一种压铸铝合金及其应用
By controlling the proportions of Cu, Mg, and Sn in die-cast aluminum alloys, Cu-Sn and Mg-Sn intermetallic compounds are formed, solving the problem of mold sticking in traditional die-cast aluminum alloys. This achieves high-precision, high-yield, and low-cost production, suitable for 3C products, transportation vehicles, and aerospace components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIANGFAN JINNAITE MACHINERY
- Filing Date
- 2024-02-21
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional die-cast aluminum alloys are prone to sticking to the mold during the production process, which leads to a decrease in product precision and yield. Adding Fe to solve the sticking problem will worsen the mechanical and thermal conductivity properties.
By controlling the proportions of Cu, Mg, and Sn in die-cast aluminum alloys, especially [Cu]/[Sn] = 1.98-3.25 and [Mg]/[Sn] = 0.38-0.65, Cu-Sn and Mg-Sn intermetallic compounds are formed, avoiding sticking defects while maintaining excellent mechanical and thermal properties.
It achieves high precision and high yield without sticking during the die casting process, simplifies the production process, reduces process costs, and maintains the mechanical and thermal conductivity properties of aluminum alloys, making it suitable for 3C products, transportation vehicles, and aerospace components.
Smart Images
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