A full-automatic film laminating machine and an intelligent control system thereof

Abstract

The application relates to the field of PCB production equipment, and discloses a full-automatic film laminating machine, which comprises a board feeding assembly, a film feeding assembly and a film laminating assembly. The board feeding assembly is used for bearing a PCB and driving the PCB to reciprocate, the film feeding assembly is used for supplying a protective film, and the film laminating assembly is used for laminating the protective film onto the PCB on the board feeding assembly. The film laminating method of the full-automatic film laminating machine comprises the following steps: the board feeding assembly moves in a first direction to convey the PCB to the lower side of the film feeding assembly, the film feeding assembly conveys the protective film to the upper side of the PCB on the board feeding assembly; and the board feeding assembly moves in the opposite direction of the first direction to convey the PCB, and meanwhile, the film laminating assembly laminates the protective film onto the PCB. The full-automatic film laminating machine is provided with the board feeding assembly, the film feeding assembly and the film laminating assembly, and can efficiently laminate the long-strip-shaped PCB.

Description

Technical Field

[0001] This application relates to the field of PCB manufacturing equipment technology, and more specifically, to a fully automatic film applicator and its intelligent control system. Background Technology

[0002] To prevent dust, liquids, and other external impurities from entering the internal components of microphones and other electronic devices, a dustproof film is often applied to the PCB of these devices. The primary function of this dustproof film is to protect the components on the microphone PCB from damage. It also improves the stability and reliability of the device, extends the microphone's lifespan, and makes it more durable in harsh environments. However, existing film application machines often fail to accurately adhere the protective film to the PCB, resulting in air pockets and misalignment, which negatively impacts PCB manufacturing quality.

[0003] Patent CN111132467B (application number: CN202010045399.0) provides a multi-station adhesive coating and film application system for PCB circuit boards, including a rotary worktable, multiple adhesive coating mechanisms and multiple film application mechanisms. Multiple worktables are formed on the rotary worktable, and each worktable is used to position the PCB circuit board. The multiple adhesive coating mechanisms and multiple film application mechanisms are arranged around the periphery of the rotary worktable and are arranged alternately. However, the multi-station adhesive coating and film application system for PCB circuit boards in patent CN111132467B can only perform adhesive coating and film application on small PCBs and is not suitable for efficient film application on long strip PCBs. Summary of the Invention

[0004] The purpose of this application is to provide a fully automatic film applicator and its intelligent control system, which solves the technical problem that existing film applicator equipment is not suitable for applying film to long strip PCBs, and achieves the technical effect of efficiently applying film to long strip PCBs.

[0005] This application provides a fully automatic film applicator and its intelligent control system. The fully automatic film applicator includes a board feeding assembly, a film feeding assembly, and a film applicator. The board feeding assembly carries a PCB board and drives the PCB board to reciprocate. The film feeding assembly supplies a protective film. The film applicator applies the protective film to the PCB board on the board feeding assembly. The film applicator method of the fully automatic film applicator includes: the board feeding assembly moves in a first direction to transport the PCB board below the film feeding assembly; the film feeding assembly transports the protective film above the PCB board on the board feeding assembly; the board feeding assembly moves in the opposite direction of the first direction to transport the PCB board, and at the same time, the film applicator applies the protective film to the PCB board.

[0006] In one possible implementation, the board feeding assembly includes a cylinder, a carrier plate, a lateral correction assembly, and a vertical correction assembly. The carrier plate is used to carry the PCB board and is fixedly connected to the output end of the cylinder. The cylinder is used to drive the carrier plate to reciprocate while carrying the PCB board. The lateral correction assembly is used to laterally position the PCB board on the carrier plate, and the vertical correction assembly is used to vertically position the PCB board on the carrier plate. The vertical correction assembly includes a first movable push plate located at a first end of the carrier plate and a second movable push plate located at a second end of the carrier plate. Both the first and second movable push plates are driven by the cylinder to push the PCB board on the carrier plate so that the two ends of the PCB board are flush with the ends of the carrier plate.

[0007] In another possible implementation, the carrier board has a horizontally arranged cavity, and the top of the carrier board has multiple air suction holes communicating with the cavity. An air suction pipe is connected to the cavity. The PCB board has multiple through holes corresponding to the multiple air suction holes. The film application method of the fully automatic film application machine includes: horizontally positioning the PCB board on the carrier board in the horizontal direction using a horizontal correction component, and vertically positioning the PCB board on the carrier board in the vertical direction using a vertical correction component, so that the multiple through holes and multiple air suction holes of the PCB board are connected; when the board feeding component starts to move in the opposite direction of the first direction to transport the PCB board, the air suction pipe draws suction into the cavity to create negative pressure in the multiple through holes and multiple air suction holes, and the multiple air suction holes adsorb the protective film onto the PCB board from the first end of the carrier board. At the same time, the film application component applies the protective film onto the PCB board from the first end of the carrier board.

[0008] In another possible implementation, a film-cutting assembly is also included. The second end of the carrier board has an upward-facing air inlet, and an air supply pipe is connected to the air inlet. The film-applying method of the fully automatic film applicator also includes: after the film applicator applies the protective film to the PCB board from the second end of the carrier board, it supplies air to the air inlet through the air suction pipe to blow the protective film upward, and then cuts the protective film by the film-cutting assembly.

[0009] In another possible implementation, the film-cutting assembly includes a film baffle and a film-cutting blade. The film baffle is fixedly disposed near the film-applying assembly, and the film-cutting blade is disposed on a second movable push plate and moves with the second movable push plate. The film baffle is provided with a cutting opening that can cooperate with the film-cutting blade. Cutting the protective film by the film-cutting assembly includes: the second movable push plate driving the film-cutting blade to move toward the film baffle, and cutting the protective film by the cooperation of the film-cutting blade and the film baffle; after cutting the protective film, the second movable push plate driving the film-cutting blade to reset.

[0010] In another possible implementation, the film application assembly includes a vertical cylinder and a pressure roller, with the pressure roller rotatably connected to the moving end of the vertical cylinder, and a film baffle positioned horizontally between the film supply end of the film feeding assembly and the pressure roller.

[0011] In another possible implementation, a control component, a motion detection component, and a position detection component are also included. The motion detection component is used to detect the movement direction of the carrier board, and the position detection component is used to detect the real-time position of the carrier board. The motion detection component, the position detection component, and the second movable push plate are electrically connected to the control component. When the motion detection component detects that the carrier board is moving along the first direction, the control component controls the second movable push plate to squeeze the PCB board to correct the position of the PCB board on the carrier board. When the motion detection component detects that the carrier board is moving in the opposite direction of the first direction, and the position detection component detects that the carrier board has moved to the limit position in the opposite direction of the first direction, the control component controls the second movable push plate to drive the film cutting blade to move toward the film baffle plate, and the protective film is cut by the cooperation of the film cutting blade and the film baffle plate.

[0012] This application embodiment also provides an intelligent control system for a fully automatic film applicator, including a storage unit, a processing unit, and a transceiver unit. The storage unit, processing unit, and transceiver unit cooperate to implement the following method: controlling the board feeding assembly to move in a first direction to transport the PCB board below the film feeding assembly; controlling the film feeding assembly to transport the protective film above the PCB board on the board feeding assembly; controlling the board feeding assembly to move in the opposite direction of the first direction to transport the PCB board, while simultaneously controlling the film applicator to apply the protective film onto the PCB board.

[0013] In another possible implementation, the intelligent control system of the aforementioned fully automatic film applicator is also used to implement the following method: controlling the lateral correction component to perform lateral positioning of the PCB board on the carrier in the lateral direction, and controlling the vertical correction component to perform vertical positioning of the PCB board on the carrier in the vertical direction, so that the multiple through holes and multiple suction holes of the PCB board are connected; controlling the board feeding component to start moving in the opposite direction of the first direction to transport the PCB board, controlling the suction pipe to draw air into the cavity to generate negative pressure in the multiple through holes and multiple suction holes, and the multiple suction holes adsorb the protective film onto the PCB board from the first end of the carrier board, while controlling the film applicator to apply the protective film onto the PCB board from the first end of the carrier board.

[0014] In another possible implementation, the intelligent control system of the fully automatic film applicator described above is also used to implement the following method: after the film applicator is controlled to apply the protective film to the PCB board from the second end of the carrier board, air is supplied to the air blowing port through the air suction pipe to blow the protective film upward, and the film cutting assembly is controlled to cut the protective film.

[0015] In another possible implementation, the intelligent control system of the fully automatic film applicator described above is also used to implement the following method: controlling the second movable push plate to drive the film cutting blade to move toward the film baffle, thereby cutting the protective film through the cooperation of the film cutting blade and the film baffle; after cutting the protective film, controlling the second movable push plate to drive the film cutting blade to reset.

[0016] In another possible implementation, the intelligent control system of the aforementioned fully automatic film applicator is also used to implement the following method: when the carrier plate is detected to be moving along the first direction, the second moving push plate is controlled to squeeze the PCB board to correct the position of the PCB board on the carrier plate; when the carrier plate is detected to be moving in the opposite direction of the first direction, and when the carrier plate is detected to have moved to the limit position in the opposite direction of the first direction, the second moving push plate is controlled to drive the film cutting blade toward the film blocking plate, thereby cutting the protective film through the cooperation of the film cutting blade and the film blocking plate.

[0017] The beneficial effects of the embodiments in this application compared with the prior art are:

[0018] This application provides a fully automatic film applicator, comprising a board feeding assembly, a film feeding assembly, and a film applicator. The board feeding assembly carries a PCB board and drives it in reciprocating motion. The film feeding assembly supplies protective film, and the film applicator applies the protective film to the PCB board on the board feeding assembly. The film applicator method includes: the board feeding assembly moving in a first direction to transport the PCB board below the film feeding assembly; the film feeding assembly transporting the protective film above the PCB board on the board feeding assembly; the board feeding assembly moving in the opposite direction to the first direction to transport the PCB board, while the film applicator applies the protective film to the PCB board. This application improves the efficiency of applying film to long, narrow PCB boards. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the main structure of a fully automatic film applicator according to an embodiment of this application;

[0021] Figure 2 for Figure 1 A partial structural diagram of point A of a fully automatic film applicator;

[0022] Figure 3 This is a three-dimensional structural diagram of a fully automatic film applicator according to an embodiment of this application;

[0023] Figure 4 This is a three-dimensional structural diagram of a plate feeding assembly according to an embodiment of this application;

[0024] Figure 5 This is a schematic diagram of the internal structure of a carrier plate in one embodiment of this application;

[0025] Figure 6 for Figure 5 A schematic diagram of a partial structure at point B of a carrier plate;

[0026] Figure 7 This is a schematic diagram of the internal structure of another carrier plate in an embodiment of this application;

[0027] Figure 8 for Figure 7 A schematic diagram of a partial structure at point C of a carrier plate;

[0028] Figure 9 This is a schematic diagram of the structure of a carrier plate in a first position according to an embodiment of this application;

[0029] Figure 10 This is a schematic diagram of the front view structure of a baffle plate in an embodiment of this application;

[0030] Figure 11 This is a schematic diagram of the structure of a carrier plate in a second position according to an embodiment of this application;

[0031] Figure 12 for Figure 11 A schematic diagram of a partial structure at point D of a carrier plate;

[0032] Figure 13 This is a schematic diagram of the control structure of a fully automatic film applicator according to an embodiment of this application;

[0033] In the diagram, 1 is a fully automatic film applicator; 101 is a PCB board; 101a is a through hole; 102 is a protective film; 11 is a board feeding assembly; 111 is a cylinder; 112 is a carrier board; 112a is a cavity; 112b is an air suction hole; 112c is an air suction pipe; 112d is an air blowing port; 112e is an air supply pipe; 113 is a horizontal correction assembly; 114 is a vertical correction assembly; 114a is a first moving push plate; 114b is a second moving push plate; 12 is a film feeding assembly; 13 is a film applicator assembly; 131 is a vertical cylinder; 132 is a pressure roller; 14 is a film cutting assembly; 141 is a film baffle plate; 141a is a film cutting opening; 142 is a film cutting knife; 15 is a control assembly; 151 is a motion detection assembly; and 152 is a position detection assembly. Detailed Implementation

[0034] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0035] It should be noted that when a component or structure is referred to as being "fixed to" or "set on" another component or structure, it can be directly on or indirectly on the other component or structure. When a component or structure is referred to as being "connected to" another component or structure, it can be directly connected to or indirectly connected to the other component or structure.

[0036] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device, component, or structure referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0038] In the existing technology, the multi-station adhesive coating and film application system for PCB circuit boards can only apply adhesive and film to small PCBs, and is not suitable for efficient film application to long strip PCBs.

[0039] Based on the above reasons, this application provides a fully automatic film applicator. The fully automatic film applicator includes a board feeding assembly, a film feeding assembly, and a film applicator. The board feeding assembly carries a PCB board and drives it in reciprocating motion. The film feeding assembly supplies protective film. The film applicator applies the protective film to the PCB board on the board feeding assembly. The film applicator method includes: the board feeding assembly moving in a first direction to transport the PCB board below the film feeding assembly; the film feeding assembly transporting the protective film above the PCB board on the board feeding assembly; the board feeding assembly moving in the opposite direction to the first direction to transport the PCB board, while the film applicator applies the protective film to the PCB board. This application can improve the film applicability to long, narrow PCB boards.

[0040] In some scenarios, a fully automatic film applicator according to an embodiment of this application can be applied to the film application process of long strip PCB boards, and the film application efficiency of long strip PCB boards can be achieved through reciprocating motion.

[0041] The following describes a fully automatic film applicator provided in the embodiments of this application with specific examples.

[0042] Figure 1 This is a front view schematic diagram of a fully automatic film applicator according to an embodiment of this application. Figure 2 for Figure 1 A partial structural diagram of point A of a fully automatic film applicator. Figure 3 This is a three-dimensional structural diagram of a fully automatic film applicator according to an embodiment of this application, such as... Figures 1 to 3 As shown, the fully automatic film applicator 1 in this embodiment includes a board feeding assembly 11, a film feeding assembly 12, and a film applicator 13. The board feeding assembly 11 is used to carry the PCB board 101 and drive the PCB board 101 to reciprocate. The film feeding assembly 12 is used to supply the protective film 102. The film applicator 13 is used to apply the protective film 102 onto the PCB board 101 on the board feeding assembly 11. The film applicator method of the fully automatic film applicator 1 includes S110 to S120. S110 to S120 will be described in detail below.

[0043] Structurally, such as Figures 1 to 3 As shown, the board feeding assembly 11 can be a reciprocating moving assembly driven by a cylinder. The board feeding assembly 11 can carry the PCB board 101 and drive the PCB board 101 to reciprocate. After the board feeding assembly 11 conveys the PCB board 101, it can apply a film to the PCB board 101.

[0044] In use, the film feeding assembly 12 is used to supply the protective film 102. After the protective film 102 is supplied, the protective film 102 can be applied to the PCB board 101 on the board feeding assembly 11 by the film application assembly 13 to complete the film application on the PCB board 101.

[0045] For example, the protective film 102 delivered by the film delivery assembly 12 is a strip-shaped protective film.

[0046] For example, a release film is provided on the application surface of the protective film 102. The film feeding assembly 12 can peel off the protective film on the protective film 102 while feeding the film. The protective film 102 can also extend above the PCB board 101. The film application assembly 13 can move downward to attach the protective film 102 to the PCB board 101.

[0047] In this embodiment of the application, the film application method of the fully automatic film applicator 1 includes S110 to S120, and S110 to S120 will be described in detail below.

[0048] S110, the board feeding assembly 11 moves in the first direction to transport the PCB board 101 to below the film feeding assembly 12, and the film feeding assembly 12 transports the protective film 102 to above the PCB board 101 on the board feeding assembly 11.

[0049] In use, the present application embodiment can control the board feeding assembly 11 to move in the first direction to transport the PCB board 101 to below the film feeding assembly 12, and the film feeding assembly 12 can transport the protective film 102 to above the PCB board 101 on the board feeding assembly 11, so as to facilitate the subsequent application of film to the PCB board 101.

[0050] S120, the board feeding assembly 11 moves in the opposite direction of the first direction to transport the PCB board 101, while the film application assembly 13 applies the protective film 102 onto the PCB board 101.

[0051] In use, the board feeding assembly 11 can be driven to move in the opposite direction of the first direction to transport the PCB board 101. While the PCB board 101 is being transported in the opposite direction of the first direction, the protective film 102 can be applied to the PCB board 101 at the same time by the film application assembly 13, so as to achieve the simultaneous application of film to the PCB board 101.

[0052] In use, after the film is applied to the PCB board 101, the PCB board 101 can be conveyed out in the opposite direction of the first direction by the board feeding assembly 11, and the PCB board 101 on the board feeding assembly 11 can be removed by other moving components, thereby realizing the unloading of the PCB board 101 on the board feeding assembly 11.

[0053] In subsequent processes, the PCB board 101 can be fed onto the board feeding assembly 11 again to realize the feeding of the PCB board 101 onto the board feeding assembly 11.

[0054] The beneficial effect of the above implementation method is that by conveying the PCB board along the length of the PCB board, the feeding and film application of long strip PCB boards can be realized, thereby improving the film application efficiency of the PCB board.

[0055] In some implementations, Figure 4 This is a three-dimensional structural diagram of a plate feeding assembly according to an embodiment of this application, such as... Figures 1 to 4 As shown, the board feeding assembly 11 includes a cylinder 111, a carrier plate 112, a lateral correction assembly 113, and a vertical correction assembly 114. The carrier plate 112 is used to carry the PCB board 101. The carrier plate 112 is fixedly connected to the output end of the cylinder 111. The cylinder 111 is used to drive the carrier plate 112 to reciprocate while carrying the PCB board 101. The lateral correction assembly 113 is used to perform lateral positioning of the PCB board 101 on the carrier plate 112 in the lateral direction. The vertical correction assembly 114 is used to perform vertical positioning of the PCB board 101 on the carrier plate 112 in the vertical direction.

[0056] When using, such as Figures 1 to 4As shown, after the carrier plate 112 carries the PCB board 101, the carrier plate 112 is fixedly connected to the output end of the cylinder 111. The cylinder 111 can drive the carrier plate 112 carrying the PCB board 101 to move along the first direction to the position where the film is to be applied. The cylinder 111 can then drive the carrier plate 112 carrying the PCB board 101 to move in the opposite direction of the first direction to apply the film to the PCB board 101.

[0057] In use, the lateral correction component 113 can laterally position the PCB board 101 on the carrier board 112, thereby correcting the position of the PCB board 101 in the lateral direction and ensuring the accuracy of film application to the PCB board 101.

[0058] For example, the lateral correction component 113 may include a plurality of cylinders and a pressure head connected to the cylinder output end. The carrier plate 112 is provided with a side baffle opposite to the position of the lateral correction component 113. The pressure head of the lateral correction component 113 can push the PCB board 101 laterally against the side baffle on the carrier plate 112, thereby correcting the lateral compression position of the PCB board 101.

[0059] In use, the vertical correction component 114 can vertically position the PCB board 101 on the carrier board 112, and then correct the position of the PCB board 101 in the vertical direction to ensure the accuracy of film application on the PCB board 101.

[0060] In some implementations, the vertical correction component 114 includes a first movable push plate 114a disposed at a first end of the carrier plate 112 and a second movable push plate 114b disposed at a second end of the carrier plate 112. Both the first movable push plate 114a and the second movable push plate 114b are driven by a cylinder to push the PCB board 101 on the carrier plate 112 so that the two ends of the PCB board 101 are flush with the ends of the carrier plate 112.

[0061] Structurally, such as Figure 4 As shown, the vertical correction component 114 corrects the position of the PCB board 101 by cooperating with a first movable push plate 114a at the first end of the carrier plate 112 and a second movable push plate 114b at the second end of the carrier plate 112. Structurally, both the first movable push plate 114a and the second movable push plate 114b are driven by cylinders to push the PCB board 101 on the carrier plate 112 so that both ends of the PCB board 101 are flush with the ends of the carrier plate 112, thereby achieving the positioning of the PCB board 101.

[0062] Structurally, both the first movable push plate 114a and the second movable push plate 114b can abut against the end of the carrier plate 112, and the length of the PCB board 101 is the same as the length of the carrier plate 112, so that the two ends of the PCB board 101 and the end of the carrier plate 112 can be set flush.

[0063] The beneficial effects of the above implementation method are that the horizontal correction component is used to perform horizontal positioning of the PCB board on the carrier board, and the vertical correction component is used to perform vertical positioning of the PCB board on the carrier board, thereby improving the positioning effect of the PCB board and improving the film application accuracy.

[0064] In some implementations, Figure 5 This is a schematic diagram of the internal structure of a carrier plate in one embodiment of this application. Figure 6 for Figure 5 A partial structural diagram of point B on a carrier plate, as shown in the diagram. Figure 5 and Figure 6 As shown, the carrier plate 112 has a horizontally arranged cavity 112a, the top of the carrier plate 112 has a plurality of air intake holes 112b communicating with the cavity 112a, the cavity 112a is connected to an air intake pipe 112c, and the PCB board 101 has a plurality of through holes 101a corresponding to the plurality of air intake holes 112b.

[0065] Structurally, the carrier plate 112 has a horizontally arranged cavity 112a, and the top of the carrier plate 112 has a plurality of air intake holes 112b communicating with the cavity 112a. The plurality of air intake holes 112b can vent air into the cavity 112a, so that by applying negative pressure to the cavity 112a, negative pressure can be applied to the plurality of air intake holes 112b through the cavity 112a.

[0066] Structurally, the cavity 112a is connected to an air intake pipe 112c, through which the gas inside the cavity 112a can be extracted and negative pressure applied to the cavity 112a.

[0067] Structurally, such as Figure 5 and Figure 6 As shown, the PCB board 101 is provided with a plurality of through holes 101a corresponding to the plurality of air intake holes 112b. After the PCB board 101 and the carrier board 112 are aligned, the plurality of air intake holes 112b can draw external air into the cavity 112a through the plurality of air intake holes 112b and the plurality of through holes 101a when air is drawn in.

[0068] For example, the through hole 101a on the PCB board 101 can be a structural hole or a via on the PCB board 101. The through hole 101a can also be a gap hole between each PCB board unit on the PCB board 101 composed of multiple PCB board units.

[0069] In some implementations, the film application method of this fully automatic film applicator 1 also includes S210 to S220, which will be described in detail below.

[0070] S210, the PCB board 101 on the carrier board 112 is positioned laterally by the lateral correction component 113, and the PCB board 101 on the carrier board 112 is positioned vertically by the vertical correction component 114, so that the multiple through holes 101a and multiple air intake holes 112b of the PCB board 101 are connected.

[0071] In use, the PCB board 101 on the carrier board 112 can be horizontally positioned by the horizontal correction component 113, and the PCB board 101 on the carrier board 112 can be vertically positioned by the vertical correction component 114, so that the multiple through holes 101a and multiple air suction holes 112b of the PCB board 101 are connected, which can ensure that the multiple air suction holes 112b can draw in external air through the multiple through holes 101a when air is being drawn in.

[0072] S220, when the board feeding assembly 11 starts to move in the opposite direction of the first direction to transport the PCB board 101, the suction pipe 112c draws air into the cavity 112a, causing negative pressure to be generated in the multiple through holes 101a and multiple suction holes 112b. The multiple suction holes 112b adsorb the protective film 102 onto the PCB board 101 starting from the first end of the carrier board 112. At the same time, the film application assembly 13 applies the protective film 102 onto the PCB board 101 starting from the first end of the carrier board 112.

[0073] In use, the suction pipe 112c draws air into the cavity 112a, creating negative pressure in the multiple through holes 101a and multiple suction holes 112b. This means that external air passes through the multiple through holes 101a, multiple suction holes 112b, and the cavity 112a in sequence. Since the protective film 102 located at the first end of the carrier plate 112 is closest to the PCB board 101, the protective film 102 located at the first end of the carrier plate 112 is adsorbed onto the PCB board 101 under the action of airflow. At the same time, the film application assembly 13 applies the protective film 102 to the PCB board 101 starting from the first end of the carrier plate 112, thus realizing the film application on the PCB board 101.

[0074] The beneficial effect of the above implementation method is that, while the carrier board supports the PCB board, the protective film is adsorbed onto the PCB board through the through-holes on the carrier board, which facilitates the application of the protective film to the PCB board and improves the accuracy of film application.

[0075] The beneficial effect of the above implementation method is that it utilizes the structural holes and vias on the PCB board to apply the film to the PCB, thereby achieving the purpose of applying the film to the PCB board using the PCB board structure, simplifying the complexity of the film application structure, and reducing the cost of the film application equipment.

[0076] In some implementations, Figure 7This is a schematic diagram of the internal structure of another carrier plate in an embodiment of this application. Figure 8 for Figure 7 A partial structural diagram of point C on a carrier plate, as shown in the diagram. Figure 7 and Figure 8 As shown in the embodiment of this application, it also includes a film cutting assembly 14, and the second end of the carrier plate 112 is provided with an upwardly facing air blowing port 112d, and an air supply pipe 112e is connected to the air blowing port 112d.

[0077] Figure 9 This is a schematic diagram of the structure of a carrier plate in a first position according to an embodiment of this application. Figure 10 This is a schematic diagram of the main structure of a baffle plate in an embodiment of this application, as shown below. Figures 7 to 10 As shown, the film-cutting component 14 in this embodiment is used to cut the protective film 102 so as to achieve repeated film application to multiple PCB boards 101.

[0078] Structurally, the second end of the carrier plate 112 is provided with an upward-facing air inlet 112d, which can blow air out of the air inlet 112d to blow air onto the protective film 102.

[0079] Structurally, an air supply pipe 112e is connected to the air outlet 112d. The air supply pipe 112e is used to supply airflow to the air outlet 112d so that the airflow that blows the protective film 102 can be supplied to the air outlet 112d through the air supply pipe 112e.

[0080] In some implementations, the film application method of the fully automatic film applicator 1 described above further includes: after the film application assembly 13 applies the protective film 102 to the PCB board 101 from the second end of the carrier board 112, it supplies air to the air outlet 112d through the air suction pipe 112c to blow the protective film 102 upward, and then cuts the protective film 102 through the film cutting assembly 14.

[0081] In use, the protective film 102 can be applied to the PCB board 101 from the second end of the carrier board 112 through the film application assembly 13. Then, air is supplied to the air outlet 112d through the air intake pipe 112c to blow the protective film 102 upward, so as to facilitate the cutting of the protective film 102. At this time, the protective film 102 is cut by the film cutting assembly 14.

[0082] The beneficial effect of the above implementation method is that after the film is applied, the protective film is blown with air through the air blowing port integrated on the carrier plate, which makes it easy to cut the protective film.

[0083] The beneficial effect of the above implementation method is that by supplying air to the air outlet through the air intake pipe, the protective film is blown upward, and then cut after the protective film is in an upward state, which improves the utilization rate of the protective film and avoids waste of the protective film.

[0084] In some implementations, Figure 11 This is a schematic diagram of a carrier plate in a second position according to an embodiment of this application. Figure 12 for Figure 11 A schematic diagram of a partial structure at point D of a carrier plate, as shown in the figure. Figures 11 to 12 As shown, the film cutting assembly 14 includes a film baffle plate 141 and a film cutting blade 142. The film baffle plate 141 is fixedly disposed near the film application assembly 13. The film cutting blade 142 is disposed on the second movable push plate 114b and moves with the second movable push plate 114b. The film baffle plate 141 is provided with a film cutting opening 141a that can cooperate with the film cutting blade 142.

[0085] Structurally, such as Figures 11 to 12 As shown, the film cutting assembly 14 includes a film baffle plate 141 and a film cutting blade 142. The film baffle plate 141 is fixedly disposed near the film application assembly 13, so that the film baffle plate 141 can stop the protective film 102 and cut the protective film 102 at a position near the film application assembly 13.

[0086] Structurally, such as Figures 11 to 12 As shown, the film-cutting blade 142 is mounted on the second movable push plate 114b and moves with the second movable push plate 114b, so that the film-cutting blade 142 can contact the film-blocking plate 141 when it moves with the second movable push plate 114b and the carrier plate 112. The film-blocking plate 141 is provided with a film-cutting opening 141a that can cooperate with the film-cutting blade 142, so that the film-cutting blade 142 can cooperate with the film-cutting opening 141a to cut the protective film 102.

[0087] Structurally, when the carrier plate 112 moves, the second movable push plate 114b always moves on one side of the baffle plate 141, so that the second movable push plate 114b and the baffle plate 141 do not interfere with each other structurally.

[0088] In some implementations, the protective film 102 is cut by the film cutting assembly 14, including S310 to S320, which are described in detail below.

[0089] S310, the second moving push plate 114b drives the film cutting knife 142 to move toward the film baffle plate 141, and the protective film 102 is cut by the cooperation of the film cutting knife 142 and the film baffle plate 141.

[0090] In use, the second moving push plate 114b drives the film cutting knife 142 to move toward the film baffle plate 141, so that the film cutting knife 142 can actively cooperate with the film baffle plate 141 to cut the protective film 102 through the film cutting opening 141a and the film cutting knife 142.

[0091] S320. After the protective film 102 is cut, the second moving push plate 114b drives the film cutting knife 142 to reset.

[0092] During use, the second moving push plate 114b drives the film cutting blade 142 to reset, which can prevent the film cutting blade 142 from affecting the application process of the protective film 102 in subsequent use.

[0093] The beneficial effect of the above implementation method is that the protective film is cut by the cooperation of the baffle plate and the cutting blade, and the protective film is cut by the cutting blade driven by the second moving push plate, which improves the integration of the structure for cutting the protective film.

[0094] The beneficial effect of the above implementation method is that the second moving pusher can also achieve auxiliary positioning of the PCB board, enabling the second moving pusher to simultaneously perform the functions of PCB board positioning and cutting the protective film, thereby improving the equipment's performance.

[0095] In some implementations, such as Figure 2 As shown, the film application assembly 13 includes a vertical cylinder 131 and a pressure roller 132. The pressure roller 132 is rotatably connected to the moving end of the vertical cylinder 131. The film baffle 141 is arranged in the horizontal direction between the film supply end of the film feeding assembly 12 and the pressure roller 132.

[0096] Structurally, the pressure roller 132 is a rotatable flexible roller, and the vertical cylinder 131 can drive the pressure roller 132 to press the protective film 102 downward, thereby attaching the protective film 102 to the PCB board 101.

[0097] Structurally, the baffle plate 141 is positioned horizontally between the film supply end of the film feeding assembly 12 and the pressure roller 132, so that the baffle plate 141 will not interfere with the pressure roller 132, and the protective film 102 on the film feeding assembly 12 can continue to supply film to the subsequent PCB board 101 after it is cut.

[0098] For example, the film supply end of the film feeding assembly 12 can be located above the film baffle 141 so that the film feeding assembly 12 will not interfere with the film baffle 141.

[0099] The beneficial effect of the above implementation method is that the baffle plate will not interfere with the position of the film supply end and the pressure roller of the film feeding assembly.

[0100] In some implementations, Figure 13 This is a schematic diagram of the control structure of a fully automatic film applicator according to an embodiment of this application, such as... Figure 13As shown, this embodiment of the application also includes a control component 15, a motion detection component 151, and a position detection component 152. The motion detection component 151 is used to detect the movement direction of the carrier plate 112, and the position detection component 152 is used to detect the real-time position of the carrier plate 112. The motion detection component 151, the position detection component 152, and the second moving push plate 114b are electrically connected to the control component 15. When the motion detection component 151 detects that the carrier plate 112 is moving along the first direction, the control component 15 controls the second moving push plate 114b to press the PCB board 101 to correct the position of the PCB board 101 on the carrier plate 112. When the motion detection component 151 detects that the carrier plate 112 is moving in the opposite direction of the first direction, and the position detection component 152 detects that the carrier plate 112 has moved to the limit position in the opposite direction of the first direction, the control component 15 controls the second moving push plate 114b to drive the film cutting knife 142 to move toward the film baffle plate 141, and the protective film 102 is cut by the cooperation of the film cutting knife 142 and the film baffle plate 141.

[0101] In use, the motion detection component 151 can detect the movement direction of the carrier plate 112, and the position detection component 152 can detect the real-time position of the carrier plate 112. The motion detection component 151, the position detection component 152, and the second moving push plate 114b are electrically connected to the control component 15, so that the control component 15 can control the fully automatic film applicator according to the detection results of the motion detection component 151, the position detection component 152, and the second moving push plate 114b.

[0102] During operation, when the motion detection component 151 detects that the carrier plate 112 is moving along the first direction, the control component 15 controls the second moving push plate 114b to press the PCB board 101 to correct the position of the PCB board 101 on the carrier plate 112, so that the position of the PCB board 101 on the carrier plate 112 is fixed accurately, thereby improving the film application accuracy of the PCB board 101.

[0103] In use, when the motion detection component 151 detects that the carrier plate 112 is moving in the opposite direction of the first direction, and when the position detection component 152 detects that the carrier plate 112 has moved to the limit position in the opposite direction of the first direction, the control component 15 controls the second moving push plate 114b to drive the film cutting blade 142 to move toward the film blocking plate 141. The film cutting blade 142 and the film blocking plate 141 work together to cut the protective film 102, thus completing the entire film application process on the PCB board 101.

[0104] For example, when the position detection component 152 detects that the carrier plate 112 has moved to the limit position in the opposite direction of the first direction, it can start the unloading component to unload the PCB board 101 on the carrier plate 112 after a predetermined time delay.

[0105] For example, the second movable push plate 114b can be driven by a cylinder, and the cylinder of the second movable push plate 114b is controlled by a solenoid valve. The control component 15 is electrically connected to the solenoid valve of the second movable push plate 114b so as to control the motion state of the second movable push plate 114b through the control component 15.

[0106] The beneficial effect of the above implementation method is that, through position detection and motion direction detection, the control accuracy and control effect of correcting the position of the PCB board on the carrier board and cutting the protective film are improved.

[0107] This application also provides an intelligent control system for a fully automatic film applicator, including a storage unit, a processing unit, and a transceiver unit. The storage unit stores data, the processing unit processes data, and the transceiver unit sends and receives data. The storage unit, processing unit, and transceiver unit are coupled to each other to implement methods such as S110 to S120. The beneficial effects of this intelligent control system for the fully automatic film applicator have been described in the above description of methods S110 to S120, and will not be repeated here.

[0108] In some implementations, the intelligent control system of the fully automatic film applicator described above is also used to implement the methods described in S210 to S220. The beneficial effects of the intelligent control system of this fully automatic film applicator have been explained in the method descriptions of S210 to S220 above, and will not be repeated here.

[0109] In some implementations, the intelligent control system of the aforementioned fully automatic laminating machine is also used to implement the following method: after the laminating assembly 13 applies the protective film 102 onto the PCB 101 from the second end of the carrier board 112, it controls the supply of air through the suction pipe 112c to the air outlet 112d to blow the protective film 102 upwards, and controls the film cutting assembly 14 to cut the protective film 102. The beneficial effects of the intelligent control system of this fully automatic laminating machine have been explained in the description of the above method and will not be repeated here.

[0110] In some implementations, the intelligent control system of the fully automatic film applicator described above is also used to implement the methods described in S310 to S320. The beneficial effects of the intelligent control system of this fully automatic film applicator have been explained in the method descriptions of S310 to S320 above, and will not be repeated here.

[0111] In some implementations, the intelligent control system of the fully automatic film applicator described above is also used to implement the following method: when the carrier plate 112 is detected to be moving along the first direction, the second moving push plate 114b is controlled to press the PCB board 101 to correct the position of the PCB board 101 on the carrier plate 112. When the carrier plate 112 is detected to be moving in the opposite direction of the first direction, and when the carrier plate 112 is detected to have moved to its limit position in the opposite direction of the first direction, the second moving push plate 114b is controlled to drive the film cutting blade 142 to move toward the film blocking plate 141, thereby cutting the protective film 102 through the cooperation of the film cutting blade 142 and the film blocking plate 141. The beneficial effects of the intelligent control system of this fully automatic film applicator have been explained in the description of the above method and will not be repeated here.

[0112] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A fully automatic film applicator, characterized in that, The fully automatic film applicator (1) includes a board feeding assembly (11), a film feeding assembly (12), and a film applicator (13). The board feeding assembly (11) is used to carry the PCB board (101) and drive the PCB board (101) to reciprocate. The film feeding assembly (12) is used to supply the protective film (102). The film applicator (13) is used to apply the protective film (102) onto the PCB board (101) on the board feeding assembly (11). The film applicator method of the fully automatic film applicator (1) includes: The board feeding assembly (11) moves in the first direction to transport the PCB board (101) to below the film feeding assembly (12), and the film feeding assembly (12) transports the protective film (102) to above the PCB board (101) on the board feeding assembly (11); The board feeding assembly (11) moves in the opposite direction to the first direction to transport the PCB board (101), while the film application assembly (13) applies the protective film (102) to the PCB board (101); The board feeding assembly (11) includes a cylinder (111), a carrier plate (112), a horizontal correction assembly (113), and a vertical correction assembly (114). The carrier plate (112) is used to carry the PCB board (101). The carrier plate (112) is fixedly connected to the output end of the cylinder (111). The cylinder (111) is used to drive the carrier plate (112) to carry the PCB board (101) in reciprocating motion. The horizontal correction assembly (113) is used to perform horizontal positioning of the PCB board (101) on the carrier plate (112) in the horizontal direction. The vertical correction assembly (114) is used to perform vertical positioning of the PCB board (101) on the carrier plate (112) in the vertical direction. The vertical correction assembly (114) includes a first movable push plate (114a) disposed at the first end of the carrier plate (112) and a second movable push plate (114b) disposed at the second end of the carrier plate (112). The first movable push plate (114a) and the second movable push plate (114b) are both driven by a cylinder to push the PCB board (101) on the carrier plate (112) so that the two ends of the PCB board (101) are flush with the ends of the carrier plate (112). The carrier plate (112) has a horizontally arranged cavity (112a) inside, and the top of the carrier plate (112) has a plurality of air suction holes (112b) communicating with the cavity (112a). An air suction pipe (112c) is connected to the cavity (112a). The PCB board (101) has a plurality of through holes (101a) corresponding to the plurality of air suction holes (112b). The film application method of the fully automatic film application machine (1) includes: The PCB board (101) on the carrier board (112) is positioned laterally by the lateral correction component (113), and the PCB board (101) on the carrier board (112) is positioned vertically by the vertical correction component (114), so that the multiple through holes (101a) and multiple air intake holes (112b) of the PCB board (101) are connected. When the board feeding assembly (11) starts to move in the opposite direction of the first direction to transport the PCB board (101), the suction pipe (112c) draws the cavity (112a) to generate negative pressure in multiple through holes (101a) and multiple suction holes (112b). The multiple suction holes (112b) adsorb the protective film (102) onto the PCB board (101) from the first end of the carrier board (112). At the same time, the film application assembly (13) applies the protective film (102) onto the PCB board (101) from the first end of the carrier board (112).

2. The fully automatic film applicator as described in claim 1, characterized in that, It also includes a film cutting assembly (14), and the second end of the carrier plate (112) is provided with an upward-facing air inlet (112d), and an air supply pipe (112e) is connected to the air inlet (112d). The film application method of the fully automatic film applicator (1) further includes: After the film-applying assembly (13) applies the protective film (102) to the PCB board (101) from the second end of the carrier board (112), it supplies air to the air outlet (112d) through the air intake pipe (112c) to blow the protective film (102) upward, and then cuts the protective film (102) through the film-cutting assembly (14).

3. The fully automatic film applicator as described in claim 2, characterized in that, The film cutting assembly (14) includes a film baffle plate (141) and a film cutting blade (142). The film baffle plate (141) is fixedly installed close to the film application assembly (13). The film cutting blade (142) is installed on the second movable push plate (114b) and moves with the second movable push plate (114b). The film baffle plate (141) is provided with a film cutting opening (141a) that can cooperate with the film cutting blade (142). The protective film (102) is cut by the film-cutting assembly (14), including: The second movable push plate (114b) drives the film cutting knife (142) to move toward the film baffle (141), and the protective film (102) is cut by the cooperation of the film cutting knife (142) and the film baffle (141). After the protective film (102) is cut, the second moving push plate (114b) drives the film cutting knife (142) to reset.

4. The fully automatic film applicator as described in claim 3, characterized in that, The film application assembly (13) includes a vertical cylinder (131) and a pressure roller (132). The pressure roller (132) is rotatably connected to the moving end of the vertical cylinder (131). The film baffle (141) is arranged in the horizontal direction between the film supply end of the film feeding assembly (12) and the pressure roller (132).

5. The fully automatic film applicator as described in claim 4, characterized in that, It also includes a control component (15), a motion detection component (151), and a position detection component (152). The motion detection component (151) is used to detect the movement direction of the carrier plate (112), and the position detection component (152) is used to detect the real-time position of the carrier plate (112). The motion detection component (151), the position detection component (152), and the second moving push plate (114b) are electrically connected to the control component (15). When the motion detection component (151) detects that the carrier plate (112) is moving along the first direction, the control component (15) controls the second moving push plate (114b). The PCB board (101) is squeezed to correct the position of the PCB board (101) on the carrier board (112); when the motion detection component (151) detects that the carrier board (112) is moving in the opposite direction of the first direction, and the position detection component (152) detects that the carrier board (112) has moved to the limit position in the opposite direction of the first direction, the control component (15) controls the second moving push plate (114b) to drive the film cutting knife (142) to move toward the film blocking plate (141), and the protective film (102) is cut by the cooperation of the film cutting knife (142) and the film blocking plate (141).

6. An intelligent control system for a fully automatic film applicator, characterized in that, It includes a storage unit, a processing unit, and a transceiver unit. The storage unit, processing unit, and transceiver unit work together to implement the following method: The control board feeding assembly (11) moves in the first direction to transport the PCB board (101) to below the film feeding assembly (12), and the control film feeding assembly (12) transports the protective film (102) to above the PCB board (101) on the board feeding assembly (11); The control board feeding assembly (11) moves in the opposite direction of the first direction to transport the PCB board (101), and at the same time controls the film application assembly (13) to apply the protective film (102) onto the PCB board (101); The horizontal correction component (113) is controlled to perform horizontal positioning of the PCB board (101) on the carrier board (112) in the horizontal direction, and the vertical correction component (114) is controlled to perform vertical positioning of the PCB board (101) on the carrier board (112) in the vertical direction, so that the multiple through holes (101a) and multiple air suction holes (112b) of the PCB board (101) are connected. When the control board feeding assembly (11) starts to move in the opposite direction of the first direction to transport the PCB board (101), the control system draws air through the suction pipe (112c) to the cavity (112a) to generate negative pressure in the multiple through holes (101a) and multiple suction holes (112b). The multiple suction holes (112b) adsorb the protective film (102) onto the PCB board (101) from the first end of the carrier board (112). At the same time, the control system applies the protective film (102) onto the PCB board (101) from the first end of the carrier board (112).

7. The intelligent control system of the fully automatic film applicator as described in claim 6, characterized in that, It is also used to implement the following methods: After the control film application assembly (13) applies the protective film (102) to the PCB board (101) from the second end of the carrier board (112), the control supplies air to the air outlet (112d) through the air intake pipe (112c) to blow the protective film (102) upward, and the control film cutting assembly (14) cuts the protective film (102).

Images