Dual-channel chip mounter and chip mounting method

Abstract

The present application relates to chip welding technical field, specifically to a kind of double-channel chip mounter and patching method, double-channel chip mounter includes rack, substrate feeding mechanism, substrate transfer mechanism, chip feeding mechanism, chip transfer mechanism, pressure head mechanism and chip mounting platform.Rack includes bottom plate and crossbeam;Substrate feeding mechanism, chip feeding mechanism, chip transfer mechanism and chip mounting platform are all set on bottom plate;Substrate transfer mechanism and pressure head mechanism are all set on crossbeam.Substrate transfer mechanism, chip transfer mechanism, pressure head mechanism and chip mounting platform are symmetrically arranged with crossbeam as center line.Compensation mechanism of chip is all set on pressure head mechanism, and pressure head mechanism directly compensates and adjusts chip multiple times;Compensation mechanism of substrate is all set on chip mounting platform, and chip mounting platform directly compensates and adjusts substrate multiple times;Both reduce the occupied space of compensation mechanism, and also reduce the situation that chip and substrate collide and damage with compensation mechanism.

Description

Technical Field

[0001] This invention relates to the field of chip bonding technology, specifically to a dual-channel chip mounter and a chip mounting method. Background Technology

[0002] The finished chip is made by welding a chip and a substrate. The solder on the substrate is heated to melt the solder, and the chip and the substrate are pressed together. After cooling, the chip and the substrate can be eutecticly formed into the finished chip.

[0003] Pick-and-place machines enable automated or semi-automated soldering of finished chips, saving labor costs and improving soldering efficiency, making them one of the mainstream finished chip soldering equipment. Existing pick-and-place machines can use compensation mechanisms to compensate for the dimensions of chips or substrates, improving alignment accuracy after soldering. However, a single compensation mechanism in an existing machine typically only compensates for dimensions in one direction or plane, requiring multiple mechanisms to work together to adjust the chip or substrate to the theoretical soldering position. The use of multiple compensation mechanisms occupies significant space, leading to excessively high soldering costs. Furthermore, the risk of chip or substrate collision damage increases when the chip or substrate moves between these mechanisms. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a dual-channel pick and place machine and a pick and place method, which solves the technical problem that the existing pick and place machines have too many compensation mechanisms, which can easily lead to collision damage to the chip or substrate.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the dual-channel placement machine of the present invention includes:

[0008] A frame, the frame including a vertically connected base plate and crossbeams;

[0009] A substrate loading and unloading mechanism is disposed on the base plate; the substrate loading and unloading mechanism is capable of loading or unloading substrates from below stacked substrate trays.

[0010] A pair of substrate transfer mechanisms, which are disposed on the crossbeam and are capable of adsorbing substrates from the substrate loading and unloading mechanism;

[0011] A chip loading and unloading mechanism is disposed on the base plate; the chip loading and unloading mechanism is capable of loading or unloading chips from below stacked chip trays;

[0012] A pair of chip transfer mechanisms, which are disposed on the base plate and are capable of adsorbing chips from the chip loading and unloading mechanism;

[0013] A pair of pressure head mechanisms are provided on the crossbeam. The pressure head mechanisms can adsorb the chips on the chip transfer mechanism and perform angle compensation on the chips in the horizontal and vertical planes.

[0014] A pair of placement platforms are disposed on the base plate and located between the substrate loading / unloading mechanism and the chip loading / unloading mechanism; the placement platform is movable in a direction perpendicular to the crossbeam; the placement platform is capable of receiving the substrate transported by the substrate transfer mechanism and performing angle compensation on the horizontal plane and dimensional compensation in the direction perpendicular to the crossbeam on the substrate.

[0015] The substrate transfer mechanism, the chip transfer mechanism, the pressure head mechanism, and the mounting platform are symmetrically arranged based on the plane containing the central axis of the crossbeam.

[0016] Optionally, the bonding platform includes a soldering station, a heating component, a soldering station sliding component, and a first grating; the soldering station sliding component is disposed on the base plate; the soldering station is slidably connected to the soldering station sliding component, and a heating hole is provided on the top of the soldering station; the heating component is disposed inside the soldering station, and the substrate can be placed on the heating component, and the heating component can perform angle compensation on the substrate in the horizontal plane; the first grating is disposed on the soldering station sliding component.

[0017] Optionally, the heating assembly includes a heating element and a heater; the heater is disposed inside the welding station, and the output shaft of the heater is connected to the heating element so as to drive the heating element to rotate; the heating element is disposed in the heating hole, and the heating element has an adsorption hole so as to vacuum adsorb the chip.

[0018] Optionally, the pressure head mechanism includes a pressure head sliding assembly, a pressure head lifting assembly, a first pressure head rotating assembly, a pressure head connecting plate, a second pressure head rotating assembly, a pressure head assembly, and a pressure head detection assembly; the pressure head sliding assembly is disposed on the crossbeam; the pressure head lifting assembly is disposed on the pressure head sliding assembly so that the pressure head lifting assembly can move in the horizontal direction; the first pressure head rotating assembly is mounted on the pressure head lifting assembly, and the output shaft of the first pressure head rotating assembly is connected to the pressure head connecting plate; the second pressure head rotating assembly is disposed on the pressure head connecting plate, and the output shaft of the second pressure head rotating assembly passes through the pressure head connecting plate and is connected to the pressure head assembly; the pressure head detection assembly is connected to the pressure head lifting assembly, and the pressure head detection assembly can move synchronously with the first pressure head rotating assembly;

[0019] The first pressure head rotation assembly can compensate for the angle of the pressure head assembly on the horizontal plane; the second pressure head rotation assembly can compensate for the angle of the pressure head assembly on the vertical plane.

[0020] Optionally, the pressure head assembly includes a pressure head mounting plate, a preheater, and a pressure head; the pressure head mounting plate is connected to the output shaft of the second pressure head rotating assembly, the pressure head is disposed at the lower end of the pressure head mounting plate, and the preheater is disposed inside the pressure head; the pressure head is capable of adsorbing the chip on the chip transfer mechanism.

[0021] Optionally, the chip transfer mechanism includes a mounting base, a support plate, a transfer sliding assembly, a chip transfer detection assembly, and a chip adsorption assembly; the mounting base is disposed on the base plate, the support plate is disposed on the top surface of the mounting base, the transfer sliding assembly is disposed on the side of the support plate facing the chip loading and unloading mechanism, the chip transfer detection assembly and the chip adsorption assembly are both disposed on the transfer sliding assembly, and the chip adsorption assembly can adsorb the chips on the chip loading and unloading mechanism.

[0022] Optionally, the substrate transfer mechanism includes a substrate sliding assembly, a substrate lifting assembly, a substrate adsorption assembly, and a substrate transfer detection assembly; the substrate sliding assembly is disposed on the crossbeam, the substrate lifting assembly is disposed on the substrate sliding assembly, the substrate adsorption assembly and the substrate transfer detection assembly are both mounted on the substrate lifting assembly, and the substrate adsorption assembly is capable of adsorbing the substrate on the substrate loading and unloading mechanism.

[0023] Optionally, the substrate loading and unloading mechanism includes a substrate transfer assembly, a substrate loading and unloading assembly, a substrate support frame, and a pair of substrate clamping assemblies; the substrate transfer assembly is disposed on the base plate, and the substrate loading and unloading assembly is disposed on the substrate transfer assembly; the substrate support frame is connected to the base plate and is located above the substrate transfer assembly; the substrate clamping assemblies are disposed on the substrate support frame, and the pair of substrate clamping assemblies can clamp or release the substrate tray.

[0024] Optionally, the chip loading and unloading mechanism includes a chip transfer component, a chip loading and unloading component, a chip support frame, and a pair of chip clamping components; the chip transfer component is disposed on the base plate, and the chip loading and unloading component is disposed on the chip transfer component; the chip support frame is connected to the base plate and is located above the chip transfer component; the chip clamping components are disposed on the chip support frame, and the pair of chip clamping components can clamp or release the chip tray.

[0025] Furthermore, the present invention also provides a placement method for a dual-channel pick-and-place machine, the placement method of which is implemented based on the dual-channel pick-and-place machine as described above, and the placement method of the dual-channel pick-and-place machine includes the following steps:

[0026] The substrate loading and unloading mechanism picks up the substrate and transports the substrate tray to below the substrate transfer mechanism; the substrate transfer mechanism picks up the substrate from the substrate tray and transports the substrate to the soldering station of the mounting platform; the mounting platform performs angle compensation on the substrate in the horizontal plane.

[0027] After the substrate transfer mechanism picks up the substrate, the substrate loading and unloading mechanism moves to below the substrate transfer mechanism on the other side; after the substrate transfer mechanism on the other side picks up the substrate, it places the substrate on the soldering station of the mounting platform on the corresponding side; the mounting platform on the corresponding side performs angle compensation on the substrate in the horizontal plane.

[0028] The chip loading and unloading mechanism picks up the chip tray and transports it to the area below the chip transfer mechanism; the chip transfer mechanism picks up the chips from the chip tray and transports them to the picking station of the pressing head mechanism.

[0029] After the chip transfer mechanism picks up the chip, the chip loading and unloading mechanism moves to below the chip transfer mechanism on the other side; after the chip transfer mechanism on the other side picks up the chip, it transports the chip to the picking station of the pressure head mechanism on the corresponding side.

[0030] The pressure head mechanism moves above the chip transfer mechanism to pick up the chip, and after picking up the chip, it performs angle compensation on the horizontal and vertical planes; the placement platform performs angle compensation on the horizontal plane of the substrate.

[0031] The pressure head mechanism moves to the soldering station of the placement platform, and the placement platform performs dimensional compensation on the substrate in the direction perpendicular to the length of the crossbeam; the placement platform drives the chip to press down onto the substrate; at the same time, the placement platform heats the substrate, and after a preset time, cools the finished chip to complete the soldering of the finished chip.

[0032] (III) Beneficial Effects

[0033] The beneficial effects of the present invention are: the substrate loading and unloading mechanism and the chip loading and unloading mechanism can load and unload stacked boxes, and the stacked boxes themselves can save space. By setting the substrate loading and unloading mechanism and the chip loading and unloading mechanism below the stacked boxes, the loading and unloading process of the substrate and the chip is completed below the boxes, which can effectively save the space occupied by the loading and unloading mechanism.

[0034] The placement platform can move in the direction perpendicular to the crossbeam in conjunction with the substrate transfer mechanism, so that the substrate transfer mechanism can place the substrate on the placement platform. The placement platform 7 can perform angle compensation on the horizontal plane of the substrate. At the same time, it can adjust the movement of the placement platform in the direction perpendicular to the crossbeam according to the pressing position of the chip on the pressing head mechanism, that is, to perform size compensation on the substrate on the placement platform 7, so that the substrate adapts to the pressing position of the chip, improves the alignment accuracy between the chip and the substrate, and improves the soldering accuracy of the finished chip.

[0035] The chip transfer mechanism can work in conjunction with the pressure head mechanism to lift and lower, enabling the pressure head mechanism to pick up chips from the chip transfer mechanism. The chip transfer mechanism can also compensate for the lifting and lowering stroke of the pressure head mechanism.

[0036] The pressure head mechanism presses the chip onto the substrate for soldering the finished chip. Before soldering, the pressure head mechanism can compensate for the angle of the chip in the horizontal and vertical planes, further improving the soldering accuracy of the finished chip.

[0037] The chip picking position is compensated and adjusted by the pressure head mechanism so that the actual welding position of the chip basically coincides with the theoretical welding position; the placement position of the substrate is compensated and adjusted by the placement platform so that the actual placement position of the substrate basically coincides with the theoretical placement position; and the alignment accuracy of the substrate and the chip before welding is further improved by adjusting the pressing position of the substrate on the placement platform in the direction perpendicular to the crossbeam, thereby improving the welding accuracy of the finished chip after welding.

[0038] This invention places the chip's compensation mechanism on the pressure head mechanism, allowing for multiple compensation adjustments to the chip directly through the pressure head mechanism; and places the substrate's compensation mechanism on the mounting platform, allowing for multiple compensation adjustments to the substrate directly through the mounting platform. Unlike existing technologies, this eliminates the need for the chip and substrate to move between multiple compensation mechanisms, reducing the space occupied by the compensation mechanisms and decreasing the likelihood of collisions and damage between the chip / substrate and the compensation mechanisms. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the dual-channel chip mounter of the present invention;

[0040] Figure 2 This is a perspective view of the dual-channel placement machine of the present invention;

[0041] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0042] Figure 4 This is a schematic diagram of the pressure head mechanism of the present invention;

[0043] Figure 5This is a schematic diagram of the chip transfer mechanism of the present invention;

[0044] Figure 6 This is a schematic diagram of the substrate transfer mechanism of the present invention;

[0045] Figure 7 This is a schematic diagram of the substrate loading and unloading mechanism of the present invention;

[0046] Figure 8 This is a front view of the substrate loading and unloading mechanism of the present invention;

[0047] Figure 9 This is a schematic diagram of the chip loading and unloading mechanism of the present invention.

[0048] [Explanation of Labels in the Attached Image]

[0049] 1: Frame; 11: Base plate; 12: Crossbeam;

[0050] 2: Substrate loading and unloading mechanism; 21: Substrate transfer assembly; 22: Substrate loading and unloading assembly; 221: Support base; 222: Primary lifting unit; 223: Secondary lifting unit; 23: Substrate support frame; 24: Substrate clamping assembly; 25: Substrate placement area; 26: Substrate empty cell area 2; 27: Substrate empty cell area 1; 28: Finished chip placement area;

[0051] 3: Substrate transfer mechanism; 31: Substrate sliding assembly; 32: Substrate lifting assembly; 321: Lifting plate; 33: Substrate adsorption assembly; 331: Adsorption head; 34: Substrate transfer and detection assembly;

[0052] 4: Chip loading / unloading mechanism; 41: Chip transfer assembly; 42: Chip loading / unloading assembly; 43: Chip support frame; 44: Chip clamping assembly;

[0053] 5: Chip transfer mechanism; 51: Mounting base; 52: Support plate; 53: Transfer sliding assembly; 54: Chip transfer detection assembly; 55: Chip adsorption assembly;

[0054] 6: Pressure head mechanism; 61: Pressure head sliding assembly; 62: Pressure head lifting assembly; 621: Second grating; 63: First pressure head rotating assembly; 64: Pressure head connecting plate; 65: Second pressure head rotating assembly; 66: Pressure head assembly; 661: Pressure head mounting plate; 662: Pressure head; 67: Pressure head detection assembly;

[0055] 7: Placement platform; 71: Soldering station; 72: Heating assembly; 721: Heating element; 73: Soldering station sliding assembly; 74: First grating. Detailed Implementation

[0056] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0057] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0058] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0059] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; "connection" can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0060] See Figure 1 and Figure 2This invention provides a dual-channel pick-and-place machine, comprising a frame 1, a substrate loading / unloading mechanism 2, paired substrate transfer mechanisms 3, chip loading / unloading mechanisms 4, paired chip transfer mechanisms 5, paired pressure head mechanisms 6, and paired placement platforms 7. The frame 1 includes a vertically connected base plate 11 and a crossbeam 12. The crossbeam 12 is a concave crossbeam, with its open end connected to the base plate 11, allowing the loading / unloading mechanisms to pass through slots in the crossbeam 12. Simultaneously, transfer mechanisms can be correspondingly mounted on the crossbeam 12 to reduce the space occupied by the dual-channel pick-and-place machine. The compact structure also reduces the travel distance of each mechanism, improving the soldering efficiency of the finished chips. The substrate loading / unloading mechanism 2 is mounted on the base plate 11 and can load or unload substrates from below stacked substrate trays. The substrate transfer mechanism 3 is... The substrate loading / unloading mechanism 2 is placed on the crossbeam 12 and can adsorb the substrates on the substrate loading / unloading mechanism 2; the chip loading / unloading mechanism 4 is set on the base plate 11; the chip loading / unloading mechanism 4 can load or unload chips from below the stacked chip trays; the chip transfer mechanism 5 is set on the base plate 11 and can adsorb the chips on the chip loading / unloading mechanism 4; the pressure head mechanism 6 is set on the crossbeam 12, the pressure head mechanism 6 can adsorb the chips on the chip transfer mechanism 5, and perform angle compensation on the horizontal and vertical planes of the chips. The angle compensation on the horizontal plane refers to rotating the chip based on the normal of the horizontal plane within the horizontal plane. The predetermined angle compensation in the vertical plane refers to rotating by a predetermined angle based on the normal of the vertical plane. In this invention, the normal of the vertical plane is parallel to the crossbeam 12. By performing angle compensation on the chip, the actual adsorption position of the chip can be made to basically coincide with the theoretical adsorption position, thereby improving the welding accuracy of the finished chip. The chip mounting platform 7 is set on the base plate 11 and is located between the substrate loading / unloading mechanism 2 and the chip loading / unloading mechanism 4. The chip mounting platform 7 can move in the direction perpendicular to the length of the crossbeam 12, which is the length of the substrate transfer mechanism 3 and the pressure head mechanism 6. The horizontal movement direction on the crossbeam 12; the mounting platform 7 can receive the substrate transported by the substrate transfer mechanism 3 and perform angle compensation on the horizontal plane and dimensional compensation in the direction perpendicular to the length of the crossbeam 12; wherein, the substrate transfer mechanism 3, the chip transfer mechanism 5, the pressure head mechanism 6 and the mounting platform 7 are symmetrically arranged based on the plane where the central axis of the crossbeam 12 is located, that is, symmetrically arranged with the length direction of the crossbeam 12 as the center line; of course, the actual installation position of each mechanism can be modified to a certain extent according to actual needs, but the overall installation area is still symmetrically distributed.

[0061] The substrate loading / unloading mechanism 2 and the chip loading / unloading mechanism 4 can load and unload stacked boxes. The stacked boxes themselves can save space. By placing the substrate loading / unloading mechanism 2 and the chip loading / unloading mechanism 4 below the stacked boxes, the loading and unloading processes of the substrate and the chip are completed below the boxes, which can effectively save the space occupied by the loading / unloading mechanism.

[0062] The mounting platform 7 can move in the length direction perpendicular to the crossbeam 12 in coordination with the substrate transfer mechanism 3, so that the substrate transfer mechanism 3 can place the substrate on the mounting platform 7. The mounting platform 7 can perform angle compensation on the horizontal plane of the substrate. At the same time, it can adjust the movement of the mounting platform 7 in the length direction perpendicular to the crossbeam 12 according to the pressing position of the chip on the pressure head mechanism 6, that is, to perform size compensation on the substrate on the mounting platform 7, so that the substrate adapts to the pressing position of the chip, improves the alignment accuracy between the chip and the substrate, and improves the soldering accuracy of the finished chip.

[0063] The chip transfer mechanism 5 can move up and down in conjunction with the pressure head mechanism 6, so that the pressure head mechanism 6 can pick up the chip on the chip transfer mechanism 5, and the chip transfer mechanism 5 can compensate for the lifting stroke of the pressure head mechanism 6.

[0064] The pressure head mechanism 6 can press the chip onto the substrate for soldering the finished chip. Before soldering, the pressure head mechanism 6 can also compensate for the angle of the chip on the horizontal and vertical planes, further improving the soldering accuracy of the finished chip.

[0065] The chip picking position is compensated and adjusted by the pressure head mechanism 6 so that the actual welding position of the chip basically coincides with the theoretical welding position; the substrate placement position is compensated and adjusted by the placement platform 7 so that the actual placement position of the substrate basically coincides with the theoretical placement position; and the alignment accuracy of the substrate and the chip before welding is further improved by adjusting the pressing position of the substrate on the placement platform 7 in the length direction perpendicular to the crossbeam 12, thereby improving the welding accuracy of the finished chip after welding.

[0066] This invention sets the chip compensation mechanism on the pressure head mechanism 6, allowing the chip to be directly compensated and adjusted multiple times via the pressure head mechanism 6; and sets the substrate compensation mechanism on the mounting platform 7, allowing the substrate to be directly compensated and adjusted multiple times via the mounting platform 7. Unlike existing technologies, this invention eliminates the need for the chip and substrate to move between multiple compensation mechanisms, reducing the space occupied by the compensation mechanisms and decreasing the likelihood of collisions and damage between the chip / substrate and the compensation mechanisms.

[0067] like Figure 3As shown, the mounting platform 7 includes a soldering station 71, a heating assembly 72, a soldering station sliding assembly 73, and a first grating 74. The soldering station sliding assembly 73 is mounted on the base plate 11. The soldering station 71 is slidably connected to the soldering station sliding assembly 73, and a heating hole is provided on the top of the soldering station 71. The soldering station sliding assembly 73 can move in the direction perpendicular to the length of the crossbeam 12 to cooperate with the substrate transfer mechanism 3 for loading and unloading and for compensating the size of the substrate. The heating assembly 72 is located inside the soldering station 71, and the substrate can be placed on the heating assembly 72. The heating assembly 72 can compensate the angle of the substrate on the horizontal plane. The first grating 74 is mounted on the soldering station sliding assembly 73. Specifically, the sliding assembly of the present invention includes a drive unit, a sliding plate, a pair of sliders, and a pair of slide rails. The drive unit can be a linear motor drive, a lead screw motor drive, or a cylinder drive, etc. The slide rails are mounted on the base plate 11, the sliders are slidably connected to the slide rails, and the bottom surfaces of the sliding plate are connected one-to-one with the pairs of sliders. The soldering station 71 is mounted on the sliding plate. The soldering station sliding assembly 73 can move in conjunction with the substrate transfer mechanism 3, allowing the substrate transfer mechanism 3 to place the substrate onto the heating assembly 72. It can also, after the finished chip is soldered, work with the substrate transfer mechanism 3 to remove the finished chip. Simultaneously, before soldering, the pressure head mechanism 6 can detect the placement position of the substrate on the heating assembly 72 and transmit the substrate position information to the control center. The control center then controls the soldering station sliding assembly 73 to drive the soldering station 71, so that the substrate on the heating assembly 72 can move directly below the chip on the pressure head mechanism 6. This also compensates for the substrate soldering position, further improving the soldering accuracy of the finished chip. The first grating 74 can feed back the position information of the substrate along the sliding direction of the soldering station sliding assembly 73 to the control center, further monitoring the movement of the substrate on the heating assembly 72. The control program and calculation program of the control center in this invention are existing commonly used programs, and will not be described in detail here.

[0068] Furthermore, the heating assembly 72 includes a heating element 721 and a heater. The heater is disposed inside the soldering station 71, and its output shaft is connected to the heating element 721 to drive the heating element 721 to rotate. The heating element 721 is disposed within a heating hole, and an adsorption hole is formed on the heating element 721 to enable vacuum adsorption of the chip. The outer diameter of the heating element 721 is smaller than the diameter of the heating hole, so that the heating element 721 can rotate relative to the heating hole. Specifically, the output shaft of the heater can drive the heating element 721 to rotate in the horizontal plane, thereby driving the substrate placed on the heating element 721 to rotate, thus performing angle compensation on the substrate in the horizontal plane, making the actual placement position of the substrate basically coincide with the theoretical placement position, thereby reducing the soldering error caused by the substrate handling process. At the same time, the heater is externally connected to an air pipe and an air pump. The external air pipe is connected to the heater and the adsorption hole on the heating element 721. By the suction or release of air by the external air pump, the heating element 721 can respectively achieve adsorption or de-adsorption of the substrate.

[0069] See Figure 4 The pressure head mechanism 6 includes a pressure head sliding assembly 61, a pressure head lifting assembly 62, a first pressure head rotating assembly 63, a pressure head connecting plate 64, a second pressure head rotating assembly 65, a pressure head assembly 66, and a pressure head detection assembly 67. The pressure head sliding assembly 61 is mounted on the crossbeam 12 to allow the pressure head assembly 66 to move horizontally. The pressure head lifting assembly 62 is mounted on the slide plate of the pressure head sliding assembly 61, and allows the pressure head assembly 66 to move vertically. The first pressure head rotating assembly 63 is mounted on the pressure head lifting assembly 62. The pressure head lifting assembly 62 includes a pressure head lifting drive unit, a pressure head lifting sliding assembly, and a second grating 621. The output shaft of the pressure head lifting drive unit is connected to the pressure head lifting assembly. The sliding component's slide plate is threaded, i.e., driven by a lead screw motor. The second grating 621 is fixedly connected to the slide plate of the pressure head lifting sliding component, so that the second grating 621 and the slide plate of the pressure head lifting sliding component can rise and fall synchronously. The pressure head component 66 and the slide plate of the pressure head lifting sliding component also rise and fall synchronously. Therefore, the second grating 621 can transmit the height information of the pressure head component 66 to the control center to control the lifting height of the pressure head component 66, thereby controlling the pressure applied by the pressure head component 66 to the chip. This can effectively prevent the pressure head component 66 from being too high and damaging the chip or substrate, or from being too low and failing to press the chip and substrate into place, thereby improving the yield of finished chip soldering.

[0070] The output shaft of the first pressure head rotating assembly 63 is connected to a pressure head connecting plate 64; a second pressure head rotating assembly 65 is disposed on the pressure head connecting plate 64, and the output shaft of the second pressure head rotating assembly 65 passes through the pressure head connecting plate 64 and is connected to the pressure head assembly 66; a pressure head detection assembly 67 is connected to a pressure head lifting assembly 62, and the pressure head detection assembly 67 can rise and fall synchronously with the first pressure head rotating assembly 63; the first pressure head rotating assembly 63 can compensate for the angle of the pressure head assembly 66 on the horizontal plane; the second pressure head rotating assembly 65 can compensate for the angle of the pressure head assembly 66 on the vertical plane. Specifically, the first pressure head rotating assembly 63 includes a first pressure head rotating drive unit and a flange; the output shaft of the first pressure head rotating drive unit is connected to the flange, and the flange is then fixedly connected to the pressure head connecting plate 64, and the flange can increase the stability of the transmission; the first pressure head rotating assembly 63 can drive the pressure head assembly 66 to rotate in a plane perpendicular to the output shaft of the first pressure head rotating assembly 63, thereby enabling angle compensation for the chip adsorbed on the pressure head assembly 66. The second pressure head rotating assembly 65 can be a voice coil motor, which has advantages such as small size and fast response speed. This invention uses a voice coil motor with an arc-shaped motion. There are one to two voice coil motors, which are mounted on the pressure head connecting plate 64. The output shaft of the voice coil motor is connected to the pressure head assembly 66 to drive the pressure head assembly 66 to perform an arc-shaped motion. This allows adjustment of the angle of the pressure head assembly 66 in the vertical plane, ensuring surface-to-surface contact between the chip and the substrate during pressing, thereby improving the soldering yield of the finished chip. Additionally, the pressure head detection assembly 67 includes a detection camera. The detection cameras in this invention are all existing detection cameras used for visually identifying the actual position of the chip or substrate and transmitting the relevant position information to the control center for processing. The pressure head detection assembly 67 can detect the position of the chip adsorbed on the pressure head assembly 66 and transmit the chip's position information to the control center. The control center then controls the first pressure head rotating assembly 63 and the second pressure head rotating assembly 65 to compensate and adjust the chip. Before the finished chip is pressed, the pressure head detection component 67 can identify the position of the substrate on the mounting platform 7 after angle compensation. The control center compensates and adjusts the position of the substrate on the mounting platform 7 by means of the cooperation of the welding table sliding component 73 and the first grating 74, that is, by adjusting along the sliding direction of the welding table sliding component 73, that is, by adjusting along the length direction perpendicular to the crossbeam 12.

[0071] Furthermore, the pressure head assembly 66 includes a pressure head mounting plate 661, a preheater, and a pressure head 662. The pressure head mounting plate 661 is connected to the output shaft of the second pressure head rotating assembly 65, the pressure head 662 is disposed at the lower end of the pressure head mounting plate 661, and the preheater is disposed inside the pressure head 662. The pressure head 662 can adsorb the chip on the chip transfer mechanism 5. Specifically, the preheater can heat the pressure head 662 so that the chip can be preheated before being soldered to the substrate, thereby accelerating the melting speed of the solder on the substrate, reducing the soldering time of the finished chip, and improving the soldering efficiency. The preheater is externally connected to an air extraction pipe and an air extraction pump, which is analogous to the heater of the heating assembly 72, so that the pressure head 662 can adsorb the chip. In addition, a limiting block can be provided on the pressure head connecting plate 64 to limit the angle compensation stroke of the pressure head assembly 66 in the vertical plane, so as to avoid the pressure head 662 adjusting too large an angle and damaging the pressure head during pressing, thus effectively protecting the pressure head 662.

[0072] like Figure 5 As shown, the chip transfer mechanism 5 includes a mounting base 51, a support plate 52, a transfer sliding assembly 53, a chip transfer detection assembly 54, and a chip adsorption assembly 55. The mounting base 51 is mounted on the base plate 11. The support plate 52 is an L-shaped support plate, with its base plate positioned on the top surface of the mounting base 51. The transfer sliding assembly 53 is mounted on the side of the support plate 52 facing the chip loading / unloading mechanism 4. Both the chip transfer detection assembly 54 and the chip adsorption assembly 55 are mounted on the sliding plate of the transfer sliding assembly 53. The chip adsorption assembly 55 can adsorb chips from the chip loading / unloading mechanism 4. Specifically, the chip adsorption assembly 55 includes a transfer nozzle, which can pick up chips from the chip loading / unloading mechanism 4 via the transfer sliding assembly 53 and transfer the chips to a height where the pressure head mechanism 6 can pick them up, thus compensating for the lifting stroke of the pressure head mechanism 6. The chip transfer detection assembly 54 includes a detection camera, which can identify the chip position on the chip loading / unloading mechanism 4, enabling the chip adsorption assembly 55 to pick up chips accurately.

[0073] See Figure 6The substrate transfer mechanism 3 includes a substrate sliding assembly 31, a substrate lifting assembly 32, a substrate adsorption assembly 33, and a substrate transfer detection assembly 34. The substrate sliding assembly 31 is mounted on the crossbeam 12, and the substrate lifting assembly 32 is mounted on the sliding plate of the substrate sliding assembly 31, enabling the substrate lifting assembly 32 to move horizontally. The output shaft of the substrate lifting assembly 32 is threadedly connected to a lifting plate 321. The substrate lifting assembly 32 is driven by a screw motor. The substrate adsorption assembly 33 and the substrate transfer detection assembly 34 are both mounted on the lifting plate 321. The substrate adsorption assembly 33 can adsorb substrates on the substrate loading / unloading mechanism 2. The substrate lifting assembly 32 can compensate for the lifting stroke of the substrate adsorption assembly 33. Specifically, the substrate adsorption assembly 33 includes a drive cylinder and a suction head 331. The drive cylinder is mounted on the lifting plate 321, and the extension rod of the drive cylinder is connected to the suction head 331. The substrate adsorption assembly 33 of this invention has two drive cylinders and two suction heads 331, with one drive cylinder corresponding to one suction head 331. In actual operation, Figure 1 For example, the left side is the first suction head, and the right side is the second suction head. The side closer to the mounting platform 7 is the left side, and the side closer to the substrate loading / unloading mechanism 2 is the right side. The second suction head first picks up the substrate from the substrate loading / unloading mechanism 2, while the first suction head remains idle. After the mounting platform 7 completes the soldering of the finished chip, the substrate transfer mechanism 3 moves above the mounting platform 7, and the first suction head picks up the finished chip. After picking up the chip, the substrate transfer mechanism 3 moves to the left again, and the second suction head places the substrate on the mounting platform 7. The substrate transfer mechanism 3 then moves to the right above the substrate loading / unloading mechanism 2, and the first suction head unloads the finished chip. By setting two drive cylinders and two suction heads 331, the substrate transfer mechanism 3 can realize the loading of substrates and the picking and unloading of finished chips in one reciprocating motion, effectively improving the handling efficiency. In addition, the substrate transfer and detection component 34 and the substrate adsorption component 33 move up and down synchronously. The substrate transfer and detection component 34 includes a detection camera, which is used to detect and identify the position information of the substrate on the substrate loading and unloading mechanism 2, so as to realize precise control of substrate picking and finished chip unloading. The substrate transfer and detection component 34 can also identify the actual position information of the substrate on the heating component 72 after the substrate is placed on the bonding platform 7. The control center can perform angle compensation in the horizontal plane on the substrate through the heating component 72 according to the actual position information of the substrate.

[0074] like Figure 7 and Figure 8As shown, the substrate loading / unloading mechanism 2 includes a substrate transfer assembly 21, a substrate loading / unloading assembly 22, a substrate support frame 23, and a pair of substrate clamping assemblies 24. The substrate transfer assembly 21 is mounted on the base plate 11 and is driven by a lead screw motor. The substrate loading / unloading assembly 22 is mounted on the substrate transfer assembly 21. The substrate support frame 23 is connected to the base plate 11 and is located above the substrate transfer assembly 21. The substrate clamping assemblies 24 are mounted on the substrate support frame 23, and the pair of substrate clamping assemblies 24 can clamp or release the stacked substrate trays. A clearance groove is provided on the substrate support frame 23 directly below the stacked substrate trays to allow the substrate loading / unloading assembly 22 to load and unload the substrates. Therefore, the stacked substrate trays are actually suspended on the substrate support frame 23 by the pair of substrate clamping assemblies 24. Specifically, the substrate loading / unloading assembly 22 includes a support base 221, a primary lifting unit 222, and a secondary lifting unit 223. The support base 221 is a T-shaped support base, which is mounted on the slide plate of the substrate transfer assembly 21. The primary lifting unit 222 and the secondary lifting unit 223 are mirror images of each other on both sides of the support base 221, and the driving principle of both sides is the same. One side will be described in detail. The primary lifting unit 222 is mounted on the support base 221, and the telescopic rod of the primary lifting unit 222 is connected to the secondary lifting unit 223 via a connecting plate to drive the secondary lifting unit 223 to lift. A tray is provided on the telescopic rod of the secondary lifting unit 223, and the tray can abut directly below the substrate tray. Next, the substrate clamping assembly 24 includes a clamping cylinder and a clamping plate. The clamping plate is connected to the telescopic rod of the clamping cylinder. By the synchronous reverse movement of the paired substrate clamping assemblies 24, the substrate tray can be clamped or released.

[0075] In actual operation, the substrate transfer assembly 21 first drives the substrate loading and unloading assembly 22 to directly below the substrate tray. The primary lifting unit 222 drives the secondary lifting unit 223 to rise until the tray of the secondary lifting unit 223 abuts against the substrate tray. At this time, the substrate loading and unloading assembly 22 can support the substrate tray. The paired substrate clamping assemblies 24 release the clamping of the substrate tray, and the secondary lifting unit 223 raises and lowers the height (thickness) of one substrate tray, thereby realizing the loading (unloading) or unloading (picking) of the substrate tray.

[0076] The trays of this invention are stacked, and the tray transfer mechanism and loading / unloading mechanism are both located below the support frame, effectively saving space occupied by the substrate loading / unloading mechanism 2. Specifically, the substrate support frame 23 of this invention is provided with a substrate placement area 25, a substrate empty box second area 26, a substrate empty box first area 27, and a finished chip placement area 28; the substrate placement area 25 is used to stack substrate trays filled with substrates, the finished chip placement area 28 is used to stack substrate trays filled with finished chips, and the substrate empty box first area 27 and substrate empty box second area 26 are used to stack empty substrate trays; the two trays of the substrate loading / unloading assembly 22 can cooperate with the four tray placement areas on the substrate support frame 23 for loading and unloading. In actual production, with Figure 7 For example, the tray on the left side of the support base 221 is the first tray, and the one on the right side is the second tray. The side closer to the substrate empty box area 26 is the left side, and the side closer to the finished chip placement area 28 is the right side. The substrate transfer assembly 21 moves the first tray directly under the substrate placement area 25 to pick up the substrate, and the second tray moves simultaneously directly under the substrate empty box area 27 to pick up the substrate. After picking up the substrate, the substrate loading and unloading assembly 22 moves to below the substrate transfer mechanism 3. The substrate transfer mechanism 3 picks up the substrate from the first tray and places the soldered finished chip on the second tray. When the first tray is empty and the second tray is full, the substrate transfer assembly 21 moves the first tray directly under the substrate empty box area 26 to unload the substrate, and the second tray moves simultaneously directly under the finished chip placement area 28 to unload the substrate. This realizes the loading and unloading of the stacked trays. Of course, the above is only one embodiment, and the placement areas of each substrate tray can be set according to actual needs.

[0077] See Figure 9 The chip loading / unloading mechanism 4 includes a chip transfer assembly 41, a chip loading / unloading assembly 42, a chip support frame 43, and a pair of chip clamping assemblies 44. The chip transfer assembly 41 is mounted on the base plate 11, and the chip loading / unloading assembly 42 is mounted on the slide plate of the chip transfer assembly 41. The chip support frame 43 is connected to the base plate 11 and is located above the chip transfer assembly 41. The chip clamping assemblies 44 are mounted on the chip support frame 43, and the pair of chip clamping assemblies 44 can clamp or release the chip tray. The chip loading / unloading mechanism 4 can be compared with the loading / unloading principle of the substrate loading / unloading mechanism 2, and will not be described in detail here. The difference between the chip loading / unloading mechanism 4 and the substrate loading / unloading mechanism 2 is that the chip loading / unloading mechanism 4 only needs to set up a tray, a chip placement area, and a chip empty box area. This is because in this embodiment, the unloading area of ​​the finished chip is set on one side of the substrate loading / unloading mechanism 2. This invention can achieve loading and unloading in one reciprocating stroke for stacked trays, saving space occupied by the mechanism and improving loading / unloading efficiency.

[0078] Furthermore, the present invention also provides a placement method for a dual-channel pick-and-place machine. The placement method for the dual-channel pick-and-place machine is implemented based on a dual-channel pick-and-place machine and includes the following steps:

[0079] The substrate loading and unloading mechanism 2 picks up substrates below the substrate support frame 23 and transports the substrate tray full of substrates and the empty tray of finished chips to the substrate transfer mechanism 3 below; the substrate transfer mechanism 3 picks up the substrates from the substrate tray and transports the substrates to the heating plate 721 of the mounting platform 7; the heating component 72 performs angle compensation in the horizontal plane on the substrate based on the substrate position information identified by the substrate transfer detection component 34.

[0080] After the substrate transfer mechanism 3 picks up the substrate, the substrate loading and unloading mechanism 2 moves to the substrate transfer mechanism 3 on the other side of the crossbeam 12. After the substrate transfer mechanism 3 on the other side picks up the substrate, it places the substrate on the heating plate 721 of the corresponding side of the mounting platform 7. The heating component 72 on the corresponding side performs angle compensation in the horizontal plane on the substrate based on the substrate position information identified by the substrate transfer detection component 34 on the corresponding side.

[0081] The chip loading and unloading mechanism 4 picks up the chip tray below the chip support frame 43 and transports the chip tray to the area below the chip transfer mechanism 5. The chip transfer mechanism 5 picks up the chips from the chip tray and transports them to the picking station of the pressing head mechanism 6 to compensate for the lifting height of the pressing head mechanism 6.

[0082] After the chip transfer mechanism 5 picks up the chip, the chip loading and unloading mechanism 4 moves to the bottom of the chip transfer mechanism 5 on the other side of the crossbeam 12; after the chip transfer mechanism 5 on the other side picks up the chip, it transports the chip to the picking station of the pressure head mechanism 6 on the corresponding side.

[0083] The pressing head mechanism 6 moves above the chip transfer mechanism 5 to pick up the chip. The chip is transferred from the transfer nozzle of the transfer mechanism 5 to the pressing head 662 of the pressing head mechanism 6. The preheater preheats the chip. At the same time, the control center identifies the actual position of the chip on the pressing head 662 through the pressing head detection component 67, and performs angle compensation on the chip in the horizontal plane through the first pressing head rotation component 63, and performs angle compensation on the chip in the vertical plane through the second pressing head rotation component 65, so as to adjust the actual position of the chip on the pressing head 662 to the theoretical position.

[0084] When the heating assembly 72 performs angle compensation on the substrate in the horizontal plane, the actual position information of the substrate on the heating plate 721 can be identified by the pressure head detection assembly 67 or by the substrate transfer detection assembly 34, and can be set according to actual needs.

[0085] The pressure head mechanism 6 moves to the soldering station of the placement platform 7. The pressure head detection component 67 transmits the position information of the substrate and the chip after angle compensation to the control center. The control center then calculates the dimensional deviation of the substrate and the chip in the direction perpendicular to the length of the crossbeam 12, and then performs dimensional compensation on the substrate through the soldering table sliding component 73 and the first grating 74. The placement platform 7 drives the chip to press down onto the substrate. At the same time, the heating component 72 heats the substrate, and after a preset time, the finished chip is cooled to complete the soldering of the finished chip.

[0086] This invention symmetrically arranges the substrate transfer mechanism 3, chip transfer mechanism 5, pressure head mechanism 6, and placement platform 7 along the length of the crossbeam 12, using a dual-channel placement method for chip soldering. This saves equipment space and improves chip soldering efficiency. By placing multiple chip compensation mechanisms on the pressure head mechanism 6 and multiple substrate compensation mechanisms on the placement platform 7, the number of times the chip and substrate pass between compensation mechanisms is reduced. This effectively reduces the risk of chip and substrate collision damage and also reduces temperature loss, thereby improving the soldering efficiency of the finished chip.

[0087] It should be understood that the above description of specific embodiments of the present invention is only for illustrating the technical approach and features of the present invention, and is intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. However, the present invention is not limited to the specific embodiments described above. All changes or modifications made within the scope of the claims of the present invention should be covered within the protection scope of the present invention.

Claims

1. A dual-channel pick and place machine, characterized in that, The dual-channel placement machine includes: The frame (1) includes a vertically connected base plate (11) and crossbeam (12). A substrate loading and unloading mechanism (2) is disposed on the base plate (11); the substrate loading and unloading mechanism (2) can load or unload substrates from below the stacked substrate trays; A pair of substrate transfer mechanisms (3) are provided on the crossbeam (12) and can adsorb substrates on the substrate loading and unloading mechanism (2). A chip loading / unloading mechanism (4) is disposed on the base plate (11); the chip loading / unloading mechanism (4) can load or unload chips from below stacked chip trays; A pair of chip transfer mechanisms (5), the chip transfer mechanism (5) is disposed on the base plate (11) and can adsorb the chips on the chip loading and unloading mechanism (4); A pair of pressure head mechanisms (6) are provided on the crossbeam (12). The pressure head mechanism (6) can adsorb the chip on the chip transfer mechanism (5) and perform angle compensation on the chip in the horizontal and vertical planes. The pressure head mechanism (6) includes a pressure head sliding assembly (61), a pressure head lifting assembly (62), a first pressure head rotating assembly (63), a pressure head connecting plate (64), a second pressure head rotating assembly (65), a pressure head assembly (66), and a pressure head detection assembly (67); the pressure head sliding assembly (61) is disposed on the crossbeam (12); the pressure head lifting assembly (62) is disposed on the pressure head sliding assembly (61) so that the pressure head lifting assembly (62) can move in the horizontal direction; the first pressure head rotating assembly (63) is mounted on the pressure head lifting assembly (62), and the output shaft of the first pressure head rotating assembly (63) is connected to the pressure head sliding assembly (65). A head connecting plate (64); a second head rotating assembly (65) is provided on the head connecting plate (64), and the output shaft of the second head rotating assembly (65) passes through the head connecting plate (64) and is connected to the head assembly (66); the head detection assembly (67) is connected to the head lifting assembly (62), and the head detection assembly (67) can move synchronously with the first head rotating assembly (63); the first head rotating assembly (63) can compensate for the angle of the head assembly (66) on the horizontal plane; the second head rotating assembly (65) can compensate for the angle of the head assembly (66) on the vertical plane; A pair of mounting platforms (7) are disposed on the base plate (11) and located between the substrate loading / unloading mechanism (2) and the chip loading / unloading mechanism (4); the mounting platform (7) is capable of moving in a direction perpendicular to the crossbeam (12); the mounting platform (7) is capable of receiving the substrate transported by the substrate transfer mechanism (3) and performing angle compensation on the horizontal plane and dimensional compensation in the direction perpendicular to the crossbeam (12) on the substrate; The substrate transfer mechanism (3), the chip transfer mechanism (5), the pressure head mechanism (6) and the mounting platform (7) are symmetrically arranged based on the plane containing the central axis of the crossbeam (12).

2. The dual-channel placement machine according to claim 1, characterized in that, The mounting platform (7) includes a welding station (71), a heating component (72), a welding station sliding component (73), and a first grating (74); the welding station sliding component (73) is disposed on the base plate (11); the welding station (71) is slidably connected to the welding station sliding component (73), and a heating hole is provided on the top of the welding station (71); the heating component (72) is disposed inside the welding station (71), the substrate can be placed on the heating component (72), and the heating component (72) can perform angle compensation on the horizontal plane of the substrate; the first grating (74) is disposed on the welding station sliding component (73).

3. The dual-channel placement machine according to claim 2, characterized in that, The heating assembly (72) includes a heating element (721) and a heater; the heater is disposed inside the welding station (71), and the output shaft of the heater is connected to the heating element (721) so as to drive the heating element (721) to rotate; the heating element (721) is disposed in the heating hole, and the heating element (721) has an adsorption hole so as to vacuum adsorb the chip.

4. The dual-channel placement machine according to claim 1, characterized in that, The pressure head assembly (66) includes a pressure head mounting plate (661), a preheater, and a pressure head (662); the pressure head mounting plate (661) is connected to the output shaft of the second pressure head rotating assembly (65), the pressure head (662) is disposed at the lower end of the pressure head mounting plate (661), and the preheater is disposed inside the pressure head (662); the pressure head (662) can adsorb the chip on the chip transfer mechanism (5).

5. The dual-channel placement machine according to any one of claims 1-3, characterized in that, The chip transfer mechanism (5) includes a mounting base (51), a support plate (52), a transfer sliding assembly (53), a chip transfer detection assembly (54), and a chip adsorption assembly (55). The mounting base (51) is disposed on the base plate (11), and the support plate (52) is disposed on the top surface of the mounting base (51). The transfer sliding assembly (53) is disposed on the side of the support plate (52) facing the chip loading and unloading mechanism (4). The chip transfer detection assembly (54) and the chip adsorption assembly (55) are both disposed on the transfer sliding assembly (53). The chip adsorption assembly (55) can adsorb the chips on the chip loading and unloading mechanism (4).

6. The dual-channel placement machine according to any one of claims 1-3, characterized in that, The substrate transfer mechanism (3) includes a substrate sliding assembly (31), a substrate lifting assembly (32), a substrate adsorption assembly (33), and a substrate transfer detection assembly (34). The substrate sliding assembly (31) is disposed on the crossbeam (12), the substrate lifting assembly (32) is disposed on the substrate sliding assembly (31), the substrate adsorption assembly (33) and the substrate transfer detection assembly (34) are both mounted on the substrate lifting assembly (32), and the substrate adsorption assembly (33) can adsorb the substrate on the substrate loading and unloading mechanism (2).

7. The dual-channel placement machine according to any one of claims 1-3, characterized in that, The substrate loading and unloading mechanism (2) includes a substrate transfer assembly (21), a substrate loading and unloading assembly (22), a substrate support frame (23), and a pair of substrate clamping assemblies (24). The substrate transfer assembly (21) is disposed on the base plate (11), and the substrate loading and unloading assembly (22) is disposed on the substrate transfer assembly (21). The substrate support frame (23) is connected to the base plate (11) and is located above the substrate transfer assembly (21). The substrate clamping assembly (24) is disposed on the substrate support frame (23), and the pair of substrate clamping assemblies (24) can clamp or release the substrate tray.

8. The dual-channel placement machine according to any one of claims 1-3, characterized in that, The chip loading and unloading mechanism (4) includes a chip transfer assembly (41), a chip loading and unloading assembly (42), a chip support frame (43), and a pair of chip clamping assemblies (44). The chip transfer assembly (41) is disposed on the base plate (11), and the chip loading and unloading assembly (42) is disposed on the chip transfer assembly (41). The chip support frame (43) is connected to the base plate (11) and is located above the chip transfer assembly (41). The chip clamping assembly (44) is disposed on the chip support frame (43), and the pair of chip clamping assemblies (44) can clamp or release the chip tray.

9. A placement method for a dual-channel pick-and-place machine, characterized in that, The placement method of the dual-channel placement machine is implemented based on the dual-channel placement machine according to any one of claims 1-8, and the placement method of the dual-channel placement machine includes the following steps: The substrate loading and unloading mechanism (2) picks up the substrate and transports the substrate tray to the area below the substrate transfer mechanism (3); the substrate transfer mechanism (3) picks up the substrate from the substrate tray and transports the substrate to the soldering station of the mounting platform (7); the mounting platform (7) performs angle compensation on the substrate in the horizontal plane. After the substrate transfer mechanism (3) picks up the substrate, the substrate loading and unloading mechanism (2) moves to the bottom of the substrate transfer mechanism (3) on the other side; after the substrate transfer mechanism (3) on the other side picks up the substrate, it places the substrate on the soldering station of the corresponding side of the mounting platform (7); the corresponding side of the mounting platform (7) performs angle compensation on the substrate in the horizontal plane. The chip loading and unloading mechanism (4) picks up the chip tray and transports it to the area below the chip transfer mechanism (5); the chip transfer mechanism (5) picks up the chips from the chip tray and transports them to the picking station of the pressing head mechanism (6); After the chip transfer mechanism (5) picks up the chip, the chip loading and unloading mechanism (4) moves to the bottom of the chip transfer mechanism (5) on the other side; after the chip transfer mechanism (5) on the other side picks up the chip, it transports the chip to the picking station of the pressure head mechanism (6) on the corresponding side. The pressure head mechanism (6) moves above the chip transfer mechanism (5) to pick up the chip, and after picking up the chip, it performs angle compensation on the horizontal and vertical planes; the mounting platform (7) performs angle compensation on the horizontal plane of the substrate; The pressure head mechanism (6) moves to the welding station of the mounting platform (7), the mounting platform (7) performs dimensional compensation on the substrate in the direction perpendicular to the length of the crossbeam (12); the mounting platform (7) drives the chip to press down onto the substrate; at the same time, the mounting platform (7) heats the substrate, and after a preset time, cools the finished chip to complete the welding of the finished chip.

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