PCB pulse copper plating additive, preparation method and application thereof

Abstract

This invention belongs to the field of PCB boards, specifically relating to a PCB pulse electroplating copper additive, its preparation method, and its application. The PCB pulse electroplating copper additive includes an accelerator, an inhibitor, and a leveling agent. The accelerator is sodium polydithiopropane sulfonate, the inhibitor is polyethylene glycol-6000, and the leveling agent is a nitrogen-containing aromatic benzyl quaternary ammonium salt compound. The proportion of the accelerator is 1-10 ppm, the proportion of the inhibitor is 150-300 ppm, and the proportion of the leveling agent is 1-10 ppm. The pyridine benzyl ammonium chloride synthesized in this invention is used as a leveling agent in the copper electroplating process. The nitrogen-containing aromatic heterocycle is more prone to electrophilic reactions, making the compound easily adsorbed on the cathode surface. Super-filling without voids or gaps can be obtained in blind vias with aspect ratios of 0.625 and 1.25.

Description

Technical Field

[0001] This invention belongs to the field of PCB boards, specifically relating to a PCB pulse electroplating copper additive, its preparation method, and its application. Background Technology

[0002] Flexible circuit boards, also known as "flexible boards," are printed circuits made of flexible insulating substrates. They can be bent, rolled, and folded freely, and can withstand millions of dynamic bends without damaging the wires. They can be arranged arbitrarily according to spatial layout requirements. Flexible circuits provide excellent electrical performance, meet the design needs of smaller and higher density installations, and also help reduce assembly steps and enhance reliability.

[0003] Based on existing technology, it has been found that because flexible circuit boards are relatively soft, when they are immersed in an electroplating bath and come into contact with the electroplating solution, they are easily swayed by the pressure of the electroplating solution. This causes adjacent flexible circuit boards to stick together, thus affecting the electroplating quality.

[0004] Furthermore, during the electroplating process of flexible circuit boards, the electroplating solution in the electroplating tank is in a turbulent state, which can easily cause adjacent flexible circuit boards to stick together again. After the flexible circuit board is electroplated, because there are multiple positioning holes or pin holes in the flexible circuit board, when the flexible circuit board is removed from the electroplating tank, electroplating solution can easily remain in the holes, which can affect the subsequent processing of the flexible circuit board. Summary of the Invention

[0005] To overcome the drawback of adjacent flexible circuit boards sticking to each other and affecting the electroplating quality, this invention provides a PCB pulse electroplating copper additive, its preparation method, and its application.

[0006] Technical solution: A PCB pulse electroplating copper additive, comprising an accelerator, an inhibitor, and a leveling agent, wherein the accelerator is sodium polydisulfide dipropane sulfonate, the inhibitor is polyethylene glycol-6000, and the leveling agent is an aza-aromatic benzyl quaternary ammonium salt compound, wherein the proportion of the accelerator is 1-10 ppm, the proportion of the inhibitor is 150-300 ppm, and the proportion of the leveling agent is 1-10 ppm.

[0007] To prepare the above-mentioned PCB pulse electroplating copper additive, the present invention also provides a method for preparing the PCB pulse electroplating copper additive, which includes the following steps:

[0008] S1: Pyridine is heated and stirred, and benzyl chloride is added dropwise;

[0009] S2: Heat the mixture under reflux to react, then cool;

[0010] S3: The product is recrystallized with solvent and filtered to obtain pyridine benzyl ammonium chloride, an additive for electroplating copper solution.

[0011] A PCB pulse copper plating apparatus includes an electroplating tank, support blocks, a liquid circulation pump, nozzles, a drive unit, and a placement assembly. At least four support blocks are fixedly connected to the bottom inner side of the electroplating tank. A liquid circulation pump is installed on the rear right side of the electroplating tank, with its inlet penetrating the electroplating tank and located inside. Multiple nozzles are fixedly connected to the outlet of the liquid circulation pump. All nozzles are fixedly connected to the electroplating tank. A drive unit is located on the upper part of the electroplating tank. The drive unit is connected to the placement assembly. The drive unit is used to move the placement assembly. The apparatus also includes a drive assembly, a top plate I, a guide tube, and extrusion plates. The electroplating tank is connected to the drive assembly. The drive assembly is connected to the top plate I. The drive assembly is used to move the top plate I. A guide tube is fixedly connected to the middle of the top plate I. At least two extrusion plates are fixedly connected to the top plate I.

[0012] Furthermore, a rubber block is provided at one end of the top plate I near the extrusion plate to prevent damage to the PCB board.

[0013] Furthermore, the extrusion plate is provided with a bending section for pushing the PCB board.

[0014] Furthermore, the placement component includes hooks, sliding rods, shelves, elastic elements, baffles, and limiting strips; at least two hooks are connected to the drive component; at least two sliding rods are slidably connected to each hook; shelves are fixedly connected to the lower ends of all sliding rods, the shelves have at least four legs at the bottom, and the bottom of the shelves has multiple through slots; an elastic element is fitted on the outer side of each sliding rod, one end of the elastic element is fixedly connected to the hook, and the other end of the elastic element is fixedly connected to the sliding rod; at least three baffles are fixedly connected to the lower part of the shelves; multiple limiting strips are fixedly connected to the inner bottom of the shelves, and each limiting strip has a groove.

[0015] Furthermore, the limiting strip is made of rubber to facilitate the movement of the PCB board.

[0016] Furthermore, the drive assembly includes a support frame I, a motor I, a connecting rod, an electric slide rail, an electric slider, and an electric actuator I; the support frame I is fixedly connected to the middle of the rear side of the electroplating tank; the motor I is mounted on the support frame I; the output shaft of the motor I is fixedly connected to the connecting rod; the electric slide rail is fixedly connected to the connecting rod; the electric slider is slidably connected to the electric slide rail; the electric actuator I is fixedly connected to the electric slider; and the telescopic part of the electric actuator I is fixedly connected to a top plate I.

[0017] Furthermore, it also includes a distributed system; the distributed system includes an electric actuator II, a support frame II, a motor II, a fixed plate, a tee pipe, a round pipe, and a limiting plate I; the electric actuator II is fixedly connected to the rear side of the electroplating tank; the telescopic part of the electric actuator II is fixedly connected to the support frame II; the support frame II is slidably connected to the electroplating tank; the motor II is mounted on the support frame II; the output shaft of the motor II is fixedly connected to the fixed plate; a tee pipe is mounted on the fixed plate; a round pipe is fixedly connected to the lower part of the tee pipe, and a solenoid valve is mounted on the round pipe; a limiting plate I is fixedly connected to the lower part of the fixed plate; the limiting plate I is connected to the round pipe, and the limiting plate I has multiple grooves, each groove containing a through hole.

[0018] Furthermore, it also includes a liquid removal system; the liquid removal system includes a top plate II, a limiting plate II, and a top block; the top plate II is fixedly connected to the top plate I; another round pipe is fixedly connected to the upper part of the three-way pipe, and a solenoid valve is installed on the round pipe; the limiting plate II is fixedly connected to the upper part of the fixing plate; the limiting plate II is connected to the round pipe, and the limiting plate II has multiple grooves, each groove having a vent hole; the top block is fixedly connected to the lower surface of the shelf.

[0019] The advantages and positive effects of this invention are:

[0020] (1) The synthesized pyridine benzyl ammonium chloride is used as a leveling agent in the copper electroplating process. The nitrogen-containing aromatic heterocycle is more likely to undergo electrophilic reaction, making the compound easier to adsorb on the cathode surface. Super filling without voids and gaps can be obtained in blind holes with aspect ratios of 0.625 and 1.25.

[0021] (2) The top plate I moves between the two PCBs that are close to each other, thereby squeezing the two PCBs that are close to each other and separating them. The bending part squeezes the edge of the PCB, thereby bending the PCB and increasing the distance between the two adjacent PCBs, thus separating the two PCBs that are close to each other.

[0022] (3) By blowing gas along the duct between two adjacent PCB boards, the distance between the two PCB boards is further increased, the problem of adjacent PCB boards touching each other is further avoided, and the electroplating quality of the PCB boards is improved.

[0023] (4) The upper part of the PCB board is limited by the limiting plate I, and the gas enters the limiting plate I along the three-way pipe and the round pipe, and finally sprays out from multiple through holes, so that the gas blows towards the PCB board, so that the PCB board no longer sticks to the inner wall of the groove on the limiting plate, thereby avoiding the problem of the inner wall of the groove on the limiting plate blocking the local area of ​​the PCB board and improving the electroplating quality of the PCB board.

[0024] (5) Limit the PCB board by limiting the limit plate and limiting plate II, and leave a gap between adjacent PCB boards. Then move the shelf up and down repeatedly, so that the limiting strip in the shelf shakes, thereby removing the residual electroplating liquid on the PCB board through shaking.

[0025] (6) The gas is blown along the through hole and the hole on the limiting plate II to the PCB board to further remove the residual electroplating solution on the PCB board, thereby avoiding the problem of residual electroplating solution on the PCB board. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0027] Figure 2 This is a partial three-dimensional structural diagram of the present invention;

[0028] Figure 3 This is a three-dimensional structural diagram of the shelf of the present invention;

[0029] Figure 4 This is a schematic diagram of the PCB board placement state according to the present invention;

[0030] Figure 5 This is a schematic diagram showing the installation position of the drive component of the present invention;

[0031] Figure 6 This is a cross-sectional view of the top plate I of the present invention;

[0032] Figure 7 This is a schematic diagram of the three-dimensional structure of the dispersion system of the present invention;

[0033] Figure 8 This is a schematic diagram of the installation position of the limiting plate I of the present invention;

[0034] Figure 9 This is a three-dimensional structural diagram of the liquid removal system of the present invention.

[0035] Component names and numbers in the diagram: 1-Electroplating tank, 11-Support block, 2-Liquid circulation pump, 21-Spray nozzle, 3-Driver, 4-Hook, 5-PCB board, 41-Slide rod, 42-Shelf, 43-Elastic component, 44-Baffle, 45-Limiting strip, 201-Support frame I, 202-Motor I, 203-Connecting rod, 204-Electric slide rail, 205-Electric slider, 206-Electric... Actuator I, 207-Top Plate I, 208-Conduit, 209-Extrusion Plate, 2091-Bending Section, 301-Electric Actuator II, 302-Support Frame II, 303-Motor II, 304-Fixed Plate, 305-Tee Pipe, 306-Round Pipe, 307-Limiting Plate I, 3071-Through Hole, 3072-Arc-shaped Section, 401-Top Plate II, 402-Limiting Plate II, 403-Top Block. Detailed Implementation

[0036] The preferred technical solution of the present invention will be described in detail below with reference to the accompanying drawings.

[0037] Example 1

[0038] A PCB pulse electroplating copper additive includes an accelerator, an inhibitor, and a leveling agent. The accelerator is sodium polydisulfide dipropane sulfonate, the inhibitor is polyethylene glycol-6000, and the leveling agent is an aza-aromatic benzyl quaternary ammonium salt compound. The proportion of the accelerator is 1-10 ppm, the proportion of the inhibitor is 150-300 ppm, and the proportion of the leveling agent is 1-10 ppm.

[0039] A method for preparing copper additives for PCB pulse electroplating, the method comprising the following steps:

[0040] S1: Pyridine is heated and stirred, and benzyl chloride is added dropwise;

[0041] S2: Heat the mixture under reflux to react, then cool;

[0042] S3: The product is recrystallized with solvent and filtered to obtain pyridine benzyl ammonium chloride, an additive for electroplating copper solution.

[0043] A PCB pulse copper plating device, according to Figure 1-6 As shown, the system includes an electroplating tank 1, support blocks 11, a liquid circulation pump 2, nozzles 21, a drive unit 3, and a placement assembly. Four rectangular support blocks 11 are fixedly attached to the bottom inner side of the electroplating tank 1. A liquid circulation pump 2 is installed on the rear right side of the electroplating tank 1, with its inlet penetrating the electroplating tank 1 and located inside the tank. The outlet of the liquid circulation pump 2 is fixedly connected to and connected to multiple nozzles 21. All nozzles 21 are fixedly connected to the electroplating tank 1. A drive unit 3 is installed on the upper part of the electroplating tank 1. The drive unit 3 is connected to the placement assembly. The drive unit 3 is used to move the placement assembly.

[0044] It also includes a drive assembly, a top plate I 207, a conduit 208, and an extrusion plate 209; the electroplating tank 1 is connected to the drive assembly; the drive assembly is connected to the top plate I 207; the drive assembly is used to drive the top plate I 207 to move; the conduit 208 is fixedly connected to the middle of the top plate I 207; two extrusion plates 209 are fixedly connected to the top plate I 207.

[0045] A rubber block is provided at one end of the top plate I207 near the extrusion plate 209 to prevent damage to the PCB board 5.

[0046] The extrusion plate 209 is provided with a bending part 2091 for pushing the PCB board 5.

[0047] The placement assembly includes hooks 4, sliding rods 41, shelves 42, elastic elements 43, baffles 44, and limiting strips 45; two hooks 4 are connected to the drive unit 3; two sliding rods 41 are slidably connected to each hook 4; shelves 42 are fixedly connected to the lower ends of all sliding rods 41, shelves 42 have four legs at the bottom, and multiple through slots at the bottom of shelves 42; an elastic element 43 is sleeved on the outside of each sliding rod 41, one end of the elastic element 43 is fixedly connected to the hook 4, and the other end of the elastic element 43 is fixedly connected to the sliding rod 41; three baffles 44 are fixedly connected to the lower part of shelves 42; multiple limiting strips 45 are fixedly connected to the inner bottom of shelves 42, and each limiting strip 45 has a groove.

[0048] The support block 11 contains a magnet for positioning and supporting the shelf 42.

[0049] The limiting strip 45 is made of rubber to facilitate the movement of the PCB board 5.

[0050] The drive assembly includes a support frame I201, a motor I202, a connecting rod 203, an electric slide rail 204, an electric slider 205, and an electric actuator I206; the support frame I201 is fixedly connected to the middle of the rear side of the electroplating tank 1; the motor I202 is mounted on the support frame I201; the output shaft of the motor I202 is fixedly connected to the connecting rod 203; the electric slide rail 204 is fixedly connected to the connecting rod 203; the electric slider 205 is slidably connected to the electric slide rail 204; the electric actuator I206 is fixedly connected to the electric slider 205; the telescopic part of the electric actuator I206 is fixedly connected to the top plate I207.

[0051] When electroplating copper onto PCB board 5: PCB board 5 is a flexible circuit board. Electroplating solution is pre-filled into electroplating bath 1, then multiple PCB boards 5 are placed in shelf 42, and the lower ends of PCB boards 5 are inserted into grooves on multiple limiting strips 45, such as... Figure 4 As shown, the two hooks 4 are then hung on the drive unit 3. The drive unit 3 is then controlled to move the two hooks 4, thereby moving all connected components and moving the shelf 42 into the electroplating tank 1. At the same time, the liquid circulation pump 2 is controlled to operate to extract the electroplating solution from the electroplating tank 1 and then flow back into the electroplating tank 1 through the nozzle 21. This allows the electroplating solution in the electroplating tank 1 to circulate and surge, so as to electroplat copper on the PCB board 5. After the PCB board 5 has been electroplated copper, the drive unit 3 is controlled to operate, thereby moving the shelf 42 out of the electroplating tank 1, thus realizing the batch electroplating of the PCB board 5.

[0052] Furthermore, when the shelf 42 moves into the electroplating tank 1, the four legs of the shelf 42 are supported by a support block 11. Since the support block 11 is equipped with a magnet, when the shelf 42 moves and abuts against the support block 11, the magnet in the support block 11 will attract the legs of the shelf 42, thereby making the shelf 42 stable during the electroplating process.

[0053] The initial state of the connecting rod 203 is vertical. Before electroplating copper on the PCB board 5, the external gas pump is connected to the conduit 208. Since the PCB board 5 is a flexible circuit board, and the lower part of the PCB board 5 is limited by multiple limiting strips 45, when the PCB board 5 is immersed in the electroplating tank 1 and comes into contact with the electroplating solution in the electroplating tank 1, the PCB board 5 is easily swayed by the pressure of the electroplating solution in the electroplating tank 1, which causes the adjacent PCB boards 5 to stick together, thus affecting the electroplating quality of the PCB board 5. To solve the above problem, the control motor I 202 is started. The output shaft of the motor I 202 rotates, driving the connecting rod 203 to rotate. The rotation of the connecting rod 203 changes from the initial vertical state to the horizontal state. 3. The rotation drives the electric slide rail 204 to rotate, which in turn drives all connected components to rotate, causing the top plate I 207 to approach the PCB board 5. Then, the electric actuator I 206 is controlled to start and drive the top plate I 207 to move diagonally downward, so that the top plate I 207 moves between the two PCB boards 5 that are close to each other, thereby squeezing the two PCB boards 5 and separating them. At the same time, the movement of the top plate I 207 drives the two squeezing plates 209 to move. Each of the two squeezing plates 209 moves and contacts one of the PCB boards 5, squeezing the PCB board 5 and further separating the two PCB boards 5.

[0054] Furthermore, when the two extrusion plates 209 move to extrude one PCB board 5, since the extrusion plates 209 move obliquely downwards and make contact with a local area of ​​the extrusion plates 209 and PCB board 5, the upper middle part of the two PCB boards 5 that are close together is difficult to separate effectively. At this time, the electric actuator I 206 is activated to drive the top plate I 207 to move continuously, which in turn drives the two extrusion plates 209 to move continuously, so that the bent part 2091 of each extrusion plate 209 contacts the edge of the PCB board 5, and the bent part 2091 extrudes the edge of the PCB board 5, thereby causing the PCB board 5 to bend, thereby increasing the distance between the two adjacent PCB boards 5, and thus separating the two PCB boards that are close together. At the same time, the external gas pump is controlled to operate to deliver gas into the conduit 208, so that the gas is blown along the conduit 208 between the two adjacent PCB boards 5, thereby further increasing the distance between the two PCB boards 5, further avoiding the problem of adjacent PCB boards 5 being close together, and improving the electroplating quality of the PCB boards 5.

[0055] Example 2:

[0056] Based on Example 1, according to Figure 7-8 As shown, it also includes a distributed system; the distributed system includes an electric actuator II 301, a support frame II 302, a motor II 303, a fixing plate 304, a three-way pipe 305, a round pipe 306, and a limiting plate I 307; the electric actuator II 301 is fixedly connected to the rear side of the electroplating tank 1; the support frame II 302 is fixedly connected to the telescopic part of the electric actuator II 301; the support frame II 302 is slidably connected to the electroplating tank 1; a motor is mounted on the support frame II 302. II303; The output shaft of motor II303 is fixedly connected to a fixing plate 304; A three-way pipe 305 is installed on the fixing plate 304; A round pipe 306 is fixedly connected to the lower part of the three-way pipe 305, and a solenoid valve is installed on the round pipe 306; A limit plate I 307 is fixedly connected to the lower part of the fixing plate 304; The limit plate I 307 is fixedly connected to and communicates with the round pipe 306, and multiple grooves are opened on the limit plate I 307, and a through hole 3071 is provided in each groove.

[0057] The limiting plate I 307 is provided with an arc-shaped part 3072 to avoid damaging the PCB board 5.

[0058] When limiting the PCB board 5: the initial state of the fixing plate 304 is vertical, and another external gas pump is connected to the three-way pipe 305 in advance. After the PCB boards 5 that are close to each other are separated by the top plate I 207, the conduit 208 and the extrusion plate 209, because the electroplating solution in the electroplating tank 1 is in a turbulent state during the electroplating process of the PCB board 5, it is very easy for the upper parts of the adjacent PCB boards 5 to come into contact again. At this time, the control motor II 303 is started, and the output shaft of the motor II 303 rotates, driving the fixing plate 304 to rotate. The rotation changes the position from vertical to horizontal, thereby moving all connected components. This causes the limiting plate I 307 to rotate into a horizontal position. Then, the electric actuator II 301 is activated, which moves the support frame II 302. The movement of the support frame II 302 moves the motor II 303, which in turn moves all connected components. This causes the limiting plate I 307 to move close to the PCB board 5, and the upper edge of the PCB board 5 is engaged in the groove of the limiting plate I 307, thus limiting the upper part of the PCB board 5.

[0059] When adjacent PCB boards 5 come into contact, the same working principle described above is used to separate the PCB boards 5 that are in contact with each other through the top plate I 207, the guide tube 208 and the extrusion plate 209. When the PCB board 5 is extruded, the PCB board 5 will move past the arc-shaped part 3072 into the groove of the limiting plate, and then the upper part of the PCB board 5 will be limited by the limiting plate I 307.

[0060] Furthermore, taking the front side of the electroplating tank 1 as a reference, the distance between the front and back of the groove on the limiting plate is greater than the thickness between the front and back of the PCB board 5. Thus, when the PCB board 5 moves into the groove on the limiting plate, there is a gap between the PCB board 5 and the groove on the limiting plate. This avoids the problem that the groove on the limiting plate will stick to the PCB board 5 during electroplating, causing obstruction in a local area of ​​the PCB board 5, resulting in insufficient electroplating of the PCB board 5 and affecting the electroplating quality of the PCB board 5.

[0061] Because the electroplating solution in the electroplating tank 1 is in a turbulent state, the PCB board 5 is very likely to stick to the inner wall of the groove on the limiting plate, thus causing local occlusion of the PCB board 5 and affecting the electroplating quality of the PCB board 5. At this time, the external gas pump is started to supply air into the three-way pipe 305, and the solenoid valve on the round pipe 306 is opened, so that the gas enters the limiting plate 1 307 along the three-way pipe 305 and the round pipe 306, and finally sprays out from multiple through holes 3071. The gas blows towards the PCB board 5, so that the PCB board 5 no longer sticks to the inner wall of the groove on the limiting plate, thus avoiding the problem of the inner wall of the groove on the limiting plate causing local occlusion of the PCB board 5 and improving the electroplating quality of the PCB board 5.

[0062] Example 3:

[0063] Based on Example 2, according to Figure 9 As shown, it also includes a liquid removal system; the liquid removal system includes a top plate II 401, a limiting plate II 402, and a top block 403; the top plate II 401 is fixedly connected to the top plate I 207; another round pipe 306 is fixedly connected to the upper part of the three-way pipe 305, and a solenoid valve is installed on the round pipe 306; the limiting plate II 402 is fixedly connected to the upper part of the fixing plate 304; the limiting plate II 402 is fixedly connected to and communicates with the round pipe 306, and multiple grooves are opened on the limiting plate II 402, each groove being provided with a vent hole; the top block 403 is fixedly connected to the lower surface of the shelf 42.

[0064] The elastic element 43 is a spring, and the electric actuators I206 and II301 are electric push rods.

[0065] When removing liquid from PCB board 5: After electroplating of PCB board 5 is completed, the shelf 42 is moved out of the electroplating tank 1 using the same working principle as described above. During this process, because PCB board 5 has multiple positioning holes or pin holes, electroplating liquid is easily left in the holes when PCB board 5 is moved out of the electroplating tank 1, which affects the subsequent processing of PCB board 5. When shelf 42 moves upward, because three baffles 44 are fixed to the lower part of shelf 42, the lower part of shelf 42 is in an open state, such as... Figure 4 and Figure 5 As shown, at this time, the shelf 42 moves upward, exposing the lower part of the PCB board 5 to the surface of the electroplating solution. Simultaneously, the limiting plate and limiting plate II 402 change from a vertical to a horizontal position in the aforementioned manner, causing the PCB board 5 to engage with the corresponding grooves on the limiting plate and limiting plate II 402. This limits the PCB board 5 through the limiting plate and limiting plate II 402, leaving a gap between adjacent PCB boards 5. Meanwhile, the top plate I 207 is located below the shelf 42. Then, the electric actuator I 206 is activated, causing the top plate I 207 to move diagonally downward. The movement of the top plate I 207 causes the top plate II 401 to move diagonally downward. The top plate II 401 moves and touches the top block 403, squeezing the top block 403 and causing it to move upward. The upward movement of the top block 403 drives the shelf 42 to move, which in turn drives all the sliding rods 41 to move, thereby compressing all the elastic elements 43. This causes the limiting strip 45 inside the shelf 42 to move upward. At the same time, the electric actuator I 206 is activated to drive the top plate I 207 to move back and forth, which in turn causes the shelf 42 to move up and down back and forth, causing the limiting strip 45 inside the shelf 42 to vibrate. This vibration removes the residual electroplating solution on the PCB board 5.

[0066] Furthermore, when the PCB board 5 is limited by the limiting plate and the limiting plate II 402, the external gas pump is started to supply gas into the three-way pipe 305, and the solenoid valves on the two round pipes 306 are both in the open state, so that the gas is blown towards the PCB board 5 through the through hole 3071 and the hole on the limiting plate II 402. In this way, the gas blown towards the PCB board 5 further removes the residual electroplating solution on the PCB board 5, thereby avoiding the problem of residual electroplating solution on the PCB board 5.

[0067] It should be understood that the above description is for illustrative purposes only and is not intended to limit the invention. Those skilled in the art will understand that variations of the invention are included within the scope of the claims herein.

Claims

1. A PCB pulse copper plating device, characterized in that: The system includes an electroplating tank (1), support blocks (11), a liquid circulation pump (2), nozzles (21), a drive unit (3), and a placement assembly; at least four support blocks (11) are fixedly connected to the bottom inner side of the electroplating tank (1); a liquid circulation pump (2) is installed on the right rear side of the electroplating tank (1), and the inlet of the liquid circulation pump (2) penetrates through the electroplating tank (1) and is located inside the electroplating tank (1); multiple nozzles (21) are fixedly connected to the outlet of the liquid circulation pump (2); all nozzles (21) are fixedly connected to the electroplating tank (1); the electroplating tank (1) is mounted on... The part is provided with a driving component (3); the driving component (3) is connected to a placement component; the driving component (3) is used to drive the placement component to move; the feature is that it also includes a driving component, a top plate I (207), a conduit (208) and an extrusion plate (209); the electroplating tank (1) is connected to the driving component; the driving component is connected to the top plate I (207); the driving component is used to drive the top plate I (207) to move; a conduit (208) is fixedly connected to the middle of the top plate I (207); at least two extrusion plates (209) are fixedly connected to the top plate I (207).

2. The PCB pulse copper plating apparatus according to claim 1, characterized in that: A rubber block is provided at one end of the top plate I (207) near the extrusion plate (209) to prevent damage to the PCB board (5).

3. The PCB pulse copper plating apparatus according to claim 1, characterized in that: The extrusion plate (209) is provided with a bending section (2091) for pushing the PCB board (5).

4. A PCB pulse copper plating apparatus according to any one of claims 1-3, characterized in that: The placement component includes hooks (4), slide bars (41), shelves (42), elastic elements (43), baffles (44), and limiting strips (45); at least two hooks (4) are connected to the drive unit (3); at least two slide bars (41) are slidably connected to each hook (4); shelves (42) are fixedly connected to the lower ends of all slide bars (41), shelves (42) are provided with at least four legs at the bottom, and shelves (42) are provided with multiple through slots at the bottom; an elastic element (43) is sleeved on the outside of each slide bar (41), one end of the elastic element (43) is fixedly connected to the hook (4), and the other end of the elastic element (43) is fixedly connected to the slide bar (41); at least three baffles (44) are fixedly connected to the lower part of shelves (42); multiple limiting strips (45) are fixedly connected to the bottom inner side of shelves (42), and each limiting strip (45) has a groove.

5. The PCB pulse copper plating apparatus according to claim 2, characterized in that: The limiting strip (45) is made of rubber to facilitate the movement of the PCB board (5).

6. The PCB pulse copper plating apparatus according to claim 2, characterized in that: The drive assembly includes a support frame I (201), a motor I (202), a connecting rod (203), an electric slide rail (204), an electric slider (205), and an electric actuator I (206); the support frame I (201) is fixedly connected to the middle of the rear side of the electroplating tank (1); the motor I (202) is mounted on the support frame I (201); the output shaft of the motor I (202) is fixedly connected to the connecting rod (203); the electric slide rail (204) is fixedly connected to the connecting rod (203); the electric slider (205) is slidably connected to the electric slide rail (204); the electric actuator I (206) is fixedly connected to the electric slider (205); the telescopic part of the electric actuator I (206) is fixedly connected to the top plate I (207).

7. The PCB pulse copper plating apparatus according to claim 6, characterized in that: It also includes a distributed system; the distributed system includes an electric actuator II (301), a support frame II (302), a motor II (303), a fixing plate (304), a three-way pipe (305), a round pipe (306), and a limiting plate I (307); the electric actuator II (301) is fixedly connected to the rear side of the electroplating tank (1); the telescopic part of the electric actuator II (301) is fixedly connected to the support frame II (302); the support frame II (302) is slidably connected to the electroplating tank (1); a motor is installed on the support frame II (302). II (303); The output shaft of motor II (303) is fixedly connected to a fixing plate (304); A three-way pipe (305) is installed on the fixing plate (304); A round pipe (306) is fixedly connected to the lower part of the three-way pipe (305), and a solenoid valve is installed on the round pipe (306); A limit plate I (307) is fixedly connected to the lower part of the fixing plate (304); The limit plate I (307) is connected to the round pipe (306), and multiple grooves are opened on the limit plate I (307), and a through hole (3071) is provided in each groove.

8. The PCB pulse copper plating apparatus according to claim 7, characterized in that: It also includes a liquid removal system; the liquid removal system includes a top plate II (401), a limiting plate II (402) and a top block (403); the top plate II (401) is fixedly connected to the top plate I (207); another round pipe (306) is fixedly connected to the upper part of the three-way pipe (305), and a solenoid valve is installed on the round pipe (306); the limiting plate II (402) is fixedly connected to the upper part of the fixing plate (304); the limiting plate II (402) is connected to the round pipe (306), and multiple grooves are opened on the limiting plate II (402), and a vent hole is provided in each groove; the top block (403) is fixedly connected to the lower surface of the shelf (42).

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