Lamination process and cutting and laminating integrated machine

Abstract

The application relates to a lamination process and a cutting and laminating integrated machine. The lamination process is characterized in that a pole piece distribution process is arranged between a piece manufacturing process and a core manufacturing process. The pole piece distribution process stores pole pieces in a pole piece storage device in a form of interval stacking, and enables the pole pieces to circulate in the pole piece storage device. Therefore, high-speed feeding and discharging of the pole pieces can be realized, the pole pieces are not easily damaged during the feeding and discharging, the distribution of the pole pieces between the piece manufacturing process and the core manufacturing process is high in efficiency and low in damage, and a good foundation for improving the OEE of the lamination equipment is provided. The cutting and laminating integrated machine adopting the lamination process can also realize decoupling of the piece manufacturing process and the core manufacturing process. When any one of the piece manufacturing process and the core manufacturing process fails, the other process can normally operate, the OEE of the lamination equipment is ensured, and the equipment failure rate is reduced.

Description

Technical Field

[0001] This application relates to the field of solar cell manufacturing technology, and in particular to the stacking process and integrated cutting and stacking machine. Background Technology

[0002] A crucial step in lithium-ion battery production is lamination, which involves alternately stacking positive and negative electrode sheets, separated by a separator. This process is repeated multiple times to obtain the desired number of layers and thickness of cells. Currently, there are two main types of integrated cutting and lamination processes: NCSP (Non-Cut-Slice, C-Cut, S-Laminate, P-Hot-Pressure) and NC+SP. NCSP involves four coupled processes; the next process only begins after the previous one is completed. The advantages of NCSP are high Overall Equipment Effectiveness (OEE) and relatively small overall space requirements. However, its disadvantages are significant: a failure in any process requires a shutdown of the entire lamination process, impacting efficiency. NC+SP decouples the cutting and lamination processes. Cut electrode sheets are stored in clips and transported to the lamination process using AGV systems, OHT cranes, or manually, where they are then stacked. The advantage of the NC+SP stacking process is that after the NC and SP processes are decoupled, their actions do not affect each other, thus reducing the failure rate of the entire stacking system. However, the added electrode transfer process requires additional electrode loading and unloading actions in the system, affecting stacking efficiency. Moreover, since the electrodes are stacked in the magazine, friction damage between them is inevitable. Furthermore, the loading and unloading actions also increase the probability of electrode damage. This not only increases the loss of incoming electrode material, but the frequent rejection further affects stacking efficiency.

[0003] Therefore, new stacking processes are needed to achieve stacking with low failure rate, high efficiency, and high yield. Summary of the Invention

[0004] The main objective of this application is to propose a stacking process and a cutting and stacking integrated machine that can achieve stacking with low failure rate, high efficiency, and high yield.

[0005] To achieve the above objectives, a first aspect of this application provides a wafer stacking process, including a wafer fabrication step and a core fabrication step, wherein an electrode distribution step is provided between the wafer fabrication step and the core fabrication step, the electrode distribution step including:

[0006] The electrodes are stored in an electrode storage device in a spaced-out stacked manner and circulate within the electrode storage device;

[0007] When the storage position of the electrode storage device is transferred to the feed side of the electrode storage device, the electrode cut from the electrode manufacturing process is received.

[0008] When the electrode storage device moves from the storage position to the discharge side, the electrode is discharged.

[0009] In one embodiment, it further includes:

[0010] When the electrode storage device receives the first fault signal of the electrode manufacturing process, it stops receiving electrodes when the storage position of the electrode storage device is transferred to the feeding side of the electrode storage device, until the first recovery signal of the electrode manufacturing process is received.

[0011] And / or, when the electrode storage device receives a second fault signal from the core-making process, the electrode feeding stops when the storage position of the electrode storage device is transferred to the discharge side of the electrode storage device, until a second recovery signal from the core-making process is received.

[0012] In one embodiment, the buffer size of the electrode storage device is N1, the number of wafers stacked by the core-making process during a single wafer-making process failure cycle is N2, the number of wafers stacked by the wafer-making process during a single core-making process failure cycle is N3, and N1 > N2 and / or N1 > N3.

[0013] In one embodiment, the time for a single electrode to be transferred from the electrode fabrication process to the electrode distribution process is less than 0.3 seconds, and the time for the electrode distribution process to send out a single electrode is less than 0.7 seconds.

[0014] In one embodiment, when the storage position of the electrode storage device is transferred to the discharge side of the electrode storage device, at least a portion of the electrode body is discharged from the electrode storage device by means of suction when the electrode is discharged.

[0015] To achieve the above objectives, a second aspect of this application provides a wafer-making unit and a core-making unit, wherein an electrode distribution unit is disposed between the wafer-making unit and the core-making unit, and the electrode distribution unit includes:

[0016] An electrode storage device has an inlet side and an outlet side, as well as multiple spaced storage positions, with the electrode stored individually in each of the storage positions.

[0017] A circulating circulation device is used to drive the storage unit to circulate between the inlet side and the outlet side;

[0018] A feeding device is used to receive the electrode sheets cut from the electrode manufacturing process and store the electrode sheets into the storage location;

[0019] The discharge device is used to feed the electrode sheet on the storage position into the core-making unit.

[0020] In one embodiment, the electrode distribution unit is two or more.

[0021] In one embodiment, the storage location has a rigid support, within which there is a non-rigid storage area for storing electrode sheets.

[0022] In one embodiment, the discharge device includes:

[0023] A suction assembly for suctioning at least a portion of the electrode body out of the electrode storage device;

[0024] A receiving assembly for receiving at least a portion of the electrode body and delivering the electrode to the core-making unit.

[0025] In one embodiment, the splicing assembly is at least one of a belt mechanism, a roller assembly, and a robotic gripper.

[0026] The aforementioned stacking process and integrated cutting and stacking machine incorporate an electrode distribution process between the wafer fabrication and core fabrication processes. This process uses an intermittent stacking method to store the electrodes in an electrode storage device, allowing the electrodes to circulate within the storage device. This enables high-speed electrode feeding and discharging with minimal damage during the feeding and discharging process, ensuring efficient and low-damage distribution of electrodes between the wafer fabrication and core fabrication processes. This provides a solid foundation for improving the OEE of the stacking equipment. Furthermore, the integrated cutting and stacking machine employing this process can decouple the wafer fabrication and core fabrication processes. In the event of a failure in either the wafer fabrication or core fabrication process, the other process can continue to operate normally, ensuring the OEE of the stacking equipment while reducing the equipment failure rate. Attached Figure Description

[0027] Figure 1 This is a flowchart of the electrode distribution process in one embodiment.

[0028] Figure 2 This is a schematic diagram of the structure of a die-cutting, cutting, stacking, and hot-pressing integrated machine in one embodiment.

[0029] Figure 3 This is a schematic diagram of the distribution system in some other embodiments.

[0030] Reference numerals: 100, die-cutting unit; 110, die-cutting blade;

[0031] 200. Cutting unit; 210. Cutting blade;

[0032] 300. Stacking unit; 310. Stacking stage;

[0033] 400. Hot pressing unit; 410. Hot press machine;

[0034] 500. Electrode distribution unit; 510. Electrode storage device; 520. Circulation and transfer device; 530. Feeding device; 540. Discharging device; 541. Suction assembly; 542. Receiving assembly; 543. Pushing assembly; 545. Robotic arm; 546. Roller assembly;

[0035] 610, electrode sheet; 620, battery cell. Detailed Implementation

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0042] like Figure 1 As shown, the wafer stacking process provided in this application includes a wafer fabrication step S1, an electrode distribution step S2, and a core fabrication step S3. The electrode distribution step S3 is located between the wafer fabrication step S1 and the core fabrication step S2. It is used to receive the electrode sheets delivered from the wafer fabrication step S1 and provide the positive / negative electrode sheets required for wafer stacking to the core fabrication step S2. Simultaneously, the electrode distribution step S3 also has an electrode buffering function, capable of receiving excess electrode sheets generated by the wafer fabrication step S1, or buffering electrode sheets continuously delivered by the wafer fabrication step S1 during a fault cycle of the core fabrication step S2, to maintain the normal operation of the wafer fabrication step S1 when the core fabrication step S3 fails. Furthermore, based on the electrode distribution step S3 buffering a certain number of electrode sheets, the electrode distribution step S3 can also continuously output electrode sheets to the core fabrication step S3 during a fault cycle of the wafer fabrication step, to maintain the normal operation of the core fabrication step S3 when the wafer fabrication step S2 fails. The following describes... Figure 1 Each process shown is explained.

[0043] (Film production process S1)

[0044] In this process, the electrode sheets required for the battery cell are manufactured. These electrode sheets can be positive, negative, or composite. Each electrode sheet comprises a core made of strip-shaped metal foil, with an active material layer on the surface of the substrate and tabs extending radially outward from the periphery of the substrate. This process may include an electrode sheet cutting step, i.e., cutting the electrode sheet roll coated with active material and with the tabs cut into dimensions required for battery cell production; alternatively, this process may include a die-cutting step and a cutting step, i.e., cutting the electrode sheet roll coated with active material into tabs using die-cutting / laser cutting, and cutting the electrode sheet roll into single pieces using die-cutting / laser cutting. It should be noted that in some embodiments, the order of the tab cutting step and the electrode sheet cutting step can be reversed, i.e., cutting the electrode sheet first and then cutting the tab shape.

[0045] It should be noted that this process is not limited to the cutting and trimming steps mentioned above. It may also include steps such as coating active materials, cleaning electrode tabs, and making electrode tab reinforcing ribs. Other new steps can be added as needed for the sheet-making process, as long as the cutting of the electrode sheet can be completed to form the single electrode sheet required for stacking.

[0046] Furthermore, this process is not particularly limited as long as it can produce the electrode sheets required for the battery cell. For example, pre-fabricated electrode sheets can also be provided.

[0047] (Electrode distribution process S2)

[0048] In this process, the electrodes are stored in an electrode storage device in a spaced-apart stacked manner and circulate within the electrode storage device. Specifically, in the electrode distribution process S2, as follows: Figure 2 As shown, the electrode storage device has multiple spaced storage positions. The electrode storage device has a loading side and a unloading side. These storage positions can circulate within the electrode storage device, and at certain times, the storage positions can circulate to the unloading side's discharge end / the unloading side's inlet end. When a storage position circulates to the unloading side of the electrode storage device, the electrode sheet cut from the sheet-making process (i.e., the electrode sheet from sheet-making process S1) is conveyed to the loading side. When the electrode sheet circulates to the unloading side of the electrode storage device from any empty storage position, it can be received and stored in the storage position. When a storage position circulates to the unloading side of the electrode storage device, the electrode sheet is discharged. That is, when the electrode sheet circulates to the unloading side of the electrode storage device from any storage position containing the electrode sheet, it can be discharged and further received by the core-making process S3 to complete the stacking operation.

[0049] Existing electrode buffering methods include using vacuum suction belts, which involves setting up a long conveyor belt that can simultaneously transport a certain number of electrodes. By controlling the belt speed, buffering is achieved. However, this method significantly impacts stacking efficiency and has a very limited buffer capacity. If the electrode fabrication process malfunctions and stops, the subsequent core-making process is likely to be shut down. Another method uses clips for electrode buffering. After the electrodes are cut in the electrode fabrication stage, a certain number of electrodes are received and stored in clips. Then, the clips containing the electrodes are transferred to the core-making stage via an AGV / OHT transport system or manually. The advantage of using clips and transport for electrode buffering and feeding is that it decouples the electrode fabrication and core-making processes, ensuring that their operation does not interfere with each other and reducing the probability of downtime for the stacking equipment. However, the disadvantages are also obvious. For example, when electrodes are stored in clips in a stacked manner, friction between the electrodes is inevitable, causing electrode damage. Furthermore, during the process of storing and retrieving electrode sheets from the clips, it is necessary to control the speed of electrode sheet storage and retrieval to minimize frictional damage, which in turn affects the OEE (Overall Equipment Effectiveness) of the stacking equipment. Therefore, in this process, by storing the electrode sheets in an interleaved stacking manner in the electrode storage device, frictional damage between the electrode sheets is eliminated during storage and retrieval, thus improving the storage and retrieval speed and consequently increasing the OEE of the stacking equipment. Simultaneously, the interleaved stacking of the electrode sheets effectively reduces / avoids potential frictional damage that may occur when the electrode sheets are buffered in the electrode storage device. Furthermore, the storage positions for storing electrode sheets are circulated within the electrode storage device. Empty storage positions can move to the feed side to quickly receive electrode sheets from the sheet-making process S1, while storage positions containing electrode sheets can move to the discharge side to quickly discharge electrode sheets for efficient stacking in the core-making process S3. The circulation of electrodes within the electrode storage device can improve electrode allocation efficiency, reduce cache pressure on the electrode storage device, increase electrode transfer efficiency, and improve stacking efficiency.

[0050] In this process, the intermittent stacking of electrodes and the cyclical circulation of electrodes enable high-speed storage and retrieval of electrodes, while reducing the requirements for electrode buffer space, thereby achieving high-speed and low-loss allocation of electrodes in a small space.

[0051] It should be noted that there are no particular restrictions on the coupling between the electrode distribution process S2 and the wafer fabrication process S1 and the core fabrication process S3. Preferably, the electrode distribution process S2 can be decoupled from the wafer fabrication process S1 / core fabrication process S3, that is, when the wafer fabrication process S1 fails, the electrode distribution process S2 can still operate normally with the core fabrication process S3; and when the core fabrication process S3 fails, the electrode distribution process S2 can still operate normally with the wafer fabrication process S1. Specifically, when the electrode storage device receives a first fault signal from the wafer fabrication process S1, it stops receiving electrodes when the storage position of the electrode storage device moves to the feed side of the electrode storage device, until it receives a first recovery signal from the wafer fabrication process S1; and / or, when the electrode storage device receives a second fault signal from the core fabrication process S3, it stops feeding electrodes when the storage position of the electrode storage device moves to the discharge side of the electrode storage device, until it receives a second recovery signal from the core fabrication process S3. In other words, when the electrode distribution process S2 receives the first fault signal from the wafer fabrication process S1, it decouples from the wafer fabrication process S1, allowing the electrode distribution process S2 to feed wafers to the core fabrication process normally independently of the wafer fabrication process S1, so as to maintain the normal operation of the core fabrication process; and when the electrode distribution process S2 receives the second fault signal from the core fabrication process S3, it decouples from the core fabrication process S3, allowing the electrode distribution process S2 to receive the electrode sheets delivered by the wafer fabrication process S1 normally independently of the core fabrication process S3.

[0052] Compared with the existing NCSP stacking process, this application, by setting an electrode distribution process S2 between the electrode fabrication process S1 and the core fabrication process S3, can decouple the electrode fabrication process S1 and the core fabrication process S3, allowing the two processes to be executed independently of each other, thus reducing the failure rate of the stacking process. Furthermore, compared with the cartridge + VAG / OHT / manual transfer process, the electrode distribution process S2 provided by this application can achieve high-speed and low-loss storage and retrieval of electrodes, which is beneficial to improving the OEE of the stacking equipment.

[0053] It should also be noted that there is no particular limitation on the number of electrodes that the electrode allocation process S2 can cache. Preferably, the number of electrodes that the electrode allocation process S2 can cache is sufficient to meet the electrode caching requirements of the wafer fabrication process S1 during the failure period of the core fabrication process S3, or the wafer stacking requirements of the core fabrication process S3 during the failure period of the wafer fabrication process S1. Specifically, assuming that the cache size of the electrode storage device in the electrode allocation process S2 is N1, the number of wafers stacked by the core fabrication process during a single wafer fabrication failure period is N2, and the number of wafers stacked by the wafer fabrication process during a single core fabrication failure period is N3, where N1 > N2 and / or N1 > N3. For example, if the stacking efficiency of the core-making process S3 is 0.5s / pcs, and a failure occurs in a certain core-making process S1 for 2 minutes, then within this 2-minute failure period, the number of electrodes required for the core-making process S3 is 240, with 120 positive and 120 negative electrodes, i.e., N2=120. At this time, the buffer size of the electrode storage device N1>120, and can be 130, 140, 150, etc.

[0054] It should be noted that the N1, N2, and N3 electrodes are determined based on various factors such as the equipment's stacking efficiency, OEE, and failure rate. There are no specific limitations here, as long as they can basically meet the normal operation requirements of the wafer fabrication process during the failure period of the core fabrication process / the normal operation requirements of the core fabrication process during the failure period of the wafer fabrication process.

[0055] In addition, in the electrode distribution process S2, by adopting the method of intermittent stacking of electrodes and the circulation of electrodes, the time for a single electrode to be transferred from the electrode preparation process S1 to the electrode distribution process S2 is less than 0.3 seconds, and the time for a single electrode to be sent out in the electrode distribution process S2 is less than 0.7 seconds. That is, the electrode storage efficiency can be achieved within 0.3s / pcs, and the electrode retrieval efficiency can be achieved within 0.7s / pcs.

[0056] To achieve the aforementioned high efficiency in electrode storage and retrieval, the electrode storage method in electrode distribution step S2 can employ a vacuum adsorption blowing belt for feeding. Specifically, the vacuum adsorption blowing belt has a belt assembly with an adsorption chamber and adsorption holes / gap on the belt. The lower part of the belt body connected to the discharge side of the belt assembly is connected to the adsorption chamber. A blowing component is positioned adjacent to the lower part of the belt body connected to the adsorption chamber. When the electrode vacuum adsorption blowing belt receives an electrode, it quickly transports it to the blowing position of the electrode vacuum adsorption blowing belt, where the blowing component rapidly blows the electrode away from the belt body, causing it to fall into the storage position of the electrode storage device.

[0057] The electrode is made of foil, which is lightweight and thin. By using a vacuum adsorption air blowing belt for feeding, the electrode can be adsorbed onto the belt during rapid transportation. Furthermore, by adding an air blowing component, the vacuum adsorption force between the electrode and the belt can be quickly broken, and the electrode can be quickly dropped into the storage position of the electrode storage device, thereby achieving rapid storage of the electrode.

[0058] The electrode sheets can be removed using a suction method, combined with pushing, pulling, drawing, and suction actions. Specifically, the electrode sheets are first removed from the storage position using suction to avoid friction damage between the electrode sheets and the storage position during transfer; then, at least a portion of the picked-up electrode sheet is sent out of the electrode sheet storage device. For example, the electrode sheet can be picked up from above the storage position by the suction element extending from the discharge end on the feeding side, and then the suction element can be quickly pulled out and placed on the electrode sheet discharge belt. The suction element can also be equipped with an air blowing structure to allow the electrode sheet to quickly detach from the suction element and fall onto the discharge belt. Another example is that the electrode sheet can be picked up from above the storage position by the suction element extending from the opposite side of the discharge end on the feeding side, so that the electrode sheet is gripped by a roller mechanism located at the discharge end on the feeding side, and the roller mechanism completely removes the electrode sheet for the robotic gripper to grasp / the electrode sheet discharge belt to pick up and send out; yet another example is that the electrode sheet can be directly grasped and sent out by a robotic arm equipped with the above-mentioned suction element.

[0059] It should be noted that there are no particular restrictions on the method of removing the electrode. Other mechanisms that can perform pushing, pulling, drawing, suction, etc. can also be used to quickly remove the electrode. It is preferable to use an adsorption method so that the electrode is first removed from the storage area and then transferred out to reduce damage to the electrode during the removal process.

[0060] In this process, each storage compartment is provided with a support surface. Since the electrodes have a certain degree of flexibility, when stacked vertically at intervals, the middle part of the electrodes may deform and bend due to gravity, causing the edges of the electrodes to scratch and be damaged by the support structure on the storage compartment.

[0061] Based on this, in the case of vertically spaced stacked electrodes, a surface support structure is set in the storage position to provide good surface support for the flexible electrodes and ensure that the electrodes can be stacked vertically at intervals.

[0062] Furthermore, when the electrode circulates vertically, it needs to remain essentially stationary relative to the surface support structure to avoid damage caused by relative friction during circulation. Therefore, in this process, preferably, a pressing structure can be selectively placed above the surface support structure to apply appropriate pressure to maintain a relatively stable position of the electrode as it circulates within the surface support structure. Alternatively, an adsorption structure can be selectively placed on the surface support structure to temporarily adhere and fix the electrode to it, ensuring a relatively stable position during circulation. It should be noted that there are no particular restrictions as long as the electrode remains essentially stationary relative to the surface support structure during vertical circulation.

[0063] Even with a surface support structure, the contact between the surface support structure and the electrode can potentially damage the electrode. Therefore, in addition to the surface support structure, a protective zone can be selectively incorporated within the surface support structure to store the electrode and mitigate damage. For example, a silicone / Teflon gasket can be placed within this protective zone to reduce frictional damage to the electrode caused by the surface support structure.

[0064] (Core manufacturing process S3)

[0065] In this process, electrode sheets are stacked to form a battery cell. This cell manufacturing process may include a stacking step, in which positive and negative electrode sheets or composite electrode sheets are stacked layer by layer and separated by a separator. Before the stacking step, there may also be electrode defect detection steps, electrode correction steps, etc.; after the stacking step, there may also be steps such as battery cell tail film winding steps, battery cell shaping steps, and battery cell hot pressing steps.

[0066] It should be noted that there are no particular restrictions on the core-making process S3 as long as the electrode stacking can be completed.

[0067] See Figure 2 An embodiment of this application provides a cutting and stacking integrated machine, which includes a wafer-making unit and a core-making unit. An electrode distribution unit 500 is disposed between the wafer-making unit and the core-making unit. The electrode distribution unit 500 includes an electrode storage device 510, a circulation device 520, a feeding device 530, and a discharging device 540. The electrode storage device 510 has an feeding side, a discharging side, and multiple spaced storage positions. Electrodes 610 are stored individually in each storage position. The circulation device 520 drives the storage positions to circulate between the feeding side and the discharging side. The feeding device 530 receives the electrode 610 cut from the self-made wafer process and stores the electrode 610 in the storage position. The discharging device 540 delivers the electrode 610 from the storage position to the core-making process.

[0068] An electrode distribution unit 500 is disposed between the wafer fabrication unit and the core fabrication unit. It receives the electrodes 610 from the wafer fabrication unit and provides the core fabrication unit with the positive / negative electrodes 610 required for lamination. Simultaneously, the electrode storage device 510 has multiple spaced storage positions, allowing electrodes 610 to be stored individually in each storage position, thus enabling the electrode storage device 510 to function as an electrode 610 buffer. That is, the electrode distribution unit 500 can receive excess electrodes 610 generated by the wafer fabrication unit, or buffer electrodes 610 continuously supplied by the wafer fabrication unit during a core fabrication unit failure cycle, to maintain the normal operation of the wafer fabrication unit when the core fabrication unit fails. Furthermore, based on the amount of electrodes 610 buffered in the electrode distribution unit 500, the electrode distribution unit 500 can also continuously output electrodes 610 to the core fabrication unit during a wafer fabrication unit failure cycle, to maintain the normal operation of the core fabrication unit when the wafer fabrication unit fails.

[0069] Meanwhile, due to the multiple storage bit spacing, the friction damage that may occur between two adjacent electrodes 610 can also be effectively reduced / avoided when the electrode 610 is cached in the electrode 610 storage device.

[0070] It should be noted that the wafer-making unit may include a cutting unit 200 or simultaneously include a die-cutting unit 100 and a cutting unit 200. The core-making unit includes a stacking unit 300 or simultaneously includes a stacking unit 300 and a hot-pressing unit 400. The die-cutting unit 100 includes a die-cutting blade 110, which may be a die-cutting blade or a laser cutter. The cutting unit 200 includes a cutting blade 210, which may be a die-cutting blade or a laser cutter. The stacking unit 300 has a stacking stage 310, and a positive electrode 610, a negative electrode 610, and a separator are used to stack on the stacking stage 310 to form a battery cell 620. The hot-pressing unit 400 hot-presses the battery cell 620 using a hot press 410.

[0071] In actual use, the electrode sheet 610 cut from the wafer-making unit is first received by the feeding device 530, and then the electrode sheet 610 is stored in the storage position. As one embodiment of the electrode storage device 510, the electrode storage device 510 includes multiple surface support structures, all of which are slidably engaged with the circulation device 520. The multiple surface support structures are arranged at intervals on the circulation device 520. The circulation device 520 can drive the surface support structures to the feeding side to receive the electrode sheet 610 transferred to the feeding end of the feeding side by the feeding device 530. At the same time, the circulation device 520 can drive the surface support structures to the discharging end of the unloading side so that the electrode sheet 610 in the storage position can be sent to the core-making unit by the discharging device 540.

[0072] One embodiment of the circulating flow device 520 includes sliders and slide rails. The slide rails are U-shaped, and multiple sliders are provided, each slider slidingly engaging with the slide rail. The multiple sliders are connected one-to-one to multiple surface support structures. The multiple sliders slide cyclically on the slide rails, thereby driving the multiple surface support structures to circulate.

[0073] Of course, in other embodiments, the electrode storage device 510 can also be a frame-type support structure, and the circulation device 520 can be a transmission chain. The frame-type support structure is detachably mounted on the transmission chain, and the frame-type support structure is driven to circulate through the transmission chain.

[0074] In addition, as long as the electrode storage device 510 can store the electrode 610 in the storage position of the electrode storage device 510 in the form of a single piece and the circulation device 520 is used to drive the storage position to circulate between the feed side and the discharge side, there are no restrictions on the specific structure of the electrode storage device 510 and the circulation device 520.

[0075] Furthermore, the electrode distribution unit 500 consists of two or more units.

[0076] In one embodiment, the number of electrode distribution units 500 is the same as the number of wafer fabrication units, that is, multiple electrode distribution units 500 are configured to simultaneously receive cut electrode sheets 610 from multiple wafer fabrication units and transmit the cut electrode sheets 610 from multiple wafer fabrication units to a core fabrication unit.

[0077] In another embodiment, the number of electrode distribution units 500 is the same as the number of core-making units, that is, multiple electrode distribution units 500 can deliver the electrode 610 cut from one core-making unit to multiple core-making units.

[0078] In some embodiments, the feeding device 530 includes a belt assembly and an air blowing assembly. The belt assembly is provided with an adsorption chamber and adsorption holes / adsorption gaps are provided on the belt of the belt assembly. The air blowing assembly is provided on the belt assembly and located below the belt rotation position. When the belt assembly receives the electrode 610, it first adsorbs the electrode 610 onto the belt assembly by adsorption. Then, the belt assembly quickly transports it to the air blowing position of the belt assembly. The air blowing assembly quickly blows the electrode 610 away from the belt body, so that it falls into the storage position of the electrode 610 storage device.

[0079] In some embodiments, the discharge device 540 includes a suction assembly 541 and a receiving assembly 542. The suction assembly 541 is used to suction at least a portion of the electrode body 610 out of the electrode storage device 510. The receiving assembly 542 is used to receive at least a portion of the electrode body 610 and deliver the electrode 610 to the core-making unit.

[0080] In actual use, the electrode 610 located in the discharge side storage position is first suctioned to a certain height by the electrode suction assembly 541, and then the electrode 610 is transferred out by the electrode receiving assembly 542. The electrode 610 is taken out from the storage position by suction, avoiding friction damage between the electrode 610 and the storage position during the transfer of the electrode 610.

[0081] Of course, in other embodiments, the electrode 610 can also be pushed out of the storage position by pushing, or the electrode 610 can be clamped into the storage position by the robotic arm 545.

[0082] Specifically, the splicing assembly 542 is at least one of a belt mechanism, a roller assembly, and a mechanical gripper.

[0083] For example, the electrode suction assembly 541 sucks out the electrode 610 and places it on the belt mechanism, which then feeds the electrode 610 into the core-making unit.

[0084] Of course, in other embodiments, see Figure 3 Alternatively, the discharge device 540 may include a pushing component 543 and a roller assembly 546, with the pushing component 543 and the roller assembly 546 respectively disposed on opposite sides of the discharge side storage position. The pushing component 543 is used to push at least a portion of the electrode sheet 610 into the space between the roller assemblies 546.

[0085] In some embodiments, the storage compartment has a rigid support, within which there is a non-rigid storage area for storing the electrode. The support of the storage compartment is made of a rigid material, which improves the support and durability of the electrode, while the storage area is made of a non-rigid material to prevent scratching the surface of the electrode. The non-rigid material may be, for example, silicone or Teflon.

[0086] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A wafer stacking process, comprising a wafer fabrication step and a core fabrication step, characterized in that, An electrode distribution process is provided between the wafer fabrication process and the core fabrication process, the electrode distribution process including: The electrodes are stored in an electrode storage device in a spaced-out stacked manner and circulate within the electrode storage device; When the storage position of the electrode storage device is transferred to the feed side of the electrode storage device, the electrode cut from the electrode manufacturing process is received. When the electrode storage unit moves to the discharge side of the electrode storage unit, the electrode is discharged. When the electrode storage device receives the first fault signal of the electrode manufacturing process, it stops receiving electrodes when the storage position of the electrode storage device is transferred to the feeding side of the electrode storage device, until the first recovery signal of the electrode manufacturing process is received. And / or, when the electrode storage device receives a second fault signal from the core-making process, the electrode feeding stops when the storage position of the electrode storage device is transferred to the discharge side of the electrode storage device, until a second recovery signal from the core-making process is received.

2. The lamination process according to claim 1, characterized in that, Also includes: The buffer size of the electrode storage device is N1, the number of wafers stacked by the core-making process during a single wafer-making process failure cycle is N2, the number of wafers stacked by the wafer-making process during a single core-making process failure cycle is N3, and N1 > N2 and / or N1 > N3.

3. The lamination process according to claim 1, characterized in that, The time for a single electrode to be transferred from the electrode fabrication process to the electrode distribution process is less than 0.3 seconds, and the time for the electrode distribution process to send out a single electrode is less than 0.7 seconds.

4. The lamination process according to any one of claims 1-3, characterized in that, When the storage position of the electrode storage device is transferred to the discharge side of the electrode storage device, at least a portion of the electrode body is discharged from the electrode storage device by means of suction when the electrode is discharged.

5. A slicing and stacking integrated machine, comprising a wafer-making unit and a core-making unit, characterized in that, For implementing the wafer stacking process as described in any one of claims 1-4, an electrode distribution unit is provided between the wafer fabrication unit and the core fabrication unit, the electrode distribution unit comprising: An electrode storage device has an inlet side and an outlet side, as well as multiple spaced storage positions, with the electrode stored individually in each of the storage positions. A circulating circulation device is used to drive the storage unit to circulate between the inlet side and the outlet side; The feeding device is used to receive the electrode sheets cut from the electrode manufacturing process and store the electrode sheets into the storage location. The discharge device is used to feed the electrode sheet on the storage position into the core-making unit.

6. The cutting and stacking integrated machine according to claim 5, characterized in that, The electrode distribution unit consists of two or more units.

7. The cutting and stacking integrated machine according to claim 5, characterized in that, The storage location has a rigid support, and the rigid support has a non-rigid storage area, which is used to store electrode sheets.

8. The cutting and stacking integrated machine according to claim 5, characterized in that, The discharge device includes: A suction assembly for suctioning at least a portion of the electrode body out of the electrode storage device; A receiving assembly for receiving at least a portion of the electrode body and delivering the electrode to the core-making unit.

9. The cutting and stacking integrated machine according to claim 8, characterized in that, The splicing assembly is at least one of a belt mechanism, a roller assembly, and a mechanical gripper.

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