Electronic device
Patent Information
- Application Number
- CN202410131318.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-30
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2044-01-30
AI Technical Summary
而冲压铝的壁厚均匀,在使用冲压铝结构作为主板上盖时,只能在与同轴线间隔的区域内形成U形折弯,冲压铝与同轴线之间填充塑胶,该结构造成同轴线无法接地,且冲压铝无法形成同轴线与天线之间的金属挡墙
[0011] In this embodiment, a motherboard cover with a stamped metal structure is used on the electronic device. This motherboard cover cannot shield the electromagnetic field on the coaxial line from the noise interference of the first antenna, nor can it ground the coaxial line to prevent the electromagnetic field on the coaxial line from spreading outward. In this case, by reducing the overlap length between the first end of the first antenna and the area where the coaxial line is located, and extending the second end of the first antenna toward the direction of the second antenna radiator, the first radiator is moved as far away from the coaxial line as possible while ensuring that the size of the first radiator meets the radiation requirements of each frequency band of the first antenna. This makes the overlap length between the first end of the first antenna and the area where the coaxial line is located less than or equal to a first threshold, thereby reducing the noise interference of the electromagnetic field on the coaxial line to the first antenna and improving the antenna performance of the first antenna.
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Figure CN117937113B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of communication technology, and specifically relates to an electronic device. Background Technology
[0002] With the intensification of market competition for electronic devices (such as mobile phones), cost reduction and efficiency improvement have become key requirements for various electronic device brands. Compared with die-cast aluminum alloys, stamped aluminum alloys are now widely used in the low-end mobile phone market as motherboard covers due to their lower cost advantage.
[0003] Currently, stamped aluminum motherboard covers are mainly used in 4G mobile phones. Very few manufacturers use laser direct structure (LDS) antennas in 5G projects to achieve the same motherboard cover structure. The main reason is that mobile phones use coaxial cables to transmit signals from the secondary board to the motherboard. During signal transmission, electromagnetic induction generates an electric field around the coaxial cable, which interferes with nearby antennas, creating noise interference. Since stamped aluminum has a uniform wall thickness, using it as a motherboard cover means that a U-shaped bend can only be formed in the area separated from the coaxial cable. Plastic is then filled between the stamped aluminum and the coaxial cable. This structure prevents the coaxial cable from grounding, and the stamped aluminum cannot form a metal barrier between the coaxial cable and the antenna.
[0004] Therefore, using a stamped aluminum structure as the motherboard cover cannot avoid the clutter interference problem of the coaxial cable to the antenna, which will lead to a decrease in antenna performance. Summary of the Invention
[0005] The purpose of this application is to provide an electronic device that, when combined with a motherboard cover made of stamped metal, reduces clutter interference from the coaxial cable within the electronic device to the antenna, thereby improving the antenna's performance.
[0006] This application provides an electronic device, which includes: a motherboard, a sub-board, a coaxial cable, a motherboard cover, a first antenna, and a second antenna; the first antenna includes a first radiator, the second antenna includes a second radiator, and the motherboard cover is a stamped metal structure.
[0007] The coaxial cable is connected between the motherboard and the sub-board, and at least a portion of the coaxial cable extends along a first side of the electronic device;
[0008] The second radiator is located on the second side of the electronic device, and the first side and the second side are adjacent to each other;
[0009] The first radiator extends along the first side, and the overlap length between the first end of the first radiator and the first region is less than or equal to a first threshold, wherein the first region is the region where the coaxial line is located, the overlap length is the length along the first side, and the first threshold is related to the clutter interference requirements of the first antenna.
[0010] There is a first gap between the second end of the first radiator and the second radiator.
[0011] In this embodiment, a motherboard cover with a stamped metal structure is used on the electronic device. This motherboard cover cannot shield the electromagnetic field on the coaxial line from the noise interference of the first antenna, nor can it ground the coaxial line to prevent the electromagnetic field on the coaxial line from spreading outward. In this case, by reducing the overlap length between the first end of the first antenna and the area where the coaxial line is located, and extending the second end of the first antenna toward the direction of the second antenna radiator, the first radiator is moved as far away from the coaxial line as possible while ensuring that the size of the first radiator meets the radiation requirements of each frequency band of the first antenna. This makes the overlap length between the first end of the first antenna and the area where the coaxial line is located less than or equal to a first threshold, thereby reducing the noise interference of the electromagnetic field on the coaxial line to the first antenna and improving the antenna performance of the first antenna. Attached Figure Description
[0012] Figure 1 These are structural diagrams of the coaxial cable, antenna #11, antenna #12, and antenna #13 in electronic devices related to this technology.
[0013] Figure 2 This is a schematic diagram of antenna clutter caused by coaxial cables in related technologies;
[0014] Figure 3 This is a schematic diagram of a motherboard cover with a die-cast aluminum alloy structure forming a metal barrier between the FPC antenna and the coaxial cable in a related technology.
[0015] Figure 4 This is a schematic diagram of a coaxial cable grounded using a motherboard cover made of die-cast aluminum alloy in related technologies.
[0016] Figure 5 This is a schematic diagram of the structure of the motherboard cover and the coaxial line of the die-cast aluminum alloy structure in the embodiments of this application;
[0017] Figure 6 This is a schematic diagram showing the relative positions of the motherboard, sub-board, coaxial cable, and motherboard cover in an electronic device according to an embodiment of this application.
[0018] Figure 7 This is a schematic diagram of the coaxial cable, antenna #11, and antenna #13 in the electronic device of this application embodiment;
[0019] Figure 8 This is a schematic diagram of the structure of the coaxial cable, antenna #11, antenna #12, and antenna #13 in the electronic device of this application embodiment;
[0020] Figure 9 This is a schematic diagram showing the relative positions of antenna #11 and antenna #12 in the electronic device of this application embodiment;
[0021] Figure 10 It is along Figure 9 A schematic diagram of the cross-sectional structure along the AA direction. Detailed Implementation
[0022] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.
[0023] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0024] To facilitate understanding of the electronic device provided in the embodiments of this application, the relevant technologies are described below:
[0025] In related technologies, mobile phones have two circuit boards: a motherboard and a sub-board. The motherboard is located at the top of the phone (i.e., the top when the phone is in portrait mode), and the sub-board is located at the bottom of the phone (i.e., the bottom when the phone is in portrait mode). The motherboard and the sub-board are connected by a coaxial cable so that the motherboard and the sub-board can transmit signals through the coaxial cable.
[0026] For 5G phones, because 5G projects use more frequency bands, the antenna FPC length is required to be longer. In related technologies, the antenna FPC of 5G phones needs to enter the area where the coaxial line is located. At this time, the electromagnetic field generated by the coaxial line during signal transmission will interfere with the FPC antenna that enters the area where the coaxial line is located.
[0027] For example: Figure 1As shown, a 5G phone requires antennas #11, #12, and #13. The radiator 111 of antenna #11 is located between the radiator 121 of antenna #12 and the coaxial line 103, and a large portion of the radiator 111 overlaps with the region 1031 of the coaxial line 103, i.e., the overlapping portion of the first projection and the second projection, occupying a large portion of the first projection. The first projection represents the projection of the radiator 111 on the first side, and the second projection represents the projection of the coaxial line 103 on the first side. The first side is one side of the electronic device where the radiator 111 of antenna #11 is located. At this time, as... Figure 2 As shown, if the electromagnetic clutter generated by the coaxial cable during signal transmission is located in the B1 and N78 frequency bands, the electromagnetic clutter will cause clutter interference to the B1 and N78 frequency bands of antenna #11, reducing the antenna performance.
[0028] In related technologies, in order to ensure the antenna performance of antenna #11, only the following specific structure of the motherboard cover can be used to shield or ground the clutter interference generated by the electromagnetic field of the coaxial cable:
[0029] 1. For example Figure 3 As shown, the motherboard cover 101, which is made of die-cast aluminum alloy, can be flipped upward to form a metal barrier between the FPC antenna 102 and the coaxial cable 103. In this way, the motherboard cover 101 can be used to shield the interference of the electric field on the coaxial cable 103 on the FPC antenna 102.
[0030] 2. For example Figure 4 As shown, the motherboard cover 101 with a die-cast aluminum alloy structure forms an exposed metal connection part around the coaxial line 103. In this way, the grounding clamp 1032 of the coaxial line 103 can contact the exposed metal connection part to achieve grounding of the coaxial line 103 using the motherboard cover 101 with a die-cast aluminum alloy structure. That is, the motherboard cover 101 and the coaxial line 103 share a common ground. At this time, the electric field generated by the coaxial line 103 during signal transmission is grounded through the motherboard cover 101, so as not to generate outward noise interference signals.
[0031] It should be noted that the motherboard cover with the above specific structure is relatively complex, such as needing to be flipped to form a metal barrier or to form an exposed metal connection around the coaxial line. It can only be achieved by using a high-precision die-casting process. That is, in order to achieve the purpose of shielding or grounding the electromagnetic interference generated by the coaxial line by the motherboard cover with the above specific structure, the relevant technology can only use a motherboard cover with a die-cast aluminum alloy structure.
[0032] Using a stamped aluminum structure as the motherboard cover cannot avoid the clutter interference problem of the coaxial cable to the antenna, specifically as follows: Figure 5As shown, the motherboard cover 104 of the stamped aluminum structure has a uniform wall thickness, so it can only form a U-shaped bend below the coaxial line 103. Plastic is filled between the motherboard cover 104 of the stamped aluminum structure and the side wall of the coaxial line 103. At this time, the coaxial line 103 cannot be grounded through the motherboard cover 104 of the stamped aluminum structure, and the motherboard cover 104 of the stamped aluminum structure cannot form a metal barrier between the coaxial line 103 and the antenna. Therefore, it is impossible to avoid the clutter interference generated by the coaxial line 103 on the antenna, resulting in a decrease in antenna performance.
[0033] In this embodiment, by changing the antenna structure and antenna distribution on the electronic device, the overlap between the antenna radiator and the clutter interference area of the coaxial line is reduced, thereby making the clutter interference of the electromagnetic field generated on the coaxial line negligible and improving the antenna radiation performance.
[0034] To facilitate understanding, before describing the structure and working principle of the embodiments of this application, the following explanations are provided for the nouns or terms involved in the embodiments of this application:
[0035] The first antenna, namely antenna #11, is mainly responsible for the main transmit and receive (TRX) of the N1, N3, N40, N41, N77 and N78 bands in Non-Standalone (NSA) networks, as well as the TRX of the N1, N3, N40, N41, N77 and N78 bands in Standalone (SA) networks.
[0036] The second antenna, namely antenna #13, is mainly responsible for the Long Term Evolution (LTE) main antenna.
[0037] The third antenna, namely antenna #12, is mainly responsible for the DRX of the NSA N77 and NSA N78 bands, as well as the DRX of the SAN77 and SA N78 bands.
[0038] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.
[0039] See Figure 6 and Figure 7 The electronic device provided in this application embodiment includes: a motherboard 1, a sub-board 2, a coaxial cable 3, a motherboard cover 4, a first antenna 5, and a second antenna 6; the first antenna 5 includes a first radiator 51, the second antenna 6 includes a second radiator 61, and the motherboard cover 4 is a stamped metal structure, for example: Figure 5 The motherboard cover 104 shown is made of stamped aluminum.
[0040] The coaxial cable 3 is connected between the main board 1 and the sub-board 2, and at least a portion of the coaxial cable 3 extends along the first side U of the electronic device;
[0041] The second radiator 61 is located on the second side V of the electronic device, and the first side U and the second side V are adjacent to each other;
[0042] The first radiator 51 extends along the first side U, and the overlap length M between the first end 511 of the first radiator 51 and the first region 31 is less than or equal to a first threshold. The first region 31 is the region where the coaxial line 3 is located, the overlap length M is the length along the first side U, and the first threshold is related to the clutter interference requirements of the first antenna 5.
[0043] There is a first gap N between the second end 512 of the first radiator 51 and the second radiator 61.
[0044] It should be noted that the electronic device in this application embodiment is a 5G electronic device. For ease of explanation, a 5G mobile phone is used as an example in this application embodiment. In this application embodiment, "above" can be understood as the direction near the top of the phone when the phone is in portrait mode, and "below" can be understood as the direction near the bottom of the phone when the phone is in portrait mode.
[0045] In some implementations, the motherboard 1 and the sub-board 2 are located on the upper and lower sides of the battery area Q of the mobile phone, and a coaxial cable 3 is used to cross the battery area Q to connect the motherboard 1 and the sub-board 2, so that the motherboard 1 and the sub-board 2 can transmit signals between each other through the coaxial cable 3.
[0046] In some implementations, the width of the first gap N can be greater than or equal to 1 mm. This can reduce mutual interference between antenna #11 and antenna #13.
[0047] In some embodiments, the overlap length M between the first region 31 and the first radiator 51 along the first side U can be such that the first region 31 and the first radiator 51 are along... Figure 6 The overlap length along the X-axis. When the overlap length M between the first region 31 and the first radiator 51 along the first side U is less than or equal to the first threshold, the signal interference caused by the electric field generated on the coaxial line 3 to the first antenna 5 can be ignored, that is, the signal interference intensity of the coaxial line 3 to the first antenna 5 during signal transmission is approximately 0.
[0048] In some implementations, the radiator length W of antenna #11 is greater than or equal to 40mm to meet the radiation requirements of antenna #11 in various frequency bands.
[0049] In this embodiment, a motherboard cover with a stamped metal structure is used on the electronic device. This motherboard cover cannot shield the electromagnetic field on the coaxial line from the noise interference of the first antenna, nor can it ground the coaxial line to prevent the electromagnetic field on the coaxial line from spreading outward. In this case, by reducing the overlap length between the first end of the first antenna and the area where the coaxial line is located, and extending the second end of the first antenna toward the direction of the second antenna radiator, the first radiator is moved as far away from the coaxial line as possible while ensuring that the size of the first radiator meets the radiation requirements of each frequency band of the first antenna. This makes the overlap length between the first end of the first antenna and the area where the coaxial line is located less than or equal to a first threshold, thereby reducing the noise interference of the electromagnetic field on the coaxial line to the first antenna and improving the antenna performance of the first antenna.
[0050] It should be noted that the electronic device provided in this application embodiment also includes a third antenna (i.e., antenna #12). In this case, since the overlap length M between the first end 511 of the first antenna (i.e. antenna #11) and the first region 31 is less than or equal to the first threshold, and the radiator length W of antenna #11 is greater than or equal to 40mm, the first side U may not have enough space to set antenna #12. In this case, antenna #12 can be set in other areas of the electronic device other than the first side U, such as on the motherboard bracket or on the back of the mobile phone.
[0051] In some implementations, the function of the third antenna is similar to that of antenna #12 in the related art, that is, the third antenna 8 is used for diversity reception DRX in at least one of the following frequency bands: NSA N77 band, NSA 78 band, SA N77 band, SA78 band.
[0052] In some implementations, compared to, for example Figure 1 Regarding the structure of antennas 11#, 12#, and 13# in the 5G mobile phone shown in the related technology, in this embodiment of the application, since a low-cost stamped metal structure motherboard cover 4 is used, and this stamped metal structure motherboard cover 4 can only achieve a simple structure, it cannot form a shielding layer between the coaxial line 3 and the first antenna 5, nor can it ground the coaxial line 3. In order to overcome the problem that the electromagnetic field generated by the coaxial line 3 during signal transmission causes noise interference to the first antenna 5, resulting in a reduction in the performance of the first antenna 5, in this embodiment of the application, the end of the first radiator 51 near the coaxial line 3 is shortened, and the original layout space of antenna 12# is occupied to extend the end of the first radiator 51 near antenna 13#. In this way, the noise interference area of the first radiator 51 and the coaxial line 3 do not overlap or only partially overlap. Thus, it is equivalent to moving antenna 11# towards the direction of antenna 13# and placing antenna 12# in an area other than the first side U.
[0053] In some implementations, such as Figure 8 , Figure 9 and Figure 10 As shown, the electronic device further includes: a motherboard bracket 7 and a third antenna 8; the third antenna 8 includes a third radiator 81;
[0054] The motherboard cover 4 and the motherboard bracket 7 are located on opposite sides of the motherboard 1, and at least a portion of the third radiator 81 is located on the side of the motherboard bracket 7 facing away from the motherboard 1.
[0055] There is a second gap P between the third radiator 81 and the first radiator 51.
[0056] In some implementations, the width of the second gap P is greater than or equal to 3 mm, which can reduce the mutual interference between antenna #11 and antenna #12.
[0057] In some implementations, the third antenna 8 is a monopole antenna.
[0058] It should be noted that if antenna #12 is set on motherboard bracket 7, then antenna #12 may enter the middle area of motherboard 1. Due to the limited space for components on motherboard 1, by setting antenna #12 to a monopole scheme, only one feed point is needed to meet the power supply requirements of antenna #12.
[0059] In this embodiment, the third antenna 8 has only one feed. Compared with the 12# antenna scheme with two feeds in related technologies, the 12# antenna using the monopole scheme in this application embodiment only needs to set a spring between the third radiator 81 and the main board 1 to realize the feed connection, which simplifies the structure of the 12# antenna and reduces the board area occupied by the feed spring of the 12# antenna.
[0060] In some implementations, the clearance dimension S of antenna #12 is greater than or equal to 1.5 mm, for example: Figure 10 As shown, the distance S between the third radiator 81 and the motherboard 1 along the thickness direction of the electronic device is greater than or equal to 1.5 mm. This improves the radiation performance of antenna #12.
[0061] In some implementations, to avoid mutual interference between antenna #11 and antenna #12, the width of the second gap P between the third radiator 81 and the first radiator 51 is greater than or equal to 3 mm.
[0062] For example: Figure 10 As shown, the width of the second gap P between the third radiator 81 and the first radiator 51 on the plane where the mobile phone screen is located can be greater than or equal to 3mm.
[0063] In some implementations, antenna #12 is positioned as far away as possible from coaxial line 3 or the coaxial mount corresponding to coaxial line 3, in order to reduce interference from coaxial line 3 or the coaxial mount to antenna #12.
[0064] In this embodiment, the third antenna 8 (i.e., antenna #12) is set on the motherboard bracket 7. The space on the motherboard bracket 7 can be used to arrange antenna #12. In the related art, the arrangement space of antenna #12 is used for antenna #11 to move away from the coaxial line 3 in this embodiment.
[0065] In some embodiments, at least one of antennas #11, #12, and #13 is a flexible printed circuit (FPC) antenna. Here, an FPC antenna indicates that the radiator of the antenna is made of FPC. In this case, the FPC can be bent to form a U-shaped groove structure radiator. A feed point and a ground point are provided on the side wall of this U-shaped groove structure near the motherboard 1. The feed point is used to connect to the feed on the motherboard 1, and the ground point is used to connect to the main ground on the motherboard 1.
[0066] For example: Figure 10 Antennas 11 and 12 shown are FPC antennas. The first radiator 51 and the third radiator 81 have a U-shaped groove structure. Compared with the conventional planar structure radiator, the U-shaped groove structure can increase the radiation area of the radiator in a limited space. The radiator with a larger radiation area is more suitable for the multi-band requirements of 5G antennas.
[0067] In some embodiments, the third radiator 81 of antenna #12 is made of an FPC with a U-shaped groove structure. In this case, one side wall of the U-shaped groove structure is located on the side of the main board bracket 7 facing away from the main board 1, and the other side wall of the U-shaped groove structure is located on the side of the main board bracket 7 facing the main board 1. The feed point, ground point, etc. of antenna #12 are set on the side wall of the U-shaped groove structure near the main board 1. This makes it easy to connect the feed point, ground point, etc. on the side wall of the U-shaped groove structure near the main board 1 to the corresponding devices such as the feed and ground terminals on the main board 1.
[0068] In this embodiment, an FPC antenna and a stamped metal motherboard cover 4 can be deployed on a 5G terminal. The FPC antenna is less expensive than the LDS antenna in related technologies, and the stamped metal motherboard cover 4 is less expensive than the die-cast aluminum alloy motherboard cover in related technologies. Therefore, this embodiment can achieve a greater reduction in cost based on the FPC antenna and the stamped metal motherboard cover 4.
[0069] In some implementations, such as Figure 7 As shown, the first antenna 5 also includes a first feed 52 and a second feed 53;
[0070] The connection point between the first feed 52 and the second feed 53 and the first radiator 51 is located in the second region of the first radiator 51.
[0071] The second region is located on the side of the first central axis H closer to the second radiator 61, and the first central axis H is the first radiator 51 along a first direction (e.g., along a first direction). Figure 6 The central axis (shown in the Y-axis direction) is perpendicular to the first side U.
[0072] It should be noted that the first feed 52 and the second feed 53 mentioned above are the two feeds of the first antenna 5. The relative positions of the connection point between the first feed 52 and the first radiator 51 and the connection point between the second feed 53 and the first radiator 51 can be as follows: Figure 7 The connection point between the first feed 52 and the first radiator 51 shown is located on the side of the connection point between the second feed 53 and the first radiator 51 closer to the coaxial line 3. Of course, the connection point between the first feed 52 and the first radiator 51 is located on the side of the connection point between the second feed 53 and the first radiator 51 closer to the second radiator 61, which does not constitute a specific limitation here.
[0073] It should be noted that, by placing the first feed 52 and the second feed 53 on the side of the first central axis H closer to the second radiator 61, compared to placing the first feed 52 and the second feed 53 on the first central axis H or on the side of the first central axis H farther away from the second radiator 61, the electrical length of the first radiator 51 can be extended.
[0074] In some embodiments, at least one of the first power supply 52 and the second power supply 53 is used to connect the switch and the tuning module to achieve the switching of the operating mode.
[0075] For example, the first antenna 5 also includes a first switching switch (not shown) and a first tuning module (not shown);
[0076] The first power supply 52 is also connected to the first tuning module through the first switching switch, and the first tuning module includes at least two branches.
[0077] The first switching switch is used to connect the first feed 52 to different branches in the first tuning module, so as to switch the first antenna 5 to receive and transmit TRX in at least one of the following frequency bands:
[0078] Non-standalone (NSA) network: NSA N1 band, NSA N3 band, NSA N40 band, NSA N41 band, NSA N77 band, NSA N78 band; Standalone (SA) network: SA N1 band, SA N3 band, SA N40 band, SA N41 band, SA N77 band, SA 78 band.
[0079] It should be noted that for different branches in the first tuning module, at least one of the parameters such as capacitance, inductance, and resistance is different. Thus, based on the switching of the first switching switch, the first feed can be grounded through different capacitors, inductors, and resistors, thereby adjusting the frequency of the excitation current of the first feed and realizing the adjustment of the operating frequency band of the first antenna.
[0080] For example, antenna #11 is a loop antenna, meaning a loop is formed between the feed and the switch. The feed and switch are connected to a ground pin via a tuning module, which can be considered equivalent to a parallel inductor. When the switch connects to the zero-ohm branch in the tuning module, the fundamental and third modes of the loop are excited, and the operating frequency of the loop antenna is in the N3+N78 band. The N78 band has an additional branch at the feed and switch to increase bandwidth, equivalent to a parallel capacitor. When the switch connects to the small inductor branch in the tuning module, the second mode of the loop is excited, and the operating frequency of the loop antenna is in the N41 band. The N1 / N40 bands use the second mode of the loop. When the switch connects to the small capacitor branch in the tuning module, the operating frequency of the loop antenna is in the N1 band. When the switch is disconnected from all branches in the tuning module, the operating frequency of the loop antenna is in the N40 band.
[0081] In this embodiment, the first antenna 5 is set as a LOOP antenna, and the working mode of the LOOP antenna is adjusted by means of power supply, switching switch and tuning module, so that the working frequency of the LOOP antenna can be adjusted in different working modes.
[0082] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.
[0083] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. An electronic device, characterized in that, include: The motherboard, sub-board, coaxial cable, motherboard cover, first antenna and second antenna; the first antenna includes a first radiator, the second antenna includes a second radiator, and the motherboard cover is a stamped metal structure. The coaxial cable is connected between the motherboard and the sub-board, and at least a portion of the coaxial cable extends along a first side of the electronic device; The second radiator is located on the second side of the electronic device, and the first side and the second side are adjacent to each other; The first radiator extends along the first side, and the overlap length between the first end of the first radiator and the first region is less than or equal to a first threshold, wherein the first region is the region where the coaxial line is located, the overlap length is the length along the first side, and the first threshold is related to the clutter interference requirements of the first antenna. There is a first gap between the second end of the first radiator and the second radiator.
2. The electronic device according to claim 1, characterized in that, The electronic device further includes: a motherboard bracket and a third antenna; the third antenna includes a third radiator; The motherboard cover and the motherboard bracket are located on opposite sides of the motherboard, and at least a portion of the third radiator is located on the side of the motherboard bracket facing away from the motherboard. The third radiator has a second gap with the first radiator.
3. The electronic device according to claim 2, characterized in that, The third antenna is a single-stage antenna.
4. The electronic device according to any one of claims 1 to 3, characterized in that, The first threshold is less than or equal to 1 mm.
5. The electronic device according to claim 2 or 3, characterized in that, The distance between the third radiator and the motherboard is greater than or equal to 1.5 mm.
6. The electronic device according to any one of claims 1 to 3, characterized in that, The first antenna is a loop antenna.
7. The electronic device according to any one of claims 1 to 3, characterized in that, The first antenna also includes a first feed and a second feed; The connection points of the first feed and the second feed with the first radiator are located in the second region of the first radiator. The second region is located on the side of the first central axis closer to the second radiator, where the first central axis is the central axis of the first radiator along a first direction, which is perpendicular to the first side.
8. The electronic device according to claim 7, characterized in that, The first antenna also includes a first switching switch and a first tuning module; The first power supply is also connected to the first tuning module via the first switching switch, and the first tuning module includes at least two branches; The first switching switch is used to connect the first feed to different branches in the first tuning module, so as to switch the first antenna to receive and transmit TRX in at least one of the following frequency bands: Non-standalone (NSA) network: NSA N1 band, NSA N3 band, NSA N40 band, NSA N41 band, NSA N77 band, NSA N78 band; Standalone (SA) network: SA N1 band, SA N3 band, SA N40 band, SA N41 band, SA N77 band, SA N78 band.
9. The electronic device according to any one of claims 1 to 3, characterized in that, The second antenna is the LTE main antenna.
10. The electronic device according to claim 2 or 3, characterized in that, The third antenna is used for diversity reception DRX in at least one of the following frequency bands: NSA N77 band, NSA 78 band, SA N77 band, and SA 78 band.
11. The electronic device according to claim 2 or 3, characterized in that, At least one of the first antenna, the second antenna, and the third antenna is a flexible printed circuit board (FPC) antenna.
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