Instrument temperature measurement method, apparatus, and readable storage medium

Abstract

The present disclosure provides an instrument temperature measurement method, device and readable storage medium. The method comprises: obtaining the internal temperature T1 and the external temperature T2 of the instrument shell; obtaining the theoretical temperature T3 of the instrument shell according to the instrument shell parameters and the internal temperature T1; obtaining the heat value Q emitted outward by the instrument shell according to the instrument shell parameters, the internal temperature T1, the external temperature T2 and the theoretical temperature T3; obtaining the theoretical value T0 of the environmental temperature according to the heat value Q emitted outward by the instrument shell; and obtaining the instrument environmental temperature value according to the theoretical value T0 of the environmental temperature. The present disclosure realizes accurate measurement of the instrument environmental temperature by introducing the instrument shell related parameters.

Description

Technical Field

[0001] This disclosure relates to the field of instrument ambient temperature, specifically to an instrument temperature measurement method, apparatus, and readable storage medium. Background Technology

[0002] During operation, the components and circuit boards of the equipment generate a lot of heat. This heat will reach the vicinity of the ambient temperature sensor through radiation or thermal conduction, which will seriously affect the accuracy of the ambient temperature sensor's measurement. Summary of the Invention

[0003] This disclosure provides an instrument temperature measurement method, apparatus, and readable storage medium, which can solve the technical problem of inaccurate ambient temperature measurement in existing instruments.

[0004] In a first aspect, embodiments of this disclosure provide an instrument temperature measurement method, including:

[0005] Obtain the internal temperature T1 and external temperature T2 of the instrument housing;

[0006] Based on the instrument housing parameters and internal temperature T1, the theoretical temperature T3 of the instrument housing is obtained.

[0007] Based on the instrument casing parameters, internal temperature T1, external temperature T2, and theoretical temperature T3, the heat value Q dissipated from the instrument casing is obtained.

[0008] The theoretical value of the ambient temperature T0 is obtained based on the heat Q emitted outward from the instrument casing.

[0009] The ambient temperature of the instrument is obtained based on the theoretical value T0 of the ambient temperature.

[0010] Furthermore, in one embodiment, obtaining the theoretical temperature T3 of the instrument housing based on the instrument housing parameters and the internal temperature T1 may include:

[0011] The thermal resistance R and thermal power P of the instrument housing are obtained. The thermal resistance R of the instrument housing is determined according to the material and thickness of the instrument housing, and the thermal power P is determined according to the power of the instrument.

[0012] The theoretical temperature T3 of the instrument casing is obtained based on the thermal resistance R, thermal power P, and internal temperature T1 of the instrument casing.

[0013] Furthermore, in one embodiment, the theoretical temperature T3 of the instrument housing can be obtained according to the formula R = (T1 - T3) / P.

[0014] Furthermore, in one embodiment, the heat value Q dissipated by the instrument casing can be obtained according to the formula Q=c*m*{(T1-T2)-(T1-T3)} / 2, where c is the specific heat capacity of the instrument casing and m is the mass of the instrument casing.

[0015] Furthermore, in one embodiment, the theoretical value T0 of the ambient temperature can be obtained according to the Stefan-Boltzmann law.

[0016] Furthermore, in one embodiment, the process of obtaining the instrument ambient temperature based on the theoretical value T0 of the ambient temperature may further include:

[0017] Real-time acquisition of the actual ambient temperature value Tam;

[0018] A nonlinear fit was performed on the theoretical value T0 of the ambient temperature and the actual value Tam of the ambient temperature obtained in real time to obtain a nonlinear relationship between the instrument ambient temperature and the theoretical value T0.

[0019] Furthermore, in one embodiment, the theoretical value T0 of the ambient temperature and the actual value T of the ambient temperature obtained in real time are compared. am Before performing nonlinear fitting, the following steps are required: obtaining the theoretical value T0 and the actual value T of the ambient temperature. am The linear fitting relationship is used to correct the theoretical value T0 of the ambient temperature based on the correlation index of the linear fitting relationship.

[0020] Secondly, embodiments of this disclosure also provide an instrument temperature measuring device, comprising:

[0021] Temperature sensor S1 is used to obtain the internal temperature T1 of the instrument housing;

[0022] Temperature sensor S2 is used to obtain the external temperature T2 of the instrument housing;

[0023] The theoretical temperature acquisition module is configured to obtain the theoretical temperature T3 of the instrument housing based on the instrument housing parameters and the internal temperature T1.

[0024] The heat value measurement module is configured to obtain the heat value Q dissipated by the instrument casing based on the instrument casing parameters, internal temperature T1, external temperature T2 and theoretical temperature T3.

[0025] The ambient temperature theoretical value acquisition module is configured to obtain the theoretical value T0 of the ambient temperature based on the heat value Q dissipated outward from the instrument casing.

[0026] The instrument ambient temperature acquisition module is configured to obtain the instrument ambient temperature based on the theoretical value T0 of the ambient temperature.

[0027] Furthermore, in one embodiment, the instrument can be a portable instrument.

[0028] Thirdly, embodiments of this disclosure also provide a readable storage medium storing a program corresponding to an instrument temperature measurement method, wherein when the program is executed by a processor, it implements the steps of the instrument temperature measurement method as described in the first aspect.

[0029] In this disclosure, the internal temperature T1 and external temperature T2 of the instrument housing are obtained, and combined with the instrument housing parameters, the heat value Q dissipated by the instrument housing is obtained. Finally, based on the heat value Q dissipated by the instrument housing, the theoretical value T0 of the ambient temperature is obtained, and the actual value T0 of the real-time ambient temperature is obtained based on the pre-fitted value. am The instrument's ambient temperature is obtained by establishing a nonlinear relationship between the ambient temperature and the theoretical value T0. This technique, by combining instrument housing parameters, reveals the influence of the instrument housing on the ambient temperature, thereby enabling ambient temperature compensation and deviation correction, and achieving accurate measurement of the instrument's ambient temperature. Attached Figure Description

[0030] Figure 1 This is a flowchart illustrating the instrument temperature measurement method in one embodiment of the present disclosure;

[0031] Figure 2 This is a schematic diagram showing the location of the temperature sensor in another embodiment of this disclosure;

[0032] Figure 3 This is a schematic diagram of the process for obtaining the theoretical temperature of the instrument housing in another embodiment of this disclosure;

[0033] Figure 4 This is a schematic diagram of the functional modules of the instrument temperature measuring device in another embodiment of the present disclosure;

[0034] Figure 5 This is a schematic diagram of the hardware structure of the temperature measurement device involved in the embodiments of this disclosure. Detailed Implementation

[0035] To enable those skilled in the art to better understand the present disclosure, the technical solutions of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present disclosure, and not all embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present disclosure.

[0036] When conducting experiments, instruments are typically used, and the ambient temperature of these instruments can affect the accuracy of the experimental results. Therefore, it is necessary to measure the ambient temperature of the instruments. Some instruments use the readings from the ambient temperature sensor as the true ambient temperature value, while others use the temperature readings from the gas path. However, both methods completely ignore the influence of thermal radiation and heat conduction on the ambient temperature sensor, thus affecting the measured ambient temperature value.

[0037] For example, some portable instruments use the ambient temperature value read when the instrument is turned on as the ambient temperature value throughout the entire use process, completely ignoring the actual changes in ambient temperature.

[0038] When the instrument generates less heat, changes in ambient temperature may have a smaller impact on the experimental results. However, when the instrument generates more heat, the difference between the actual and measured ambient temperatures can reach up to 10°C. This can significantly affect the accurate measurement of the instrument's operating flow rate and thus the precision of the experimental results.

[0039] To address the aforementioned issues, this disclosure provides an instrument temperature measurement method, apparatus, and readable storage medium. By pre-determining the parameter characteristics of the instrument housing, deviations in ambient temperature can be corrected and compensated, thereby accurately obtaining the instrument's ambient temperature value.

[0040] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0041] like Figure 1 As shown in one specific embodiment, this disclosure provides an instrument temperature measurement method, which may include the following steps:

[0042] S1. Obtain the internal temperature T1 and external temperature T2 of the instrument housing;

[0043] The internal temperature T1 of the instrument housing can be measured by a temperature sensor S1 located inside the instrument housing, and the external temperature T2 of the instrument housing can be measured by a temperature sensor S2 located outside the instrument housing. In one embodiment, the temperature sensor S1 can be located on the inner wall of the instrument housing, or it can be located inside the instrument housing but not adjacent to the inner wall; the temperature sensor S2 can be located on the outer wall of the instrument housing, or it can be located outside the instrument housing but not adjacent to the outer wall. Figure 2In the illustrated embodiment, temperature sensor S1 is disposed inside the instrument housing but not adjacent to the inner wall of the housing, while temperature sensor S2 is disposed on the outer wall of the instrument housing. It is worth noting that in this embodiment, temperature sensor S1 can also be disposed inside the instrument housing adjacent to the inner wall of the housing. This embodiment does not specifically limit the position of temperature sensor S1, and those skilled in the art can set it according to actual needs.

[0044] In one embodiment, the instrument can be a portable instrument or a large instrument.

[0045] S2. Based on the instrument housing parameters and the internal temperature T1, obtain the theoretical temperature T3 of the instrument housing;

[0046] In one embodiment, multiple units of the same model can be purchased in bulk, and the physical quantities related to the casing of multiple instruments of the same model are usually the same. Therefore, the parameters of this batch of instrument casings can be determined in advance. For example, parameters such as the material, thickness, mass, and shape of the instrument casings in the same batch can be obtained in advance.

[0047] In one embodiment, such as Figure 3 As shown, step S2 can specifically include:

[0048] S21. Obtain the thermal resistance R and thermal power P of the instrument housing. The thermal resistance R can be determined based on the material and thickness of the instrument housing, and the thermal power P can be determined based on the instrument's power rating. Thermal resistance refers to the ratio between the temperature difference across an object and the power of the heat source when heat is transferred through it, expressed in Kelvin per watt (K / W) or degrees Celsius per watt (°C / W). In another embodiment, the thermal resistance R of the instrument housing can also be determined based on parameters such as the material, thickness, and shape of the instrument housing.

[0049] S22. Based on the thermal resistance R of the instrument casing, the thermal power P, and the internal temperature T1, obtain the theoretical temperature T3 of the instrument casing. When the instrument is not performing external operations, the instrument's power can be used as the thermal power; in this case, the calculated theoretical temperature T3 is the theoretical temperature of the instrument casing when it is not dissipating heat.

[0050] In one embodiment, the theoretical temperature T3 of the instrument housing can be obtained according to the formula R = (T1 - T3) / P.

[0051] S3. Based on the instrument casing parameters, internal temperature T1, external temperature T2, and theoretical temperature T3, obtain the heat dissipation value Q of the instrument casing.

[0052] In one embodiment, the heat value Q dissipated by the instrument casing can be obtained according to the formula Q = c * m * {(T1-T2) - (T1-T3)} / 2, where c is the specific heat capacity of the instrument casing and m is the mass of the instrument casing. Specific heat capacity, also known as specific heat, is the heat capacity per unit mass of a substance, that is, the heat absorbed or released when a unit mass of an object changes its temperature by one unit. {(T1-T2) - (T1-T3)} / 2 can be used as the temperature decrease caused by the instrument casing dissipating heat.

[0053] S4. Based on the heat value Q emitted by the instrument casing, obtain the theoretical value T0 of the ambient temperature;

[0054] In one embodiment, the theoretical value of the ambient temperature T0 can be obtained according to the Stefan-Boltzmann law. The Stefan-Boltzmann law is a well-known law in thermodynamics, which states that the total power radiated per unit area of ​​a blackbody surface (called the emissivity or energy flux density of the object) j* is proportional to the fourth power of the blackbody's thermodynamic temperature T (also known as the absolute temperature).

[0055] In one embodiment, the Stefan-Boltzmann law formula is Q = 5.67037 * 10 -8 *v*(T2 4 -T0 4 ), where v is a constant value related to the heat dissipation medium.

[0056] S5. Obtain the instrument ambient temperature based on the theoretical value T0 of the ambient temperature.

[0057] In one embodiment, before obtaining the instrument ambient temperature based on the theoretical value T0 of the ambient temperature, the process may further include:

[0058] Real-time acquisition of actual ambient temperature T am Among them, T am It can be obtained in real time by using an ambient temperature meter. In real time, it can be a certain periodic interval, such as 2 minutes as a periodic unit.

[0059] The theoretical value T0 of the ambient temperature and the actual value T of the ambient temperature obtained in real time. am A nonlinear fitting is performed to obtain a nonlinear relationship between the instrument ambient temperature and the theoretical value T0 of the ambient temperature. In one embodiment, the nonlinear fitting can be performed using the least squares method.

[0060] In one embodiment, the fitting formula can be y = AX 3 +BX 2+CX+D, based on the calculated theoretical value of ambient temperature T0 and the real-time measured actual value of ambient temperature T am The parameters A, B, C, and D in the fitting formula can be calculated, where y is f(T0). The fitting formula can be specifically expressed as f(T0) = AT0. 3 +BT0 2 +CT0+D. Therefore, in practical use, based on the theoretical ambient temperature T0 calculated using the formula, the displayed instrument ambient temperature f(T0) can be obtained. This embodiment uses multi-point nonlinear fitting compensation on the derived ambient temperature value to make the data measured by the instrument more accurate.

[0061] In one embodiment, the theoretical value T0 of the ambient temperature and the displayed instrument ambient temperature f(T0) can be recorded according to the fitting formula in 2-minute intervals, as shown in the table below:

[0062] <![CDATA[T2]]> 22.4 23.6 24.9 26 26.6 27.1 27.4 27.8 28.1 28.4 28.6 28.8 29.1 29.3 29.4 <![CDATA[T0]]> 22.5 23.1 23.3 23.6 23.6 23.7 23.8 23.8 23.7 23.6 23.5 23.3 23.1 22.9 22.8 <![CDATA[f(T0)]]> 22.4 22.4 22.5 22.4 22.2 22.2 22.1 22.1 22.1 21.9 22 22 22.1 22.1 22.1

[0063] In another embodiment, due to differences in the uniformity of the instrument housing material and its irregular shape, as well as the potential influence of external convective heat dissipation, the theoretical value T0 of the ambient temperature and the actual value T of the ambient temperature obtained in real time are compared. am Before performing nonlinear fitting, the following may also be included: obtaining the theoretical value T0 and the actual value T of the ambient temperature. am The linear fitting relationship is used to correct the theoretical value T0 of the ambient temperature based on the correlation index of the linear fitting relationship. The linear fitting relationship can be a univariate polynomial regression equation, such as F(T... am )=aT am +b,F(T am This is also known as T0'. Furthermore, the correlation index R of the univariate polynomial regression equation can also be obtained. 2 The correlation index indicates the reliability of the regression equation. A closer correlation index to 1 indicates a better fit of the univariate polynomial regression equation. When the correlation index is greater than or equal to a set value, the fitted univariate polynomial regression equation has a high degree of fit, and the corrected theoretical environmental temperature value T0' can be calculated using this equation. When the correlation index is less than or equal to the set value, the test conditions need to be optimized, and the theoretical environmental temperature value T0 needs to be recalculated. The set value can be set based on experience or according to the required accuracy of the experimental data.

[0064] In summary, the instrument temperature measurement method provided in this disclosure determines the thermal resistance of the instrument housing by using parameters such as material and thickness, and then combines this with thermal power to obtain the influence of the instrument housing heat dissipation on the instrument ambient temperature. By performing dual compensation for the actual ambient temperature through linear fitting and nonlinear fitting, a more accurate instrument ambient temperature can be obtained, thereby improving the accuracy of the results.

[0065] Secondly, this disclosure also provides an instrument temperature measuring device, which can also be applied to portable instruments.

[0066] Figure 4 A schematic diagram of the functional modules of an instrument temperature measuring device in one embodiment of this disclosure is shown.

[0067] Reference Figure 4 In one embodiment, the instrument temperature measurement device includes:

[0068] Temperature sensor S1 10 is used to obtain the internal temperature T1 of the instrument housing;

[0069] Temperature sensor S2 20 is used to obtain the external temperature T2 of the instrument housing;

[0070] The theoretical temperature acquisition module 30 is configured to obtain the theoretical temperature T3 of the instrument housing based on the instrument housing parameters and the internal temperature T1.

[0071] The heat value measurement module 40 is configured to obtain the heat value Q dissipated by the instrument casing based on the instrument casing parameters, internal temperature T1, external temperature T2 and theoretical temperature T3.

[0072] The ambient temperature theoretical value acquisition module 50 is configured to obtain the theoretical value T0 of the ambient temperature based on the heat value Q dissipated outward from the instrument casing.

[0073] The instrument ambient temperature acquisition module 60 is configured to obtain the instrument ambient temperature based on the theoretical value T0 of the ambient temperature.

[0074] In another embodiment, the theoretical temperature acquisition module 30 can be specifically configured to obtain the thermal resistance R and thermal power P of the instrument housing, wherein the thermal resistance R is determined based on the material and thickness of the instrument housing, and the thermal power P is determined based on the instrument power; the theoretical temperature T3 of the instrument housing is obtained based on the thermal resistance R, thermal power P, and internal temperature T1. Specifically, the theoretical temperature T3 of the instrument housing is obtained according to the formula R = (T1 - T3) / P.

[0075] In one embodiment, the heat value Q emitted by the instrument casing can be obtained according to the formula Q=c*m*{(T1-T2)-(T1-T3)} / 2, where c is the specific heat capacity of the instrument casing and m is the mass of the instrument casing.

[0076] In one embodiment, the theoretical value T0 of the ambient temperature can be obtained according to the Stefan-Boltzmann law.

[0077] In another embodiment, the instrument temperature measuring device may further include an ambient thermometer and a nonlinear fitting module, wherein the ambient thermometer is used to obtain the actual ambient temperature value T. am The nonlinear fitting module can be configured to fit the theoretical value T0 of the ambient temperature and the real-time actual value T of the ambient temperature. am Nonlinear fitting is performed to obtain the nonlinear relationship between the instrument ambient temperature and the theoretical value T0 of the ambient temperature.

[0078] In another embodiment, the instrument temperature measuring device may further include a linear fitting module, which can be configured to obtain the theoretical value T0 of the ambient temperature and the actual value T of the ambient temperature. am The linear fitting relationship is used to correct the theoretical value T0 of the ambient temperature based on the correlation index of the linear fitting relationship.

[0079] The functions of each module in the above-mentioned instrument temperature measurement device correspond to the steps in the above-mentioned instrument temperature measurement method embodiment, and their functions and implementation processes will not be described in detail here.

[0080] Thirdly, the present disclosure provides an instrument temperature measuring device, which can be a personal computer (PC), laptop computer, server or other device with data processing capabilities.

[0081] Figure 5 A schematic diagram of the hardware structure of the instrument temperature measurement device involved in the embodiments of this disclosure is shown.

[0082] Reference Figure 5 In this embodiment of the disclosure, the instrument temperature measurement device may include a processor, a memory, a communication interface, and a communication bus.

[0083] The communication bus can be of any type and is used to interconnect the processor, memory, and communication interface.

[0084] The communication interface includes input / output (I / O) interfaces, physical interfaces, and logical interfaces used to interconnect devices within the vehicle operation data processing equipment, as well as interfaces used to interconnect the vehicle operation data processing equipment with other devices (such as other computing devices or user equipment). Physical interfaces can be Ethernet interfaces, fiber optic interfaces, ATM interfaces, etc.; user equipment can be displays, keyboards, etc.

[0085] Memory can be various types of storage media, such as random access memory (RAM), read-only memory (ROM), non-volatile RAM (NVRAM), flash memory, optical storage, hard disk, programmable ROM (PROM), erasable PROM (EPROM), electrically erasable PROM (EEPROM), etc.

[0086] The processor can be a general-purpose processor, which can call the ion chromatography processing program stored in the memory and execute the ion chromatography processing method provided in the embodiments of this disclosure. For example, the general-purpose processor can be a central processing unit (CPU). The method executed when the ion chromatography processing program is called can be referred to in the various embodiments of the ion chromatography processing method of this disclosure, and will not be repeated here.

[0087] Those skilled in the art will understand that Figure 5 The hardware structure shown does not constitute a limitation of this disclosure and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0088] Fourthly, embodiments of this disclosure also provide a readable storage medium.

[0089] This disclosure contains a program stored on a readable storage medium corresponding to an instrument temperature measurement method, wherein when the program is executed by a processor, it implements the steps of the instrument temperature measurement method as described above.

[0090] The method implemented when the program corresponding to the instrument temperature measurement method is executed can be referred to in various embodiments of the instrument temperature measurement method disclosed herein, and will not be repeated here.

[0091] It should be noted that the sequence numbers of the above-mentioned embodiments are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0092] The terms "comprising" and "having," and any variations thereof, in this disclosure, claims, and accompanying drawings are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such processes, methods, products, or apparatus. The terms "first," "second," and "third," etc., are used to distinguish different objects, etc., and do not indicate a sequential order, nor do they limit "first," "second," and "third" to different types.

[0093] In the description of embodiments in this disclosure, terms such as "exemplary," "for example," or "for instance" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplary," "for example," or "for instance" in this disclosure should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary," "for example," or "for instance" is intended to present the relevant concepts in a concrete manner.

[0094] In the description of the embodiments of this disclosure, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The word "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this disclosure, "multiple" means two or more.

[0095] In some processes described in the embodiments of this disclosure, multiple operations or steps are included in a specific order. However, it should be understood that these operations or steps may not be executed in the order they appear in the embodiments of this disclosure, or they may be executed in parallel. The sequence number of the operation is only used to distinguish different operations, and the sequence number itself does not represent any execution order. In addition, these processes may include more or fewer operations, and these operations or steps may be executed sequentially or in parallel, and these operations or steps may be combined.

[0096] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this disclosure, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause a terminal device to execute the methods described in the various embodiments of this disclosure.

[0097] The above are merely preferred embodiments of this disclosure and do not limit the patent scope of this disclosure. Any equivalent structural or procedural transformations made using the content of this disclosure and its drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this disclosure.

Claims

1. A method for measuring instrument temperature, characterized in that, include: Obtain the internal temperature T1 and external temperature T2 of the instrument housing; The theoretical temperature T3 of the instrument housing is obtained based on the thermal resistance R, thermal power P, and internal temperature T1; the theoretical temperature T3 of the instrument housing is obtained according to the formula R=(T1-T3) / P. The heat dissipation value Q of the instrument casing is obtained based on the thermal resistance R, thermal power P, internal temperature T1, external temperature T2, and theoretical temperature T3. The heat dissipation value Q of the instrument casing is obtained according to the formula Q=c*m*{(T1-T2)-(T1-T3)} / 2, where c is the specific heat capacity of the instrument casing and m is the mass of the instrument casing. Based on the heat value Q emitted outward from the instrument casing and the Stefan-Boltzmann law, the theoretical value T0 of the ambient temperature is obtained. The ambient temperature of the instrument is obtained based on the theoretical value T0 of the ambient temperature.

2. The instrument temperature measurement method as described in claim 1, characterized in that, The thermal resistance R of the instrument housing is determined based on the material and thickness of the instrument housing, and the thermal power P is determined based on the power of the instrument.

3. The instrument temperature measurement method as described in claim 1, characterized in that, Before obtaining the instrument ambient temperature based on the theoretical value T0 of the ambient temperature, the following steps are also included: Real-time acquisition of actual ambient temperature T am ; The theoretical value T0 of the ambient temperature and the actual value T of the ambient temperature obtained in real time. am Nonlinear fitting is performed to obtain the nonlinear relationship between the instrument ambient temperature and the theoretical value T0 of the ambient temperature.

4. The instrument temperature measurement method as described in claim 3, characterized in that, The theoretical value T0 of the ambient temperature and the actual value T of the ambient temperature obtained in real time are compared. am Before performing nonlinear fitting, the following steps are required: obtaining the theoretical value T0 and the actual value T of the ambient temperature. am The linear fitting relationship is used to correct the theoretical value T0 of the ambient temperature based on the correlation index of the linear fitting relationship.

5. A temperature measuring device for an instrument, characterized in that, include: Temperature sensor S1 is used to obtain the internal temperature T1 of the instrument housing; Temperature sensor S2 is used to obtain the external temperature T2 of the instrument housing; The theoretical temperature acquisition module is configured to obtain the theoretical temperature T3 of the instrument housing based on the thermal resistance R, thermal power P, and the internal temperature T1; the theoretical temperature T3 of the instrument housing is obtained according to the formula R=(T1-T3) / P. The heat value measurement module is configured to obtain the heat value Q dissipated by the instrument casing based on the thermal resistance R, thermal power P, internal temperature T1, external temperature T2, and theoretical temperature T3 of the instrument casing. The heat value Q dissipated by the instrument casing is obtained according to the formula Q=c*m*{(T1-T2)-(T1-T3)} / 2, where c is the specific heat capacity of the instrument casing and m is the mass of the instrument casing. The ambient temperature theoretical value acquisition module is configured to obtain the theoretical value T0 of the ambient temperature based on the heat value Q dissipated outward from the instrument casing and the Stefan-Boltzmann law. The instrument ambient temperature acquisition module is configured to obtain the instrument ambient temperature based on the theoretical value T0 of the ambient temperature.

6. The instrument temperature measuring device as described in claim 5, characterized in that, The instrument is a portable instrument.

7. A readable storage medium, characterized in that, The readable storage medium stores a program corresponding to the instrument temperature measurement method, wherein when the program is executed by a processor, it implements the steps of the instrument temperature measurement method as described in any one of claims 1 to 4.

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