Substrate processing method and substrate processing apparatus

Abstract

The present invention relates to a substrate processing method and a substrate processing apparatus for suppressing breakage and defects of a laminated substrate manufactured by joining a plurality of substrates, and particularly relates to a technique for applying a filler to a gap formed between edge portions of a plurality of substrates constituting a laminated substrate. In the method, a filler (F) is applied to a gap between an edge portion (E1) of a first substrate (W1) and an edge portion (E2) of a second substrate (W2), the applied filler (F) is cured, an edge portion image of the laminated substrate (Ws) to which the filler (F) is applied is generated by an infrared camera (5), and a filling state of the filler (F) after application to the gap between the edge portion (E1) of the first substrate (W1) and the edge portion (E2) of the second substrate (W2) is determined based on the image.

Description

Technical Field

[0001] This invention relates to a substrate processing method and a substrate processing apparatus for suppressing cracking and defects in a laminated substrate manufactured by bonding multiple substrates, and particularly to a technique for applying a filler to the gaps formed between the edges of the multiple substrates constituting the laminated substrate. Background Technology

[0002] In recent years, to achieve further increases in the density and functionality of semiconductor devices, a three-dimensional mounting technology that stacks multiple substrates to form a three-dimensional assembly is being developed. In this three-dimensional mounting technology, for example, the component side of a first substrate on which integrated circuits and electrical wiring are formed is bonded to the component side of a second substrate on which integrated circuits and electrical wiring are formed. Furthermore, after bonding the first and second substrates, the second substrate is thinned using a grinding or lapping apparatus. In this way, integrated circuits can be stacked in a direction perpendicular to the component sides of the first and second substrates.

[0003] Three-dimensional mounting technology can also bond more than three substrates. For example, it is possible to thin a second substrate bonded to a first substrate, then bond a third substrate to the second substrate, and then thin the third substrate. In this specification, the method of bonding multiple substrates together is referred to as "stacked substrate".

[0004] To prevent cracking or peeling, the edges of the substrate are typically pre-ground into rounded or chamfered shapes. When grinding a second substrate with this shape, a sharp end is formed on the second substrate. This sharp end (hereinafter referred to as the cutting edge) is formed between the back surface of the ground second substrate and its outer peripheral surface. This cutting edge is prone to defects due to physical contact and can cause damage to the laminate itself during transport. Furthermore, insufficient bonding between the first and second substrates can also cause the second substrate to crack during grinding.

[0005] Therefore, to prevent the cutting edge from cracking (splits) and defects (peeling), a filler is applied to the edge of the laminated substrate before grinding the second substrate. The filler is applied in the gap between the edge of the first substrate and the edge of the second substrate. The filler supports the cutting edge formed after grinding the second substrate, preventing cracking and defects in the cutting edge.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 5-304062

[0009] The technical problem that the invention aims to solve

[0010] However, when applying filler to the gap between the edges of the first substrate and the second substrate, poor filling may occur, such as insufficient or excessive filler application. If the laminated substrate is processed in subsequent steps when poor filling occurs, there are concerns that damage to the laminated substrate and adverse effects on the laminated substrate and process performance may occur. Previously, the filling status of the laminated substrate could only be confirmed after the filler application was completed, and the laminated substrate had to be destroyed if necessary. Summary of the Invention

[0011] Therefore, the object of the present invention is to provide a substrate processing method and a substrate processing apparatus capable of simultaneously applying a filler to the gap between the edge of a first substrate and the edge of a second substrate while monitoring the filling state of the filler in the gap.

[0012] (Solutions)

[0013] One approach provides a substrate processing method in which a filler is applied to a laminated substrate formed by bonding a first substrate and a second substrate, the filler is applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate, the applied filler is cured, an image of the edge portion of the laminated substrate coated with the filler is generated by an infrared imaging device, and the filling state of the filler in the gap is determined based on the image.

[0014] One approach is to determine the fill state based on the size of the filler within a pre-defined target area on the image.

[0015] In one approach, the substrate processing method terminates the coating of the filler based on the filling state.

[0016] In one embodiment, the substrate processing method further includes a step of applying the filler based on the filling state.

[0017] One approach is that the substrate processing method further includes the following steps: counting the number of voids occurring in the filler on the image, and determining that an abnormality has occurred when the number of voids reaches an allowable value.

[0018] One approach is to perform the steps of applying the filler, curing the filler, and generating the image while rotating the laminated substrate.

[0019] One approach is to modify the coating conditions of the filler based on the filling state in the substrate processing method.

[0020] One approach is that, during one revolution of the laminated substrate, the substrate processing method generates the image at multiple measurement points on the laminated substrate, and changes the coating conditions of the filler at at least one of the multiple measurement points based on the filling state at the multiple measurement points and the position information of the multiple measurement points.

[0021] One approach is that the substrate processing method further includes the following step: changing the coating conditions of the filler in the next laminated substrate based on the filling state.

[0022] One approach is that the coating conditions include at least one of the following: the total amount of filler applied, the shape of the filler nozzle of the coating apparatus for applying the filler, the distance between the laminated substrate and the filler nozzle, the amount of filler sprayed from the filler nozzle per unit time, and the rotational speed of the laminated substrate.

[0023] One method involves the infrared imaging device irradiating infrared light approximately perpendicularly to the bonding surface of the first substrate and the second substrate of the stacked substrate.

[0024] One approach provides a substrate processing apparatus for applying a filler to a laminated substrate formed by bonding a first substrate and a second substrate, comprising: a filler application module configured to apply the filler to the laminated substrate; and an operation control unit controlling the operation of the filler application module, the filler application module comprising: a substrate holding portion holding the laminated substrate; a coating apparatus for applying the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; a curing apparatus for curing the applied filler; and an infrared imaging apparatus generating an image of the edge portion of the laminated substrate coated with the filler, the operation control unit being configured to determine the filling state of the filler applied to the gap based on the image.

[0025] In one embodiment, the motion control unit is further configured to: based on the filling state, issue an instruction to the filler coating module to end the coating of the filler performed by the coating device.

[0026] In one embodiment, the motion control unit is further configured to: based on the filling state, issue an instruction to the filler coating module to apply additional filler.

[0027] In one embodiment, the filler coating module further includes a rotation mechanism that rotates the substrate holding portion.

[0028] One approach is for the motion control unit to change the coating conditions of the filler based on the filling state.

[0029] Invention Effects

[0030] When using this invention, by monitoring the filling state of the filler while applying the filler to the laminated substrate, the filling of the filler can be stopped at the appropriate time, and the appropriate filling state can be achieved as needed by adding filler or changing the coating conditions. Attached Figure Description

[0031] Figure 1A This is an enlarged cross-sectional view showing the edge of the substrate.

[0032] Figure 1B This is an enlarged cross-sectional view showing the edge of the substrate.

[0033] Figure 2 This is an enlarged cross-sectional view showing a multilayer substrate.

[0034] Figure 3 This is a top view showing one embodiment of the substrate processing apparatus.

[0035] Figure 4 This is a side view showing one embodiment of the substrate processing apparatus.

[0036] Figure 5 This is a schematic diagram illustrating one embodiment of the coating apparatus.

[0037] Figure 6 This is a schematic diagram illustrating the situation where an infrared imaging device generates an image.

[0038] Figure 7 This is an example diagram showing a measurement point set on a multilayer substrate.

[0039] Figure 8A This is an enlarged cross-sectional view of the edge of the laminated substrate in the middle of the filling process.

[0040] Figure 8B It means Figure 8A A diagram showing an image of the edge portion of the stacked substrate.

[0041] Figure 9A This is an enlarged cross-sectional view of the edge of a laminated substrate after the filler has been filled.

[0042] Figure 9B It means Figure 9A An image of the edge of the stacked substrate shown.

[0043] Figure 10 This is a flowchart illustrating one implementation of a substrate processing method.

[0044] Figure 11A This is an enlarged cross-sectional view of the edge of a laminated substrate where voids are created within the filler.

[0045] Figure 11B It means Figure 11A An image of the edge of the stacked substrate shown.

[0046] Figure 12 This is a flowchart illustrating other embodiments of the substrate processing method.

[0047] Figure 13A This is an enlarged cross-sectional view of the edge of a laminated substrate where filler filling is inadequate.

[0048] Figure 13B It means Figure 13A An image of the edge of the stacked substrate shown. Detailed Implementation

[0049] Hereinafter, embodiments of the present invention will be described with reference to the figures.

[0050] Figure 1A and Figure 1B This is an enlarged cross-sectional view showing the edge portion E of the substrate W. More specifically, Figure 1A This is a cross-sectional view of the so-called straight substrate W. Figure 1B This is a cross-sectional view of a so-called rounded-corner substrate W. The edge portion E is the outermost side that is inclined relative to the flat surface (surface and back surface) of the substrate W, and has a rounded or chamfered shape. Figure 1A In the substrate W, the edge portion E is the outermost peripheral surface of the substrate W, which is composed of an upper inclined portion (upper inclined edge) B1, a lower inclined portion (lower inclined edge) B2, and a side portion (vertex) B3. Figure 1B In the substrate W, the edge portion E is the portion with a curved cross-section that forms the outermost peripheral surface of the substrate W. The edge portion E is also called the bevel portion.

[0051] Figure 2 This is an enlarged cross-sectional view of the laminated substrate Ws. The laminated substrate Ws has a structure formed by bonding a first substrate W1 and a second substrate W2 at a bonding surface P. In this embodiment, the first substrate W1 and the second substrate W2 are circular. The laminated substrate Ws of this embodiment has a structure formed by bonding a first substrate W1 and a second substrate W2 at a bonding surface P. Figure 1B The structure shown is formed by bonding a rounded-corner first substrate W1 and a second substrate W2. However, in one embodiment, the stacked substrate Ws can also have a structure composed of... Figure 1AThe diagram shows a structure formed by bonding a straight first substrate W1 and a second substrate W2. In this specification, the edge portion of the laminated substrate Ws refers to the outer edge portion of the laminated substrate Ws, including the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. Edge portions E1 and E2 are also referred to as beveled edges. A gap G is formed between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. This gap G is formed around the entire circumference of the laminated substrate Ws.

[0052] Figure 3 This is a top view showing one embodiment of the substrate processing apparatus 1. Figure 4 This is a side view showing one embodiment of the substrate processing apparatus 1. The substrate processing apparatus 1 is an apparatus for applying a filler F to a laminated substrate Ws formed by bonding a first substrate W1 and a second substrate W2. The substrate processing apparatus 1 includes: a filler coating module 9 configured to apply the filler F to the laminated substrate Ws; and an operation control unit 10 for controlling the operation of the filler coating module 9. The filler coating module 9 includes: a substrate holding unit 2 for holding the laminated substrate Ws; a coating apparatus 3 for applying the filler F; a curing apparatus 4 for curing the applied filler F; and an infrared imaging apparatus 5 for generating an image of the edge portion of the laminated substrate Ws.

[0053] The substrate holding section 2 is a stage that holds the back side of the laminated substrate Ws by vacuum adsorption. The filler coating module 9 further includes: a rotation shaft 7 connected to the center of the substrate holding section 2; and a rotation mechanism 8 for rotating the substrate holding section 2 and the rotation shaft 7. The laminated substrate Ws is mounted on the substrate holding section 2 with its center aligned with the axis of the rotation shaft 7. The rotation mechanism 8 includes a motor (not shown). Figure 3 As shown, the rotating mechanism 8 is configured such that the substrate holding part 2 and the stacked substrate Ws are rotated together in the direction indicated by the arrow, with the central axis Cr of the stacked substrate Ws as the center.

[0054] The coating apparatus 3 is located on the outer side of the stacked substrate Ws in the radial direction on the substrate holding part 2, and is configured to coat the filler F in the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 of the stacked substrate Ws. Figure 5This is a schematic diagram illustrating one embodiment of the coating apparatus 3. The coating apparatus 3 includes: a syringe 21 for dispensing filler F; a piston 22 capable of reciprocating within the syringe 21; and a horizontal movement mechanism (not shown) for bringing the syringe 21 closer to or away from the laminated substrate Ws. The coating apparatus 3 can adjust the distance between the laminated substrate Ws and the filler outlet 21a of the coating apparatus 3 via this horizontal movement mechanism. In one embodiment, the horizontal movement mechanism can also be omitted from the coating apparatus 3. In this case, the distance between the laminated substrate Ws and the filler outlet 21a is predetermined in such a way that the filler F is appropriately injected into the gap G of the laminated substrate Ws.

[0055] The syringe 21 has a hollow structure and is configured to be filled with filler F inside. A piston 22 is disposed within the syringe 21. The syringe 21 has a filler nozzle 21a at its front end for dispensing the filler F. The front end of the syringe 21, including the filler nozzle 21a, can also be configured to be detachable. The shape of the filler nozzle 21a is selected appropriately according to the physical properties (e.g., viscosity) of the coated filler F. The filler nozzle 21a is configured to face the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2.

[0056] The coating apparatus 3 is connected to a gas supply source via a gas supply line 25. When gas (e.g., dry air or nitrogen) is supplied from the gas supply source to the syringe 21, the piston 22 advances within the syringe 21. As the piston 22 advances, the filler F inside the syringe 21 is ejected from the filler nozzle 21a.

[0057] A pressure regulating device 26 and an on / off valve 27 are provided in the gas supply line 25. The on / off valve 27 is an actuator-driven valve such as an electric valve or a solenoid valve. When the on / off valve 27 is opened, gas is supplied from the gas supply source to the coating apparatus 3, and the coating apparatus 3 coats the filler F onto the laminated substrate Ws. When the on / off valve 27 is closed, the gas supply to the coating apparatus 3 is stopped, thereby stopping the coating of the filler F. The pressure regulating device 26 can adjust the amount of filler F ejected from the filler nozzle 21a per unit time by adjusting the gas pressure supplied from the gas supply source to the coating apparatus 3. The operation of the pressure regulating device 26 and the on / off valve 27 is controlled by the operation control unit 10.

[0058] In one embodiment, the coating apparatus 3 may also include a screw feeder to replace the combination of syringe 21 and piston 22.

[0059] like Figure 3 and Figure 4As shown, the curing device 4 is located radially outside the laminated substrate Ws on the substrate holding portion 2. The curing device 4 is positioned downstream of the coating device 3 in the rotational direction of the laminated substrate Ws, and is configured to cure the filler F coated onto the laminated substrate Ws by the coating device 3. The curing of the filler F by the curing device 4 occurs simultaneously with the rotation of the laminated substrate Ws. In this embodiment, the filler F is a thermosetting filler. Examples of such fillers include thermosetting resins.

[0060] The curing apparatus 4 is an air heater configured to blow hot air toward the filler F coated on the laminated substrate Ws. The curing apparatus 4 is configured to adjust the air pressure and temperature of the blown hot air. The filler F, heated by the hot air, cures through a cross-linking reaction. When the filler F contains a solvent, the solvent evaporates due to heating. The curing apparatus 4 is not limited to an air heater; it can also be a lamp heater or other configurations.

[0061] In this embodiment, the filler F is a thermosetting filler; however, in another embodiment, the filler F may also be a UV-curable filler. In this case, the curing apparatus 4 may be a UV irradiation apparatus that cures the filler F by irradiating it with ultraviolet light. When the filler F contains a solvent, it may also be heated using an air heater or the like to evaporate the solvent.

[0062] The infrared imaging device 5 is positioned downstream of the curing device 4 in the rotational direction of the laminated substrate Ws. The infrared imaging device 5 is configured to generate an image containing a filler F, which is a filler applied to the laminated substrate Ws by the coating device 3 and cured by the curing device 4. The distance between the infrared imaging device 5 and the curing device 4 is shorter than the distance between the infrared imaging device 5 and the coating device 3. The infrared imaging device 5 is located above the edge of the laminated substrate Ws and is configured to generate an image of the edge of the laminated substrate Ws. More specifically, the infrared imaging device 5 is configured to irradiate the edge of the laminated substrate Ws with infrared light, receive the infrared light reflected from the edge of the laminated substrate Ws, and generate an image of the edge of the laminated substrate Ws. The infrared imaging device 5 may be, for example, an infrared microscope.

[0063] Figure 6This is a schematic diagram illustrating the image generation process of the infrared imaging device 5. The infrared imaging device 5 irradiates infrared light approximately perpendicularly to the bonding surface P of the first substrate W1 and the second substrate W2 of the multilayer substrate Ws. The infrared imaging device 5 generates an image of the imaging area R containing a filler F, which is a filler applied to the multilayer substrate Ws by the coating device 3 and cured by the curing device 4. Image generation by the infrared imaging device 5 can also be performed while the multilayer substrate Ws is rotated. Infrared light has a wavelength that transmits through silicon. In this embodiment, the first substrate W1 and the second substrate W2 are essentially made of silicon wafers, and the infrared light irradiated by the infrared imaging device 5 passes through the first substrate W1 and the second substrate W2. Because infrared light does not transmit through the filler F, the infrared imaging device 5 can generate an image of the imaging area R containing the filler F from infrared light reflected from the edges of the multilayer substrate Ws.

[0064] The motion control unit 10 is configured to control the operation of the filler coating module 9 as described above. The filler coating module 9, which includes a coating device 3, a curing device 4, an infrared imaging device 5, a rotating mechanism 8, a pressure adjusting device 26, and an on / off valve 27, is electrically connected to the motion control unit 10.

[0065] The motion control unit 10 is composed of at least one computer. The motion control unit 10 includes: a storage device 10a storing a program for controlling the operation of the filler coating module 9; and a processing device 10b executing operations according to the commands contained in the program. The storage device 10a includes: a main storage device such as random access memory (RAM); and an auxiliary storage device such as a hard disk drive (HDD) or a solid-state drive (SSD). The processing device 10b includes, for example, a CPU (central processing unit) or a GPU (graphics processing unit). However, the specific configuration of the motion control unit 10 is not limited to these examples.

[0066] During one revolution of the laminated substrate Ws, the infrared imaging device 5 generates an image of the edge of the laminated substrate Ws at a pre-set measurement point. The number of measurement points can be one or more. Figure 7 This is an example diagram showing measurement points disposed on the laminated substrate Ws. In this embodiment, the number of measurement points is four.

[0067] like Figure 7As shown, four measurement points M1 to M4 are located at equal intervals around the central axis Cr of the laminated substrate Ws at the edge of the laminated substrate Ws. The motion control unit 10 has position information (e.g., angle information) of the start application point of the filler F and the measurement points M1 to M4. The laminated substrate Ws rotates in the direction indicated by the arrow. When the start application point of the filler F coincides with the measurement point M1, the coating device 3 starts coating from the measurement point M1, and then the filler F is continuously coated on the edge of the laminated substrate Ws. The filler F can also be coated during multiple rotations of the laminated substrate Ws according to its total coating amount.

[0068] Similarly, the curing device 4 continuously cures the filler F applied to the edge of the laminated substrate Ws. Furthermore, the infrared imaging device 5 generates images of the edge of the laminated substrate Ws at each measurement point in the order of measurement points M1, M2, M3, and M4. The motion control unit 10 determines the gap G (refer to...) between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 based on the generated images. Figure 5 The motion control unit 10 determines the filling state of the filler F and, at an appropriate time, stops the coating device 3 from coating the filler F.

[0069] Secondly, the method for determining the filling state of filler F is explained. Figure 8A This is an enlarged cross-sectional view of the edge of the laminated substrate Ws filled with filler F. Figure 8B It means Figure 8A An image of the edge of the stacked substrate Ws shown. Figure 8A The edge of the stacked substrate Ws shown corresponds to Figure 6 The shooting area R shown. Figure 8B This represents an image of the imaging area R generated by the infrared imaging device 5 disposed above the edge of the laminated substrate Ws. In this embodiment, the image generated by the infrared imaging device 5 is two-dimensional; however, in one embodiment, the image generated by the infrared imaging device 5 may also be three-dimensional.

[0070] Figure 8A In the diagram, width x1 is the radial width of the portion within the imaging area R where the first substrate W1 and the second substrate W2 are joined. Width x2 is the radial width of the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. Width x3 is the radial width of the filler F applied to the gap G.

[0071] Figure 8B The widths x1 to x3 shown correspond to Figure 8AThe widths x1 to x3 are shown. Since the infrared light emitted from the infrared imaging device 5 passes through the second substrate W2 and the first substrate W1, the region Rn corresponding to the absence of filler F is displayed in the image as a near-white color. Since the infrared light emitted from the infrared imaging device 5 passes through the second substrate W2 and is reflected from the filler F, the region Rf corresponding to the presence of filler F is displayed in the image as a near-black color.

[0072] The motion control unit 10 determines the filling state of the filler F applied to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 based on the image generated by the infrared imaging device 5. More specifically, the motion control unit 10 determines the filling state based on the size of the filler F within a pre-defined target area T on the image. The target area T can be a part or the entirety of the image. In this embodiment, the target area T is as follows: Figure 8B The diagram shows a region with a width of x1 + x2 in the radial direction and a length of y in the direction perpendicular to the radial direction. In one embodiment, the target region T can also be set as a region with a width of x2 in the radial direction and a length of y in the direction perpendicular to the radial direction (denoted by the symbol Tx). The target region T can be arbitrarily set as long as its width in the radial direction completely includes the portion where the filler F is present.

[0073] Figure 8A The laminated substrate Ws shown is filled with a filler F of width x3 in the radial direction. However, when the filler F is coated to a width of x2 in the radial direction, the filling of the filler F is considered complete. That is, the filling state of the filler F in this embodiment is "filling incomplete". The motion control unit 10 determines the filling state as "filling incomplete" when the size of the filler F in the target area T (that is, the area of ​​the area Rf) is smaller than a predetermined threshold. The predetermined threshold in this embodiment is the size of the filler F in the target area T (that is, the area of ​​the area Rf when the width in the radial direction is x2) when the radial direction width is x2.

[0074] Figure 9A This is an enlarged cross-sectional view of the edge of the laminated substrate Ws after the filler F has been filled. Figure 9B It means Figure 9A An image of the edge portion of the laminated substrate Ws shown. Details of this embodiment, unless otherwise specified, are referenced. Figure 8A and Figure 8B The implementation methods described are the same, so repeated descriptions are omitted. Figure 9AIn the diagram, width x1 is the radial width of the portion of the imaging area R where the first substrate W1 and the second substrate W2 are joined. Width x2 is the radial width of the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. Width x3 is the radial width of the filler F applied to the gap G.

[0075] Figure 9B The widths x1 to x3 shown correspond to Figure 9A The widths x1 to x3 are shown. Since the infrared light emitted from the infrared imaging device 5 passes through the second substrate W2 and the first substrate W1, the region Rn corresponding to the absence of filler F is displayed in the image as a near-white color. Since the infrared light emitted from the infrared imaging device 5 passes through the second substrate W2 and is reflected from the filler F, the region Rf corresponding to the presence of filler F is displayed in the image as a near-black color.

[0076] The motion control unit 10 determines the filling state of the filler F applied to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 based on the image generated by the infrared imaging device 5. More specifically, the motion control unit 10 determines the filling state based on the size of the filler F in the target area T on the image.

[0077] Figure 9A The laminated substrate Ws shown is filled with a filler F of width x3 in the radial direction, but the filling is completed when the filler F is applied to a width of x2 in the radial direction. That is, the filling state of the filler F in this embodiment is "filling completed". When the size of the filler F in the target area T (that is, the area of ​​the area Rf) is greater than a predetermined threshold, the motion control unit 10 determines the filling state as "filling completed". The predetermined threshold in this embodiment is the size of the filler F in the target area T (that is, the area of ​​the area Rf when the width in the radial direction is x2) when the radial direction width is x2.

[0078] Based on the determined filling state of the filler F, the motion control unit 10 causes the coating device 3 to stop coating the filler F. More specifically, when the filling state of the filler F is determined to be "filling incomplete", the motion control unit 10 issues a command to the filler coating module 9 to cause the coating device 3 to continue coating the filler F; when the filling state of the filler F is determined to be "filling complete", the motion control unit 10 issues a command to the filler coating module 9 to cause the coating device 3 to stop coating the filler F.

[0079] Figure 10 This is a flowchart illustrating one implementation of a substrate processing method.

[0080] Step S101 is when the motion control unit 10 issues a command to the rotation mechanism 8 of the filler coating module 9, causing the substrate holding unit 2 and the stacked substrate Ws to rotate at a specified speed.

[0081] Step S102 involves the motion control unit 10 issuing a command to the on / off valve 27 of the filler coating module 9, opening the on / off valve 27, and supplying gas from the gas supply source to the coating apparatus 3. Through this action, filler F is injected into the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 of the rotating laminated substrates Ws.

[0082] Step S103 is when the motion control unit 10 issues a command to the curing device 4 of the filler coating module 9 to heat the laminated substrate Ws and cure the coated filler F.

[0083] Step S104 is when the motion control unit 10 issues an instruction to the infrared imaging device 5 of the filler coating module 9 to generate an image of the edge of the laminated substrate Ws at the measurement point on the laminated substrate Ws.

[0084] Step S105 involves the motion control unit 10 comparing the size of the filler F in the target area T on the image generated by the infrared imaging device 5 with a predetermined threshold.

[0085] When the size of the filler F in the target area T is smaller than a predetermined threshold, the motion control unit 10 determines the filling status as "filling incomplete" (step S106-1). When the motion control unit 10 determines the filling status as "filling incomplete", it issues an instruction to the filler coating module 9 to make the coating device 3 continue to coat the filler F, and repeatedly executes steps S102 to S105.

[0086] When the size of the filler F in the target area T exceeds a predetermined threshold, the motion control unit 10 determines the filling state as "filling complete" (step S106-2). When the filling state is determined to be "filling complete," the motion control unit 10 issues a command to the filler coating module 9 to end the coating of the filler F. The motion control unit 10 can also issue a command to the filler coating module 9 to stop coating the filler F when the starting point of the filler F reaches the coating position of the coating device 3.

[0087] In this embodiment, because the distance between the infrared imaging device 5 and the curing device 4 is shorter than the distance between the infrared imaging device 5 and the coating device 3, the determination of the filling state of the filler F is performed immediately after the filler F is cured by the curing device 4. Therefore, the filling state of the filler F can be monitored in real time, and the coating of the filler F can be terminated at the appropriate time. Thus, a suitable filling state of the filler F can be achieved.

[0088] In one embodiment, the motion control unit 10 can also determine the filling state by comparing the size of the filler F in the target area T with a predetermined threshold after stopping the operation of the coating device 3 and the curing device 4 (step S105). At this time, when the filling state is determined to be "filling incomplete" (step S106-1), the motion control unit 10 issues a command to the filler coating module 9 to restart the operation of the coating device 3 and the curing device 4, and performs additional coating of filler F through the coating device 3 (step S102). Steps S103 to S105 are executed repeatedly.

[0089] One embodiment is that the additional coating of filler F can also be performed only on a portion of the edge of the laminated substrate Ws, based on the filling state of filler F at multiple measurement points and the position information of the multiple measurement points. For example, the motion control unit 10 in Figure 7 The filling state of filler F is determined by multiple measurement points M1 to M4. When the filling state is determined to be "filling incomplete" at measurement point M1, and "filling complete" at measurement points M2 to M4, the filler coating module 9 can also perform additional coating of filler F only at measurement point M1.

[0090] Next, other embodiments of the substrate processing method will be described. Figure 11A This is an enlarged cross-sectional view of the edge of the laminated substrate Ws where voids B are formed within the filler F. Void B refers to the voids formed within the filler F coated on the laminated substrate Ws. Figure 11B It means Figure 11A An image of the edge portion of the laminated substrate Ws shown. Details of this embodiment, unless otherwise specified, are referenced. Figure 8A and Figure 8B The described implementation method is the same, so repeated descriptions are omitted. Depending on the coating conditions of filler F, voids B may occur within the coated filler F. Figure 11A In the diagram, width x1 is the radial width of the portion within the imaging area R where the first substrate W1 and the second substrate W2 are joined. Width x2 is the radial width of the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. Width x3 is the radial width of the filler F applied to the gap G.

[0091] Figure 11B The widths x1 to x3 shown correspond to Figure 11AThe widths x1 to x3 are shown. Since the infrared light emitted from the infrared imaging device 5 passes through the second substrate W2 and the first substrate W1, the region Rn corresponding to the absence of filler F is displayed in the image as a near-white color. Since the infrared light emitted from the infrared imaging device 5 passes through the second substrate W2 and is reflected from the filler F, the region Rf corresponding to the presence of filler F is displayed in the image as a near-black color. The voids B occurring in the filler F are displayed in the image as a near-white color.

[0092] Based on the image generated by the infrared imaging device 5, the motion control unit 10 determines the filling state of the filler F applied to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. More specifically, when the motion control unit 10 detects a gap B within the filler F (i.e., region Rf) in the image, it determines the filling state as "gap has occurred". Furthermore, the motion control unit 10 counts the number of gaps B in the image, and when the number of gaps B reaches a preset allowable value, it determines that "an anomaly has occurred".

[0093] Figure 12 This is a flowchart illustrating other embodiments of the substrate processing method. Since steps S201 to S204 of this embodiment are similar to those in the reference embodiment... Figure 10 The steps S101 to S104 of the described implementation are the same, so repeated descriptions are omitted.

[0094] Step S205 is when the motion control unit 10 determines whether a void B has occurred in the filler F based on the image generated by the infrared imaging device 5.

[0095] When a void B occurs in the filler F, the motion control unit 10 determines the filling state as "void occurs" (step S206). When the motion control unit 10 determines that no void B has occurred in the filler F (step S205 "No"), the filler coating module 9 continues to coat the filler F and repeats steps S202 to S205.

[0096] When a void B occurs in the filler F (step S205 "Yes"), the motion control unit 10 counts the number of voids B in the image generated by the infrared imaging device 5 (step S207).

[0097] Step S208 involves the motion control unit 10 determining whether the number of gaps B has reached a predetermined allowable value. If the number of gaps B reaches the allowable value, the motion control unit 10 determines that an "abnormality has occurred" (step S209). When the motion control unit 10 determines that an "abnormality has occurred," it issues a command to the filler coating module 9 to end the coating of filler F.

[0098] When the number of gaps B has not reached the specified allowable value (No in step S208), the motion control unit 10 issues an instruction to the filler coating module 9 to continue coating the filler F and repeatedly executes steps S202 to S205.

[0099] In this embodiment, because the distance between the infrared imaging device 5 and the curing device 4 is shorter than the distance between the infrared imaging device 5 and the coating device 3, the determination of the filling state of the filler F is performed immediately after the filler F is cured by the curing device 4. Therefore, the filling state of the filler F can be monitored in real time, and the occurrence of abnormalities can be detected quickly.

[0100] In one embodiment, the motion control unit 10 can also be based on the target region T (refer to) on the image. Figure 11B The increase rate of the size of filler F within the target area T is used to detect voids B within filler F. The increase rate of the size of filler F is the amount of increase in the size of filler F per unit time within the target area T. When voids B occur within filler F, compared to when no voids B occur, the width x3 of the filler F applied in the radial direction in the gap G (refer to...) Figure 11A , Figure 11B The size of the filler F in the target area T increases. Therefore, in this embodiment, when the rate of increase of the size of the filler F in the target area T (that is, the rate of increase of the area of ​​the area Rf) is greater than a predetermined reference value, the motion control unit 10 determines the filling state as "void has occurred". The predetermined reference value may, for example, be set based on the rate of increase of the size of the filler F when no void B has occurred in the filler F, obtained in advance by experiments, etc.

[0101] The rate of increase in the size of the filler F can be determined from the size of the filler F in the target area T of the image generated by the infrared imaging device 5 each time the laminated substrate Ws rotates. For example, the motion control unit 10 calculates the increase in the size of the filler F based on the size of the filler F in the target area T of the image when the laminated substrate Ws rotates once at the beginning of filler F application and the size of the filler F in the target area T of the image when the laminated substrate Ws rotates once again. The motion control unit 10 calculates the increase in the size of the filler F per unit time, i.e., the rate of increase in the size of the filler F, by dividing the calculated increase in the size of the filler F by the time it takes for the laminated substrate to rotate once.

[0102] Furthermore, the motion control unit 10 can also issue an instruction to the filler coating module 9 to end the coating of filler F when the rate of increase of the size of filler F in the target area T is greater than the above-mentioned reference value.

[0103] When numerous voids occur within the filler F, the volume of the coated filler F increases unexpectedly. Therefore, in one embodiment, the motion control unit 10 may determine the filling state as "voids have occurred" when the size of the filler F in the target region T (i.e., the area of ​​region Rf) is greater than a preset upper limit. Furthermore, the motion control unit 10 may also issue an instruction to the filler coating module 9 to end the coating of the filler F when the size of the filler F in the target region T (i.e., the area of ​​region Rf) is greater than the aforementioned preset upper limit.

[0104] In one embodiment, the motion control unit 10 can also change the coating conditions of the filler F based on the filling state of the filler F. The coating conditions include: the total coating amount of the filler F, the filler nozzle 21a of the coating device 3 (refer to...). Figure 5 The coating conditions may include at least one of the following: the shape of the substrate Ws, the distance between the laminated substrate Ws and the filler nozzle 21a, the amount of filler F ejected from the filler nozzle 21a per unit time, and the rotational speed of the laminated substrate Ws. In one embodiment, the coating conditions may further include the air pressure and temperature of the hot air blown from the curing apparatus 4.

[0105] In one embodiment, the change of coating conditions can also be based on the filling state of the filler F at multiple measurement points and the position information of the multiple measurement points, and is performed only on a portion of the edge of the laminated substrate Ws. The motion control unit 10 in... Figure 7 Among the multiple measurement points M1 to M4 shown, the filling state of filler F is determined. When the motion control unit 10 determines the filling state as "poor filling" at measurement point M1 and "incomplete filling" at measurement points M2 to M4, it only changes the coating conditions of filler F at measurement point M1 based on the position information of measurement points M1 to M4.

[0106] In this embodiment, because the distance between the infrared imaging device 5 and the curing device 4 is shorter than the distance between the infrared imaging device 5 and the coating device 3, the determination of the filling state of the filler F is performed immediately after the filler F is cured by the curing device 4. Therefore, the filling state of the filler F can be monitored in real time, and the coating conditions can be adjusted to achieve the optimal filling state.

[0107] In one embodiment, the coating conditions of the filler F in the next laminate can be reflected based on the filling state of the filler F in the laminated substrate Ws. Therefore, when the next laminated substrate has the same configuration, coating can be performed under appropriate filling conditions without needing to adjust the coating conditions midway.

[0108] Next, another embodiment of the substrate processing method will be described. Figure 13A This is an enlarged cross-sectional view of the edge of the laminated substrate Ws where filler F is poorly filled. Figure 13B It means Figure 13A An image of the edge portion of the laminated substrate Ws shown. Details of this embodiment, unless otherwise specified, are referenced. Figure 8A and Figure 8B The implementation methods described are the same, so repeated descriptions are omitted. Figure 13A In the diagram, width x1 is the radial width of the portion within the imaging area R where the first substrate W1 and the second substrate W2 are joined. Width x2 is the radial width of the portion of the substrate W2 that is not coated with filler F, which is radially inner from the filler F. Width x3 is the radial width of the filler F coated in the gap G. Width x4 is the radial width of the portion of the substrate W2 that is not coated with filler F, which is radially outer from the filler F; that is, it is the width from the outermost end of the filler F in the radial direction to the outermost end of the stacked substrate Ws in the radial direction.

[0109] Figure 13B The widths x1 to x4 shown correspond to Figure 13A The widths x1 to x4 are shown. Since the infrared light emitted from the infrared imaging device 5 passes through the second substrate W2 and the first substrate W1, the area Rn where the filler F is absent is displayed in the image as a near-white color. Since the infrared light emitted from the infrared imaging device 5 passes through the second substrate W2 and is reflected from the filler F, the area Rf where the filler F is present is displayed in the image as a near-black color.

[0110] The motion control unit 10 determines the filling state of the filler F applied to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 based on the image generated by the infrared imaging device 5. More specifically, the motion control unit 10 determines the filling state based on the position of the filler F in the image.

[0111] Figure 13A The laminated substrate Ws shown exhibits poor filling of filler F, with a portion of width x2 in the radial direction where filler F is not applied. At this time, as... Figure 13B As shown, the end position Lf of region Rf in the radial direction, relative to the end position L0 of the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2, is located in the radial direction outside. When the end position Lf of filler F in the radial direction (i.e., the end position Lf of region Rf in the radial direction) is located in the radial direction outside the end position L0 of gap G in the radial direction, the operation control unit 10 determines the filling state as "poor filling". When the filling state of filler F is determined to be "poor filling", the operation control unit 10 stops applying filler F through the coating apparatus 3.

[0112] In this embodiment, because the distance between the infrared imaging device 5 and the curing device 4 is shorter than the distance between the infrared imaging device 5 and the coating device 3, the determination of the filling state of the filler F is performed immediately after the filler F is cured by the curing device 4. Therefore, the filling state of the filler F can be monitored in real time, and poor filling can be quickly detected.

[0113] The above embodiments are described with the aim of enabling those skilled in the art to practice the present invention. Those skilled in the art will naturally be able to make various variations of the above embodiments, and the technical concept of the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is interpreted within the broadest scope of the technical concept defined by the claims.

[0114] Industrial availability

[0115] The present invention relates to a substrate processing method and a substrate processing apparatus for suppressing cracking and defects in a multi-substrate laminate manufactured by bonding multiple substrates, and particularly to a technique for applying a filler to the gaps formed between the edges of the multiple substrates constituting the multi-substrate laminate.

[0116] Symbol Explanation

[0117] 1: Substrate processing device

[0118] 2: Substrate holding section

[0119] 3: Coating device

[0120] 4: Curing device

[0121] 5: Infrared imaging device

[0122] 7: Rotation axis

[0123] 8: Rotating mechanism

[0124] 9: Filler Coating Module

[0125] 10: Motion Control Department

[0126] 10a: Storage device

[0127] 10b: Processing device

[0128] 21: Syringe

[0129] 21a: Filler spray nozzle

[0130] 22: Piston

[0131] 25: Gas supply pipeline

[0132] 26: Pressure regulating device

[0133] 27: On / off valve.

Claims

1. A substrate processing method, comprising applying a filler to a laminated substrate formed by bonding a first substrate and a second substrate, characterized in that, include: The filler is applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate using a coating device; The applied filler is cured using a curing device; An image of the edge of the laminated substrate after the filler has been coated and cured is generated using an infrared imaging device; as well as The filling state of the filler, after being applied to and cured within the gaps, is determined based on the image. The distance between the infrared imaging device and the curing device is shorter than the distance between the infrared imaging device and the coating device.

2. The substrate processing method as described in claim 1, characterized in that, The process of determining the filling state is based on the size of the filler within a pre-defined target area on the image.

3. The substrate processing method as described in claim 1 or 2, characterized in that, The application of the filler is completed based on the filling state.

4. The substrate processing method as described in claim 1 or 2, characterized in that, The process further includes the step of applying the filler in addition to the filling state.

5. The substrate processing method as described in claim 1 or 2, characterized in that, The process further includes the following steps: counting the number of voids in the image that occur within the filler, and determining that an abnormality has occurred when the number of voids reaches an allowable value.

6. The substrate processing method as described in claim 1 or 2, characterized in that, The process of applying the filler, the process of curing the filler, and the process of generating the image are performed while the laminated substrate is rotated.

7. The substrate processing method as described in claim 6, characterized in that, The curing device is positioned downstream of the coating device in the rotational direction of the laminated substrate. The infrared imaging device is positioned downstream of the curing device in the rotational direction of the laminated substrate.

8. The substrate processing method as described in claim 6, characterized in that, The coating conditions of the filler are changed based on the filling state.

9. The substrate processing method as described in claim 8, characterized in that, During one rotation of the laminated substrate, the image is generated at multiple measurement points on the laminated substrate. Based on the filling status and location information of the plurality of measurement points, the coating conditions of the filler at at least one of the plurality of measurement points are changed.

10. The substrate processing method as described in claim 1, characterized in that, The process further includes the following steps: based on the filling state, changing the coating conditions of the filler on the next laminated substrate.

11. The substrate processing method according to any one of claims 8-10, characterized in that, The coating conditions include at least one of the following: the total amount of filler applied, the shape of the filler nozzle of the coating apparatus, the distance between the laminated substrate and the filler nozzle, the amount of filler sprayed from the filler nozzle per unit time, and the rotational speed of the laminated substrate.

12. The substrate processing method as described in claim 1 or 2, characterized in that, The infrared imaging device irradiates infrared light perpendicularly onto the bonding surface of the first substrate and the second substrate of the stacked substrate.

13. A substrate processing apparatus for applying a filler to a laminated substrate formed by bonding a first substrate and a second substrate, characterized in that, have: A filler coating module configured to coat the filler onto the laminated substrate; and The motion control unit controls the operation of the filler coating module. The filler coating module includes: A substrate holding portion that holds the stacked substrate; A coating apparatus for applying the filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate; A curing apparatus for curing the coated filler; as well as An infrared imaging device that generates an image of the edge of the laminated substrate after the filler has been coated and cured. The motion control unit is configured to determine the filling state of the filler applied to and cured in the gap based on the image. The distance between the infrared imaging device and the curing device is shorter than the distance between the infrared imaging device and the coating device.

14. The substrate processing apparatus as claimed in claim 13, characterized in that, The motion control unit is further configured to: based on the filling state, issue a command to the filler coating module to end the coating of the filler performed by the coating device.

15. The substrate processing apparatus as claimed in claim 13, characterized in that, The motion control unit is further configured to: based on the filling state, issue an instruction to the filler coating module to apply additional filler.

16. The substrate processing apparatus according to any one of claims 13 to 15, characterized in that, The filler coating module further includes a rotation mechanism that rotates the substrate holding portion.

17. The substrate processing apparatus as claimed in claim 16, characterized in that, The curing device is positioned downstream of the coating device in the rotational direction of the laminated substrate. The infrared imaging device is positioned downstream of the curing device in the rotational direction of the laminated substrate.

18. The substrate processing apparatus as claimed in claim 13, characterized in that, The motion control unit changes the coating conditions of the filler based on the filling state.

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