IGBT module health condition and junction temperature on-line monitoring system
By measuring the gate peak current and the on-state voltage drop near the zero temperature coefficient point, the coupling problem between the bond wire health status and junction temperature monitoring of IGBT modules in the prior art has been solved, achieving high-precision online monitoring and improving the reliability of the system.
CN117890747BActive Publication Date: 2026-07-14XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
- Filing Date
- 2023-12-27
- Publication Date
- 2026-07-14
Smart Images
Figure CN117890747B_ABST
Abstract
The application provides an IGBT module health state and junction temperature online monitoring system, and relates to the technical field of electronic components, which comprises a conduction voltage drop measuring plate, a gate peak current measuring plate, a collector current signal conditioning plate, a thermocouple signal conditioning plate and a main control plate; the gate peak current measuring plate is used for measuring the gate peak current of the IGBT module; the conduction voltage drop measuring plate is used for measuring the conduction voltage drop of the IGBT module; the collector current signal conditioning plate is used for measuring the collector current of the IGBT module, and the thermocouple signal conditioning plate is used for measuring the shell temperature of the IGBT module; and the main control plate is used for obtaining the junction temperature information of the IGBT module and the health state of the bonding wire according to the measurement data. The application realizes the decoupling of the bonding wire failure and the junction temperature, and achieves the purpose of online monitoring the health state of the bonding wire and the junction temperature of the IGBT module in the actual working condition.
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