A residual stress removal apparatus

CN117925967BActive Publication Date: 2026-10-27KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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Patent Information

Application Number
CN202410108667.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-01-25
Publication Date
2026-10-27
Estimated Expiration
2044-01-25

AI Technical Summary

Technical Problem

目前残余应力的去除方法会损坏金属构件,无法适用于金属掩膜板

Benefits of technology

[0023]本申请的有益效果是:本申请的残余应力去除装置中,工作仓的容纳腔用于放置掩膜板,同时容纳腔中还设置有弹丸,驱动机构驱动弹丸振动,弹丸振动过程中会对掩膜板造成冲击,进而去除掩膜板上的残余应力。

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a residual stress removing device which comprises a working bin, a bullet and a driving mechanism, wherein the working bin is provided with a containing cavity and an open part which is communicated with the containing cavity; the bullet is arranged in the containing cavity; and the driving mechanism is used for driving the bullet to vibrate. The containing cavity is used for placing a mask plate, and the bullet is also arranged in the containing cavity. The driving mechanism drives the bullet to vibrate, and the bullet will impact the mask plate during the vibration, so that the residual stress on the mask plate is removed.
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Description

Technical Field

[0001] This application relates to the field of residual stress removal technology, and in particular to a residual stress removal device. Background Technology

[0002] Metal photomasks are manufactured using processes such as cold rolling and etching. Residual stress is inevitably generated during the manufacturing process. Due to the small thickness of the metal photomask, this residual internal stress can easily cause small wrinkles that are difficult to unfold in localized areas. In the vapor deposition process of Organic Electroluminescence Display (OLED) products, these localized wrinkles in the photomask cannot be unfolded, leading to defects such as mura and color spots. Removing residual stress within the photomask can effectively reduce these defects in OLED products during the vapor deposition process. However, current methods for removing residual stress can damage metal components and are not suitable for metal photomasks.

[0003] There is an urgent need to design a residual stress removal device suitable for metal film plates to effectively remove residual stress in metal mask plates. Summary of the Invention

[0004] This application mainly provides a residual stress removal device, which can effectively remove residual stress in a metal mask.

[0005] To solve the above-mentioned technical problems, the technical solution adopted in this application is: to provide a residual stress removal device, which includes a working chamber, a projectile and a driving mechanism, wherein the working chamber is provided with a receiving cavity and an open part, and the open part is connected to the receiving cavity; the projectile is disposed in the receiving cavity; and the driving mechanism is used to drive the projectile to vibrate.

[0006] Among them, the hardness of the bullet is less than that of the metal material;

[0007] Preferably, the projectile is made of a non-metallic material;

[0008] Preferably, the material of the projectile includes at least one of glass and rubber.

[0009] The projectile has a spherical structure.

[0010] Preferably, the diameter of the projectile is 0.0021 to 0.0024 inches.

[0011] The surface of the projectile is smooth.

[0012] The projectiles are multiple, and multiple projectiles are laid at the bottom of the receiving cavity to form a vibrating body.

[0013] Preferably, multiple projectiles are evenly distributed at the bottom of the receiving cavity.

[0014] Preferably, the total thickness of the projectile is greater than or equal to 5 mm.

[0015] The driving mechanism is a vibration motor.

[0016] Among them, at least one of the amplitude, output thrust, and output frequency of the vibration motor is adjustable.

[0017] Preferably, the amplitude of the vibration motor is less than 20 mm, and / or the output thrust of the vibration motor is less than 500 N, and / or the output frequency of the vibration motor is less than 3500 Hz.

[0018] The drive mechanism is located outside the working chamber and connected to the working chamber. The drive mechanism drives the working chamber to vibrate, which in turn causes the projectile to vibrate.

[0019] Preferably, the drive mechanism is connected to the bottom wall of the working chamber.

[0020] The residual stress removal device also includes a base for supporting the working chamber.

[0021] Preferably, the base has a groove on the surface facing the working chamber, and the drive mechanism is located in the groove and connected to the working chamber.

[0022] The residual stress relief device also includes a cover plate, which is used to seal the receiving cavity.

[0023] The beneficial effects of this application are: In the residual stress removal device of this application, the receiving cavity of the working chamber is used to place the mask plate, and the receiving cavity is also provided with a projectile. The driving mechanism drives the projectile to vibrate, and the projectile will impact the mask plate during the vibration process, thereby removing the residual stress on the mask plate. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0025] Figure 1 This is a schematic diagram of one embodiment of the residual stress removal device in this application;

[0026] Explanation of reference numerals in the attached drawings: 10 Residual stress removal device; 1 Base; 2 Drive mechanism; 21 Vibration motor; 3 Projectile; 4 Working chamber; 5 Receiving cavity; 6 Cover plate; 7 Mask plate. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0029] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0030] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0031] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0032] Please see Figure 1This application provides a residual stress removal device 10, which includes a working chamber 4, a projectile 3, and a drive mechanism 2. The working chamber 4 has a receiving cavity 5 and an open portion, the open portion communicating with the receiving cavity 5. The projectile 3 is disposed in the receiving cavity 5. The drive mechanism 2 is used to drive the projectile 3 to vibrate. Specifically, the receiving cavity 5 provides a working space for residual stress removal, in which the projectile 3 and a mask plate 7 are placed. The drive mechanism 2 generates the power to vibrate the projectile 3, driving the projectile 3 to vibrate. Specifically, the drive mechanism 2 can directly contact the projectile 3 or indirectly contact the projectile 3. During the process of removing residual stress, by laying the mask plate 7 on the projectile 3, during operation, the drive mechanism 2 drives the projectile 3 in the working chamber 4 to vibrate and impact the mask plate 7 placed above the projectile 3. During the vibration of the projectile 3, it will impact the mask plate 7, thereby removing the residual stress on the mask plate 7.

[0033] In one embodiment, the hardness of the projectile 3 is less than the hardness of the metal material. Specifically, in order to protect the mask plate 7 from damage during impact, reducing the hardness of the projectile 3 can play a protective role for the mask plate 7. The mask plate 7 is generally made of metal, but in this application, the hardness of the projectile 3 is less than the hardness of the metal material, so it can be a non-metallic material, ensuring that the metal mask plate 7 will not be damaged during the residual stress removal process.

[0034] In one embodiment, the material of the projectile 3 includes at least one of glass and rubber. Glass and rubber are both mature materials in the industry and readily available. Furthermore, their physical properties make them easy to process, facilitating the preparation of the projectile 3. The preparation process is also flexible, allowing the projectile 3 to be processed into a suitable shape and size according to usage requirements. Additionally, since the mask plate 7 is a highly magnetic metal, to avoid localized magnetization of the metal mask plate 7 due to friction and collision between metals during residual stress removal, which could lead to small wrinkles that are difficult to unfold, the projectile 3 is made of a non-metallic material such as glass or rubber. Of course, the material of the projectile 3 in this application can be other materials besides glass and rubber.

[0035] The projectile 3 is a spherical structure. In one embodiment, the outer surface of the sphere has no sharp corners to avoid damage to the mask plate 7 during impact. Specifically, the projectile 3 can be a sphere similar in shape to a basketball or an ellipsoid similar in shape to a rugby ball. Of course, the projectile 3 in this application can also be other shapes, such as a square or a rectangle. When the projectile 3 is square, the corners and edges need to be polished to make the transition natural and avoid sharp points that could damage the mask plate 7.

[0036] In one embodiment, the diameter of the projectile 3 is 0.0021 to 0.0024 inches. Since the metal mask 7 is relatively thin, to avoid damage to it during residual stress removal, the projectile 3 can be selected in sizes of 0.0021 inches, 0.0022 inches, 0.0023 inches, or 0.0024 inches. Using a smaller projectile 3 has several advantages: firstly, it is a standard consumable, easy to collect, and convenient for use in the residual stress removal device 10; secondly, it is lightweight, preventing damage to the mask 7 during impact; and thirdly, its small size reduces the likelihood of pixel hole blockage and ensures the accuracy of the mask 7 during vapor deposition.

[0037] In one embodiment, the surface of the projectile 3 is smooth. Specifically, the smooth surface of the projectile 3 will not scratch or abrade the mask 7 during contact with the mask plate 7, ensuring that the shape of the mask plate 7 is not damaged.

[0038] In one embodiment, multiple projectiles 3 are arranged at the bottom of the receiving cavity 5 to form a vibrating body. Specifically, the residual stress removal device 10 is equipped with multiple projectiles 3, which work simultaneously to remove residual stress on the mask plate 7, resulting in high efficiency. Simultaneously, the multiple projectiles 3 arranged at the bottom of the receiving cavity 5 to form a vibrating body are placed near the drive mechanism 2. When the drive mechanism 2 operates, it drives the projectiles 3 to vibrate, thus forming a vibrating body. In one embodiment, multiple projectiles 3 are evenly arranged at the bottom of the receiving cavity 5. This even arrangement ensures that the force exerted by the drive mechanism 2 on the projectiles 3 is also uniform, resulting in a uniform force exerted by the projectiles 3 on the mask plate 7, thus guaranteeing the effective removal of residual stress on the mask plate 7.

[0039] In one embodiment, the total thickness of the projectile 3 is greater than or equal to 5 mm. Because the projectile 3 is relatively small, its total thickness is greater than or equal to 5 mm to ensure effective removal of residual stress. Specifically, the total thickness of the projectile 3 can be 5 mm, 6 mm, 8 mm, 10 mm, 15 mm, 20 mm, etc.

[0040] In one embodiment, the drive mechanism 2 is a vibration motor 21. The vibration motor 21 can drive the projectile 3 to vibrate, and the vibration motor 21 is a mature device in the industry, which makes it easy to select a suitable vibration motor 21 in the residual stress removal device 10.

[0041] In one embodiment, at least one of the amplitude, output thrust, and output frequency of the vibration motor 21 is adjustable. Specifically, the functional parameters of the vibration motor 21 are adjustable, so that the vibration motor 21 can be adapted to mask plates 7 of different specifications.

[0042] In one embodiment, the amplitude of the vibration motor 21 is less than 20 mm; in another embodiment, the output thrust of the vibration motor 21 is less than 500 N; and in yet another embodiment, the output frequency of the vibration motor 21 is less than 3500 Hz. Because the metal mask plate 7 is relatively thin, to avoid damage caused by excessive amplitude of the projectile 3 during residual stress removal, and considering the need to be applicable to various mask plates 7, the motor amplitude can be adjusted in multiple levels within 20 mm, the motor output thrust can be adjusted in multiple levels within 500 N, and the motor output frequency can be adjusted in multiple levels within 3500 Hz. The vibration motor 21 uses high-frequency vibration to achieve the collision between the projectile 3 and the mask plate 7, which can reduce the impact force of the projectile 3 on the mask plate 7 and prevent damage to the mask plate 7. In one embodiment, the vibration motor 21 can be an ultrasonic vibration motor 21 to achieve high-frequency vibration.

[0043] Please continue reading. Figure 1 The drive mechanism 2 is located outside and connected to the working chamber 4. The drive mechanism 2 drives the working chamber 4 to vibrate, which in turn causes the projectile 3 to vibrate. Specifically, to avoid excessive driving force from the drive mechanism 2 damaging the mask plate 7, the drive mechanism 2 is placed outside the working chamber 4. At the same time, to ensure the driving effect, the drive mechanism 2 is connected to the working chamber 4. In this case, the drive mechanism 2 can drive the working chamber 4 to vibrate. After the working chamber 4 vibrates, it causes the projectile 3 to vibrate. After the projectile 3 vibrates, it impacts the surface of the mask plate 7, thereby removing the residual stress on the mask plate 7.

[0044] In one embodiment, the drive mechanism 2 is connected to the bottom wall of the working chamber 4. Specifically, the projectile 3 is located at the bottom of the working chamber 4. After the drive mechanism 2 is connected to the bottom wall of the working chamber 4, the drive mechanism 2 can effectively drive the projectile 3 to vibrate, thereby improving efficiency.

[0045] Please continue reading. Figure 1 The residual stress removal device 10 also includes a base 1, which supports the working chamber 4. Specifically, the base 1 provides effective support, with the working chamber 4 located on the base 1, and the base 1 supporting the working chamber 4.

[0046] In one embodiment, a groove is provided on the surface of the base 1 facing the working chamber 4, and the drive mechanism 2 is located in the groove and connected to the working chamber 4. With the groove on the surface of the base 1 facing the working chamber 4 and the drive mechanism 2 placed in the groove, the drive mechanism 2 is connected to the working chamber 4, making the drive mechanism 2 connected to the bottom wall of the working chamber 4. The drive mechanism 2 can effectively drive the projectile 3 in the working chamber 4 to vibrate.

[0047] In one embodiment, the residual stress relief device 10 further includes a cover plate 6 for sealing the receiving cavity 5. The cover plate 6 seals the receiving cavity 5 in the working chamber 4, preventing the projectiles 3 from splashing out during the operation of the residual stress relief device 10. The cover plate 6 can be made of a non-metallic material to prevent the projectiles from impacting the cover plate 6, magnetizing it, and affecting the service life of the residual stress relief device 10.

[0048] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A residual stress removal device, characterized in that, include: The working compartment has a receiving cavity and an open portion, the open portion being connected to the receiving cavity; A projectile is disposed in the receiving cavity; the projectile is made of non-metallic material; the projectile has a spherical structure and a smooth surface; there are multiple projectiles, which are evenly distributed at the bottom of the receiving cavity to form a vibrating body. A driving mechanism is used to drive the projectile to vibrate; wherein, during the process of removing residual stress, a mask plate is laid on the projectile, the hardness of the projectile is less than the hardness of the mask plate metal material, and the diameter of the projectile is 0.0021~0.0024 inches.

2. The residual stress removal device according to claim 1, characterized in that, The projectile is made of at least one of glass and rubber.

3. The residual stress removal device according to claim 1, characterized in that, The total thickness of the projectile is greater than or equal to 5 mm.

4. The residual stress removal device according to claim 1, characterized in that, The driving mechanism is a vibration motor.

5. The residual stress removal device according to claim 4, characterized in that, At least one of the amplitude, output thrust, and output frequency of the vibration motor is adjustable.

6. The residual stress removal device according to claim 5, characterized in that, The vibration motor has an amplitude of less than 20 mm, and / or the output thrust of the vibration motor is less than 500 N, and / or the output frequency of the vibration motor is less than 3500 Hz.

7. The residual stress removal device according to claim 1, characterized in that, The drive mechanism is located outside the working chamber and connected to the working chamber. The drive mechanism drives the working chamber to vibrate, thereby causing the projectile to vibrate.

8. The residual stress removal device according to claim 7, characterized in that, The drive mechanism is connected to the bottom wall of the working chamber.

9. The residual stress removal device according to claim 1, characterized in that, Also includes: A base for supporting the working chamber.

10. The residual stress removal device according to claim 9, characterized in that, The base has a groove on its surface facing the work chamber, and the drive mechanism is located in the groove and connected to the work chamber.

11. The residual stress removal device according to claim 1, characterized in that, Also includes: A cover plate is used to close the receiving cavity.

Citation Information

Patent Citations

  • Planar array type ultrasonic shot-peening reinforcing device and method

    CN107488780A

  • Method and equipment for improving thermal stability of jet orifice part of engine nozzle

    CN109517955A

  • Residual stress removal method, workpiece machining method, composite shot peening and preparation method

    CN115725825A