Molding apparatus and molding method
Patent Information
- Application Number
- CN202410291789.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-14
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2044-03-14
AI Technical Summary
[0004]为了解决相关技术中外力使增强材料与工装贴合造成增强材料撕裂损坏的技术问题,本申请提供一种成型装置及成型方法
[0041]According to one or more embodiments of this application, the molding apparatus and molding method include a first cover plate, a core cylinder, multiple punch blocks, multiple die blocks, and a second cover plate. The first cover plate, the second cover plate, the multiple punch blocks, and the multiple die blocks are assembled to form the molding apparatus. Since the diameter of the core cylinder gradually increases away from the first cover plate, and the thickness of the punch blocks gradually decreases away from the first cover plate, at least one punch block can be disassembled to provide a buffer space for the reinforcing fiber. This allows the reinforcing fiber to be smoothly and conveniently fitted onto the periphery of the multiple punch blocks. Then, the thin end of the disassembled punch block is inserted into the buffer space. The taper of the core cylinder gradually applies pressure to the reinforcing fiber until the disassembled punch block is properly seated, allowing the reinforcing fiber to adhere to the die blocks, thereby preventing tearing and damage to the reinforcing fiber and improving the quality of the molded product.