A PCB board welding device for an optical module

Abstract

The application discloses a PCB welding device for an optical module and belongs to the technical field of PCB processing. The device comprises a bearing table, a welding structure is installed on the bearing table, a fixed disc is fixedly connected to the bearing table, a rotating disc is rotatably connected to the fixed disc, a driving structure is installed in the bearing table, and a plurality of positioning structures are installed on the rotating disc. A plurality of expansion capsules are integrally formed on the inner wall of the fixed bearing box, a shunt box is installed outside the fixed bearing box, an air inlet valve is in communication with the outside of the shunt box, and a first shunt valve is in communication with the outside of the shunt box. When the fixed bearing box expands, the expansion capsules are extended to bear the PCB. In the process of continuous air injection, the expansion of the extrusion capsules can position the PCB on the expansion capsules, accelerate the overall limiting process of the PCB, and improve the continuous processing speed of the PCB.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing technology, and more specifically, to a PCB board soldering apparatus for optical modules. Background Technology

[0002] With the rapid development of information technology, optical modules are increasingly widely used in communications, data centers, and other fields. PCB board soldering technology in optical modules is one of the key aspects for achieving stable and efficient operation. Traditional soldering techniques mainly employ hot-press soldering or ultrasonic soldering, but these techniques have certain limitations, such as unstable soldering quality and easy damage to the PCB board and components. Therefore, developing a new optical module PCB board soldering technology has significant practical importance and application value.

[0003] The patent, titled "Intelligent Processing and Welding Device and Method for PCB Boards" (application number CN202310888174.5), points out that existing welding devices suffer from poor processing continuity during PCB board assembly and disassembly, resulting in a halted welding process and impacting economic efficiency. Furthermore, their stability is low, and assembly and disassembly are inconvenient. Additionally, impurities may adhere to the PCB board before processing, requiring pre-cleaning to avoid negatively affecting processing quality. Moreover, the high temperature at the welding points on the finished PCB board poses a risk of hand injury to workers if not handled carefully. This patent, however, utilizes continuous bearing... The mounting mechanism enables continuous soldering of the PCB board and removes impurities from the PCB board through a dust extraction device. It can also cool the soldered PCB board through an air blowing structure. However, in actual use, multiple screws are still used to manually position the PCB board during the installation process. The continuous processing of the PCB board results in the situation where the front PCB board is soldered but the rear PCB board has not been fixed in time, which reduces the continuity of PCB board processing. Moreover, the screw positioning method is a hard positioning method, and continuous pressure will cause the PCB board to bend and deform. Therefore, a PCB board soldering device for optical modules is needed. Summary of the Invention

[0004] The purpose of this invention is to provide a PCB board soldering apparatus for optical modules to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a PCB board welding device for optical modules, comprising a support platform, a welding structure mounted on the support platform, a fixed disk fixedly connected to the support platform, a rotating disk rotatably connected to the fixed disk, a driving structure installed inside the support platform, and multiple positioning structures mounted on the rotating disk; The positioning structure includes multiple through slots located outside the rotating disk and the fixed disk. Multiple fixed support boxes are fixedly connected to the rotating disk. Multiple expansion bladders are integrally formed on the inner wall of each fixed support box. A diversion box is installed outside the fixed support box. An air inlet valve is connected to the outside of the diversion box. A first diversion valve is connected to the outside of the diversion box. The air outlet of the first diversion valve is connected to the fixed support box. An air pump is installed inside the support platform. An air inlet pipe is connected to the air inlet of the air pump. A first air outlet pipe is connected to the air outlet of the air pump. The end of the first air outlet pipe away from the air pump is inserted into the air inlet of the air inlet valve.

[0006] Preferably, the fixed support box has two integrally formed inner expansion boxes inside, and an integrally formed compression bladder on the outside of the inner expansion boxes. The outside of the diversion box is connected to a third diversion valve, and the air outlet of the third diversion valve is connected to a double-pass pipe. The two air outlets of the double-pass pipe are respectively connected to the two inner expansion boxes.

[0007] Preferably, both the inner expansion box and the fixed support box are connected to an electrically controlled valve on the outside. The air outlet of the electrically controlled valve is connected to an air outlet bladder. The outside of the air outlet bladder is connected to a plurality of second air outlet pipes, which penetrate the outer wall of the fixed support box.

[0008] Preferably, the interior of the compression bladder has a cavity filled with electrorheological fluid, and a conductive wire is connected inside the electrorheological fluid. One end of the conductive wire passes through the outer wall of the fixed support box and is electrically connected to an external power source.

[0009] Preferably, the outside of the compression bladder is fixedly connected to a compression layer, and the outer wall of the compression layer is provided with multiple arc-shaped grooves.

[0010] Preferably, the expansion bladder is internally connected to a stretching bladder, one side of which is connected to the inner wall of the fixed support box. The stretching bladder is externally connected to multiple vent pipes, which penetrate the outer wall of the expansion bladder. The diversion box is externally connected to a second diversion valve, the outlet of which is connected to a three-way connecting pipe. The other two inlets of the three-way connecting pipe are respectively connected to two stretching bladders.

[0011] Preferably, the external of the diversion box is connected to a fourth diversion valve, the air inlet of the fourth diversion valve is connected to an air inlet pipe, the end of the air inlet pipe away from the fourth diversion valve is connected to a dust collection box, the external of the fixed support box is integrally formed with a snap-fit ​​groove, the dust collection box is located inside the snap-fit ​​groove, the external of the dust collection box is connected to multiple dust collection pipes, and the end of the dust collection pipe away from the dust collection box penetrates through the outer wall of the fixed support box.

[0012] Preferably, the welding structure includes a fixing frame, which is mounted on a support platform. A cross-shaped linear module is mounted on the fixing frame, and a welding device is mounted on the slide of the cross-shaped linear module.

[0013] Preferably, the drive structure includes a drive motor, which is installed inside the support platform. The output shaft of the drive motor passes through the outer wall of the support platform and is fixedly connected to a gear. The inner ring of the rotating disk is integrally formed with an inner ring toothed plate, and the gear meshes with the inner ring toothed plate.

[0014] Preferably, a support rod is fixedly connected to the outside of the support platform, and a collection box is slidably connected to the outside of the support rod.

[0015] The beneficial effects of this invention are as follows: In this invention, the PCB board is continuously welded by a rotating disk and multiple fixed support boxes. During the welding process, gas can be injected into the first air outlet pipe by an air pump during the placement and positioning of the PCB board. The gas is then continuously delivered to the inside of the fixed support box through the first air outlet pipe. After the fixed support box expands, an expansion bladder extends inside to support the PCB board. During the continuous gas injection process, the PCB board located on the expansion bladder can also be positioned by squeezing the expansion of the bladder, thereby accelerating the overall positioning process of the PCB board and improving the continuous processing speed of the PCB board.

[0016] In this invention, when using an expanded extrusion bladder to position the PCB board, the extrusion bladder contains gas, which reduces the extrusion damage to the PCB board during positioning and avoids damage caused by excessive extrusion. At the same time, when using an air pump to inject gas, the air pump's inlet, in conjunction with the air inlet pipe and the stretched bladder, can create a negative pressure adsorption effect, ensuring the stability of the PCB board during the soldering process. Attached Figure Description

[0017] Figure 1 This is one of the three-dimensional structural schematic diagrams of an embodiment of the present invention; Figure 2 This is a second three-dimensional structural schematic diagram of an embodiment of the present invention; Figure 3 This is a schematic diagram of the drive motor and gear in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the shunt box in an embodiment of the present invention; Figure 5 This is a partial cross-sectional view of the fixed carrier box in an embodiment of the present invention; Figure 6 This is a cross-sectional view of the fixed support box in an embodiment of the present invention; Figure 7 This is an embodiment of the present invention. Figure 5 A magnified structural diagram of area A in the diagram; Figure 8 This is an embodiment of the present invention. Figure 6 A magnified schematic diagram of region B in the diagram; Figure 9 This is a schematic cross-sectional view of the compression bladder in an embodiment of the present invention; Figure 10 This is an embodiment of the present invention. Figure 6 A magnified structural diagram of region C in the diagram; Figure 11 This is a cross-sectional view of the distribution box in an embodiment of the present invention.

[0018] In the diagram: 100, support platform; 101, fixed plate; 102, rotating plate; 103, fixed frame; 104, cross-shaped linear module; 105, welder; 106, fixed support box; 107, air pump; 108, air inlet pipe; 109, first air outlet pipe; 110, diverter box; 111, air inlet valve; 112, first diverter valve; 113, expansion bladder; 114, through groove; 200, second diverter valve; 201, air outlet valve; 202, stretching bladder. 203. Ventilation pipe; 300. Third diversion valve; 301. Inner expansion box; 302. Compression bladder; 303. Compression layer; 304. Arc groove; 305. Electrically controlled valve; 306. Exhaust bladder; 307. Second exhaust pipe; 400. Electrorheological fluid; 401. Conductive wire; 500. Fourth diversion valve; 501. Dust collection box; 502. Dust collection pipe; 600. Drive motor; 601. Gear; 700. Support rod; 701. Collection box. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0021] In the description of this application, the term "for example" is used to mean "used as an example, illustration, or description." Any embodiment described as "for example" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use the invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the invention can be made without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the invention with unnecessary detail. Therefore, the invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0022] In this invention, the PCB board is continuously welded by a rotating disk 102 and multiple fixed support boxes 106. During the welding process, gas can be injected into the first air outlet pipe 109 by the air pump 107 during the placement and positioning of the PCB board. The gas is then continuously delivered to the inside of the fixed support box 106 through the first air outlet pipe 109. After the fixed support box 106 expands, an expansion bladder 113 extends outward to support the PCB board. During the continuous air injection process, the PCB board located on the expansion bladder 113 can also be positioned by squeezing the expansion of the bladder 302, thereby accelerating the overall positioning process of the PCB board and improving the continuous processing speed of the PCB board.

[0023] Example 1 like Figures 1-8 As shown, the PCB board welding device for optical modules in this application includes a support platform 100, a welding structure installed on the support platform 100, a fixed disk 101 fixedly connected to the support platform 100, a rotating disk 102 rotatably connected to the fixed disk 101, a driving structure installed inside the support platform 100, and multiple positioning structures installed on the rotating disk 102. The positioning structure includes multiple through slots 114, which are formed on the outside of the rotating disk 102 and the fixed disk 101. Multiple fixed support boxes 106 are fixedly connected to the rotating disk 102. Multiple expansion bladders 113 are integrally formed on the inner wall of each fixed support box 106. A diversion box 110 is installed on the outside of the fixed support box 106. The inside of the diversion box 110 is divided into an air inlet cavity and an air outlet cavity. An air inlet valve 111 is connected to the outside of the diversion box 110. The air valve 111 is connected to the air inlet cavity. The outside of the diversion box 110 is connected to the first diversion valve 112. The air outlet of the first diversion valve 112 is connected to the fixed support box 106. An air pump 107 is installed inside the support platform 100. The air inlet of the air pump 107 is connected to the air inlet pipe 108. The air outlet of the air pump 107 is connected to the first air outlet pipe 109. The end of the first air outlet pipe 109 away from the air pump 107 is inserted into the air inlet of the air inlet valve 111.

[0024] Specifically, during use, the drive mechanism can rotate the rotating disk 102 on the fixed disk 101. During rotation, the user can connect the first air outlet pipe 109 to the air inlet of the air inlet valve 111 and start the air pump 107 to deliver gas into the first air outlet pipe 109. The gas is then delivered to the air inlet valve 111, and after entering the air inlet valve 111, it is delivered to the inside of the diversion box 110. Finally, by opening the switch of the first diversion valve 112, the gas is delivered to the fixed support box 106. The continuous feeding of air into the fixed carrier box 106 causes the fixed carrier box 106 to expand. During this expansion, the expansion bladder 113, integrally formed with the fixed carrier box 106, expands first. The expansion coefficient of the expansion bladder 113 is lower than that of the fixed carrier box 106. As the expansion bladder 113 continues to expand, it forms a bottom support inside the fixed carrier box 106, supporting the PCB board. During continuous air intake, the inner wall of the fixed carrier box 106 also expands laterally, compressing and limiting the PCB board. After limiting the PCB board, the rotating disk 102 is continuously rotated via the drive structure, moving the fixed carrier box 106 containing the PCB board to the welding structure position for welding.

[0025] like Figures 1-3 As shown, the drive structure includes a drive motor 600, which is installed inside the support platform 100. The output shaft of the drive motor 600 passes through the outer wall of the support platform 100 and is fixedly connected to a gear 601. The inner ring of the rotating disk 102 is integrally formed with an inner ring toothed plate, and the gear 601 meshes with the inner ring toothed plate.

[0026] Specifically, in the drive structure, starting the drive motor 600 can drive the gear 601 to rotate. The rotation of the gear 601 can cooperate with the toothed plate of the inner ring of the rotating disk 102 to drive the rotating disk 102 to rotate on the fixed disk 101, thereby driving multiple fixed carrier boxes 106 to move in position. Multiple T-shaped sliders are installed at the bottom of the rotating disk 102. The upper surface of the fixed disk 101 is provided with a T-shaped groove that matches the slider. The T-shaped slider is slidably connected to the inside of the T-shaped groove.

[0027] like Figures 1-2 As shown, the welding structure includes a fixing frame 103, which is mounted on a support platform 100. A cross-shaped linear module 104 is mounted on the fixing frame 103, and a welder 105 is mounted on the slide of the cross-shaped linear module 104.

[0028] Specifically, when the fixed carrier box 106 with the PCB board moves to the bottom of the welding structure, the cross-shaped linear module 104 drives the welder 105 to move to the designated welding position, and the lifting rod inside the welder 105 works with the welding head to weld the contacts of the PCB.

[0029] like Figure 6 and Figure 8 As shown, the expansion bladder 113 is internally connected to a stretching bladder 202, and the diversion box 110 is externally connected to an air outlet valve 201, which is connected to the air outlet cavity of the diversion box 110. One side of the stretching bladder 202 is connected to the inner wall of the fixed support box 106. The stretching bladder 202 is externally connected to multiple air vents 203, which penetrate the outer wall of the expansion bladder 113. The diversion box 110 is externally connected to a second diversion valve 200, and the air outlet of the second diversion valve 200 is connected to a three-way connecting pipe. The other two air inlets of the three-way connecting pipe are respectively connected to two stretching bladders 202.

[0030] Specifically, during use, when the operator places the PCB board onto the expanded expansion bladder 113, the air inlet pipe 108 can be inserted into the air outlet valve 201. By continuously starting the air pump 107 in conjunction with the air outlet valve 201, the air in the air outlet cavity of the diversion box 110 is extracted, and the second diversion valve 200 is opened. The air inside the stretching bladder 202 is extracted through the three-way connecting pipe connected to the second diversion valve 200. After the air inside the stretching bladder 202 is extracted, external gas is drawn into the stretching bladder 202 through the vent pipe 203. When the air inlet of the vent pipe 203 is blocked by the PCB board, a negative pressure effect is formed inside the stretching bladder 202 and the vent pipe 203, which continuously adsorbs the PCB board located on the expansion bladder 113, limiting and fixing the PCB board and ensuring its stability.

[0031] The technical solutions in the above-described embodiments of this application have at least the following technical effects or advantages: Compared with the prior art, in this embodiment, during the installation of the PCB board, gas can be quickly injected into the fixed carrier box 106 by starting the air pump 107, so that the fixed carrier box 106 forms a support. When the PCB board is placed on the expanded expansion bladder 113 inside the fixed carrier box 106, the air pump 107 can also be used in conjunction with the first air outlet pipe 109 to suck the inside of the expansion bladder 202, so that when the PCB board is placed on the expansion bladder 113, a negative pressure adsorption and limiting effect is formed, which speeds up the installation and limiting of the PCB. In addition, the fixed carrier box 106 is made of soft material, so it will not cause excessive deformation of the PCB board during the installation and limiting process.

[0032] Example 2 Considering that in actual use, due to the limited expansion of the expansion bladder 113, the negative pressure adsorption generated by the stretching bladder 202 and the vent tube 203 can only adsorb negative pressure on a portion of the PCB board, resulting in incomplete adsorption and positioning, the following technical solution is proposed to address the above-mentioned technical problems: like Figures 1-7 As shown, the fixed carrier box 106 has two integrally formed inner expansion boxes 301 inside, and an integrally formed compression bladder 302 outside the inner expansion box 301. The outside of the diversion box 110 is connected to a third diversion valve 300. The air outlet of the third diversion valve 300 is connected to a double-pass pipe. The two air outlets of the double-pass pipe are respectively connected to the two inner expansion boxes 301.

[0033] Specifically, during use, the valve port of the third diversion valve 300 can be opened, thereby delivering the air inside the air intake cavity of the diversion box 110 to the dual-pass pipe through the third diversion valve 300. Gas is then injected into the two compression bladders 302 through the dual-pass pipe, causing the two compression bladders 302 to expand. The two expanded compression bladders 302 are located above the expansion bladder 113. When the PCB board is placed on the expansion bladder 113, the two expanded compression bladders 302 clamp and fix the two sides of the PCB board, further increasing the stability of the PCB board on the expansion bladder 113.

[0034] Furthermore, an extrusion layer 303 is fixedly connected to the outside of the extrusion bladder 302. The outer wall of the extrusion layer 303 has multiple arc-shaped grooves 304. The material of the extrusion layer 303 is rubber block, which has a harderness than the extrusion bladder 302. During the further extrusion process of the PCB board, the extrusion layer 303 with multiple arc-shaped grooves 304 on the outside can further enhance the extrusion stability of the extrusion bladder 302 on the PCB board.

[0035] like Figure 5As shown, both the inner expansion box 301 and the fixed support box 106 are connected to an electric control valve 305. The air outlet of the electric control valve 305 is connected to an air outlet 306. The air outlet 306 is connected to a plurality of second air outlet pipes 307. The second air outlet pipes 307 penetrate the outer wall of the fixed support box 106.

[0036] Specifically, during use, after the PCB board is soldered, the solder joints on the PCB board are at a high temperature. As the rotating disk 102 continues to rotate and moves the fixed carrier box 106 with the PCB board at the rear to the position of the solderer 105, the fixed carrier box 106 with the soldered board at the front will move with the rotation of the rotating disk 102. When the fixed carrier box 106 with the soldered PCB board inside moves, the electric control valve 305 will be activated. After the electric control valve 305 is activated, it will gradually deliver the gas inside the fixed carrier box 106 and the gas inside the inner expansion box 301 to the inside of the air outlet bladder 306. After the gas enters the air outlet bladder 306, it will be sprayed out through the second air outlet pipe 307. The second air outlet pipe 307 is an inclined nozzle, which can spray the air inside the fixed carrier box 106 and the inner expansion box 301 together onto the PCB board through the air outlet bladder 306 and the second air outlet pipe 307 to cool the solder joints on the PCB board, so that the PCB board can be quickly cooled to the initial temperature.

[0037] Furthermore, a support rod 700 is fixedly connected to the outside of the support platform 100, and a collection box 701 is slidably connected to the outside of the support rod 700. When the gas inside the fixed support box 106 and the solenoid valve 305 is discharged, the expanded expansion bladder 113 will gradually return to its original position and lose support for the PCB board. When the PCB board loses support, it will fall through the through slot 114 into the collection box 701 supported by the support rod 700. The collection box 701 collects the PCB board after the soldering is completed.

[0038] like Figures 5-10 As shown, the external of the diversion box 110 is connected to a fourth diversion valve 500, the air inlet of the fourth diversion valve 500 is connected to an air inlet pipe, and the end of the air inlet pipe away from the fourth diversion valve 500 is connected to a dust collection box 501. The external of the fixed support box 106 is integrally formed with a snap-fit ​​groove, the dust collection box 501 is located inside the snap-fit ​​groove, and the external of the dust collection box 501 is connected to multiple dust collection pipes 502. The end of the dust collection pipe 502 away from the dust collection box 501 penetrates the outer wall of the fixed support box 106.

[0039] Specifically, when cleaning dust from the PCB board before soldering, the user can hold the first exhaust pipe 109 and blow away the dust on the surface of the PCB board by starting the air pump 107. When suction-type dust collection is required, the PCB board can be placed in front of multiple dust collection pipes 502, and the air inlet pipe 108 can be inserted into the air outlet valve 201. The valve switch of the fourth diversion valve 500 can be opened, and the air inlet pipe connected to the air inlet of the fourth diversion valve 500, together with the dust collection box 501 and the dust collection pipe 502, transmits the suction generated by the air pump 107. When the suction is generated, the dust on the surface of the PCB board located in front of the dust collection pipe 502 will enter the interior of the dust collection pipe 502. The dust collection pipe 502 is a filter box that can retain the dust. After the suction is completed, the dust collection box 501 can be separated from the fixed carrier box 106.

[0040] The technical solutions in the above-described embodiments of this application have at least the following technical effects or advantages: Compared with Embodiment 1, in this embodiment, the gas entering the diversion box 110 can be diverted to the interior of the inner expansion box 301 through the third diversion valve 300 and the double-pass pipe connected to the third diversion valve 300, causing the compression bladder 302 to expand. The expanded compression bladder 302 further clamps the two sides of the PCB board, ensuring the stability of the PCB board during the soldering process. At the same time, after the soldering is completed, the gas in the fixed support box 106 can be discharged, which not only cools the PCB board but also restores the fixed support box 106 to its original state, causing the PCB board to lose support and actively fall into the collection box 701 for collection.

[0041] Example 3 Considering that the compression bladder 302 provides overall gas support during the clamping process of the PCB board, and that gas support is highly unstable, the positioning of the PCB board may become unstable under significant shaking. To address the above-mentioned technical problems, this application proposes the following technical solution: like Figure 9 As shown, the interior of the compression bladder 302 has a cavity, which is filled with electrorheological fluid 400. A conductive wire 401 is connected inside the electrorheological fluid 400. One end of the conductive wire 401 passes through the outer wall of the fixed carrier box 106 and is electrically connected to an external power source.

[0042] Specifically, during use, when the expanded extrusion bladder 302 brings the extrusion layer 303 and the arc groove 304 into contact with the PCB board, the electrorheological fluid 400 is energized through the externally connected conductive wire 401. When the electrorheological fluid 400 is energized, it will harden. The hardened electrorheological fluid 400 will further improve the stability of the extrusion bladder 302 in clamping and limiting the PCB board, and reduce instability.

[0043] Compared to Embodiment 2, in this embodiment, the electrorheological fluid 400 filled inside the extrusion bladder 302 can improve the overall stability of the extrusion bladder 302 in clamping the PCB board after hardening, forming a substantial hard support and avoiding the instability that would occur if the support were entirely soft and came into contact with a wobbly surface.

[0044] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0045] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A PCB board welding device for optical modules, comprising a support platform (100), a welding structure mounted on the support platform (100), a fixed disk (101) fixedly connected to the support platform (100), a rotating disk (102) rotatably connected to the fixed disk (101), and a driving structure installed inside the support platform (100), characterized in that: The rotating disk (102) is equipped with multiple positioning structures; The positioning structure includes multiple through slots (114) located outside the rotating disk (102) and the fixed disk (101). Multiple fixed support boxes (106) are fixedly connected to the rotating disk (102). Multiple expansion bladders (113) are integrally formed on the inner wall of each fixed support box (106). A diversion box (110) is installed outside the fixed support box (106). The interior of the diversion box (110) is divided into an air inlet cavity and an air outlet cavity. An air inlet valve (111) is connected to the exterior of the diversion box (110). The air valve (111) is connected to the air inlet cavity. The outside of the diversion box (110) is connected to the first diversion valve (112). The air outlet of the first diversion valve (112) is connected to the fixed support box (106). An air pump (107) is installed inside the support platform (100). The air inlet of the air pump (107) is connected to the air inlet pipe (108). The air outlet of the air pump (107) is connected to the first air outlet pipe (109). The end of the first air outlet pipe (109) away from the air pump (107) is inserted into the air inlet of the air inlet valve (111). The fixed support box (106) has two integrally formed inner expansion boxes (301) inside, and an integrally formed compression bladder (302) on the outside of the inner expansion box (301). The diversion box (110) is connected to a third diversion valve (300) on the outside. The air outlet of the third diversion valve (300) is connected to a double-pass pipe, and the two air outlets of the double-pass pipe are respectively connected to the two inner expansion boxes (301). Both the inner expansion box (301) and the fixed support box (106) are connected to an electric control valve (305). The air outlet of the electric control valve (305) is connected to an air outlet bladder (306). The air outlet bladder (306) is connected to a plurality of second air outlet pipes (307) on its outside. The second air outlet pipes (307) penetrate the outer wall of the fixed support box (106). The expansion bladder (113) is internally connected to a stretching bladder (202), and the outside of the diversion box (110) is connected to an air outlet valve (201). The air outlet valve (201) is connected to the air outlet cavity of the diversion box (110). One side of the stretching bladder (202) is connected to the inner wall of the fixed support box (106). The outside of the stretching bladder (202) is connected to multiple air vents (203). The air vents (203) penetrate the outer wall of the expansion bladder (113). The outside of the diversion box (110) is connected to a second diversion valve (200). The air outlet of the second diversion valve (200) is connected to a three-way connecting pipe. The other two air inlets of the three-way connecting pipe are respectively connected to two stretching bladders (202). The external of the diversion box (110) is connected to a fourth diversion valve (500), the air inlet of the fourth diversion valve (500) is connected to an air inlet pipe, and the end of the air inlet pipe away from the fourth diversion valve (500) is connected to a dust collection box (501). The external of the fixed support box (106) is integrally formed with a snap-fit ​​groove, the dust collection box (501) is located inside the snap-fit ​​groove, and the external of the dust collection box (501) is connected to multiple dust collection pipes (502). The end of the dust collection pipe (502) away from the dust collection box (501) penetrates the outer wall of the fixed support box (106).

2. The PCB board soldering device for optical modules according to claim 1, characterized in that: The compression bladder (302) has an internal cavity filled with electrorheological fluid (400). A conductive wire (401) is connected inside the electrorheological fluid (400). One end of the conductive wire (401) passes through the outer wall of the fixed support box (106) and is electrically connected to an external power source.

3. The PCB board soldering device for optical modules according to claim 2, characterized in that: The compression bladder (302) is fixedly connected to the outside of a compression layer (303), and the outer wall of the compression layer (303) is provided with a plurality of arc-shaped grooves (304).

4. The PCB board soldering device for optical modules according to claim 1, characterized in that: The welding structure includes a fixing frame (103) mounted on a support platform (100), a cross-shaped linear module (104) mounted on the fixing frame (103), and a welder (105) mounted on the slide of the cross-shaped linear module (104).

5. The PCB board soldering device for optical modules according to claim 1, characterized in that: The drive structure includes a drive motor (600), which is installed inside the support platform (100). The output shaft of the drive motor (600) passes through the outer wall of the support platform (100) and is fixedly connected to a gear (601). The inner ring of the rotating disk (102) is integrally formed with an inner ring toothed plate, and the gear (601) meshes with the inner ring toothed plate.

6. The PCB board soldering device for optical modules according to claim 1, characterized in that: The support platform (100) is fixedly connected to the outside of a support rod (700), and a collection box (701) is slidably connected to the outside of the support rod (700).

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