Stack-based all-solid-state laser radar and control method thereof

CN117970290BActive Publication Date: 2026-09-29NO 27 RES INST CHINA ELECTRONICS TECH GRP
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Patent Information

Application Number
CN202311851975.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-12-29
Publication Date
2026-09-29
Estimated Expiration
2043-12-29

AI Technical Summary

Technical Problem

该装置虽然实现了OPA激光雷达的集成小型化,但是其非堆栈式的布局结构使得小型化程度并不足以满足微小型激光雷达的发展需要

Benefits of technology

步骤6:将所述包含目标信息的模拟电信号进行放大、采集滤波处理,转变为包含目标信息的数字电信号;

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a kind of based on stack full solid laser radar and its control method, including the emission receiving layer of TSV optoelectronic vertical interconnection, signal processing and control circuit layer, integrated control and information processing layer, thermal management and interface control layer and thermal management implementation and interface layer;Emission receiving layer includes narrow linewidth linear frequency modulation light source, silicon-based optical phased array transmitting antenna and coherent receiving unit;Signal processing and control circuit layer includes amplification and readout circuit, AD acquisition unit and two-dimensional scanning control unit, two-dimensional scanning control unit is used to carry out phase modulation to the scanning beam of silicon-based optical phased array transmitting antenna;Integrated control and information processing layer includes FMCW information processing unit for obtaining target three-dimensional detection information and integrated control unit for controlling laser tuning.The application forms stack multi-layer component structure form layout by optoelectronic vertical interconnection and hybrid integration, realizes the miniaturization of laser radar system.
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Description

Technical Field

[0001] This invention relates to the field of all-solid-state lidar technology, and in particular to a stack-based all-solid-state lidar and its control method. Background Technology

[0002] LiDAR (Light Detection and Ranging) is a device that uses laser beams to detect objects and their trajectories, and can create three-dimensional images of these objects. LiDAR emits a laser beam and precisely detects the reflection time, imaging and tracking objects within its detection range. Currently, LiDAR, with its advantages of high resolution, strong anti-interference capability, and good concealment, has wide applications in precision measurement, reconnaissance and surveillance, space rendezvous and docking, landing obstacle avoidance, and remote sensing, and has always been a key research focus and hot topic worldwide.

[0003] However, most existing lidar beam pointing control methods employ mechanical scanning. Achieving fast and accurate mechanical scanning requires a sophisticated and robust mechanical rotating structure, inevitably leading to a large and cumbersome system. Furthermore, due to the complexity of the control circuitry in mechanical scanning systems, most systems exhibit slow response times and low scanning accuracy. In contrast to mechanical scanning, optical phased array (OPA) lidar significantly improves reliability by achieving full micro-light integration from transmission and scanning to reception.

[0004] Chinese invention patent CN114002703A discloses a three-dimensional imaging all-solid-state lidar device, which employs an optical phased array emitting chip and a laser receiving chip. The emitting chip converts the laser beam array into a scanning beam with a phase difference. The scanning beam is transmitted through an optical lens system and then illuminates the target object. The laser echo signal reflected by the target object is transmitted through the optical lens system and received by the laser receiving chip. Although this device achieves integrated miniaturization of the OPA lidar, its non-stacked layout structure means that the miniaturization level is insufficient to meet the development needs of micro-miniature lidar.

[0005] Therefore, the future demand for environmental detection mainly lies in enhancing the lightweight, integrated, and all-solid-state capabilities of micro-miniature environmental situational awareness lidar or optoelectronic detection systems, and research on stacked all-solid-state lidar technology has become an indispensable direction. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and improve the miniaturization, micro-miniaturization and all-solid-state capability of lidar or detection equipment, and to provide a stack-based all-solid-state lidar and its control method.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A stack-based all-solid-state lidar includes: a transmission and reception layer, a signal processing and control circuit layer, an integrated control and information processing layer, a thermal management and interface control layer, and a thermal management implementation and interface layer; The transmit-receive layer is used to transmit a beam scanning signal generated by phase modulation to the target object and receive the echo laser signal reflected from the target object. The echo laser signal is coherently mixed and converted into an analog electrical signal containing target information. The transmit-receive layer includes a silicon-based optical phased array transmitting antenna. The signal processing and control circuit layer is used to amplify, filter and collect the analog electrical signal containing target information and convert it into a digital electrical signal containing target information, and to perform phase modulation control on the transmission and reception layer after receiving the two-dimensional scanning command. The integrated control and information processing layer is used to calculate and process the digital electrical signal containing target information to obtain the three-dimensional detection information of the target area, to output laser emission commands for laser emission control in the transmission and reception layer, and to output two-dimensional scanning commands for two-dimensional scanning control in the signal processing and control circuit layer. The transmit / receive layer, signal processing and control circuit layer, integrated control and information processing layer, thermal management and interface control layer, and thermal management implementation and interface layer are all connected via TSV optoelectronic vertical interconnect components.

[0008] This invention employs a layered layout structure, integrating the transmit / receive antenna layer, the silicon-based substrate control circuit layer, the integrated information processing layer, the thermal management and external communication interface control layer, and the thermal management and external communication interface layer through optoelectronic vertical interconnection and hybrid integration. This results in a stacked, multi-layered component structure, achieving miniaturized integration of optoelectronic devices in the lidar system. Furthermore, this invention utilizes an electrically controlled scanning beam pointing control method based on a silicon-based optical phased array, featuring simple structure, light weight, high stability, random angle deflection, and dynamic real-time angle control. It also offers advantages such as high resolution, high accuracy, and electrically programmable multi-beam control.

[0009] Preferably, the transmit-receive layer further includes a narrow-linewidth linear frequency modulated (LFM) light source and a coherent receiving unit. The LFM light source is used to output a first continuously frequency modulated (CFDM) laser signal and a second CFDM laser signal. The silicon-based optical phased array transmitting antenna is used to split the first CFDM laser signal and generate a beam scanning signal after phase modulation, and then transmit the beam scanning signal to the target object. The coherent receiving unit includes a receiving antenna, which is used to receive the echo laser signal reflected from the target object. The second CFDM laser signal is delayed by an adjustable delay unit and used as a local oscillator laser signal. The coherent receiving unit performs coherent mixing of the echo laser signal according to the local oscillator laser signal and converts the mixed optical signal into an analog electrical signal containing target information.

[0010] Preferably, the narrow linewidth linear frequency modulated light source includes a semiconductor laser, an SOA amplifier, and a first MMI beam splitter. The output terminal of the semiconductor laser is connected to the input terminal of the SOA amplifier. The semiconductor laser is used to output a continuously frequency modulated laser signal. The SOA amplifier is used to amplify the continuously frequency modulated laser signal. The first MMI beam splitter is used to split the amplified continuously frequency modulated laser signal into a first continuously frequency modulated laser signal and a second continuously frequency modulated laser signal.

[0011] Preferably, the silicon-based optical phased array transmitting antenna includes an MMI beam splitter group, a phase shifter, and a grating radiating antenna. The first continuously frequency modulated laser signal is split into multiple beams by the MMI beam splitter group. The multiple beams are transmitted to the phase shifter through a silicon photonic waveguide array. The control signal input terminal of the phase shifter is connected to the phase modulation signal output terminal of the two-dimensional scanning control unit. The multiple beams are converted into beam scanning signals by the phase shifter and transmitted to the grating radiating antenna by the silicon photonic waveguide array. The grating radiating antenna is used to emit beam scanning signals to the target object.

[0012] This invention employs silicon-based optical phased array technology, which enables two-dimensional optical phase control on a chip, achieving two-dimensional beam scanning for chip-based lidar. The fabrication process is compatible with CMOS, making the optical array easy to manufacture.

[0013] Preferably, the coherent receiving unit further includes a grating coupling array, an optical mixer, an adjustable delay unit, and a balanced detector. The grating coupling array is used to couple the input echo laser signal. The optical mixer is used to mix the coupled input echo laser signal with the local oscillator laser signal to generate a mixed echo laser signal. The balanced detector is used to perform photoelectric conversion on the mixed echo laser signal and output an analog electrical signal containing target information.

[0014] Preferably, the signal processing and control circuit includes an amplification and readout circuit, an AD acquisition unit, and a two-dimensional scanning control unit. The input terminal of the amplification and readout circuit is connected to the analog electrical signal output terminal of the coherent receiving unit, and the output terminal of the amplification and readout circuit is connected to the AD acquisition unit. The analog electrical signal containing target information is amplified and acquired sequentially by the amplification and readout circuit and the AD acquisition unit, and then converted into a digital electrical signal containing target information. The phase modulation signal output terminal of the two-dimensional scanning control unit is connected to the phase modulation signal input terminal of the silicon-based optical phased array transmitting antenna. The two-dimensional scanning control unit is used to perform phase modulation control on the silicon-based optical phased array transmitting antenna after receiving a two-dimensional scanning command.

[0015] Preferably, the integrated control and information processing layer includes an integrated control unit and an FMCW information processing unit. The integrated control unit is connected to the FMCW information processing unit. The laser emission command output terminal of the integrated control unit is connected to the input terminal of the narrow linewidth linear frequency modulated light source. The two-dimensional scanning command output terminal of the integrated control unit is connected to the input terminal of the two-dimensional scanning control unit. The FMCW information processing unit is used to calculate and process the digital electrical signal containing target information to obtain three-dimensional detection information of the target area.

[0016] A stack-based all-solid-state lidar control method includes the following steps: Step 1: Based on the spatial scanning and detection commands issued by the system, the integrated control unit issues laser emission commands and two-dimensional scanning commands; Step 2: Parse the laser emission command into laser emission control parameters, and parse the two-dimensional scanning command into two-dimensional phased array scanning parameters; Step 3: Generate frequency-modulated continuous light according to the laser emission control parameters, and split the frequency-modulated continuous light into a local oscillator beam and a probe beam; Step 4: Control the phased scanning system to work according to the two-dimensional phased scanning parameters. The phased scanning system is used to output phased scanning drive signals, input the detection beam to the silicon-based optical phased array transmitting antenna, generate beam scanning signals through two-dimensional phased scanning control, and transmit the beam scanning signals to the target object. Step 5: The echo beam reflected back by the target object and the local oscillator beam are coherently mixed and photoelectrically converted into an analog electrical signal containing target information; Step 6: Amplify, collect, and filter the analog electrical signal containing the target information to convert it into a digital electrical signal containing the target information; Step 7: Calculate and process the digital electrical signal containing the target information to obtain the three-dimensional detection information of the target area.

[0017] The beneficial effects of this invention are as follows: Compared with traditional spatial optical interconnects or fiber optic interconnects, this invention achieves high integration and low loss interconnection of optical devices based on silicon-based optical waveguide coupling technology; through TSV-based multi-layer stacking and fine rewiring technology, it achieves stacked all-solid-state lidar optoelectronic microsystem packaging that is different from the traditional method of connecting optoelectronic devices with wire harnesses or large connectors, which greatly reduces the product size, improves the system integration, and realizes the micro-miniature all-solid-state integration of the system. Attached Figure Description

[0018] The following is a detailed description of a stack-based all-solid-state lidar and its control method provided by the present invention, with reference to the accompanying drawings: Figure 1 A schematic diagram of the external shape of a stacked all-solid-state lidar according to the present invention; Figure 2 This is a schematic diagram of the internal structure of a stacked all-solid-state lidar according to the present invention; Figure 3 This is a schematic diagram of the layered structure of the signal processing and control circuit of a stacked all-solid-state lidar according to the present invention; Figure 4 This is a schematic diagram illustrating the integrated control and information processing layering of a stacked all-solid-state lidar based on the present invention. Figure 5 This is a schematic diagram of the thermal management and interface control layering of a stacked all-solid-state lidar according to the present invention; Figure 6 This is a block diagram illustrating the working principle of a stacked all-solid-state lidar according to the present invention. Figure 7 This is a flowchart illustrating the operation of a stacked all-solid-state lidar based on the present invention. Figure 8 This is a flowchart of a stack-based all-solid-state lidar control method according to the present invention.

[0019] Figure Label Explanation: 1-Transmitter / Receiver Layer; 2-Signal Processing and Control Circuit Layer; 3-Integrated Control and Information Processing Layer; 4-Thermal Management and Interface Control Layer; 5-Thermal Management Implementation and Interface Layer; 6-TSV Optoelectronic Vertical Interconnect Component; 101-Narrow Linewidth Linear Frequency Modulated Light Source; 1011-Semiconductor Laser; 1012-SOA Amplifier; 1013-First MMI Beam Splitter; 102-Silicon-based Optical Phased Array Transmitting Antenna; 1021-MMI Beam Splitter Group; 1022-Phase Shifter; 1023-Grating Radiation Amplifier Line; 103-Coherent receiving unit; 1031-Receiving antenna; 1032-Grate coupling array; 1033-Optical mixer; 1034-Balanced detector; 1035-Adjustable delay unit; 201-Amplification and readout circuit; 202-AD acquisition unit; 203-Two-dimensional scanning control unit; 301-FMCW information processing unit; 302-Integrated control unit; 401-Thermal management control unit; 402-External interface control unit; 501-Thermal management implementation unit; 502-External interface unit. Detailed Implementation

[0020] like Figures 1 to 6 As shown, the present invention provides a stacked all-solid-state lidar, comprising: a transmission and reception layer 1, a signal processing and control circuit layer 2, a comprehensive control and information processing layer 3, a thermal management and interface control layer 4, and a thermal management implementation and interface layer 5. Transmitter-receiver layer 1 is used to transmit a phase-modulated beam scanning signal to the target and receive the echo laser signal reflected from the target. The echo laser signal is coherently mixed and converted into an analog electrical signal containing target information. The signal processing and control circuit layer 2 is used to amplify, filter and acquire the analog electrical signal containing target information, and then convert it into a digital electrical signal containing target information. After receiving the two-dimensional scanning command, it performs phase modulation control on the transmit and receive layer 1. The integrated control and information processing layer 3 is used to calculate and process digital electrical signals containing target information to obtain three-dimensional detection information of the target area, to output laser emission commands from the transmission and reception layer 1 for laser emission control, and to output two-dimensional scanning commands from the signal processing and control circuit layer 2 for two-dimensional scanning control. The transmit / receive layer 1, signal processing and control circuit layer 2, integrated control and information processing layer 3, thermal management and interface control layer 4, and thermal management implementation and interface layer 5 are all connected via TSV optoelectronic vertical interconnect components 6.

[0021] In this embodiment, the transmit-receive layer 1 includes a narrow linewidth linear frequency modulated light source 101, a silicon-based optical phased array transmit antenna 102, and a coherent receive unit 103.

[0022] like Figure 2 and Figure 6 As shown, the narrow linewidth linear frequency modulated light source 101 includes a semiconductor laser 1011, an SOA amplifier 1012, and a first MMI beam splitter 1013. The output terminal of the semiconductor laser 1011 is connected to the input terminal of the SOA amplifier 1012. After generating a continuous frequency modulated laser signal, the semiconductor laser 1011 outputs it. The SOA amplifier 1012 amplifies the continuous frequency modulated laser signal. The first MMI beam splitter 1013 receives the amplified continuous frequency modulated laser signal and splits it into a first continuous frequency modulated laser signal and a second continuous frequency modulated laser signal.

[0023] like Figure 2 and Figure 6 As shown, the silicon-based optical phased array transmitting antenna 102 includes an MMI beam splitter group 1021, a phase shifter 1022, and a grating radiating antenna 1023. The first continuously modulated laser signal is split into multiple beams by the MMI beam splitter group 1021. These multiple beams are transmitted to the phase shifter 1022 via a silicon photonic waveguide array. The control signal input terminal of the phase shifter 1022 is connected to the phase modulation signal output terminal of the two-dimensional scanning control unit 203. After the phase of the multiple beams is modulated by the phase shifter, they become beam scanning signals, which are transmitted to the grating radiating antenna 1023 via the silicon photonic waveguide array. The grating radiating antenna 1023 is used to emit the beam scanning signal to the target object. This embodiment employs silicon-based optical phased array technology, enabling two-dimensional optical phase control functions to be implemented on a chip, achieving two-dimensional beam scanning for chip-based lidar. The fabrication process is compatible with CMOS, making the optical array easy to manufacture.

[0024] like Figure 2 and Figure 6 As shown, the coherent receiving unit 103 includes a receiving antenna 1031, a grating coupling array 1032, an adjustable delay unit 1035, an optical mixer 1033, and a balanced detector 1034. The receiving antenna 1031 receives the echo laser signal reflected from the target object, and the echo laser signal is coupled to the optical mixer 1033 via the grating coupling array 1032. Simultaneously, the second continuously frequency-modulated laser signal, delayed by the adjustable delay unit 1035, is input to the optical mixer 1033 as a local oscillator laser signal. The optical mixer 1033 mixes the coupled echo laser signal according to the local oscillator laser signal to generate a mixed echo laser signal. The balanced detector 1034 performs photoelectric conversion on the mixed echo laser signal and outputs an analog electrical signal containing target information.

[0025] In this embodiment, as Figure 3 and Figure 6As shown, the signal processing and control circuit layer 2 includes an amplification and readout circuit 201, an AD acquisition unit 202, and a two-dimensional scanning control unit 203. The input terminal of the amplification and readout circuit 201 is connected to the analog electrical signal output terminal of the coherent receiving unit 103, and the output terminal of the amplification and readout circuit 201 is connected to the AD acquisition unit 202. The analog electrical signal containing target information is amplified and acquired by the amplification and readout circuit 201 and the AD acquisition unit 202 in sequence and then converted into a digital electrical signal containing target information. The phase modulation signal output terminal of the two-dimensional scanning control unit 203 is connected to the phase modulation signal input terminal of the silicon-based optical phased array transmitting antenna 102. After receiving the two-dimensional scanning command, the two-dimensional scanning control unit 203 performs phase modulation control on the phase shifter 1022 of the silicon-based optical phased array transmitting antenna 102.

[0026] In this embodiment, as Figure 4 and Figure 6 As shown, the integrated control and information processing layer 3 includes an integrated control unit 302 and an FMCW information processing unit 301. The integrated control unit 302 is connected to the FMCW information processing unit 301. The laser emission command output terminal of the integrated control unit 302 is connected to the input terminal of the narrow linewidth linear frequency modulated light source 101. The two-dimensional scanning command output terminal of the integrated control unit 302 is connected to the input terminal of the two-dimensional scanning control unit 203. The FMCW information processing unit 301 is used to calculate and process the digital electrical signal containing target information to obtain the three-dimensional detection information of the target area.

[0027] This invention employs a layered layout structure, integrating the transmit / receive antenna layer, the silicon-based substrate control circuit layer, the integrated information processing layer, the thermal management and external communication interface control layer, and the thermal management and external communication interface layer through optoelectronic vertical interconnection and hybrid integration. This results in a stacked, multi-layered component structure, achieving miniaturized integration of optoelectronic devices in the lidar system. Furthermore, this invention utilizes an electrically controlled scanning beam pointing control method based on a silicon-based optical phased array, characterized by its simple structure, light weight, and high stability. It can dynamically and in real-time control the beam scanning angle while also offering advantages such as high resolution, high accuracy, and electrically programmable multi-beam control.

[0028] The specific working process of this invention is as follows: Figure 6 and Figure 7As shown, after the invention is started, the system first issues a spatial scanning and detection command. The integrated control unit 302 sends a two-dimensional scanning command to the two-dimensional scanning control unit 203, and the integrated control unit 302 sends a laser emission command to the narrow linewidth linear frequency modulated light source 101. The semiconductor laser 1011 in the narrow linewidth linear frequency modulated light source 101 generates a continuously frequency modulated laser signal with a linear frequency after being driven and controlled by the laser by the integrated control unit 302. The integrated control unit 302 achieves wavelength tuning control by controlling the narrow linewidth linear frequency modulated light source 101, thereby realizing vertical scanning.

[0029] The continuously frequency modulated laser signal is amplified by SOA amplifier 1012, and then split into two beams by first MMI beam splitter 1013, namely a first continuously frequency modulated laser signal and a second continuously frequency modulated laser signal. The first continuously frequency modulated laser signal is transmitted as a probe beam to silicon-based optical phased array transmitting antenna 102.

[0030] Meanwhile, upon receiving the two-dimensional scanning command from the integrated control unit 302, the two-dimensional scanning control unit 203 parses the scanning command into phased array scanning information through its internal program and generates phased array scanning parameters. Based on the generated phased array scanning parameters, the two-dimensional scanning control unit generates and outputs scanning control drive signals.

[0031] Subsequently, the silicon-based optical phased array transmitting antenna 102 receives the first continuously frequency-modulated laser signal, which is then split into multiple beams by the MMI beam splitter group 1021 and transmitted to the phase shifter 1022 via the silicon photonic waveguide array. The two-dimensional scanning control unit 203 starts operating according to the applied scanning control drive signal. Based on the drive loading strategy, it controls the phase shifter 1022 of the silicon-based optical phased array transmitting antenna 102 to perform phase control to achieve horizontal scanning, generating a beam scanning signal. This signal is transmitted by the silicon photonic waveguide array to the grating radiating antenna 1023, which outputs the beam scanning signal to the target object. By controlling the frequency and phase of the scanning beam, vertical and horizontal scanning are achieved, thereby realizing the scanning of the entire predetermined field of view.

[0032] The second continuously frequency modulated laser signal from the narrow-linewidth linear frequency modulated light source 101, after passing through the first MMI beam splitter 1013, is transmitted to the optical mixer 1033 as the local oscillator laser signal via the adjustable delay unit 1035. The echo laser signal reflected from the target is received by the receiving antenna 1031, coupled to the optical mixer 1033 via the grating coupling array 1032, and coherently mixed with the local oscillator laser signal in the coherent receiving unit 103 via the optical mixer 1033. Then, the mixed optical signal is converted into an analog electrical signal containing target information by the balanced detector 1034.

[0033] The analog electrical signal output by the coherent receiving unit 103 is amplified and readout by the circuit 201 before entering the high-speed AD acquisition unit 202. Through acquisition and processing by the AD acquisition unit 202, a digital electrical signal containing target information is obtained and then transmitted to the FMCW information processing unit 301. The FMCW information processing unit 301 calculates the target's distance and velocity, and, combined with the two-dimensional addressing of the receiving antenna array, obtains the target's azimuth and elevation information, thereby achieving three-dimensional detection and perception of the target area.

[0034] Compared to traditional spatial optical interconnects or fiber optic interconnects, this invention achieves high-integration, low-loss interconnection of optical devices based on silicon-based optical waveguide coupling technology. Through TSV-based multi-layer stacking and fine rewiring technology, it realizes a stacked all-solid-state lidar optoelectronic microsystem package that differs from the traditional method of connecting optoelectronic devices with wire harnesses or large connectors. This greatly reduces product size, improves system integration, and achieves micro-miniature all-solid-state integration of the system.

[0035] Meanwhile, the application of stacked optoelectronic highly integrated technology and optical phased arrays enables the realization of detection systems that are simple in structure, small in size, and lightweight. The all-solid-state system configuration has high stability and environmental adaptability, and possesses excellent overall performance, impact resistance, operational flexibility, and high cost-effectiveness. Therefore, this invention can be applied not only to the field of lidar, but also to fields such as enhanced situational awareness, biomedical imaging, 3D holographic display, and ultra-high data rate communication.

[0036] This invention also provides a stack-based all-solid-state lidar control method, such as... Figure 8 As shown, it includes the following steps: Step 1: Based on the spatial scanning and detection commands issued by the system, the integrated control unit issues laser emission commands and two-dimensional scanning commands; Step 2: Parse the laser emission command into laser emission control parameters, and parse the two-dimensional scanning command into two-dimensional phased array scanning parameters; Step 3: Generate frequency-modulated continuous light according to the laser emission control parameters, and split the frequency-modulated continuous light into a local oscillator beam and a probe beam; Step 4: Control the operation of the phased scanning system according to the two-dimensional phased scanning parameters. The phased scanning system is used to output the phased scanning drive signal, input the detection beam to the silicon-based optical phased array transmitting antenna, generate the beam scanning signal through the two-dimensional phased scanning control, and transmit the beam scanning signal to the target object. Step 5: The echo beam reflected back from the target object is coherently mixed with the local oscillator beam and then photoelectrically converted into an analog electrical signal containing target information. Step 6: Amplify, collect, and filter the analog electrical signal containing the target information to convert it into a digital electrical signal containing the target information; Step 7: Calculate and process the digital electrical signal containing the target information to obtain the three-dimensional detection information of the target area.

[0037] For an introduction to the stack-based all-solid-state lidar control method provided by the present invention, please refer to the above-described device embodiments; the present invention will not be described in detail here.

[0038] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A stack-based all-solid-state lidar, characterized in that, include: Transmitter and receiver layering, signal processing and control circuit layering, integrated control and information processing layering, thermal management and interface control layering, and thermal management implementation and interface layering; The transmit-receive layer is used to transmit a beam scanning signal generated by phase modulation to the target object and receive the echo laser signal reflected from the target object. The echo laser signal is coherently mixed and converted into an analog electrical signal containing target information. The transmit-receive layer includes a silicon-based optical phased array transmitting antenna. The signal processing and control circuit layer is used to amplify, filter and collect the analog electrical signal containing target information and convert it into a digital electrical signal containing target information, and to perform phase modulation control on the transmission and reception layer after receiving the two-dimensional scanning command. The integrated control and information processing layer is used to calculate and process the digital electrical signal containing target information to obtain the three-dimensional detection information of the target area, to output laser emission commands for laser emission control in the transmission and reception layer, and to output two-dimensional scanning commands for two-dimensional scanning control in the signal processing and control circuit layer. The transmit / receive layer, signal processing and control circuit layer, integrated control and information processing layer, thermal management and interface control layer, and thermal management implementation and interface layer are all connected via TSV optoelectronic vertical interconnect components.

2. The stack-based all-solid-state lidar according to claim 1, characterized in that, The transmit-receive layer further includes a narrow-linewidth linear frequency modulated (LFM) light source and a coherent receiving unit. The LFM light source is used to output a first continuously frequency modulated (CFDM) laser signal and a second CFDM laser signal. The silicon-based optical phased array transmitting antenna is used to split the first CFDM laser signal and generate a beam scanning signal after phase modulation, and then transmit the beam scanning signal to the target. The coherent receiving unit includes a receiving antenna, which is used to receive the echo laser signal reflected from the target. The second CFDM laser signal is delayed by an adjustable delay unit and used as a local oscillator laser signal. The coherent receiving unit performs coherent mixing of the echo laser signal according to the local oscillator laser signal and converts the mixed optical signal into an analog electrical signal containing target information.

3. The stack-based all-solid-state lidar according to claim 2, characterized in that, The signal processing and control circuit is layered into an amplification and readout circuit, an AD acquisition unit, and a two-dimensional scanning control unit. The input terminal of the amplification and readout circuit is connected to the analog electrical signal output terminal of the coherent receiving unit, and the output terminal of the amplification and readout circuit is connected to the AD acquisition unit. The analog electrical signal containing target information is amplified and acquired sequentially by the amplification and readout circuit and the AD acquisition unit and then converted into a digital electrical signal containing target information. The phase modulation signal output terminal of the two-dimensional scanning control unit is connected to the phase modulation signal input terminal of the silicon-based optical phased array transmitting antenna. The two-dimensional scanning control unit is used to perform phase modulation control on the silicon-based optical phased array transmitting antenna after receiving a two-dimensional scanning command.

4. A stack-based all-solid-state lidar according to claim 3, characterized in that, The integrated control and information processing layer includes an integrated control unit and an FMCW information processing unit. The integrated control unit is connected to the FMCW information processing unit. The laser emission command output terminal of the integrated control unit is connected to the input terminal of the narrow linewidth linear frequency modulated light source. The two-dimensional scanning command output terminal of the integrated control unit is connected to the input terminal of the two-dimensional scanning control unit. The FMCW information processing unit is used to calculate and process the digital electrical signal containing target information to obtain three-dimensional detection information of the target area.

5. A stack-based all-solid-state lidar according to claim 2, characterized in that, The narrow linewidth linear frequency modulated light source includes a semiconductor laser, an SOA amplifier, and a first MMI beam splitter. The output terminal of the semiconductor laser is connected to the input terminal of the SOA amplifier. The semiconductor laser is used to output a continuously frequency modulated laser signal. The SOA amplifier is used to amplify the continuously frequency modulated laser signal. The first MMI beam splitter is used to split the amplified continuously frequency modulated laser signal into a first continuously frequency modulated laser signal and a second continuously frequency modulated laser signal.

6. A stack-based all-solid-state lidar according to claim 3, characterized in that, The silicon-based optical phased array transmitting antenna includes an MMI beam splitter group, a phase shifter, and a grating radiating antenna. The first continuously frequency modulated laser signal is split into multiple beams by the MMI beam splitter group. The multiple beams are transmitted to the phase shifter through a silicon photonic waveguide array. The control signal input terminal of the phase shifter is connected to the phase modulation signal output terminal of the two-dimensional scanning control unit. After the phase of the multiple beams is modulated by the phase shifter, they become a beam scanning signal, which is transmitted to the grating radiating antenna by the silicon photonic waveguide array. The grating radiating antenna is used to emit the beam scanning signal to the target object.

7. A stack-based all-solid-state lidar according to claim 3, characterized in that, The coherent receiving unit further includes a grating coupling array, an optical mixer, an adjustable delay unit, and a balanced detector. The grating coupling array is used to couple the input echo laser signal. The optical mixer is used to mix the coupled input echo laser signal with the local oscillator laser signal to generate a mixed echo laser signal. The balanced detector is used to perform photoelectric conversion on the mixed echo laser signal and output an analog electrical signal containing target information.

8. A stack-based all-solid-state lidar control method, applied to the stack-based all-solid-state lidar as described in claim 1, characterized in that, Includes the following steps: Step 1: Based on the spatial scanning and detection commands issued by the system, the integrated control unit issues laser emission commands and two-dimensional scanning commands; Step 2: Parse the laser emission command into laser emission control parameters, and parse the two-dimensional scanning command into two-dimensional phased array scanning parameters; Step 3: Generate frequency-modulated continuous light according to the laser emission control parameters, and split the frequency-modulated continuous light into a local oscillator beam and a probe beam; Step 4: Control the phased scanning system to work according to the two-dimensional phased scanning parameters. The phased scanning system is used to output phased scanning drive signals, input the detection beam to the silicon-based optical phased array transmitting antenna, generate beam scanning signals through two-dimensional phased scanning control, and transmit the beam scanning signals to the target object. Step 5: The echo beam reflected back by the target object and the local oscillator beam are coherently mixed and photoelectrically converted into an analog electrical signal containing target information; Step 6: Amplify, collect, and filter the analog electrical signal containing the target information to convert it into a digital electrical signal containing the target information; Step 7: Calculate and process the digital electrical signal containing the target information to obtain the three-dimensional detection information of the target area.

Citation Information

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