Device and method for removing edge photoresist

Abstract

A device and method for removing edge photoresist, the device comprises: a carrier; a first guide rail, located on both sides of the carrier and arranged along a first direction; a degumming assembly, comprising a U-shaped mounting frame, a first liquid nozzle, a second liquid nozzle and a gas nozzle; the U-shaped mounting frame is arranged along a second direction perpendicular to the first direction, and its opening is arranged toward the carrier, the U-shaped mounting frame comprises a top plate, a side plate and a bottom plate connected in sequence, the bottom plate is connected to the first guide rail, the first liquid nozzle, the second liquid nozzle and the gas nozzle are arranged on the top plate, the gas nozzle is arranged close to the opening of the U-shaped mounting frame, and the gas nozzle is inclined toward the side plate, the second liquid nozzle is close to the side plate and is inclined toward the side plate, the first liquid nozzle is located between the gas nozzle and the second liquid nozzle and is arranged close to the second liquid nozzle, the first liquid nozzle is perpendicular to the top plate, and the angle between the first liquid nozzle and the second liquid nozzle is 5° to 10°. The present invention can improve the edge photoresist removal accuracy.

Description

Technical Field

[0001] The invention relates to the technical field of integrated circuit manufacturing, and in particular to a device and method for removing edge photoresist. Background Art

[0002] Blank mask (mask substrate, also known as blank mask) is a substrate used to manufacture photomasks (reticle, also known as mask plate). The structure of the mask substrate generally includes a quartz substrate, a mask material layer (such as a chromium film or other light-shielding film) deposited on the quartz substrate, and a photoresist coated on the mask material layer.

[0003] The manufacturing process of the mask substrate includes a sputtering process for forming a mask material layer by sputtering deposition on a quartz substrate and a coating process for coating photoresist on the mask material layer. Generally, the existing coating process adopts a spin coating method, and the quartz substrate that has completed the sputtering deposition process is placed on a rotating chuck in the coating chamber, and the rotating chuck drives the quartz substrate to rotate at a high speed, so that the photoresist dripped on the quartz substrate is spread to form a thin layer, and the film thickness of the required film is achieved by controlling the rotation speed and the rotation time. Since the quartz substrate is a square substrate, it is easy to coat the edge and side of the substrate with excess photoresist during the spin coating process to produce bulges around, resulting in too thick thickness of the edge photoresist. Although the photoresist with too thick edges is generally formed in the non-effective area of ​​the mask substrate, due to the excessive thickness of the film layer, when used in the downstream process exposure, the too thick photoresist will still lead to insufficient exposure energy, and even produce too large a gap with the exposure equipment, resulting in unclear exposure imaging, affecting the yield of the photolithography exposure process. Therefore, it is necessary to use an edge degumming device to completely remove the photoresist with too thick edges to avoid affecting the exposure. Generally, the edge stripping device is provided with a gas nozzle and a liquid nozzle. The liquid nozzle sprays a diluent onto the edge of the photoresist to dissolve the excess photoresist, and the gas nozzle sprays a gas to purge and remove the diluent that has dissolved the photoresist. However, the conventional edge stripping device often has edge defects due to uneven diluent spraying during use, such as incomplete edge photoresist removal resulting in edge protrusion defects or excessive removal resulting in edge concave defects, low edge photoresist removal accuracy, and inability to form a vertical section at the edge of the photoresist, so that the mask substrate still cannot meet the exposure requirements of the downstream process, and it is necessary to repeatedly perform edge stripping operations or even re-coat the photoresist and then perform edge stripping operations, which seriously affects the production efficiency and manufacturing cost of the mask substrate.

[0004] Therefore, the traditional edge stripping device has the technical problems of low edge photoresist removal accuracy and inability to form a vertical section at the edge of the photoresist, which affects the production efficiency and manufacturing cost of the mask substrate. Summary of the invention

[0005] The purpose of the present invention is to provide a device and method for removing edge photoresist to solve the technical problems of low edge photoresist removal accuracy and inability to form vertical sections at the edge of the photoresist, which affects the production efficiency and manufacturing cost of the mask substrate.

[0006] To achieve the above-mentioned purpose, on the one hand, the present invention provides a device for removing edge photoresist, a carrier, a degumming assembly and a first guide rail, the carrier is used to carry a substrate; the first guide rail is arranged on both sides of the carrier, and the first guide rail is arranged along a first direction; the degumming assembly includes a U-shaped mounting frame, a first liquid nozzle, a second liquid nozzle and a gas nozzle, the U-shaped mounting frame is arranged along a second direction perpendicular to the first direction, and the opening of the U-shaped mounting frame is arranged toward the carrier, the U-shaped mounting frame includes a top plate, a side plate and a bottom plate connected in sequence, the bottom plate is connected to the first guide rail, the first liquid nozzle, the second liquid nozzle and the gas nozzle are respectively arranged on the top plate, the gas nozzle is arranged close to the opening of the U-shaped mounting frame, and the gas nozzle is inclined toward the side plate, the second liquid nozzle is close to the side plate and inclined toward the side plate, the first liquid nozzle is located between the gas nozzle and the second liquid nozzle and is arranged close to the second liquid nozzle, the first liquid nozzle is perpendicular to the top plate, and the angle between the first liquid nozzle and the second liquid nozzle is 5° to 10°.

[0007] When the above-mentioned device for removing edge photoresist works, photoresist diluent is sprayed to substrate through first liquid nozzle and second liquid nozzle, and nitrogen is sprayed to substrate through gas nozzle to form nitrogen wind wall. The first liquid nozzle is perpendicular to substrate and aligns with the removal starting position to spray photoresist diluent to substrate, so that photoresist diluent is vertically sprayed to photoresist film surface and dissolves photoresist at injection point (i.e., removal starting position). The photoresist diluent sprayed vertically will not diffuse, and can be concentrated at injection point to ensure that the photoresist diluent spray at injection point is uniform, and the photoresist diluent is concentrated at injection point to dissolve photoresist, ensuring that the photoresist film can be vertically cut off at the removal starting position, thereby forming a vertical section after removing photoresist. Further, the second liquid nozzle is adjacent to the first liquid nozzle on one side of the side plate and is tilted at a small angle to the side plate, so that the photoresist diluent sprayed by the second liquid nozzle can dissolve the edge photoresist in the region outside the removal starting position, and the diluent dissolved in the photoresist can flow to the outside of the substrate to remove waste liquid. Furthermore, the gas nozzle is arranged to be inclined toward the side plate on one side near the opening of the U-shaped mounting frame, and the gas nozzle is located above the photoresist film in the area within the removal starting position. The gas nozzle sprays nitrogen toward the removal starting position to form a nitrogen wind wall on the inner side of the removal starting position, which can ensure that the photoresist diluent sprayed by the first liquid nozzle and the second liquid nozzle will not splash to the area within the removal starting position, ensuring that the photoresist in the area within the removal starting position is not damaged, and the nitrogen wind wall can blow away the diluent that dissolved the photoresist to ensure that the waste liquid is removed cleanly.

[0008] The above-mentioned device for removing edge photoresist adopts the design of the upper double diluent nozzle. By designing the spray angle of the two liquid nozzles, it can ensure that a vertical section is formed at the starting position of the removal while ensuring the removal of the photoresist that is too thick at the edge. After removing the photoresist that is too thick at the edge, a vertical section can be formed at the edge of the photoresist, thereby effectively improving the removal accuracy of the edge photoresist. Furthermore, the above-mentioned device for removing edge photoresist is provided with degumming components on both sides of the carrier, and the edge degumming operation can be performed on both sides of the substrate at the same time, which helps to improve the removal efficiency. Therefore, compared with the prior art, the above-mentioned device for removing edge photoresist has the beneficial effects of high edge photoresist removal accuracy and high removal efficiency, which helps to improve the production efficiency of the mask substrate and reduce the manufacturing cost of the mask substrate.

[0009] In one embodiment, the angle between the gas nozzle and the top plate is 60° to 70°.

[0010] In one of the embodiments, the device for removing edge photoresist further includes: a third liquid nozzle, which is disposed on the bottom plate and inclined toward the side plate, and the angle between the third liquid nozzle and the bottom plate is 30° to 45°.

[0011] In one embodiment,

[0012] The installation distance between the first liquid nozzle and the second liquid nozzle is not greater than 1 mm;

[0013] and / or,

[0014] The liquid ejection flow rate of the first liquid nozzle is greater than the liquid ejection flow rate of the second liquid nozzle.

[0015] In one of the embodiments, the device for removing edge photoresist further includes: a position detection sensor, wherein a transmitter and a receiver of the position detection sensor are respectively arranged on the top plate and the bottom plate.

[0016] In one embodiment, the device for removing edge photoresist further includes: a second guide rail, the second guide rail is arranged along the second direction, and at least two of the carrier and the two first guide rails located on both sides thereof are connected to the second guide rail.

[0017] In one embodiment, the stage is configured to drive the substrate to rotate.

[0018] In one of the embodiments, the device for removing edge photoresist further includes: a controller, which is respectively connected to the carrier, the photoresist removal component and the first guide rail.

[0019] In one of the embodiments, a liquid discharge port is provided on the side plate, and a flow guiding inclined surface is provided at the liquid discharge port on the side plate and the bottom plate respectively.

[0020] On the other hand, the present invention also provides a method for removing edge photoresist based on any one of the above-mentioned devices for removing edge photoresist, characterized in that it comprises the following steps:

[0021] Acquire position information of edge photoresist to be removed and substrate information;

[0022] Detect the insertion depth of the substrate edge into the U-shaped mounting frame;

[0023] Compare the detected insertion depth with the acquired position information to determine whether the substrate has moved to the target position;

[0024] When the substrate moves to the target position, the first liquid nozzle, the second liquid nozzle and the gas nozzle are started to remove the edge photoresist according to the substrate information.

[0025] The above-mentioned method for removing edge photoresist performs edge photoresist removal operation by applying the above-mentioned device for removing edge photoresist, which has the beneficial effects of high edge photoresist removal accuracy and high removal efficiency, helps to improve the production efficiency of the mask substrate and reduce the manufacturing cost of the mask substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic structural diagram of a device for removing edge photoresist according to an embodiment;

[0027] Figure 2 The figure is a schematic diagram of the process of removing edge photoresist according to an embodiment.

[0028] Description of reference numerals:

[0029] 10-carrier, 11-workbench, 20-degumming assembly, 21-U-shaped mounting frame, 22-first liquid nozzle, 23-second liquid nozzle, 24-gas nozzle, 25-third liquid nozzle, 26-drainage port, 31-transmitter, 32-receiver, 40-first guide rail, 50-second guide rail, 60-drainage hose, 70-substrate. DETAILED DESCRIPTION

[0030] In the following description, a large number of specific details are given in order to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features known in the art are not described. It should be understood that the present invention can be implemented in different forms and should not be interpreted as being limited to the embodiments presented here. On the contrary, providing these embodiments will make the disclosure thorough and complete, and fully convey the scope of the present invention to those skilled in the art. The same reference numerals represent the same elements from beginning to end. It should be understood that when a layer is referred to as being formed on other layers, it can be directly formed on other layers, or there can be an intervening film layer. Among them, the orientation or positional relationship indicated by the terms "upper", "lower", "front", "back" and the like is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention, wherein "longitudinal" can be understood as a direction perpendicular to the substrate surface, and "lateral" can be understood as a direction parallel to the substrate surface. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "include" is used to determine the presence of features, steps, operations, elements and / or parts, but does not exclude the presence or addition of one or more other features, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items. The terms "same", "equal" and "consistent" include completely equal and identical meanings, and may also include approximately the same or approximately equal meanings under allowed process errors. The terms "first" "second" and the like in the specification are used to distinguish between similar elements, and are not necessarily used to describe a specific order or time sequence. It is to be understood that, where appropriate, these terms used in this way are interchangeable, for example, so that the embodiments of the present invention described herein can be operated in other orders different from those described or shown herein. Similarly, if the method described herein includes a series of steps, the order in which the steps are presented herein is not necessarily the only order in which the steps can be performed, and some of the steps described may be omitted and / or some other steps not described herein may be added to the method. If components in a certain figure are the same as components in other figures, although these components can be easily identified in all figures, in order to make the description of the figures clearer, this specification will not mark all the same component numbers in each figure.

[0031] The present invention is described more clearly and completely below by way of embodiments in conjunction with the accompanying drawings, but the present invention is not limited to the scope of the following embodiments.

[0032] The present invention provides a device and method for removing edge photoresist, which can effectively improve the removal accuracy and removal efficiency of edge photoresist. The device and method can be used to perform edge photoresist removal operations on various substrates (including but not limited to mask substrates, photomasks, and wafers) in semiconductor manufacturing processes.

[0033] Please refer to 1, a device for removing edge photoresist, a carrier 10, a degumming assembly 20 and a first guide rail 40, the carrier 10 is used to carry a substrate 70; the first guide rail 40 is arranged on both sides of the carrier 10, and the first guide rail 40 is arranged along a first direction; the degumming assembly 20 includes a U-shaped mounting frame 21, a first liquid nozzle 22, a second liquid nozzle 23 and a gas nozzle 24, the U-shaped mounting frame 21 is arranged along a second direction perpendicular to the first direction, and the opening of the U-shaped mounting frame 21 is arranged toward the carrier 10, and the U-shaped mounting frame 21 includes a top plate, a side plate and a bottom plate connected in sequence The bottom plate is connected to the first guide rail 40, the first liquid nozzle 22, the second liquid nozzle 23 and the gas nozzle 24 are respectively arranged on the top plate, the gas nozzle 24 is arranged close to the opening of the U-shaped mounting frame 21, and the gas nozzle 24 is inclined toward the side plate, the second liquid nozzle 23 is close to the side plate and inclined toward the side plate, the first liquid nozzle 22 is located between the gas nozzle 24 and the second liquid nozzle 23 and is arranged close to the second liquid nozzle 23, the first liquid nozzle 22 is perpendicular to the top plate, and the angle between the first liquid nozzle 22 and the second liquid nozzle 23 is 5° to 10°.

[0034] Specifically, the first liquid nozzle 22 and the second liquid nozzle 23 are used to spray the photoresist diluent onto the substrate 70, and the gas nozzle 24 is used to spray nitrogen onto the substrate 70 to form a nitrogen wind wall. In one embodiment, the lengths of the first liquid nozzle 22, the second liquid nozzle 23, and the gas nozzle 24 are all 5 mm. In this embodiment, the first liquid nozzle 22, the second liquid nozzle 23, and the gas nozzle 24 are arranged on the same straight line along the second direction, and the gas nozzle 24, the first liquid nozzle 22, and the second liquid nozzle 23 are arranged in sequence from outside to inside between the opening and the side plate of the U-shaped mounting frame 21. Correspondingly, corresponding to taking the substrate 70 as the reference object, the gas nozzle 24, the first liquid nozzle 22 and the second liquid nozzle 23 are arranged from the inside of the substrate 70 to the edge of the substrate 70 from the inside to the outside, wherein the first liquid nozzle 22 is perpendicular to the substrate 70 and aligned with the edge photoresist removal starting position to spray photoresist diluent toward the substrate 70 to form an injection point on the surface of the photoresist film at the removal starting position, the gas nozzle 24 sprays nitrogen toward the removal starting position to form a nitrogen wind wall on the inner side of the removal starting position, and the second liquid nozzle 23 sprays diluent toward the photoresist film outside the removal starting position to form an injection point in the area outside the removal starting position.

[0035] Generally, the width of the photoresist with too thick edges is generally 1.2mm to 2mm, that is, the photoresist in the 1.2mm to 2mm width area of ​​the edge of the substrate 70 is the photoresist that needs to be removed, and the position from the edge to the inside of the removal width is the removal starting position. The photoresist outside the removal starting position needs to be completely removed, and the photoresist inside the removal starting position is retained. The first liquid nozzle 22 forms an injection point at the starting position, and the second liquid nozzle 23 forms an injection point in the area outside the removal starting position. In order to ensure accurate removal of the photoresist outside, the injection point of the second liquid nozzle 23 must be guaranteed to be within the area within the removal width, and the diluent cannot be sprayed outside the substrate 70. This requires that the distance between the injection point of the second liquid nozzle 23 and the injection point of the first liquid nozzle 22 cannot be greater than the removal width. Therefore, the second liquid nozzle 23 must be set close to the first liquid nozzle 22, and the second liquid nozzle 23 can only be tilted toward the side plate at a small angle relative to the first liquid nozzle 22. In one embodiment, the installation spacing between the first liquid nozzle 22 and the second liquid nozzle 23 is no more than 1 mm, and the installation spacing between the first liquid nozzle 22 and the second liquid nozzle 23 is 0 mm in an ideal state. Further, the inclination angle of the second liquid nozzle 23 is set according to the removal width and the installation spacing between the first liquid nozzle 22 and the second liquid nozzle 23 and the nozzle length to ensure that the injection point of the second liquid nozzle 23 is within the outer removal area. In this embodiment, the angle between the first liquid nozzle 22 and the second liquid nozzle 23 is 5° to 10°, preferably 5°.

[0036] Furthermore, in the present embodiment, the gas nozzle 24 forms an injection point in the area within the removal starting position, and the outer edge of the injection point of the gas nozzle 24 (the edge of the injection point close to the edge of the substrate 70) is close to the inner edge of the injection point of the first liquid nozzle 22 (the edge of the injection point away from the edge of the substrate 70). Preferably, the outer edge of the injection point of the gas nozzle 24 is aligned with the inner edge of the injection point of the first liquid nozzle 22, and further preferably, the two do not overlap. In the present embodiment, the outer edge of the injection point of the gas nozzle 24 is arranged to be aligned with the inner edge of the injection point of the first liquid nozzle 22, which can ensure that the gas nozzle 24 forms a nitrogen wind wall close to the removal starting position inside the removal starting position, and can also ensure that the injection point of the gas nozzle 24 does not overlap with the injection point of the first liquid nozzle 22 to avoid liquid splashing, thereby ensuring that the photoresist film is accurately cut off at the removal starting position, and effectively protecting the photoresist film inside the removal starting position. Specifically, the inclination angle of the gas nozzle 24 is set according to the removal starting position, the installation spacing between the first liquid nozzle 22 and the gas nozzle 24, and the nozzle length to ensure that the outer edge of the injection point of the gas nozzle 24 is aligned with the inner edge of the injection point of the first liquid nozzle 22. In one embodiment, the angle between the gas nozzle 24 and the top plate is 60° to 70°.

[0037] When the above-mentioned device for removing edge photoresist is working, the photoresist diluent is sprayed toward the substrate 70 through the first liquid nozzle 22 and the second liquid nozzle 23, and nitrogen is sprayed toward the substrate 70 through the gas nozzle 24 to form a nitrogen wind wall. The first liquid nozzle 22 is perpendicular to the substrate 70 and aligned with the removal starting position to spray the photoresist diluent toward the substrate 70, so that the photoresist diluent is vertically sprayed onto the surface of the photoresist film and dissolves the photoresist at the spraying point (i.e., the removal starting position). The vertically sprayed photoresist diluent will not diffuse, and can be concentrated at the spraying point to ensure that the photoresist diluent at the spraying point is sprayed evenly. The photoresist diluent is concentrated at the spraying point to dissolve the photoresist, ensuring that the photoresist film can be vertically cut off at the removal starting position, so that a vertical section can be formed after the photoresist is removed. Furthermore, the second liquid nozzle 23 is disposed close to the first liquid nozzle 22 on one side of the side plate and tilted at a small angle toward the side plate, so that the photoresist diluent sprayed by the second liquid nozzle 23 can dissolve the edge photoresist in the area outside the removal starting position, and can flow the diluent that has dissolved the photoresist to the outside of the substrate 70 to remove the waste liquid. Furthermore, the gas nozzle 24 is disposed tilted toward the side plate on one side of the opening of the U-shaped mounting frame 21, and the gas nozzle 24 is located above the photoresist film in the area within the removal starting position. The gas nozzle 24 sprays nitrogen toward the removal starting position to form a nitrogen wind wall inside the removal starting position, which can ensure that the photoresist diluent sprayed by the first liquid nozzle 22 and the second liquid nozzle 23 will not splash to the area within the removal starting position, ensuring that the photoresist in the area within the removal starting position is not damaged, and the nitrogen wind wall can purge and remove the diluent that has dissolved the photoresist, ensuring that the waste liquid is removed cleanly.

[0038] The above-mentioned device for removing edge photoresist adopts the design of the upper double diluent nozzle. By designing the spray angle of the two liquid nozzles, it is possible to ensure that a vertical section is formed at the starting position of the removal while ensuring the removal of the photoresist that is too thick at the edge. After removing the photoresist that is too thick at the edge, a vertical section can be formed at the edge of the photoresist, thereby effectively improving the removal accuracy of the edge photoresist. Furthermore, the above-mentioned device for removing edge photoresist is provided with a degumming assembly 20 on both sides of the carrier 10, and the edge degumming operation can be performed on both sides of the substrate 70 at the same time, which helps to improve the removal efficiency. Therefore, compared with the prior art, the above-mentioned device for removing edge photoresist has the beneficial effects of high edge photoresist removal accuracy and high removal efficiency, which helps to improve the production efficiency of the mask substrate 70 and reduce the manufacturing cost of the mask substrate 70.

[0039] In one embodiment, the first guide rail 40 includes a track and a slider, and the bottom plate is connected to the slider of the first guide rail 40, and the moving slider can drive the degumming assembly 20 to move along the first direction. When the substrate 70 is a square substrate, the degumming assembly 20 is moved along the first direction while spraying diluent and nitrogen to the substrate 70, and the degumming assembly 20 removes the photoresist at the edge of the substrate 70 while moving. After the degumming assembly 20 moves from one end of the substrate 70 to the other end along the first direction, the edge photoresist degumming operation on one side of the substrate 70 can be completed, which helps to improve the degumming efficiency. Further, in one embodiment, the degumming assembly 20 also includes a first driving member, which is connected to the U-shaped mounting frame 21, and the first driving member is used to provide a driving force to the degumming assembly 20 so that the degumming assembly 20 can slide on the track of the first guide rail 40. The first driving member can be, but is not limited to, a cylinder, a hydraulic cylinder or a motor. The provision of the first driving member helps to achieve automatic control and further improve the degumming efficiency.

[0040] In one embodiment, the device for removing the edge photoresist further includes: a third liquid nozzle 25, the third liquid nozzle 25 is arranged on the bottom plate, and the third liquid nozzle 25 is inclined toward the side plate, and the angle between the third liquid nozzle 25 and the bottom plate is 30° to 45°. Specifically, the third liquid nozzle 25 is used to spray the diluent to the edge of the lower surface of the substrate 70 to remove the diluent waste liquid that dissolves the photoresist flowing down the side of the substrate 70, to avoid the waste liquid from contaminating the side of the substrate 70 or the lower surface of the substrate 70, to ensure that there is no residual waste liquid on the side of the substrate 70 and the back of the substrate 70, and to ensure that the waste liquid is removed cleanly. Ensure that the diluent sprayed by the third liquid nozzle 25 forms a spray point at the edge of the lower surface of the substrate 70, and the third nozzle is inclined toward the side plate. Further, the inclination angle of the third liquid nozzle 25 is set according to the nozzle length and the installation spacing between the gas nozzle 24 and the first liquid nozzle 22 to ensure that the diluent sprayed by the third liquid nozzle 25 will not be sprayed outside the substrate 70. In this embodiment, the angle between the third liquid nozzle 25 and the bottom plate is 30° to 45°.

[0041] In one embodiment, the liquid spraying flow rate of the first liquid nozzle 22 is greater than the liquid spraying flow rate of the second liquid nozzle 23. In this embodiment, setting the liquid spraying flow rate of the first liquid nozzle 22 to be greater than the liquid spraying flow rate of the second liquid nozzle 23 can avoid the dilution liquid splashing caused by the excessive liquid spraying flow rate of the second liquid nozzle 23, which helps to better protect the photoresist film inside the removal starting position.

[0042] In one embodiment, the device for removing edge photoresist further comprises: a position detection sensor, wherein a transmitter 31 and a receiver 32 of the position detection sensor are respectively arranged on the top plate and the bottom plate. Figure 1As shown, the transmitter 31 of the position sensor is arranged on the top plate, and the receiver 32 is arranged on the bottom plate. To avoid interference between the position detection sensor and the substrate 70, the transmitter 31 and the receiver 32 of the position detection sensor are bonded to the ends of the top plate and the bottom plate, respectively. The position detection sensor can detect the depth of the edge of the substrate 70 entering the U-shaped mounting frame 21, and then can accurately control the depth of the substrate 70 entering the U-shaped mounting frame 21 according to the removal width, ensuring that the first liquid nozzle 22 is accurately aligned with the removal starting position, and effectively ensuring the removal accuracy. In this embodiment, the transmitter 31 of the position detection sensor is arranged on the top plate, and the receiver 32 is arranged on the bottom plate. In other embodiments, the transmitter 31 can also be arranged on the bottom plate, and the receiver 32 can be arranged on the top plate. This embodiment is not specifically limited.

[0043] In one embodiment, the device for removing edge photoresist further includes: a second guide rail 50 , which is arranged along the second direction, and at least two of the carrier 10 and the two first guide rails 40 located on both sides thereof are connected to the second guide rail 50 .

[0044] Specifically, the second guide rail 50 includes a slider and a track, and the track of the first guide rail 40 and / or the carrier 10 are connected to the slider of the second guide rail 50. The first guide rail 40 or the carrier 10 can move along the second direction on the second track, and the first guide rail 40 moves along the second direction on the second track to drive the degumming component 20 to move along the second direction. By controlling the degumming component 20 or the carrier 10 to move along the second direction, the depth of the substrate 70 inserted into the U-shaped mounting frame 21 can be controlled. When the insertion depth is reached, the degumming component 20 or the carrier 10 can be stopped. The insertion and alignment operation of the substrate 70 and the U-shaped mounting frame 21 is simple and convenient. In order to save energy consumption, the carrier 10 and one of the two first guide rails 40 can be connected to the second guide rail 50. Of course, all three can be connected to the second track, and this embodiment does not make specific limitations. Furthermore, in one embodiment, the device for removing edge photoresist also includes a second driving member, which is connected to the first guide rail 40 or the carrier 10. The second driving member is used to provide driving force to the first guide rail 40 or the carrier 10 so that the first guide rail 40 or the carrier 10 can slide on the track of the second guide rail 50. The second driving member can be but is not limited to a cylinder, a hydraulic cylinder or a motor. The provision of a second driving member helps to achieve automatic control and further improve the degumming efficiency.

[0045] In one embodiment, the carrier 10 is configured to be able to drive the substrate 70 to rotate. Specifically, the carrier 10 includes a workbench 11 and a drive motor (not shown in the figure). The workbench 11 can be, but is not limited to, fixing the substrate 70 by vacuum adsorption. The drive motor can provide a driving force to drive the workbench 11 to rotate to improve the degumming efficiency. The rotation angle of the carrier 10 is set specifically according to the shape of the substrate 70. If the substrate 70 is a square substrate, the rotation angle of the workbench 11 can be set to 90 degrees; if the substrate 70 is a circular substrate, the rotation angle of the workbench 11 is set to 360 degrees. When the substrate 70 is a square substrate, after the degumming component 20 is moved along the first direction to complete the degumming operation on the edges of the two opposite sides of the substrate 70, the workbench 11 is controlled to rotate 90 degrees. After the workbench 11 drives the substrate 70 to rotate 90 degrees, the other two opposite edges are degummed. The degumming operation is simple and convenient and the removal efficiency is high. When the substrate 70 is a circular substrate, the rotation angle of the workbench 11 is 360 degrees. At this time, the degumming component 20 does not need to be moved. The substrate 70 is driven to rotate by the carrier 10 to perform edge degumming operations. Furthermore, in order to ensure that the edge photoresist is completely removed, the workbench 11 can be controlled to rotate continuously for multiple weeks.

[0046] In one embodiment, the device for removing the edge photoresist also includes: a controller (not shown in the figure), which is connected to the carrier 10, the glue removal component 20 and the first guide rail 40 respectively. Specifically, the controller is connected to the first liquid nozzle 22, the second liquid nozzle 23, the gas nozzle 24, the position detection sensor, the first driver, the second driver and the drive motor respectively, and the controller is used to control the second driver to drive the first guide rail 40 or the carrier 10 to move on the second guide rail 50 so that the substrate 70 is inserted into the U-shaped mounting frame 21, and the controller receives the detection signal of the position detection sensor. When the insertion depth reaches the removal width, the controller controls the second driver to stop running. Afterwards, the controller controls the first liquid nozzle 22, the second liquid nozzle 23, and the gas nozzle 24 to start and start removing the edge photoresist. At this time, the controller also controls the glue removal component 20 to slide on the first guide rail 40 and / or controls the carrier 10 to rotate according to the shape of the substrate 70. Further, the controller is also used to control the removal time or the moving speed of the degumming assembly 20 according to the material type of the photoresist. When the substrate 70 is a square substrate, the controller controls the first driving member to drive the degumming assembly 20 to slide on the first guide rail 40, and controls the moving speed of the degumming assembly 20 according to the material type of the photoresist. After the degumming assembly 20 moves into place to complete the degumming operation on two edges, the controller controls the carrier 10 to rotate 90 degrees, and then controls the degumming assembly 20 to move to degumming the other two edges. After the degumming assembly 20 moves into place, the controller controls the first driving member to stop running, and controls the first liquid nozzle 22, the second liquid nozzle 23, and the gas nozzle 24 to close, and completes the degumming. When the substrate 70 is a circular substrate, the controller controls the driving motor of the carrier 10 to drive the workbench 11 to rotate to perform the degumming operation, and controls the removal time according to the material type of the photoresist. After the preset removal time is reached, the controller controls the first liquid nozzle 22, the second liquid nozzle 23, and the gas nozzle 24 to close, and controls the driving motor to stop running, and completes the degumming.

[0047] In one embodiment, a liquid discharge port 26 is provided on the side plate, and a flow guiding slope is provided on the side plate and the bottom plate at the liquid discharge port 26. Specifically, the liquid discharge port 26 is connected to an external liquid discharge hose 60 to discharge the diluent waste liquid in which the photoresist is dissolved into an external waste liquid bucket. In this embodiment, the flow guiding slope is provided on the side plate and the bottom plate respectively, so that the waste liquid can flow into the liquid discharge port 26 quickly and be discharged in time, which can effectively avoid the accumulation of waste liquid and improve the waste discharge efficiency of the device.

[0048] On the other hand, the present invention also provides a method for removing edge photoresist based on any one of the above-mentioned devices for removing edge photoresist, characterized in that it comprises the following steps:

[0049] Step S11: Acquire the position information of the edge photoresist to be removed and the substrate information.

[0050] In one embodiment, the position information of the edge photoresist to be removed is the removal width data of the edge photoresist to be removed, and the substrate information includes substrate shape information and photoresist material information. The controller obtains the removal width data, substrate shape information and photoresist material information entered by the user and then executes step S12.

[0051] Step S12: Detecting the insertion depth of the edge of the substrate into the U-shaped installation frame.

[0052] Specifically, the second driving member drives the first guide rail 40 or the carrier 10 to move on the second guide rail 50, so that the substrate 70 is inserted into the U-shaped mounting frame 21, and the position detection sensor detects the insertion depth of the edge of the substrate 70 into the U-shaped mounting frame 21, and sends the detected insertion depth data to the controller.

[0053] Step S13: Compare the detected insertion depth with the acquired position information to determine whether the substrate has moved to the target position.

[0054] Specifically, the controller calculates the distance between the edge of the substrate and the extension line of the center line of the first liquid nozzle 22 based on the received insertion depth data and the position coordinates of the first liquid nozzle 22, obtains edge spacing data, and compares the calculated edge spacing data with the removal width data. When the edge spacing is equal to the removal width (that is, the distance between the edge of the substrate and the extension line of the center line of the first liquid nozzle 22 is equal to the removal width), it is determined that the substrate 70 has moved to the target position, the controller controls the second driving member to stop running, and executes step S14.

[0055] Step S14: when the substrate moves to the target position, the first liquid nozzle, the second liquid nozzle and the gas nozzle are started to remove the edge photoresist according to the substrate information.

[0056] When the substrate 70 moves to the target position, the controller starts the first liquid nozzle 22, the second liquid nozzle 23 and the gas nozzle 24 to start the stripping operation. At this time, the controller also controls the movement state and stripping time of the stripping component 20 and the substrate 70 according to the substrate shape information and the photoresist material information. Specifically, the controller controls the stripping component 20 to slide on the first guide rail 40 and / or controls the rotation of the carrier 10 according to the shape of the substrate 70, and the controller controls the removal time or the moving speed of the stripping component 20 according to the material type of the photoresist. Specifically, when the substrate 70 is a square substrate, the controller controls the first driving member to drive the degumming assembly 20 to slide on the first guide rail 40, and controls the moving speed of the degumming assembly 20 according to the material type of the photoresist. After the degumming assembly 20 moves into place to complete the degumming operation on two edges, the controller controls the stage 10 to rotate 90 degrees, and then controls the degumming assembly 20 to move to degumming the other two edges. After the degumming assembly 20 moves into place, the controller controls the first driving member to stop running, and controls the first liquid nozzle 22, the second liquid nozzle 23, and the gas nozzle 24 to close, and the degumming is completed. When the substrate 70 is a circular substrate, the controller controls the driving motor of the stage 10 to drive the workbench 11 to rotate to perform the degumming operation, and controls the removal time according to the material type of the photoresist. After the preset removal time is reached, the controller controls the first liquid nozzle 22, the second liquid nozzle 23, and the gas nozzle 24 to close, and controls the driving motor to stop running, and the degumming is completed.

[0057] The above-mentioned method for removing edge photoresist performs edge photoresist removal operation by applying the above-mentioned device for removing edge photoresist, which has the beneficial effects of high edge photoresist removal accuracy and high removal efficiency, helps to improve the production efficiency of the mask substrate 70 and reduce the manufacturing cost of the mask substrate 70.

[0058] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of the technical solution of the present invention.

Claims

1. A device for removing edge photoresist, characterized in that: include: A carrier, a degumming assembly, a first guide rail and a second guide rail, wherein the carrier is used to carry a substrate; the first guide rail and the second guide rail each include a guide rail and a slider, the first guide rail is arranged on both sides of the carrier, and the first guide rail is arranged along a first direction; the second guide rail is arranged along a second direction perpendicular to the first direction, and at least two of the carrier and the two first guide rails located on both sides thereof are connected to the second guide rail; the degumming assembly includes a U-shaped mounting frame, a first liquid nozzle, a second liquid nozzle and a gas nozzle, the U-shaped mounting frame is arranged along the second direction, and the opening of the U-shaped mounting frame is arranged toward the carrier, the U-shaped mounting frame includes a top plate, a side plate and a bottom plate connected in sequence, the bottom plate is connected to the first guide rail, the first liquid nozzle, the second liquid nozzle and The gas nozzles are respectively arranged on the top plate, the first liquid nozzle, the second liquid nozzle and the gas nozzle are arranged on the same straight line along the second direction, the gas nozzle is arranged close to the opening of the U-shaped mounting frame, and the gas nozzle is inclined toward the side plate, the second liquid nozzle is close to the side plate and inclined toward the side plate, the first liquid nozzle is located between the gas nozzle and the second liquid nozzle and is arranged close to the second liquid nozzle, the first liquid nozzle is perpendicular to the top plate, the angle between the first liquid nozzle and the second liquid nozzle is 5°~10°, the installation spacing between the first liquid nozzle and the second liquid nozzle is not greater than 1mm, and the spray flow rate of the first liquid nozzle is greater than the spray flow rate of the second liquid nozzle.

2. The device for removing edge photoresist according to claim 1, characterized in that: The angle between the gas nozzle and the top plate is 60° to 70°.

3. The device for removing edge photoresist according to claim 1, characterized in that: The device for removing edge photoresist also includes: a third liquid nozzle, which is arranged on the bottom plate and inclined toward the side plate, and the angle between the third liquid nozzle and the bottom plate is 30°~45°.

4. The device for removing edge photoresist according to claim 1, characterized in that: The device for removing edge photoresist further comprises: a position detection sensor, wherein a transmitter and a receiver of the position detection sensor are respectively arranged on the top plate and the bottom plate.

5. The device for removing edge photoresist according to claim 1, characterized in that: The stage is configured to drive the substrate to rotate.

6. The device for removing edge photoresist according to claim 1, characterized in that: The device for removing edge photoresist also includes: a controller, which is connected to the carrier, the photoresist removal component and the first guide rail respectively.

7. The device for removing edge photoresist according to claim 1, characterized in that: The side plate is provided with a liquid discharge port, and the side plate and the bottom plate are respectively provided with flow guide slopes at the liquid discharge port.

8. A method for removing edge photoresist based on the device for removing edge photoresist according to any one of claims 1 to 7, characterized in that: The following steps are involved: Acquire position information of edge photoresist to be removed and substrate information; Detect the insertion depth of the substrate edge into the U-shaped mounting frame; Compare the detected insertion depth with the acquired position information to determine whether the substrate has moved to the target position; When the substrate moves to the target position, the first liquid nozzle, the second liquid nozzle and the gas nozzle are started to remove the edge photoresist according to the substrate information.

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