Microfluidic chip preparation mold, preparation method thereof and microfluidic chip preparation method

Abstract

The application provides a micro-fluidic chip preparation mold, a preparation method thereof and a micro-fluidic chip preparation method. The micro-fluidic chip preparation mold comprises an outer support and a base template. The preparation method of the micro-fluidic chip preparation mold comprises the following steps: after a groove is formed on a substrate, the base template with a forming surface is fixed in the groove, another substrate is covered on the groove to form a cavity, and a through hole is formed in the cavity. The micro-fluidic chip preparation method comprises the following steps: injection molding is performed in the cavity of the micro-fluidic chip preparation mold, then the micro-fluidic chip is cooled and formed, and the micro-fluidic chip is separated, so that the micro-fluidic chip matched with the forming surface of the base template can be obtained. The application combines the advantages of the industrial injection molding method and the semiconductor manufacturing process, the required pressure for injection molding is small, the requirement for equipment and the mold is low, the roughness of the mold is low, the micro-fluidic chip with small size microstructure can be formed, the development cost and the manufacturing period of the mold are reduced, the mold is convenient to replace, and the operation and production are easy.

Description

Technical Field

[0001] This invention relates to the field of microfluidic chip manufacturing, specifically to a microfluidic chip fabrication mold and its fabrication method, and a microfluidic chip fabrication method. Background Technology

[0002] Microfluidic chip technology integrates basic operational units such as sample pretreatment, reaction, separation, and detection in biological, chemical, and medical analysis processes onto a chip only a few square centimeters in size. A network of microchannels connects each operational step, automating the entire analytical process. Microfluidic chips feature controllable fluid flow, low sample consumption, fast reaction speeds, and ease of integration, and are widely used in clinical diagnostics and disease screening in hospital surgeries, emergency rooms, intensive care units, and chronic disease prevention and treatment.

[0003] Materials that can be processed into microfluidic chips include glass, silicon, and polymers. Among these, polymers, with their wide variety, ease of processing, and low cost, have attracted considerable interest from researchers. Polydimethylsiloxane (PDMS), a thermosetting material, has become one of the most widely used materials in microfluidic chips due to its good light transmittance and simple processing. A mixture of PDMS precursor and curing agent at a mass ratio of 10:1 is poured onto the surface of a microfluidic chip mold, stirred thoroughly, and then poured onto the mold. The mold is then placed in a vacuum drying oven and cured at 90°C for 40 minutes. After cooling to room temperature, the cured PDMS is separated from the mold, yielding a microfluidic chip with a surface structure consistent with the mold. However, its poor heat resistance often limits its use as a single material in microfluidic chip molding. The hydrophobicity of PDMS surface makes it difficult for liquids such as buffer solutions to penetrate its structure, requiring additional surface modification before use. In polymerase chain reaction (PCR) experiments, droplet evaporation occurs during temperature cycling, significantly limiting its application. In addition, due to the cumbersome steps of the molding process and the fact that it can only be used after various post-processing steps, molding is not suitable for mass continuous production.

[0004] Considering factors such as processability, material cost, and biochemical reactions with reagents, medical microfluidic chips are generally made of polymer materials. The manufacturing of polymer microfluidic chips mainly involves methods such as micromechanical or laser-direct polymer molding, photolithographic electroforming (LIGA) replication, and mold replication molding. To reduce processing costs and maintain consistency, mass production of polymer microfluidic chips typically employs injection mold replication molding. The key to injection molding lies in the processing of the injection mold. Microfluidic chips have multiple functional areas, which are reflected in the injection mold as corresponding macroscopic structures and local microstructures. The processing of the macroscopic structure of the injection mold is basically the same as that of ordinary molds; the core of injection mold processing is the processing of the microstructure. When using CNC machining or laser processing to create microfluidic chip injection molds at the micrometer or even nanometer scale, the precision often fails to meet requirements, and the uniformity and roughness of the resulting molds are poor, leading to surface roughness of the molded chips that does not meet usage requirements.

[0005] In view of this, both PDMS casting for microfluidic chips and industrial injection molding using micromachining molds have certain drawbacks. To address this issue, researchers are using methods from semiconductor manufacturing processes to compensate for the shortcomings of industrial injection molding. Using photolithography, a layer of photoresist is first uniformly coated onto a substrate. The thinner and more uniform the photoresist layer on the substrate surface, the more refined the pattern produced. Photoresists are classified into positive and negative photoresists based on their photoreactivity. The former decomposes upon exposure to light, leaving the pattern in the unexposed areas, while the latter exposes the pattern in the exposed areas. Exposure is achieved through light irradiation, followed by the application of a developer to remove the photoresist from the uncovered areas, and then etching.

[0006] Wet etching utilizes a chemical reaction between a solution and a thin film to remove the areas to be etched, thus achieving the etching purpose. Photoresist is typically used as a selective removal material on a mask, and the mask pattern can be etched into glass, silicon, or quartz substrates. Wet etching of glass usually uses hydrofluoric acid as the etching solution, which is generally further diluted with water or a buffer solvent to reduce the etching rate of oxides, facilitating control of the etching rate and substrate uniformity. Therefore, etching substrates using this method can yield substrates with fine surface structures, precise dimensions, and low roughness, with precision down to the micrometer or even nanometer scale.

[0007] In summary, microfluidic chips are currently mostly fabricated using thermosetting material molding and thermoplastic material injection molding. However, thermosetting materials such as PDMS require complex post-processing steps after molding before they can be used normally, such as vacuuming to remove air bubbles and surface modification to change hydrophilicity and hydrophobicity. Furthermore, PDMS materials suffer from problems such as difficulty in removing air bubbles and significant surface solution evaporation during use. Injection molding molds are difficult to process into micro-sized structures, showing limitations in micro- and nano-scale micro- and nano-structures. While Chinese patent application number 201810335107.X discloses a method combining photolithography, etching, and electroforming processes with industrial injection molding, an additional metal layer needs to be applied to the substrate template surface, making the process cumbersome and increasing manufacturing costs. Summary of the Invention

[0008] This invention is made to solve the above-mentioned problems. Its purpose is to combine the advantages of industrial injection molding methods and semiconductor manufacturing processes to develop a simple method that uses the etched substrate template directly as an injection mold, thereby providing a microfluidic chip fabrication mold and its fabrication method, as well as a microfluidic chip fabrication method.

[0009] This invention provides a method for preparing a microfluidic chip fabrication mold, characterized by its use in preparing a microfluidic chip fabrication mold for fabricating microfluidic chips. The method for preparing the microfluidic chip fabrication mold includes the following steps: S10, taking two substrates, respectively designated as a first substrate and a second substrate, and forming a groove on the surface of one of them; S20, setting a base template with a molding surface in the groove, wherein the pattern of the molding surface is opposite to and matches the pattern of the surface of the microfluidic chip to be prepared; S30, splicing the first substrate and the second substrate along the groove to form a structure with an internal cavity, designated as an outer support member; S40, forming a channel on the outer support member, designated as an injection molding channel, to connect the cavity with the external space of the outer support member.

[0010] The method for preparing a microfluidic chip fabrication mold provided by the present invention may also have the following features: step S20 includes the following sub-steps: S21, using semiconductor processing technology, etching one side of the substrate template to form a structure that is opposite in texture and matches the surface pattern of the microfluidic chip to be prepared, denoted as the molding surface; S22, cutting the substrate template according to the size of the groove, so that the substrate template is embedded in the groove with the molding surface facing upward; S23, pouring adhesive into the groove without submerging the molding surface on the substrate template, so that the substrate template is adhered to the groove.

[0011] The method for preparing a microfluidic chip fabrication mold provided by the present invention may also have the following features: step S21 includes the following sub-steps: S211, depositing a corrosion-resistant material on the surface of a substrate template to form a thin film; S212, photolithographically etching a micro-recessed dot matrix on the deposited thin film; S213, immersing the substrate template in an etching solution and etching a distance along the micro-recessed dot matrix into the substrate template; S214, placing the etched substrate template in a cleaning solution to remove the deposited thin film, thereby obtaining a substrate template with a micro-recessed dot matrix, wherein the side of the substrate template with the micro-recessed dot matrix has opposite and matching patterns on the surface of the microfluidic chip to be prepared, and is referred to as the forming surface.

[0012] The method for preparing a microfluidic chip fabrication mold provided by the present invention may also have the following features: in step 23, the adhesive is a thermosetting material, including PDMS, AB glue or UV glue, and the adhesive adheres the substrate template to the groove.

[0013] This invention provides a microfluidic chip fabrication mold, characterized by being prepared using any of the aforementioned microfluidic chip fabrication mold preparation methods, and used for fabricating microfluidic chips. The microfluidic chip fabrication mold includes: an outer support member having a cavity inside and an injection channel connecting the cavity to the external space of the outer support member; and a substrate template disposed inside the cavity, one surface of which is a molding surface, the pattern of which is opposite to and matches the pattern of the surface of the microfluidic chip to be fabricated.

[0014] The microfluidic chip fabrication mold provided by the present invention may also have the following features: the outer support includes a first base plate and a second base plate, one of which has a groove on its surface, and the two are spliced ​​along the groove to form an outer support with a cavity, the depth of the groove is greater than the thickness of the base template, and the difference between the depth of the groove and the thickness of the base template is the thickness of the microfluidic chip to be fabricated.

[0015] The microfluidic chip fabrication mold provided by the present invention may also have the following feature: wherein an injection channel is provided on the first base plate or the second base plate, and the injection channel connects the cavity and the external space of the outer support.

[0016] The microfluidic chip fabrication mold provided by the present invention may also have the following feature: wherein the first base plate and the second base plate are jointly provided with an injection channel, and the injection channel connects the cavity with the external space of the outer support.

[0017] This invention provides a method for fabricating a microfluidic chip, characterized by using the microfluidic chip fabrication mold of any of the foregoing claims for fabricating a microfluidic chip.

[0018] The microfluidic chip fabrication method provided by this invention may also have the following features: the microfluidic chip fabrication method includes the following steps: S50, injecting a molten thermoplastic polymer into the cavity inside the outer support through an injection channel; S60, after cooling, opening the first and second base plates of the outer support, separating the substrate template and the polymer that has cooled and formed thereon, and the polymer that has cooled and formed is the fabricated microfluidic chip.

[0019] The role and effect of invention

[0020] The microfluidic chip fabrication mold and its fabrication method according to the present invention combine the advantages of industrial injection molding and semiconductor manufacturing processes. Therefore, the present invention can quickly and cost-effectively process microfluidic chip fabrication molds and fabricate microfluidic chips, with high precision and easy demolding. At the same time, its steps are simple, practical and easy to mass-produce. Attached Figure Description

[0021] Figure 1 This is an exploded view of the microfluidic chip fabrication mold in Embodiment 1 of the present invention when it does not contain a substrate template;

[0022] Figure 2 This is a schematic diagram of the planar structure of the microfluidic chip fabrication mold in Embodiment 1 of the present invention when the second base plate is not present;

[0023] Figure 3 This is a flowchart of the method for preparing the microfluidic chip fabrication mold in Embodiment 2 of the present invention;

[0024] Figure 4 This is a schematic diagram of the preparation process of the substrate template with a molding surface in the preparation method of the microfluidic chip preparation mold in Embodiment 2 of the present invention;

[0025] Figure 5 This is a flowchart of the microfluidic chip fabrication method in Embodiment 3 of the present invention;

[0026] Figure 6 This is a flowchart of the injection molding process of the microfluidic chip fabrication method in Embodiment 3 of the present invention;

[0027] Figure 7 This is a schematic diagram of the injection molding process of the microfluidic chip fabrication method in Embodiment 3 of the present invention. Detailed Implementation

[0028] To make the technical means, creative features, objectives and effects of the present invention easy to understand, the following embodiments, in conjunction with the accompanying drawings, specifically illustrate a microfluidic chip fabrication mold and its fabrication method, as well as a microfluidic chip fabrication method.

[0029] <Example 1>

[0030] This embodiment provides a mold for fabricating microfluidic chips.

[0031] Figure 1 This is an exploded view of the microfluidic chip fabrication mold in Embodiment 1 of the present invention when it does not contain a substrate template; Figure 2 This is a schematic diagram of the planar structure of the microfluidic chip fabrication mold without the second base plate in Embodiment 1 of the present invention.

[0032] like Figure 1-2 As shown, this embodiment provides a microfluidic chip fabrication mold 100 for fabricating microfluidic chips. The microfluidic chip fabrication mold 100 includes an outer support 10 and a substrate template 20.

[0033] The outer support member 10 includes a first base plate 11 and a second base plate 12, both made of metal.

[0034] A groove 111 is provided on the surface of the first base plate 11, and an injection channel 112 is also provided on the first base plate 11 to connect the groove 111 and the external space of the first base plate 11.

[0035] In this embodiment, the groove 111 is rectangular or square in shape to facilitate the subsequent embedding of the base template 20. The groove 111 is 10-50mm long, 10-50mm wide, and 20-50mm deep.

[0036] In this embodiment, the inner diameter of the infusion channel 112 is 1-5 mm.

[0037] The first base plate 11 and the second base plate 12 are spliced ​​together along one side of the groove 111 to form an outer support member 10 with an internal cavity (not shown in the figure), and the injection channel 112 connects the cavity with the external space of the outer support member 10.

[0038] In this embodiment, the first base plate 11 and the second base plate 12 also have corresponding matching through holes (not shown in the figure), and the two are fastened by bolts passing through the through holes.

[0039] The base template 20 is disposed in the groove 111, and its shape is quadrilateral, circular or sector-shaped, with a volume of 2000-125000 mm². 3The substrate template 20 is made of borosilicate glass, silicon, or quartz (in this embodiment, it is borosilicate glass with a hardness of 480HK). One surface of the substrate template 20 is a molding surface 21. The pattern of the molding surface 21 is opposite to and matches the pattern of the microfluidic chip surface to be prepared. The molding surface 21 faces upward and is oriented in the same direction as the opening of the groove 111. The thickness of the substrate template 20 is less than the thickness of the groove 111, and the difference between the two is the thickness of the microfluidic chip to be prepared. The substrate template 20 is located in the internal cavity of the outer support member 10 through the splicing of the first base plate 11 and the second base plate 12.

[0040] In this embodiment, the base template 20 is bonded to the groove 111 by an adhesive, which is a thermosetting material such as PDMS, AB glue or UV glue.

[0041] <Example 2>

[0042] This embodiment provides a method for preparing a mold for fabricating microfluidic chips.

[0043] Figure 3 This is a flowchart of the method for preparing the microfluidic chip fabrication mold in Embodiment 2 of the present invention; Figure 4 This is a schematic diagram of the preparation process of the substrate template with a molding surface in the preparation method of the microfluidic chip preparation mold in Embodiment 2 of the present invention.

[0044] like Figure 3-4 As shown, this embodiment provides a method for fabricating a microfluidic chip fabrication mold, used to fabricate the microfluidic chip fabrication mold 100 provided in <Example 1>. The method for fabricating the microfluidic chip fabrication mold in this embodiment includes the following steps:

[0045] S10, Take two substrates, which are respectively called the first substrate and the second substrate, and make a groove on the surface of the first substrate.

[0046] S211, take a substrate template, deposit a 100nm chromium layer on its surface, and then uniformly spin-coat photoresist on it;

[0047] S212, after exposing the substrate template surface with a mask, the photoresist in the unexposed part is dissolved and washed away, thereby etching a micro-recession array with a diameter of 1-200μm in the chromium layer and photoresist on the substrate template. Then, the substrate template surface is washed with deionized water, dried with nitrogen, developed, heated and naturally cooled.

[0048] S213, the substrate template is immersed in the etching solution, so that the etching solution etches a certain distance into the substrate template along the micro-dimpled lattice. The etching process requires continuous stirring and shaking. The etching time is adjusted according to the required etching depth. Different etching solutions and concentrations have different erosion rates on glass (hydrofluoric acid solution is selected in this embodiment). The appropriate type, concentration and etching time of the etching solution are selected according to the required etching size.

[0049] S214, after etching, the substrate template is placed in toluene solution to clean away excess photoresist and chromium layer, and then ultrasonic cleaning is performed to obtain a substrate template with micro-recessed dot matrix. The side of the substrate template with micro-recessed dot matrix has opposite and matching pattern concavity and convexity to the surface of the microfluidic chip to be prepared, and is called the forming surface.

[0050] S22, the base template is cut according to the size of the groove so that the base template is embedded in the groove with the forming surface facing upward;

[0051] S23, pouring adhesive into the groove without submerging the molding surface on the base template, so that the base template is bonded to the groove, wherein the adhesive is a thermosetting material such as PDMS, AB glue or UV glue.

[0052] S30, the first base plate and the second base plate are spliced ​​together along the groove to form a structure with an internal cavity, which is called the outer support member;

[0053] S40, a channel is opened on the outer support, which is called the injection channel, so that it connects the cavity with the external space of the outer support to obtain the microfluidic chip fabrication mold.

[0054] In this embodiment, the injection channel is located entirely within the first base plate of the outer support and extends through the first base plate, connecting the groove with the space outside the first base plate.

[0055] In steps S211-S23 of a variation of this embodiment, multiple substrate templates can be etched, and the etched dimensions are all different. Then, the multiple substrate templates are fixed in the groove of the first base plate, so that the microfluidic chip prepared with this mold has patterned structures of different sizes.

[0056] For ease of explanation, the same structures as in <Example 1> are given the same names and the same descriptions are omitted in this embodiment.

[0057] <Example 3>

[0058] This embodiment provides a method for fabricating a microfluidic chip.

[0059] Figure 5 This is a flowchart of the microfluidic chip fabrication method in Embodiment 3 of the present invention.

[0060] like Figure 5 As shown, this embodiment provides a microfluidic chip fabrication method. This method uses the microfluidic chip fabrication mold from Example 1, prepared by the microfluidic chip fabrication mold preparation method provided in Example 2, to fabricate a microfluidic chip. The microfluidic chip fabrication method includes the following steps:

[0061] S50, through the injection channel, injects molten thermoplastic polymer into the cavity inside the outer support;

[0062] S60. After cooling, open the first and second base plates of the outer support to separate the substrate template and the polymer that has cooled and formed on it. The polymer that has cooled and formed is the microfluidic chip that has been prepared.

[0063] In this embodiment, the polymer in step S50 is any one of thermoplastic materials such as PS, PE, PP or PMMA.

[0064] Figure 6 This is a flowchart of the injection molding process of the microfluidic chip fabrication method in Embodiment 3 of the present invention; Figure 7 This is a schematic diagram of the injection molding process of the microfluidic chip fabrication method in Embodiment 3 of the present invention.

[0065] like Figure 6-7 As shown, in this embodiment, the injection molding process in step S50 includes the following sub-steps:

[0066] S51 connects the injection molding machine and the air compressor using an air cable;

[0067] S52, fill the barrel of the injection molding machine with high molecular thermoplastic material granules, and it is best to fill the barrel each time.

[0068] S53, turn on the injection molding machine heating system, adjust the temperature to the required temperature range for processing polymer thermoplastic materials, and select the corresponding melting temperature. For example, select the processing temperature of polystyrene (PS) material as 180℃ to 200℃.

[0069] S54. Adjust the air pressure according to the condition of the polymer thermoplastic material to ensure that it is injected evenly into the mold. The pressure gauge of the pressure regulator displays the current working pressure. The required air pressure is 0.35-0.85MPa. Too low air pressure will cause defects in the injection molded product, and too high air pressure will damage the base template.

[0070] For S55, the optimal distance between the opening of the injection channel and the injection nozzle of the injection molding machine is about 5cm. After aligning the opening of the injection channel with the injection nozzle of the injection molding machine, press the injection switch of the injection molding machine until the injection process is completed.

[0071] For ease of explanation, the same structures as in <Example 1> are given the same names and the same descriptions are omitted in this embodiment.

[0072] The role and effect of the embodiments

[0073] The microfluidic chip fabrication mold and its fabrication method provided in the embodiments of the present invention, and the microfluidic chip fabrication method, by using the microfluidic chip fabrication mold, the formed microfluidic chip not only inherits the advantages of low surface roughness and high precision of the substrate template, but also has high consistency with the substrate template, and can achieve mass production. Moreover, the forming process is simple and convenient, easy to operate, and has high accuracy and precision.

[0074] The embodiments of the present invention combine the advantages of industrial injection molding and semiconductor manufacturing processes, resulting in low roughness of the substrate template and the ability to form small-sized microstructures.

[0075] The advantages of embodiments of the present invention also include the ability to simultaneously embed two or more substrate templates etched with microstructures of different sizes into the grooves, thereby obtaining structures of different sizes on a single microfluidic chip to achieve different applications. Furthermore, this method significantly reduces machining steps, resulting in a substantial reduction in processing costs. The surface pattern fineness of the substrate template can be maintained at the micrometer level for extended periods, further reducing processing and substrate template manufacturing costs, offering good repeatability, and shortening the production cycle.

[0076] The embodiments of the present invention reduce the development cost and manufacturing cycle of the substrate template, make it easy to replace the substrate template, and facilitate mass production.

[0077] The fineness of the pattern on the substrate template in the embodiments of the present invention can be maintained at the micrometer and submicrometer level for a long time, with good repeatability and shortened production cycle.

[0078] The embodiments of the present invention do not require plating a metal layer on the etched substrate template, eliminating cumbersome processing steps, simplifying the manufacturing process, and improving economy and practicality.

[0079] In embodiments of the present invention, thermosetting materials such as PDMS are used to coat the substrate template, which can reduce the demolding difficulties caused by product shrinkage due to temperature changes during demolding.

[0080] Those skilled in the art should understand that this invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to this invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A method for fabricating a microfluidic chip mold, characterized in that, A mold for fabricating microfluidic chips is used to fabricate microfluidic chips, and the fabrication method includes the following steps: S10, Take two substrates, which are respectively called the first substrate and the second substrate, and make a groove on the surface of one of them; S20, a base template with a molding surface is provided in the groove, wherein the pattern of the molding surface is opposite to and matches the pattern of the surface of the microfluidic chip to be prepared, the depth of the groove is greater than the thickness of the base template, and the difference between the depth of the groove and the thickness of the base template is the thickness of the microfluidic chip to be prepared. S30, the first base plate and the second base plate are spliced ​​together along the groove to form a structure with an internal cavity, which is called the outer support member; S40, a channel, denoted as an injection molding channel, is formed on the outer support member to connect the cavity with the external space of the outer support member. Step S20 includes the following sub-steps: S21, using semiconductor processing technology, one side of the substrate template is etched with a structure that is opposite in texture and matches the surface pattern of the microfluidic chip to be prepared, and is called the molding surface; S22, the base template is cut according to the size of the groove so that the base template is embedded in the groove and the forming surface faces upward; S23, pour adhesive into the groove without submerging the molding surface on the base template, so that the base template is adhered to the groove.

2. The method for preparing a microfluidic chip fabrication mold according to claim 1, Its features are: Step S21 includes the following sub-steps: S211, a corrosion-resistant material is deposited on the surface of the substrate template to form a thin film; S212, photolithography is used to create a micro-recessed dot matrix on the deposited thin film; S213, Immerse the substrate template in the etching solution and etch a distance into the substrate template along the micro-dimpled lattice; S214, the etched substrate template is placed in a cleaning solution to remove the deposited thin film, resulting in a substrate template with a micro-recessed dot matrix. The side of the substrate template with the micro-recessed dot matrix has a pattern that is opposite to and matches the surface of the microfluidic chip to be prepared, and is referred to as the molding surface.

3. The method for preparing a microfluidic chip fabrication mold according to claim 1, characterized in that: in, In step 23, the adhesive is a thermosetting material. The thermosetting material includes PDMS, AB glue, or UV glue. The adhesive bonds the base template into the groove.

4. A microfluidic chip fabrication mold, characterized in that, The microfluidic chip fabrication mold is prepared using the fabrication method of any one of claims 1-3, and is used to fabricate microfluidic chips. The microfluidic chip fabrication mold comprises: An outer support member having an internal cavity and an injection channel connecting the cavity to the external space of the outer support member; and A substrate template is disposed inside the cavity, one surface of which is a molding surface. The pattern of the molding surface is opposite to and matches the pattern of the surface of the microfluidic chip to be prepared.

5. The microfluidic chip fabrication mold according to claim 4, characterized in that: in, The external support includes a first base plate and a second base plate, one of which has a groove on its surface, and the two are spliced ​​together along the groove to form the external support having the cavity.

6. The microfluidic chip fabrication mold according to claim 5, characterized in that: in, An injection molding channel is provided on the first base plate or the second base plate. The injection channel connects the cavity to the external space of the outer support.

7. The microfluidic chip fabrication mold according to claim 5, characterized in that: in, The first base plate and the second base plate are both provided with an injection molding channel. The injection channel connects the cavity to the external space of the outer support.

8. A method for fabricating a microfluidic chip, characterized in that, The microfluidic chip fabrication mold according to any one of claims 4-7 is used to fabricate a microfluidic chip.

9. The microfluidic chip fabrication method according to claim 8, characterized in that, Includes the following steps: S50, molten thermoplastic polymer is injected into the cavity inside the outer support through the injection channel; S60, after cooling, open the first and second base plates of the outer support to separate the substrate template and the polymer that has been cooled and formed thereon. The polymer that has been cooled and formed is the microfluidic chip that has been prepared.

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