An airborne flexible wireless sensing and collecting device

Abstract

The present disclosure provides an airborne flexible wireless sensing and collecting device, comprising: a flexible circuit board and an ultrathin device arranged on one side surface of the flexible circuit board; wherein the ultrathin device at least comprises: a photovoltaic thin film battery, a multi-path power supply unit, a three-axis accelerometer, a temperature sensor, a pressure sensor, a strain sensor, an analog-to-digital converter, a microprocessor and an antenna unit. The present disclosure integrates the ultrathin device on the flexible circuit board, has the functions of sensing, collecting and wireless signal transceiving, can realize in-situ measurement of the aircraft signal without affecting the aerodynamic shape of the aircraft, and realizes wireless transmission to the host computer through the antenna unit, has the advantages of near in-situ, conformal, no interference with equipment operation, multi-point and multi-source information acquisition in application, and effectively reduces the problems of arranging redundant cables on the structure surface and large modification workload.

Description

Technical Field

[0001] This disclosure relates to the field of civil aircraft flight test technology, and in particular to an airborne flexible wireless sensing and data acquisition device. Background Technology

[0002] Based on experience from flight testing of large civil aircraft, there are often some special testing requirements, characterized by a wide distribution of test points, numerous test locations, and unique test locations. These requirements necessitate the measurement of parameters on the aircraft's outer surface, such as wing temperature / vibration / aerodynamic pressure measurement, and aircraft vertical tail vibration / strain measurement.

[0003] Current airborne network data acquisition systems for sensor measurement rely on installing sensors at the test points on the aircraft to collect signals. Acquisition equipment is installed in the cabin to collect these signals, and data transmission between devices is achieved via Ethernet cables. Switches serve as network nodes for system expansion. However, traditional sensor measurement devices are bulky and heavy, and their installation on the aircraft's external surface can affect the aircraft's aerodynamic shape, making effective conformal integration difficult. This prevents traditional sensor systems from measuring characteristic signals from the aircraft's external surface. Furthermore, existing wired Ethernet-based airborne data acquisition systems suffer from problems such as complex sensor installation, numerous test cables, significant workload in cable laying and cabin penetration, long modification cycles, and limited system scalability. Summary of the Invention

[0004] The purpose of this disclosure is to provide an airborne flexible wireless sensing and acquisition device to solve the problems in the prior art where sensing and measurement devices affect the aerodynamic shape of the aircraft and are difficult to form effective conformal integration, resulting in the inability to measure the characteristic signals of the outer surface of the aircraft. At the same time, existing wired network-based acquisition systems have problems such as many test cables, long modification time and limited expansion scale.

[0005] The embodiments of this disclosure adopt the following technical solution: an airborne flexible wireless sensing and acquisition device, comprising at least: a flexible circuit board and an ultra-thin device disposed on one side surface of the flexible circuit board; wherein, the ultra-thin device comprises at least: a photovoltaic thin-film battery, a multi-channel power supply unit, a triaxial accelerometer, a temperature sensor, a pressure sensor, a strain sensor, an analog-to-digital converter, a microprocessor, and an antenna unit.

[0006] In some embodiments, a filter circuit is connected to the pre-stage of each signal input terminal of the antenna unit and the pre-stage of each signal input terminal of the analog-to-digital converter.

[0007] In some embodiments, the flexible circuit board includes at least a signal layer circuit board, a first insulating layer, a power layer circuit board, a second insulating layer, a ground layer circuit board, a third insulating layer, and a bottom circuit board arranged sequentially; wherein, the ultra-thin device is disposed on the surface of the signal layer circuit board away from the first insulating layer, and the devices communicate with each other through signal lines disposed on the signal layer circuit board, the power supply pin of the ultra-thin device is connected to the power layer circuit board through a first through-hole penetrating the first insulating layer, and the ground pin of the ultra-thin device is connected to the ground layer circuit board through a second through-hole penetrating the first insulating layer, the power layer circuit board, and the second insulating layer.

[0008] In some embodiments, the power layer circuit board includes at least a plurality of power supply regions with different rated supply voltages, each power supply region is non-overlapping, and the surface of the power supply region near the first insulating layer is provided with copper foil as the power supply surface of the power supply region, so that the power supply pins of multiple devices requiring the same rated supply voltage are all connected to the power supply surface corresponding to the rated supply voltage.

[0009] In some embodiments, the multi-power supply unit supplies power to different power supply areas through different power supply pins, and a decoupling capacitor bank is provided at the power interface between each power supply area and the photovoltaic thin-film battery; wherein, the decoupling capacitor bank includes at least a plurality of capacitors arranged in parallel, and the plurality of capacitors have different magnitudes and capacitance values.

[0010] In some embodiments, the ground plane circuit board includes at least an analog ground area and a digital ground area, wherein the analog ground area and the digital ground area do not overlap.

[0011] In some embodiments, the analog ground area and the digital ground area are grounded at a single point via a zero-ohm resistor or a ferrite bead.

[0012] In some embodiments, the antenna unit includes at least: a flexible antenna, an antenna switching circuit, and an onboard antenna; wherein the microprocessor detects the echo signal strength of the flexible antenna and the echo signal strength of the onboard antenna, and sends a switching command to the antenna switching circuit according to the detection results, so that the antenna switching circuit connects the antenna with the higher echo signal strength to the microprocessor.

[0013] In some embodiments, the analog-to-digital converter is specifically used to: convert the analog temperature signal collected by the temperature sensor into a digital temperature signal, convert the analog pressure signal collected by the pressure sensor into a digital pressure signal, and convert the analog strain signal collected by the strain sensor into a digital strain signal; the microprocessor is specifically used to: acquire the digital signals output by the analog-to-digital converter and / or the triaxial accelerometer at preset sampling frequency intervals, input the digital signals into a circular queue, and perform packet buffering and wireless transmission according to different data types and preset protocols.

[0014] In some embodiments, the data format of the data packet formed according to the preset protocol includes at least: packet header, packet length, device serial number, packet serial number, data type, data packet type, data length, data, and checksum. The data packet type includes at least control instructions, time information, data information, and calibration coefficients.

[0015] The beneficial effects of this disclosure are as follows: by integrating ultra-thin devices on a flexible circuit board, it integrates sensing, acquisition, and wireless signal transmission and reception functions, enabling in-situ measurement of aircraft signals without affecting the aerodynamic shape of the aircraft, and wireless transmission to the host computer through the antenna unit. In application, it has the advantages of near-in-situ, conformal, non-interference with equipment operation, and multi-point and multi-source information acquisition, and effectively reduces the problem of redundant cables on the structural surface and large amount of modification work. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in one or more embodiments of this specification or in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a block diagram illustrating the principle of a traditional sensing and measurement system.

[0018] Figure 2 This is a schematic diagram of the device integration of the airborne flexible wireless sensing and acquisition device in an embodiment of this disclosure;

[0019] Figure 3 This is a schematic diagram of the filter circuit design in an embodiment of this disclosure;

[0020] Figure 4 This is a schematic diagram of the layer hierarchy of a four-layer stacked FPC circuit board in an embodiment of this disclosure;

[0021] Figure 5 This is a schematic diagram of the decoupling capacitor bank design in an embodiment of this disclosure;

[0022] Figure 6 This is a schematic diagram illustrating a single-point connection between analog ground and digital ground via an OR resistor in an embodiment of this disclosure. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solutions in one or more embodiments of this specification, the technical solutions in one or more embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this specification, and not all of the embodiments. Based on one or more embodiments of this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this document.

[0024] Based on experience from flight testing of large civil aircraft, there are often some special testing requirements, characterized by a wide distribution of test points, numerous test locations, and unique test locations. These requirements necessitate the measurement of parameters on the aircraft's outer surface, such as wing temperature / vibration / aerodynamic pressure measurement, and aircraft vertical tail vibration / strain measurement.

[0025] Current airborne network data acquisition systems for sensor measurement all involve installing sensors at the points to be measured on the aircraft to collect signals. Data acquisition equipment is installed in the cabin to collect these signals, and data transmission between these devices is achieved via Ethernet cables. Switches serve as network nodes for system expansion. Figure 1 As shown, traditional sensing and measurement equipment is relatively large in weight and size. Installing it on the outer surface of an aircraft would affect the aircraft's aerodynamic shape and make effective conformal integration difficult. Consequently, traditional sensing systems cannot measure characteristic signals from the outer surface of the aircraft. Furthermore, existing airborne data acquisition systems based on wired Ethernet suffer from problems such as complex installation of sensing and measurement equipment, numerous test cables, a large workload for cable laying and penetration, long modification cycles, and limited system expansion capabilities.

[0026] To address the aforementioned problems, this disclosure provides an airborne flexible wireless sensing and data acquisition device, the integration schematic of which is shown below. Figure 2As shown, it includes at least a flexible printed circuit (FPC) and ultra-thin devices integrated on one side of the flexible printed circuit. In this embodiment, based on the actual testing requirements of the aircraft, the ultra-thin devices include at least: a photovoltaic thin-film battery, a multi-channel power supply unit, a triaxial accelerometer, a temperature sensor, a pressure sensor, a strain sensor, an analog-to-digital converter, a microprocessor, and an antenna unit. Among them, photovoltaic thin-film batteries are flexible and lightweight, and can convert solar energy into electrical energy to power other devices integrated on the FPC; the multi-power supply unit converts the power provided by the photovoltaic thin-film batteries into different voltages to power each sensor based on the rated operating requirements of different sensors; the triaxial accelerometer, temperature sensor, pressure sensor, and strain sensor are used to collect triaxial acceleration, temperature, pressure, and strain data at their respective test points; the analog-to-digital converter is used to convert the corresponding types of analog signals output by the temperature sensor, pressure sensor, and strain sensor into digital signals, that is, to convert the temperature analog signal collected by the temperature sensor into a temperature digital signal, the pressure analog signal collected by the pressure sensor into a pressure digital signal, and the strain analog signal collected by the strain sensor into a strain digital signal; the microprocessor (MCU, Microcontroller Unit) is mainly used to process the data collected by each sensor and to conduct wireless communication through the antenna unit.

[0027] This embodiment integrates an ultra-thin photovoltaic thin-film battery, a multi-channel power supply unit, a triaxial accelerometer, a temperature sensor, a pressure sensor, a strain sensor, an analog-to-digital converter, a microprocessor, and an antenna unit onto a flexible circuit board. This allows the wireless sensing and acquisition device to achieve high integration while maintaining a certain degree of flexibility, making it more suitable for placement on the surface of various test points on aircraft with curved designs. This achieves advantages such as near-in-situ, conformal operation, no interference with equipment operation, and multi-point, multi-source information acquisition. Furthermore, the wireless sensing and acquisition device can transmit signals to a host computer wirelessly without affecting the aircraft's aerodynamic shape, effectively reducing the need for redundant cables on structural surfaces and the resulting large amount of modification work.

[0028] In practical implementation, since the actual operating environment is an airborne environment, and the airborne electromagnetic environment is complex, electromagnetic interference sources can cause significant interference to devices such as antenna units and analog-to-digital converters in wireless sensing and acquisition equipment. Considering the electromagnetic compatibility of the aforementioned sensitive sources, this embodiment designs a filtering circuit and places the filtering circuit in the pre-stage of each signal input terminal of the antenna unit and the pre-stage of each signal input terminal of the analog-to-digital converter to achieve filtering of the signals input to the antenna unit and the analog-to-digital converter, thereby suppressing common-mode noise and differential-mode noise in the circuit. Figure 3The schematic diagram of the filter circuit in this embodiment is shown. It mainly includes an operational amplifier 10, capacitors C1 to C7, and resistors R1 to R3. The first input terminal of the filter circuit is connected to one end of resistor R1, and the other end of resistor R1 is connected to connection point X. The second input terminal of the filter circuit is connected to one end of resistor R2, and the other end of resistor R2 is connected to connection point Y. The two ends of capacitor C1 are connected to connection points X and Y respectively. One end of capacitor C2 is connected to connection point X, and the other end is connected to analog ground. One end of capacitor C3 is connected to connection point Y, and the other end is connected to analog ground. The non-inverting input terminal of operational amplifier 10 is connected to connection point X. The inverting input terminal is connected to connection point Y. R3 is the internal resistance of operational amplifier 10. The positive and negative terminals of the power supply are connected to the positive power supply +Vs and the negative power supply -Vs, respectively. Connection point U is led out from the positive power supply. One end of capacitors C4 and C5 is connected to connection point U, and the other end is connected to analog ground. Connection point V is led out from the negative power supply. One end of capacitors C6 and C7 is connected to connection point V, and the other end is connected to analog ground. The reference terminal of operational amplifier 10 is connected to the reference signal REF. Its output terminal Vout is connected as the output of the filter circuit and connected to the signal input terminal of the subsequent analog-to-digital converter unit or the signal input terminal of the antenna unit.

[0029] It should be noted that the capacitance values ​​of the capacitors and the resistance values ​​of the resistors shown in the figure are for illustrative purposes only and can be adjusted according to actual needs during implementation.

[0030] In some embodiments, the flexible circuit board can be designed as a stacked design with a four-layer circuit board structure. By optimizing the circuit layout design within the circuit board and separating high-frequency and low-frequency circuits, the impedance in the circuit loop is effectively reduced, thereby improving the electromagnetic compatibility of the FPC circuit board. Specifically, Figure 4 A schematic diagram of a four-layer stacked FPC circuit board is shown, which includes at least, from top to bottom, a signal layer circuit board L1, a first insulating layer D1, a power layer circuit board L2, a second insulating layer D2, a ground layer circuit board L3, a third insulating layer D3, and a bottom layer circuit board L4. In this embodiment, each ultra-thin component of the wireless sensing and acquisition device is disposed on the surface of the signal layer circuit board L1 away from the first insulating layer D1 (i.e., Figure 4 The upper surface of the signal layer circuit board L1 is used for data transmission between various devices through signal lines designed on the signal layer circuit board L1. The power supply pins of the devices are connected to the power layer circuit board L2 through the first through hole K1 that passes through the first insulating layer D1 to achieve power supply. The ground pins of the devices are connected to the ground layer circuit board L3 through the second through hole K2 that passes through the first insulating layer D1, the power layer circuit board L2, and the second insulating layer D2 to achieve grounding.

[0031] Each signal line and its loop on an FPC circuit board forms a current loop. According to the principle of electromagnetic radiation, when a sudden current flows through a loop in the circuit, it generates an electromagnetic field in space and affects other wires. These loops are like small antennas radiating magnetic fields into space. For transmission lines, the return path with the lowest inductive reactance, which is the high-frequency current return path, is located on the copper plane directly below the signal trace. The radiation intensity of a four-layer board stack-up design can be effectively reduced compared to a two-layer board with the same function. The key is that the signal return current can pass through the adjacent reference layer, thereby reducing the loop area and the inductance of the signal path. A low-inductance signal path can reduce noise interference.

[0032] Further combining the aforementioned multilayered FPC design, the power layer circuit board L2 includes at least multiple power supply areas with different rated supply voltages. These power supply areas do not overlap. A copper foil serves as the power supply surface for each power supply area near the first insulating layer, allowing the power supply pins of multiple devices requiring the same rated supply voltage to be connected to the corresponding power supply surface. It is important to note that in actual connection, the multi-power supply unit sets multiple power supply pins with different voltage outputs according to actual voltage requirements. These multiple power supply pins are then connected to different power supply surfaces on the power layer circuit board L2, enabling different power supply surfaces to provide different voltages. Sensors, analog-to-digital converters, and other devices connect to different power supply surfaces based on their own voltage requirements, achieving the shortest path transmission of voltage signals within the power supply surface and reducing noise interference. Simultaneously, the copper foil's high flexibility and conductivity make it easier to use in FPCs, while also reducing inductance.

[0033] To prevent the power supply from absorbing a large instantaneous current when the output state of the logic gates inside each device changes, thus causing power supply fluctuations, in some embodiments, a decoupling capacitor bank can be provided at the power interface between each power supply area and the photovoltaic thin-film battery. Figure 5 A schematic diagram of a decoupling capacitor bank design is shown, comprising multiple capacitors connected in parallel. These capacitors have different magnitudes and capacitance values. The decoupling capacitor bank charges when the current is stable. When the output state of a device's logic gate changes, a large current is drawn from the decoupling capacitor bank, thereby reducing the current change rate of the power supply and reducing noise generation. Simultaneously, since a practical capacitor can be equivalent to a resistor and inductor in series, connecting multiple capacitors of different magnitudes and capacitance values ​​in parallel can present a lower impedance over a wider range, resulting in better decoupling.

[0034] In some embodiments, since both power supply current and signal current flow back to the power source or signal source through the ground wire, and the ground wire conductor has a certain impedance, a voltage will be generated on the ground wire. When the frequency of the current flowing through the ground wire is high, the impedance of the ground wire may be large, resulting in a voltage difference in the ground wire impedance. This ultimately leads to different potential differences at different locations on the ground wire, which will cause the MCU to make incorrect logic judgments. Therefore, the ground wire is segmented in the acquisition circuit to avoid mutual interference between different circuits. By segmenting the ground wires of different circuits, each type of circuit is placed in a relatively stable potential region. In this embodiment, the ground plane circuit board L3 includes at least two non-overlapping analog ground regions, AGND and DGND, that is, the ground wire is segmented by using digital ground and analog ground.

[0035] Furthermore, since digital signals are generally rectangular waves, they contain a large number of harmonics. If the digital ground and analog ground on the circuit board are not separated from the access point, the harmonics in the digital signal can easily interfere with the waveform of the analog signal. When the analog signal is a high-frequency or high-voltage signal, it will also affect the normal operation of the digital circuit. In some embodiments, the analog ground area AGND and the digital ground area DGND are grounded at a single point through a zero-ohm resistor or a ferrite bead. Figure 6 This diagram illustrates a single-point connection between analog ground and digital ground via an 0R resistor FB. Figure 6 The design shown ensures equal DC potential and attenuates noise at all frequencies. The narrow single-point grounding current path limits the passage of noise current, which is beneficial for improving electromagnetic compatibility.

[0036] In this embodiment, the antenna unit is connected to the microprocessor and is mainly used to transmit data collected by the device to the host computer wirelessly. The wireless communication protocol used can be WiFi, Bluetooth, Zigbee, etc. In actual setup, the antenna unit mainly includes an onboard antenna, a flexible antenna, and an antenna switching circuit. The onboard antenna can be integrated into the MCU, while the flexible antenna can be a separate antenna designed independently of the FPC and connected to the microprocessor. The antenna switching circuit controls the connection between different antennas and the microprocessor. When data transmission is required, the microprocessor detects the echo signal strength of the flexible antenna and the onboard antenna, and sends a switching command to the antenna switching circuit based on the detection results. This causes the antenna switching circuit to connect the antenna with the higher echo signal strength to the microprocessor for data transmission, ensuring optimal transmission performance in different scenarios.

[0037] To address the issues of frame loss or out-of-order data transmission caused by network fluctuations, large data volumes, and diverse data types during the direct wireless transmission of sensor data to the receiving end in traditional acquisition modules, this embodiment employs a multi-type, large-volume data transmission and reception circular queue with callback processing functions and a wireless transmission thread. This queue provides high-fidelity caching for large-volume data transmission from multiple points and sources, ensuring orderly input and sequential packaging of large amounts of multi-source sensor data. This reduces packet loss during multi-type, large-volume data transmission and avoids out-of-order transmission caused by data stacking. This strategy guarantees data synchronization, reduces packet loss, and achieves reliable data transmission. Specifically, the microprocessor internally acquires the digital signals output by the analog-to-digital converter and / or the triaxial accelerometer at preset sampling frequency intervals using a timer. After preprocessing, the signals are input into a circular queue. Based on different data types, the signals are packaged, buffered, and wirelessly transmitted according to preset protocols. In this embodiment, the data in the circular queue is read and written mutually exclusive to ensure the consistency of the data writing and reading order. Furthermore, multiple read channels are preset at the end of the circular queue. When the data volume is too large and a single channel cannot meet the data output, the preset channels are activated. This ensures that the processing abnormalities caused by data fluctuations are smoothed out when the data acquisition and wireless transmission are unstable, thereby greatly reducing the bit error rate of network data packets at the sensor transmitting end.

[0038] It should be noted that the data format of the data packets packaged by the microprocessor according to the preset protocol can be customized according to the requirements. In this embodiment, the data packets include at least a packet header, packet length, device serial number, packet serial number, data type, data packet type, data length, data, and check value. The data packet type includes control instructions, time information, data information, calibration coefficients, etc., and can also be used to indicate the corresponding sensors, heartbeat packets, smoothing number, etc.

[0039] This embodiment integrates ultra-thin devices on a flexible circuit board, combining sensing, data acquisition, and wireless signal transmission and reception functions. It can achieve in-situ measurement of aircraft signals without affecting the aerodynamic shape of the aircraft, and wirelessly transmit the signals to the host computer through the antenna unit. In application, it has the advantages of near-in-situ, conformal, non-interference with equipment operation, and multi-point and multi-source information acquisition, and effectively reduces the problem of redundant cables on the structural surface and large amount of modification work.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An airborne flexible wireless sensing and data acquisition device, characterized in that, At least including: A flexible circuit board and an ultra-thin device disposed on one side surface of the flexible circuit board; wherein the ultra-thin device includes at least: a photovoltaic thin-film battery, a multi-channel power supply unit, a triaxial accelerometer, a temperature sensor, a pressure sensor, a strain sensor, an analog-to-digital converter, a microprocessor, and an antenna unit; The flexible circuit board includes at least a signal layer circuit board, a first insulating layer, a power layer circuit board, a second insulating layer, a ground layer circuit board, a third insulating layer, and a bottom layer circuit board arranged sequentially; wherein... The ultra-thin device is disposed on the side surface of the signal layer circuit board away from the first insulating layer. The devices communicate with each other through signal lines provided on the signal layer circuit board. The power supply pin of the ultra-thin device is connected to the power layer circuit board through a first through hole penetrating the first insulating layer. The ground pin of the ultra-thin device is connected to the ground layer circuit board through a second through hole penetrating the first insulating layer, the power layer circuit board, and the second insulating layer.

2. The wireless sensing and data acquisition device according to claim 1, characterized in that, A filter circuit is connected to the pre-stage of each signal input terminal of the antenna unit and the pre-stage of each signal input terminal of the analog-to-digital converter.

3. The wireless sensing and data acquisition device according to claim 1, characterized in that, The power supply layer circuit board includes at least a plurality of power supply areas with different rated supply voltages. Each power supply area does not overlap. The surface of the power supply area near the first insulating layer is provided with copper foil as the power supply surface of the power supply area, so that the power supply pins of multiple devices requiring the same rated supply voltage are all connected to the power supply surface corresponding to the rated supply voltage.

4. The wireless sensing and data acquisition device according to claim 3, characterized in that, The multi-channel power supply unit supplies power to different power supply areas through different power supply pins. A decoupling capacitor bank is provided at the power interface between each power supply area and the photovoltaic thin-film battery. The decoupling capacitor bank includes at least a number of capacitors connected in parallel, and the multiple capacitors have different magnitudes and capacitance values.

5. The wireless sensing and data acquisition device according to claim 1, characterized in that, The ground plane circuit board includes at least an analog ground area and a digital ground area, and the analog ground area and the digital ground area do not overlap.

6. The wireless sensing and data acquisition device according to claim 5, characterized in that, The analog ground area and the digital ground area are grounded at a single point through a zero-ohm resistor or a ferrite bead.

7. The wireless sensing and data acquisition device according to claim 1, characterized in that, The antenna element includes at least: The system includes a flexible antenna, an antenna switching circuit, and an onboard antenna. The microprocessor detects the echo signal strength of the flexible antenna and the echo signal strength of the onboard antenna, and based on the detection results, sends a switching command to the antenna switching circuit to connect the antenna with the higher echo signal strength to the microprocessor.

8. The wireless sensing and data acquisition device according to claim 1, characterized in that, The analog-to-digital converter is specifically used to: convert the temperature analog signal collected by the temperature sensor into a temperature digital signal, convert the pressure analog signal collected by the pressure sensor into a pressure digital signal, and convert the strain analog signal collected by the strain sensor into a strain digital signal. The microprocessor is specifically used to: acquire digital signals output by the analog-to-digital converter and / or the triaxial accelerometer at preset sampling frequency intervals, input the digital signals into a circular queue, and package, cache, and wirelessly transmit them according to preset protocols based on different data types.

9. The wireless sensing and data acquisition device according to claim 8, characterized in that, The data format of a data packet packaged according to a preset protocol includes at least the following: The packet header, packet length, device serial number, packet serial number, data type, data packet type, data length, data, and checksum, wherein the data packet type includes at least control instructions, time information, data information, and calibration coefficients.

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