Bag for transporting silicon material and bale of silicon material

Abstract

The present application relates to a bag for transporting silicon material and a bale of silicon material. A bag for transporting silicon material, wherein the bag for transporting silicon material is provided with: a first bag; and a second bag disposed in the first bag, a packaging material constituting the second bag is a laminated material sequentially having a resin base material layer, a barrier layer, and a sealant layer, the sealant layer is located on the inner side of the second bag, the sealant layer has a first surface and a second surface opposite to the first surface, and contains: a first portion containing the first surface; and a second portion located at a position closer to the second surface than the first portion, the first portion contains low-density polyethylene (LDPE), and the second portion contains linear low-density polyethylene (LLDPE).

Description

[0001] This application is a divisional application of Chinese invention patent application filed on August 27, 2020, entitled "Sealant, Silicon Material Transport Bag and Silicon Material Bundle", with application number 202080060589.8. Technical Field

[0002] This disclosure relates to sealants, transport bags for silicon materials, and bundles for silicon materials. Background Technology

[0003] For silicon wafers used in the manufacture of semiconductor products, and silicon materials such as polycrystalline silicon used as raw materials for silicon wafers, extremely high cleanliness is required. Therefore, during transportation, multiple silicon wafers are placed in a cleaned resin casing, and then packaged together with the resin casing in a sealed packaging material. As a packaging material constituting such a packaging material, linear low-density polyethylene (LLDPE) is known to be used.

[0004] Furthermore, bags used for bundling the aforementioned silicon materials are sometimes made of packaging materials that have a barrier function that prevents the permeation of oxygen, water vapor, etc., which can degrade the silicon materials contained therein. As such packaging materials, there are known packaging materials made by depositing polyethylene terephthalate (PET) on one side of an alumina vapor-deposited layer (barrier layer) and low-density polyethylene (LDPE) or linear low-density polyethylene (LLDPE) on the other side (see Patent Document 2).

[0005] Furthermore, the aforementioned silicon materials are typically transported in double-layered bags. Among such double-layered bags are known bags comprising an inner bag and an outer bag, wherein the inner bag is composed of a laminate of plastic bags such as polyester, polyamide, or polyolefin, and the outer bag is composed of a laminate having a barrier layer such as aluminum foil or silica-deposited polyester (see Patent Document 3). By providing a barrier layer on the outer bag, light-blocking and oxygen-barrier properties can be achieved.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2013-136405

[0009] Patent Document 2: Japanese Patent Application Publication No. 2004-148633

[0010] Patent Document 3: Japanese Patent Application Publication No. 2012-223942 Summary of the Invention

[0011] The problem that the invention aims to solve

[0012] One object of this disclosure is to provide: a sealant used in a transport packaging of silicon material that reduces volatile components and improves sealing strength; a packaging material; a transport packaging of silicon material; and a bundle of silicon material; a packaging material, a transport bag of silicon material, and a bundle of silicon material capable of suppressing cracking of the barrier layer; and a transport bag of silicon material and a bundle of silicon material capable of suppressing contamination of the silicon material as contents even if the outer bag is damaged during transport.

[0013] Methods for solving problems

[0014] To address the aforementioned issues, as one embodiment of this disclosure, a packaging material is provided for a bag used for transporting silicon materials. The packaging material is a laminate formed by sequentially stacking a first resin substrate layer, a barrier layer, a second resin substrate layer, a resin layer, and a sealant layer. The compressive modulus (MPa) of the resin layer is more than one decimal place smaller than the compressive modulus (MPa) of each of the first and second resin substrate layers. The compressive modulus (MPa) of the sealant layer is more than one decimal place smaller than the compressive modulus (MPa) of both the first and second resin substrate layers. The difference between the compressive modulus (MPa) of the first resin substrate layer and the compressive modulus (MPa) of the second resin substrate layer is smaller than the difference between the compressive modulus (MPa) of the second resin substrate layer and the compressive modulus (MPa) of the resin layer.

[0015] The difference between the indentation elastic modulus (MPa) of the first resin substrate layer and the indentation elastic modulus (MPa) of the second resin substrate layer is only required to be more than one decimal place smaller than the difference between the indentation elastic modulus (MPa) of the second resin substrate layer and the indentation elastic modulus (MPa) of the resin layer. The difference between the indentation elastic modulus (MPa) of the first resin substrate layer and the indentation elastic modulus (MPa) of the second resin substrate layer is only required to be less than 800 MPa.

[0016] The compressive modulus of the resin materials constituting the first resin substrate layer and the second resin substrate layer only needs to be in the range of 1500MPa to 3500MPa, and the compressive modulus of the material constituting the sealant layer only needs to be in the range of 300MPa to 500MPa. The resin layer can be made of polyethylene.

[0017] The compressive modulus (MPa) of the resin layer may be more than two digits smaller than the compressive modulus (MPa) of the first resin substrate layer and the second resin substrate layer, and the resin layer may be composed of a two-component polyurethane resin adhesive.

[0018] The first resin substrate layer and the second resin substrate layer can be composed of the same resin material, and the thickness of the resin layer only needs to be 1μm to 5μm. The resin materials constituting the first and second resin substrate layers can be polyester resin or polyamide resin, and the resin materials constituting the first and second resin substrate layers can be the polyester resin. The barrier layer can be transparent, and the barrier layer can contain silicon dioxide or aluminum oxide.

[0019] As one embodiment of this disclosure, a transport bag for silicon material is provided, wherein the transport bag for silicon material is composed of the aforementioned packaging material, and the aforementioned sealing layer is located on the inner side of the transport bag for silicon material.

[0020] As one embodiment of this disclosure, a silicon material bundle is provided, comprising: a transport bag for the silicon material; and silicon material contained within the transport bag for the silicon material.

[0021] As one embodiment of this disclosure, a transport bag for silicon material is provided, wherein the transport bag for silicon material comprises a first bag and a second bag disposed within the first bag, and the packaging material constituting the second bag includes a barrier layer.

[0022] The barrier layer may contain silicon dioxide or aluminum oxide. The packaging material constituting the second bag is a laminated material having a resin substrate layer, the barrier layer and a sealant layer in sequence. The sealant layer may be located on the inside of the second bag. The resin substrate layer may be made of polyester resin or polyamide resin.

[0023] The packaging material constituting the second bag may be a laminated material having an adhesive layer between the resin substrate layer and the barrier layer, or a laminated material having a resin layer containing a polyester resin between the barrier layer and the sealant layer. It may be a laminated material having a resin substrate layer, the barrier layer, the resin layer and the sealant layer in sequence, wherein the resin substrate layer and the resin layer contain the same resin, and the sealant layer may be located on the inside of the second bag or may be transparent.

[0024] The packaging material constituting the first bag is a laminated material having a resin substrate layer comprising a polyester resin and a sealant layer in sequence. The sealant layer may be located on the inner side of the first bag and may be composed of a laminated material without a barrier layer or a laminated material without polyamide resin. The thickness of the resin substrate layer of the packaging material constituting the first bag may be 8 μm to 30 μm.

[0025] As one embodiment of this disclosure, a silicon material bundle is provided, comprising: a transport bag for the silicon material; and silicon material contained in a second bag within the transport bag for the silicon material.

[0026] As one embodiment of this disclosure, a transport bag for silicon material is provided, comprising a first bag and a second bag disposed within the first bag, the second bag being disposed within the first bag in a manner not fixed to the first bag, and the packaging material constituting the second bag comprising a barrier layer.

[0027] As one embodiment of this disclosure, an inner bag is provided, which is the inner bag in a transport bag of silicon material having an outer bag and an inner bag disposed inside the outer bag in a manner not fixed to the outer bag, wherein the packaging material constituting the inner bag includes a barrier layer.

[0028] As one embodiment of this disclosure, a sealant is provided for use in a transport packaging of silicon materials, wherein the sealant comprises a sealant substrate having a first surface and a second surface facing the first surface, the sealant substrate comprising: a first portion including the first surface; and a second portion located at a position closer to the second surface than the first portion, the first portion comprising low-density polyethylene (LDPE), and the second portion comprising linear low-density polyethylene (LLDPE).

[0029] The second part may further comprise low-density polyethylene (LDPE), and the sealant substrate may further comprise a third part that is located further away from the second surface than the second part, the third part of which may comprise low-density polyethylene (LDPE).

[0030] The sealant substrate may be a laminated structure having at least a first layer including the first part and a second layer including the second part, or it may be a single-layer structure having at least the first part and the second part.

[0031] The first portion may be rich in the low-density polyethylene (LDPE), and the second portion may be thicker than the first portion. The low-density polyethylene (LDPE) contained in the first portion may be low-density polyethylene that is substantially free of added slip agents, and the linear low-density polyethylene (LLDPE) contained in the second portion may be linear low-density polyethylene that is substantially free of added slip agents.

[0032] As one embodiment of this disclosure, a packaging material is provided having a base made of resin material and the aforementioned sealant disposed on one side of the base, the sealant being disposed such that the second surface abuts against one side of the base.

[0033] Alternatively, it may also have an air barrier layer formed on the other side of the base.

[0034] As one embodiment of this disclosure, a transport package for silicon material made of the aforementioned packaging material is provided.

[0035] As one embodiment of this disclosure, a silicon material bundle is provided, which includes the aforementioned silicon material transport packaging body and the silicon material housed within the silicon material transport packaging body.

[0036] As one embodiment of this disclosure, a sealant is provided for use in packaging for transporting silicon materials. The sealant comprises a sealant substrate having a first surface and a second surface facing the first surface. The sealant substrate has: a first surface layer including the first surface; a second surface layer including the second surface; and an intermediate layer located between the first surface layer and the second surface layer. The first surface layer and the second surface layer comprise low-density polyethylene (LDPE), and the intermediate layer comprises linear low-density polyethylene (LLDPE). The sealant has an indentation modulus of elasticity in the range of 300 MPa to 500 MPa.

[0037] The thickness of the intermediate layer can be greater than the thickness of the first surface layer and the thickness of the second surface layer, respectively.

[0038] As one embodiment of this disclosure, a sealant is provided for use in packaging for transporting silicon materials. The sealant comprises a sealant substrate having a first surface and a second surface facing the first surface. The sealant substrate is a single-layer structure comprising low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE), and the sealant has an indentation modulus in the range of 300 MPa to 500 MPa.

[0039] The effects of the invention

[0040] According to this disclosure, it is possible to provide: a sealant used in a transport packaging of silicon material that reduces volatile components and improves sealing strength; a packaging material; a transport packaging of silicon material; and a bundle of silicon material; a packaging material, a transport bag of silicon material, and a bundle of silicon material that can suppress cracking of the barrier layer; and a transport bag of silicon material and a bundle of silicon material that can suppress contamination of the silicon material as the contents even if the outer bag is damaged during transport. Attached Figure Description

[0041] Figure 1 This is a partially enlarged cut-off end view showing a schematic structure of a sealant according to one embodiment of the present disclosure.

[0042] Figure 2 This is a partially enlarged cut-off end view showing another schematic structure of the sealant according to one embodiment of the present disclosure.

[0043] Figure 3 This is a partially enlarged cut-off end view showing a schematic structure of a packaging material in one embodiment of the present disclosure.

[0044] Figure 4 This is a partially enlarged cut-off end view showing a schematic structure of another embodiment of the packaging material according to the present disclosure.

[0045] Figure 5 This is a schematic diagram illustrating an example of the structure of a manufacturing apparatus capable of producing packaging materials according to one embodiment of the present disclosure.

[0046] Figure 6 This is a perspective view showing a schematic structure of a silicon material transport package according to one embodiment of the present disclosure.

[0047] Figure 7 This is a perspective view showing a schematic structure of a silicon material bundle in one embodiment of the present disclosure.

[0048] Figure 8 This is a perspective view showing a schematic structure of a silicon material bundle in one embodiment of the present disclosure.

[0049] Figure 9A This is a mass spectrum showing the GC / MS analysis results of sample 1.

[0050] Figure 9B This is a mass spectrum showing the GC / MS analysis results of sample 2.

[0051] Figure 9C This is a mass spectrum showing the GC / MS analysis results of sample 3.

[0052] Figure 10 This is a perspective view illustrating a schematic structure of a silicon material transport bag according to one embodiment of the present disclosure.

[0053] Figure 11 This is a perspective view showing a schematic structure of one embodiment of the first bag according to the present disclosure.

[0054] Figure 12 This is a perspective view showing a schematic structure of one embodiment of the second bag according to the present disclosure.

[0055] Figure 13 This is a partially enlarged cut-off end view showing a schematic structure of a first packaging material in one embodiment of the present disclosure.

[0056] Figure 14 This is a partially enlarged cut-off end view showing a schematic structure of a second packaging material in one embodiment of the present disclosure.

[0057] Figure 15 This is a partially enlarged cut-off end view showing a schematic structure of another embodiment of the second packaging material according to the present disclosure.

[0058] Figure 16 This is a partially enlarged cut-off end view showing a schematic structure of another embodiment of the second packaging material according to the present disclosure.

[0059] Figure 17 This is a partially enlarged cut-off end view showing a schematic structure of another embodiment of the second packaging material according to the present disclosure.

[0060] Figure 18 This is a partially enlarged cut-off end view showing a schematic structure of one embodiment of the sealing layer of the first packaging material according to the present disclosure.

[0061] Figure 19 This is a partially enlarged cut-off end view showing another aspect of the schematic structure of the sealant layer of the first packaging material in one embodiment of the present disclosure.

[0062] Figure 20 This is a partially enlarged cut-off end view showing a schematic structure of one embodiment of the sealing layer of the second packaging material according to the present disclosure.

[0063] Figure 21 This is a partially enlarged cut-off end view showing another aspect of the schematic structure of the sealant layer of the second packaging material in one embodiment of the present disclosure.

[0064] Figure 22 This is a perspective view illustrating a schematic structure of a silicon material bundle in one embodiment of the present disclosure.

[0065] Figure 23 This is a perspective view illustrating a schematic structure of a silicon material bundle in one embodiment of the present disclosure.

[0066] Figure 24A This is a partially enlarged cut-off end view showing a schematic structure of a packaging material in one embodiment of the present disclosure.

[0067] Figure 24B This is a partially enlarged cut-off end view showing a schematic structure of another embodiment of the packaging material according to the present disclosure.

[0068] Figure 24CThis is a partially enlarged cut-off end view showing a schematic structure of another embodiment of the packaging material according to the present disclosure.

[0069] Figure 25 This is a partially enlarged cut-off end view showing a schematic structure of another embodiment of the packaging material according to the present disclosure.

[0070] Figure 26 This is a partially enlarged cut-off end view showing a schematic structure of a sealant in one embodiment of the present disclosure.

[0071] Figure 27 This is a partially enlarged cut-off end view showing a schematic structure of the sealant in one embodiment of the present disclosure.

[0072] Figure 28 This is a perspective view showing a schematic structure of a transport bag for silicon material according to one embodiment of the present disclosure in an expanded state.

[0073] Figure 29 This is a perspective view showing the schematic structure of a transport bag for silicon material in one embodiment of the present disclosure in a closed state.

[0074] Figure 30 This is a perspective view showing a schematic structure of a silicon material bundle in one embodiment of the present disclosure.

[0075] Figure 31 This is a perspective view showing a schematic structure of a silicon material bundle in one embodiment of the present disclosure. Detailed Implementation

[0076] The embodiments of this disclosure will be described with reference to the accompanying drawings.

[0077] In the accompanying drawings, for ease of understanding, the shapes, scales, and aspect ratios of various parts are sometimes altered or exaggerated relative to the actual object. In this specification, the numerical range indicated by “~” refers to the range encompassing the values ​​described before and after the “~”, which are respectively designated as the lower and upper limits. In this specification, the terms “membrane,” “sheet,” and “plate” are not distinguished based on their usage. For example, “plate” also includes components that are generally referred to as “sheet” or “membrane.”

[0078] like Figure 1 and Figure 2As shown, the sealant 1 in this embodiment is a sealant for packaging (packaging for transporting silicon materials) used in the transportation of silicon materials, and includes a sealant substrate 2 having a first surface 2A and a second surface 2B opposite thereto. The sealant substrate 2 may be a laminated structure having a first surface layer 21 on the first surface 2A side, a second surface layer 22 on the second surface 2B side, and an intermediate layer 23 between the first surface layer 21 and the second surface layer 22 (see reference). Figure 1 It can also be a single-layer structure with a first surface 2A and a second surface 2B (see reference). Figure 2 ).

[0079] exist Figure 1 In the illustrated configuration, the first surface layer 21 on the first surface 2A side is a layer containing low-density polyethylene (LDPE) without substantially added slip agents. The second surface layer 22 on the second surface 2B side is similar to the first surface layer 21, for example, a layer containing low-density polyethylene (LDPE) without substantially added slip agents. The intermediate layer 23 sandwiched between the first surface layer 21 and the second surface layer 22 is, for example, a layer containing linear low-density polyethylene (LLDPE) without substantially added slip agents. Furthermore, in this embodiment, "without substantially added slip agents" means that the component that, as a slip agent, actually improves the smoothness of the sealant surface is added in an amount that is sufficient to actually affect the smoothness of the sealant surface. Examples of slip agents include particles of calcium carbonate or talc, surfactants such as silicone resins or quaternary ammonium compounds.

[0080] If volatile components (such as gas release components from sealant 1) from the innermost layer of the silicon transport packaging adhere to the polycrystalline silicon or silicon wafer containing the contents, defects may occur in semiconductor devices manufactured using that silicon wafer. Therefore, it is desirable to minimize the amount of volatile components from sealant 1. To reduce the volatile components from sealant 1, it is desirable to make the thickness T2 of sealant 1 as thin as possible. By making the thickness T2 of sealant 1 relatively thin, the volatile components from sealant 1 are released to the outside of the membrane, thus reducing the amount of volatile components from sealant 1. On the other hand, if the thickness T2 of sealant 1 is too thin, the resistance to mechanical properties such as tensile strength decreases, potentially reducing the functionality of the bag as a packaging for the contents. In this regard, linear low-density polyethylene (LLDPE) has higher elasticity and greater resistance to bending than low-density polyethylene (LDPE). Therefore, by using LLDPE as sealant 1, the thickness T2 of sealant 1 can be made relatively thin.

[0081] Additionally, when the resin housing 51 (refer to) Figure 7) Transport packaging for housing silicon material 10 (refer to Figure 6 After that, the air is degassed from the packaging body 10 and then bundled. Therefore, for the packaging material 3 constituting the packaging body 10 (refer to...), Figure 3 and Figure 4 For the sealant 1 contained in the product, good conformability is required. In this regard, since linear low-density polyethylene (LLDPE) has relatively high elasticity, the conformability of sealant 1 can also be achieved by using LLDPE.

[0082] If the sealant is composed of a single layer of linear low-density polyethylene (LLDPE), the compressive modulus of elasticity of the sealant composed of a single layer of LLDPE can be adjusted to approximately 150 MPa to 600 MPa. Therefore, it is conceivable that the thickness of the sealant can be reduced. Furthermore, even considering good sealant conformability, it can be said that a sealant composed of a single layer of LLDPE is preferred. However, since the polymerization pressure of LLDPE is lower than that of low-density polyethylene (LDPE), the low molecular weight components in LLDPE are more volatile compared to LDPE. Therefore, it is considered that even if the sealant thickness can be reduced if it is composed of a single layer of LLDPE, the silicone material may still be contaminated by volatile components from the sealant. Furthermore, it is believed that linear low-density polyethylene (LLDPE) tends to have reduced smoothness compared to low-density polyethylene (LDPE). Therefore, if the sealant is composed of a single layer of LLDPE, the surface smoothness of the sealant may be reduced. Regarding sealants used in packaging for transporting silicone materials, it is preferable to avoid adding any slip agents that could potentially become foreign matter. Therefore, it is preferable to improve smoothness by means other than the use of slip agents. In this embodiment, the intermediate layer 23 containing LLDPE is sandwiched between a first surface layer 21 and a second surface layer 22 containing LDPE. Therefore, the sealant 1 according to this embodiment can have a relatively thinner thickness T2, good conformability and smoothness, and can prevent the volatilization of low-molecular-weight components from the LLDPE contained in the intermediate layer 23.

[0083] exist Figure 2In the sealant 1 shown, the single-layer structure of the sealant substrate 2 comprises low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE). In this sealant substrate 2, the mixing ratio of LDPE to LLDPE is only approximately 50:50 to 70:30. By ensuring that the amount of LDPE is greater than or equal to the amount of LLDPE, and preferably greater, the amount of LDPE is increased compared to the amount of LLDPE. This increases the amount of LDPE on the first surface 2A of the sealant substrate 2, and the LLDPE also helps to thin the thickness T2 of the sealant 1, thus preventing the volatilization of low-molecular-weight components. Furthermore, when viewed in the thickness direction of the sealant substrate 2, low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE) can be substantially uniformly present, or the low-density polyethylene (LDPE) can be biased towards the first surface 2A side and the second surface 2B side.

[0084] Regarding the thickness T2 of the sealant 1 in this embodiment, it can be determined based on the thickness of the packaging material 3 containing the sealant 1 (see reference 3). Figure 3 and Figure 4 The transport packaging body 10 of silicon material composed of (refer to) Figure 6 The thickness, etc., can be set appropriately, but for example, approximately 35μm to 60μm is sufficient.

[0085] exist Figure 1 In the illustrated configuration, a first surface layer 21 comprising low-density polyethylene (LDPE) and a second surface layer 22 comprising low-density polyethylene (LDPE) are arranged with an intermediate layer 23 sandwiched between them. This arrangement causes the internal stress on one side of the sealant 1 to partially offset the internal stress on the other side, thus suppressing curling of the sealant 1. Furthermore, in Figure 1In the illustrated configuration, the thicknesses T21 and T22 of the first surface layer 21 and the second surface layer 22 are both thinner than the thickness T23 of the intermediate layer 23. By configuring the thicknesses T21 and T22 of the first surface layer 21 and the second surface layer 22 to be thinner than the thickness T23 of the intermediate layer 23, the sealant 1 can be given a specified conformability. The ratio of the thickness T21 of the first surface layer 21 to the thickness T23 of the intermediate layer 23 only needs to be approximately 1:1 to 10, preferably approximately 1:2 to 3. By making this thickness ratio within the above range, the sealant 1 can be given sufficient conformability due to the low-density linear polyethylene (LLDPE) contained in the intermediate layer 23, thereby enabling the sealant 1 to have an indentation modulus of elasticity in the range of 300 MPa to 500 MPa. Furthermore, the indentation modulus of elasticity can be measured using a microhardness tester (product name "PICODENTOR HM500", manufactured by Fischer Instruments). Figure 2 In the method shown, by mixing low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE) in a ratio of 50:50 to 70:30, the compressive modulus of sealant 1 can be made to be in the range of 300 MPa to 500 MPa.

[0086] It is known that the sealing strength of a sealant can be controlled by the sealing temperature, sealing pressure, and sealing time during heat sealing. Generally, there is a tendency for higher sealing temperatures to increase sealing strength, but if the sealing temperature is too high, the sealant will over-melt, which may lead to a decrease in sealing strength. In this embodiment, when the first surfaces 2A of the sealant 1 are sealed together under heat sealing conditions of 150°C, 0.1 MPa, and 1 second, the sealing strength only needs to be 30 N / 15 mm or more, preferably 50 N / 15 mm or more and less than 60 N / 15 mm. If the sealing strength is less than 30 N / 15 mm, then when packaged in packaging material 3 (refer to) containing the sealant 1... Figure 3 and Figure 4 The transport packaging body 10 of silicon material composed of (refer to) Figure 6 During the transport of silicon material in the package 10, the heat-sealed portion (e.g., the upper surface heat-sealed portion HST, etc.) of the silicon material transport package 10 is used for sealing. Figure 7 It is possible to peel off.

[0087] As described above, from the viewpoint of making the thickness T2 of sealant 1 relatively thinner, it is considered preferable to use linear low-density polyethylene (LLDPE) as the constituent material of sealant 1. However, in sealants made of linear low-density polyethylene (LLDPE), the sealing temperature required to obtain the specified sealing strength is relatively high. In this regard, in this embodiment, by making the first surface layer 21 of sealant 1 contain low-density polyethylene (LDPE), the sealing temperature required to obtain the specified sealing strength can be relatively reduced.

[0088] In this embodiment, the haze of the sealant 1 only needs to be 25% or less, preferably 20% or less. By making the haze of the sealant 1 20% or less, the haze of the silicone material transport packaging 10 (refer to) made of packaging material 3 having the sealant 1 is reduced. Figure 6 In this process, the internal structure can be visually inspected effectively. Furthermore, before packaging the silicon material into the transport packaging, it is possible to check whether any foreign matter adheres to the first surface 2A of the sealant 1, thus preventing contamination of the silicon material. Additionally, the haze of the sealant 1 can be measured, for example, using a haze meter (product name: HM-150, manufactured by Murakami Color Research Institute Co., Ltd.) according to JIS-K7136.

[0089] The sealant 1 having the above structure can be manufactured using conventionally known thin-film deposition methods. For example, having Figure 1 The sealant 1 shown can be manufactured by laminating a second surface layer 22, an intermediate layer 23, and a first surface layer 21 using coating methods such as molding or blow molding. Figure 2 The sealant 1 shown can also be manufactured using the coating method, extrusion blow molding method, etc., as described above.

[0090] Here, low-density polyethylene (LDPE without added slip agents, manufactured by Ube Maruzen Polyethylene Co., Ltd., product name: UBE polyethylene B128) is used as the constituent material of the first surface layer 21; a melt mixture (mixing ratio = 1:1 (mass basis) of low-density polyethylene (LDPE without added slip agents, manufactured by Ube Maruzen Polyethylene Co., Ltd., product name: UBE polyethylene B128) and linear low-density polyethylene (LLDPE without added slip agents, manufactured by Prattmann Polymer Co., Ltd., product name: ULTZEX3500ZA) is used as the constituent material of the intermediate layer 23; and low-density polyethylene (LDPE without added slip agents, manufactured by Ube Maruzen Polyethylene Co., Ltd., product name: UBE polyethylene B128) is used as the constituent material of the second surface layer 22. A film with [missing information] is produced by multilayer co-extrusion blow molding. Figure 1The sealant 1 with the structure shown (first surface layer 21 (film thickness: 8 μm), intermediate layer 23 (film thickness: 24 μm), second surface layer 22 (film thickness: 8 μm)) (sample 1).

[0091] In addition, low-density polyethylene (LDPE without added slip agents, manufactured by Ube Maruzen Polyethylene Co., Ltd., product name: UBE Polyethylene B128) granules and linear low-density polyethylene (LLDPE without added slip agents, manufactured by Priman Polymers Co., Ltd., product name: ULTZEX3500ZA) granules were melt-mixed at a ratio of 7:3 (by weight), and then produced by blow-forming a film with... Figure 2 The sealant 1 (thickness: 40 μm) of the structure shown (sample 2).

[0092] Then, a sealant (thickness: 50 μm) made of additive-free linear low-density polyethylene (additive-free LLDPE, manufactured by Tamapoly, product name: NB-1) was prepared (sample 3).

[0093] Slices of the sealant from samples 1-3 were cut into 100mm × 25mm pieces and immersed in ethanol at 60°C for one week. Then, the volatile components from these slices were analyzed by GC / MS under the following conditions, yielding mass spectra. Figures 9A to 9C The obtained mass spectrum is shown in the figure.

[0094] <GC / MS Conditions>

[0095] • Gas chromatograph: GCMS-QP2010 (manufactured by Shimadzu Corporation)

[0096] • Column: 670-15003-03 (Length: 30mm, Inner Diameter: 0.25mm, manufactured by Shimadzu Corporation)

[0097] • Column oven temperature: 50℃

[0098] Injection volume: 1 μL

[0099] • Carrier gas: He (57.1 mL / min)

[0100] • Vaporization chamber temperature setting: 300℃

[0101] • Measurement mode: Divert

[0102] like Figures 9A to 9CAs shown in the mass spectra, no volatile components were detected in the sealant 1 of samples 1 and 2, but volatile components were detected in the sealant of sample 3. It can be inferred that by making the first surface layer 21 on the first side 2A, as in samples 1 and 2, contain low-density polyethylene (LDPE), and by making the intermediate layer 23 on the second side 2B, in contrast, contain linear low-density polyethylene (LLDPE), it is possible to prevent low-molecular-weight components from volatilizing from the sealant 1.

[0103] Furthermore, for the slices cut from the sealant of the above-mentioned samples 1 to 3 at the desired size, the compressive modulus was measured according to ISO 14577:2015 in an atmosphere with a temperature of 23℃ ± 2℃ and a humidity of 60% RH ± 5% RH. First, with the first side 2A of the above-mentioned slices cut into sizes of 20mm × 20mm as the upper surface, the slices were fixed to a commercially available glass slide (hereinafter referred to as "the first glass slide") with adhesive resin (product name "ARONALPHA (registered trademark) General Use", manufactured by Toa Synthetic Co., Ltd.). Specifically, the above-mentioned adhesive resin was dripped onto the center of the first glass slide (product name "Slide (Cut Type) 1-9645-11", manufactured by AS ONE Co., Ltd.). At this time, the adhesive resin was not spread, and one drop of adhesive resin was dripped in such a way that the adhesive resin did not overflow from the above-mentioned slice when pressed and spread as described later. Then, the slice is brought into contact with the first glass slide with the first surface 2A as the top surface and the adhesive resin located in the center of the slice. The adhesive resin is pressed and spread between the first glass slide and the slice to form a temporary bond. Then, another new glass slide (hereinafter referred to as "second glass slide") is placed on the slice to obtain a laminate of first glass slide / adhesive resin / slice / second glass slide. Next, a weight of 30g to 50g is placed on the second glass slide and left at room temperature for 12 hours. Then, the weight and the second glass slide are removed and used as a measurement sample. Then, the measurement sample is fixed on the measuring stage of a microhardness testing machine (product name: PICODENTOR HM500, manufactured by Fischer Instruments) set parallel to the vibration table. This fixing is achieved by securing the four sides of the first glass slide with tape (product name: Cello Tape (registered trademark), manufactured by NICHIBAN) to prevent the measurement sample from moving. Next, on the first side 2A of the slice, the indentation modulus (MPa) was measured using an ultra-micro load hardness tester (PICODENTOR HM500, Fischer Instruments) equipped with a Vickers indenter (a diamond indenter with a 136° opposite angle of a regular square pyramid). The indentation was performed at an indentation speed of 0.15 μm / s, an indentation depth of 3 μm, a holding time of 5 seconds, and a pull-out speed of 0.15 μm / s. Measurements were taken at at least five different locations within a single slice, and the average of these measurements was taken as the indentation modulus of the sealant under these conditions. The results are shown in Table 1.

[0104] [Table 1]

[0105] Indentation modulus (MPa) Sample 1 457.3 Sample 2 371.6 Sample 3 159.0

[0106] As shown in Table 1, although the indentation modulus of elasticity of samples 1 and 2 is larger than that of sample 3, they are presumed to have sufficient flexibility to provide adequate conformability in practical applications, and also possess flexural strength. Furthermore, it is presumed that the sealant in samples 1 and 2 ensures sufficient transparency.

[0107] Then, the first surfaces of the sealant of samples 1 to 3 were heat-sealed together at sealing temperatures of 110°C, 120°C, 130°C, 140°C and 150°C. A heat-sealing test piece with a width of 15 mm including the heat-sealed part was selected, and the sealing strength (N / 15 mm) of the heat-sealing test piece at each sealing temperature was determined according to JIS-Z1711.

[0108] [Table 2]

[0109]

[0110] As shown in Table 2, sealant 1 in samples 1 and 2, compared to sealant 3, is presumably able to achieve higher sealing strength at a lower sealing temperature. Furthermore, at sealing temperatures of 110℃ and 120℃, samples 1 through 3 do not achieve satisfactory sealing strength.

[0111] like Figure 3 As shown, the packaging material 3 in this embodiment has a multi-layer structure formed by laminating the sealant 1 in such a way that the second surface 2B abuts against one side of the base 4.

[0112] The base 4 is, for example, composed of a laminate of one or more resin materials selected from polyethylene (PE), polyethylene terephthalate (PET), nylon (registered trademark, Ny), and polybutylene terephthalate (PBT). Furthermore, in Figure 3 In the example shown, the base 4 is composed of a laminate of two resin materials (a first resin layer 41 and a second resin layer 42), with the first resin layer 41 functioning as an adhesive layer for bonding to the second surface 2B of the sealant 1. In this case, for example, it is sufficient if the first resin layer 41 is made of polyethylene (PE) and the second resin layer 42 is made of polyethylene terephthalate (PET).

[0113] The sealant 1 in the aforementioned packaging material 3 has the following degree of transparency: in the transport packaging 10 of the silicon material manufactured from this packaging material 3 (refer to...) Figure 6When silicon material is packaged in the packaging, the interior of the packaging body 10 can be visually inspected. Therefore, the packaging material 3 having the sealant 1 should also preferably have a level of transparency that allows for visual inspection of the interior of the packaging body 10. From this perspective, the haze of the packaging material 3 in this embodiment is preferably 30% or less, and more preferably 25% or less. When the haze of the packaging material 3 exceeds 30%, there is a concern that the visual inspection of the interior of the silicon material transport packaging body 10 made of the packaging material 3 deteriorates, or it becomes difficult to confirm whether foreign matter is attached to the first surface 2A of the sealant 1 in the silicon material transport packaging body 10. Furthermore, the haze of the packaging material 3 can be measured, for example, using a haze meter (product name: HM-150, manufactured by Murakami Color Research Institute Co., Ltd.) according to JIS-K7136.

[0114] In this embodiment, a gas barrier layer 5 may also be provided on the other side of the base 4 (see reference). Figure 4 By having a gas barrier layer 5, gases that could contaminate the surface of the silicon material can be prevented from entering the transport packaging 10 (see reference 3) of the silicon material, which is made of packaging material 3. Figure 6 External intrusion. The gas barrier layer 5 can be, for example, a vapor-deposited film formed by vapor-depositing inorganic oxides such as silicon dioxide or aluminum oxide onto a resin layer (e.g., a PET layer). Alternatively, the packaging material 3 may have a metal vapor-deposited film or a metal foil such as aluminum vapor-deposited on the other side of the base 4. When these metal vapor-deposited films or metal foils are present on the other side of the base 4, transparency cannot be ensured in the packaging material 3, but in addition to gas barrier properties, light-shielding properties can be provided to the silicon material transport packaging 10 made of the packaging material 3. In addition, in this manner, by making the sealant 1 provided on one side of the base 4 have a specified transparency, it is easier to confirm whether foreign matter is attached to the first side 2A of the sealant 1 in the silicon material transport packaging 10 made of the packaging material 3.

[0115] Packaging material 3 having the above structure can be manufactured using conventional methods for manufacturing films, etc., for example, such as... Figure 5 As shown, the packaging material 3 can be produced using a manufacturing apparatus 60 having a first roller 61, a second roller 62, a third roller 63, and a T-die 64. In this manufacturing apparatus 60, between the second surface 2B of the sealant 1 and the second resin layer 42, the resin material constituting the first resin layer 41 is extruded in film form from the T-die 64 and cooled by surface pressing with the first roller 61, the second roller 62, and the third roller 63, thereby producing the packaging material 3.

[0116] like Figure 6As shown, the silicon material transport packaging 10 in this embodiment is a generally cuboid (generally rectangular) packaging bag that is expanded, and it is composed of a first side film 11, a second side film 12, a first side fold film 13, and a second side fold film 14. The first side film 11, the second side film 12, the first side fold film 13, and the second side fold film 14 are all composed of the aforementioned packaging material 3. The silicon material transport packaging 10 is configured such that the first surface 2A of the sealant 1 of any one of the first side film 11, the second side film 12, the first side fold film 13, and the second side fold film 14 is located on the innermost surface, and the other side of the base 4 is located on the outermost surface.

[0117] In the aforementioned silicon material transport packaging 10, a first heat-sealed portion HS1 is formed by overlapping one of the two opposing side edges of the first side film 11 with one of the two opposing side edges of the folded-in first side fold film 13 and then heat-sealing and welding them together. A second heat-sealed portion HS2 is formed by overlapping the other side edge of the first side film 11 with one of the two opposing side edges of the folded-in second side fold film 14 and then heat-sealing and welding them together. Furthermore, a third heat-sealed portion HS3 is formed by overlapping one of the two opposing side edges of the second side film 12 with one of the other side edges of the folded-in first side fold film 13 and then heat-sealing and welding them together. A fourth heat-sealed portion HS4 is formed by overlapping the other side edge of the second side film 12 with one of the other side edges of the folded-in second side fold film 14 and then heat-sealing and welding them together. A bottom heat-sealed portion HSB is formed by overlapping the side edges of the first side film 11 and the second side film 12 and welding them together by heat sealing. The side edges of the first side film 11 and the second side film 12 located opposite the bottom heat-sealed portion HSB are not heat-sealed, thus forming an opening 15 for transporting silicon material in the packaging body 10.

[0118] With multiple layers of the silicon material transport package 10 stacked, including the first side fold film 13 and the second side fold film 14, the opening 15 can be opened by adsorbing and holding the first side film 11 or the second side film 12 and lifting it upwards. Through this opened opening 15, a resin casing 51 containing the silicon material (silicon wafer) 52 is inserted into the silicon material transport package 10 (see reference). Figure 7 ) or silicon material (polycrystalline silicon) 53 (refer to) Figure 8 The first side film 11 and the second side film 12 in the opening 15 are overlapped for heat sealing, thereby forming the upper surface heat-sealed portion HST and producing a silicon material bundle 50 (see reference). Figure 7 and Figure 8 ).

[0119] Generally, sealant is located in the innermost layer of the packaging used to encapsulate silicon materials. However, if volatile components from the sealant (gas release components from the sealant) adhere to silicon materials such as polycrystalline silicon or silicon wafers, defects may occur in semiconductor devices manufactured using that silicon material. Therefore, it is desirable to have fewer volatile components from the sealant. One method to reduce volatile components from the sealant is to thin it. When thinning the sealant, linear low-density polyethylene (LLDPE) is preferred as a constituent material, considering its resistance to bending, etc. However, LLDPE tends to produce low-molecular-weight components due to the low polymerization pressure, raising concerns about the potential for volatile components to be released from the sealant. Furthermore, LLDPE has a relatively high sealing temperature, which may make it difficult to achieve sufficient sealing strength.

[0120] In the silicon material transport packaging 10 of this embodiment, low-density polyethylene (LDPE) is contained on the first surface 2A side of the innermost sealant 1, and linear low-density polyethylene (LLDPE) is contained on the second surface 2B side. The use of LLDPE in the sealant 1 allows for a relatively thinner thickness T2, resulting in good conformability. Furthermore, the presence of LDPE on the first surface 2A side of the sealant 1 prevents the volatilization of low-molecular-weight components from the LLDPE. While a metal vapor-deposited film or metal foil cannot guarantee the required transparency when it is provided on the other side of the base 4 of the packaging material 3 constituting the silicon material transport packaging 10, providing a metal vapor-deposited film or metal foil on the other side of the base 4 of the packaging material 3 imparts gas barrier and light-blocking properties to the silicon material transport packaging 10. Furthermore, by ensuring the specified transparency in the sealant 1 provided on one side of the base 4, it is easy to confirm whether there are foreign objects attached to the first side 2A of the sealant 1 in the silicon material transport packaging 10.

[0121] like Figures 10-12 As shown, the silicon material transport bag 100 of this embodiment is a double-layered packaging bag having a first bag 110 and a second bag 120 disposed inside the first bag 110. The first bag 110 is the so-called outer bag, and the second bag 120 is the so-called inner bag. The second bag 120, as the inner bag, is independent of the first bag 110, which is the outer bag, and is disposed inside the first bag 110 in a manner that it is not fixed to the first bag 110.

[0122] Both bag 110 and bag 120 are packaging bags that unfold into a roughly cuboid (roughly rectangular) shape. They are composed of first side films 111 and 121, second side films 112 and 122, first side fold films 113 and 123, and second side fold films 114 and 124. The first side film 111, the second side film 112, the first side fold film 113, and the second side fold film 114 are all made of the first packaging material 130 (see reference). Figure 13 The first side film 121, the second side film 122, the first side fold film 123, and the second side fold film 124 are all composed of the second packaging material 140 (see reference). Figures 14-17 The second bag 120 is constructed as follows. Regarding its outer diameter, it can be any size that allows it to be fitted within the first bag 110. That is, the first bag 110 is slightly larger than the second bag 120. Alternatively, neither the first bag 110 nor the second bag 120 may have the first side fold films 113, 123 and the second side fold films 114, 124. In this case, the three side edges can be heat-sealed together by aligning the first surfaces 132A, 142A of the sealing adhesive layers 132, 142 of the first side films 111, 121 and the second side films 112, 122 with each other.

[0123] The first packaging material 130 constituting the films of the first bag 110 (first side film 111, second side film 112, first side fold film 113, and second side fold film 114) has: a resin substrate layer 131 having one side 131A and another side 131B opposite thereto; and a sealant layer 132 laminated on the side of the resin substrate layer 131 having one side 131A (see reference). Figure 13 Furthermore, the first packaging material 130 is not limited to a double-layer structure of resin substrate layer 131 and sealant layer 132. For example, other layers such as resin layer or adhesive layer may be provided between resin substrate layer 131 and sealant layer 132. Similarly, the aforementioned other layers may be provided on the side of resin substrate layer 131 opposite to the side of sealant layer 132, and the aforementioned other layers may also be provided on the side of sealant layer 132 opposite to the side of resin substrate layer 131.

[0124] The second packaging material 140 constituting the films (first side film 121, second side film 122, first side fold film 123, and second side fold film 124) of the second bag 120 comprises: a resin substrate layer 141 having one side 141A and an opposite side 141B; a barrier layer 143 laminated on one side 141A of the resin substrate layer 141; and a sealant layer 142 laminated on the barrier layer 143 (see reference). Figure 14 Regarding the second packaging material 140, besides Figure 14In addition to the method shown, a barrier layer 143, a resin layer 144 including polyethylene terephthalate (PET) and the like, and a sealant layer 142 (see reference) can also be sequentially laminated. Figure 15 Alternatively, the resin substrate layer 141, barrier layer 143, resin layer 144, and sealant layer 142 can be layered sequentially (see reference). Figure 16 Furthermore, the resin substrate layer 141, adhesive layer 145, barrier layer 143, and sealant layer 142 can be layered sequentially (see reference). Figure 17 Furthermore, similar to the first packaging material 130 described above, the second packaging material 140 is not limited to the layer structure described above, and other layers described above may also be provided.

[0125] Examples of resin materials included in resin layer 144 include polyester resin materials such as polyethylene (PE), polyethylene terephthalate (PET), and polybutylene terephthalate (PBT). Figure 16 In the manner shown, the resin substrate layer 141 and the resin layer 144 may contain the same material or different materials, but it is preferred that they contain the same material. As a result, it is difficult for stress differences to be generated on both sides of the barrier layer 143, thereby suppressing the formation of cracks in the barrier layer 143.

[0126] exist Figure 16 In this design, a resin layer 144 is provided between the sealant layer 142 and the barrier layer 143, but multiple resin layers 144 may also be provided. Furthermore, when multiple resin layers 144 are provided, these multiple resin layers 144 may contain the same material or different materials. For example, although not shown, when a resin substrate layer, barrier layer, first resin layer, second resin layer, and sealant layer are sequentially stacked, the first resin layer may contain polyethylene terephthalate (PET), and the second resin layer may contain polyethylene (PE).

[0127] The adhesive layer 145 can be formed using an adhesive. Examples of adhesives include two-component polyurethane resin adhesives. More specifically, examples include two-component polyurethane resin adhesives composed of a base agent (Ru77t, manufactured by Rock Paint) and a curing agent (H-7, manufactured by Rock Paint). The adhesive layer 145 can be positioned either inside or outside the barrier layer 143, but is more preferably positioned outside the barrier layer 143. When a bag is made using the second packaging material 140, the adhesive layer 45 is positioned outside the bag than the barrier layer 143, thus preventing organic components from the adhesive layer 145 from moving into the interior of the bag. Therefore, when silicone material is contained in the bag, degradation of the silicone material inside the bag can be prevented. Regarding the thickness of the adhesive layer 145, for example, approximately 1 μm to 5 μm is acceptable, but approximately 2 μm to 4 μm is preferred. If the adhesive layer 145 is thinner than 1 μm, sufficient bond strength may not be achieved. On the other hand, if the adhesive layer 145 is thicker than 5 μm, the curing reaction will require a considerable amount of time, which may result in the adhesive layer 145 containing more unreacted substances or residual solvents.

[0128] Furthermore, "more inside than the barrier layer" means that when the second bag 120 is made using the second packaging material 140, it is located inside the second bag 120 compared to the barrier layer 143 of the second packaging material 140. On the other hand, "more outside than the barrier layer" means that when the second bag 120 is made using the second packaging material 140, it is located outside the second bag 120 compared to the barrier layer 143 of the second packaging material 140.

[0129] The resin substrate layer 131 of the first packaging material 130 is composed of polyester resin materials such as polyethylene terephthalate (PET) and polybutylene terephthalate (PBT), and can be a single layer of one resin material or a laminate of two or more resin materials. The resin substrate layer 131 may contain polyamide resin materials such as nylon (Ny, registered trademark), but preferably does not contain such polyamide resin materials. By omitting polyamide resin materials from the resin substrate layer 131, the possibility of contamination of the silicone material containing the contents, such as when the first bag 110 is opened, can be reduced. Furthermore, a layer such as polyethylene (PE) may be included between the resin substrate layer 131 and the sealant layer 132.

[0130] The resin substrate layer 141 of the second packaging material 140 is, for example, a laminate of one or more resin materials selected from polyester resin materials such as polyethylene (PE), polyethylene terephthalate (PET), and polybutylene terephthalate (PBT), and polyamide resin materials such as nylon (registered trademark, Ny). The resin substrate layer 141 preferably does not contain polyamide resin materials such as nylon (registered trademark). Caprolactam, a residual monomer of the polyamide resin material, may contaminate the silicone material that is the contents, but by having a barrier layer 143 located inside the resin substrate layer 141 in the second bag 120, contamination caused by caprolactam can be suppressed. Regarding this, if the resin substrate layer 141 contains polyamide resin material, the possibility that caprolactam contained in the resin substrate layer 141 may contaminate the silicon material cannot be ruled out when the second bag 120 is opened. However, by making the resin substrate layer 141 not contain polyamide resin material, the possibility of contamination of the silicon material as the contents can be further reduced.

[0131] Furthermore, generally speaking, when a package containing silicon material wrapped in a double-layered bag consisting of an outer bag and an inner bag is damaged during transportation due to impact, the inner bag, lacking a barrier layer, may become contaminated with the silicon material. According to this embodiment, the second bag 120, serving as the inner bag, has a barrier layer 143 located inside the resin substrate layer 141. Therefore, even if the first bag, serving as the outer bag, is damaged, contamination of the silicon material can be suppressed.

[0132] The thickness of the resin substrate layer 131 of the first packaging material 130 and the resin substrate layer 141 of the second packaging material 140 can be, for example, 8 μm to 30 μm, preferably 10 μm to 27 μm. If the thickness is less than 8 μm, it will be difficult to maintain the bag shape of the first bag 110 and the second bag 120, and thus the workability when storing the silicon material in the silicon material transport bag 100 may deteriorate. If the thickness exceeds 30 μm, the first bag 110 and the second bag 120 will be difficult to deform, and the followability of the first bag 110 and the second bag 120 may be reduced when storing the silicon material in the silicon material transport bag 100 and degassing and bundling it.

[0133] The following specific examples can be cited as examples of the layer structure of the second packaging material 140.

[0134] [Specific example of the layer structure of resin substrate layer 141 / adhesive layer / barrier layer 143 / resin layer 144 / resin layer / sealant layer 142]

[0135] ·PET / adhesive layer / AlO X / PET / PE / Sealant Layer

[0136] ·PET / adhesive layer / SiO X / PET / PE / Sealant Layer

[0137] ·Nylon / adhesive layer / AlO X / PET / PE / Sealant Layer

[0138] ·Nylon / adhesive layer / SiO X / PET / PE / Sealant Layer

[0139] ·Nylon / adhesive layer / AlO X / Nylon / PE / Sealant Layer

[0140] ·Nylon / adhesive layer / SiO X / Nylon / PE / Sealant Layer

[0141] [Specific example of the layer structure of resin substrate layer 141 / barrier layer 143 / adhesive layer / resin layer 144 / resin layer / sealant layer 142]

[0142] ·PET / AlO X / Adhesive layer / PET / PE / Sealant layer

[0143] ·PET / SiO X / Adhesive layer / PET / PE / Sealant layer

[0144] ·Nylon / AlO X / Adhesive layer / PET / PE / Sealant layer

[0145] ·Nylon / SiO X / Adhesive layer / PET / PE / Sealant layer

[0146] Furthermore, in specific examples of the above-mentioned layered structures, the "sealant layer" can be exemplified by the aforementioned Sample 1, Sample 2, and Sample 3, etc. In specific examples of the above-mentioned layered structures, "AlO..." X "It is an aluminum oxide vapor-deposited film, "SiO" X "PET" refers to a vapor-deposited film of silicon dioxide. In the specific example of the above layer structure, "PET" is a polyethylene terephthalate layer, "nylon" is a nylon layer, and "PE" is a polyethylene layer.

[0147] The sealant layer 132 of the first packaging material 130 has a first surface 132A and a second surface 132B opposite thereto. In the first packaging material 130, the second surface 132B of the sealant layer 132 is located on the resin substrate layer 131 side. The sealant layer 132 may be a laminated structure having a first surface layer 321 located on the first surface 132A side, a second surface layer 322 located on the second surface 132B side, and an intermediate layer 323 between the first surface layer 321 and the second surface layer 322 (see reference). Figure 18 It can also be a single-layer structure with a first surface 132A and a second surface 132B (see reference). Figure 19 ).

[0148] The sealant layer 132 only needs to contain a resin component that can be heat-fused, such as polyolefin, cyclic polyolefin, carboxylic acid modified polyolefin, carboxylic acid modified cyclic polyolefin, etc.

[0149] Examples of polyolefins include: low-density polyethylene (LDPE), medium-density polyethylene, high-density polyethylene, linear low-density polyethylene (LLDPE), etc.; homopolymer polypropylene, block copolymers of polypropylene (e.g., block copolymers of propylene and ethylene), random copolymers of polypropylene (e.g., random copolymers of propylene and ethylene), etc.; terpolymers of ethylene-butene-propylene, etc.

[0150] Cyclic polyolefins are copolymers of olefins and cyclic monomers. Examples of olefins that are constituent monomers of cyclic polyolefins include ethylene, propylene, 4-methyl-1-pentene, styrene, butadiene, and isoprene. Examples of cyclic monomers that are constituent monomers of cyclic polyolefins include norbornene and other cyclic olefins. Specifically, examples include cyclic dienes such as cyclopentadiene, dicyclopentadiene, cyclohexadiene, and norbornene.

[0151] Carboxylic acid-modified polyolefins refer to polymers that are modified by block polymerization or graft polymerization of polyolefins with carboxylic acids. Examples of carboxylic acids used in the modification include maleic acid, acrylic acid, itaconic acid, crotonic acid, maleic anhydride, and itaconic anhydride.

[0152] Carboxylic acid-modified cyclic polyolefins refer to polymers obtained by copolymerizing a portion of the monomers constituting the cyclic polyolefin with α,β-unsaturated carboxylic acids or their anhydrides, or by block polymerization or graft polymerization of α,β-unsaturated carboxylic acids or their anhydrides with respect to the cyclic polyolefin.

[0153] As described below, the sealing layer 142 of the second packaging material 140 constituting the second bag 120 may simply contain polyethylene such as low-density polyethylene (LDPE) or linear low-density polyethylene (LLDPE). Therefore, the sealing layer 132 of the first packaging material 130 constituting the first bag 110 is also preferably composed of polyethylene such as low-density polyethylene (LDPE) or linear low-density polyethylene (LLDPE). Furthermore, the sealing layer 132 of the first packaging material 130 may be a sealing layer other than that containing polyethylene such as low-density polyethylene (LDPE) or linear low-density polyethylene (LLDPE) as long as it has approximately the same sealing temperature as the polyethylene such as low-density polyethylene (LDPE) or linear low-density polyethylene (LLDPE) constituting the sealing layer 142 of the second packaging material 140, or has sealing characteristics equivalent to those that can achieve the desired sealing strength. If the sealing properties (e.g., sealing temperature conditions) of the sealing layer 132 of the first packaging material 130 and the sealing layer 142 of the second packaging material 140 are different, then the silicon material bundle 160 is made by storing the silicon material in the silicon material transport bag 100 (see reference). Figure 22 When doing so, there may be defects in the process.

[0154] The first surface layer 321 located on the first surface 132A side of the sealant layer 132 may be a layer containing low-density polyethylene (LDPE) without substantially added slip agents. Similarly, the second surface layer 322 located on the second surface 132B side may also be a layer containing low-density polyethylene (LDPE) without substantially added slip agents, as is the first surface layer 321. The intermediate layer 323 sandwiched between the first surface layer 321 and the second surface layer 322 may be a layer containing linear low-density polyethylene (LLDPE) without substantially added slip agents. Furthermore, in this embodiment, "without substantially added slip agents" means that the component that, as a slip agent, actually improves the smoothness of the sealant surface is added in an amount that is sufficient to actually affect the smoothness of the sealant surface. Examples of slip agents include particles of calcium carbonate or talc, surfactants such as silicone resins or quaternary ammonium compounds.

[0155] The sealant layer 142 of the second packaging material 140, like the sealant layer 132 of the first packaging material 130, has a first surface 142A and a second surface 142B opposite thereto. In the second packaging material 140, the second surface 142B of the sealant layer 142 is located on the resin substrate layer 141 side. The sealant layer 142 may be a laminated structure having a first surface layer 421 located on the first surface 142A side, a second surface layer 422 located on the second surface 142B side, and an intermediate layer 423 between the first surface layer 421 and the second surface layer 422 (see reference). Figure 20 It can also be a single-layer structure with a first surface 142A and a second surface 142B (see reference). Figure 21 ).

[0156] The sealant layer 142 may contain polyethylene such as low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE), and preferably low-density polyethylene (LDPE) or linear low-density polyethylene (LLDPE) without added slip agents.

[0157] Since the sealant layer 142 is located at the innermost layer of the second bag 120, if volatile components from the sealant layer 142 (such as gas release components from the sealant layer 142) adhere to the polycrystalline silicon or silicon wafer containing the contents, defects may occur in semiconductor devices manufactured using that silicon wafer. Therefore, the amount of volatile components from the sealant layer 142 should preferably be as small as possible. To reduce the amount of volatile components from the sealant layer 142, it is preferable to reduce the thickness T142 of the sealant layer 142 as much as possible. By making the thickness T142 of the sealant layer 142 relatively thin, the volatile components from the sealant layer 142 are released to the outside of the membrane, thereby reducing the amount of volatile components from the sealant layer 142. On the other hand, if the thickness T142 of the sealant layer 142 is too thin, the resistance to mechanical properties such as tensile strength will be reduced, and the function of the bag as a packaging for the contents may be diminished. In this regard, compared with low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE) has higher elasticity and higher resistance to bending. Therefore, by using linear low-density polyethylene (LLDPE) as the sealant layer 142, the thickness T142 of the sealant layer 142 can be relatively thinned.

[0158] Additionally, when the resin housing 151 (refer to) Figure 22 ) or polycrystalline silicon 153 (refer to) Figure 23After being placed in the second bag 120, the contents are degassed and bundled. Therefore, good conformability is required for the sealant layer 142 contained in the second packaging material 140 constituting the second bag 120. In this regard, since linear low-density polyethylene (LLDPE) has relatively high elasticity, good conformability of the sealant layer 142 can also be achieved by using LLDPE.

[0159] If the sealant layer is composed of a single layer of linear low-density polyethylene (LLDPE), the compressive modulus of the sealant layer composed of a single layer of LLDPE can be adjusted to approximately 150 MPa to 600 MPa. Therefore, it is conceivable that the thickness of the sealant layer can be reduced. Furthermore, even considering good conformability of the sealant layer, it can be said that a sealant layer composed of a single layer of LLDPE is preferred. However, since the polymerization pressure of LLDPE is lower than that of low-density polyethylene (LDPE), the low molecular weight components in LLDPE are more volatile compared to LDPE. Therefore, it is considered that even if the thickness of the sealant layer can be reduced if it is composed of a single layer of LLDPE, the silicone material may still be contaminated by volatile components from the sealant layer. Furthermore, it is believed that linear low-density polyethylene (LLDPE) tends to have reduced smoothness compared to low-density polyethylene (LDPE). Therefore, if the sealant layer is composed of a single layer of LLDPE, the surface smoothness of the sealant layer may be reduced. Regarding the sealant layer 142 used in the second bag 120, it is preferable not to add any slip agents that could potentially become foreign matter. Therefore, it is preferable to improve smoothness by means other than the use of slip agents. In this embodiment, the intermediate layer 423 containing linear low-density polyethylene (LLDPE) can be sandwiched between the first surface layer 421 and the second surface layer 422 containing low-density polyethylene (LDPE). Therefore, in the sealant layer 142 of the second bag 120, its thickness T142 can be relatively thin, resulting in good conformability and smoothness. In addition, it is possible to prevent the volatilization of low molecular weight components from the LLDPE contained in the intermediate layer 423.

[0160] Figure 19 and Figure 21The sealant layers 132 and 142 of the single-layer structure shown may contain low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE). In these sealant layers 132 and 142, the mixing ratio of LDPE to LLDPE is only approximately 50:50 to 70:30. By increasing the amount of LDPE compared to LLDPE, the amount of LDPE present on the first surfaces 132A and 142A of the sealant layers 132 and 142 is increased. Furthermore, this results in a thinner thickness (T132 and T142) of the sealant layers 132 and 142 due to the presence of LLDPE, thus preventing the volatilization of low-molecular-weight components. Furthermore, when viewed in the thickness direction of the sealant layers 132 and 142, low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE) can be substantially uniformly present, or the low-density polyethylene (LDPE) can be biased towards the first surface 132A and 142A side and the second surface 132B and 142B side.

[0161] The thicknesses T132 and T142 of the sealing layers 132 and 142 can be appropriately set according to the thickness of the first bag 110 made of the first packaging material 130 and the thickness of the second bag 120 made of the second packaging material 140, etc. However, for example, it is sufficient to be approximately 35μm to 100μm.

[0162] exist Figure 18 and Figure 20 In the illustrated configuration, the first surface layers 321 and 421 containing low-density polyethylene (LDPE) and the second surface layers 322 and 422 containing low-density polyethylene (LDPE) are arranged with intermediate layers 323 and 423 sandwiched between them. This arrangement causes the internal stress on one side of the sealant layers 132 and 142 to partially offset the internal stress on the other side, thereby suppressing curling of the sealant layers 132 and 142. Furthermore, in Figure 18 and Figure 20In the illustrated configuration, the thicknesses T321, T322, T421, and T422 of the first surface layers 321, 421 and the second surface layers 322, 422 are all thinner than the thicknesses T323 and T423 of the intermediate layers 323, 423. By configuring the thicknesses T321, T322, T421, and T422 of the first surface layers 321, 421 and the second surface layers 322, 422 to the intermediate layers 323, 423 to the intermediate layers 323, 423 to the intermediate layers 132, 142 to the specified conformability, the sealant layers 132, 142 can be given a specified conformity. The ratio of the thicknesses T321, T421 of the first surface layers 321, 421 to the thicknesses T323, T423 of the intermediate layers 323, 423 to the intermediate layers 132, 1422 can be approximately 1:1 to 10, and is preferably approximately 1:2 to 3. By setting the thickness ratio within the aforementioned range, the sealant layers 132 and 142 can be given sufficient conformability due to the low-density linear polyethylene (LLDPE) contained in the intermediate layers 323 and 423, thereby enabling the sealant layers 132 and 142 to have an indentation modulus of elasticity in the range of 300 MPa to 500 MPa. Furthermore, the indentation modulus of elasticity can be measured using a microhardness tester (product name "PICODENTOR HM500", manufactured by Fischer Instruments).

[0163] It is known that the sealing strength of a sealant can be controlled by the sealing temperature, sealing pressure, and sealing time during heat sealing. Generally, there is a tendency for higher sealing temperatures to increase sealing strength, but if the sealing temperature is too high, the sealant will melt excessively, which may lead to a decrease in sealing strength. In this embodiment, under heat sealing conditions of a sealing temperature of 150°C, a sealing pressure of 0.1 MPa, and a sealing time of 1 second, the sealing strength when the first surfaces 132A and 142A of the sealant layers 132 and 142 are sealed to each other only needs to be 30 N / 15 mm or more, preferably 50 N / 15 mm or more and less than 60 N / 15 mm. If the sealing strength is less than 30 N / 15 mm, during the transportation of the silicon material bundle 160 formed in the silicon material transport bag 100, the heat-sealed parts of the silicon material transport bag 100 (e.g., the upper surface heat-sealed parts HST1, HST2, etc. (see reference)) will be affected. Figure 22 and Figure 23 Peeling may occur, wherein the transport bag 100 for the silicon material has a first and a second bag 110 and 120 consisting of a first and a second packaging material 130 and 140 having sealing layers 132 and 142.

[0164] As described above, from the viewpoint of making the thickness T142 of the sealant layer 142 relatively thin, it is considered preferable to use linear low-density polyethylene (LLDPE) as the constituent material of the sealant layer 142. However, in a sealant layer made of linear low-density polyethylene (LLDPE), the sealing temperature required to obtain the specified sealing strength is relatively high. In this regard, in this embodiment, by making the first surface layer 421 of the sealant layer 142 contain low-density polyethylene (LDPE), the sealing temperature required to obtain the specified sealing strength can be relatively reduced.

[0165] In this embodiment, the haze of the sealant layer 142 only needs to be 25% or less, preferably 20% or less. By keeping the haze of the sealant layer 142 at 20% or less, the visual visibility of the interior of the second bag 120 is good. Furthermore, before packaging the silicon material into the transport packaging, it is possible to check whether any foreign matter adheres to the first surface 41A of the sealant layer 142, thus preventing contamination of the silicon material. The haze of the sealant layer 142 can be measured, for example, using a haze meter (product name: HM-150, manufactured by Murakami Color Research Institute Co., Ltd.) according to JIS-K7136.

[0166] The sealant layers 132 and 142 having the above structure can be manufactured using conventionally known thin-film deposition methods. For example, having Figure 18 and Figure 20 The sealant layers 132 and 142 of the structure shown can be manufactured by laminating second surface layers 322 and 422, intermediate layers 323 and 423, and first surface layers 321 and 421 using coating methods such as molding or blow molding. Figure 19 and Figure 21 The sealant layers 132 and 142 of the structure shown can also be manufactured using the coating method, extrusion blow molding method, etc. described above.

[0167] The barrier layer 143 of the second packaging material 140 in this embodiment can be, for example, a vapor-deposited film formed by vapor-depositing inorganic oxides such as silicon dioxide or aluminum oxide onto a PET layer, for example. By having the barrier layer 143 on the second packaging material 140, gases that could contaminate the surface of the silicon material containing the contents can be prevented from entering the second bag 120 from the outside. The barrier layer 143 can be a metal vapor-deposited film formed by vapor-depositing metals such as aluminum onto a resin substrate layer 141 or a resin layer 144, or a metal foil such as aluminum. When the barrier layer 143 is such a metal vapor-deposited film or metal foil, transparency cannot be ensured in the second bag 120, but in addition to barrier properties, light-blocking properties can also be provided to the second bag 120. In addition, in this way, by having the sealant layer 142 have a specified transparency, it is easier to confirm whether foreign matter is attached to the first side 142A of the sealant layer 142 in the second bag 120.

[0168] As described above, the sealant layers 132 and 142 have the following degree of transparency: when the silicon material is packaged in a silicon material transport bag 100 (refer to...). Figure 10 When the sealing layers 132 and 142 are present, the interior of the transport bag 100 can be visually confirmed. Therefore, the first packaging material 130 and the second packaging material 140, which have the sealing layers 132 and 142, should also preferably have a level of transparency that allows for visual confirmation of the interior of the transport bag 100. From this point of view, the haze of the first packaging material 130 and the second packaging material 140 in this embodiment is only required to be 30% or less, preferably 25% or less. If the haze of the first packaging material 130 and the second packaging material 140 exceeds 30%, it may lead to a decrease in the visual confirmability of the interior of the transport bag 100 containing the silicon material, which has the first bag 110 and the second bag 120 made of the first packaging material 130 and the second packaging material 140 respectively, or it may be difficult to confirm whether foreign matter is attached to the first surfaces 132A and 142A of the sealing layers 132 and 142 in the silicon material transport bag 100. Furthermore, the haze of the first packaging material 130 and the second packaging material 140 can be measured, for example, using a haze meter (product name: HM-150, manufactured by Murakami Color Research Institute Co., Ltd.) in accordance with JIS-K7136.

[0169] The first bag 110 is configured such that the first surface 132A of each sealant layer 132 of the first side film 111, the second side film 112, the first side fold film 113, and the second side fold film 114 is located on the innermost surface, and the other surface 131B of the resin substrate layer 131 is located on the outermost surface. The second bag 120 is configured such that the first surface 142A of each sealant layer 142 of the first side film 121, the second side film 122, the first side fold film 123, and the second side fold film 124 is located on the innermost surface, and the other surface 141B of the resin substrate layer 141 (see reference) Figure 14 and Figure 16 ) or barrier layer 143 (refer to) Figure 15 The side is located on the outermost surface.

[0170] In each of the first bag 110 and the second bag 120, a first heat-sealed portion HS11 and HS21 are formed by overlapping one of the two opposing side edges of the first side films 111 and 121 with one of the two opposing side edges of the folded-in first side fold films 113 and 123 and then welding them together by heat sealing. A second heat-sealed portion HS12 and HS22 are formed by overlapping the other side edge of the first side films 111 and 121 with one of the two opposing side edges of the folded-in second side fold films 114 and 124 and then welding them together by heat sealing. In addition, a third heat-sealing part HS13, HS23 is formed by overlapping one of the two opposing side edges of the second side films 112, 122 with the other side edge of the folded-in first side films 113, 123 and welding them together by heat sealing. A fourth heat-sealing part HS14, HS24 is formed by overlapping the other side edge of the second side films 112, 122 with the other side edge of the folded-in second side films 114, 124 and welding them together by heat sealing. The bottom heat-sealed portions HSB1 and HSB2 are formed by overlapping the side edges of the first side films 111 and 121 and the second side films 112 and 122 and welding them together by heat sealing. The openings 115 and 125 of the first bag 110 and the second bag 120 are formed by not heat sealing the side edges of the first side films 111 and 121 and the second side films 112 and 122 located opposite to the bottom heat-sealed portions HSB1 and HSB2.

[0171] With multiple layers of the second bag 120 folded in, including the first side fold film 123 and the second side fold film 124, the opening 125 can be opened by adsorption holding the first side film 121 or the second side film 122 in place and lifting it upwards. A resin casing 151 containing silicon material 152 is then inserted into the second bag 120 through this opened opening 125 (see reference). Figure 22 ) or polycrystalline silicon 153 (refer to) Figure 23The first side film 121 and the second side film 122 in the opening 125 are overlapped and heat-sealed to form the upper surface heat-sealed portion HST2. Next, with multiple layers of the first bag 110 folded in, the first side film 111 or the second side film 112 is held in place by adsorption and lifted upwards to open the opening 115. The second bag 120, which contains a resin shell 151 or polysilicon 153, is then placed into the opened opening 115 and has the upper surface heat-sealed portion HST2 formed thereon. Then, the side edges of the first side film 111 and the second side film 112 in the opening 115 are overlapped and heat-sealed to form the upper surface heat-sealed portion HST1. In this way, a silicon material bundle 160 can be manufactured.

[0172] In the second bag 120 of this embodiment, low-density polyethylene (LDPE) is contained on the first side 142A of the innermost sealing layer 142, and linear low-density polyethylene (LLDPE) is contained on the second side 142B. By using the LLDPE constituting the sealing layer 142, the thickness T142 of the sealing layer 142 can be relatively thinned, thereby improving conformability. Furthermore, the LDPE contained on the first side 142A of the sealing layer 142 prevents the volatilization of low-molecular-weight components from the LLDPE. While it is impossible to ensure the required transparency when the barrier layer 143 of the second packaging material 140 constituting the second bag 120 is a metal vapor-deposited film or metal foil, by using a metal vapor-deposited film or metal foil, the second bag 120 can be given barrier and light-blocking properties. In addition, by ensuring the specified transparency in the sealant layer 142, it is easy to confirm whether there are foreign objects attached to the first side 142A of the sealant layer 142 in the second bag 120.

[0173] like Figure 24A As shown, the packaging material 200 of this embodiment is used for the transport bag 1000 of silicon material (see reference). Figure 28 and Figure 29 The packaging material 200 is a laminate comprising: a resin substrate layer 201 having a first resin substrate layer 2011 and a second resin substrate layer 2012; a barrier layer 203 located between the first resin substrate layer 2011 and the second resin substrate layer 2012; and a sealant layer 205 located on the opposite side of the second resin substrate layer 2012 from the barrier layer 203, separated by a resin layer 204. In the transport bag 1000 for silicon material made of packaging material 200, the sealant layer 205 is located on the inner side, and the first resin substrate layer 2011 is located on the outer side.

[0174] Both the first resin substrate layer 2011 and the second resin substrate layer 2012 are composed of polyester resin materials such as polyethylene terephthalate (PET) and polybutylene terephthalate (PBT), and can be a single layer of one resin material or a laminate of two or more resin materials.

[0175] Both the first resin substrate layer 2011 and the second resin substrate layer 2012 may contain polyamide resin materials such as nylon (Ny, registered trademark), but preferably, at least the second resin substrate layer 2012 does not contain such polyamide resin material, and particularly preferably, neither the first resin substrate layer 2011 nor the second resin substrate layer 2012 contains such polyamide resin material. Caprolactam, as a residual monomer of the polyamide resin material, may become a factor affecting the packaging body 250 (see reference). Figure 30 and Figure 31 The caprolactam can be a contaminant of the silicon materials (silicon wafers 252 and polycrystalline silicon 253) contained in the transport bag 1000. However, by having a barrier layer 203 located inside the first resin substrate layer 2011 in the transport bag 1000, the possibility of contamination of the silicon materials 252 and 253 due to caprolactam can be reduced. In this regard, even if the second resin substrate layer 2012 does not contain polyamide resin material, if the first resin substrate layer 2011 contains polyamide resin material, the possibility of caprolactam contained in the first resin substrate layer 2011 contaminating the silicon materials 252 and 253 cannot be ruled out when the transport bag 1000 is opened. However, by ensuring that the first resin substrate layer 2011 does not contain polyamide resin material, the possibility of contamination of the silicon materials 252 and 253 contained in the transport bag 1000 can be further reduced.

[0176] The resin materials constituting the first resin substrate layer 2011 and the resin materials constituting the second resin substrate layer 2012 can be the same or different resin materials, but are preferably the same. When the silicon materials 252 and 253 are bundled in a transport bag 1000 made of the packaging material 200 of this embodiment, after the silicon materials 252 and 253 are placed in the transport bag 1000, the transport bag 1000 is degassed to perform vacuum packaging. In the vacuum-packed bundle 250, a predetermined stress is applied to the packaging material 200 constituting the transport bag 1000. If a large difference occurs between the strain of the first resin substrate layer 2011 on one side of the barrier layer 203 and the strain of the second resin substrate layer 2012 on the other side when stress is applied to the packaging material 200, there is a concern that the barrier layer 203 may not be able to keep up with the strain difference and cracks may form on the barrier layer 203. If cracks occur in the barrier layer 203, the barrier function that prevents the permeation of oxygen, water vapor, etc., is reduced, potentially contaminating the silicon materials 252 and 253 that are the contents. In this embodiment, by placing the first resin substrate layer 2011 and the second resin substrate layer 2012 on opposite sides of the barrier layer 203, it is difficult for a large strain difference to occur between the first resin substrate layer 2011 and the second resin substrate layer 2012 even when a specified stress is applied to the packaging material 200, thereby suppressing the formation of cracks in the barrier layer 203. To more effectively suppress the formation of cracks in the barrier layer 203, even if the resin materials constituting the first resin substrate layer 2011 and the resin materials constituting the second resin substrate layer 2012 are different, it is preferable that the difference in the compressive modulus of elasticity of the two resin materials is small, and it is particularly preferable that the two resin materials are the same. Furthermore, when the resin materials of the two layers are different, the difference in the compressive elastic modulus of the two resin materials is preferably within 1000 MPa, and particularly preferably within 800 MPa. When the main component of the resin material contained in the first resin substrate layer 2011 (the resin material contained in the largest quantity by weight) is the same as the main component of the resin material contained in the second resin substrate layer 2012, it can be said that the resin materials constituting the first resin substrate layer 2011 and the second resin substrate layer 2012 are the same.

[0177] Furthermore, as in this embodiment, by providing resin substrate layers 201 (first resin substrate layer 2011 and second resin substrate layer 2012) on both sides of the barrier layer 203, the strength of the packaging material 200 can be relatively improved. By improving the strength of the packaging material 200, the following effects can be achieved: the transport bag 1000 for silicon materials is less likely to break, or the workability of bundling silicon materials 252 and 253 into the transport bag 1000 for silicon materials becomes better.

[0178] The compressive modulus of the first resin substrate layer 2011 and the second resin substrate layer 2012 only needs to be between 1500 MPa and 3500 MPa, preferably between 1800 MPa and 3300 MPa. Although it also depends on the thickness of the packaging material 200, if the compressive modulus is less than 1500 MPa, the strength of the silicon material transport bag 1000 is relatively easy to decrease, thereby increasing the possibility of the transport bag 1000 breaking. If it exceeds 3500 MPa, the rigidity of the silicon material transport bag 1000 is relatively easy to increase, thereby increasing the possibility of reduced workability when bundling the silicon material in the transport bag 1000.

[0179] The thicknesses of the first resin substrate layer 2011 and the second resin substrate layer 2012 need to be, for example, 6 μm to 40 μm, preferably 10 μm to 30 μm. Although it also depends on the compressive modulus of the first resin substrate layer 2011 and the second resin substrate layer 2012, if the thickness is less than 6 μm, the strength of the silicon material transport bag 1000 is relatively easy to decrease, thereby increasing the possibility of the transport bag 1000 breaking. If it exceeds 40 μm, the rigidity of the silicon material transport bag 1000 is relatively easy to increase, thereby increasing the possibility of reduced workability when bundling the silicon material into the transport bag 1000. Thus, from the viewpoint of the strength of the silicon material transport bag 1000 and the workability of bundling the silicon material into the transport bag 1000, it is important to set the compressive modulus and thickness of the first resin substrate layer 2011 and the second resin substrate layer 2012 constituting the packaging material 200 within an appropriate range. For example, when the compressive modulus of elasticity is relatively small, the thickness can be relatively thick, and when the compressive modulus of elasticity is relatively large, the thickness can be relatively thin. This allows for good strength of the silicone material transport bag 1000 and good workability of bundling silicone material into the transport bag 1000. On the other hand, by sandwiching the barrier layer 203 between a first resin substrate layer 2011 and a second resin substrate layer 2012, which have a specified rigidity and, for example, a compressive modulus of elasticity greater than that of the sealant layer 205, damage to the barrier layer 203 can be suppressed. Therefore, from the viewpoints of strength of the silicone material transport bag 1000, workability of bundling silicone material into the transport bag 1000, and protective properties of the barrier layer 203, it is preferable to set the compressive modulus of elasticity and thickness of the first resin substrate layer 2011 and the second resin substrate layer 2012 within an appropriate range.

[0180] A resin layer 204 may also be provided between the first resin substrate layer 2011 and the sealant layer 205. The resin layer 204 may be provided between the first resin substrate layer 2011 and the barrier layer 203. Alternatively, the resin layer 204 may be provided between the barrier layer 203 and the second resin substrate layer 2012. Furthermore, the resin layer 204 may be provided between the second resin substrate layer 2012 and the sealant layer 205. Multiple resin layers 204 may be provided between the first resin substrate layer 2011 and the sealant layer 205. These multiple resin layers 204 may be provided at positions further outward than the barrier layer 203, or at positions further inward than the barrier layer 203. Additionally, at least one resin layer 204 may be provided at both positions further outward and inward than the barrier layer 203. The resin layer 204 may be formed by extrusion lamination of a polyolefin such as polyethylene (PE), or by using an adhesive to bond the second resin substrate layer 2012 and the sealant layer 205 together. Examples of adhesives include two-component polyurethane resin adhesives. For instance, a two-component polyurethane resin adhesive can be used that is a mixture of a base agent (Rock Paint Corporation, Ru77t) and a curing agent (Rock Paint Corporation, H-7).

[0181] When the resin layer 204 is formed by an adhesive, the resin layer 204 formed by the adhesive (hereinafter sometimes referred to as the "adhesive layer") is preferably disposed between the first resin substrate layer 2011 and the barrier layer 203. Figure 24B and Figure 24CAs shown, for example, packaging material 200 can be a laminate in which a first resin substrate layer 2011, a resin layer 204 (adhesive layer), a barrier layer 203, a second resin substrate layer 2012, and a sealant layer 205 are sequentially stacked, or a laminate in which a first resin substrate layer 2011, a first resin layer 2041 (adhesive layer), a barrier layer 203, a second resin substrate layer 2012, a second resin layer 2042, and a sealant layer 205 are sequentially stacked. When a silicone material transport bag 1000 is made using packaging material 200 with such a structure, since the resin layer 204 (adhesive layer) is positioned further outward than the barrier layer 203 of the transport bag 1000, it is possible to suppress the movement of organic components contained in the resin layer 204 (adhesive layer) into the interior of the transport bag 1000. Therefore, when silicon material is contained in the transport bag 1000, the deterioration of the silicon material within the transport bag 1000 can be suppressed. Furthermore, examples of organic components that can move from the resin layer 204 (adhesive layer) include unreacted monomers such as acrylic acid and methacrylic acid. The thickness of the resin layer 204 (adhesive layer) formed by the adhesive is, for example, about 1 μm to 5 μm, preferably about 2 μm to 4 μm. If the thickness of the resin layer 204 (adhesive layer) formed by the adhesive is thinner than 1 μm, sufficient adhesive strength may not be obtained. On the other hand, if the thickness of the resin layer 204 (adhesive layer) formed by the adhesive is thicker than 5 μm, the curing reaction requires a considerable amount of time, which may result in more unreacted substances or residual solvents being contained in the resin layer 204. Furthermore, the thickness of the resin layer 204 formed by extrusion lamination is, for example, only about 10 μm or more. The indentation modulus of the resin layer 204 only needs to be at least one decimal place smaller than the indentation modulus of the first resin substrate layer 2011 and the second resin substrate layer 2012, or at least two decimal places smaller. More specifically, the indentation modulus of the resin layer 204 only needs to be approximately 250 MPa or less, approximately 150 MPa or less, or approximately 100 MPa or less. It is possible that a relatively large strain difference will occur between the two layers sandwiching the barrier layer 203, potentially causing cracks in the barrier layer 203. However, by making the indentation modulus of the resin layer 204 at least one decimal place smaller than the indentation modulus of the first resin substrate layer 2011 and the second resin substrate layer 2012, the influence of the resin layer 204 on cracks generated in the barrier layer 203 due to this strain difference can be relatively reduced.

[0182] The following specific examples can be cited as examples of the layered structure of packaging material 200.

[0183] [Specific example of the layer structure of the first resin substrate layer 2011 / resin layer 204 / barrier layer 203 / second resin substrate layer 2012 / resin layer 204 / sealant layer 205]

[0184] ·PET / adhesive layer / AlO X / PET / PE / Sealant Layer

[0185] ·PET / adhesive layer / SiO X / PET / PE / Sealant Layer

[0186] ·Nylon / adhesive layer / AlO X / PET / PE / Sealant Layer

[0187] ·Nylon / adhesive layer / SiO X / PET / PE / Sealant Layer

[0188] ·Nylon / adhesive layer / AlO X / Nylon / PE / Sealant Layer

[0189] ·Nylon / adhesive layer / SiO X / Nylon / PE / Sealant Layer

[0190] [Specific example of the layer structure of the first resin substrate layer 2011 / barrier layer 203 / resin layer 204 / second resin substrate layer 2012 / resin layer 204 / sealant layer 205]

[0191] ·PET / AlO X / Adhesive layer / PET / PE / Sealant layer

[0192] ·PET / SiO X / Adhesive layer / PET / PE / Sealant layer

[0193] ·Nylon / AlO X / Adhesive layer / PET / PE / Sealant layer

[0194] ·Nylon / SiO X / Adhesive layer / PET / PE / Sealant layer

[0195] ·Nylon / AlO X / Adhesive layer / Nylon / PE / Sealant layer

[0196] ·Nylon / SiO X / Adhesive layer / Nylon / PE / Sealant layer

[0197] Furthermore, in specific examples of the above-mentioned layered structures, the "sealant layer" can be exemplified by the aforementioned Sample 1, Sample 2, and Sample 3, etc. In specific examples of the above-mentioned layered structures, "AlO..." X "It is an aluminum oxide vapor-deposited film, "SiO" X"PET" refers to a vapor-deposited film of silicon dioxide. In the specific example of the above layer structure, "PET" is a polyethylene terephthalate layer, "nylon" is a nylon layer, and "PE" is a polyethylene layer.

[0198] Furthermore, "more inside than the barrier layer" means that when the transport bag 1000 for silicon material is made using packaging material 200, it is located inside the transport bag 1000, which is closer to the barrier layer 203 of packaging material 200. On the other hand, "more outside than the barrier layer" means that when the transport bag 1000 for silicon material is made using packaging material 200, it is located outside the transport bag 1000, which is closer to the barrier layer 203 of packaging material 200.

[0199] The sealant layer 205 has a first surface 205A and a second surface 205B opposite thereto. In the packaging material 200, the second surface 205B of the sealant layer 205 is located on the side of the second resin substrate layer 2012. The sealant layer 205 may be a laminated structure having a first surface layer 2051 located on the side of the first surface 205A, a second surface layer 2052 located on the side of the second surface 205B, and an intermediate layer 2053 between the first surface layer 2051 and the second surface layer 2052 (see reference). Figure 26 It can also be a single-layer structure with surface 205A (first surface) and surface 205B (see reference). Figure 27 ).

[0200] The sealant layer 205 only needs to contain a resin component that can be heat-fused, such as polyolefin, cyclic polyolefin, carboxylic acid modified polyolefin, carboxylic acid modified cyclic polyolefin, etc.

[0201] Examples of polyolefins include: low-density polyethylene (LDPE), medium-density polyethylene, high-density polyethylene, linear low-density polyethylene (LLDPE), etc.; homopolymer polypropylene, block copolymers of polypropylene (e.g., block copolymers of propylene and ethylene), random copolymers of polypropylene (e.g., random copolymers of propylene and ethylene), etc.; terpolymers of ethylene-butene-propylene, etc.

[0202] Cyclic polyolefins are copolymers of olefins and cyclic monomers. Examples of olefins that are constituent monomers of cyclic polyolefins include ethylene, propylene, 4-methyl-1-pentene, styrene, butadiene, and isoprene. Examples of cyclic monomers that are constituent monomers of cyclic polyolefins include norbornene and other cyclic olefins. Specifically, examples include cyclic dienes such as cyclopentadiene, dicyclopentadiene, cyclohexadiene, and norbornene.

[0203] Carboxylic acid-modified polyolefins refer to polymers that are modified by block polymerization or graft polymerization of polyolefins with carboxylic acids. Examples of carboxylic acids used in the modification include maleic acid, acrylic acid, itaconic acid, crotonic acid, maleic anhydride, and itaconic anhydride.

[0204] Carboxylic acid-modified cyclic polyolefins refer to polymers obtained by copolymerizing a portion of the monomers constituting the cyclic polyolefin with α,β-unsaturated carboxylic acids or their anhydrides, or by block polymerization or graft polymerization of α,β-unsaturated carboxylic acids or their anhydrides with respect to the cyclic polyolefin.

[0205] The first surface layer 2051 located on the first surface 205A side of the sealant layer 205 may be a layer containing low-density polyethylene (LDPE) without substantially added slip agents. Similarly, the second surface layer 2052 located on the second surface 205B side may also be a layer containing low-density polyethylene (LDPE) without substantially added slip agents, as with the first surface layer 2051. The intermediate layer 2053 sandwiched between the first surface layer 2051 and the second surface layer 2052 may, for example, be a layer containing linear low-density polyethylene (LLDPE) without substantially added slip agents. Furthermore, in this embodiment, "without substantially added slip agents" means that the component that, as a slip agent, actually improves the smoothness of the sealant surface is added in an amount that is sufficient to actually affect the smoothness of the sealant surface. Examples of slip agents include particles of calcium carbonate or talc, surfactants such as silicone resins or quaternary ammonium compounds.

[0206] The sealing layer 205 is located at the innermost layer of the transport bag 1000. Therefore, if volatile components from the sealing layer 205 (such as gas release components from the sealing layer 205) adhere to the silicon material, such as polycrystalline silicon or silicon wafers, which are the contents, defects may occur in semiconductor devices manufactured using this silicon material. Therefore, the amount of volatile components from the sealing layer 205 should be as small as possible. To reduce the amount of volatile components from the sealing layer 205, it is preferable to reduce the thickness T205 of the sealing layer 205 as much as possible. By making the thickness T205 of the sealing layer 205 relatively thin, the volatile components from the sealing layer 205 are released to the outside of the membrane, thereby reducing the amount of volatile components from the sealing layer 205. On the other hand, if the thickness T205 of the sealing layer 205 is too thin, the resistance to mechanical properties such as tensile strength will be lower, and the function of the bag as a packaging for the contents may be reduced. In this regard, compared with low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE) has higher elasticity and higher resistance to bending. Therefore, by using linear low-density polyethylene (LLDPE) as the sealant layer 205, the thickness T205 of the sealant layer 205 can be relatively thinned.

[0207] Furthermore, after the resin shell 251 is placed in the transport bag 1000, it is degassed from the transport bag 1000 and then bundled. Therefore, good conformability is required for the sealing layer 205 contained in the packaging material 200 constituting the transport bag 1000. In this regard, since linear low-density polyethylene (LLDPE) has relatively high elasticity, good conformability of the sealing layer 205 can also be achieved by using LLDPE.

[0208] If the sealant layer is composed of a single layer of linear low-density polyethylene (LLDPE), the compressive modulus of the sealant layer composed of a single layer of LLDPE can be adjusted to approximately 150 MPa to 600 MPa. Therefore, it is conceivable that the thickness of the sealant layer can be reduced. Furthermore, even considering good conformability of the sealant layer, it can be said that a sealant layer composed of a single layer of LLDPE is preferred. However, since the polymerization pressure of LLDPE is lower than that of low-density polyethylene (LDPE), the low molecular weight components in LLDPE are more volatile compared to LDPE. Therefore, it is considered that even if the thickness of the sealant layer can be reduced if it is composed of a single layer of LLDPE, the silicone material may still be contaminated by volatile components from the sealant layer. Furthermore, it is believed that linear low-density polyethylene (LLDPE) tends to have reduced smoothness compared to low-density polyethylene (LDPE). Therefore, if the sealant layer is composed of a single layer of LLDPE, the surface smoothness of the sealant layer may be reduced. Regarding the sealant layer 205 used in the transport bag 1000, it is preferable to not add any slip agents that could potentially become foreign matter. Therefore, it is preferable to improve smoothness by means other than the use of slip agents. In this embodiment, the intermediate layer 2053 containing linear low-density polyethylene (LLDPE) can be sandwiched between a first surface layer 2051 and a second surface layer 2052 containing low-density polyethylene (LDPE). Therefore, in the sealant layer 205 of the transport bag 1000, its thickness T205 can be relatively thin, resulting in good conformability and smoothness. Furthermore, it is possible to prevent the volatilization of low-molecular-weight components from the LLDPE contained in the intermediate layer 2053.

[0209] Sealant layer 205 of single-layer structure (refer to) Figure 27The sealant layer 205 may contain low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE). In this sealant layer 205, the mixing ratio of LDPE to LLDPE is only approximately 50:50 to 70:30. This way, by increasing the amount of LDPE compared to LLDPE, the amount of LDPE present on the first surface 205A of the sealant layer 205 is increased, and the thickness T205 of the sealant layer 205 is reduced due to the presence of LLDPE, thus preventing the volatilization of low-molecular-weight components. Furthermore, when viewed in the thickness direction of the sealant layer 205, LDPE and LLDPE can be substantially uniformly present, or the LDPE can be biased towards the first surface 205A and the second surface 205B.

[0210] The thickness T205 of the sealing layer 205 can be appropriately set according to the thickness of the transport bag 1000 made of packaging material 200, etc., but, for example, it is only necessary to be about 35μm to 60μm.

[0211] exist Figure 26 In the illustrated configuration, a first surface layer 2051 comprising low-density polyethylene (LDPE) and a second surface layer 2052 comprising low-density polyethylene (LDPE) are arranged with an intermediate layer 2053 sandwiched between them. This arrangement causes the internal stress on one side of the sealant layer 205 to partially offset the internal stress on the other side, thus suppressing curling of the sealant layer 205. Furthermore, in Figure 26 In the illustrated configuration, the thicknesses T2051 and T2052 of the first surface layer 2051 and the second surface layer 2052 are both thinner than the thickness T2053 of the intermediate layer 2053. By making the thicknesses T2051 and T2052 of the first surface layer 2051 and the second surface layer 2052 thinner than the thickness T2053 of the intermediate layer 2053, the sealant layer 205 can be given a specified conformability. The ratio of the thickness T2051 of the first surface layer 2051 to the thickness T2053 of the intermediate layer 2053 only needs to be about 1:1 to 10, preferably about 1:2 to 3. By making this thickness ratio within the above range, the sealant layer 205 can be given sufficient conformability due to the low-density linear polyethylene (LLDPE) contained in the intermediate layer 2053, thereby enabling the sealant layer 205 to have a compressive modulus of elasticity in the range of 300 MPa to 500 MPa. Furthermore, the indentation modulus can be measured using a microhardness tester (product name "PICODENTOR HM500", manufactured by Fischer Instruments).

[0212] It is known that the sealing strength of a sealant can be controlled by the sealing temperature, sealing pressure, and sealing time during heat sealing. Generally, there is a tendency for higher sealing temperatures to increase sealing strength, but if the sealing temperature is too high, the sealant will melt excessively, which may lead to a decrease in sealing strength. In this embodiment, under heat sealing conditions of a sealing temperature of 150°C, a sealing pressure of 0.1 MPa, and a sealing time of 1 second, the sealing strength when the first surfaces 205A of the sealant layers 205 are sealed together only needs to be 30 N / 15 mm or more, preferably 50 N / 15 mm or more and less than 60 N / 15 mm. If the sealing strength is less than 30 N / 15 mm, then during the transportation of the silicone material bundle 50, which is packaged in a transport bag 1000 made of packaging material 200 having the sealant layer 205, the heat-sealed portion of the silicone material transport bag 1000 (e.g., the upper surface heat-sealed portion HST21, etc. (see reference)) will be insufficient. Figure 30 and Figure 31 It is possible to peel off.

[0213] As described above, from the viewpoint of making the thickness T205 of the sealant layer 205 relatively thin, it is considered preferable to use linear low-density polyethylene (LLDPE) as the constituent material of the sealant layer 205. However, in a sealant layer made of linear low-density polyethylene (LLDPE), the sealing temperature required to obtain the specified sealing strength is relatively high. In this regard, in this embodiment, by making the first surface layer 2051 of the sealant layer 205 contain low-density polyethylene (LDPE), the sealing temperature required to obtain the specified sealing strength can be relatively reduced.

[0214] In this embodiment, the haze of the sealant layer 205 only needs to be 25% or less, preferably 20% or less. By ensuring that the haze of the sealant layer 205 is 20% or less, the visual visibility of the interior of the transport bag 1000 is good. Furthermore, before packaging the silicon material into the silicon material transport bag 1000, it is possible to check whether any foreign matter is attached to the first surface 205A of the sealant layer 205, thus preventing contamination of the silicon material. The haze of the sealant layer 205 can be measured, for example, using a haze meter (product name: HM-150, manufactured by Murakami Color Research Institute Co., Ltd.) according to JIS-K7136.

[0215] The sealant layer 205 having the above structure can be manufactured using conventionally known thin-film deposition methods. For example, having Figure 26 The sealant layer 205 of the structure shown can be manufactured by laminating a second surface layer 2052, an intermediate layer 2053, and a first surface layer 2051 using coating methods such as molding or blow molding. Figure 27The sealant layer 205 of the structure shown can also be manufactured using the coating method, extrusion blow molding method, etc., as described above.

[0216] In this embodiment, the barrier layer 203 can be, for example, a vapor-deposited film formed by depositing inorganic oxides such as silicon dioxide or aluminum oxide onto a PET layer, for example. By having the barrier layer 203 in the packaging material 200, gases that could contaminate the surfaces of the silicon materials 252 and 253, which are the contents, can be prevented from entering the interior of the transport bag 1000 from the outside. The barrier layer 203 can be a metal vapor-deposited film formed by depositing metals such as aluminum onto the first resin substrate layer 2011 or the second resin substrate layer 2012, or a metal foil such as aluminum. When the barrier layer 203 is such a metal vapor-deposited film or metal foil, transparency cannot be ensured in the transport bag 1000; however, in addition to barrier properties, light-blocking properties can also be provided to the transport bag 1000. Furthermore, in this manner, by having the sealant layer 205 have a specified transparency, it is easier to confirm whether foreign matter is attached to the first surface 205A of the sealant layer 205 in the transport bag 1000.

[0217] As described above, the sealant layer 205 has the following degree of transparency: when the silicone material is packaged in a silicone material transport bag 1000 (refer to...). Figure 28 and Figure 29 When the sealing layer 205 is present, the interior of the transport bag 1000 can be visually confirmed. Therefore, the packaging material 200 having the sealing layer 205 should also preferably have a level of transparency that allows for visual confirmation of the interior of the transport bag 1000. From this perspective, the haze of the packaging material 200 in this embodiment is only required to be 30% or less, preferably 25% or less. When the haze of the packaging material 200 exceeds 30%, there is a concern that the visual confirmation of the interior of the transport bag 1000 made of the packaging material 200 deteriorates, or it becomes difficult to confirm whether foreign matter is attached to the first surface 205A of the sealing layer 205 in the transport bag 1000. Furthermore, the haze of the packaging material 200 can be measured, for example, using a haze meter (product name: HM-150, manufactured by Murakami Color Research Institute Co., Ltd.) according to JIS-K7136.

[0218] Furthermore, the packaging material 200 of this embodiment may also have multiple barrier layers. For example, such as Figure 25As shown, the packaging material 200 can be a laminate comprising, in sequence, a first resin substrate layer 2011 (resin substrate layer 201), a first barrier layer 2031 (barrier layer 203), a second resin substrate layer 2012 (resin substrate layer 201), a second barrier layer 2032 (barrier layer 203), a third resin substrate layer 2013 (resin substrate layer 201), a resin layer 204, and a sealant layer 205. In this embodiment, the first resin substrate layer 2011 and the second resin substrate layer 2012 can be made of either a polyester-based resin material or a polyamide-based resin material, but it is preferable that the third resin substrate layer 2013 is made of a polyester-based resin material. In addition to the above-described methods, the packaging material 200 may also be a laminate having, for example, a first resin substrate layer 2011 (resin substrate layer 201), a first barrier layer 2031 (barrier layer 203), a second resin substrate layer 2012 (resin substrate layer 201), a resin layer 204, a second barrier layer 2032 (barrier layer 203), a third resin substrate layer 2013 (resin substrate layer 201) and a sealant layer 205 in sequence, or a laminate having, for example, a first resin substrate layer 2011 (resin substrate layer 201), a resin layer 204, a first barrier layer 2031 (barrier layer 203), a second resin substrate layer 2012 (resin substrate layer 201), a second barrier layer 2032 (barrier layer 203), a third resin substrate layer 2013 (resin substrate layer 201) and a sealant layer 205 in sequence. Furthermore, in these packaging materials 200, as described above, multiple resin layers 204 can also be provided.

[0219] The silicon material transport bag 1000 in this embodiment is a packaging bag that is expanded into a generally cuboid shape (generally rectangular), and it is composed of a first side film 211, a second side film 212, a first side fold film 213, and a second side fold film 214. The first side film 211, the second side film 212, the first side fold film 213, and the second side fold film 214 are all made of the packaging material 200 of this embodiment. Alternatively, the transport bag 1000 may not have the first side fold film 213 and the second side fold film 214. In this case, the three side edges can be heat-sealed together by placing the first surfaces 205A of the sealing adhesive layers 205 of the first side film 211 and the second side film 212 opposite each other.

[0220] The transport bag 1000 is configured such that the first surface 205A of each sealing layer 205 of the first side film 211, the second side film 212, the first side fold film 213 and the second side fold film 214 is located on the innermost surface, and the first resin substrate layer 2011 is located on the outermost surface.

[0221] In the aforementioned transport bag 1000, a first heat-sealing part HS211 is formed by overlapping one of the two opposing side edges of the first side film 211 with one of the two opposing side edges of the folded-in first side fold film 213 and then welding them together by heat sealing. A second heat-sealing part HS212 is formed by overlapping the other side edge of the first side film 211 with one of the two opposing side edges of the folded-in second side fold film 214 and then welding them together by heat sealing. Furthermore, a third heat-sealed portion HS213 is formed by overlapping one of the two opposing side edges of the second side film 212 with the other side edge of the folded-in first side fold film 213 and then welding them together by heat sealing. A fourth heat-sealed portion HS214 is also formed by overlapping the other side edge of the second side film 212 with the other side edge of the folded-in second side fold film 214 and then welding them together by heat sealing. A bottom heat-sealed portion HSB21 is formed by overlapping the side edges of the first side film 211 and the second side film 212 and then welding them together by heat sealing. The side edges of the first side film 211 and the second side film 212, located opposite the bottom heat-sealed portion HSB21, are not heat-sealed, thus forming the opening 215 of the transport bag 1000.

[0222] With multiple layers of the transport bag 1000 folded in, including the first side fold film 213 and the second side fold film 214, the opening 215 can be opened by adsorption holding the first side film 211 or the second side film 212 and lifting it upwards. A resin shell 251 containing silicon materials 252 and 253 is then inserted into the transport bag 1000 through this opened opening 215 (see reference). Figure 30 and Figure 31 The first side film 211 and the second side film 212 in the opening 215 are overlapped and heat-sealed to form the upper surface heat-sealed portion HST21. In this way, a silicon material bundle 250 can be produced.

[0223] Typically, when silicon materials are bundled in a bag, the bag is degassed and vacuum-packed after the silicon materials are placed inside. In the vacuum-packed bundle, a predetermined stress is applied to the packaging material constituting the bag. In the case where the packaging material has polyethylene terephthalate (PET) on one side of an alumina vapor-deposited layer (barrier layer) and low-density polyethylene (LDPE) or linear low-density polyethylene (LLDPE) on the other side (see Patent Document 2 above), there is a concern that when stress is applied to the packaging material, a difference arises between the strain of PET on one side of the barrier layer and the strain of polyethylene (LDPE, LLDPE) on the other side. The barrier layer cannot keep up with this strain difference, resulting in cracks in the barrier layer. If cracks occur in the barrier layer, the barrier function of preventing the permeation of oxygen, water vapor, etc., is reduced.

[0224] In addition, when the bundled package containing silicon material is exposed to a relatively high temperature and high humidity environment, cracks may occur in the barrier layer due to the difference in elongation between PET and polyethylene (LDPE, LLDPE) on one side of the barrier layer.

[0225] In the transport bag 1000 of this embodiment, by placing the first resin substrate layer 2011 and the second resin substrate layer 2012 on both sides of the barrier layer 203, it is difficult to generate a large strain difference between the first resin substrate layer 2011 and the second resin substrate layer 2012 even when a predetermined stress is applied to the transport bag 1000 (packaging material 200), thereby suppressing the generation of cracks in the barrier layer 203.

[0226] Furthermore, the first side 205A of the innermost sealing layer 205 in the transport bag 1000 contains low-density polyethylene (LDPE), and the second side 205B contains linear low-density polyethylene (LLDPE). By using the LLDPE constituting the sealing layer 205, the thickness T205 of the sealing layer 205 can be relatively thinned, thereby ensuring good conformability. Furthermore, the low-density polyethylene (LDPE) contained in the first side 205A of the sealing layer 205 prevents the volatilization of low-molecular-weight components from the LLDPE. Moreover, by ensuring the required transparency in the sealing layer 205, it is easy to confirm whether any foreign matter is attached to the first side 205A of the sealing layer 205 in the transport bag 1000.

[0227] The embodiments described above are provided for ease of understanding of this disclosure and are not intended to limit this disclosure. Therefore, the elements disclosed in the above embodiments also include all design changes or equivalents that fall within the technical scope of this disclosure.

[0228] The silicon material bundle 50 in the above embodiment (refer to) Figure 7 as well as Figure 8 Alternatively, the aforementioned silicon material transport packaging 10 can be used as an inner bag, and an outer bag with the same structure can also be provided. In this case, it is sufficient to store the silicon materials 52 and 53 within the silicon material transport packaging 10, which serves as the inner bag, and then further store them within the outer bag. The packaging materials constituting the first side film 11, the second side film 12, the first side fold film 13, and the second side fold film 14 of the outer bag can be packaging materials with… Figure 3 and Figure 4 The packaging material 3 shown in the diagram can also be a laminate formed by sequentially stacking a resin film with antistatic function (e.g., a nylon film with an antistatic layer (product name: Bonil AS, manufactured by Kohjin Film & Chemicals Co., Ltd.)), an air barrier layer 5, a first resin layer 41, and a sealant 1.

[0229] The silicon material transport packaging 10 in the above embodiment (refer to) Figure 6 It is also possible to omit the first side fold film 13 and the second side fold film 14. In this case, the three side edges can be heat-sealed together by placing the first side 2A of the sealant 1 of the first side film 11 and the second side film 12 opposite each other.

[0230] In the above embodiment, the silicon material transport bag 1000 (refer to...) Figure 29 It can also be a double-layered packaging bag having a first bag as an outer bag and a second bag disposed inside the first bag as an inner bag. In this case, it is sufficient as long as at least the second bag is made of the packaging material 200 of the above embodiment, and preferably, the first bag is also made of the above packaging material 200.

Claims

1. A bag for transporting silicon material, wherein, The transport bag for the silicon material includes: Bag 1; and The second bag is arranged inside the first bag. The packaging material constituting the second bag is a laminated material having a resin substrate layer, a barrier layer, and a sealant layer in sequence. The sealant layer is located on the inside of the second bag. The sealant layer has a first surface and a second surface facing the first surface, and includes: a first portion including the first surface; and a second portion located at a position closer to the second surface than the first portion. The first part comprises low-density polyethylene (LDPE), which is offset on the first side. The second part comprises linear low-density polyethylene (LLDPE). The sealant layer is a single sealant layer comprising the first part and the second part. The second side of the sealant layer is located on the resin substrate layer side.

2. The transport bag for silicon material according to claim 1, wherein, The barrier layer comprises silicon dioxide or aluminum oxide.

3. The transport bag for silicon material according to claim 1, wherein, The resin substrate layer is composed of polyester resin or polyamide resin.

4. The transport bag for silicon material according to claim 1, wherein, The packaging material constituting the second bag is a laminated material that also has an adhesive layer located between the resin substrate layer and the barrier layer.

5. The transport bag for silicon material according to claim 1, wherein, The packaging material constituting the second bag is a laminated material having a resin layer containing polyester resin located between the barrier layer and the sealant layer.

6. The transport bag for silicon material according to claim 1, wherein, The packaging material constituting the second bag is a laminated material having, in sequence, the resin substrate layer, the barrier layer, the resin layer, and the sealant layer. The resin substrate layer and the resin layer contain the same resin.

7. The transport bag for silicon material according to claim 1, wherein, The packaging material constituting the second bag is transparent.

8. The transport bag for silicon material according to claim 1, wherein, The packaging material constituting the first bag is a laminated material having a resin substrate layer comprising a polyester resin and a sealant layer in sequence. The sealant layer is located on the inside of the first bag.

9. The transport bag for silicon material according to claim 7, wherein, The packaging material constituting the first bag is composed of laminated materials without a barrier layer.

10. The transport bag for silicon material according to claim 7, wherein, The packaging material constituting the first bag is composed of laminated material that does not contain polyamide resin.

11. The transport bag for silicon material according to claim 7, wherein, The thickness of the resin substrate layer of the packaging material constituting the first bag is 8μm to 30μm.

12. The transport bag for silicon material according to claim 1, wherein, The packaging material constituting the second bag is a laminated material having, in sequence, the resin substrate layer, the barrier layer, the first resin layer, the second resin layer, and the sealant layer.

13. The transport bag for silicon material according to claim 1, wherein, The packaging material constituting the second bag is a laminated material having, in sequence, the resin substrate layer, the adhesive layer, the barrier layer, and the sealant layer.

14. The transport bag for silicon material according to claim 1, wherein, The linear low-density polyethylene (LLDPE) contained in Part 2 is essentially linear low-density polyethylene without added slip agents.

15. The transport bag for silicon material according to claim 1, wherein, The haze of the packaging material constituting the first bag is below 30%. The haze of the packaging material constituting the second bag is less than 30%.

16. A silicon material bundle, wherein, The silicon material bundle includes: The transport bag for silicon material as described in claim 1; and Silicon material contained in the second bag of the transport bag for the silicon material.

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