A tungsten powder treatment method for preparing tungsten-copper alloy by tungsten-copper infiltration

CN117900495BActive Publication Date: 2026-06-26ANQING RUIMAITE TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ANQING RUIMAITE TECH CO LTD
Filing Date
2024-01-23
Publication Date
2026-06-26

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Abstract

The application discloses a tungsten powder treatment method for preparing a tungsten-copper alloy by a tungsten-copper infiltration method, and specifically comprises the following steps: S1, tungsten powder with a particle size of 3-4 mu m is subjected to primary screening; S2, 2% of a binder is added into the tungsten powder, and then heating and stirring are carried out in a water bath environment with a temperature of 50-80 DEG C to obtain tungsten powder mixed with the binder; S3, the tungsten powder mixed with the binder is uniformly spread and then is placed into a drying machine for drying; S4, the dried tungsten powder is subjected to secondary screening to obtain spherical tungsten powder with a particle size of 30-35 mu m; S5, the spherical tungsten powder is cooled to room temperature; and S6, misty anhydrous ethanol is sprayed on the surface layer of the spherical tungsten powder cooled to room temperature, and then the spherical tungsten powder is uniformly stirred and then is pressed. In the preparation of the tungsten-copper alloy by the tungsten-copper infiltration method, the tungsten powder is pretreated before being pressed into a tungsten skeleton, so that the tungsten powder is prevented from being cracked when being pressed into the tungsten skeleton, and cracks generated during subsequent high-temperature sintering are reduced, and therefore the product quality is improved.
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Description

Technical Field

[0001] This invention relates to the field of tungsten-copper alloy preparation technology, specifically a tungsten powder treatment method for preparing tungsten-copper alloys using the tungsten-copper melting infiltration method. Background Technology

[0002] Tungsten-copper alloys possess advantages such as a low coefficient of volume expansion, good wear and corrosion resistance, good electrical and thermal conductivity, and high-temperature resistance, making them widely used in applications including tungsten-copper electrodes, tungsten-copper electronic packaging chips, tungsten-copper tubes, and high-temperature materials for military applications. Common methods for preparing tungsten-copper alloys include liquid-phase sintering and tungsten-copper melt infiltration. Compared to liquid-phase sintering, materials prepared by melt infiltration have higher density, better sintering performance, and ideal thermal and electrical conductivity. Furthermore, due to the high-temperature sintering process, tungsten reduction is thorough, and low-melting-point impurities and difficult-to-reduc low-valence oxides can be removed through volatilization and thermal decomposition.

[0003] The tungsten-copper melting and infiltration method refers to the process of adding a certain proportion of binder to tungsten powder, pressing it into a blank, and then pre-firing it at a certain temperature to prepare a porous tungsten matrix skeleton with a certain density and strength. Then, copper with a lower melting point is melted and gradually filled into the tungsten skeleton by capillary force, thus obtaining a denser tungsten-copper material.

[0004] The existing tungsten-copper infiltration method for preparing tungsten-copper alloys is as follows:

[0005] First, a certain proportion of binder is added to tungsten powder, mixed evenly, and then pressed into shape. The binder is removed under a temperature of 400℃-800℃ (low vacuum environment). Then, it is pre-sintered at a temperature of about 1000℃ for about 2 hours. Then, it is sintered at a high temperature of 1800℃-2000℃ (hydrogen). Finally, it is infiltrated with copper under a temperature of 1300℃-1400℃ (hydrogen or vacuum environment).

[0006] In the preparation of tungsten-copper alloys, pressing is the first step, and the presence of cracks in the pressed tungsten framework is crucial. If cracks exist in the tungsten framework, they will persist with the product and may continue to propagate during subsequent pre-firing and high-temperature sintering. Furthermore, because tungsten is a brittle metal with high hardness but very poor toughness, cracks or fractures often occur during pressing. Therefore, the state and quality of the tungsten powder during pressing are particularly critical.

[0007] The tungsten-copper alloys prepared using the above process often have numerous microcracks on their surface and inside. The presence of these microcracks causes crack propagation and extension under stress, reducing both the material's strength and toughness. This significantly impacts the material's utilization rate and performance. Furthermore, the process is complex and has a long production cycle; the presence of cracks renders the product unusable, resulting in substantial losses in production costs. Summary of the Invention

[0008] The purpose of this invention is to overcome the defects and shortcomings of the existing technology and provide a tungsten powder treatment method for preparing tungsten-copper alloys using the tungsten-copper melting and infiltration method, so as to avoid cracking of tungsten powder when it is pressed into a tungsten skeleton and reduce the generation of cracks during subsequent high-temperature sintering, thereby improving product quality.

[0009] To achieve the above objectives, the present invention provides the following technical solution:

[0010] A method for treating tungsten powder to prepare tungsten-copper alloys using the tungsten-copper melting infiltration method, characterized by the following steps:

[0011] S1. Select tungsten powder with a particle size of 3-4μm and sieve it to remove large particulate impurities from the tungsten powder;

[0012] S2. Pour the tungsten powder obtained by sieving in step S1 into a mixer, add 2% by mass of binder, and heat and stir the tungsten powder and binder in a water bath environment of 50-80℃ to obtain tungsten powder mixed with binder.

[0013] S3. Spread the tungsten powder mixed with binder evenly, and then put it into a dryer for drying;

[0014] S4. The dried tungsten powder is sieved again to obtain spherical tungsten powder with a particle size of 30-35μm;

[0015] S5. Place the spherical tungsten powder obtained by sieving in step S4 in a clean environment to cool down to room temperature;

[0016] S6. Spray a small amount of mist-like anhydrous ethanol onto the surface of the spherical tungsten powder after it has cooled to room temperature, and then stir it evenly before pressing the spherical tungsten powder.

[0017] Furthermore, in step S1, the tungsten powder is sieved using a 1000-mesh sieve.

[0018] Furthermore, in step S2, the components of the adhesive and the mass percentage of each component are as follows: paraffin 10-12%, oleic acid 9-10%, polyvinyl alcohol 10-15%, sodium butadiene rubber 5-10%, liquid bisphenol epoxy resin 35-40%, and diethylaminopropylamine 20-25%.

[0019] Furthermore, in step S2, the stirring time is 90-100 minutes.

[0020] Furthermore, in step S3, the drying temperature is 100-120℃ and the drying time is 60-90 minutes.

[0021] Furthermore, in step S4, the dried tungsten powder is sieved using a 400-mesh sieve.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] This invention utilizes the tungsten-copper melting and infiltration method to prepare tungsten-copper alloys. Specifically, before pressing tungsten powder into a skeletonless form, the tungsten powder is pretreated. This process not only prevents cracking of the tungsten powder when it is pressed into a tungsten skeleton, but also reduces the occurrence of cracks during subsequent high-temperature sintering, thereby improving product quality. Attached Figure Description

[0024] Figure 1 This is a flowchart of the method of the present invention.

[0025] Figure 2 Metallographic images of tungsten-copper alloys prepared without using the tungsten powder treatment method of the present invention.

[0026] Figure 3 Metallographic image of tungsten-copper alloy prepared by the tungsten powder treatment method of the present invention. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Example 1

[0029] See Figure 1 A method for treating tungsten powder to prepare tungsten-copper alloys using the tungsten-copper melting infiltration method specifically includes the following steps:

[0030] Step 1: Select tungsten powder with a particle size of 3μm and sieve it using a 1000-mesh sieve to remove large particle impurities from the tungsten powder.

[0031] It should be noted that since the particle size of the powder has a great influence on the performance of the product, micron-sized tungsten powder is selected in this embodiment. The larger the particle size, the more difficult the molding will be, and it is easy to have loose, porous, and rough surface phenomena. On the other hand, the smaller the particle size, the larger its surface area, the faster the sintering speed, which is conducive to the bonding between particles and increases the density of the sintered body. From an economic cost perspective, 3μm tungsten powder is more suitable.

[0032] Even after sieving, the tungsten powder still has a particle size of 3μm. The purpose of sieving is simply to ensure the uniformity and purity of the particle size, removing large particles of tungsten powder and other impurities. If the particle size uniformity of the tungsten powder is poor, larger pores will be generated during the sintering process.

[0033] In addition, since tungsten powder often contains large particulate impurities (large dust particles, large tungsten powder particles, etc.), these large particulate impurities can cause cracks in the tungsten skeleton during the pressing of the tungsten powder; and during subsequent high-temperature sintering, they will generate pores, which will affect the density of the product and increase the risk of cracking.

[0034] The tungsten powder after step one screening does not contain large particles of impurities. Therefore, neither the pressing of the tungsten powder nor the subsequent high-temperature sintering will cause cracking or generate fissures.

[0035] In addition, since the size of powder particles should be smaller than 1 / 3 to 1 / 2 of the sieve aperture, and the aperture of a 1000-mesh sieve is 15μm, it is sufficient to meet the need for screening tungsten powder with a size of 3μm. If the aperture is too small, the tungsten powder will be difficult to pass through the sieve, which is time-consuming and laborious.

[0036] Step 2: Pour the tungsten powder obtained from step 1 into a mixer, then add 2% by mass of binder (correspondingly, the tungsten powder is 98% by mass). Heat and stir the tungsten powder and binder in an 80°C water bath for 90 minutes to prevent the binder from solidifying and to make the binder and tungsten powder mix more evenly, thus obtaining tungsten powder mixed with binder.

[0037] Specifically, the components of the adhesive and the mass percentage of each component are as follows: paraffin 11%, oleic acid 9%, polyvinyl alcohol 10%, sodium butadiene rubber 10%, liquid bisphenol epoxy resin 40%, and diethylaminopropylamine 20%.

[0038] After thoroughly mixing the above components according to the above mass percentages, it is necessary to add 10 times the volume of water for dilution.

[0039] It should be noted that pure tungsten has poor toughness and is prone to cracking during the pressing process. Therefore, increasing the mass percentage of the binder to 2% ensures that the tungsten powder and binder are mixed thoroughly and evenly, thus avoiding localized cracking during the pressing of the tungsten powder.

[0040] Step 3: Spread the tungsten powder mixed with binder evenly, and then put it into a dryer for drying.

[0041] Specifically, the drying temperature is 120℃ and the drying time is 60 minutes.

[0042] Step 4: The dried tungsten powder is sieved again using a 400-mesh sieve to obtain spherical tungsten powder with a particle size of 30μm.

[0043] It should be noted that, because the powder used for pressing must have uniform particle size, and dried tungsten powder often clumps together, pressing directly without sieving would significantly reduce the molding effect and make it difficult to form. Therefore, sieving the dried tungsten powder again prevents it from clumping. After sieving, the tungsten powder mixed with binder that falls from the sieve aggregates from 3μm particles into 30μm spherical shapes.

[0044] In addition, since most of the dried tungsten powder is in block form, if a sieve with a small aperture is selected, the tungsten powder cannot pass through. However, if the sieve aperture is too large, the tungsten powder particles screened out will also be too large, which will make it difficult to press and form. Therefore, a 400-mesh sieve with an aperture of 38μm is selected. Most of the tungsten powder passing through this sieve is spherical powder of 25-35μm, which can meet the requirements for pressing.

[0045] Step 5: Place the spherical tungsten powder obtained from step 4 in a clean environment to cool down, so that the temperature of the spherical tungsten powder drops to room temperature, eliminating the influence of internal thermal stress in the tungsten powder during subsequent pressing.

[0046] It should be noted that because the temperature of the dried tungsten powder is relatively high, after the tungsten powder is pressed into a tungsten skeleton, the interior of the tungsten skeleton often still has a high temperature. During the subsequent natural cooling process, cracks will be generated due to cooling and shrinkage.

[0047] Therefore, placing tungsten powder in a clean environment to cool it down allows the temperature of the tungsten powder to drop to room temperature in advance, eliminating the influence of internal thermal stress in the tungsten powder during subsequent pressing, thereby preventing cracks from forming in the tungsten skeleton due to cooling and shrinkage.

[0048] Step 6: Spray a small amount of mist-like anhydrous ethanol onto the surface of the spherical tungsten powder after it has cooled to room temperature, and then stir it evenly before pressing the spherical tungsten powder.

[0049] It should be noted that because the surface of tungsten powder is in contact with air, its surface moisture evaporates quickly, and its humidity decreases. During pressing, cracks often occur because the surface is too dry.

[0050] Therefore, spraying a small amount of mist-like anhydrous ethanol onto the surface of spherical tungsten powder after it has cooled to room temperature, and then stirring it evenly, can make the tungsten powder dry and wet evenly, thereby avoiding cracking due to excessive dryness of the surface.

[0051] Furthermore, anhydrous ethanol is chosen for several reasons: firstly, its volatile nature prevents internal residue buildup; secondly, its adhesive properties reduce the likelihood of cracking in the pressed tungsten skeleton; and thirdly, it facilitates demolding during pressing, preventing peeling. Atomized anhydrous ethanol is selected for two reasons: uniform spraying and controllable spray volume.

[0052] Example 2

[0053] See Figure 1 A method for treating tungsten powder to prepare tungsten-copper alloys using the tungsten-copper melting infiltration method specifically includes the following steps:

[0054] Step 1: Select tungsten powder with a particle size of 3μm and sieve it using a 1000-mesh sieve to remove large particle impurities from the tungsten powder.

[0055] It should be noted that since the particle size of the powder has a great influence on the performance of the product, micron-sized tungsten powder is selected in this embodiment. The larger the particle size, the more difficult the molding will be, and it is easy to have loose, porous, and rough surface phenomena. On the other hand, the smaller the particle size, the larger its surface area, the faster the sintering speed, which is conducive to the bonding between particles and increases the density of the sintered body. From an economic cost perspective, 3μm tungsten powder is more suitable.

[0056] Even after sieving, the tungsten powder still has a particle size of 3μm. The purpose of sieving is simply to ensure the uniformity and purity of the particle size, removing large particles of tungsten powder and other impurities. If the particle size uniformity of the tungsten powder is poor, larger pores will be generated during the sintering process.

[0057] In addition, since tungsten powder often contains large particulate impurities (large dust particles, large tungsten powder particles, etc.), these large particulate impurities can cause cracks in the tungsten skeleton during the pressing of the tungsten powder; and during subsequent high-temperature sintering, they will generate pores, which will affect the density of the product and increase the risk of cracking.

[0058] The tungsten powder after step one screening does not contain large particles of impurities. Therefore, neither the pressing of the tungsten powder nor the subsequent high-temperature sintering will cause cracking or generate fissures.

[0059] In addition, since the size of powder particles should be smaller than 1 / 3 to 1 / 2 of the sieve aperture, and the aperture of a 1000-mesh sieve is 15μm, it is sufficient to meet the need for screening tungsten powder with a size of 3μm. If the aperture is too small, the tungsten powder will be difficult to pass through the sieve, which is time-consuming and laborious.

[0060] Step 2: Pour the tungsten powder obtained from step 1 into a mixer, then add 2% by mass of binder (correspondingly, the tungsten powder is 98% by mass). Heat and stir the tungsten powder and binder in a 50°C water bath for 100 minutes to prevent the binder from solidifying and to make the binder and tungsten powder mix more evenly, thus obtaining tungsten powder mixed with binder.

[0061] Specifically, the components of the adhesive and the mass percentage of each component are as follows: paraffin 10%, oleic acid 10%, polyvinyl alcohol 15%, sodium butadiene rubber 5%, liquid bisphenol epoxy resin 35%, and diethylaminopropylamine 25%.

[0062] After thoroughly mixing the above components according to the above mass percentages, it is necessary to add 10 times the volume of water for dilution.

[0063] It should be noted that pure tungsten has poor toughness and is prone to cracking during the pressing process. Therefore, increasing the mass percentage of the binder to 2% ensures that the tungsten powder and binder are mixed thoroughly and evenly, thus avoiding localized cracking during the pressing of the tungsten powder.

[0064] Step 3: Spread the tungsten powder mixed with binder evenly, and then put it into a dryer for drying.

[0065] Specifically, the drying temperature is 100℃ and the drying time is 90 minutes.

[0066] Step 4: The dried tungsten powder is sieved again using a 400-mesh sieve to obtain spherical tungsten powder with a particle size of 32μm.

[0067] It should be noted that, because the powder used for pressing must have uniform particle size, and dried tungsten powder often clumps together, pressing directly without sieving would significantly reduce the molding effect and make it difficult to form. Therefore, sieving the dried tungsten powder again prevents it from clumping. After sieving, the tungsten powder mixed with binder that falls from the sieve aggregates from 3μm particles into 32μm spherical shapes.

[0068] In addition, since most of the dried tungsten powder is in block form, if a sieve with a small aperture is selected, the tungsten powder cannot pass through. However, if the sieve aperture is too large, the tungsten powder particles screened out will also be too large, which will make it difficult to press and form. Therefore, a 400-mesh sieve with an aperture of 38μm is selected. Most of the tungsten powder passing through this sieve is spherical powder of 25-35μm, which can meet the requirements for pressing.

[0069] Step 5: Place the spherical tungsten powder obtained from step 4 in a clean environment to cool down, so that the temperature of the spherical tungsten powder drops to room temperature, eliminating the influence of internal thermal stress in the tungsten powder during subsequent pressing.

[0070] It should be noted that because the temperature of the dried tungsten powder is relatively high, after the tungsten powder is pressed into a tungsten skeleton, the interior of the tungsten skeleton often still has a high temperature. During the subsequent natural cooling process, cracks will be generated due to cooling and shrinkage.

[0071] Therefore, placing tungsten powder in a clean environment to cool it down allows the temperature of the tungsten powder to drop to room temperature in advance, eliminating the influence of internal thermal stress in the tungsten powder during subsequent pressing, thereby preventing cracks from forming in the tungsten skeleton due to cooling and shrinkage.

[0072] Step 6: Spray a small amount of mist-like anhydrous ethanol onto the surface of the spherical tungsten powder after it has cooled to room temperature, and then stir it evenly before pressing the spherical tungsten powder.

[0073] It should be noted that because the surface of tungsten powder is in contact with air, its surface moisture evaporates quickly, and its humidity decreases. During pressing, cracks often occur because the surface is too dry.

[0074] Therefore, spraying a small amount of mist-like anhydrous ethanol onto the surface of spherical tungsten powder after it has cooled to room temperature, and then stirring it evenly, can make the tungsten powder dry and wet evenly, thereby avoiding cracking due to excessive dryness of the surface.

[0075] Furthermore, anhydrous ethanol is chosen for several reasons: firstly, its volatile nature prevents internal residue buildup; secondly, its adhesive properties reduce the likelihood of cracking in the pressed tungsten skeleton; and thirdly, it facilitates demolding during pressing, preventing peeling. Atomized anhydrous ethanol is selected for two reasons: uniform spraying and controllable spray volume.

[0076] Example 3

[0077] See Figure 1 A method for treating tungsten powder to prepare tungsten-copper alloys using the tungsten-copper melting infiltration method specifically includes the following steps:

[0078] Step 1: Select tungsten powder with a particle size of 4μm and sieve it using a 1000-mesh sieve to remove large particle impurities from the tungsten powder.

[0079] It should be noted that since the particle size of the powder has a great influence on the performance of the product, micron-sized tungsten powder is selected in this embodiment. The larger the particle size, the more difficult the molding will be, and it is easy to have loose, porous, and rough surface phenomena. On the other hand, the smaller the particle size, the larger its surface area, the faster the sintering speed, which is conducive to the bonding between particles and increases the density of the sintered body. From an economic cost perspective, 4μm tungsten powder is more suitable.

[0080] The sieving process leaves the tungsten powder with a particle size of 4μm. The purpose of sieving is simply to ensure the uniformity and purity of the particle size, removing large particles of tungsten powder and other impurities. If the particle size uniformity of the tungsten powder is poor, larger pores will be generated during the sintering process.

[0081] In addition, since tungsten powder often contains large particulate impurities (large dust particles, large tungsten powder particles, etc.), these large particulate impurities can cause cracks in the tungsten skeleton during the pressing of the tungsten powder; and during subsequent high-temperature sintering, they will generate pores, which will affect the density of the product and increase the risk of cracking.

[0082] The tungsten powder after step one screening does not contain large particles of impurities. Therefore, neither the pressing of the tungsten powder nor the subsequent high-temperature sintering will cause cracking or generate fissures.

[0083] In addition, since the size of powder particles should be smaller than 1 / 3 to 1 / 2 of the sieve aperture, and the aperture of a 1000-mesh sieve is 15μm, it is sufficient to meet the need for screening tungsten powder with a size of 4μm. If the aperture is too small, the tungsten powder will be difficult to pass through the sieve, which is time-consuming and laborious.

[0084] Step 2: Pour the tungsten powder obtained from step 1 into a mixer, then add 2% by mass of binder (correspondingly, the tungsten powder is 98% by mass). Heat and stir the tungsten powder and binder in a 60°C water bath for 100 minutes to prevent the binder from solidifying and to make the binder and tungsten powder mix more evenly, thus obtaining tungsten powder mixed with binder.

[0085] Specifically, the components of the adhesive and the mass percentage of each component are as follows: paraffin 10%, oleic acid 10%, polyvinyl alcohol 14%, sodium butadiene rubber 6%, liquid bisphenol epoxy resin 38%, and diethylaminopropylamine 22%.

[0086] After thoroughly mixing the above components according to the above mass percentages, it is necessary to add 10 times the volume of water for dilution.

[0087] It should be noted that pure tungsten has poor toughness and is prone to cracking during the pressing process. Therefore, increasing the mass percentage of the binder to 2% ensures that the tungsten powder and binder are mixed thoroughly and evenly, thus avoiding localized cracking during the pressing of the tungsten powder.

[0088] Step 3: Spread the tungsten powder mixed with binder evenly, and then put it into a dryer for drying.

[0089] Specifically, the drying temperature is 110℃ and the drying time is 80 minutes.

[0090] Step 4: The dried tungsten powder is sieved again using a 400-mesh sieve to obtain spherical tungsten powder with a particle size of 35μm.

[0091] It should be noted that, because the powder used for pressing must have uniform particle size, and dried tungsten powder often clumps together, pressing directly without sieving would significantly reduce the molding effect and make it difficult to form. Therefore, sieving the dried tungsten powder again prevents it from clumping. After sieving, the tungsten powder mixed with binder that falls from the sieve aggregates from 3μm particles into 35μm spherical shapes.

[0092] In addition, since most of the dried tungsten powder is in block form, if a sieve with a small aperture is selected, the tungsten powder cannot pass through. However, if the sieve aperture is too large, the tungsten powder particles screened out will also be too large, which will make it difficult to press and form. Therefore, a 400-mesh sieve with an aperture of 38μm is selected. Most of the tungsten powder passing through this sieve is spherical powder of 25-35μm, which can meet the requirements for pressing.

[0093] Step 5: Place the spherical tungsten powder obtained from step 4 in a clean environment to cool down, so that the temperature of the spherical tungsten powder drops to room temperature, eliminating the influence of internal thermal stress in the tungsten powder during subsequent pressing.

[0094] It should be noted that because the temperature of the dried tungsten powder is relatively high, after the tungsten powder is pressed into a tungsten skeleton, the interior of the tungsten skeleton often still has a high temperature. During the subsequent natural cooling process, cracks will be generated due to cooling and shrinkage.

[0095] Therefore, placing tungsten powder in a clean environment to cool it down allows the temperature of the tungsten powder to drop to room temperature in advance, eliminating the influence of internal thermal stress in the tungsten powder during subsequent pressing, thereby preventing cracks from forming in the tungsten skeleton due to cooling and shrinkage.

[0096] Step 6: Spray a small amount of mist-like anhydrous ethanol onto the surface of the spherical tungsten powder after it has cooled to room temperature, and then stir it evenly before pressing the spherical tungsten powder.

[0097] It should be noted that because the surface of tungsten powder is in contact with air, its surface moisture evaporates quickly, and its humidity decreases. During pressing, cracks often occur because the surface is too dry.

[0098] Therefore, spraying a small amount of mist-like anhydrous ethanol onto the surface of spherical tungsten powder after it has cooled to room temperature, and then stirring it evenly, can make the tungsten powder dry and wet evenly, thereby avoiding cracking due to excessive dryness of the surface.

[0099] Furthermore, anhydrous ethanol is chosen for several reasons: firstly, its volatile nature prevents internal residue buildup; secondly, its adhesive properties reduce the likelihood of cracking in the pressed tungsten skeleton; and thirdly, it facilitates demolding during pressing, preventing peeling. Atomized anhydrous ethanol is selected for two reasons: uniform spraying and controllable spray volume.

[0100] The present invention will be further described below with reference to the accompanying drawings:

[0101] See Figure 2 , 3 It is evident that the tungsten-copper alloy prepared without the tungsten powder treatment method of the present invention has numerous microcracks, while the tungsten-copper alloy prepared using the tungsten powder treatment method of the present invention has no microcracks. This not only avoids cracking of tungsten powder when it is pressed into a tungsten skeleton, but also reduces the generation of cracks during subsequent high-temperature sintering, thereby improving product quality.

[0102] Although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0103] Therefore, the above description is only a preferred embodiment of this application and is not intended to limit the scope of this application; that is, all equivalent modifications made in accordance with the scope of the claims of this application shall be within the protection scope of the claims of this application.

Claims

1. A method for treating tungsten powder to prepare tungsten-copper alloys using the tungsten-copper melting infiltration method, characterized in that: Specifically, the following steps are included: S1. Select tungsten powder with a particle size of 3-4μm and sieve it to remove large particulate impurities from the tungsten powder; S2. Pour the tungsten powder obtained by sieving in step S1 into a mixer, add 2% by mass of binder, and heat and stir the tungsten powder and binder in a water bath environment of 50-80℃ to obtain tungsten powder mixed with binder. The components of the adhesive and the mass percentage of each component are as follows: paraffin wax 10-12%, oleic acid 9-10%, polyvinyl alcohol 10-15%, sodium butadiene rubber 5-10%, liquid bisphenol epoxy resin 35-40%, and diethylaminopropylamine 20-25%; S3. Spread the tungsten powder mixed with binder evenly, and then put it into a dryer for drying; S4. The dried tungsten powder is sieved again to obtain spherical tungsten powder with a particle size of 30-35μm; S5. Place the spherical tungsten powder obtained by sieving in step S4 in a clean environment to cool down to room temperature; S6. Spray a small amount of mist-like anhydrous ethanol onto the surface of the spherical tungsten powder after it has cooled to room temperature, and then stir it evenly before pressing the spherical tungsten powder.

2. The tungsten powder treatment method for preparing tungsten-copper alloys using the tungsten-copper melting infiltration method according to claim 1, characterized in that: In step S1, tungsten powder is sieved using a 1000-mesh sieve.

3. The tungsten powder treatment method for preparing tungsten-copper alloys using the tungsten-copper melting infiltration method according to claim 1, characterized in that: In step S2, the stirring time is 90-100 minutes.

4. The tungsten powder treatment method for preparing tungsten-copper alloys using the tungsten-copper melting infiltration method according to claim 1, characterized in that: In step S3, the drying temperature is 100-120℃ and the drying time is 60-90 minutes.

5. The tungsten powder treatment method for preparing tungsten-copper alloys using the tungsten-copper melting infiltration method according to claim 1, characterized in that: In step S4, the dried tungsten powder is sieved using a 400-mesh sieve.