A 200 degree celsius and above open circuit high temperature test device and method

Abstract

The application relates to a 200 DEG C and above open circuit high-temperature examination testing device and method, the device comprises a plurality of unit cylinders, each of the unit cylinders comprises a cylinder body with a bottom surface and a top surface opening, one or more windows are arranged on the side surface of the cylinder body, and a window door for controlling the opening and closing of the window is arranged on each window; the unit cylinders are combined and arranged together to form a whole, and the windows on each two adjacent cylinder bodies correspond to each other. The 200 DEG C and above open circuit high-temperature examination testing device takes the unit cylinder as the main body, can control the opening and closing of the heat dissipation channel through the window door on the cylinder body, and can be adjusted according to the sizes and layouts of different circuit boards and functional units in the circuit system, so that the device is suitable for various circuits.

Description

Technical Field

[0001] This invention relates to the field of oil and gas drilling technology, specifically to a high-temperature testing device and method for open circuits at 200°C and above. Background Technology

[0002] In oil drilling, as drilling depth increases, the temperatures that drilling tools and measurement systems withstand also increase. Currently, most foreign oil companies provide logging-while-drilling (LOD) instruments capable of withstanding temperatures up to 175°C, while domestic companies are actively developing LOD circuit systems capable of withstanding temperatures of 200°C and above, ensuring drilling depths reach 8000 meters and even 10000 meters. In this research and development process, the temperature resistance and heat dissipation of the circuit system, as well as the self-heating of electronic components, are key factors affecting the design of ultra-high temperature LOD circuits. Therefore, reasonable open circuit high-temperature testing devices and methods are essential in the research and development process.

[0003] Currently, the existing open circuit high-temperature testing methods in China have the following shortcomings: (1) the testing operation needs to be completed in a high-temperature oven, and the temperature field distribution cannot be monitored; (2) the testing cannot be carried out in units; and (3) the heat dissipation channels of the circuit cannot be observed.

[0004] To achieve high-temperature testing of open circuits and address the aforementioned problems, a more independent and controllable testing method is needed. How to achieve this ultra-high-temperature circuit testing is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a high temperature test device and method for open circuits at 200°C and above, which can independently test the functional units of open circuits at high temperatures, and provide a more realistic observation of the overall temperature field distribution and heat dissipation channels of the circuit.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a high temperature test device for open circuits at 200°C and above, comprising multiple unit cylinders, each of the unit cylinders comprising a cylinder body with openings on the bottom and top surfaces, one or more windows provided on the side of the cylinder body, and each of the windows being provided with a door for controlling the opening and closing of the window; the multiple unit cylinders are arranged together to form a whole, and the windows on each of the two adjacent cylinder bodies correspond to each other.

[0007] Based on the above technical solution, the present invention can be further improved as follows.

[0008] Furthermore, the side of the cylinder is provided with one or more fixing holes, and the fixing holes on each pair of adjacent cylinders are corresponding and are engaged by a pin to fix the corresponding two unit cylinders.

[0009] Furthermore, the cylinder has an opening on its bottom surface to cover the test area of ​​the open circuit, and an opening on its top surface to connect a heating source.

[0010] Furthermore, the cylindrical body is specifically a cube with a rectangular base.

[0011] Furthermore, the window is provided on one or more sides of the cylinder, and the window is rectangular in shape.

[0012] The beneficial effects of the present invention are: the present invention provides a high temperature test device for open circuits at 200°C and above, which is mainly based on a unit cylinder. It can not only control the opening and closing of the heat dissipation channel through the windows and doors on the cylinder, but also adjust it according to different circuit board sizes and the size and layout of functional units in the circuit system, thereby achieving the ability to adapt to various circuits.

[0013] Based on the above-mentioned high-temperature testing device for open circuits at 200°C and above, the present invention also provides a high-temperature testing method for open circuits at 200°C and above.

[0014] A high-temperature testing method for open circuits at 200℃ and above includes the following steps:

[0015] The open circuit to be tested is divided into test areas to obtain multiple functional units. Based on the size and layout of the functional units, a high temperature test device for open circuits at 200°C and above as described in any one of claims 1 to 5 is designed. The bottom surface of each cylinder in the high temperature test device for open circuits at 200°C and above is opened to accommodate corresponding functional units.

[0016] The device controls the opening and closing of one or more windows on the cylinder of the open circuit high-temperature test device at 200°C and above, and heats one or more corresponding functional units through upper ventilation, so as to conduct independent high-temperature test on the functional units of the open circuit or conduct high-temperature test on the overall temperature field distribution and heat dissipation channel of multiple functional units.

[0017] Based on the above technical solution, the present invention can be further improved as follows.

[0018] Furthermore, the specific steps for conducting independent high-temperature testing on the functional units of the open circuit are as follows: A unit testing scheme is formulated based on a functional unit to be tested in the open circuit. According to the unit testing scheme, all windows and doors on a corresponding cylinder in the 200℃ and above open circuit high-temperature testing device are closed to separate the functional unit to be tested from the non-tested functional units. Heat is blown in from the opening on the top surface of the corresponding cylinder through an upward airflow to individually heat the functional unit to be tested to a preset testing temperature, thus enabling the individual high-temperature testing of the functional unit to be tested.

[0019] Furthermore, when a functional unit to be evaluated fails the high-temperature test, the following steps are also included: optimizing and improving the open circuit.

[0020] Furthermore, the specific steps for conducting high-temperature testing on the overall temperature field distribution and heat dissipation channels of multiple functional units are as follows: A system testing scheme is formulated based on the multiple functional units to be tested within a preset area of ​​the open circuit. According to the system testing scheme, the windows and doors on the corresponding cylinders of the 200℃ and above open circuit high-temperature testing device are opened and closed in combination. Heat is blown in from the openings on the top surface of the corresponding cylinders through an upward airflow to heat the preset area of ​​the open circuit. The heat dissipation effect and heat dissipation channels of each functional unit to be tested are observed using an infrared thermal imaging instrument when all windows of the corresponding cylinders are closed and fully open, in order to conduct high-temperature testing on the temperature resistance characteristics and temperature field distribution of the preset area of ​​the open circuit.

[0021] Furthermore, when conducting high-temperature testing on the temperature resistance characteristics and temperature field distribution of the preset area of ​​the open circuit, the system testing scheme is used to determine whether the preset area of ​​the open circuit passes the high-temperature testing; if the preset area of ​​the open circuit fails the high-temperature testing, the open circuit is optimized and improved.

[0022] The beneficial effects of this invention are: a high-temperature test method for open circuits at 200°C and above uses a high-temperature test device for open circuits at 200°C and above to independently test the functional units of open circuits at high temperatures, and to more realistically observe the overall temperature field distribution and heat dissipation channels of the circuit. This not only improves upon the previous method of using a high-temperature oven for testing, which could not observe the temperature field distribution, but also allows for the observation of the heat dissipation channels of each component, and based on this, the overall circuit system can be optimized and upgraded. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the unit cylinder in a high-temperature testing device for open circuits at 200℃ and above according to the present invention.

[0024] Figure 2This is a schematic diagram of the structure of a high-temperature testing device for open circuits at 200°C and above according to the present invention.

[0025] Figure 3 This is a flowchart of a high-temperature testing method for open circuits at 200°C and above, according to the present invention.

[0026] Figure 4 Flowchart of the unit assessment test plan;

[0027] Figure 5 This is a flowchart of the system assessment and testing plan. Detailed Implementation

[0028] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0029] like Figure 1 and Figure 2 As shown, a high-temperature testing device for open circuits at 200℃ and above includes multiple unit cylinders 100. Each unit cylinder 100 includes a cylinder body 1 with openings on the bottom and top surfaces. One or more windows 2 are provided on the side of each cylinder body 1, and each window 2 is provided with a door for controlling the opening and closing of the window. The multiple unit cylinders 100 are arranged together to form a whole, and the windows 2 on each two adjacent cylinder bodies 1 correspond to each other.

[0030] In some embodiments: one or more fixing holes 3 are provided on the side of the cylindrical body 1, and the fixing holes 3 on each pair of adjacent cylindrical bodies 1 correspond and are engaged by a pin to fix the corresponding two unit cylinders 100. The cylindrical body 1 has a bottom opening for covering the test area of ​​the open circuit, and a top opening for connecting a heating source. The cylindrical body 1 is specifically a cube with a rectangular bottom. The window 2 is provided on one or more sides of the cylindrical body 1, and the window 2 is rectangular in shape.

[0031] This invention discloses a high-temperature testing device for open circuits at 200℃ and above. The device is composed of unit cylinders, each surrounded by a rectangular window that can be manually opened and closed. Circular fixing holes are used to assemble the unit cylinders, in conjunction with pins (not shown in the figure). The size of the base of the unit cylinder and the aspect ratio of the rectangle are not limited; the illustration is for illustrative purposes only. The device can be adjusted according to the size of the circuit board to be tested, the unit arrangement, and the distribution of components. The side windows and doors are used for the conduction or obstruction of airflow and temperature, and their opening and closing can be adjusted according to the actual testing plan. The fixing holes, in conjunction with the pins, allow the various unit cylinders to be combined into a single unit.

[0032] Figure 2In the open circuit high temperature test device shown at 200℃ and above, each irregular rectangle (rectangle marked with dots) is a unit tube. According to the size and layout of the components and units in the circuit, the unit tube can be made into rectangles of different sizes and aspect ratios to adapt to the shape and size of the components and circuit units. Figure 2 The size, aspect ratio, number of units, and layout of the circuit are for illustrative purposes only and do not represent limitations.

[0033] Based on the above-mentioned high-temperature testing device for open circuits at 200°C and above, the present invention also provides a high-temperature testing method for open circuits at 200°C and above.

[0034] like Figure 3 As shown, a high-temperature testing method for open circuits at 200℃ and above includes the following steps:

[0035] The open circuit to be tested is divided into test areas to obtain multiple functional units. Based on the size and layout of the functional units, a high temperature test device for open circuits at 200°C and above as described in any one of claims 1 to 5 is designed. The bottom surface of each cylinder in the high temperature test device for open circuits at 200°C and above is opened to accommodate corresponding functional units.

[0036] The device controls the opening and closing of one or more windows on the cylinder of the open circuit high-temperature test device at 200°C and above, and heats one or more corresponding functional units through upper ventilation, so as to conduct independent high-temperature test on the functional units of the open circuit or conduct high-temperature test on the overall temperature field distribution and heat dissipation channel of multiple functional units.

[0037] In some embodiments, such as Figure 4 As shown, the specific steps for conducting independent high-temperature testing on the functional units of an open circuit are as follows: A unit testing scheme is formulated based on a functional unit to be tested in the open circuit. According to the unit testing scheme, all windows and doors on a corresponding cylinder in the 200℃ and above open circuit high-temperature testing device are closed to separate the functional unit to be tested from the non-tested functional units. Heat is blown in from the opening on the top surface of the corresponding cylinder through an upward airflow to individually heat the functional unit to be tested to a preset testing temperature, thus enabling the individual high-temperature testing of the functional unit to be tested.

[0038] If a functional unit to be evaluated fails the high-temperature test, the following steps are also included: optimizing and improving the open circuit.

[0039] Unit Assessment: When the assessment and testing work begins, corresponding unit assessment plans are formulated for the functional units to be assessed. Based on the testing requirements and the formulated unit assessment plans, the unit cylinders are arranged and the opening and closing of the windows in each unit cylinder are controlled. The functional units to be assessed are heated individually. The heat dissipation effect and heat dissipation channels of the functional units to be assessed are observed using instruments under conditions of fully closed or fully open windows. Their temperature resistance characteristics and temperature field distribution are observed. Finally, based on the assessment plan, it is determined whether the functional unit to be assessed passes the assessment. If the unit fails the unit assessment, further optimization and improvement of the circuit are required.

[0040] This invention separates the functional unit to be tested from the external circuit through a unit cylinder, closes all windows and doors, and heats the functional unit to be tested to a specified testing temperature by blowing air from the top. In this way, the functional unit to be tested is tested while the external circuit is slightly heated, achieving the effect of testing the functional unit separately and protecting other components.

[0041] In some embodiments, such as Figure 5 As shown, the specific steps for high-temperature testing of the overall temperature field distribution and heat dissipation channels of multiple functional units are as follows: A system testing scheme is formulated based on the multiple functional units to be tested within a preset area of ​​the open circuit. According to the system testing scheme, the windows and doors on the corresponding cylinders of the 200℃ and above open circuit high-temperature testing device are opened and closed in combination. Heat is blown in from the openings on the top surface of the corresponding cylinders through an upward airflow to heat the preset area of ​​the open circuit. The heat dissipation effect and heat dissipation channels of each functional unit to be tested are observed using an infrared thermal imaging instrument when all windows of the corresponding cylinders are closed and all windows are open, in order to conduct high-temperature testing of the temperature resistance characteristics and temperature field distribution of the preset area of ​​the open circuit.

[0042] When conducting high-temperature testing on the temperature resistance characteristics and temperature field distribution of a preset area of ​​an open circuit, the system testing scheme is used to determine whether the preset area of ​​the open circuit passes the high-temperature testing; if the preset area of ​​the open circuit fails the high-temperature testing, the open circuit is optimized and improved.

[0043] System Assessment: Upon commencement of operation, a comprehensive assessment plan is developed for the circuits to be assessed. Based on the testing requirements and the established plan, the unit cylinders are arranged and the opening and closing of the windows are controlled. The circuits to be tested are heated as a whole. The heat dissipation effect and heat dissipation channels of the assessment units are observed using instruments under conditions of full closure or full opening. Their temperature resistance characteristics and temperature field distribution are observed. Finally, based on the assessment plan, it is determined whether the circuit meets the application requirements. If it fails the assessment, further optimization and improvement of the circuit are required.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-temperature testing method for open circuits at 200℃ and above, characterized in that, Includes the following steps: The open circuit to be tested is divided into test areas to obtain multiple functional units. A high-temperature testing device for open circuits at 200℃ and above is designed based on the size and layout of these functional units. Corresponding functional units are installed on the bottom openings of each cylinder in the 200℃ and above open circuit high-temperature testing device. The 200℃ and above open circuit high-temperature testing device includes multiple unit cylinders, each of which includes a cylinder with openings on its bottom and top surfaces. One or more windows are provided on the side of each cylinder, and each window has a door for controlling its opening and closing. Multiple unit cylinders are arranged together to form a whole, with windows corresponding to each adjacent pair of cylinders. The device controls the opening and closing of one or more windows on the cylinder of the open circuit high-temperature test device at 200°C and above, and heats one or more corresponding functional units through upper ventilation, so as to conduct independent high-temperature test on the functional units of the open circuit or conduct high-temperature test on the overall temperature field distribution and heat dissipation channel of multiple functional units.

2. The high-temperature testing method for open circuits at 200℃ and above according to claim 1, characterized in that, The specific steps for conducting independent high-temperature testing on the functional units of an open circuit are as follows: A unit testing scheme is formulated based on a functional unit to be tested in the open circuit. According to the unit testing scheme, all windows and doors on a corresponding cylinder in the 200℃ and above open circuit high-temperature testing device are closed to separate the functional unit to be tested from the non-tested functional units. Heat is blown in from the opening on the top surface of the corresponding cylinder through an upward airflow to individually heat the functional unit to be tested to a preset testing temperature, thus enabling the individual high-temperature testing of the functional unit to be tested.

3. The high-temperature testing method for open circuits at 200℃ and above according to claim 2, characterized in that, If a functional unit to be evaluated fails the high-temperature test, the following steps are also included: optimizing and improving the open circuit.

4. The high-temperature testing method for open circuits at 200℃ and above according to claim 1, characterized in that, The specific steps for conducting high-temperature testing on the overall temperature field distribution and heat dissipation channels of multiple functional units are as follows: A system testing scheme is formulated based on the multiple functional units to be tested within a preset area of ​​the open circuit. According to the system testing scheme, the windows and doors on the corresponding cylinders of the 200℃ and above open circuit high-temperature testing device are opened and closed in combination. Heat is blown in from the openings on the top surface of the corresponding cylinders through an upward airflow to heat the preset area of ​​the open circuit. The heat dissipation effect and heat dissipation channels of each functional unit to be tested are observed using an infrared thermal imaging instrument when all windows of the corresponding cylinders are closed and fully open, in order to conduct high-temperature testing on the temperature resistance characteristics and temperature field distribution of the preset area of ​​the open circuit.

5. The high-temperature testing method for open circuits at 200℃ and above according to claim 4, characterized in that, When conducting high-temperature testing on the temperature resistance characteristics and temperature field distribution of a preset area of ​​an open circuit, the system testing scheme is used to determine whether the preset area of ​​the open circuit passes the high-temperature testing; if the preset area of ​​the open circuit fails the high-temperature testing, the open circuit is optimized and improved.

6. The high-temperature testing method for open circuits at 200℃ and above according to claim 1, characterized in that, The side of the cylinder is provided with one or more fixing holes. Each pair of adjacent fixing holes on the cylinder corresponds to and is engaged with a pin to fix the corresponding two unit cylinders.

7. The high-temperature testing method for open circuits at 200℃ and above according to claim 1, characterized in that, The cylinder has an opening on its bottom surface to cover the test area of ​​an open circuit, and an opening on its top surface to connect a heating source.

8. The high-temperature testing method for open circuits at 200℃ and above according to claim 1, characterized in that, The cylinder is specifically a cube with a rectangular base.

9. The high-temperature testing method for open circuits at 200℃ and above according to claim 8, characterized in that, The window is provided on one or more sides of the cylinder, and the window is rectangular in shape.

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