Cooling composite material and preparation method and application thereof

Abstract

The application relates to the field of heat-conducting materials, and particularly discloses a cool composite material, a preparation method thereof and application thereof. The cool composite material comprises the following components in parts by weight: 10-30 parts of epoxy resin, 20-60 parts of heat-conducting fillers, 10-40 parts of auxiliary fillers, 3-15 parts of curing agents, 2-15 parts of accelerators and 10-13 parts of solvents; the heat-conducting fillers comprise flaky boron nitride and spherical aluminum nitride in a mass ratio of 1:(2-3); the auxiliary fillers comprise silica powder; the preparation method comprises the following steps: accurately weighing the raw materials according to the proportions, uniformly mixing the raw materials, and obtaining a glue; coating the glue on a release film, and heating and curing the glue at 110-180 DEG C to obtain the cool composite material. The cool composite material has a relatively optimal heat-conducting coefficient, has a cool feeling when contacting with human bodies, and can be applied to the preparation of mobile phone back covers or tablet computer back covers.

Description

Technical Field

[0001] This application relates to the field of thermally conductive resins, and more specifically, to a cooling composite material and a method for preparing the same. Background Technology

[0002] With the continuous development of electrical and electronic equipment, users have increasingly higher requirements for the appearance and texture of products. Ceramics, due to their high gloss, high hardness, and excellent texture, have received increasing attention. However, ceramics have drawbacks such as difficult molding, long processing time, high cost, and excessive hardness. To address this, some companies have combined resin and ceramic powder to create composite materials for use in electronic equipment manufacturing. However, these composite materials suffer from low thermal conductivity and lack the cool feel of ceramics. Therefore, how to provide a composite material that is easy to process, has high thermal conductivity, and provides a cool touch is a problem that needs to be solved. Summary of the Invention

[0003] In order to provide a composite material that is easy to process, has high thermal conductivity, and feels cool to the touch, this application provides a cooling composite material, its preparation method, and its application.

[0004] In a first aspect, this application provides a cooling composite material, which adopts the following technical solution:

[0005] A cooling composite material comprises the following components in parts by weight: 10-30 parts epoxy resin, 20-60 parts thermally conductive filler, 10-40 parts auxiliary filler, 3-15 parts curing agent, 2-15 parts accelerator, and 10-13 parts solvent.

[0006] The thermally conductive filler consists of sheet-like boron nitride and spherical aluminum nitride in a mass ratio of 1:(2-3);

[0007] Auxiliary fillers include silica fume.

[0008] By adopting the above technical solutions, epoxy resin possesses superior strength and toughness, ensuring a stable shape that resists external impacts and deformation. It also exhibits excellent heat resistance, corrosion resistance, and insulation properties. The thermally conductive filler, once incorporated into the system, imparts thermal conductivity, allowing the material to absorb and dissipate body heat upon contact, providing a cooling sensation. Both boron nitride and aluminum nitride possess excellent thermal conductivity, along with superior hardness and strength. The combination of flake-shaped boron nitride and spherical aluminum nitride, with the spherical aluminum nitride filling the spaces between the flake-shaped boron nitride, ensures sufficient contact between the thermally conductive fillers, forming an effective thermal conductivity pathway. Silica fume exhibits excellent corrosion resistance, impact resistance, and wear resistance. Its needle-like structure readily forms an intersecting three-dimensional structure within the system. During curing, this structure interacts with the network structure formed by the epoxy resin, thereby enhancing the material's hardness and wear resistance.

[0009] Preferably, the spherical aluminum nitride grafted with epoxidized soybean oil.

[0010] Preferably, the spherical aluminum nitride is first treated with silane-polyethylene glycol-carboxyl groups, and then grafted with epoxidized soybean oil.

[0011] By adopting the above technical solution, epoxidized soybean oil can adjust the viscosity of the material and play a lubricating role in the system. Using epoxidized soybean oil to treat spherical aluminum nitride can promote the uniform dispersion of spherical aluminum nitride in the system by means of the lubricating effect of epoxidized soybean oil, thereby helping to form an effective heat conduction path in the system. The carboxyl group in silane-polyethylene glycol-carboxyl can undergo a ring-opening reaction with the epoxy group in epoxidized soybean oil, thereby forming oligomers, improving the compatibility between epoxidized soybean oil and epoxy resin, and further promoting the uniform dispersion of spherical aluminum nitride in the system.

[0012] Preferably, the auxiliary filler further includes coconut carbon powder, and the mass ratio of silica fume to coconut carbon powder is (2-3):1.

[0013] By employing the above technical solution, aluminum nitride is easily hydrolyzed upon contact with water to produce aluminum hydroxide, which can easily disrupt the thermal conductivity pathway in the system and affect the performance of the cooling material. Coconut carbon powder has high mechanical strength and can capture and release water vapor in the system, while silica fume can absorb water vapor and control its further penetration. Therefore, using silica fume and coconut carbon powder in combination can reduce the adverse effects of water vapor penetrating into the system on aluminum nitride.

[0014] Preferably, it also includes 5-10 parts of polyethylene wax.

[0015] Preferably, the mass ratio of the auxiliary filler to polyethylene wax is (4-4.5):1.

[0016] By adopting the above technical solution, polyethylene wax has an internal lubricating effect in the system, which can promote the uniform dispersion of thermally conductive fillers and auxiliary fillers in the system. During the curing process of the cool-feeling composite material, as the solvent evaporates, polyethylene wax also has the tendency and ability to migrate to the material surface. Therefore, polyethylene wax on the material surface can play a waterproof role. Combined with silica fume powder and coconut carbon powder, the waterproof performance of the material can be effectively improved, so that the thermal conductive path in the system can exist stably.

[0017] Preferably, the curing agent is selected from acid anhydride curing agents, imidazole curing agents, amine curing agents, organic urea curing agents, or modified amine curing agents;

[0018] The accelerator is DMP-30 accelerator, and the solvent is dibutyl phthalate.

[0019] Secondly, this application provides a method for preparing a cooling composite material, which adopts the following technical solution:

[0020] A method for preparing a cooling composite material includes the following steps:

[0021] Weigh each raw material accurately according to the proportions, mix them well, and obtain the adhesive compound;

[0022] The adhesive is coated onto the release film and cured by heating at 110-180℃ to obtain a cool-feeling composite material.

[0023] Preferably, the coating thickness of the adhesive on the release film is 0.1-0.5 mm.

[0024] By adopting the above technical solutions, cooling composite materials of different thicknesses can be manufactured according to actual needs.

[0025] Thirdly, this application provides an application of a cooling composite material, employing the following technical solution:

[0026] An application of a cooling composite material for manufacturing back covers for mobile phones or tablets.

[0027] By adopting the above technical solutions, the back covers of mobile phones and tablets can be made to feel cool, thus improving the user experience.

[0028] In summary, this application has the following beneficial effects:

[0029] 1. This application combines flake boron nitride and spherical aluminum nitride and fills them into epoxy resin to prepare a thermally conductive cooling composite material, which allows the human body to feel a cool sensation when in contact with it.

[0030] 2. This application utilizes silane-polyethylene glycol-carboxyl and epoxidized soybean oil to treat spherical aluminum nitride, enabling the spherical aluminum nitride to be uniformly dispersed in the system, thereby improving the thermal conductivity of the cooling composite material.

[0031] 3. This application utilizes the synergistic effect of polyethylene wax, silica powder, and coconut carbon powder to reduce the influence of moisture on spherical aluminum nitride, thereby enabling the cooling composite material to possess long-lasting and excellent thermal conductivity. Detailed Implementation

[0032] The present application will be further described in detail below with reference to the embodiments.

[0033] In this application, the silane-polyethylene glycol-carboxyl group was purchased from Xi'an Qiyue Biotechnology; the flake boron nitride was model ML-BN-PW40; the spherical boron nitride was model ML-BN-QW50; the spherical aluminum nitride was model YM-ALN-W10; the bisphenol A epoxy resin was model E-44; the polyamide curing agent was polyamide 650 curing agent; the epoxidized soybean oil was purchased from Shandong Zhuoan Chemical; the polyethylene wax was model 1105A; the silica fume was purchased from Lingshou County Qiangdong Mineral Products Processing Plant, with a mesh size of 1250; and the coconut carbon powder had a specification of 5μm.

[0034] Preparation Example 1

[0035] Silane-polyethylene glycol-carboxyl groups were dissolved in water to prepare a 3% (w / w) silane aqueous solution. The pH of the silane aqueous solution was adjusted to 5.5 using hydrochloric acid. Spherical aluminum nitride was added to the silane aqueous solution at a mass ratio of 1:3. The reaction was carried out at 70°C for 3 hours. After filtration, washing, and drying, pretreated spherical aluminum nitride was obtained.

[0036] Epoxidized soybean oil and pretreated spherical aluminum nitride were mixed at a mass ratio of 1:1, and then fluoroboric acid catalyst at a mass ratio of 1:120 to epoxidized soybean oil was added. The mixture was reacted at 100°C for 2 hours. After the reaction was completed, the mixture was filtered and then added to ethyl acetate to remove excess epoxidized soybean oil. The mixture was washed with water several times and then the ethyl acetate was removed using a rotary evaporator to obtain spherical aluminum nitride grafted with epoxidized soybean oil.

[0037] Example 1

[0038] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g silica fume, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler is composed of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2.

[0039] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0040] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0041] Example 2

[0042] A cooling composite material comprises the following components: 10g bisphenol A epoxy resin, 20g thermally conductive filler, 10g silica fume, 3g polyamide curing agent, 10g DMP-30 accelerator, and 15g dibutyl phthalate. The thermally conductive filler is composed of lamellar boron nitride and spherical aluminum nitride in a mass ratio of 1:2.

[0043] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0044] The adhesive is coated onto the release film to a thickness of 0.5 mm, and then placed in an oven to be heated and cured at 180°C to obtain a cool-feeling composite material.

[0045] Example 3

[0046] A cooling composite material comprises the following components: 30g bisphenol A epoxy resin, 60g thermally conductive filler, 40g silica fume, 15g polyamide curing agent, 15g DMP-30 accelerator, and 30g dibutyl phthalate. The thermally conductive filler is composed of lamellar boron nitride and spherical aluminum nitride in a mass ratio of 1:2.

[0047] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0048] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0049] Example 4

[0050] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g silica fume, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler is composed of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:3.

[0051] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0052] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0053] Example 5

[0054] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g silica fume, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, wherein the spherical aluminum nitride is prepared by Preparation Example 1.

[0055] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0056] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0057] Example 6

[0058] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g auxiliary filler, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, and the auxiliary filler consists of silica fume and coconut carbon powder in a mass ratio of 1:1.

[0059] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0060] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0061] Example 7

[0062] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g auxiliary filler, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, and the auxiliary filler consists of silica fume and coconut carbon powder in a mass ratio of 2:1.

[0063] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0064] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0065] Example 8

[0066] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g auxiliary filler, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, and the auxiliary filler consists of silica fume and coconut carbon powder in a mass ratio of 3:1.

[0067] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0068] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0069] Example 9

[0070] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g auxiliary filler, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, and the auxiliary filler consists of silica fume and coconut carbon powder in a mass ratio of 5:1.

[0071] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0072] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0073] Example 10

[0074] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g auxiliary filler, 5g polyethylene wax, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, and the auxiliary filler consists of silica fume and coconut carbon powder in a mass ratio of 1:1.

[0075] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0076] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0077] Example 11

[0078] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g auxiliary filler, 8g polyethylene wax, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, and the auxiliary filler consists of silica fume and coconut carbon powder in a mass ratio of 1:1.

[0079] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0080] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0081] Example 12

[0082] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g auxiliary filler, 10g polyethylene wax, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, and the auxiliary filler consists of silica fume and coconut carbon powder in a mass ratio of 1:1.

[0083] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0084] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0085] Example 13

[0086] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 32g auxiliary filler, 8g polyethylene wax, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, and the auxiliary filler consists of silica fume and coconut carbon powder in a mass ratio of 1:1.

[0087] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0088] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0089] Example 14

[0090] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 34.4g auxiliary filler, 8g polyethylene wax, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, and the auxiliary filler consists of silica fume and coconut carbon powder in a mass ratio of 1:1.

[0091] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0092] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0093] Example 15

[0094] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 36g auxiliary filler, 8g polyethylene wax, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler consists of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:2, and the auxiliary filler consists of silica fume and coconut carbon powder in a mass ratio of 1:1.

[0095] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0096] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0097] Example 16

[0098] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 1.

[0099] Example 17

[0100] An application of a cooling composite material for preparing a tablet computer back cover, the cooling composite material being prepared in Example 1.

[0101] Example 18

[0102] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 2.

[0103] Example 19

[0104] An application of a cooling composite material for preparing a mobile phone back cover; the cooling composite material was prepared in Example 3.

[0105] Example 20

[0106] An application of a cooling composite material for preparing a mobile phone back cover; the cooling composite material was prepared in Example 4.

[0107] Example 21

[0108] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 5.

[0109] Example 22

[0110] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 6.

[0111] Example 23

[0112] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 7.

[0113] Example 24

[0114] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 8.

[0115] Example 25

[0116] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 9.

[0117] Example 26

[0118] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 10.

[0119] Example 27

[0120] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 11.

[0121] Example 28

[0122] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 12.

[0123] Example 29

[0124] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 13.

[0125] Example 30

[0126] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 14.

[0127] Example 31

[0128] An application of a cooling composite material for preparing a mobile phone back cover, the cooling composite material being prepared in Example 15.

[0129] Comparative Example 1

[0130] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g silica fume, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler is composed of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:1.

[0131] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0132] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0133] Comparative Example 2

[0134] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g silica fume, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler is composed of flake boron nitride and spherical aluminum nitride in a mass ratio of 1:10.

[0135] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0136] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0137] Comparative Example 3

[0138] A cooling composite material comprises the following components: 20g bisphenol A epoxy resin, 30g thermally conductive filler, 30g silica fume, 10g polyamide curing agent, 2g DMP-30 accelerator, and 10g dibutyl phthalate. The thermally conductive filler is composed of spherical boron nitride and spherical aluminum nitride in a mass ratio of 1:2.

[0139] During preparation, each raw material is accurately weighed, mixed evenly, and the resulting adhesive is obtained.

[0140] The adhesive is coated onto the release film to a thickness of 0.1 mm, and then placed in an oven to be heated and cured at 110°C to obtain a cool-feeling composite material.

[0141] Performance testing

[0142] The thermal conductivity of the cooling composite materials in Examples 1-15 and each comparative example was determined according to ASTM D5470-2017. Each cooling composite material was then placed in a test chamber at 50°C and 93% relative humidity for 24 hours. After removal, the corresponding thermal conductivity was tested.

[0143] Referring to GB / T 35263-2017 "Test and Evaluation of Instantaneous Cooling Properties of Textiles", the contact cooling coefficients of the cooling composite materials in Examples 1-15 and each comparative example were tested. During the test, the temperature of the sample stage was 20℃, the temperature of the thermal detection plate was set to 35℃, the ambient temperature was 20.5℃, and the relative humidity was 64.1%. Then, each cooling composite material was placed in a test chamber at a temperature of 50℃ and a relative humidity of 93% for 24 hours. After being removed, the corresponding contact cooling coefficients were tested under the same test conditions. The results are shown in Table 1.

[0144] Table 1. Thermal conductivity of the cooling composite material in each embodiment and comparative example.

[0145]

[0146]

[0147] As shown in the table, compared with Comparative Examples 1-3, the cooling composite materials in Examples 1-3 have better thermal conductivity and contact cooling coefficient, indicating that after compounding flake boron nitride and spherical aluminum nitride in an appropriate ratio, an effective thermal conduction path can be formed in the cooling composite material, thereby allowing the human body to feel a cooling sensation.

[0148] Combining Examples 1 and 5, the flake boron nitride is first treated with silane-polyethylene glycol-carboxyl groups and then grafted with epoxidized soybean oil, which can promote the uniform dispersion of spherical aluminum nitride in the system, thereby promoting the formation of thermal conductive pathways. As a result, the cooling composite material in Example 5 has high thermal conductivity and contact cooling coefficient.

[0149] As can be seen from Examples 1 and 6-9, compounding coconut carbon powder and silica fume in an appropriate ratio can protect aluminum nitride in the system, reduce the impact of water vapor penetrating into the material on aluminum nitride, and thus enable aluminum nitride to continuously and stably perform its thermal conductivity.

[0150] In conjunction with Examples 6 and 10-12, adding polyethylene wax to the system can further improve the dispersibility of the thermally conductive filler in the system, thereby improving the thermal conductivity of the cooling composite material. Further, in conjunction with Examples 13-15, it can be seen that compounding polyethylene wax and auxiliary fillers in an appropriate ratio allows the polyethylene wax, silica fume, and coconut carbon powder to have a good synergistic effect, further reducing the adverse effects of moisture and ensuring that the cooling composite material has good thermal conductivity, thus providing a strong cooling sensation when the human body comes into contact with the material.

[0151] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.

Claims

1. A cooling composite material, characterized in that, It comprises the following components by weight: 10-30 parts epoxy resin, 20-60 parts thermally conductive filler, 10-40 parts auxiliary filler, 3-15 parts curing agent, 2-15 parts accelerator, and 10-13 parts solvent; the thermally conductive filler comprises flake boron nitride and spherical aluminum nitride in a mass ratio of 1:(2-3); the auxiliary filler comprises silica fume. The auxiliary filler also includes coconut carbon powder, and the mass ratio of silica fume to coconut carbon powder is (2-3):1; It also includes 5-10 parts of polyethylene wax; The mass ratio of the auxiliary filler to polyethylene wax is (4-4.5):

1.

2. The cooling composite material according to claim 1, characterized in that: The spherical aluminum nitride grafted with epoxidized soybean oil.

3. The cooling composite material according to claim 2, characterized in that: The spherical aluminum nitride is first treated with silane-polyethylene glycol-carboxyl groups, and then grafted with epoxidized soybean oil.

4. The cooling composite material according to claim 1, characterized in that: The curing agent is selected from acid anhydride curing agents, imidazole curing agents, amine curing agents, organic urea curing agents, or modified amine curing agents; the accelerator is DMP-30 accelerator, and the solvent is dibutyl phthalate.

5. A method for preparing a cooling composite material according to any one of claims 1-4, characterized in that: The process includes the following steps: accurately weigh each raw material according to the proportion, mix them evenly to obtain an adhesive; coat the adhesive onto a release film, and heat and cure it at 110-180℃ to obtain a cool-feeling composite material.

6. The method for preparing a cooling composite material according to claim 5, characterized in that: The coating thickness of the adhesive on the release film is 0.1-0.5 mm.

7. The application of the cooling composite material according to any one of claims 1-4, characterized in that: Used to manufacture back covers for mobile phones or tablets.

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