A sliding resistance linear displacement sensor

Abstract

This invention provides a sliding resistance linear displacement sensor, comprising a sensor body, a microcontroller, a power acquisition module, a signal input / output module, and an environmental information acquisition module. Both the power acquisition module and the signal input / output module are electrically connected to a power supply and communication bus. The power acquisition module is also electrically connected to the sensor body and the microcontroller. Both the sensor body and the environmental information acquisition module are electrically connected to the microcontroller. The microcontroller is electrically connected to the signal input / output module. After receiving instructions from a host computer, the microcontroller compensates for the linear displacement signal based on the received environmental information and outputs the compensated linear displacement signal via the signal input / output module and the power supply and communication bus. This invention's linear displacement sensor compensates for the acquired linear displacement, improving the accuracy of the linear displacement. Furthermore, by connecting the sliding resistance linear displacement sensor to external devices only through the power supply and communication bus, wiring can be simplified and equipment costs reduced.

Description

Technical Field

[0001] This invention relates to the field of airborne electronic equipment technology, specifically to a sliding variable resistance linear displacement sensor. Background Technology

[0002] The fly-by-wire flight control system (FSB) is based on commands and feedback from sensors, with electronic signal processing and control equipment at its core. It uses signal transmission cables instead of traditional mechanical linkages to transmit pilot inputs to the control surfaces, simplifying the design, manufacturing, debugging, and control efficiency of the flight control system. Almost all control and motion parameters in the flight control system can be represented by displacement or displacement-related parameters; therefore, displacement is the most important parameter in the FSB, and the reliability of the displacement measurement sensors directly affects the reliability of the entire FSB.

[0003] Currently, displacement measurement can be achieved using differential transformer displacement sensors or sliding rheostat sensors. Differential transformer displacement sensors employ a non-contact physical structure, resulting in no mechanical contact during operation, thus exhibiting noiseless operation, high repeatability, high reliability, and theoretically unlimited lifespan. They also feature high sensitivity, unlimited resolution, and high-frequency response. Sliding rheostat displacement sensors detect changes in displacement signals by altering the position of adjustable contacts. The position signal is obtained by distributing the input signal voltage according to the different positions of the adjustable contacts.

[0004] When a sliding resistance sensor detects displacement, it needs to communicate with a host computer to receive commands and transmit data. It also needs a power supply to ensure its normal operation. The signal lines and power lines make the wiring complex and increase the cost of the equipment.

[0005] Furthermore, neither traditional differential nor sliding resistance displacement sensors possess intelligent sensing capabilities for ambient temperature, humidity, and atmospheric pressure, making them incapable of monitoring and self-compensating in complex airborne environments. Summary of the Invention

[0006] To address the technical problems of complex signal and power line layout and high cost of sliding resistance sensors, as well as their inability to perform monitoring and self-compensation in complex airborne environments, this invention discloses a sliding resistance linear displacement sensor.

[0007] The technical solution to achieve the purpose of the invention is as follows: A sliding variable resistance linear displacement sensor, comprising a sensor body, a microcontroller, an electrical energy acquisition module, a signal input / output module, and an environmental information acquisition module;

[0008] Both the power acquisition module and the signal input / output module are electrically connected to the power supply and communication bus, and the power acquisition module is electrically connected to the sensor body and the microcontroller respectively.

[0009] Both the sensor body and the environmental information acquisition module are electrically connected to the microcontroller. The sensor body outputs the acquired linear displacement signal to the microcontroller, and the environmental information acquisition module outputs the acquired environmental information to the microcontroller.

[0010] The microcontroller is electrically connected to the signal input / output module. The signal input / output module outputs the host computer instructions extracted from the power supply and communication bus to the microcontroller. After receiving the host computer instructions, the microcontroller compensates for the linear displacement signal based on the environmental information and outputs the compensated linear displacement signal through the signal input / output module and the power supply and communication bus.

[0011] Furthermore, the power acquisition module includes a first DC / DC isolation module and a second DC / DC isolation module, both of which are grounded;

[0012] The first DC / DC isolation module is electrically connected to the sensor body, and converts the 28V DC power extracted from the power supply and communication bus into the 15V DC power required by the sensor body.

[0013] The second DC / DC isolation module is electrically connected to the microcontroller and converts the 28V DC power extracted from the power supply and communication bus into the 3.3V DC power required by the microcontroller.

[0014] Furthermore, the signal input / output module includes a transformer and a high-speed carrier module. One end of the transformer is electrically connected to the power supply and communication bus, and the other end is electrically connected to the high-speed carrier module. The high-speed carrier module is electrically connected to the microcontroller.

[0015] Furthermore, a capacitor for blocking low-frequency signals is connected in series between the primary side of the transformer and the power supply communication bus.

[0016] Furthermore, the transformer has a turns ratio of 1:1.

[0017] Furthermore, the microcontroller is an ARM microcontroller.

[0018] Furthermore, the ARM microcontroller includes an ADC module, an IIC communication interface, an SPI communication interface, and a GPIO digital input / output interface.

[0019] Furthermore, the environmental information acquisition module includes a temperature acquisition module, a humidity acquisition module, and an air pressure acquisition module.

[0020] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above-mentioned technical solutions adopted in the embodiments of this specification include at least the following: The sliding resistance linear displacement sensor disclosed in this invention can continuously collect linear displacement and environmental information after power-on and output it to the microcontroller. In the microcontroller, the linear displacement is compensated by the environmental information, and the compensated linear displacement is output to the host computer through the signal input / output module and the power supply and communication bus. By compensating the collected linear displacement, this invention can improve the accuracy of the linear displacement. At the same time, by connecting the sliding resistance linear displacement sensor to external devices only through the power supply and communication bus, wiring can be simplified and equipment costs reduced. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the sliding resistance linear displacement sensor disclosed in this invention.

[0023] Figure 2 This is a schematic diagram of the linear displacement signal of the adjustable contact k within the sensor body disclosed in this invention. Detailed Implementation

[0024] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0025] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features of the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] This invention discloses a sliding resistance linear displacement sensor, see [link to relevant documentation]. Figure 1As shown, it includes a sensor body, a microcontroller, a power acquisition module, a signal input / output module, and an environmental information acquisition module.

[0027] The power acquisition module and the signal input / output module are both electrically connected to the power supply and communication bus, and the power acquisition module is electrically connected to the sensor body and the microcontroller respectively.

[0028] Both the sensor body and the environmental information acquisition module are electrically connected to the microcontroller. The sensor body outputs the acquired linear displacement signal to the microcontroller, and the environmental information acquisition module outputs the acquired environmental information to the microcontroller.

[0029] The microcontroller is electrically connected to the signal input / output module. The signal input / output module outputs the host computer instructions extracted from the power supply and communication bus to the microcontroller. After receiving the host computer instructions, the microcontroller compensates for the linear displacement signal based on the environmental information and outputs the compensated linear displacement signal through the signal input / output module and the power supply and communication bus.

[0030] In practical implementation, the sensor body adopts a sliding resistance type, see [link / reference]. Figure 2 As shown, when displacement occurs, the position of the adjustable contact k inside the sensor body changes accordingly, and it outputs an analog signal that changes linearly with the position, i.e., an output linear displacement signal. The sensor body requires a 15V DC power supply to operate.

[0031] In specific implementation, the power acquisition module includes a first DC / DC isolation module and a second DC / DC isolation module, both of which are grounded. See also... Figure 1 As shown, the first DC / DC isolation module is isolated DC / DC1, and the second DC / DC isolation module is isolated DC / DC2.

[0032] The first DC / DC isolation module is electrically connected to the sensor body, and converts the 28V DC power extracted from the power supply and communication bus into the 15V DC power required by the sensor body.

[0033] The second DC / DC isolation module is electrically connected to the microcontroller and converts the 28V DC power extracted from the power supply and communication bus into the 3.3V DC power required by the microcontroller.

[0034] More specifically, in order to reduce the size and weight of the present invention, both the first DC / DC isolation module and the second DC / DC isolation module can be selected from LTM8046 chips with a size of 15mm×9mm×4.92mm.

[0035] For specific implementation, please refer to Figure 1 As shown, the signal input / output module includes a transformer and a high-speed carrier module. One end of the transformer is electrically connected to the power supply and communication bus, and the other end is electrically connected to the high-speed carrier module. The high-speed carrier module is electrically connected to the microcontroller.

[0036] The process of transmitting host computer commands is as follows: when the host computer outputs host computer commands through the power supply and communication bus, the transformer transmits the coupled high-frequency signal to the high-speed carrier module. The high-speed carrier module demodulates the coupled high-frequency signal and transmits it to the microcontroller.

[0037] The process of transmitting the linear displacement signal is as follows: the microcontroller compensates for the linear displacement output by the sensor based on the environmental information and sends the compensated linear displacement signal to the host computer. The high-speed carrier module modulates the compensated linear displacement signal from the microcontroller with a high-frequency carrier and couples it to the transformer. Then, it outputs the signal to the host computer through the power supply and communication bus.

[0038] In practical implementation, the high-speed carrier module has high-frequency carrier signal modulation and demodulation functions, uses a 3.3V power supply, and has a power consumption of 0.25W. To reduce the size and weight of the invention, the high-speed carrier module has a size of 23mm × 12.5mm × 1mm. Simultaneously, the high-speed carrier module communicates with the microcontroller through a high-speed serial interface. Preferably, the high-speed carrier module communicates with the microcontroller via SPI or IIC bus.

[0039] In practice, the transformer mainly serves an isolation function, and preferably, its turns ratio is 1:1.

[0040] In an optional embodiment, see Figure 1 As shown, a capacitor for blocking low-frequency signals is connected in series between the primary side of the transformer and the power supply and communication bus. The capacitor mainly serves to block low-frequency signals.

[0041] The process of transmitting host computer command signals is as follows: when the host computer outputs host computer commands through the power supply and communication bus, the capacitor transmits the high-frequency signal to the transformer, the transformer transmits the coupled high-frequency signal to the high-speed carrier module, the high-speed carrier module demodulates the coupled high-frequency signal and transmits it to the microcontroller.

[0042] The process of transmitting the linear displacement signal is as follows: the microcontroller compensates for the linear displacement output by the sensor based on the environmental information. When the microcontroller sends the compensated linear displacement signal to the host computer, the high-speed carrier module modulates the compensated linear displacement signal from the microcontroller with a high-frequency carrier and couples it to the transformer. The transformer outputs the signal to the host computer through the power supply and communication bus.

[0043] In an optional embodiment, see Figure 1 As shown, the microcontroller is an ARM microcontroller, which includes an ADC module, an IIC communication interface, an SPI communication interface, and a GPIO digital input / output interface. The ADC module is mainly used to acquire the linear displacement signal collected by the sensor body in real time according to the instructions of the host computer, and to acquire the environmental information collected by the environmental information acquisition module. The IIC communication interface and the SPI communication interface are the interfaces for the ARM microcontroller to communicate with other components. The GPIO digital input / output interface is connected to the signal input / output module to output signals and receive instructions.

[0044] In practice, the ARM microcontroller is powered by 3.3V and features low power consumption and small size.

[0045] In an optional embodiment, see Figure 1 As shown, the environmental information acquisition module is used to collect information such as temperature, humidity, and air pressure in the surrounding environment. Its main function is to perform self-compensation for the sensor body, reducing or eliminating the impact of temperature, humidity, and air pressure drift on the sensor's accuracy. The environmental information acquisition module includes a temperature acquisition module, a humidity acquisition module, and an air pressure acquisition module. More specifically, the temperature acquisition module, humidity acquisition module, and air pressure acquisition module can be integrated into one unit or designed separately. MEMS chips are preferentially selected for the environmental information acquisition module.

[0046] The embodiments of this invention achieve the following technical effects: The sliding resistance linear displacement sensor disclosed in this invention can continuously collect linear displacement and environmental information after power-on and output it to the microcontroller. In the microcontroller, the linear displacement is compensated by the environmental information, and the compensated linear displacement is output to the host computer through the signal input / output module and the power supply and communication bus. By compensating the collected linear displacement, this invention can improve the accuracy of the linear displacement. At the same time, by connecting the sliding resistance linear displacement sensor to external devices only through the power supply and communication bus, wiring can be simplified and equipment costs can be reduced.

[0047] Obviously, those skilled in the art should understand that the modules or steps of the above-described embodiments of the present invention can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. Optionally, they can be implemented using computer-executable program code, thereby storing them in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, the embodiments of the present invention are not limited to any particular hardware and software combination.

[0048] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, various modifications and variations of the embodiments of the present invention are possible. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A sliding resistance linear displacement sensor, characterized in that: It includes the sensor body, microcontroller, power acquisition module, signal input / output module, and environmental information acquisition module; Both the power acquisition module and the signal input / output module are electrically connected to the power supply and communication bus, and the power acquisition module is electrically connected to the sensor body and the microcontroller respectively. Both the sensor body and the environmental information acquisition module are electrically connected to the microcontroller. The sensor body outputs the acquired linear displacement signal to the microcontroller, and the environmental information acquisition module outputs the acquired environmental information to the microcontroller. The microcontroller is electrically connected to the signal input / output module. The signal input / output module outputs the host computer instructions extracted from the power supply and communication bus to the microcontroller. After receiving the host computer instructions, the microcontroller compensates for the linear displacement signal based on the environmental information and outputs the compensated linear displacement signal through the signal input / output module and the power supply and communication bus. The power acquisition module includes a first DC / DC isolation module and a second DC / DC isolation module, both of which are grounded. The first DC / DC isolation module is electrically connected to the sensor body, and converts the 28V DC power extracted from the power supply and communication bus into the 15V DC power required by the sensor body. The second DC / DC isolation module is electrically connected to the microcontroller and converts the 28V DC power extracted from the power supply and communication bus into the 3.3V DC power required by the microcontroller. The signal input / output module includes a transformer and a high-speed carrier module. One end of the transformer is electrically connected to the power supply and communication bus, and the other end is electrically connected to the high-speed carrier module. The high-speed carrier module is electrically connected to the microcontroller.

2. The sliding resistance linear displacement sensor according to claim 1, characterized in that: A capacitor that blocks low-frequency signals is connected in series between the primary side of the transformer and the power supply and communication bus.

3. The sliding resistance linear displacement sensor according to claim 1, characterized in that: The transformer has a turns ratio of 1:

1.

4. The sliding resistance linear displacement sensor according to claim 1, characterized in that: The microcontroller is an ARM microcontroller.

5. The sliding resistance linear displacement sensor according to claim 4, characterized in that: The ARM microcontroller includes an ADC module, an IIC communication interface, an SPI communication interface, and a GPIO digital input / output interface.

6. The sliding resistance linear displacement sensor according to claim 1, characterized in that: The environmental information acquisition module includes a temperature acquisition module, a humidity acquisition module, and an air pressure acquisition module.

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