Resin composition and article thereof

Abstract

The present application discloses a resin composition and an article thereof. The resin composition comprises a prepolymer prepared by a prepolymerization of a mixture, wherein the mixture comprises 100 parts by weight of a first maleimide resin, 40 to 60 parts by weight of a siloxane compound, and 10 to 30 parts by weight of a diamine compound. The first maleimide resin comprises a bisphenol A diphenyl ether bismaleimide. The siloxane compound comprises a compound having a structure represented by Formula (I) and a molecular weight of 2200 to 2600 g / mol. The diamine compound comprises 4-aminophenyl-4-aminobenzoate. The resin composition can be prepared into a resin solution, a prepreg, a resin film, a laminate, or a printed circuit board, and at least one of resin compatibility and X-axis coefficient of thermal expansion is improved.

Description

Technical Field

[0001] This invention relates to a resin composition, and more particularly to a resin composition that can be used to prepare adhesives, prepregs, resin films, laminates or printed circuit boards. Background Technology

[0002] In recent years, with the development of electronic signal transmission methods towards 5G, and the increasing functionality and miniaturization of electronic devices, communication devices, and personal computers, the circuit boards used are also developing towards multi-layering, high-density wiring, and high-speed signal transmission. This places higher demands on the overall performance of circuit substrates such as copper foil substrates. To avoid deformation of the copper foil substrate caused by high-temperature processes during product manufacturing, which could lead to defects in subsequent products and abnormal signal transmission, it is necessary to develop copper foil substrate materials with a low coefficient of thermal expansion. Therefore, solving one or more of the above problems is currently a direction that the industry is actively striving towards. Summary of the Invention

[0003] In view of the problems encountered in the prior art, especially the inability of existing materials to meet one or more of the above-mentioned technical problems, the main objective of the present invention is to provide a resin composition that can overcome at least one of the above-mentioned technical problems and articles made using the resin composition.

[0004] To achieve the above objectives, the present invention discloses a resin composition comprising a prepolymer obtained by a prepolymerization reaction of a mixture, wherein the mixture comprises 100 parts by weight of a first maleimide resin, 40 to 60 parts by weight of a siloxane compound, and 10 to 30 parts by weight of a diamine compound, wherein:

[0005] The first maleimide resin comprises bisphenol A diphenyl ether bismaleimide;

[0006] The siloxane compounds include those with the structure shown in formula (I) and a molecular weight of 2200 to 2600 g / mol.

[0007] Where 26 ≤ n ≤ 32, and n is a positive integer; and

[0008] The diamine compound includes 4-aminophenyl-4-aminobenzoate.

[0009] For example, in one embodiment, the resin composition further comprises a second maleimide resin.

[0010] For example, in one embodiment, the resin composition comprises 100 parts by weight of the prepolymer and 10 to 35 parts by weight of the second maleimide resin.

[0011] For example, in one embodiment, the second maleimide resin comprises polyphenylene maleimide, biphenyl aralkyl maleimide, dielyl nadicimide, or a combination thereof.

[0012] For example, in one embodiment, the resin composition further includes inorganic fillers, flame retardants, curing accelerators, polymerization inhibitors, solvents, silane coupling agents, colorants, toughening agents, or combinations thereof.

[0013] To achieve the above objectives, the present invention also discloses an article made from the aforementioned resin composition, comprising an adhesive, a prepreg, a resin film, a laminate, or a printed circuit board.

[0014] For example, in one embodiment, the aforementioned article has one, more, or all of the following characteristics:

[0015] In the resin compatibility test, after the adhesive was left to stand at room temperature for 3 hours, no stratification occurred; and

[0016] The X-axis coefficient of thermal expansion, measured according to the method described in IPC-TM-6502.4.24.5, is less than or equal to 4.21 ppm / ℃. Detailed Implementation

[0017] To enable those skilled in the art to understand the features and effects of this invention, the terms and expressions used in the specification and claims are explained and defined in general below. Unless otherwise specified, all technical and scientific terms used herein have the ordinary meaning understood by those skilled in the art regarding this invention, and in the event of any conflict, the definitions in this specification shall prevail.

[0018] The theories or mechanisms described and disclosed herein, whether right or wrong, should not in any way limit the scope of the invention, that is, the contents of the invention can be implemented without being limited by any particular theory or mechanism.

[0019] The present invention uses the terms "a," "an," "a," or similar expressions to describe the components and technical features described herein. Such descriptions are merely for convenience and to provide a general meaning regarding the scope of the invention. Therefore, such descriptions should be understood to include one or at least one, and the singular includes the plural, unless clearly otherwise indicated.

[0020] In this article, "or a combination thereof" means "or any combination thereof", and "any one", "any kind", "any one" means "any one", "any kind", "any one".

[0021] In this document, the terms “comprising,” “including,” “having,” “containing,” or any similar terms are open-ended transitional phrases intended to encompass non-exclusive inclusions. For example, a composition or article containing plural elements is not limited to those listed herein but may also include other elements not explicitly listed but typically inherent to the composition or article. Furthermore, unless explicitly stated otherwise, the term “or” is inclusive, not exclusive. For example, the condition “A or B” is satisfied in any of the following cases: A is true (or exists) and B is false (or does not exist); A is false (or does not exist) and B is true (or exists); A and B are both true (or exist). Moreover, in this document, the terms “comprising,” “including,” “having,” and “containing” are interpreted as specifically revealing and simultaneously encompassing conjunctions such as “composed of” and “substantially composed of.”

[0022] In this article, the terms “and,” “with,” “as well as,” or other similar terms are used to connect parallel sentence components, and there is no distinction between primary and secondary components. The meaning of the parallel sentence components does not change after their positions are interchanged.

[0023] In this document, all features or conditions defined in the form of numerical ranges or percentage ranges are for the sake of brevity and convenience only. Accordingly, descriptions of numerical ranges or percentage ranges should be considered as encompassing and specifically revealing all possible subranges and individual values ​​within those ranges, particularly integer values. For example, a range description of "1 to 8" should be considered as specifically revealing all subranges such as 1 to 7, 2 to 8, 2 to 6, 3 to 6, 4 to 8, 3 to 8, etc., particularly subranges defined by all integer values, and should be considered as specifically revealing individual values ​​within those ranges such as 1, 2, 3, 4, 5, 6, 7, 8, etc. Similarly, a range description of "between 1 and 8" should be considered as specifically revealing all ranges such as 1 to 8, 1 to 7, 2 to 8, 2 to 6, 3 to 6, 4 to 8, 3 to 8, etc., including endpoint values. Unless otherwise specified, the foregoing interpretation applies to all content throughout this invention, regardless of its scope.

[0024] If a quantity, concentration, or other numerical value or parameter is expressed as a range, preferred range (or better range), or a series of upper and lower limits, it should be understood that this document has specifically disclosed all ranges consisting of any pair of upper or preferred values ​​(or better values) and lower or preferred values ​​(or better values) of that range, regardless of whether such ranges are disclosed separately. Furthermore, when a range of numerical values ​​is mentioned herein, unless otherwise stated, the range should include its endpoints and all integers and fractions within the range.

[0025] In this document, numerical values ​​are to be understood as having a precision with significant digits, provided that the purpose of the invention is achieved. For example, the number 40.0 should be understood to cover the range from 39.50 to 40.49.

[0026] In this document, when Markush groups or alternative terms are used to describe features or examples of the invention, those skilled in the art should understand that subgroups of all members within a Markush group or option list, or any individual member, can also be used to describe the invention. For example, if X is described as "selected from the group consisting of X1, X2, and X3," it also indicates that the claim that X is X1 and the claim that X is X1 and / or X2 and / or X3 have been fully described. Furthermore, when Markush groups or alternative terms are used to describe features or examples of the invention, those skilled in the art should understand that any combination of subgroups of all members within a Markush group or option list, or any individual member, can also be used to describe the invention. Accordingly, for example, if X is described as "selected from the group consisting of X1, X2, and X3," and Y is described as "selected from the group consisting of Y1, Y2, and Y3," it indicates that the claim that X is X1 or X2 or X3 and Y is Y1 or Y2 or Y3 has been fully described.

[0027] Unless otherwise specified, in this invention, a compound refers to a chemical substance formed by two or more elements linked by chemical bonds, including, but not limited to, small molecule compounds and macromolecules. The term "compound" in this document is not limited to a single chemical substance, but can also be interpreted as a class of chemical substances having the same component or the same properties. Furthermore, in this invention, a mixture refers to a combination of two or more compounds.

[0028] Unless otherwise specified, in this invention, a polymer refers to the product formed by the polymerization reaction of monomers, often comprising an aggregate of many high molecules, each of which is composed of many simple structural units linked by repeated covalent bonds. The monomer is the compound that synthesizes the polymer. Polymers can include homopolymers, copolymers, prepolymers, etc., but are not limited to these. A prepolymer is a polymer with a lower molecular weight, between that of the monomer and the final polymer, and contains reactive functional groups that can undergo further polymerization to obtain a fully cross-linked or hardened product with a higher molecular weight. Polymers naturally include oligomers, but are not limited to these. Oligomers, also known as low-molecular-weight polymers, are polymers composed of 2 to 20 repeating units, typically 2 to 5 repeating units.

[0029] Unless otherwise specified, "resin" in this invention is a common name for a synthetic polymer. When interpreted, it can include monomers, polymers thereof, combinations of monomers, combinations of polymers thereof, or combinations of monomers and their polymers, etc., and is not limited thereto.

[0030] Unless otherwise specified, the alkyl and alkenyl groups mentioned in this invention are interpreted to include their various isomers. For example, propyl should be interpreted to include n-propyl and isopropyl.

[0031] In this paper, a prepolymer refers to a product that still contains reactive functional groups or has polymerization potential after a compound or mixture (monomer) has undergone a prepolymerization reaction (i.e., partial polymerization reaction, or prepolymerization reaction). For example, the degree of reaction of the prepolymerization reaction can be confirmed by its molecular weight or viscosity. The prepolymerization methods used in this paper include, but are not limited to, using solvent heating to initiate the prepolymerization reaction or using a thermal melt reaction to initiate the prepolymerization reaction. For example, solvent heating prepolymerization involves adding the raw materials to a solvent to dissolve them, and selectively adding a catalyst or polymerization inhibitor as needed. After all the raw materials are dissolved in the solvent, the temperature is raised to initiate the reaction. Thermal melt reaction prepolymerization involves directly heating and melting the raw materials to initiate the prepolymerization reaction. The prepolymerized product has a larger molecular weight than the unprepolymerized monomer or mixture monomer and can be analyzed by gel permeation chromatography (GPC). The results of the residence time (X-axis) and molecular weight (Y-axis) distributions show that the molecular weight distribution peak of the prepolymer is located at the earlier end (shorter residence time), while the molecular weight distribution peak of the monomer is located at the later end (longer residence time). Furthermore, the obtained prepolymer has a broader molecular weight distribution peak containing multiple consecutive peaks, while the monomer has a narrower distribution peak containing only a single peak.

[0032] For those skilled in the art, a resin composition containing compounds A, B, and C and an additive (comprising four components in total) and a resin composition containing a prepolymer formed from compounds A, B, and C and an additive (comprising two components in total) are different resin compositions. They differ significantly in their preparation methods, physicochemical properties, and the characteristics of their products. For example, the former involves mixing A, B, C, and the additive to form the resin composition, while the latter requires first prepolymerizing the mixture containing A, B, and C under appropriate conditions to form a prepolymer, which is then mixed with the additive to obtain the resin composition. For example, for those skilled in the art, the aforementioned two resin compositions have completely different compositions, and since the prepolymer formed from compounds A, B, and C functions entirely differently from the individual or combined functions of A, B, and C in the resin composition, the two resin compositions should be considered completely different chemical substances with entirely different chemical statuses. For example, for those skilled in the art, since the aforementioned two resin compositions are completely different chemical substances, their products will not have the same characteristics. For example, in a resin composition comprising a prepolymer formed from compounds A, B, and C and a crosslinking agent, since A, B, and C have already partially reacted or transformed to form the prepolymer during the prepolymerization reaction, when the resin composition is heated at high temperature to form a semi-cured state, a partial crosslinking reaction occurs between the prepolymer and the crosslinking agent, rather than each of A, B, and C undergoing a partial crosslinking reaction with the crosslinking agent. Therefore, the products formed from the two resin compositions will be completely different and have entirely different properties.

[0033] In this document, parts by weight represent the number of parts by weight, which can be any unit of weight, such as, but not limited to, grams, kilograms, pounds, etc. For example, 100 parts by weight of prepolymer means that it can be 100 grams of prepolymer, 100 kilograms of prepolymer, or 100 pounds of prepolymer, and is not limited thereto.

[0034] The following detailed embodiments are merely illustrative in nature and are not intended to limit the invention or its uses. Furthermore, this document is not limited to the foregoing prior art or the invention itself, or to any theory described in the following detailed embodiments or examples.

[0035] As for the foregoing, the main objective of this invention is to provide a resin composition comprising a prepolymer obtained by a prepolymerization reaction of a mixture, wherein the mixture comprises 100 parts by weight of a first maleimide resin, 40 to 60 parts by weight (e.g., but not limited to 40, 45, 50, 55, or 60 parts by weight) of a siloxane compound, and 10 to 30 parts by weight (e.g., but not limited to 10, 15, 20, 25, or 30 parts by weight) of a diamine compound, wherein:

[0036] The first maleimide resin comprises bisphenol A diphenyl ether bismaleimide (also known as 2,2'-bis-[4-(4-maleimide-phenoxy)phenyl]propane);

[0037] The siloxane compounds include those with the structure shown in formula (I) and a molecular weight of 2200 to 2600 g / mol.

[0038] Where 26 ≤ n ≤ 32, and n is a positive integer; and

[0039] The diamine compound includes 4-aminophenyl-4-aminobenzoate.

[0040] In addition to the first maleimide resin, siloxane compound, and diamine compound, the mixture used to prepare the aforementioned prepolymer may further include other components as needed.

[0041] For example, in one embodiment, the aforementioned mixture further includes a solvent to control the degree of prepolymerization or the reactivity of the prepolymer. The type and amount of solvent are not particularly limited and can be determined by those skilled in the art based on the required viscosity. For example, the solvent may include propylene glycol methyl ether acetate, dimethylacetamide, butanone, cyclohexanone, N-methyl-2-pyrrolidone, or combinations thereof. For example, in one embodiment, the solvent may include 100 to 300 parts by weight of propylene glycol methyl ether acetate relative to 100 parts by weight of the first maleimide resin. Preferably, the solvent may include 150 to 250 parts by weight of propylene glycol methyl ether acetate relative to 100 parts by weight of the first maleimide resin, but is not limited thereto.

[0042] In this invention, the aforementioned prepolymer is obtained from the aforementioned mixture through a prepolymerization reaction. For example, after the components in the mixture are stirred and mixed evenly in a solvent, the temperature is raised to 80°C to 140°C and the reaction is continued for 0.5 to 5 hours to obtain a transparent, clear, dark brown solution, which is the resin solution of the prepolymer. For example, the temperature of the aforementioned prepolymerization reaction can be 80°C, 90°C, 100°C, 110°C, 115°C, 120°C, 130°C, or 140°C. For example, the time of the aforementioned prepolymerization reaction can be 0.5 hours, 1 hour, 2 hours, 3 hours, 4 hours, or 5 hours.

[0043] For example, a mixture comprising a first maleimide resin, a siloxane compound, and a diamine compound can be subjected to a prepolymerization reaction under any suitable reaction conditions to form a prepolymer. In one embodiment, a method for manufacturing a prepolymer includes dissolving the first maleimide resin in a solvent, adding the aforementioned siloxane compound and the aforementioned diamine compound, stirring to dissolve, and after complete dissolution, continuing the reaction at a high temperature (e.g., 80°C to 140°C) for 0.5 to 5 hours to obtain the prepolymer.

[0044] In this invention, the method for preparing the aforementioned resin composition includes: subjecting the mixture to a prepolymer reaction to obtain the prepolymer, and then, as needed, mixing the prepolymer with additives to obtain the resin composition. For example, in one embodiment, the mixture is subjected to a prepolymer reaction at 80°C to 140°C for 0.5 to 5 hours to obtain the prepolymer.

[0045] Unless otherwise specified, in this invention, the aforementioned resin composition may include the prepolymer and one or more additives. An additive refers to any component used in conjunction with the prepolymer to form the resin composition; it may be a component with the potential to react with the prepolymer or a component without the potential to react with the prepolymer. For example, in one embodiment, the aforementioned additive may be a second maleimide resin, and the second maleimide resin may be the same as or different from the first maleimide resin. For example, in one embodiment, the aforementioned additive may also be an inorganic filler, flame retardant, curing accelerator, polymerization inhibitor, solvent, silane coupling agent, dye, toughening agent, or a combination thereof, and is not limited thereto.

[0046] For example, in one embodiment, the aforementioned resin composition comprises the prepolymer and a second maleimide resin. The amount of the second maleimide resin relative to 100 parts by weight of the prepolymer may, for example, be 10 to 35 parts by weight (e.g., but not limited to 10, 15, 20, 25, 30, or 35 parts by weight). The type of second maleimide resin is not particularly limited, and all maleimide resins that can be used in the art to prepare prepregs, resin films, laminates, or printed circuit boards are applicable. For example, the second maleimide resin may include polyphenylene maleimide, biphenyl aralkyl maleimide, dielyl nadicimide, or combinations thereof.

[0047] For example, the aforementioned inorganic fillers can be any one or more inorganic fillers suitable for the manufacture of prepregs, resin films, laminates, or printed circuit boards. Specific examples include, but are not limited to: silica (molten, non-molten, porous, or hollow), alumina, aluminum hydroxide, magnesium oxide, magnesium hydroxide, calcium carbonate, aluminum nitride, boron nitride, silicon aluminum carbide, silicon carbide, titanium dioxide, barium titanate, lead titanate, strontium titanate, calcium titanate, magnesium titanate, barium zirconate, lead zirconate, magnesium zirconate, lead zirconate titanate, zinc molybdate, calcium molybdate, magnesium molybdate, ammonium molybdate, zinc molybdate-modified talc, zinc oxide, zirconium oxide, mica, boehmite (AlOOH), calcined talc, talc, silicon nitride, or calcined kaolin. Furthermore, the inorganic fillers can be spherical, fibrous, plate-like, granular, flake-like, or needle-like, and can be selectively pretreated with a silane coupling agent. For example, in one embodiment, the resin composition of the present invention may further include 1.2 to 2.5 times the total amount of the aforementioned "all other components" relative to the total amount of the aforementioned "all other components," preferably 1.7 to 2.0 times the total amount of the aforementioned inorganic filler, but is not limited thereto. For example, in the aforementioned resin composition, all components other than the curing accelerator, inorganic filler, and solvent are collectively referred to as "all other components."

[0048] For example, the aforementioned flame retardant may be any one or more flame retardants suitable for the manufacture of prepregs, resin films, laminates, or printed circuit boards, such as, but not limited to, phosphorus-containing flame retardants, preferably including: ammonium polyphosphate, hydroquinone bis-(diphenylphosphate), bisphenol A bis-(diphenylphosphate), tri(2-carboxyethyl)phosphine (TCEP), trichloroisopropyl phosphate, trimethyl phosphate (TMP), dimethyl methyl phosphonate (DMMP), resorcinol bis-(dixylenyl)phosphate. phosphate), RDXP, such as commercially available products PX-200, PX-201, PX-202, etc.), phosphazene compounds (such as commercially available products SPB-100, SPH-100, SPV-100, etc.), melamine polyphosphate, DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) and its derivatives or resins, DPPO (diphenylphosphine oxide) and its derivatives or resins, melamine cyanurate, tri-hydroxyethyl isocyanurate, aluminum phosphonates (such as products OP-930, OP-935, etc.) or combinations thereof.

[0049] For example, the aforementioned flame retardant may be a DPPO compound (such as a bisDPPO compound, such as commercially available products like PQ-60), a DOPO compound (such as a bisDOPO compound), a DOPO resin (such as DOPO-HQ, DOPO-NQ, DOPO-PN, DOPO-BPN), or a DOPO-bonded epoxy resin, etc., wherein DOPO-PN is a DOPO phenolic compound, and DOPO-BPN may be a bisphenolic compound such as DOPO-BPAN (DOPO-bisphenol Anovolac), DOPO-BPFN (DOPO-bisphenol F novolac), or DOPO-BPSN (DOPO-bisphenol S novolac). For example, in one embodiment, the resin composition of the present invention may further include 5 to 100 parts by weight of flame retardant, preferably 10 to 30 parts by weight, compared to 100 parts by weight of prepolymer, but is not limited thereto.

[0050] For example, the aforementioned curing accelerators (including curing initiators) may include catalysts such as Lewis bases or Lewis acids. Lewis bases may include one or more of the following: imidazole, boron trifluoride amine complex, ethyltriphenyl phosphonium chloride, 2-methylimidazole (2MI), 2-phenyl-1H-imidazole (2PZ), 2-ethyl-4-methylimidazole (2E4MI), triphenylphosphine (TPP), and 4-dimethylaminopyridine (DMAP). Lewis acids may include metal salt compounds, such as manganese, iron, cobalt, nickel, copper, zinc, etc., and metal catalysts such as zinc octanoate and cobalt octanoate. Curing accelerators also include curing initiators, such as peroxides that can generate free radicals. Curing initiators include, but are not limited to, diisopropylbenzene peroxide, tert-butyl peroxybenzoate, dibenzoyl peroxide (BPO), 2,5-dimethyl-2,5-di(tert-butylperoxy)-3-hexyne (25B), and bis(tert-butylperoxyisopropyl)benzene or combinations thereof. For example, in one embodiment, the resin composition of the present invention may further include 0.05 parts by weight to 1.0 parts by weight of curing accelerator, preferably 0.2 parts by weight to 0.5 parts by weight, but not limited thereto, compared to 100 parts by weight of the prepolymer.

[0051] For example, the aforementioned polymerization inhibitors may include, but are not limited to, 1,1-diphenyl-2-trinitrophenylhydrazine, methacrylonitrile, 2,2,6,6-tetramethyl-1-oxy-piperidine, disulfides, nitroxide-stabilized free radicals, triphenylmethyl free radicals, metal ion free radicals, sulfur free radicals, hydroquinone, p-methoxyphenol, p-benzoquinone, phenthiazide, β-phenylnaphthylamine, p-tert-butylcatechol, methylene blue, 4,4'-butylenebis(6-tert-butyl-3-methylphenol), and 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), or combinations thereof. For example, the aforementioned nitroxide-stabilized free radicals may include, but are not limited to, 2,2,6,6-substituted-1-piperidine oxygen radicals or 2,2,5,5-substituted-1-pyrrolidine oxygen radicals, etc., nitroxide free radicals derived from cyclic hydroxylamines. As substituents, alkyl groups with 4 or fewer carbon atoms, such as methyl or ethyl, are preferred. The specific nitroxide free radical compounds are not limited, and examples include, but are not limited to, 2,2,6,6-tetramethyl-1-piperidine oxygen radical, 2,2,6,6-tetraethyl-1-piperidine oxygen radical, 2,2,6,6-tetramethyl-4-oxo-1-piperidine oxygen radical, 2,2,5,5-tetramethyl-1-pyrrolidine oxygen radical, 1,1,3,3-tetramethyl-2-isodihydroindole oxygen radical, N,N-di-tert-butylamine oxygen radical, etc. Stable free radicals such as galvinoxyl radicals can also be used instead of nitroxide free radicals. The polymerization inhibitors suitable for the resin compositions of the present invention can also be products derived from the substitution of hydrogen atoms or groups of atoms in the inhibitor by other atoms or groups. For example, products derived from the substitution of hydrogen atoms in the inhibitor by groups such as amino, hydroxyl, or ketone carbonyl groups. For example, in one embodiment, the resin composition of the present invention may further include 0.001 to 5 parts by weight of a polymerization inhibitor, preferably 0.01 to 3 parts by weight, but not limited thereto, in addition to 100 parts by weight of the prepolymer.

[0052] For example, the solvent suitable for the resin composition of the present invention is not particularly limited, and can be any solvent suitable for dissolving the resin composition of the present invention, including but not limited to: methanol, ethanol, ethylene glycol monomethyl ether, acetone, butanone (also known as methyl ethyl ketone), methyl isobutyl ketone, cyclohexanone, toluene, xylene, methoxyethyl acetate, ethoxyethyl acetate, propoxyethyl acetate, ethyl acetate, dimethylformamide, dimethylacetamide, propylene glycol methyl ether, and other solvents or mixtures thereof. For example, in one embodiment, the resin composition of the present invention may further include 1.0 to 2.0 times the total amount of solvent, preferably 1.4 to 1.6 times the total amount of solvent, compared to the total amount of "all other components" in the resin composition, but is not limited thereto. For example, in the aforementioned resin composition, all components other than the curing accelerator, inorganic filler, and solvent are collectively referred to as "all other components".

[0053] For example, the aforementioned silane coupling agent may include silane compounds (such as, but not limited to, siloxane compounds), which, depending on the functional group, may be classified as amino silane compounds, epoxy silane compounds, vinyl silane compounds, acrylate silane compounds, methacrylate silane compounds, hydroxy silane compounds, isocyanate silane compounds, methacryloxy silane compounds, and acryloyloxy silane compounds. For example, in one embodiment, the resin composition of the present invention may further include 0.001 parts by weight to 2 parts by weight of silane coupling agent, preferably 0.01 parts by weight to 1 part by weight of silane coupling agent, but is not limited thereto, compared to 100 parts by weight of the prepolymer.

[0054] For example, the aforementioned dyeing agents may include, but are not limited to, dyes or pigments.

[0055] In this invention, the main function of adding toughening agents is to improve the toughness of the resin composition. For example, the toughening agents may include, but are not limited to, carboxyl-terminated butadiene acrylonitrile rubber (CTBN), core-shell rubber, or combinations thereof. For example, in one embodiment, the resin composition of this invention may further include 1 to 20 parts by weight of toughening agent, preferably 3 to 10 parts by weight, compared to 100 parts by weight of the prepolymer, but is not limited thereto.

[0056] The resin compositions of the foregoing embodiments can be made into various articles, such as components used in various electronic products, including but not limited to adhesives, prepregs, resin films, laminates, or printed circuit boards.

[0057] For example, a solvent can be added to the resin composition of each embodiment of the present invention to prepare a varnish.

[0058] For example, the resin compositions of various embodiments of the present invention can be made into a prepreg, which includes a reinforcing material and a layer disposed on the reinforcing material. The layer is obtained by heating the aforementioned resin composition at a high temperature to form a semi-cured state (B-stage). The baking temperature for making the prepreg is between 120°C and 180°C, preferably between 120°C and 160°C. The reinforcing material can be any of a fiber material, woven fabric, or nonwoven fabric, and the woven fabric preferably includes fiberglass cloth. There is no particular limitation on the type of fiberglass cloth; it can be commercially available fiberglass cloth suitable for various printed circuit boards, such as E-type fiberglass cloth, D-type fiberglass cloth, S-type fiberglass cloth, T-type fiberglass cloth, L-type fiberglass cloth, or Q-type fiberglass cloth. The fiber type includes yarn and roving, and the form can include open or closed fibers. The aforementioned nonwoven fabric preferably includes liquid crystal resin nonwoven fabric, such as polyester nonwoven fabric, polyurethane nonwoven fabric, etc., but is not limited thereto. The aforementioned fabric may also include liquid crystal resin fabric, such as polyester fabric or polyurethane fabric, and is not limited thereto. This reinforcing material can increase the mechanical strength of the prepreg. In a preferred embodiment, the reinforcing material may also be selectively pretreated with a silane coupling agent. The prepreg subsequently undergoes heating and curing (C-stage) to form an insulating layer.

[0059] For example, the resin compositions of various embodiments of the present invention can be made into resin films, which are obtained by baking and heating the aforementioned resin compositions to achieve semi-curing. The resin compositions can be selectively coated onto polyethylene terephthalate (PET) films, polyimide (PI) films, copper foils, or adhesive-backed copper foils, and then baked and heated to form a semi-cured state, thereby forming a resin film.

[0060] For example, the resin compositions of various embodiments of the present invention can be made into a laminate comprising two metal foils and an insulating layer disposed between the metal foils. The insulating layer can be obtained by curing the aforementioned resin composition under high temperature and high pressure conditions (C-stage), wherein a suitable curing temperature is between 180°C and 240°C, preferably between 200°C and 230°C, and the curing time is between 90 and 180 minutes, preferably between 120 and 150 minutes. The insulating layer can be formed by curing the aforementioned prepreg or resin film (C-stage). The metal foils may include copper, aluminum, nickel, platinum, silver, gold, or alloys thereof; for example, the metal foil may be copper foil. In one embodiment, the aforementioned laminate is a copper clad laminate (CCL).

[0061] Furthermore, the aforementioned multilayer board can be further processed through circuit manufacturing processes to form a circuit board, such as a printed circuit board.

[0062] In one embodiment, the resin composition provided by the present invention can improve at least one of the following properties: resin compatibility, X-axis coefficient of thermal expansion, etc.

[0063] For example, the resin composition provided by the present invention or the articles made therefrom may satisfy one, more or all of the following characteristics:

[0064] In the resin compatibility test, after the adhesive was left to stand at room temperature for 3 hours, the adhesive did not separate into layers.

[0065] as well as

[0066] The X-axis coefficient of thermal expansion measured according to the method described in IPC-TM-6502.4.24.5 is less than or equal to 4.21 ppm / ℃, for example, between 2.85 ppm / ℃ and 4.21 ppm / ℃.

[0067] Various prepolymers were prepared according to the amounts of the main reactants (monomers) in Tables 1 and 2 and the textual descriptions of Manufacturing Examples 1 to 16. Furthermore, resin compositions of the embodiments and comparative examples of the present invention were prepared according to the amounts in Tables 3 to 5 using various raw materials from the following sources, and various test samples were further prepared.

[0068] The chemical raw materials used in the examples of prepolymer manufacturing, resin composition examples, and comparative examples of resin compositions are as follows:

[0069] BMI-80: Bisphenol A diphenyl ether bismaleimide (also known as 2,2'-bis-[4-(4-maleimidephenoxy)phenyl]propane), purchased from KI Chemicals.

[0070] MIR-5000: Maleimide resin with the structure shown in Formula (II), purchased from Nippon Kayaku.

[0071] Where 1 ≤ m ≤ 5.

[0072] BMI-2300: Polyphenylene maleimide, purchased from Yamato Chemical.

[0073] MIR-3000: Biphenyl aryl maleimide, purchased from Nippon Kayaku.

[0074] BANI-M: Diallyl nadicimide, with the structure shown in formula (III), purchased from Maruzen Petrochemical.

[0075]

[0076] NH 30D: A siloxane compound with the structure shown in formula (I), having a molecular weight of 2200 to 2600 g / mol, purchased from WACKER.

[0077] Where 26≤n≤32, and n is a positive integer.

[0078] NH 15D: A siloxane compound with the structure shown in Formula (I) and a molecular weight of 1000 to 1200 g / mol, purchased from WACKER.

[0079] NH 40D: A siloxane compound with the structure shown in Formula (I) and a molecular weight of 2900 to 3300 g / mol, purchased from WACKER.

[0080] X-22-161A: A terminal aminosiloxane compound with a molecular weight of approximately 1600 g / mol, purchased from Shin-Etsu Chemical Industry Co., Ltd.

[0081] X-22-161B: A terminal aminosiloxane compound with a molecular weight of approximately 3000 g / mol, purchased from Shin-Etsu Chemical Industry Co., Ltd.

[0082] APAB: 4-aminophenyl-4-aminobenzoate, with the structure shown in formula (iv), purchased from Hexin Chemical Industry.

[0083]

[0084] AB-TFMB: N,N'-(2,2'-bis(trifluoromethyl)-[1,1'-biphenyl]-4,4'-diyl)bis(4-aminobenzamid), N,N'-[2,2'-bis(trifluoromethyl)-[1,1'-biphenyl]-4,4'-diyl]bis[4-aminobenzamid], purchased from Dongxin Chemical.

[0085] AB-HQ: 1,4-phenylene-di-4-aminobenzoate, purchased from Dongxin Chemical.

[0086] MOEA: 3,3'-diethyl-4,4'-diaminodiphenylmethane, purchased from Chin Yu Enterprise Co., Ltd.

[0087] 4,4'-Diaminobenzoylaniline: Commercially available.

[0088] 2PHZ-PW: 2-Phenyl-4,5-dialkylmethylimidazolium, purchased from Shikoku Kasei.

[0089] SC2050 SMJ: Spherical silica with an acrylic silane coupling agent surface treated, purchased from Admatechs. In the table, the inorganic filler dosage code "R" represents the total amount of "all other components" in the resin compositions of each example or comparative example. All other components in the resin composition, excluding the curing accelerator, inorganic filler, and solvent, are collectively referred to as "all other components." The inorganic filler dosage code "R*180%" in the table represents that the amount of inorganic filler added is 1.8 times the aforementioned R. For example, R*180% in Example E1 represents an addition of 180 parts by weight (100 parts by weight multiplied by 180%) of inorganic filler. Similarly, R*180% in Example E6 represents an addition of 198 parts by weight (110 parts by weight multiplied by 180%) of inorganic filler.

[0090] MEK: Butanone, commercially available. The solvent dosage symbol "R*150%" in the table indicates that the amount of solvent added is 1.5 times the aforementioned R. For example, R*150% in Example E1 represents 150 parts by weight of solvent added (100 parts by weight multiplied by 150%). Similarly, R*150% in Example E6 represents 165 parts by weight of solvent added (110 parts by weight multiplied by 150%).

[0091] Propylene glycol methyl ether acetate: Commercially available.

[0092] Various prepolymers were prepared in accordance with the written descriptions of Manufacturing Examples 1 to 16, wherein the monomers used in the prepolymerization reaction and their amounts are shown in Tables 1 and 2.

[0093] Manufacturing Example 1

[0094] 186 parts by weight of propylene glycol methyl ether acetate, 100 parts by weight of BMI-80, 50 parts by weight of NH30D and 20 parts by weight of APAB were added to the reaction vessel. The mixture was stirred continuously and heated to dissolve. After reaching 115°C, the mixture was kept at a constant temperature for 4 hours and then cooled to room temperature to obtain a solution of prepolymer 1.

[0095] Manufacturing Example 2

[0096] The 50 parts by weight of NH 30D in Manufacturing Example 1 were changed to 40 parts by weight of NH 30D, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 2.

[0097] Manufacturing Example 3

[0098] The 50 parts by weight of NH 30D in Manufacturing Example 1 were changed to 60 parts by weight of NH 30D, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 3.

[0099] Manufacturing Example 4

[0100] The 20 parts by weight of APAB in Manufacturing Example 1 were changed to 10 parts by weight of APAB, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 4.

[0101] Manufacturing Example 5

[0102] The 20 parts by weight of APAB in Manufacturing Example 1 were changed to 30 parts by weight of APAB, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 5.

[0103] Manufacturing Example 6

[0104] The 50 parts by weight of NH 30D in Manufacturing Example 1 were changed to 50 parts by weight of NH 15D, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 6.

[0105] Manufacturing Example 7

[0106] The 50 parts by weight of NH 30D in Manufacturing Example 1 were changed to 50 parts by weight of NH 40D, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 7.

[0107] Manufacturing Example 8

[0108] The 50 parts by weight of NH 30D in Manufacturing Example 1 were replaced with 50 parts by weight of X-22-161A, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 8.

[0109] Manufacturing Example 9

[0110] The 50 parts by weight of NH 30D in Manufacturing Example 1 were replaced with 50 parts by weight of X-22-161B, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 9.

[0111] Manufacturing Example 10

[0112] The 20 parts by weight of APAB in Manufacturing Example 1 were replaced with 20 parts by weight of AB-TFMB, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 10.

[0113] Manufacturing Example 11

[0114] The 20 parts by weight of APAB in Manufacturing Example 1 were replaced with 20 parts by weight of AB-HQ, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 11.

[0115] Manufacturing Example 12

[0116] The 20 parts by weight of APAB in Manufacturing Example 1 were replaced with 20 parts by weight of MOEA, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 12.

[0117] Manufacturing Example 13

[0118] The 50 parts by weight of NH 30D and 20 parts by weight of APAB in Manufacturing Example 1 were replaced with 50 parts by weight of X-22-161B and 20 parts by weight of MOEA, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 13.

[0119] Manufacturing Example 14

[0120] The 50 parts by weight of NH 30D in Manufacturing Example 4 were changed to 30 parts by weight of NH 30D, while the other components and steps were the same as in Manufacturing Example 4, to obtain a solution of prepolymer 14.

[0121] Manufacturing Example 15

[0122] The 20 parts by weight of APAB in Manufacturing Example 1 were replaced with 20 parts by weight of 4,4'-diaminobenzoylaniline, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 15.

[0123] Manufacturing Example 16

[0124] The 100 parts by weight of BMI-80 in Manufacturing Example 1 were replaced with 100 parts by weight of MIR-5000, while the other components and steps were the same as in Manufacturing Example 1, to obtain a solution of prepolymer 16.

[0125] The composition of the prepolymer (all units are parts by weight) is shown in the table below:

[0126] [Table 1] Prepolymer Composition (Unit: Parts by Weight)

[0127]

[0128] [Table 2] Prepolymer Composition (Unit: Parts by Weight)

[0129]

[0130] The resin composition (all in parts by weight) and characteristic tests of the examples and comparative examples are shown below, where parts by weight refer to the number of parts by weight when the solid content of each component added in each example and comparative example is 100%. For example, Example E1 uses 100 parts by weight of prepolymer 1, which means using 100 parts by weight of prepolymer 1 with a solid content of 100%.

[0131] [Table 3] Composition (parts by weight) and property test results of the resin compositions in the examples

[0132]

[0133] [Table 4] Composition (parts by weight) and property test results of comparative example resin compositions

[0134] [Table 5] Composition (parts by weight) and property test results of comparative example resin compositions

[0135]

[0136] Note: The "-" symbol in the properties column indicates that other properties cannot be tested due to the separation of the resin composition.

[0137] The aforementioned characteristics are described in the following steps: prepare the analyte (sample) as described above, and then perform characteristic analysis according to specific conditions.

[0138] 1. Prepreg (PP): Using the resin compositions of Examples E1-E8 and Comparative Examples C1-C14 (parts by weight), the components of the resin compositions were added to a mixing tank and mixed evenly to form a varnish. The varnish was placed in an impregnation tank, and then a glass fiber cloth (e.g., T-glass fiber fabric of specification 2118, purchased from Asahi Corporation) was immersed in the impregnation tank to allow the resin composition to adhere to the glass fiber cloth. The mixture was then heated and baked at 110°C to 140°C for about 2 to 3 minutes to obtain a prepreg. The resin content of the prepreg made using 2118 T-glass fiber fabric was about 45%.

[0139] 2. Copper-containing substrate 1 (also known as copper foil substrate, which is formed by laminating a prepreg): Prepare two 18-micron-thickness reverse treatment foils (RTF) and a 2118 T-glass fiber cloth impregnated with prepregs made from each test sample (each set of examples or each set of comparative examples). The resin content of each prepreg is approximately 45%. The prepregs are laminated in the following order: copper foil, a prepreg, and copper foil. The mixture is then subjected to vacuum conditions and a pressure of 42 kgf / cm². 2 A copper-containing substrate 1 is formed by pressing at 230℃ for 150 minutes. The prepreg is a resin layer formed between the two copper foils, and the resin content of the prepreg is approximately 45%.

[0140] 3. Copper-containing substrate 2 (composed of eight prepreg sheets laminated together): Prepare two 18-micron-thickness reverse treatment foils (RTF) and eight 2118-size T-glass fiber cloths impregnated with prepreg sheets made from the samples to be tested (each set of examples or each set of comparative examples). The resin content of each prepreg sheet is approximately 45%. The copper foil, eight prepreg sheets, and copper foil are laminated in that order and subjected to vacuum conditions and a pressure of 42 kgf / cm². 2 A copper-containing substrate 2 is formed by pressing at 230°C for 150 minutes. Among them, eight prepreg sheets are stacked together to form an insulating layer between the two copper foils, and the resin content of the insulating layer is about 45%.

[0141] 4. Copper-free substrate 1 (made by laminating a prepreg): The copper foil on both sides of the copper-containing substrate 1 is removed by etching to obtain copper-free substrate 1 (made by laminating a prepreg). The resin content of the insulating layer of the copper-free substrate 1 is about 45%.

[0142] 5. Copper-free substrate 2 (made of eight prepregs laminated together): The copper foil on both sides of the copper-containing substrate 2 is removed by etching to obtain a copper-free substrate 2 (made of eight prepregs laminated together). The resin content of the insulating layer of the copper-free substrate 2 is about 45%.

[0143] The test methods and their characteristic analysis items are described below:

[0144] Resin compatibility

[0145] In resin compatibility testing, for resin compositions including prepolymers and other resin components, the presence of stratification was observed. Each resin composition of Examples E1-E8 and Comparative Examples C1-C14 was prepared into a solution (excluding inorganic fillers) using all raw materials except for the inorganic filler. The solutions were mixed and stirred thoroughly, then placed in a transparent glass bottle and left to stand at room temperature (approximately 25°C) for 3 hours. The solution was then visually observed for stratification. If stratification occurred (the solution formed one or more interfaces), it was labeled "stratified"; if no stratification occurred, it was labeled "no stratification".

[0146] X-axis coefficient of thermal expansion (X-CTE)

[0147] In the X-axis thermal expansion coefficient test, the copper-free substrate 1 (made from a single prepreg laminate) was selected as the test sample for thermal mechanical analysis (TMA). The copper-free substrate 1 was cut into samples with a length and width of 10 mm. The samples were heated at a rate of 10°C per minute, from 35°C to 300°C. The X-axis thermal expansion coefficient (α1) of each test sample was measured within the temperature range of 40°C to 125°C, according to the method described in IPC-TM-6502.4.24.5, with units expressed as ppm / °C.

[0148] In this field, a lower X-axis coefficient of thermal expansion indicates better dimensional expansion and contraction characteristics. A difference in X-axis coefficient of thermal expansion greater than or equal to 0.2 ppm / ℃ indicates a significant difference in the X-axis coefficient of thermal expansion between different substrates (presenting significant technical difficulty). For example, an article made from the resin composition disclosed in this invention has an X-axis coefficient of thermal expansion less than or equal to 4.21 ppm / ℃, for example, between 2.85 ppm / ℃ and 4.21 ppm / ℃, as measured with reference to the method described in IPC-TM-6502.4.24.5.

[0149] Glass transition temperature (Tg)

[0150] In the glass transition temperature test, a copper-free substrate 2 (composed of eight prepreg sheets laminated together) was selected as the test sample for thermomechanical analysis (TMA). The sample was heated at a rate of 10°C per minute, from 35°C to 350°C. The glass transition temperature of each test sample was measured according to the method described in IPC-TM-6502.4.24.5, and the unit is °C.

[0151] In this field, a higher glass transition temperature is preferred. A difference in glass transition temperature greater than or equal to 5°C indicates a significant difference in glass transition temperatures between different substrates (presenting significant technical difficulty). For example, an article made from the resin composition disclosed in this invention has a glass transition temperature greater than or equal to 237°C, for example, between 237°C and 261°C, as measured with reference to the method described in IPC-TM-6502.4.24.5.

[0152] Peeling strength (P / S) of copper foil

[0153] In the copper foil tensile test, the aforementioned copper substrate 2 (made of eight prepreg sheets laminated together) was selected and cut into rectangular samples with a width of 24 mm and a length greater than 60 mm. The surface copper foil was etched, leaving only a strip of copper foil with a width of 3.18 mm and a length greater than 60 mm. Using a universal tensile strength tester at room temperature (approximately 25°C), the test was performed according to the method described in IPC-TM-6502.4.8. The force required for each test sample to pull the copper foil away from the surface of the substrate insulation layer was measured, with the unit being lb / in.

[0154] In this field, higher copper foil tensile strength is preferred. A difference in copper foil tensile strength greater than or equal to 0.21 lb / in indicates a significant difference in copper foil tensile strength between different substrates (representing significant technical difficulty). For example, an article made from the resin composition disclosed in this invention has a copper foil tensile strength greater than or equal to 1.5 lb / in, for example, between 1.5 lb / in and 3.1 lb / in, measured according to the method described in IPC-TM-650 2.4.8.

[0155] Based on the test results in Tables 3 to 5, the following phenomena can be clearly observed.

[0156] If the resin composition simultaneously comprises a prepolymer formed by 100 parts by weight of a first maleimide resin, 40 to 60 parts by weight of a siloxane compound, and 10 to 30 parts by weight of a diamine compound, wherein the first maleimide resin comprises bisphenol A diphenyl ether bismaleimide, the siloxane compound comprises a compound with the structure shown in formula (I) (where 26 ≤ n ≤ 32, and n is a positive integer, and its molecular weight is 2200 to 2600 g / mol), and the diamine compound comprises 4-aminophenyl-4-aminobenzoate (APAB), for example, Examples E1 to E8, the resin composition can simultaneously achieve the characteristics of no delamination in resin compatibility testing and a coefficient of thermal expansion on the X-axis of less than or equal to 4.21 ppm / ℃. In contrast, Comparative Examples C1 to C14 fail to meet the requirements in at least one characteristic such as resin compatibility testing and coefficient of thermal expansion on the X-axis.

[0157] Compared to Example E1, the prepolymer does not use the siloxane compound with the structure shown in Formula (I) of the present invention with a molecular weight of 2200 to 2600 g / mol. Instead, other siloxane compounds, such as Comparative Example C1, are used, whose X-axis thermal expansion coefficient cannot meet the requirements.

[0158] Compared to Example E1, the prepolymer does not use the siloxane compound of the structure shown in Formula (I) with a molecular weight of 2200 to 2600 g / mol of the present invention. Instead, other siloxane compounds, such as Comparative Example C2, are used, and the resin compatibility test cannot meet the requirements.

[0159] Compared to Example E1, the prepolymer does not use the siloxane compound of the structure shown in Formula (I) with a molecular weight of 2200 to 2600 g / mol of the present invention. Instead, other siloxane compounds, such as Comparative Example C3, are used, whose X-axis thermal expansion coefficient cannot meet the requirements.

[0160] Compared to Example E1, the prepolymer does not use the siloxane compound of the structure shown in Formula (I) with a molecular weight of 2200 to 2600 g / mol of the present invention. Instead, other siloxane compounds, such as Comparative Example C4, are used, and the resin compatibility test cannot meet the requirements.

[0161] Compared to Example E1, the prepolymer does not use 4-aminophenyl-4-aminobenzoate (APAB) as a diamine compound, but instead uses other amine compounds, such as Comparative Example C5, whose X-axis thermal expansion coefficient cannot meet the requirements.

[0162] Compared to Example E1, where APAB is not used as the diamine compound in the prepolymer, but other amine compounds are used instead, such as Comparative Example C6, the resin compatibility test results cannot meet the requirements.

[0163] Compared to Example E1, APAB was not used as the diamine compound in the prepolymer. Instead, other amine compounds, such as Comparative Example C7, were used, and their X-axis thermal expansion coefficient could not meet the requirements.

[0164] Compared to Example E1, the prepolymer does not use the siloxane compound with the structure of Formula (I) with a molecular weight of 2200 to 2600 g / mol of the present invention in combination with APAB as a diamine compound. Instead, other siloxane compounds are used in combination with other amine compounds, such as Comparative Example C8. The resin compatibility test results cannot meet the requirements.

[0165] Compared to Example E4, instead of using 40 to 60 parts by weight of a siloxane compound in the prepolymer, 30 parts by weight of a siloxane compound, such as Comparative Example C9, is used, and its X-axis thermal expansion coefficient cannot meet the requirements.

[0166] Compared to Example E6, instead of using 40 to 60 parts by weight of siloxane compound to match the diamine compound in the prepolymer, 30 parts by weight of siloxane compound is used to match the diamine compound. For example, Comparative Example C10's X-axis thermal expansion coefficient cannot meet the requirements.

[0167] Compared to Example E6, APAB was not used as the diamine compound in the prepolymer. Instead, other amine compounds, such as Comparative Example C11, were used, and their X-axis thermal expansion coefficient could not meet the requirements.

[0168] Compared to Example E6, the prepolymer does not use the siloxane compound with the structure of Formula (I) of the present invention with a molecular weight of 2200 to 2600 g / mol as a diamine compound in combination with APAB. Instead, other siloxane compounds are used in combination with other amine compounds, such as Comparative Example C12. The resin compatibility test results cannot meet the requirements.

[0169] Compared to Example E1, monomers with added prepolymers, such as Comparative Example C13, were used instead of the prepolymers of the present invention, and their resin compatibility could not meet the test requirements.

[0170] Compared to Example E1, bisphenol A diphenyl ether bismaleimide is not used as the first maleimide resin in the prepolymer. Instead, other types of maleimide resins are used, such as Comparative Example C14, whose X-axis thermal expansion coefficient cannot meet the requirements.

[0171] In general, the resin composition or its products of the present invention can simultaneously achieve the following characteristics: no delamination in resin compatibility tests, X-axis thermal expansion coefficient less than or equal to 4.21 ppm / ℃, glass transition temperature greater than or equal to 237℃, and copper foil tensile strength greater than or equal to 1.51 b / in.

[0172] The above embodiments are merely illustrative in nature and are not intended to limit the embodiments of the applicant or the application or use of such embodiments. In this document, the term "illustrative" means "as an example, example, or illustration." Any illustrative embodiment herein should not necessarily be interpreted as preferred or advantageous over other embodiments.

[0173] Furthermore, although at least one exemplary embodiment or comparative example has been presented in the foregoing embodiments, it should be understood that numerous variations are possible with respect to the invention. It should also be understood that the embodiments described herein are not intended to limit the scope, use, or configuration of the claimed subject matter in any way. Rather, the foregoing embodiments will provide a simple guide for those skilled in the art to implement one or more of the embodiments. Moreover, various changes can be made to the function and arrangement of the components without departing from the scope defined by the claims, and the scope of the claims includes known equivalents and all foreseeable equivalents at the time of filing of this patent application.

Claims

1. A resin composition, characterized in that, The resin composition comprises a prepolymer obtained by a prepolymerization reaction of a mixture, wherein the mixture comprises 100 parts by weight of a first maleimide resin, 40 to 60 parts by weight of a siloxane compound, and 10 to 30 parts by weight of a diamine compound, wherein: The first maleimide resin comprises bisphenol A diphenyl ether bismaleimide; The siloxane compounds include those with the structure shown in Formula (I), wherein the molecular weight of the compounds with the structure shown in Formula (I) is 2200 to 2600 g / mol. Where 26 ≤ n ≤ 32, and n is a positive integer; and The diamine compound includes 4-aminophenyl-4-aminobenzoate.

2. The resin composition according to claim 1, characterized in that, The resin composition further comprises a second maleimide resin.

3. The resin composition according to claim 2, characterized in that, The resin composition comprises 100 parts by weight of the prepolymer and 10 to 35 parts by weight of the second maleimide resin.

4. The resin composition according to claim 2, characterized in that, The second maleimide resin includes polyphenylene maleimide, biphenyl aryl maleimide, dielyl nadicimide, or a combination thereof.

5. The resin composition according to claim 1, characterized in that, The resin composition further includes inorganic fillers, flame retardants, curing accelerators, polymerization inhibitors, solvents, silane coupling agents, dyes, toughening agents, or combinations thereof.

6. An article made from the resin composition of claim 1, characterized in that, The products include adhesives, prepregs, resin films, laminates, or printed circuit boards.

7. The article of claim 6, characterized in that, In the resin compatibility test, after the adhesive was left to stand at room temperature for 3 hours, the adhesive did not separate into layers.

8. The article of claim 6, characterized in that, The X-axis thermal expansion coefficient of the product, measured according to the method described in IPC-TM-6502.4.24.5, is less than or equal to 4.21 ppm / ℃.

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