outlet. Using the solution of the present invention, gas from the storage space can enter the air inlet through a pipeline. Therefore, the oxygen treatment device can be placed in any location, thereby reducing the dependence of the oxygen treatment device's assembly on the scene structure, improving the assembly flexibility of the oxygen treatment device in the refrigeration and freezing apparatus, and expanding the application range of the oxygen treatment device.

[0034] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0035] The following sections will describe some specific embodiments of the invention in detail by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0036] Figure 1 This is a schematic structural diagram of a refrigeration and freezing apparatus according to an embodiment of the present invention;

[0037] Figure 2 This is a schematic block diagram of a refrigeration and freezing apparatus according to an embodiment of the present invention;

[0038] Figure 3 This is a schematic diagram of the voltage supply circuit of a refrigeration and freezing apparatus according to an embodiment of the present invention;

[0039] Figure 4 This is an internal structural diagram of a refrigeration and freezing apparatus according to an embodiment of the present invention;

[0040] Figure 5 This is an internal structural diagram of a refrigeration and freezing apparatus according to another embodiment of the present invention;

[0041] Figure 6 This is a schematic assembly diagram of an oxygen treatment device and a mounting box according to an embodiment of the present invention;

[0042] Figure 7 yes Figure 6 A schematic exploded view of the oxygen treatment device and mounting box shown;

[0043] Figure 8 yes Figure 6 A schematic internal structure diagram of the oxygen treatment device and mounting box shown;

[0044] Figure 9 yes Figure 8 A schematic top view of the internal structure of the oxygen treatment unit and mounting box shown;

[0045] Figure 10 yes Figure 6 The diagram shows a schematic structural representation of the mounting box, with the top wall of the mounting box omitted.

[0046] Figure 11 This is an assembly structure diagram of the positioning mechanism and the diversion device of an oxygen treatment apparatus according to an embodiment of the present invention;

[0047] Figure 12 yes Figure 11 An exploded schematic diagram of the assembly structure of the positioning mechanism and the drainage device shown.

[0048] Figure 13 This is a schematic structural diagram of an oxygen treatment apparatus according to an embodiment of the present invention;

[0049] Figure 14 This is a control flowchart of a refrigeration and freezing apparatus according to an embodiment of the present invention. Detailed Implementation

[0050] Reference will now be made in detail to embodiments of the invention, one or more of which are illustrated in the accompanying drawings. The various embodiments provided are intended to explain the invention and not to limit it. In fact, various modifications and variations to the invention will be apparent to those skilled in the art without departing from the scope or spirit of the invention. For example, a feature illustrated or described as part of one embodiment may be used with another embodiment to produce yet another embodiment. Therefore, the invention is intended to cover such modifications and variations within the scope of the appended claims and their equivalents.

[0051] The following reference Figures 1 to 14The following describes the refrigeration and freezing apparatus 20 according to an embodiment of the present invention. The terms "inner," "outer," "upper," "lower," "top," "bottom," "lateral," "horizontal," and "vertical," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These are used only for the convenience of describing the present invention and for simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. To facilitate illustration of the apparatus structure, some of the accompanying drawings are shown in perspective. The arrows in the drawings indicate the airflow direction.

[0052] In the description of this embodiment, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," etc., may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. It should be understood that the term "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0053] This invention provides a refrigeration and freezing device 20. Figure 1 This is a schematic structural diagram of a refrigeration and freezing apparatus 20 according to an embodiment of the present invention. Figure 2 This is a schematic block diagram of a refrigeration and freezing apparatus 20 according to an embodiment of the present invention. The refrigeration and freezing apparatus 20 of the present invention can be a refrigerator, a freezer, or a refrigerator, or other refrigeration equipment with low-temperature storage function.

[0054] The refrigeration and freezing unit 20 may generally include a housing 600, an oxygen handling unit 300, and a condensation prevention component 800.

[0055] The interior of the housing 600 defines a storage space 610. For example, the housing 600 may include an inner liner, the inside of which may define a storage compartment. The storage space 610 may directly refer to the interior space of the storage compartment, or it may refer to the interior space of a storage container located within the storage compartment.

[0056] The oxygen treatment device 300 is in airflow communication with the storage space 610 and is configured to treat the oxygen in the storage space 610 through an electrochemical reaction under the action of an electrolytic voltage. For example, it can consume the oxygen in the storage space 610 through an electrochemical reaction to reduce the oxygen content of the storage space 610, or it can generate oxygen through an electrochemical reaction and introduce the generated oxygen into the storage space 610 to increase the oxygen content of the storage space 610.

[0057] For example, the refrigeration and freezing device 20 can be preset with a modified atmosphere preservation mode, and when the modified atmosphere preservation mode is activated, the oxygen treatment device 300 can be made to work. For example, power can be supplied to the oxygen treatment device 300 so that it can carry out an electrochemical reaction under the action of electrolytic voltage, thereby adjusting the oxygen content of the storage space 610.

[0058] The condensation prevention component 800 includes a control unit 810 connected to the oxygen treatment device 300 to adjust the surface state of the oxygen treatment device 300, thereby preventing condensation on the surface of the oxygen treatment device 300.

[0059] It should be noted that terms such as "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a thermal connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly defined. Those skilled in the art should be able to understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0060] The surface condition of the oxygen treatment device 300 may include surface temperature, surface wind speed, and / or surface humidity. The surface temperature of the oxygen treatment device 300 may be simply referred to as the temperature of the oxygen treatment device 300. The surface of the oxygen treatment device 300 refers to the outer surface of the oxygen treatment device 300. By adjusting the surface condition of the oxygen treatment device 300, the control unit 810 can prevent condensation on the surface of the oxygen treatment device 300 so that the surface condition does not meet the condensation conditions.

[0061] The control unit 810 can adjust the surface state of the oxygen treatment device 300 in several ways. In one example, the control unit 810 can lower the surface temperature of the oxygen treatment device 300 so that the temperature of the oxygen treatment device 300 is below the dew point temperature, thereby preventing condensation on the surface of the oxygen treatment device 300. In another example, the control unit 810 can increase the surface wind speed of the oxygen treatment device 300 to reduce or avoid moisture condensation on the surface of the oxygen treatment device 300, thereby preventing condensation on the surface of the oxygen treatment device 300. In yet another example, the control unit 810 can lower the surface humidity of the oxygen treatment device 300 to prevent the surface of the oxygen treatment device 300 from becoming saturated with moisture, thereby preventing condensation on the surface of the oxygen treatment device 300.

[0062] By incorporating a condensation prevention component 800 and adjusting the surface state of the oxygen treatment device 300 using the control section 810 of the condensation prevention component 800, condensation caused by electrochemical reactions in the oxygen treatment device 300 can be reduced or avoided. Since condensation is almost nonexistent in the oxygen treatment device 300 of this invention, compared to methods that take condensation elimination measures after condensation occurs in the oxygen treatment device 300, the solution in this embodiment can fundamentally avoid the risk of condensation in the oxygen treatment device 300, thereby eliminating cumbersome condensation elimination measures.

[0063] Figure 3 This is a schematic diagram of the voltage supply circuit of a refrigeration and freezing apparatus 20 according to an embodiment of the present invention, showing the connection structure between the storage space 610 and the oxygen treatment device 300. In some optional embodiments, the surface state of the oxygen treatment device 300 includes the surface temperature. The control unit 810 includes a voltage supply circuit electrically connected to the oxygen treatment device 300 to provide the oxygen treatment device 300 with the electrolysis voltage required for the electrochemical reaction and to controllably adjust the electrical parameters of the oxygen treatment device 300 to regulate the surface temperature of the oxygen treatment device 300.

[0064] In one example, a switching element 812 may be provided in the voltage supply circuit, which is controllably configured to open and close to switch the voltage supply circuit on and off. When the refrigeration and freezing unit 20 starts the controlled atmosphere preservation mode, the switching element 812 can be controllably closed to connect the oxygen treatment unit 300 to the voltage supply circuit, forming a loop, thereby allowing the voltage supply circuit to provide electrolytic voltage to the oxygen treatment unit 300.

[0065] The electrical parameters of the oxygen treatment device 300 may include any one or a combination of the following parameters: operating voltage, operating current, and operating resistance. The operating voltage of the oxygen treatment device 300 is the electrolytic voltage supplied to the oxygen treatment device 300 by the voltage supply circuit.

[0066] By adjusting the electrical parameters of the oxygen treatment device 300, the operating state of the oxygen treatment device 300 can be adjusted, thereby regulating the rate of temperature change and consequently altering the surface temperature of the oxygen treatment device 300. For example, when the voltage supply circuit reduces the operating voltage or current of the oxygen treatment device 300, or when the voltage supply circuit increases the operating resistance of the oxygen treatment device 300, the electrochemical reaction rate of the oxygen treatment device 300 can be reduced, thereby lowering the surface temperature of the oxygen treatment device 300.

[0067] By adjusting the electrical parameters of the oxygen treatment device 300 using a voltage supply circuit, the surface temperature of the oxygen treatment device 300 is adjusted, making its surface condition unsuitable for condensation. This method is simple and has a significant effect in preventing condensation. Therefore, based on the solution of this embodiment, a simple method can be used to effectively avoid the risk of condensation in the oxygen treatment device 300 without the need for additional surface condition treatment components, which helps to reduce the cost of preventing condensation in the oxygen treatment device 300.

[0068] It needs to be further emphasized that when the oxygen treatment device 300 is applied to the refrigeration and freezing unit 20, although some condensation control solutions have been disclosed in the prior art, the inventors recognize that the prior art often focuses on the condensation problem of the storage space 610, but does not address the condensation problem of the oxygen treatment device 300, nor does it recognize the necessity of preventing condensation on the surface of the oxygen treatment device 300. The prior art clearly neglects the condensation problem of the oxygen treatment device 300. Furthermore, limited by the inherent structure of the refrigeration and freezing unit 20, such as the drip tray, those skilled in the art, when faced with the condensation problem, would easily think of collecting the condensate water promptly after it occurs. The inventors of this application creatively utilize the control unit 810 to adjust the surface state of the oxygen treatment device 300 to prevent condensation from occurring on its surface. This breaks through the limitations of the prior art and provides a completely new approach to reducing or avoiding the deterioration of the assembly environment caused by condensation on the surface of the oxygen treatment device 300, thereby improving the assembly structural stability of the oxygen treatment device 300.

[0069] In some alternative embodiments, the voltage supply circuit includes a power supply 811. The output voltage of the power supply 811 is controllably and adjustablely set and configured to reduce its output voltage when it is determined that the surface temperature of the oxygen treatment device 300 has reached or is close to the dew point temperature, thereby reducing the electrolysis voltage of the oxygen treatment device 300 and causing the surface temperature of the oxygen treatment device 300 to deviate from the dew point temperature. The surface temperature of the oxygen treatment device 300 is close to the dew point temperature when the difference between the dew point temperature and the surface temperature of the oxygen treatment device 300 is a preset threshold. The preset threshold can be any value in the range of 0 to 3°C.

[0070] When the electrolysis voltage of the oxygen treatment device 300 decreases, the electrochemical reaction rate slows down. Because the electrochemical reaction rate slows down, the heat generated by the electrochemical reaction decreases. Therefore, during the airflow exchange with the low-temperature storage space 610, the surface temperature of the oxygen treatment device 300 decreases, thereby causing the surface temperature of the oxygen treatment device 300 to deviate from the dew point temperature, for example, to be lower than the dew point temperature. In one example, the electrolysis voltage of the oxygen treatment device 300 can be adjusted to 50% to 90% of the initial electrolysis voltage, for example, to 80% of the initial electrolysis voltage.

[0071] By setting an adjustable power supply 811 in the voltage supply circuit and reducing its output voltage when the surface temperature of the oxygen treatment device 300 reaches or approaches the dew point temperature, the electrical parameters of the oxygen treatment device 300 can be adjusted without changing the basic structure of the voltage supply circuit. This method has the advantages of simple control and timely control measures, and it can solve the condensation problem at its source. When the surface temperature of the oxygen treatment device 300 approaches the dew point temperature, timely reduction of the electrolysis voltage of the oxygen treatment device 300 can further reduce the risk of condensation, ensuring that the surface of the oxygen treatment device 300 and its assembly environment remain dry.

[0072] In one example, the power supply 811 can be integrated into the main control board of the refrigeration unit 20. The output voltage of the power supply 811 can be adjusted by regulating the operating parameters of the main control board.

[0073] In some optional embodiments, the condensation control component 800 further includes a detection unit 820, which includes a first detection element 821 disposed at the oxygen processing device 300, configured to detect the surface temperature of the oxygen processing device 300 to determine whether the surface temperature of the oxygen processing device 300 has reached or is close to the dew point temperature. The first detection element 821 may contact the outer surface of the housing 310 of the oxygen processing device 300 to sense the surface temperature of the oxygen processing device 300.

[0074] The detection unit 820 may further include a second detector 822 disposed within the storage space 610 and configured to detect the temperature of the storage space 610. The dew point temperature can be determined based on the detection results of the first detector 821 and the second detector 822. In one example, when the difference between the detection results of the first detector 821 and the second detector 822 is greater than a preset safety threshold, it can be determined that there is a risk of condensation on the surface of the oxygen treatment device 300, and condensation control measures can be initiated, such as adjusting the surface condition of the oxygen treatment device 300. The safety threshold can be any value within the range of 2 to 8°C, for example, 5°C.

[0075] In one example, the detection unit 820 can also detect the dew point temperature of the oxygen processing unit 300. Figure 4 This is an internal structural diagram of a refrigeration and freezing apparatus 20 according to an embodiment of the present invention, showing the connection structure between the storage space 610 and the oxygen processing device 300. Figure 5 This is an internal structural diagram of a refrigeration and freezing apparatus 20 according to another embodiment of the present invention. Figure 5As shown, in a further example, the detection unit 820 can be transformed into a temperature and humidity sensor, which is set on the airflow path between the storage space 610 and the oxygen treatment device 300 to detect the temperature and humidity of the airflow, thereby determining whether there is a risk of condensation on the surface of the oxygen treatment device 300.

[0076] Using the above scheme, the detection results of the detection unit 820 determine whether the surface of the oxygen treatment device 300 has a risk of condensation, which is equivalent to monitoring the surface condition of the oxygen treatment device 300. By combining the detection unit 820 and the control unit 810, the condensation prevention component 800 can play a timely adjustment role when there is a risk of condensation on the surface of the oxygen treatment device 300, thereby preventing condensation from occurring on the surface of the oxygen treatment device 300.

[0077] In some optional embodiments, the detection unit 820 is further configured to detect the temperature of the oxygen treatment device 300 again at a preset time interval after the voltage supply circuit reduces the electrolysis voltage of the oxygen treatment device 300, in order to determine whether the temperature of the oxygen treatment device 300 deviates from the dew point temperature. The preset time interval can be any value in the range of 1 to 10 minutes.

[0078] The voltage supply circuit is also configured to switch to an open circuit state when it is determined that the temperature of the oxygen treatment unit 300 has not deviated from the dew point temperature. For example, the switching element 812 can be opened in a controlled manner to disconnect the oxygen treatment unit 300 from the voltage supply circuit, forming an open circuit, thereby preventing the voltage supply circuit from providing electrolysis voltage to the oxygen treatment unit 300.

[0079] By adopting the above solution, after the control unit 810 adjusts the surface state of the oxygen treatment device 300, it can determine whether the previous adjustment method is effective, and then stop the electrochemical reaction of the oxygen treatment device 300 if the previous adjustment method is ineffective, thereby completely solving the problem of temperature rise of the oxygen treatment device 300 and the resulting condensation problem.

[0080] The oxygen treatment device 300 can be installed outside the storage space 610 and connected to it via an airflow channel for gas exchange. The airflow channel can be defined by a pipe connecting the storage space 610 and the oxygen treatment device 300.

[0081] In some optional embodiments, the surface condition of the oxygen treatment device 300 also includes surface wind speed. The control unit 810 further includes an airflow actuator 815, disposed within an airflow channel between the storage space 610 and the airflow actuator 815, connected to the oxygen treatment device 300 via the airflow channel, and configured to rotate in a controlled manner to pressurize the airflow flowing through the airflow channel. The rotational speed of the airflow actuator 815 is controllably adjustable to regulate the surface wind speed of the oxygen treatment device 300. In this embodiment, the airflow actuator 815 and the oxygen treatment device 300 are connected via the airflow channel to achieve airflow communication, allowing the pressurized airflow from the airflow actuator 815 to flow to the oxygen treatment device 300, thereby regulating the surface wind speed of the oxygen treatment device 300.

[0082] By adjusting the surface air velocity of the oxygen treatment device 300, moisture condensation on the surface of the oxygen treatment device 300 can be reduced or avoided, thereby preventing condensation on the surface of the oxygen treatment device 300. The electrical parameters and surface air velocity of the oxygen treatment device 300 can be adjusted simultaneously or sequentially at certain time intervals. When there is a risk of condensation on the surface of the oxygen treatment device 300, simultaneously adjusting the electrical parameters and surface air velocity can quickly and effectively adjust the surface condition of the oxygen treatment device 300 to a low-risk state that does not meet the conditions for condensation.

[0083] In some alternative embodiments, the airflow actuator 815 is configured to increase its rotational speed when it is determined that the temperature of the oxygen treatment device 300 has reached or is close to the dew point temperature, thereby increasing the surface wind speed of the oxygen treatment device 300. For example, the rotational speed of the airflow actuator 815 may be increased by one to two speed levels.

[0084] When the rotational speed of the airflow actuator 815 increases, the airflow exchange process between the storage space 610 and the oxygen treatment device 300 can be accelerated. Since the storage space 610 is in a low-temperature state, the airflow exchange process can reduce the surface temperature of the oxygen treatment device 300 to a certain extent, so that the surface state of the oxygen treatment device 300 deviates from the risky state with the risk of condensation.

[0085] In some optional embodiments, the detection unit 820 is further configured to detect the temperature of the oxygen treatment device 300 again at a preset time interval after the control unit 810 adjusts the surface state of the oxygen treatment device 300, in order to determine whether the temperature of the oxygen treatment device 300 deviates from the dew point temperature. The preset time interval can be any value in the range of 1 to 10 minutes. The airflow actuation device 815 is further configured to switch to a preset maximum speed when it is determined that the temperature of the oxygen treatment device 300 has not deviated from the dew point temperature.

[0086] By adopting the above scheme, after the control unit 810 adjusts the surface state of the oxygen treatment device 300, it determines whether the previous adjustment method is effective. If the previous adjustment method is ineffective, the airflow actuator 815 is switched to the preset maximum speed. This can further increase the effectiveness of the adjustment method in preventing condensation risks, thereby quickly and effectively avoiding the condensation risk of the oxygen treatment device 300.

[0087] In one example, when the detection unit 820 detects that the temperature of the oxygen treatment device 300 has not deviated from the dew point temperature, it can take measures in two ways at the same time: on the one hand, stop the electrochemical reaction of the oxygen treatment device 300, and on the other hand, switch the speed of the airflow actuator 815 to the preset maximum speed. By taking two measures at the same time, the effectiveness of condensation risk prevention and control can be enhanced.

[0088] In one example, after the control unit 810 adjusts the surface state of the oxygen treatment device 300, if the storage space 610 is opened, the airflow actuator 815 can be switched to the preset maximum speed, and the electrolysis voltage of the oxygen treatment device 300 can be switched to the rated electrolysis voltage.

[0089] In some alternative embodiments, the oxygen treatment device 300 may include a housing 310 and an electrode pair. The electrode pair is electrically connected to a power source 811, for example, a voltage supply circuit, to treat oxygen via an electrochemical reaction under the action of an electrolytic voltage. The electrode pair may include a cathode 320 and an anode 330.

[0090] The housing 310 has a lateral opening. For example, the housing 310 may be in the shape of a flat cuboid. The lateral opening may be located on any face of the housing 310, such as the top, bottom, or side face. In one example, the lateral opening may be located on the face of the housing 310 with the largest area.

[0091] The cathode 320 is disposed at the side opening to define, together with the housing 310, an electrolysis chamber 311 for holding the electrolyte, and is used to consume oxygen through an electrochemical reaction under the action of the electrolysis voltage. Under the action of the electrolysis voltage, oxygen in the air can undergo a reduction reaction at the cathode 320, for example, O2 + 2H2O + 4e-. - →4OH-.

[0092] Anode 330 and cathode 320 are alternately arranged within electrolysis chamber 311, and are used to provide reactants to cathode 320 and generate oxygen through an electrochemical reaction. OH- ions generated at cathode 320 can undergo an oxidation reaction at anode 330 to generate oxygen, i.e., 4OH- ions. - →O2 + 2H2O + 4e - .

[0093] The above examples of electrochemical reactions of cathode 320 and anode 330 are merely illustrative. Based on the understanding of the above embodiments, those skilled in the art should be able to easily change the type of electrochemical reaction or extend the structure of oxygen treatment device 300 applicable to other types of electrochemical reactions. All such changes and extensions should fall within the protection scope of this invention.

[0094] In some alternative embodiments, the refrigeration and freezing device 20 may further include a mounting box 200. Figure 6 This is a schematic assembly diagram of an oxygen treatment device 300 and a mounting box 200 according to an embodiment of the present invention. Figure 7 yes Figure 6 A schematic exploded view of the oxygen treatment device 300 and the mounting box 200 shown.

[0095] The mounting box 200 has an air inlet 231 and an air outlet 221 for connecting the storage space, and its interior defines an airflow space 280 that connects the air inlet 231 and the air outlet 221.

[0096] An oxygen treatment device 300 is disposed within an airflow space 280 and is configured to process the gas flowing into the airflow space 280 from the inlet port 231 through an electrochemical reaction under the action of an electrolytic voltage, so as to generate oxygen-deficient gas or oxygen-enriched gas; the oxygen-deficient gas or oxygen-enriched gas is sent out through the outlet port 221, thereby regulating the oxygen content of the storage space.

[0097] Since the mounting box 200 has an air inlet 231 and an air outlet 221, the airflow space 280 can be connected to the storage space through a pipe, so that the gas in the storage space can flow into the airflow space 280 from the air inlet 231 and flow through the oxygen treatment device 300 to form oxygen-deficient gas or oxygen-enriched gas under the action of the oxygen treatment device 300.

[0098] By providing an air inlet 231 and an air outlet 221 on the mounting box 200 to connect the storage space, and placing the oxygen treatment device 300 within the airflow space 280 connecting the air inlet 231 and the air outlet 221, gas from the storage space can flow into the airflow space 280 through the air inlet 231 and be processed by the oxygen treatment device 300 to form oxygen-deficient or oxygen-enriched gas, which is then finally discharged from the air outlet 221. Using this embodiment, gas from the storage space can enter the air inlet 231 via a pipeline. Therefore, the oxygen treatment device 300 can be placed in any location, for example, anywhere far from the storage space. This reduces the dependence of the oxygen treatment device 300's assembly on the scene structure, improves the assembly flexibility of the oxygen treatment device 300 in the refrigeration and freezing unit 20, and expands the application range of the oxygen treatment device 300.

[0099] In some optional embodiments, the oxygen treatment device 300 may further include an inlet pipe 710 and a return pipe 720. The inlet pipe 710 connects the outlet of the storage space 610 to the inlet port 231. The return pipe 720 connects the outlet port 221 to the inlet of the storage space 610. One end of the inlet pipe 710 away from the inlet port 231 may extend into the storage space 610. The other end of the return pipe 720 away from the outlet port 221 may extend into the storage space 610. Gas in the storage space 610 flows into the inlet port 231 via the inlet pipe 710, then into the airflow space 280, then out of the airflow space 280 via the outlet port 221, and finally back into the storage space 610 via the return pipe 720. The inlet port 231 and the outlet port 221 may be directly or indirectly connected to the inlet pipe 710 and the return pipe 720, respectively.

[0100] In one example, the air inlet 231 and the air outlet 221 may be openings or apertures formed on the mounting box 200, respectively. In some alternative embodiments, the air inlet 231 is a hollow cylindrical interface formed on the mounting box 200 and protruding outward; and / or the air outlet 221 is a hollow cylindrical interface formed on the mounting box 200 and protruding outward.

[0101] When the air inlet 231 is a hollow cylindrical interface formed on the mounting box 200 and protruding outward, and / or the air outlet 221 is a hollow cylindrical interface formed on the mounting box 200 and protruding outward, the air inlet 231 and / or the air outlet 221 can be connected to the external pipeline by plugging or nesting, which can reduce the operational difficulty of connecting the oxygen treatment device 300 to the external pipeline.

[0102] In some alternative embodiments, the air inlet 231 and the air outlet 221 are formed on two different walls of the mounting box 200. This appropriately extends the distance between the air inlet 231 and the air outlet 221, giving the airflow space 280 a longer airflow path and increasing the flow time of the gas through the airflow space 280, thereby ensuring sufficient contact with the oxygen treatment device 300. In one example, the air inlet 231 is formed on the bottom wall 210 or a side wall of the mounting box 200, and the air outlet 221 is formed on the top wall 220 or another side wall of the mounting box 200. The positions of the air inlet 231 and the air outlet 221 can be interchanged.

[0103] In a further embodiment, the air intake port 231 and the air outlet port 221 are arranged in a staggered manner along the longitudinal and transverse directions. For example, in one example, the air intake port 231 is formed in the bottom section of the mounting box 200, and the air outlet port 221 is formed in the top section of the mounting box 200; further, the air intake port 231 may be located on one transverse side of the mounting box 200, and further, the air outlet port 221 may be located on the other transverse side of the mounting box 200. In a further example, the mounting box 200 is generally hollow cylindrical, such as a hollow prism or a hollow cylinder, the air intake port 231 is disposed on the side wall of the mounting box 200 and located at the bottom of the mounting box 200, and the air outlet port 221 is disposed on the top wall 220 of the mounting box 200 and is located away from the side wall of the mounting box 200 where the air intake port 231 is disposed, so as to be obliquely opposite to the air intake port 231.

[0104] By setting the air inlet 231 and the air outlet 221 on two different walls of the mounting box 200, or by further staggering the air inlet 231 and the air outlet 221 in the longitudinal and transverse directions, the gas flow path through the airflow space 280 can be extended, allowing the gas flowing through the airflow space 280 to fully contact the oxygen treatment device 300. This results in the oxygen content of the oxygen-deficient gas delivered through the air outlet 221 being at a low level, or the oxygen content of the oxygen-enriched gas delivered through the air outlet 221 being at a high level.

[0105] In some optional embodiments, the refrigeration and freezing apparatus 20 further includes a flow guiding device 400 disposed within the airflow space 280, having an air intake 411 and an air outlet 412. The air intake 411 is in airflow communication with the air inlet 231, and the air outlet 412 is opposite to the air outlet 221. The flow guiding device 400 is used to facilitate the formation of airflow from the air inlet 231 into the airflow space 280 and towards the air outlet 221. Figure 8 yes Figure 6 The diagram shows a schematic internal structure of the oxygen treatment device 300 and the mounting box 200, with the air outlet 412 shown and the top wall of the mounting box 200 hidden. Figure 9 yes Figure 8 A schematic top view of the internal structure of the oxygen processing device 300 and the mounting box 200 shown.

[0106] When a diversion device 400 is installed in the airflow space 280, and the air intake 411 of the diversion device 400 is connected to the air inlet 231, and the air outlet 412 of the diversion device 400 is opposite to the air outlet 221, the gas in the external space can flow from the air inlet 231 into the airflow space 280 and flow to the air outlet 221 under the action of the diversion device 400, forming an active high-speed airflow circulation structure. This changes the way oxygen is captured by relying solely on the principle of molecular diffusion, and helps to increase the gas flow rate through the airflow space 280 per unit time, thereby improving the working efficiency of the oxygen treatment device 300.

[0107] In one example, the flow diversion device 400 is a centrifugal fan. Of course, in other examples, the flow diversion device 400 can be replaced with any other fan, such as an axial fan.

[0108] In some alternative embodiments, the airflow space 280 has a first section 281 connected to the air inlet 231 and having a gradually expanding cross-section, and a second section 282 connected to the air intake 411 of the air intake device 400 and having a gradually contracting cross-section. As the gas flows through the first section 281, the cross-sectional area (i.e., the area of ​​the flow section) of the streamline cluster perpendicular to the airflow gradually increases in the gas flow direction. As the gas flows through the second section 282, the cross-sectional area (i.e., the area of ​​the flow section) of the streamline cluster perpendicular to the airflow gradually decreases in the gas flow direction.

[0109] By providing a first section 281 with a gradually expanding cross-section connecting the air inlet 231 and a second section 282 with a gradually narrowing cross-section connecting the air intake 411 of the guiding device 400 within the airflow space 280, the gas flowing through the airflow space 280 can be guided by the first section 281 and the second section 282 respectively, thereby reducing or avoiding turbulence. Furthermore, under the action of the first section 281, the gas flowing into the air inlet 231 can slow down its flow to prolong the flow time, thus ensuring sufficient contact with the oxygen treatment device 300; under the action of the second section 282, the gas can accelerate its flow and exit the air outlet 221 at a higher speed, thereby improving the controlled atmosphere efficiency of the storage space.

[0110] In one example, the first section 281 and the second section 282 can be directly connected. The oxygen treatment device 300 can be disposed within the first section 281 or the second section 282, or at the junction of the first section 281 and the second section 282, or simultaneously within both the first section 281 and the second section 282.

[0111] In another example, the airflow space 280 also has a third segment 283 connecting the first segment 281 and the second segment 282. Figure 10 yes Figure 6 The diagram shown is a schematic structural representation of the mounting box 200, with the top wall 220 of the mounting box 200 omitted. Figure 10 As shown, the first segment 281 and the second segment 282 are located on both sides of the third segment 283, respectively. Figure 10 The dashed lines in the middle show the boundary between the first segment 281 and the third segment 283, as well as the boundary between the second segment 282 and the third segment 283.

[0112] The oxygen treatment device 300 is disposed within the third section 283. The cross-sectional area of ​​the third section 283 (i.e., the cross-sectional area of ​​the streamline cluster perpendicular to the airflow) can remain constant in the gas flow direction. This ensures that the gas velocity flowing through the third section 283 does not change significantly, allowing all parts of the oxygen treatment device 300 to contact the flowing gas uniformly, thereby uniformly generating oxygen-deficient or oxygen-enriched gas.

[0113] In some alternative embodiments, the oxygen treatment device 300 further includes a positioning mechanism 500, which is fixed within the airflow space 280 and fixedly connected to the diversion device 400 to fix the diversion device 400 within the airflow space 280. Figure 11 This is an assembly structure diagram of the positioning mechanism 500 and the diversion device 400 of an oxygen treatment device 300 according to an embodiment of the present invention. Figure 12 yes Figure 11 An exploded schematic diagram of the assembly structure of the positioning mechanism 500 and the drainage device 400 shown.

[0114] When it is necessary to install the drainage device 400 into the airflow space 280, the drainage device 400 can be first assembled onto the positioning mechanism 500, and then the positioning mechanism 500 can be assembled into the airflow space 280, for example, fixed to the inner wall of the mounting box 200. By using the positioning mechanism 500 to indirectly fix the drainage device 400 to the airflow space 280, the connection operation between the drainage device 400 and the mounting box 200 can be avoided directly in the relatively narrow airflow space 280.

[0115] In some further embodiments, the air intake device 400 includes a volute 410 and a fan 420 disposed within the volute 410. An air intake 411 and an air outlet 412 are respectively formed on the volute 410.

[0116] The positioning mechanism 500 defines a mounting groove 510 for assembling the volute 410, and also defines a first opening 520 communicating with the mounting groove 510 and the air outlet 412, and a second opening 530 communicating with the mounting groove 510 and the air intake 411. The first opening 520 can be directly opposite the air intake 411 of the volute 410, and the second opening 530 can be directly opposite the air outlet 412 of the volute 410. The volute 410 can be fixed in the mounting groove 510 by screwing.

[0117] By assembling the drainage device 400 into the mounting groove 510 of the positioning mechanism 500 and connecting the mounting groove 510 with the first opening 520 and the second opening 530, the assembly stability between the drainage device 400 and the positioning mechanism 500 can be improved, and the blockage of the air intake 411 and air outlet 412 of the drainage device 400 by the positioning mechanism 500 can be reduced or avoided.

[0118] In some alternative embodiments, the positioning mechanism 500 further defines a protruding claw 540 extending outward from at least a portion of the opening edge of the mounting groove 510. The inner wall of the mounting box 200 correspondingly defines a slot 241 for inserting the protruding claw 540 therein to achieve engagement.

[0119] By adopting the above scheme, the positioning mechanism 500 is fixed in the airflow space 280 and fixedly connected to the diversion device 400, so as to fix the diversion device 400 in the airflow space 280. When the positioning mechanism 500 is fixed on the inner wall of the mounting box 200 by using the cooperation structure of the claw and the slot 241, the assembly method of the diversion device 400 of the oxygen treatment device 300 can be simplified.

[0120] In some alternative embodiments, the protruding claw 540 may be formed by extending radially outward from at least a portion of the opening edge of the mounting groove 510, for example, by extending outward from both lateral ends and the bottom end of the mounting groove 510.

[0121] In one example, the positioning mechanism 500 further defines a flange 550 extending outward from the top edge of the opening edge of the mounting groove 510. A first screw hole 551 is provided on the flange 550, and a second screw hole 242 corresponding to the first screw hole 551 is formed on the inner wall of the mounting box 200, so as to fix the flange 550 to the inner wall of the mounting box 200 by screwing.

[0122] In another example, the positioning mechanism 500 can simultaneously define the protruding claw 540 and the flange 550, thereby using the cooperation structure of the claw and the slot 241 and the screw connection structure to fix the positioning mechanism 500 to the inner wall of the mounting box 200, which is beneficial to further improve the assembly stability of the drainage device 400 in the airflow space 280.

[0123] In some alternative embodiments, the cathode 320 and the anode 330 are plate-shaped electrodes. The outer surface of the cathode 320 extends along the direction of the streamline cluster of the airflow flowing through the third section 283.

[0124] That is, the extension direction of the outer surface of the cathode 320 is parallel to the extension direction of the streamline cluster of the gas flowing through the third section 283. In this way, the gas flowing through the third section 283 can contact the outer surface of the cathode 320 uniformly in sequence, thereby prolonging the contact time between the cathode 320 and the gas to be treated per unit time.

[0125] In some optional embodiments, the housing 310 further defines an exhaust chamber 312 above the electrolysis chamber 311, and the exhaust chamber 312 has an exhaust port 341. The exhaust chamber 312 is connected to the electrolysis chamber 311 and is used to collect oxygen generated by the anode 330, which is then discharged through the exhaust port 341. That is, the exhaust chamber 312 is connected to both the electrolysis chamber 311 and the external environment, so as to discharge the oxygen discharged from the exhaust port 341 to the external environment.

[0126] The oxygen collected and discharged through the exhaust chamber 312 can be released directly. Alternatively, in another example, the oxygen collected and discharged through the exhaust chamber 312 can also be delivered to the high-oxygen preservation space of the refrigeration and freezing unit 20 to create a high-oxygen preservation atmosphere and improve the preservation performance of the refrigeration and freezing unit 20.

[0127] With the above structure, the oxygen treatment device 300 can be used to consume the oxygen in the low-oxygen preservation space of the refrigeration and freezing device 20, and the oxygen treatment device 300 can also be used to increase the oxygen in the high-oxygen preservation space of the refrigeration and freezing device 20, thus realizing the functional reuse of the oxygen treatment device 300.

[0128] In some optional embodiments, the exhaust chamber 312 and the electrolysis chamber 311 are integrally formed. This arrangement eliminates the need for an assembly structure between the exhaust chamber 312 and the electrolysis chamber 311, while ensuring the airtightness of the connection structure between them. A gas-liquid communication port is formed between the electrolysis chamber 311 and the exhaust chamber 312, allowing them to communicate with each other.

[0129] In some optional embodiments, the mounting box 200 is also provided with an oxygen vent 222. The oxygen treatment device 300 also includes an oxygen vent pipe 350, one end of which is connected to an exhaust port 341, and the other end extends from the oxygen vent 222 to the outside of the mounting box 200, for discharging oxygen discharged through the exhaust port 341 to the outside of the mounting box 200.

[0130] In some alternative embodiments, the oxygen treatment device 300 may omit the oxygen exhaust pipe 350, and the exhaust port 341 may be a hollow columnar interface formed on the exhaust chamber 312 and protruding outward. The exhaust port 341 may extend to the outside of the mounting box 200 through the oxygen exhaust port 222 to exhaust the flowing oxygen to the outside of the mounting box 200.

[0131] In some optional embodiments, the mounting box 200 is also provided with a liquid injection port 223. The oxygen treatment device 300 also includes a liquid replenishment pipe 360, one end of which is connected to the electrolysis chamber 311, and the other end extends from the liquid injection port 223 to the outside of the mounting box 200, for guiding external liquid to the electrolysis chamber 311.

[0132] In some alternative embodiments, the mounting box 200 has a bottom wall 210 and a top wall 220, as well as a first side wall 230 and a second side wall 240 that extend upward from the bottom wall 210 to the top wall 220 and are disposed opposite to each other.

[0133] An air outlet 221 is formed on the top wall 220 of the mounting box 200, for example, it can be located on one side of the mounting box 200. An air inlet 231 is formed on the first side wall 230 of the mounting box 200, for example, the first side wall 230 can be formed on the other side of the mounting box 200, and the air inlet 231 can be located at the bottom center of the first side wall 230. A drainage device 400 is fixed to the second side wall 240 of the mounting box 200 and is located below the air outlet 221.

[0134] With the above structure, under the action of the diversion device 400, the gas flowing through the airflow space 280 can flow in an upward direction, thus extending the gas flow path through the airflow space 280.

[0135] The mounting box 200 also has a third sidewall 250 and a fourth sidewall 260, a first guide surface 271 and a second guide surface 272, as well as a third guide surface 273 and a fourth guide surface 274.

[0136] The third sidewall 250 and the fourth sidewall 260 extend upward from the bottom wall 210 to the top wall 220, and together with the first sidewall 230 and the second sidewall 240, they enclose a cylinder with a top opening. In one example, the first sidewall 230 is approximately parallel to the second sidewall 240, and the third sidewall 250 is approximately parallel to the fourth sidewall 260.

[0137] The first guide surface 271 and the second guide surface 272 extend from the inner surface of the first sidewall 230 to the inner surface of the third sidewall 250 and the inner surface of the fourth sidewall 260, respectively, and form an obtuse angle with the inner surface of the first sidewall 230 to define the first section 281. The first guide surface 271 may extend from the inner surface of the end section of the first sidewall 230 near the third sidewall 250 to the inner surface of the end section of the third sidewall 250 near the first sidewall 230. The second guide surface 272 may extend from the inner surface of the end section of the first sidewall 230 near the fourth sidewall 260 to the inner surface of the end section of the fourth sidewall 260 near the first sidewall 230.

[0138] The third guide surface 273 and the fourth guide surface 274 extend from the inner surface of the second sidewall 240 to the inner surfaces of the third sidewall 250 and the fourth sidewall 260, respectively, forming an obtuse angle with the inner surface of the second sidewall 240 to define the second section 282. The third guide surface 273 may extend from the inner surface of the end section of the second sidewall 240 near the third sidewall 250 to the inner surface of the end section of the third sidewall 250 near the second sidewall 240. The fourth guide surface 274 may extend from the inner surface of the end section of the second sidewall 240 near the fourth sidewall 260 to the inner surface of the end section of the fourth sidewall 260 near the second sidewall 240.

[0139] In one example, the top wall 220, bottom wall 210, first side wall 230, second side wall 240, third side wall 250, fourth side wall 260, first guide surface 271, second guide surface 272, third guide surface 273, and fourth guide surface 274 of the mounting box 200 can all be manufactured using a one-piece molding process. By adopting this structure, since the mounting box 200 can be mass-produced using a one-piece molding process, the assembly process of the entire oxygen treatment device 300 can be simplified, and product consistency can be ensured.

[0140] In some alternative embodiments, the oxygen processing device 300 may be configured as a plurality of devices. Figure 13 This is a schematic structural diagram of a plurality of oxygen treatment devices 300 according to an embodiment of the present invention. The plurality of oxygen treatment devices 300 can be arranged sequentially at intervals along a preset direction to enhance oxygen regulation efficiency.

[0141] Figure 14 This is a control flow diagram of a refrigeration and freezing apparatus 20 according to an embodiment of the present invention. The control flow generally includes:

[0142] Step S1402: Detect the temperature of the oxygen treatment device 300. This step is performed during the electrochemical reaction in the oxygen treatment device 300.

[0143] Step S1404: Determine whether the temperature of the oxygen treatment device 300 has reached or is close to the dew point temperature based on the temperature of the oxygen treatment device 300; if yes, proceed to step S1406; if no, proceed to step S1402.

[0144] Step S1406: Adjust the electrical parameters of the oxygen treatment device 300 so that the temperature of the oxygen treatment device 300 deviates from the dew point temperature. During the adjustment of the electrical parameters of the oxygen treatment device 300, the power supply 811 of the voltage supply circuit can reduce the output voltage, thereby reducing the electrolysis voltage of the oxygen treatment device 300.

[0145] Step S1408: Adjust the surface wind speed of the oxygen treatment device 300. In this step, the airflow actuator 815 can increase its rotational speed, thereby increasing the surface wind speed of the oxygen treatment device 300.

[0146] Step S1410: After a preset time interval, the temperature of the oxygen treatment device 300 is checked again.

[0147] Step S1412: Determine whether the oxygen treatment device 300 deviates from the dew point temperature based on the temperature of the oxygen treatment device 300. If yes, proceed to step S1418; otherwise, proceed to step S1414.

[0148] Step S1414: The voltage supply circuit is switched to the open circuit state.

[0149] In step S1416, the airflow actuator 815 switches to the preset maximum speed.

[0150] In step S1418, the rotational speed of the airflow actuator 815 and the state of the voltage supply circuit are maintained constant until the surface condition of the oxygen treatment device 300 reaches the preset condensation control condition. Once the surface condition of the oxygen treatment device 300 reaches the preset condensation control condition, the condensation control measures are released. For example, the condensation control measures can be released when the difference between the surface temperature and the dew point temperature of the oxygen treatment device 300 exceeds a preset safety threshold. After the condensation control measures are released, the airflow actuator 815 and the oxygen treatment device 300 can continue to operate in their initial states before the condensation control measures were implemented.

[0151] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A refrigeration and freezing apparatus, characterized in that, include: The box-like structure defines the storage space within it; An oxygen treatment device is connected to the airflow of the storage space and is configured to treat the oxygen in the storage space through an electrochemical reaction under the action of an electrolytic voltage. and A condensation prevention component includes a control unit connected to the oxygen treatment device to adjust the surface state of the oxygen treatment device, thereby preventing condensation on the surface of the oxygen treatment device. The surface condition of the oxygen treatment device includes surface temperature; and The control unit includes a voltage supply circuit electrically connected to the oxygen treatment device to provide the oxygen treatment device with the electrolysis voltage required for the electrochemical reaction, and to controllably adjust the electrical parameters of the oxygen treatment device to regulate the surface temperature of the oxygen treatment device.

2. The refrigeration and freezing apparatus according to claim 1, characterized in that, The voltage supply circuit has a power supply whose output voltage is controllably adjustable and configured to reduce its output voltage when the difference between the surface temperature and the dew point temperature of the oxygen treatment device is determined to be less than or equal to 3°C, thereby reducing the electrolysis voltage of the oxygen treatment device and causing the surface temperature of the oxygen treatment device to deviate from the dew point temperature.

3. The refrigeration and freezing apparatus according to claim 1, characterized in that, The condensation control component further includes a detection unit, which includes a first detection element disposed at the oxygen treatment device and configured to detect the surface temperature of the oxygen treatment device to determine whether the difference between the surface temperature of the oxygen treatment device and the dew point temperature is less than or equal to 3°C.

4. The refrigeration and freezing apparatus according to claim 3, characterized in that, The detection unit is further configured to detect the temperature of the oxygen treatment device again at a preset time interval after the voltage supply circuit reduces the electrolysis voltage of the oxygen treatment device, in order to determine whether the temperature of the oxygen treatment device deviates from the dew point temperature; and The voltage supply circuit is also configured to switch to an open circuit state when it is determined that the temperature of the oxygen processing device has not deviated from the dew point temperature.

5. The refrigeration and freezing apparatus according to claim 3, characterized in that, The surface condition of the oxygen treatment device also includes surface wind speed; The control unit further includes an airflow actuation device disposed in the airflow channel between the storage space and the oxygen treatment device, connected to the oxygen treatment device via the airflow channel, and configured to rotate in a controlled manner to pressurize the airflow flowing through the airflow channel; and The rotational speed of the airflow actuator is controllably and adjustable to regulate the surface wind speed of the oxygen treatment device.

6. The refrigeration and freezing apparatus according to claim 5, characterized in that, The airflow actuation device is configured to increase the rotational speed when the difference between the temperature of the oxygen treatment device and the dew point temperature is less than or equal to 3°C, thereby increasing the surface wind speed of the oxygen treatment device.

7. The refrigeration and freezing apparatus according to claim 5, characterized in that, The detection unit is further configured to detect the temperature of the oxygen treatment device again at a preset time interval after the control unit adjusts the surface state of the oxygen treatment device, in order to determine whether the temperature of the oxygen treatment device deviates from the dew point temperature; and The airflow actuator is also configured to switch to a preset maximum speed when it is determined that the temperature of the oxygen processing device has not deviated from the dew point temperature.

8. The refrigeration and freezing apparatus according to claim 1, characterized in that, Also includes: The mounting box has an air inlet and an air outlet for connecting the storage space, and its interior defines an airflow space connecting the air inlet and the air outlet; and The oxygen treatment device is disposed within the airflow space and configured to treat the gas flowing into the airflow space from the air inlet through an electrochemical reaction under the action of an electrolytic voltage, so as to generate oxygen-deficient gas or oxygen-enriched gas; the oxygen-deficient gas or the oxygen-enriched gas is sent out through the air outlet, thereby adjusting the oxygen content of the storage space.

9. The refrigeration and freezing apparatus according to claim 8, characterized in that, Also includes: An air intake pipe, which connects the air outlet of the storage space with the air intake interface, is configured to guide the gas in the storage space to the airflow space; and The return air pipeline connects the air outlet to the air inlet of the storage space and is configured to guide the oxygen-deficient gas or the oxygen-enriched gas to the storage space.

Citation Information

Patent Citations

  • Refrigerating device and storing container thereof

    CN109855340A