A bending and cutting device and method for TEC lead

Abstract

This invention discloses a bending and cutting device and method for TEC leads. In the device, a lead fixing component is used to fix the TEC lead to be bent and cut; a bending die-closing component moves relative to the lead fixing component, and during the die-closing process, the bending die-closing component guides the TEC lead into a guide groove provided on the bending die-closing component for bending, allowing the TEC lead to be extruded and formed into a preset shape corresponding to the guide groove; after the TEC lead is bent into the preset shape, a cutting component moves relative to the bending die-closing component, and the cutting component can cut at a preset position on the TEC lead. Through the technical solution of this invention, automated bending and cutting is achieved, ensuring consistent bending and cutting shapes, greatly improving production efficiency, meeting production cycle requirements, standardizing bending shapes, improving cutting effects, reducing TEC lead detachment, breakage, and burrs, and lowering labor and time costs.

Description

Technical Field

[0001] This invention relates to the field of cutting device technology, and in particular to a bending and cutting device for TEC leads and a bending and cutting method for TEC leads. Background Technology

[0002] With my country's continuous increase in investment in the military industry and the gradual improvement of the automation level of various equipment, the demand for automation in military production processes is also increasing daily to meet the growing needs for production capacity and intelligent equipment. Infrared detectors, as high-end military imaging products, possess high sensitivity, high precision, and a sufficiently wide temperature measurement range, making them widely applicable in the military. Meanwhile, domestically produced infrared detector chips have achieved complete domestic substitution, with their technology ranking among the top in the world. Currently, the manufacturing processes for cooled infrared detector materials from both domestic and international companies are maturing, and the technological routes are relatively clear. How to upgrade products to higher performance, miniaturization, and lower cost based on existing processes will play a decisive role in the civilian application of infrared detectors in various countries.

[0003] In existing TEC (Thermoelectric cooler) systems, TEC leads are typically bent and cut manually. However, manual bending and cutting can result in inconsistent shapes and lengths. Furthermore, manual cutting can cause TEC leads to detachment, breakage, and burrs, leading to a high scrap rate. In addition, manual bending affects production efficiency and results in higher labor and time costs. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a bending and cutting device and method for TEC leads. Through the coordinated operation of a lead fixing component, a bending and die-fitting component, a cutting component, and a power system, the lead fixing component secures the TEC, the bending and die-fitting component bends the TEC lead into a preset shape, and the cutting component cuts the TEC lead at a preset position. This achieves automated bending and cutting, ensuring consistent bending and cutting shapes, significantly improving production efficiency, reducing TEC lead detachment, breakage, and burrs, and lowering labor and time costs.

[0005] To achieve the above objectives, the present invention provides a bending and cutting device for TEC leads, comprising: a base and a lead fixing assembly, a bending and die-closing assembly, a cutting assembly, and a power system mounted relative to the base;

[0006] The lead wire fixing assembly is used to fix the TEC to be bent and cut according to a preset position and angle;

[0007] The bending and die-closing assembly can move relative to the lead wire fixing assembly under the drive of the power system. During the die-closing process, the bending and die-closing assembly can drive the TEC lead wire into the guide groove provided on the bending and die-closing assembly for bending, so that the TEC lead wire can be extruded into a preset shape corresponding to the guide groove.

[0008] After the TEC lead is bent into a preset shape, the cutting component moves relative to the bending and mold-closing component under the drive of the power system, and the cutting component can cut the TEC lead at a preset position.

[0009] In the above technical solution, preferably, the lead fixing assembly includes a fixing plate, a TEC fixing block and a pin fixing block. The fixing plate is vertically fixed on the base, the TEC fixing block is fixed on the fixing plate, the TEC is fixed on the TEC fixing block, and the TEC lead is fixed by the pin fixing block.

[0010] In the above technical solution, preferably, the bending and mold closing assembly includes an upper mold closing part and a lower mold closing part. The upper mold closing part includes an upper pin bending plate, and the lower mold closing part includes a lower pin bending plate, a pin bending guide rail, a mold closing cylinder, and a support block. The upper pin bending plate and the lower pin bending plate are provided with matching Z-shaped guide grooves.

[0011] The lower pin bending plate is connected to the movable end of the mold closing cylinder. The mold closing cylinder is powered by the power system. Under the drive of the mold closing cylinder, the lower pin bending plate can push the TEC lead wire into the Z-shaped guide groove to undergo a first bending deformation, and undergo a second bending deformation relative to the upper pin bending plate during the continued pushing process.

[0012] In the above technical solution, preferably, the lower pin bending plate is divided into two sets of mirror-symmetrical lower left pin bending plates and lower right pin bending plates. The lower left pin bending plate and the lower right pin bending plate are respectively provided with the Z-shaped guide groove, so that the two TEC leads of the TEC are bent along the Z-shaped guide grooves on both sides. The upper pin bending plate is provided with Z-shaped guide grooves corresponding to the lower left pin bending plate and the lower right pin bending plate.

[0013] In the above technical solution, preferably, the cross-section of the Z-shaped guide groove adopts a V-shaped structure, the chamfer radius of the Z-shaped guide groove is 5 mm, and the chamfer angle is 35° to 43°.

[0014] In the above technical solution, preferably, the cutting assembly includes a scissor translation cylinder, a scissor moving bracket, and pneumatic scissors. The scissor translation cylinder is mounted on the fixed plate via a top cylinder fixing seat. The scissor moving bracket is mounted on the movable end of the scissor translation cylinder. The pneumatic scissors are mounted on the scissor moving bracket. The pneumatic scissors move to a relatively preset position relative to the TEC lead under the drive of the scissor translation cylinder and cut the TEC lead.

[0015] In the above technical solution, preferably, the bending and cutting device for TEC leads further includes a lead waste box and a foot. The lead waste box is disposed below the fixing plate and can receive the cut TEC leads. The foot is disposed below the base.

[0016] The present invention also proposes a bending and cutting method for TEC leads, applicable to the bending and cutting apparatus for TEC leads disclosed in any of the above technical solutions, comprising:

[0017] Secure the TEC to be bent and cut to the lead wire fixing assembly;

[0018] The power system drives the bending and mold closing assembly to move and close the mold, which in turn drives the TEC lead wire on the TEC to be guided into the guide groove for bending, and extrudes the TEC lead wire into a preset shape corresponding to the guide groove.

[0019] The power system drives the cutting component to move relative to the bending and mold-closing component to cut the TEC lead at a preset position.

[0020] In the above technical solution, preferably, the upper pin bending plate and the lower pin bending plate of the bending and mold closing assembly are provided with matching Z-shaped guide grooves;

[0021] The lower pin bending plate is driven by the clamping cylinder of the bending and clamping assembly to push the TEC lead into the Z-shaped guide groove to undergo a first bending deformation, and a second bending deformation occurs relative to the upper pin bending plate during the continued pushing process.

[0022] In the above technical solution, preferably, the scissor translation cylinder of the cutting component drives the pneumatic scissors to move to a preset position relative to the TEC lead, and cuts the TEC lead.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows: through the cooperation of the lead wire fixing component, the bending and mold closing component, the cutting component and the power system, the TEC is fixed by the lead wire fixing component, the TEC lead wire is bent into a preset shape by the bending and mold closing component, and the TEC lead wire is cut at a preset position by the cutting component, thereby realizing automated bending and cutting. This can not only ensure the consistency of the bending and cutting shape, but also greatly improve production efficiency, reduce the phenomenon of TEC lead wire falling off, breaking and burrs, and reduce labor costs and time costs. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall mechanism of a TEC lead bending and cutting device disclosed in one embodiment of the present invention;

[0025] Figure 2 This is a front view schematic diagram of a bending and cutting device for TEC leads disclosed in an embodiment of the present invention;

[0026] Figure 3 for Figure 2 A schematic cross-sectional view along the AA direction of the embodiment shown;

[0027] Figure 4 This is a top view schematic diagram of a TEC lead bending and cutting device disclosed in one embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the structure of a cutting component disclosed in one embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the motion mechanism of a bending and mold-closing assembly disclosed in one embodiment of the present invention;

[0030] Figure 7 This is a schematic diagram of a mold for a bending and clamping assembly according to an embodiment of the present invention;

[0031] Figure 8 This is a schematic diagram of the structure of an unbent and uncut TEC lead wire disclosed in one embodiment of the present invention;

[0032] Figure 9 This is a schematic diagram of the structure of a TEC lead wire after bending and cutting according to an embodiment of the present invention;

[0033] Figure 10 This is a schematic diagram of the structure of the lower left pin bending plate disclosed in one embodiment of the present invention;

[0034] Figure 11 This is a schematic diagram of the upper pin bending plate disclosed in one embodiment of the present invention.

[0035] In the diagram, the correspondence between the components and the reference numerals is as follows:

[0036] 1. Base; 2. Fixing plate; 3. TEC; 4. Pin pressure plate; 5. Upper pin bending plate; 6. Lower left pin bending plate; 7. Pin bending guide rail; 8. Pin fixing block; 9. Fixing block; 10. TEC fixing block; 11. Guide rail; 12. Scissors translation cylinder; 13. Top cylinder fixing seat; 14. Pin bending cylinder; 15. Lower right pin bending plate; 16. Mold closing cylinder; 17. Pneumatic scissors; 18. Support block; 19. Scissors moving bracket; 20. Support shaft; 21. Cylinder connecting plate; 22. Connecting bolt; 23. Lead wire waste box; 24. TEC tray; 25. Protective cover; 26. Foot; 27. Switch button. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] The present invention will now be described in further detail with reference to the accompanying drawings:

[0039] like Figures 1 to 4 As shown, a bending and cutting device for TEC leads according to the present invention includes: a base 1 and a lead fixing assembly, a bending and clamping assembly, a cutting assembly and a power system mounted relative to the base 1;

[0040] The lead wire fixing assembly is used to fix the TEC3 to be bent and cut according to the preset position and angle;

[0041] Driven by the power system, the bending and die-closing assembly can move relative to the lead wire fixing assembly. During the die-closing process, the bending and die-closing assembly can drive the TEC lead wire into the guide groove set on the bending and die-closing assembly for bending, so that the TEC lead wire can be extruded into a preset shape corresponding to the guide groove.

[0042] After the TEC lead wire is bent into a preset shape, the cutting component moves relative to the bending and mold-closing component under the drive of the power system, and the cutting component can cut the TEC lead wire at a preset position.

[0043] In this embodiment, through the cooperation of the lead wire fixing component, the bending and mold closing component, the cutting component, and the power system, the TEC3 is fixed by the lead wire fixing component, the TEC lead wire is bent into a preset shape by the bending and mold closing component, and the TEC lead wire is cut at a preset position by the cutting component. This achieves automated bending and cutting, which not only ensures the consistency of the bending and cutting shape, but also greatly improves production efficiency, meets the production cycle requirements, unifies the bending shape, improves the cutting effect, reduces the phenomenon of TEC lead wire falling off, breaking, and burrs, and reduces labor and time costs.

[0044] Specifically, a power system provides power to close the bending and mold-closing components to bend the TEC leads into shape, and then a cutting assembly trims the excess TEC leads to the appropriate length. Preferably, the power system uses a 12-cylinder compact cylinder to provide the bending and cutting power.

[0045] In the above embodiment, preferably, the lead fixing assembly includes a fixing plate 2, a TEC fixing block 10 and a pin fixing block 8. The fixing plate 2 is vertically fixed on the base 1, the TEC fixing block 10 is fixed on the fixing plate 2, the TEC3 is fixed on the TEC fixing block 10, and the TEC lead is fixed by the pin fixing block 8.

[0046] In this embodiment, when the TEC3 is installed manually, the TEC3 is placed in the acupoint of the TEC fixing block 10, and at the same time, the TEC lead wire is fixed in the pin fixing block 8.

[0047] like Figure 6 and Figure 7 As shown, in the above embodiment, preferably, the bending and mold closing assembly includes an upper mold closing part and a lower mold closing part. The upper mold closing part includes an upper pin bending plate 5, and the lower mold closing part includes a lower pin bending plate, a pin bending guide rail 7, a pin bending cylinder 14, a mold closing cylinder 16, and a support block 18. The upper pin bending plate 5 and the lower pin bending plate are provided with matching Z-shaped guide grooves.

[0048] The mounting plate of the pin bending cylinder 14 is fixed by the cylinder connecting plate 21. The lower pin bending plate is connected to the movable end of the pin bending cylinder 14 and the mold closing cylinder 16. The lower pin bending plate is mounted on the pin bending guide rail 7 and can move back and forth linearly along the pin bending guide rail 7 under the drive of the pin bending cylinder 14 and the mold closing cylinder 16. The mold closing cylinder 16 is powered by the power system. The lower pin bending plate can move along the pin bending guide rail 7 under the drive of the mold closing cylinder 16, and at the same time push the TEC lead into the Z-shaped guide groove to undergo the first bending deformation. During the continued pushing process, it undergoes a second bending deformation relative to the upper pin bending plate 5.

[0049] like Figure 8 and Figure 9 As shown, in this embodiment, during the bending and clamping assembly's TEC lead bending process, for the first bending deformation, the lower lead bending plate is lifted upwards by the clamping cylinder 16, and the TEC lead deforms along with the lower lead bending plate. The TEC lead is gradually subjected to pressure and squeezed into the Z-shaped guide groove of the lower lead bending plate. Based on the relative positional relationship between the upper lead bending plate 5, the lower lead bending plate, and the rear lead pressure plate 4, and under their mutual squeezing and clamping action, the TEC lead achieves bending deformation under pressure. The Z-shaped guide groove serves to naturally insert the TEC lead into the Z-shaped guide groove when it is compressed. Because the Z-shaped guide groove allows the TEC lead to be naturally guided in, it prevents the lead from breaking due to external pressure. During the first bending deformation of the TEC lead, the TEC lead is squeezed into the Z-shaped guide groove of the lower lead bending plate. Then, the upper lead bending plate 5 is driven by the cylinder to press down, fixing the first bending deformation of the TEC lead, and transferring the pressure of the lead bending point to the Z-shaped guide groove of the lower lead bending plate. This ensures that the root of the lead is not subjected to the pressure of the bending mechanism during bending and that the lead solder joint does not break.

[0050] For the second bending deformation, it is formed by the lower lead bending plate, the upper lead bending plate 5 and the lead pressure plate 4. The extrusion action should meet the following requirements: the mold closing cylinder 16 should be lifted first and the shear translation cylinder should be pressed down later to ensure that the bending point of the TEC lead does not break when the first bending deformation and the second bending deformation are formed.

[0051] like Figure 10 and Figure 11 As shown, in the above embodiment, preferably, the lower pin bending plate is divided into two sets of mirror-symmetrically arranged lower left pin bending plate 6 and lower right pin bending plate 15. The lower left pin bending plate 6 and lower right pin bending plate 15 are respectively provided with Z-shaped guide grooves, so that the two TEC leads of TEC3 are bent along the Z-shaped guide grooves on both sides. The upper pin bending plate 5 is provided with Z-shaped guide grooves corresponding to those on the lower left pin bending plate 6 and lower right pin bending plate 15, so that the two TEC3 leads of TEC3 can be bent and cut at the same time.

[0052] In the above embodiments, preferably, the cross-section of the Z-shaped guide groove adopts a V-shaped structure, the chamfer radius of the Z-shaped guide groove is 5 mm, and the chamfer angle is 35° to 43°. The Z-shaped guide groove with this shape and size can smoothly and naturally guide the TEC lead wire into the groove.

[0053] like Figure 5As shown, in the above embodiment, preferably, the cutting assembly includes a scissor translation cylinder 12, a scissor moving bracket 19, and a pneumatic scissor 17. The scissor translation cylinder 12 is mounted on the fixed plate 2 via a top cylinder fixing seat 13. The scissor moving bracket 19 is connected to the movable end of the scissor translation cylinder 12 via connecting bolts 22. The scissor moving bracket 19 is mounted on a guide rail 11. Under the drive of the scissor translation cylinder 12, the scissor moving bracket 19 makes a linear reciprocating motion on the guide rail 11. The pneumatic scissor 17 is mounted on the scissor moving bracket 19. Under the drive of the scissor translation cylinder 12, the pneumatic scissor 17 moves along the guide rail 11 to a relative preset position of the TEC lead and cuts the TEC lead.

[0054] In this embodiment, the scissor translation cylinder 12 is mounted on the top of the fixed plate 2, and the pneumatic scissors 17 are positioned downwards. The scissor translation cylinder 12 is connected to the fixed block 9 via a support shaft 20. The fixed block 9, the lead fixing block 8, and the upper lead bending plate 5 together form the upper mold assembly. When the TEC lead is extruded to form a bending deformation, the scissor translation cylinder 12 drives the upper lead bending plate 5 downwards to fix the bending point of the first bending deformation. Continuing to press downwards extrudes the second bending deformation. After the second bending deformation is formed, the pneumatic scissors 17, driven by the scissor translation cylinder 12, can reach the preset position of the TEC lead, thus cutting the TEC lead.

[0055] In the above embodiment, preferably, the TEC lead bending and cutting device further includes a lead waste box 23, a TEC tray 24, and feet 26. The lead waste box 23 is disposed below the fixing plate 2 and can receive the cut TEC leads. The TEC tray 24 is used to place the bent and cut TEC3. At least four feet 26 are disposed below the base 1 to stably support the TEC lead bending and cutting device. In addition, the TEC lead bending and cutting device also includes a protective cover 25 and a switch button 27. The protective cover 25 covers the base 1 to protect the components on the base 1, and the switch button 27 is disposed on the base 1 and connected to the power system.

[0056] The present invention also proposes a method for bending and cutting TEC leads, applied to the bending and cutting apparatus for TEC leads disclosed in any of the above embodiments, comprising:

[0057] Secure the TEC3 to be bent and cut to the lead wire fixing assembly;

[0058] The power system drives the bending and mold closing assembly to move and close the mold, which in turn drives the TEC lead wire on TEC3 to be guided into the guide groove for bending, and extrudes the TEC lead wire into a preset shape corresponding to the guide groove.

[0059] The power system drives the cutting component to move relative to the bending and mold-closing component to cut the TEC lead at a preset position.

[0060] In this embodiment, through the cooperation of the lead wire fixing component, the bending and mold closing component, the cutting component, and the power system, the TEC3 is fixed by the lead wire fixing component, the TEC lead wire is bent into a preset shape by the bending and mold closing component, and the TEC lead wire is cut at a preset position by the cutting component. This achieves automated bending and cutting, which not only ensures the consistency of the bending and cutting shape, but also greatly improves production efficiency, meets the production cycle requirements, unifies the bending shape, improves the cutting effect, reduces the phenomenon of TEC lead wire falling off, breaking, and burrs, and reduces labor and time costs.

[0061] In the above embodiments, preferably, the upper pin bending plate 5 and the lower pin bending plate of the bending and mold assembly are provided with matching Z-shaped guide grooves;

[0062] The lower pin bending plate is driven by the clamping cylinder 16 of the bending and clamping assembly to push the TEC lead into the Z-shaped guide groove to cause the first bending deformation, and a second bending deformation occurs relative to the upper pin bending plate 5 during the continued pushing process.

[0063] In the above embodiment, preferably, the scissor translation cylinder 12 of the cutting component drives the pneumatic scissors 17 to move to a preset position relative to the TEC lead and cuts the TEC lead.

[0064] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A bending and cutting device for TEC leads, characterized in that, include: The base and the lead wire fixing assembly, bending and mold closing assembly, cutting assembly and power system mounted relative to the base; The lead wire fixing assembly is used to fix the TEC to be bent and cut according to a preset position and angle; The bending and die-closing assembly can move relative to the lead wire fixing assembly under the drive of the power system. During the die-closing process, the bending and die-closing assembly can drive the TEC lead wire into the guide groove provided on the bending and die-closing assembly for bending, so that the TEC lead wire can be extruded into a preset shape corresponding to the guide groove. After the TEC lead is bent into a preset shape, the cutting component moves relative to the bending and mold closing component under the drive of the power system, and the cutting component can cut the TEC lead at a preset position. The bending and mold closing assembly includes an upper mold closing part and a lower mold closing part. The upper mold closing part includes an upper pin bending plate, and the lower mold closing part includes a lower pin bending plate, a pin bending guide rail, and a mold closing cylinder. The upper pin bending plate and the lower pin bending plate are provided with matching Z-shaped guide grooves. The lower pin bending plate is mounted on the pin bending guide rail. The lower pin bending plate is connected to the movable end of the mold closing cylinder. The mold closing cylinder is powered by the power system. Under the drive of the mold closing cylinder, the lower pin bending plate can move along the pin bending guide rail, and at the same time push the TEC lead wire into the Z-shaped guide groove to undergo a first bending deformation. During the continued pushing process, a second bending deformation occurs relative to the upper pin bending plate. The lower pin bending plate is divided into two sets of mirror-symmetrical lower left and lower right pin bending plates. The lower left and lower right pin bending plates are respectively provided with Z-shaped guide grooves, so that the two TEC leads of the TEC are bent along the Z-shaped guide grooves on both sides. The upper pin bending plate is provided with Z-shaped guide grooves corresponding to those on the lower left and lower right pin bending plates.

2. The bending and cutting device for TEC leads according to claim 1, characterized in that, The lead fixing assembly includes a fixing plate, a TEC fixing block, and a pin fixing block. The fixing plate is vertically fixed to the base, the TEC fixing block is fixed to the fixing plate, the TEC is fixed to the TEC fixing block, and the TEC lead is fixed by the pin fixing block.

3. The bending and cutting device for TEC leads according to claim 1, characterized in that, The Z-shaped guide groove has a V-shaped cross-section, and the chamfer radius of the Z-shaped guide groove is 5 mm, with a chamfer angle of 35°~43°.

4. The bending and cutting device for TEC leads according to claim 2, characterized in that, The cutting assembly includes a scissor translation cylinder, a scissor moving bracket, and pneumatic scissors. The scissor translation cylinder is mounted on the fixed plate via a top cylinder fixing seat. The scissor moving bracket is mounted on the movable end of the scissor translation cylinder. The pneumatic scissors are mounted on the scissor moving bracket. Driven by the scissor translation cylinder, the pneumatic scissors move to a relatively preset position relative to the TEC lead and cut the TEC lead.

5. The bending and cutting device for TEC leads according to claim 2, characterized in that, It also includes a lead wire waste box and a base. The lead wire waste box is located below the fixing plate and can receive the cut-off TEC leads. The base is located below the base.

6. A method for bending and cutting TEC leads, characterized in that, The bending and cutting apparatus for TEC leads as described in any one of claims 1 to 5 comprises: Secure the TEC to be bent and cut to the lead wire fixing assembly; The bending and mold-closing assembly is driven by a power system to move and close the mold, thereby guiding the TEC lead on the TEC into the guide groove for bending. The TEC lead is extruded into a preset shape corresponding to the guide groove. The lower pin bending plate is driven by the mold-closing cylinder of the bending and mold-closing assembly to push the TEC lead into the Z-shaped guide groove to undergo a first bending deformation. During the continued pushing process, a second bending deformation occurs relative to the upper pin bending plate. The power system drives the cutting component to move relative to the bending and mold-closing component to cut the TEC lead at a preset position.

7. The bending and cutting method for TEC leads according to claim 6, characterized in that, The cutting component's scissor translation cylinder drives the pneumatic scissors to move to a preset position relative to the TEC lead, and cuts the TEC lead.

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