Wafer translation assembly, automatic loading and unloading mechanism and method

Abstract

The application discloses a wafer translation assembly, an automatic feeding and discharging mechanism and a method, belongs to the technical field of wafer processing, and is used for solving the technical problems of complex wafer conveying equipment structure, insufficient fast, stable and reliable clamping of wafers and low feeding and discharging efficiency during wafer processing of different types. The wafer translation assembly comprises a Y-direction sliding table (32) and a fork-shaped bracket (322) for grabbing a wafer (5) and fixedly arranged on the Y-direction sliding table (32), the bracket (322) extends in the horizontal direction; further comprising a mechanical hand (321) arranged on the Y-direction sliding table (32), the mechanical hand (321) comprises a pressing block (323) and a grabbing cylinder (324), the grabbing cylinder (324) can drive the pressing block (323) to move to stretch forward and clamp the wafer (5) or release the wafer (5) and shrink backward. The application is convenient and stable for taking wafers, does not interfere with subsequent processes, is suitable for wafers of different models and sizes, has a wide application range, and is high in efficiency because processing and feeding and discharging are simultaneously performed.

Description

Technical Field

[0001] This invention belongs to the field of wafer processing technology, and specifically relates to a wafer translation component, an automatic loading and unloading mechanism and method. Background Technology

[0002] Currently, the automatic loading and unloading systems of wafer processing equipment mainly use three-degree-of-freedom wafer handling robots for wafer handling. Existing three-degree-of-freedom wafer handling robots are standard outsourced components, which cannot be easily integrated into wafer processing equipment. Their wafer clamping is not fast, stable, or reliable enough. In addition, they can only load, process, and unload one wafer at a time, resulting in low equipment loading and unloading efficiency. Furthermore, general-purpose robots are relatively expensive, which is not conducive to cost control of batch equipment or mass production. Summary of the Invention

[0003] Based on the above analysis, the present invention aims to provide a wafer translation component, an automatic loading and unloading mechanism and method to solve the problems of complex structure, insufficient fast, stable and reliable wafer clamping, and low loading and unloading efficiency of existing wafer handling equipment in different types of wafer processing.

[0004] The objective of this invention is mainly achieved through the following technical solutions.

[0005] On one hand, the present invention provides a wafer translation assembly, which includes a Y-axis slide and a fork-shaped bracket fixedly disposed on the Y-axis slide for supporting the wafer, the bracket extending in a horizontal direction; it also includes a robot arm disposed on the Y-axis slide, the robot arm including a pressure block and a gripping cylinder, the gripping cylinder being capable of driving the pressure block to move so that it extends forward and presses down to clamp the wafer or lifts up to release the wafer and retracts.

[0006] Furthermore, the robotic arm also includes a spring-linkage transmission mechanism, through which the gripping cylinder drives the pressure block to move back and forth and rotate.

[0007] Furthermore, the spring linkage transmission mechanism includes: a pressure block push rod, a pressure block base, a pressure block connecting rod, a pressure block spring guide post, and a pressure block spring. The pressure block push rod is fixedly connected to the output end of the gripping cylinder. The pressure block push rod is elastically connected to the pressure block base through the pressure block spring guide post and the pressure block spring. The top of the pressure block push rod is hinged to one end of the pressure block connecting rod, the top of the pressure block is hinged to the other end of the pressure block connecting rod, and the middle part of the pressure block is hinged to the pressure block base.

[0008] Furthermore, the top of the pressure block push rod has a first protrusion, and the upper middle position of the first protrusion has a first through hole, which penetrates the front and rear sides of the first protrusion; a second protrusion is provided upward from the top of the first protrusion, and the upper part of the second protrusion has a second through hole, which penetrates the left and right sides of the second protrusion.

[0009] Furthermore, the pressure block spring guide post is disposed in the first through hole, one end of the pressure block spring guide post is fixedly connected to the pressure block base, the pressure block spring is sleeved on the pressure block spring guide post and located between the pressure block push rod and the pressure block base; the other end of the pressure block spring guide post is provided with a limiting platform.

[0010] Furthermore, the pressure block connecting rod and the pressure block push rod are hinged together through the second through hole and the first short connecting shaft.

[0011] Furthermore, the robotic arm support also includes a pressure block guide rail support. ， The pressure block base bracket has an open-shaped structure. The two protrusions on the left side of the pressure block base bracket are fitted onto one pressure block guide rail bracket, and the two protrusions on the right side of the pressure block base bracket are fitted onto another pressure block guide rail bracket. The two pressure block guide rail brackets are arranged in parallel and spaced apart, so that the pressure block base bracket can move along the pressure block guide rail bracket in the front-back direction.

[0012] Furthermore, the Y-axis slide bracket also includes a groove-shaped base bracket and a top plate bracket. The pressure block base bracket is slidably disposed on the upper surface of the top plate bracket. The gripping cylinder bracket and the pressure block push rod bracket are disposed within the groove-shaped base bracket. The top plate bracket is provided with a first open bracket. The first protruding bracket of the pressure block push rod bracket can extend into the second open bracket in the middle of the first open bracket and the pressure block base bracket, and the pressure block push rod bracket can move along the length direction of the first open bracket and the second open bracket.

[0013] Furthermore, the pressure block has a horizontally extending first part, a second part extending vertically downward from the front side of the first part, and a third part extending horizontally forward from the bottom of the second part; the rear end of the first part is provided with a third through hole penetrating the left and right sides, and the rear middle of the first part is provided with an upwardly protruding third protrusion, and the third protrusion is provided with a fourth through hole penetrating the left and right sides.

[0014] Furthermore, the pressure block connecting rod is hinged to the pressure block through the fourth through hole and the second short connecting shaft; the pressure block is hinged to the long connecting shaft through the third through hole.

[0015] The present invention also provides an automatic loading and unloading mechanism, including a wafer translation component as described above, a cassette lifting component, and a rotary loading and unloading component. The cassette lifting component, the wafer translation component, and the rotary loading and unloading component are arranged sequentially. The rotary loading and unloading component includes a rotating base, a rotating motor, a rotating shaft, a rotating frame, an adapter, a lifting cylinder, a vacuum suction cup bracket, and a vacuum suction cup. The rotating motor is located at the top of the rotating base, and its output shaft extends downward and is connected to the rotating shaft. The bottom of the rotating shaft is fixedly connected to the middle of the rotating frame. The rotating frame is a rod, and each end of the rotating frame is connected to an adapter. Each adapter is fixedly equipped with a lifting cylinder, and the output end of each lifting cylinder is fixedly connected to a vacuum suction cup bracket. Multiple vacuum suction cups are arranged on each vacuum suction cup bracket, and the position of each vacuum suction cup is adjustable.

[0016] On the other hand, the present invention also provides an automatic wafer loading and unloading method, using the automatic loading and unloading mechanism as described above, comprising the following steps:

[0017] S1: The cassette containing the wafers is transported to the target height via the cassette lifting assembly;

[0018] S2: The wafer is removed from the cassette by the wafer translation assembly and transported to the loading station by the Y-axis slide table;

[0019] S3: The wafer is removed from the wafer translation component by the rotating loading and unloading component, and the wafer is driven to rise, rotate and fall to place the wafer on the worktable;

[0020] S4: The processed wafer is taken out from the worktable by the rotating loading and unloading assembly, and the wafer is driven to rise, rotate and fall, and the wafer is placed on the wafer translation assembly;

[0021] S5: The wafer is returned to the cassette using the wafer translation assembly.

[0022] Furthermore, step S2 specifically includes:

[0023] S21: The Y-axis slide moves toward the material box lifting assembly, so that the bracket extends under the wafer;

[0024] S22: The output end of the gripping cylinder extends forward, driving the pressure block push rod to move toward the material box lifting assembly. The pressure block push rod drives the pressure block base, the pressure block connecting rod, and the pressure block to move together in the same direction.

[0025] S23: After the pressure block base moves to the limit position, the pressure block push rod continues to move, compressing the pressure block spring; at the same time, the pressure block connecting rod continues to move forward, thereby driving the pressure block to rotate counterclockwise around the long connecting shaft, and the third part of the pressure block presses down until it presses down on the wafer;

[0026] S24: The Y-axis slide table moves away from the material box lifting assembly to the loading station;

[0027] S25: The output end of the gripping cylinder retracts, driving the pressure block push rod to move away from the material box lifting assembly. The pressure block spring extends, and the pressure block base remains stationary under the action of the pressure block spring. At the same time, the pressure block connecting rod moves to the rear, thereby driving the pressure block to rotate clockwise around the long connecting shaft. The third part of the pressure block is lifted up until the driving pressure block push rod contacts the limit head of the pressure block spring guide post.

[0028] S26: The pressure block push rod continues to move backward, causing the pressure block base, pressure block connecting rod and pressure block to move together in the same direction to the limit position.

[0029] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects.

[0030] The wafer translation assembly provided by this invention has a compact structure, small size, and small footprint, and can be easily positioned as needed. It can support the wafer from below and press it down from above, providing stable and reliable clamping. Furthermore, because the clamping block can move forward and backward, there is no interference when the rotating loading and unloading assembly picks up the wafer.

[0031] Furthermore, using a single cylinder to drive the pressing block's forward and backward movement and rotation around its axis saves on drive components and reduces costs. It also makes the clamping action smooth and fast, improving work efficiency.

[0032] The automatic loading and unloading mechanism provided by this invention drives the material box to move up and down to the target position through the material box lifting component, so that the wafer translation component picks up a wafer to be processed and transports it to the loading station. The vacuum suction cup on one side of the rotating loading and unloading component picks up the wafer to be processed, and the vacuum suction cup on the other side picks up the processed wafer. After rotating 180°, the wafers are placed on both sides. The wafer processing and picking and placing are carried out simultaneously in separate areas, with a high degree of automation and improved work efficiency.

[0033] With multiple vacuum chucks adjustablely mounted on each vacuum chuck holder, this mechanism can be applied to wafers of different sizes and types, making it widely applicable.

[0034] The automatic wafer loading and unloading method provided by this invention improves the stability of the conveying process, thereby increasing the efficiency of automatic wafer loading and unloading.

[0035] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained through the embodiments described and the accompanying drawings. Attached Figure Description

[0036] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0037] Figure 1 This is a structural schematic diagram of a specific embodiment of the present invention;

[0038] Figure 2 This is a side view of a specific embodiment of the present invention;

[0039] Figure 3 This is a schematic diagram of the structure of the cassette and wafer in this invention;

[0040] Figure 4 This is a schematic diagram of the wafer translation assembly with a wafer in this invention;

[0041] Figure 5 This is a top view of the wafer translation assembly without a wafer according to the present invention;

[0042] Figure 6 This is an exploded view of the wafer translation component of the present invention;

[0043] Figure 7 This is a schematic diagram of the structure of the rotary loading and unloading assembly of the present invention;

[0044] Figure 8 for Figure 7 A front view of the rotating loading and unloading assembly in the middle;

[0045] Figure 9 for Figure 7 A schematic diagram of the vacuum suction cup bracket in the rotary loading and unloading assembly;

[0046] Figure 10 for Figure 9 A top view of the vacuum suction cup holder.

[0047] Figure label:

[0048] 1-Material box; 2-Material box lifting assembly; 21-Z-axis base; 22-Z-axis slide; 221-Material box base; 23-Z-axis motor; 3-Wafer translation assembly; 31-Y-axis base; 32-Y-axis slide; 321-Robot arm; 322-Bracket; 323-Pressure block; 3231-Third through hole; 3232-Third protrusion; 3233-Fourth through hole; 324-Grip cylinder; 325-Pressure block push rod; 3251-First protrusion; 3252-Second protrusion; 3253-First through hole; 3254-Second through hole; 326-Pressure block base; 3261-Second opening; 327-Pressure block connecting rod; 3 28-Pressure block guide rail; 329-Pressure block guide rail seat; 330-Pressure block spring guide post; 331-Pressure block spring; 332-Long connecting shaft; 333-Short connecting shaft; 334-Slotted base; 335-Top plate; 336-First opening; 33-Y-direction motor; 4-Rotating loading and unloading assembly; 41-Rotating seat; 42-Rotating motor; 43-Rotating shaft; 44-Rotating frame; 45-Adapter seat; 46-Vacuum suction cup bracket; 461-I-shaped main body; 462-Radial extension end; 463-Weight reduction groove; 464-Mounting groove; 47-Air pipe; 48-Vacuum suction cup; 49-Lifting cylinder; 5-Wafer. Detailed Implementation

[0049] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0050] It should be noted that the front, back, left, and right directions in this invention are all schematic representations with reference to the accompanying drawings and should not be construed as limiting the invention.

[0051] Example 1

[0052] See Figures 4-6 This embodiment discloses a wafer translation assembly 3, which includes a horizontally extending Y-axis mount 31. A Y-axis slide 32 is disposed on the top of the Y-axis mount 31, and the Y-axis slide 32 can slide along the length direction of the Y-axis mount 31. A Y-axis motor 33 is disposed on the rear side of the Y-axis mount 31, and a Y-axis transmission system is disposed inside the Y-axis mount 31. The output end of the Y-axis motor 33 is connected to the Y-axis transmission system, and the output end of the Y-axis transmission system is connected to the Y-axis slide 32. The Y-axis motor 33 drives the Y-axis slide 32 to slide back and forth through the Y-axis transmission system.

[0053] See Figures 4-6The Y-axis slide 32 has a forward-extending, fork-shaped bracket 322 that can support the wafer 5 from below. The Y-axis slide 32 also includes a robot arm 321, which includes a pressure block 323 and a gripping cylinder 324. The gripping cylinder 324 can drive the pressure block 323 to move forward and clamp the wafer 5 or release the wafer 5 and retract it.

[0054] The Y-axis slide 32 also includes a grooved base 334 and a top plate 335. The top plate 335 is disposed above the grooved base 334 and closes the opening of the grooved base 334. The front side of the top plate 335 is provided with two elongated slots. Multiple fasteners are inserted downward from the two elongated slots and pass through the mounting part of the bracket 322, so that the bracket 322 is fixed to the lower surface of the top plate 335.

[0055] The robotic arm 321 also includes a block push rod 325, a block base 326, a block connecting rod 327, a block guide rail 328, a block guide rail seat 329, a block spring guide post 330, a block spring 331, a long connecting shaft 332, and a short connecting shaft 333.

[0056] The gripping cylinder 324 is housed within the grooved base 334 and fixed to the bottom plate of the grooved base 334. Its piston rod extends forward, and the end of the piston rod is fixedly connected to the pressure block push rod 325, which can drive the pressure block push rod 325 to move in the front-back direction.

[0057] The bottom of the pressure block push rod 325 can move back and forth on the base plate of the grooved base. Its top has a first protrusion 3251, and a first through hole 3253 at the upper middle position of the first protrusion 3251, penetrating the front and rear sides of the first protrusion 3251. A second protrusion 3252 is provided upwards from the top of the first protrusion 3251, and a second through hole 3254 is provided on the upper part of the second protrusion 3252, penetrating the left and right sides of the second protrusion 3252. That is, the axes of the first through hole 3253 and the second through hole 3254 are both located in a horizontal plane and are perpendicular to each other.

[0058] A long, narrow first opening 336 is provided on the top plate 335. A first protrusion 3251 of the pressure block push rod 325 extends from below into the first opening 336 and into a corresponding second opening 3261 in the pressure block base 326, and can move along the length of the first opening 336 and the second opening 3261. A first through hole 3253 is located in the second opening 3261. A second protrusion 3252 protrudes upward from the top surface of the second opening 3261.

[0059] A pressure spring guide post 330 is provided within the first through hole 3253. The pressure spring guide post 330 has a limiting platform, the cross-section of which is larger than the cross-section of the first through hole. The pressure spring guide post 330 is inserted into the first through hole from back to front, and the limiting platform restricts the forward displacement of the pressure spring guide post 330. The other end of the pressure spring guide post 330 extends a certain distance out of the first through hole and is fixedly connected to the inner side of the second opening 3261 of the pressure block base 326. The pressure spring 331 is sleeved on the pressure spring guide post 330, with one end abutting against the inner side of the second opening 3261 of the pressure block base 326 and the other end abutting against the outer peripheral surface of the first through hole 3253. The pressure spring 331 ensures that, without external force, the distance between the inner side of the second opening 3261 of the pressure block base 326 and the front side of the pressure block push rod 325 is maximized.

[0060] There are two pressure block guide rail seats 329, which are arranged symmetrically on the upper surface of the top plate 335. The two pressure block guide rails 328 are fixedly mounted on the left and right pressure block guide rail seats 329 respectively.

[0061] The pressure block base 326 has a roughly U-shaped structure. Both of its protrusions on the left and right sides are provided with through holes extending forward and backward. Two pressure block guide rails 328 pass through the through holes on both sides of the pressure block base 326, so that the pressure block base 326 can move along the pressure block guide rails 328 in the forward and backward direction.

[0062] The pressure block connecting rod 327 is an H-shaped plate, with four protrusions each having a through hole extending to the left and right. The second protrusion 3252 of the pressure block push rod 325 is engaged between the two protrusions on the rear side of the pressure block connecting rod 327. A short connecting shaft 333 passes sequentially through the through hole on the protrusion of the pressure block connecting rod 327 and the second through hole 3254 on the second protrusion 3252 of the pressure block push rod 325, rotatably connecting the pressure block push rod 325 and the pressure block connecting rod 327 together.

[0063] The front side of the pressure block connecting rod 327 is rotatably connected to the pressure block 323.

[0064] The pressure block 323 has a horizontally extending first part, a second part extending vertically downward from the front side of the first part, and a third part extending horizontally forward from the bottom of the second part. A third through hole penetrating the left and right sides is provided at the rear end of the first part, and an upwardly protruding third protrusion is provided in the middle of the rear side of the first part, with a fourth through hole penetrating the left and right sides on the third protrusion. That is, the axes of the third and fourth through holes are parallel to each other.

[0065] The third protrusion of the pressure block 323 is engaged between the two protrusions on the front side of the pressure block connecting rod 327. A short connecting shaft 333 passes through the through hole on the protrusion of the pressure block connecting rod 327 and the fourth through hole on the third protrusion of the pressure block 323 in sequence, so as to rotatably connect the pressure block 323 and the pressure block connecting rod 327 together.

[0066] The first part of the pressure block 323 extends into the groove between the two protrusions at the bottom of the "open" shaped pressure block base 326. A long connecting shaft 332 is inserted into the through hole on the protrusion at the bottom of the pressure block base 326 and the third through hole of the pressure block 323 in sequence, so as to rotatably connect the pressure block base 326 and the pressure block 323 together.

[0067] When the piston rod of the gripping cylinder 324 extends outward, it pushes the pressure block push rod 325 forward. The pressure block push rod 325 pushes the pressure block connecting rod 327 and the pressure block base 326 forward simultaneously. When the pressure block base 326 moves to the front end of the pressure block guide rail 328, it is limited by the pressure block guide rail seat 329 and cannot move forward further. At this time, the pressure block push rod 325 continues to move forward, compressing the pressure block spring 331. The pressure block connecting rod 327 continues to move forward under the action of the short connecting shaft 333, thereby driving the pressure block 323 to rotate around the long connecting shaft 332. The third part of the pressure block 323 presses down, pressing the wafer 5.

[0068] The wafer translation assembly 3 can remove the wafer 5 from the material box 1 through the bracket 322 and the pressure block 323, and translate the wafer 5 to the loading station.

[0069] Upon reaching the loading station, the piston rod of the gripping cylinder 324 retracts, and the pressure block push rod 325 drives the pressure block 323 to rotate upward and lift it up, and then move it to the rear side, exiting above the wafer 5 to avoid interference in subsequent processes.

[0070] Example 2

[0071] This embodiment relates to an automatic loading and unloading mechanism for wafers.

[0072] like Figures 1-2 As shown, the mechanism comprises: a bin lifting assembly 2, a wafer translation assembly 3 (as described in Embodiment 1), and a rotary loading / unloading assembly 4. The bin lifting assembly 2 extends vertically and is fixedly mounted on the ground or a rack. The wafer translation assembly 3 is located on the top side of the bin lifting assembly 2 and extends horizontally. The rotary loading / unloading assembly 4 is located above and to the side of the wafer translation assembly 3.

[0073] The specific structure and operation of the wafer translation component 3 are described in Example 1.

[0074] See Figure 3The wafer cassette 1 includes two side plates, whose top and bottom are connected. Multiple parallel grooves are formed on the inner surfaces of the two side plates, each extending horizontally and spaced vertically. Multiple wafers 5 are placed vertically at intervals in the cassette 1, each wafer 5 corresponding to a groove. Wafers 5 can be placed into or removed from the cassette 1 from either the front or rear sides.

[0075] The material box 1 is driven to move vertically by the material box lifting assembly 2 and can be positioned at any desired height.

[0076] See Figure 2 The material box lifting assembly 2 includes a vertically extending Z-axis base 21, on the front side of which a Z-axis slide 22 is slidably mounted. A Z-axis motor 23 is fixedly mounted at the bottom of the Z-axis base 21. Inside the Z-axis base 21, a Z-axis transmission system is provided. The output end of the Z-axis motor 23 is connected to the Z-axis transmission system, and the output end of the Z-axis transmission system is connected to the Z-axis slide 22. The Z-axis motor 23 can drive the Z-axis slide to move up and down via the Z-axis transmission system.

[0077] The Z-axis transmission system can be a conventional mechanical structure that converts rotary motion into linear motion. For example, it can be a lead screw and nut mechanism. The output end of the Z-axis motor 23 is connected to the end of the lead screw, the nut is sleeved on the lead screw, and is fixedly connected to the Z-axis slide 22.

[0078] A material box seat 221 is provided on the Z-axis slide table 22. The material box 1 can be placed on the material box seat 221 and thus be moved vertically by the Z-axis slide table 22.

[0079] The wafer translation assembly 3 is located on the top side of the cassette lifting assembly 2 and extends horizontally. The wafer translation assembly 3 can remove wafer 5 from the cassette 1 or place wafer 5 into the cassette 1. The wafer translation assembly 3 removes wafer 5 from the cassette 1 and translates it to the loading station. The wafer translation assembly 3 can also receive wafer 5 from the rotating loading / unloading assembly 4 and translate it to the cassette lifting assembly 2, placing the processed wafer 5 into the cassette 1.

[0080] The rotary loading and unloading assembly 4 is positioned above and beside the wafer translation assembly 3, between the wafer translation assembly 3 and the processing position of the processing table (not shown in the figure).

[0081] See Figures 7-8 The rotary loading and unloading assembly 4 includes a rotary base 41, which is fixedly connected to the frame (not shown in the figure). A rotary motor 42 is arranged above the rotary base 41, with the output end of the rotary motor 42 facing downwards, and is connected to the vertically arranged rotary shaft 43 through a flexible coupling.

[0082] A rotating frame 44 is fixedly connected to the bottom of the rotating shaft 43. The rotating frame 44 is a rod, with its upper middle section fixedly connected to the rotating shaft 43, and its two ends connected to a vacuum suction cup bracket 46 via an adapter 45 and a lifting cylinder 49, respectively. One side of the adapter 45 is fixedly connected to the end of the rotating frame 44, and the other side is fixedly connected to the lifting cylinder 49. The piston rod of the lifting cylinder 49 can reciprocate vertically. The piston rod of the lifting cylinder 49 is fixedly connected to the center of the vacuum suction cup bracket 46 via a connecting rod.

[0083] See Figures 9-10 The vacuum suction cup bracket 46 includes an I-shaped main body 461, the center of which is connected to the piston rod of the lifting cylinder via a connecting rod. A weight-reducing groove 463 is provided at the connection between the longitudinal portion in the middle and the transverse portions at both ends of the I-shaped main body 461. The weight-reducing groove 463 is preferably triangular, in order to minimize weight and energy consumption while ensuring the strength of the vacuum suction cup bracket 46.

[0084] The I-shaped main body 461 has a radially extending end 462 at each of its four ends, and the intersection of the lines connecting the centers of the four radially extending ends 462 is located at the center of the I-shaped main body 461. Each radially extending end 462 is provided with a radially extending elongated mounting groove 464, and a screw is movably mounted in each mounting groove 464. A locking nut is provided on the upper and lower sides of the screw. The top of the vacuum chuck 48 is fixedly connected to the bottom of the screw. By tightening the locking nuts, the position of the screw in the mounting groove 464 can be adjusted, thereby adjusting the radial position of the vacuum chuck 48, so that the rotary loading and unloading assembly 4 can be adapted to wafers 5 of different sizes.

[0085] Each vacuum suction cup 48 is connected to an external negative pressure source via an air pipe 47. The air pipe 47 includes a main pipe, a first branch pipe, a second branch pipe, and a third branch pipe. One end of the main pipe is connected to the negative pressure source, and the other end is connected to the middle of the first branch pipe. The first branch pipe is positioned above the I-shaped main body 461, adjacent to the upper surface of the I-shaped main body 461, see [reference needed]. Figure 10 It is located on the opposite side of the lifting cylinder 49, near the center of the I-shaped main body 461. Its extension direction is parallel to the direction of the middle part of the I-shaped main body 461. The middle part of the first branch pipe is connected to the main pipe through a connector. Each end of the first branch pipe is connected to a second branch pipe through a connector. Each second branch pipe extends vertically downwards for a certain distance and is connected to one end of two third branch pipes through a tee connector. Each third branch pipe extends horizontally, and the other end is connected to a vacuum suction cup 48.

[0086] The projections of the first, second, and third branch pipes on the horizontal plane are in the shape of an I-shape, and overlap with the projection of the I-shaped main body 461 on the horizontal plane.

[0087] In some embodiments, the first and third branches are both flexible branches, with lengths such that when each vacuum chuck 48 is adjusted to the farthest end of the mounting groove 464 relative to the center of the I-shaped body 461, the first and third branches are in a straight state. When each vacuum chuck 48 is adjusted to the nearest end of the mounting groove 464 relative to the center of the I-shaped body 461, the first and third branches are in a relaxed state, with their middle sections naturally drooping, and their lowest drooping position being higher than the bottom surface of the vacuum chuck 48, so as not to reach the upper surface of the wafer 5 and avoid interference.

[0088] In some embodiments, the first and third branches are both flexible branches whose lengths can vary within a certain range. The maximum lengths of the first and third branches allow each vacuum suction cup 48 to be adjusted to the farthest end of the mounting groove 464 relative to the center of the I-shaped body 461, at which point neither the first nor the third branch will be stretched or fail, for example, break.

[0089] The working process of the automatic loading and unloading mechanism provided by this invention is as follows:

[0090] The Z-axis slide of the material box lifting assembly 2 moves the material box 1 to a set height position. The Y-axis slide 32 of the wafer translation assembly 3 moves the robot arm 321 toward the material box 1, so that the bracket 322 extends into the material box 1 and clamps the wafer 5. The Y-axis slide 32 moves the robot arm 321 away from the material box 1 until it moves to the loading station.

[0091] The lifting cylinder 49 on one side of the rotating loading / unloading assembly 4 drives the vacuum suction cup bracket 46 to descend, the vacuum suction cup 48 contacts the upper surface of the wafer 5, the vacuum negative pressure is activated, the vacuum suction cup 48 picks up the wafer 5, the bracket 322 of the control robot 321 releases the wafer 5, the lifting cylinder 49 drives the vacuum suction cup bracket 46 to rise, and then the rotary motor 42 drives the rotary shaft 43 to rotate 180°, thereby the rotary frame 44 drives the wafer 5 to rotate 180° around the rotary shaft 43, reaching above the processing position on the processing table. The lifting cylinder 49 drives the vacuum suction cup bracket 46 to descend, the wafer 5 contacts the upper surface of the processing table, the vacuum negative pressure is turned off, the lifting cylinder 49 drives the vacuum suction cup bracket 46 to rise, so that the wafer 5 is placed at the processing position on the processing table.

[0092] After wafer 5 is processed, lifting cylinder 49 drives vacuum chuck support 46 to descend, vacuum chuck 48 contacts the upper surface of wafer 5, vacuum negative pressure is activated, vacuum chuck 48 picks up wafer 5, lifting cylinder 49 drives vacuum chuck support 46 to rise, then rotary motor 42 drives rotary shaft 43 to rotate 180°, so rotary frame 44 drives wafer 5 to rotate 180° around rotary shaft 43 and reach the top of loading station.

[0093] The lifting cylinder 49 drives the vacuum suction cup bracket 46 to descend, the wafer 5 contacts the tray 322, the tray 322 is controlled to grip the wafer 5, the vacuum negative pressure is turned off, the lifting cylinder 49 drives the vacuum suction cup bracket 46 to rise, so that the wafer 5 is placed on the tray 322.

[0094] The Y-axis slide 32 of the wafer translation assembly 3 drives the robot arm 321 to move toward the material box 1, so that the bracket 322 extends into the material box 1. The control block 323 releases the wafer 5. The Z-axis slide of the material box lifting assembly 2 drives the material box 1 to move upward to support the wafer 5. The Y-axis slide 32 drives the robot arm 321 to move away from the material box 1, so that the processed wafer 5 is placed into the material box 1.

[0095] The Z-axis slide of the material box lifting assembly 2 moves the material box 1 to the next set height position, repeating the above process. This cycle repeats, allowing for the rapid and automatic loading, unloading, and recycling of samples.

[0096] Because each end of the rotating frame 44 is equipped with a vacuum suction cup support 46, the processing and loading / unloading of the wafer 5 can be performed simultaneously, thereby improving efficiency. Specifically, while the processing table is processing the wafer 5, the Y-axis slide 32 returns the previous wafer 5 and picks up the next wafer 5 and transports it to the loading station. The lifting cylinders 49 on both sides synchronously control the vacuum suction cup supports 46 on both sides to descend, with one side adsorbing the processed wafer 5 and the other side adsorbing the wafer 5 to be processed. The lifting cylinders 49 on both sides synchronously control the vacuum suction cup supports 46 on both sides to rise. After rotating 180°, the lifting cylinders 49 on both sides synchronously control the vacuum suction cup supports 46 on both sides to descend again, with one side placing the processed wafer 5 onto the bracket 322 and the other side placing the wafer 5 to be processed onto the processing table. This cycle repeats, further improving efficiency.

[0097] Example 3

[0098] The present invention also provides an automatic wafer loading and unloading method, using the automatic loading and unloading mechanism as described in Embodiment 2, comprising the following steps:

[0099] S1: The material box 1 containing the wafer 5 is transported to the target height by the material box lifting assembly 2;

[0100] S2: The wafer 5 is taken out from the material box 1 by the wafer translation component 3, and the wafer 5 is transported to the loading station by the Y-axis slide table 32;

[0101] S3: The wafer 5 is taken out from the wafer translation component 3 by rotating the loading and unloading component 4, and the wafer 5 is driven to rise, rotate and fall, and placed on the worktable.

[0102] S4: The processed wafer 5 is taken out from the worktable by rotating the loading and unloading assembly 4, and the wafer 5 is driven to rise, rotate and fall, and placed on the wafer translation assembly 3.

[0103] S5: The wafer 5 is sent back to the material box 1 via the wafer translation component 3.

[0104] The above method can be used to efficiently and automatically load and unload wafers into wafer processing equipment.

[0105] Furthermore, step S2 specifically includes:

[0106] S21: The Y-axis slide 32 moves toward the material box lifting assembly 2, so that the bracket 322 extends into the underside of the wafer 5;

[0107] S22: The output end of the gripping cylinder 324 extends forward, driving the block push rod 325 to move toward the material box lifting assembly 2. The block push rod 325 drives the block base 326, the block connecting rod 327 and the block 323 to move together in the same direction.

[0108] S23: After the pressure block base 326 moves to the limit position, the pressure block push rod 325 continues to move, compressing the pressure block spring 331; at the same time, the pressure block connecting rod 327 continues to move forward, thereby driving the pressure block 323 to rotate counterclockwise around the long connecting shaft 332, and the third part of the pressure block 323 presses down until it presses down on the wafer 5.

[0109] S24: The Y-axis slide table 32 moves away from the material box lifting assembly 2 to the loading station;

[0110] S25: The output end of the gripping cylinder 324 retracts, driving the pressure block push rod 325 to move away from the material box lifting assembly 2. The pressure block spring 331 extends, and the pressure block base 326 remains stationary under the action of the pressure block spring 331. At the same time, the pressure block connecting rod 327 moves to the rear, thereby driving the pressure block 323 to rotate clockwise around the long connecting shaft 332. The third part of the pressure block 323 is lifted up until the driving pressure block push rod 325 contacts the limit head of the pressure block spring guide post 330.

[0111] S26: The pressure block push rod 325 continues to move backward, driving the pressure block base 326, the pressure block connecting rod 327 and the pressure block 323 to move together in the same direction to the limit position.

[0112] Using the above method, wafer 5 can be clamped stably and reliably. Since the clamping block 323 moves backward and exits above wafer 5, the clamping block 323 will not cause interference in subsequent processes.

[0113] Furthermore, between steps S23 and S24, there is also step S231: the material box lifting assembly 2 drives the material box 1 containing the wafer 5 to descend a certain distance so that the material box 1 is no longer in contact with the wafer 5.

[0114] Specifically, the distance must not exceed the difference between the height of a single groove on the side plate of the material box 1 and the thickness of the wafer 5; otherwise, the wafer 5 being gripped may collide with the previous groove. The preferred distance is 1mm. This step ensures that the wafer 5 will not rub against the grooves on both sides during removal, thus preventing wear and damage.

[0115] Furthermore, steps S3 and S4 are performed simultaneously. This arrangement further improves the efficiency of the invention.

[0116] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A wafer translation component, characterized in that: The wafer translation assembly (3) includes a Y-axis slide (32) and a support (322) fixedly mounted on the Y-axis slide (32) for supporting the wafer (5), the support (322) extending horizontally; it also includes a robot (321) mounted on the Y-axis slide (32), the robot (321) including a spring linkage transmission mechanism, a pressure block (323), a gripping cylinder (324) and a pressure block guide rail (328), the gripping cylinder (324) driving the pressure block (323) to move forward and press down to clamp the wafer (5). The wafer (5) is lifted and released and then retracted; the spring linkage transmission mechanism includes a pressure block base (326), which is an open-shaped structure. The two protrusions on the left side of the pressure block base (326) are fitted onto one pressure block guide rail (328), and the two protrusions on the right side of the pressure block base (326) are fitted onto another pressure block guide rail (328). The two pressure block guide rails (328) are arranged in parallel and spaced apart, so that the pressure block base (326) can move along the pressure block guide rail (328) in the front-back direction.

2. The wafer translation assembly as described in claim 1, characterized in that: The gripping cylinder (324) drives the pressure block (323) to move back and forth and rotate through the spring linkage transmission mechanism.

3. The wafer translation assembly as described in claim 2, characterized in that: The spring linkage transmission mechanism includes: a pressure block push rod (325), a pressure block connecting rod (327), a pressure block spring guide post (330), and a pressure block spring (331). The pressure block push rod (325) is fixedly connected to the output end of the gripping cylinder (324). The pressure block push rod (325) is elastically connected to the pressure block base (326) through the pressure block spring guide post (330) and the pressure block spring (331). The top of the pressure block push rod (325) is hinged to one end of the pressure block connecting rod (327), the top of the pressure block (323) is hinged to the other end of the pressure block connecting rod (327), and the middle part of the pressure block (323) is hinged to the pressure block base (326).

4. The wafer translation assembly as described in claim 3, characterized in that: The top of the pressure block push rod (325) has a first protrusion (3251), the first protrusion (3251) has a first through hole (3253), the first through hole (3253) penetrates the front side and the rear side of the first protrusion (3251); a second protrusion (3252) is provided upward from the top of the first protrusion (3251), the second protrusion (3252) has a second through hole (3254), the second through hole (3254) penetrates the left side and the right side of the second protrusion (3252).

5. The wafer translation assembly as described in claim 4, characterized in that: The pressure block spring guide post (330) is disposed in the first through hole (3253). One end of the pressure block spring guide post (330) is fixedly connected to the pressure block base (326), and the other end of the pressure block spring guide post (330) is provided with a limiting platform. The pressure block spring (331) is sleeved on the pressure block spring guide post (330) and is located between the pressure block push rod (325) and the pressure block base (326).

6. The wafer translation assembly as described in claim 5, characterized in that: The pressure block connecting rod (327) and the pressure block push rod (325) are hinged through the second through hole (3254) and the first short connecting shaft.

7. The wafer translation assembly as described in claim 4, characterized in that: The Y-axis slide (32) further includes a grooved base (334) and a top plate (335). The pressure block base (326) is slidably disposed on the upper surface of the top plate (335). The gripping cylinder (324) and the pressure block push rod (325) are disposed in the grooved base (334). The top plate (335) is provided with a first opening (336). The first protrusion (3251) of the pressure block push rod (325) can extend into the first opening (336) and the second opening (3261) in the middle of the pressure block base (326). The pressure block push rod (325) can move along the length direction of the first opening (336) and the second opening (3261).

8. An automatic loading and unloading mechanism, characterized in that: The wafer translation assembly includes any one of claims 1-7, and further includes a hopper lifting assembly (2) and a rotating loading and unloading assembly (4).

9. An automated wafer loading and unloading method, characterized in that: Using the automatic loading and unloading mechanism as described in claim 8 includes the following steps: S1: The cassette (1) containing the wafer (5) is transported to the target height by the cassette lifting assembly (2); S2: The wafer (5) is taken out from the cassette (1) by the wafer translation assembly (3) and transported to the loading station by the Y-axis slide (32); S3: The wafer (5) is taken out from the wafer translation component (3) by the rotating loading and unloading component (4), and the wafer (5) is driven to rise, rotate and fall, and the wafer (5) is placed on the worktable; S4: The processed wafer (5) is taken out from the worktable by the rotating loading and unloading assembly (4), and the wafer (5) is driven to rise, rotate and fall, and the wafer (5) is placed on the wafer translation assembly (3); S5: The wafer (5) is sent back to the cassette (1) by the wafer translation assembly (3).

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