藕状Cu-Sn-Ti合金坯体的制备方法
By using rotary heating, laser selective melting 3D printing, and sandblasting, the problem of through-hole processing in large-size copper-tin alloy drawing blanks was solved, achieving precise positioning of through holes and improving surface finish, reducing alloy base material waste, and improving the density and microstructure quality of the alloy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAN UNIV OF TECH
- Filing Date
- 2024-02-22
- Publication Date
- 2026-07-17
AI Technical Summary
The existing process for machining large-size copper-tin alloy drawing blanks with multiple through holes suffers from problems such as through hole positioning deviation, inaccurate dimensions, high internal roughness of through holes, and serious waste of alloy base material, which leads to a decrease in the performance of subsequent superconducting wires and an increase in production costs.
After reducing Cu-Sn-Ti alloy powder with hydrogen by rotary heating, Cu-Sn-Ti alloy blanks are formed by selective laser melting 3D printing. Through holes are then printed by radial spiral scanning from the inside out. Combined with low-temperature short-time infrared annealing and sandblasting, lotus root-shaped Cu-Sn-Ti alloy blanks are prepared.
It achieves precise positioning of through holes and improves surface finish, reduces waste of alloy base material, avoids warping and cracking defects, and improves the density and microstructure quality of the alloy.
Smart Images
Figure CN117900509B_ABST