一种激光直写逆向移印制备大面积柔性温度传感阵列方法
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AEROSPACE LONG MARCH LAUNCH VEHICLE TECH CO LTD
- Filing Date
- 2023-12-10
- Publication Date
- 2026-07-17
AI Technical Summary
Existing printed electronics technology struggles to achieve high-precision fabrication of flexible sensors, especially on flexible substrates. The accuracy and resolution of the sensors are limited by the thixotropic properties of the electronic paste/ink, and laser direct writing technology lacks versatility in substrate selectivity.
By employing laser direct writing reverse pad printing technology, selective pad printing is achieved by enhancing the interface bonding strength difference between the patterned selected area and the non-selected area through laser enhancement, combined with laser hardening and weakening techniques, to fabricate a large-area flexible temperature sensing array.
This improved the fabrication accuracy and efficiency of sensors, reduced the impact on sensor components, and enabled the fabrication of high-precision sensor arrays on flexible substrates.
Smart Images
Figure CN117961305B_ABST