A gradient Si p Roll forming method of Si / Al composite

Abstract

This application discloses a gradient Si p A method for rolling Al composite materials. The rolling method includes the following steps: rolling different contents of Si... p Al is processed into thin sheets, sandblasted, and then the surface is cleaned. Then, different amounts of Si are added. p Al wafers are stacked according to design requirements, with different Si contents... p The Al edge is fixed by welding, then encapsulated with aluminum alloy. The well-sealed multilayer plate is vacuum-sealed and heated in a sintering furnace. After heating, it is rolled in a rolling mill. Rolling reduces the Si gradient. p Defects at different interfaces in Al can improve the mechanical and thermophysical properties of the material; the final Si gradient can be controlled according to the thickness of the part. p The rolling thickness of / Al improves both material utilization and production efficiency.

Description

Technical Field

[0001] This application relates to Si p In the field of Al composite materials technology, this invention specifically relates to a gradient Si... p / Al composite material rolling forming method. Background Technology

[0002] Electronic packaging materials are collective materials used to carry components and their interconnections, providing mechanical support, sealing and environmental protection, signal transmission, heat dissipation and shielding. Commonly used electronic packaging materials include ceramic packaging materials with low thermal conductivity and tungsten-copper-aluminum alloy materials with excellent thermal conductivity.

[0003] Existing electronic packaging materials have limitations in performance and manufacturing processes, necessitating the development of new packaging materials to overcome the shortcomings of traditional materials. Si p Al composite materials have broad application prospects in the electronics field due to their advantages such as high thermal conductivity, matching coefficient of thermal expansion with chips, readily available and lightweight raw materials.

[0004] CN102358924B discloses a method for preparing gradient silicon-aluminum alloy electronic packaging materials via rapid hot pressing. The method involves mixing silicon-aluminum alloy powder and pure aluminum powder, then sequentially spreading the mixture of different components into a mold, and proceeding under an argon atmosphere to obtain the gradient silicon-aluminum alloy material. The gradient silicon-aluminum alloy material prepared by this process... p The / Al specification is small, and its success has only been achieved in the laboratory. It cannot meet the needs of widespread adoption. Moreover, the existing composite materials have low thermal conductivity, low elastic modulus, poor sealing performance, and low coefficient of thermal expansion, which cannot meet the stability and reliability requirements of electronic components.

[0005] In summary, a new gradient Si is urgently needed. p / Al composite material molding methods can be used to obtain high thermal conductivity, high elastic modulus, high sealing performance, and mild changes in the coefficient of thermal expansion, thereby improving the stability and reliability of electronic components. Summary of the Invention

[0006] This application provides a gradient Si p The Al composite material rolling forming method aims to solve the problems of low thermal conductivity, low elastic modulus, and large fluctuations in sealing performance due to the thermal expansion coefficient of the packaging material in existing composite materials, which cannot meet the stability and reliability requirements of electronic components.

[0007] In a first aspect, this application proposes a gradient Si p A method for rolling Al composite materials, characterized in that the rolling method includes the following steps:

[0008] Different Si contents p / Al is processed into a thin plate of a certain thickness according to design requirements, and then the surface of the thin plate is sandblasted. After sandblasting, the surface is cleaned with cleaning agents such as alcohol or acetone.

[0009] Different Si p The thin plates containing the content are stacked in sequence and then fixed by spot welding.

[0010] The fixed gradient Si p / Al uses aluminum plates for encapsulation and then vacuum sinterstensible the treated multilayer board.

[0011] The heated multilayer board is rolled, then kept warm, and rolling continues until the preset thickness is reached.

[0012] Furthermore, the Si p Si in Al composites p The mass fraction should not exceed 50%, the thickness of each layer should not exceed 20mm, and the gradient should usually not exceed 5 layers.

[0013] Furthermore, each layer of Si p The Al plate is sandblasted with 60-120 mesh glass beads, and then the sandblasted sheet is cleaned with high-purity alcohol or acetone. After the cleaned sheets are stacked in sequence, the edges are spot welded.

[0014] Furthermore, the encapsulation process specifically involves:

[0015] Using 1-series aluminum to grade Si p / Al composite material is used for sealing;

[0016] After sealing, a stainless steel vacuum pipe is welded in place to perform vacuuming.

[0017] The aluminum plate is 2-4mm thick, and the inner diameter of the extraction pipe is 5mm-10mm.

[0018] Furthermore, the heated gradient Si p / Al is rolled, then held at a temperature, and after the holding period, rolling continues. Specifically...

[0019] Gradient Si for sealing p / Al is kept at 400℃-480℃ for 3-6 hours;

[0020] Heat to 530℃-570℃, hold for 3-6 hours, and then roll.

[0021] Furthermore, the specific rolling steps are as follows:

[0022] The first rolling process involves rolling with a deformation rate of 10-15%.

[0023] The temperature is then reduced to 500℃-540℃ and held for 1-2 hours before rolling, with a deformation of 5-10% per pass.

[0024] Repeat the above steps until the desired thickness is achieved, then machine or mill the surface to obtain gradient Si. p / Al composite materials.

[0025] This application has the following beneficial effects: It reduces the gradient Si by rolling. p Defects at different interfaces in Al can be exploited to improve the mechanical and thermophysical properties of the material, resulting in high thermal conductivity, high elastic modulus, high sealing performance, and a moderate change in the coefficient of thermal expansion, thereby enhancing the stability and reliability of electronic components. Furthermore, the final Si gradient can be controlled according to the component thickness. p The rolling thickness of / Al improves both material utilization and production efficiency. Attached Figure Description

[0026] Figure 1 For the gradient Si of this application p Flowchart of the rolling forming method for Al composite materials. Detailed Implementation

[0027] The embodiments of this application are described in detail below, with examples of the embodiments illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0028] In the description of this application, unless otherwise expressly defined, terms such as "setup" and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0029] In the technical solution of this application, the gradient Si is reduced by rolling. p Defects at different interfaces in Al can improve the mechanical and thermophysical properties of materials, resulting in high thermal conductivity, high elastic modulus, high sealing performance, and a moderate change in the coefficient of thermal expansion, thereby improving the stability and reliability of electronic components. Furthermore, the final Si gradient can be controlled according to the component thickness. p The rolling thickness of / Al improves both material utilization and production efficiency.

[0030] Example 1

[0031] Please see Figure 1 The gradient Si of this application p / Al composite material rolling forming method includes the following steps:

[0032] S1, Different amounts of Si p / Al is processed into a thin plate of a certain thickness according to design requirements, and then the surface of the thin plate is sandblasted. After sandblasting, the surface is cleaned with cleaning agents such as alcohol or acetone.

[0033] S2, different Si p The thin plates containing the content are stacked in sequence and then fixed by spot welding.

[0034] S3, fix the gradient Si p / Al uses aluminum plates for encapsulation and then vacuum sinterstensible the treated multilayer board.

[0035] S4. Roll the heated multi-layer aluminum plate, keep it warm after rolling, and continue rolling after the heat preservation is completed until the preset thickness is reached.

[0036] In the specific implementation of the rolling forming method, in step S1, different contents of Si are... p / Al is processed into a thin plate of a certain thickness according to design requirements, and then the surface of the thin plate is sandblasted. After sandblasting, the surface is cleaned with cleaning agents such as alcohol or acetone.

[0037] It needs to be explained that different amounts of Si p / Al is processed into a thin plate of a certain thickness according to design requirements, wherein Si p Si in Al composites p The mass fraction can be 0%, 10%, 20%, 30%, or 40%, 50%, etc. The specific mass fraction can be adjusted and selected according to the different requirements of the required material's strength, thermal conductivity, and coefficient of thermal expansion. Simultaneously, Si can be added according to different requirements. p The thickness of the Al composite material is processed into thin plates of a certain thickness by rolling and cutting. The thickness of the thin plates can be 2mm, 4mm, 6mm, or 10mm. The specific thickness can be set and rolled according to the requirements.

[0038] Thus, after the Si is manufactured p / Al composite material, avoid Si p Al composite materials undergo secondary processing to reduce production costs.

[0039] Then in step S1, Si will be... p After the Al composite material is processed into a thin plate of a certain thickness, the surface of the thin plate is sandblasted. After sandblasting, the surface is cleaned with cleaning agents such as alcohol or acetone. The cleaning agents such as alcohol or acetone can quickly remove the traces remaining on the surface of the thin plate. At the same time, alcohol and acetone have good volatility and will not leave residues on the surface of the thin plate. On the one hand, it can quickly remove particles from the surface of the thin plate, and on the other hand, it can ensure the strength of the thin plate.

[0040] In step S2, different Sip Thin plates with varying content are stacked sequentially and then fixed by spot welding to improve Si content. p Strength, thermal conductivity, and coefficient of thermal expansion of Al composite materials.

[0041] In steps S3 and S4, the fixed gradient Si p / Al uses aluminum plates for encapsulation treatment, and the treated multilayer board is vacuum sintered; the heated multilayer board is rolled, and then kept at a certain temperature. After the temperature is kept at a certain temperature, rolling continues until the preset thickness is reached.

[0042] Among them, the use of encapsulation sleeves can improve the performance of Si. p / Al provides protection against contact between the rolls and Si p / Al direct contact, eliminating Si p / Al plate surface cracking and reduced cracking amount, improve rolling yield.

[0043] Vacuum sintering of the treated multilayer board reduces the presence of oxygen and other impurities, thereby reducing the formation of pores and inclusions. This helps to improve the density and bonding strength between different gradients, thus improving its mechanical and thermal properties.

[0044] Si is sintered in vacuum p The high thermal energy and surface diffusivity between Al material particles are beneficial to particle bonding, and can promote grain growth and grain boundary clarity, thereby improving the mechanical and thermal properties of the material.

[0045] The multilayer board after vacuum sintering is rolled and then heat-preserved. After heat preservation, rolling continues until the preset thickness is reached. By controlling the stress and deformation of the multilayer board through heat preservation and rolling, the interfacial bonding between different gradients is promoted, thereby improving the material performance.

[0046] Example 2

[0047] Si p Si in Al composites p The mass fraction should not exceed 50%, the thickness of each layer should not exceed 20mm, and the gradient should usually not exceed 5 layers.

[0048] In this embodiment, Si p Si in Al composites p The mass fraction of Si is not greater than 50%. p The mass fraction of Si is no more than 50% to balance the material's performance and cost. p It can provide a coefficient of thermal expansion and high thermal conductivity that match electronic components, while the aluminum matrix provides good toughness and strength.

[0049] The gradient typically has no more than 5 layers, specifically 4, 3, 2, or 1 layer, depending on the actual needs. By controlling the number of gradient layers, the cost of materials and processing difficulty can be reduced while maintaining certain performance.

[0050] Example 3

[0051] Each layer of Si p The Al plate is sandblasted with 60-120 mesh glass beads, and then the sandblasted sheet is cleaned with high-purity alcohol or acetone. After the cleaned sheets are stacked in sequence, the edges are spot welded.

[0052] In this embodiment, each Si layer p The Al plate is sandblasted with 60-120 mesh glass beads, and then the sandblasted sheet is cleaned with high-purity alcohol or acetone. After the cleaned sheets are stacked in sequence, the edges are spot welded.

[0053] It should be noted that by using 60-120 mesh glass spheres for surface sandblasting, followed by cleaning with high-purity alcohol or acetone, most of the dust and tiny particles on the surface can be removed without causing damage or pollution. This facilitates the smooth progress of subsequent manufacturing and assembly processes and increases surface roughness.

[0054] Sandblasting can increase the surface roughness of the board, improving its adhesion. Furthermore, sandblasting can effectively remove silicon (Si). p / Al removes dirt, oxide layer and other impurities from the surface of the board, making the board surface cleaner.

[0055] After cleaning, the thin plates are stacked in sequence and then spot-welded at their edges to fix them together. This can improve the structural strength and form strong weld points at the edges of the thin plates, thereby improving the overall strength and stability of the structure. It also reduces the misalignment of the thin plates during encapsulation and rolling, which can lead to uneven bonding at the interfaces of different gradients.

[0056] Example 4

[0057] The specific process for handling envelopes is as follows:

[0058] Using 1-series aluminum to grade Si p / Al composite material is used for sealing;

[0059] After sealing, a stainless steel vacuum pipe is welded in place to perform vacuuming.

[0060] The aluminum plate is 2-4mm thick, and the inner diameter of the extraction pipe is 5mm-10mm.

[0061] In this embodiment, using 1-series aluminum effectively prevents the penetration of gases, liquids, or moisture, protecting the internal materials from the influence of the external environment. Furthermore, during rolling, it can protect the Si...p / Al surface, reduce Si p / Al addresses the cracking problem caused by plastic deformation, improving rolling yield and efficiency.

[0062] Vacuuming can effectively remove gases and impurities from the cladding, improve the thermal conductivity of the material, and make heating and cooling processes in a vacuum environment more efficient, thus improving the performance of Si. p Strength, thermal conductivity, and coefficient of thermal expansion of Al composite materials.

[0063] In this embodiment, the thickness of the aluminum plate can be 2mm, 3mm or 4mm, and the inner diameter of the exhaust pipe can be 5mm, 6mm, 7mm, 8mm, 9mm or 10mm. The specific values ​​can be selected and adjusted according to actual needs.

[0064] Example 5

[0065] heated gradient Si p / Al is rolled, then held at a temperature, and after the holding period, rolling continues. Specifically...

[0066] Gradient Si for sealing p / Al is kept at 400℃-480℃ for 3-6 hours;

[0067] Heat to 530℃-570℃, hold for 3-6 hours, and then roll.

[0068] In this embodiment, the heated gradient Si p / Al is rolled, then held at temperature, and after the holding period, rolling continues. Specifically, this involves rolling the sealed gradient Si. p Holding Al at 400℃-480℃ for 3-6 hours can improve the internal grain structure of rolled metal materials. The 3-6 hour holding treatment can cause the grains to recrystallize, thereby improving the strength and toughness of the material.

[0069] Heating to 530℃-570℃ and holding for 3-6 hours before rolling helps improve the plasticity of the material, making it easier to be shaped into the desired form. Through heating and holding, the grains of the metal material are refined, thereby improving its plasticity, reducing stress concentration during the rolling process, making the material easier to plastically deform, and improving the efficiency and forming quality of rolling.

[0070] After being heated and kept warm, the grains of the metal material recrystallize, eliminating the original deformed structure and stress, thereby improving its rolling yield, mechanical and thermophysical properties.

[0071] Example 6

[0072] The specific steps of rolling are as follows:

[0073] The first rolling process involves rolling with a deformation rate of 10-15%.

[0074] The temperature is then reduced to 500℃-540℃ and held for 1-2 hours before rolling, with a deformation of 5-10% per pass.

[0075] Repeat the above steps until the desired thickness is achieved, then machine or mill the surface to obtain gradient Si. p / Al composite materials.

[0076] In this embodiment, the deformation amount of the first pressing is 10-15%, which can refine the grains, thereby increasing the strength of the material, and at the same time make the grain orientation of the metal material more uniform, thereby improving its plasticity. Controlling the deformation amount can reduce surface defects of the metal material and improve its surface smoothness and flatness.

[0077] During rolling, the temperature is lowered to 500℃-540℃ and held for 1 to 2 hours. The deformation amount per pass is 5%-10%. By reducing the temperature and controlling the deformation amount, the mechanical properties of the metal material can be effectively improved, grain recrystallization can be promoted, thereby eliminating residual stress in the material and improving its plasticity and toughness.

[0078] Insulating the material for 1 to 2 hours reduces the formation of cracks and defects. By controlling the temperature and deformation appropriately, the grain size and shape inhomogeneity of the material can be reduced, thereby improving its surface finish and overall appearance.

[0079] Furthermore, lowering the temperature and controlling the deformation amount can reduce energy consumption, lower production costs, and be more environmentally friendly. In general, lowering the temperature to 500℃-540℃, holding it at that temperature for 1 to 2 hours during rolling, and reducing the deformation amount per pass to 5%-10% can improve the properties of metallic materials, enhance product quality, and offer economic and environmental advantages.

[0080] The foregoing has described specific embodiments of this specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0081] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0082] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0083] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A gradient Si p A method for rolling Al composite materials, characterized in that... The rolling forming method includes the following steps: Different Si contents p / Al is processed into a thin plate of a certain thickness according to design requirements, and then the surface of the thin plate is sandblasted. After sandblasting, the surface is cleaned with alcohol or acetone cleaner. Different Si p The thin plates containing the content are stacked in sequence and then fixed by spot welding. The fixed gradient Si p / Al uses aluminum plates for encapsulation and then vacuum sinterstensible the treated multilayer board. The heated multi-layer aluminum sheet is rolled, then kept at a constant temperature. After the temperature is maintained, rolling continues until the preset thickness is reached. After the heat preservation period, rolling continues, specifically for the sealed gradient Si. p Al is held at 400℃-480℃ for 3-6 hours; then heated to 530℃-570℃ and held for 3-6 hours before rolling. The process involves rolling with a deformation of 10-15% in the first pass; then the temperature is lowered to 500℃-540℃ and held for 1-2 hours for rolling, with a deformation of 5-10% per pass; the above steps are repeated until the required thickness is achieved, and then the surface is machined or milled to obtain the gradient SiP / Al composite material.

2. The Si according to claim 1 p A method for rolling Al composite materials, characterized in that... The Si p Si in Al composites p The mass fraction should not exceed 50%, the thickness of each layer should not exceed 20mm, and the gradient should not exceed 5 layers.

3. The Si according to claim 1 p A method for rolling Al composite materials, characterized in that... Each layer of Si p The Al plate is sandblasted with 60-120 mesh glass beads, and then the sandblasted sheet is cleaned with high-purity alcohol or acetone. After the cleaned sheets are stacked in sequence, the edges are spot welded.

4. The Si according to claim 1 p A method for rolling Al composite materials, characterized in that... The specific process of the envelope processing is as follows: A 1-series aluminum alloy is used to seal gradient SiP / Al composite materials; After sealing, a stainless steel vacuum pipe is welded in place to perform vacuuming. The aluminum plate is 2-4mm thick, and the inner diameter of the extraction pipe is 5mm-10mm.

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