A stud welding tool and process

Abstract

The application discloses a stud welding tool, and belongs to the technical field of surface mounting technology, which comprises a rack, a clamping power mechanism, a clamping action structure, a storage structure, a rotary feeding mechanism and a rotary action driving mechanism; the clamping power mechanism is arranged on one side surface of the rack, the clamping power mechanism is drivingly connected with the clamping action structure, and the clamping action structure is movably arranged on the side surface of the rack; the storage structure is arranged at the bottom of the side surface of the rack and below the clamping action structure; the rotary feeding mechanism is movably arranged on the side surface of the rack and movably connected with the storage structure and the clamping action structure; the rotary action driving mechanism is arranged on the other side surface of the rack relative to the rotary feeding mechanism, and the rotary action driving mechanism is drivingly connected with the rotary feeding mechanism. The application solves the technical problem of how to realize quantitative automatic tin feeding of a PCB and a stud during stud welding processing.

Description

Technical Field

[0001] This invention relates to the technical field of surface mount technology, and in particular to a stud welding fixture and a stud welding process. Background Technology

[0002] Surface Mount Technology (SMT) is an electronic assembly technology that allows electronic components to be directly mounted onto a PCB board without the need for traditional pins or leads. This technology emerged as electronic products became increasingly miniaturized and thinner. In SMT, the leads or solder points of electronic components correspond pre-defined to pads on the PCB board. When mounting the electronic components onto the PCB, special adhesives are used to secure them to the pads; then, soldering processes such as reflow soldering or wave soldering are used to connect the electronic components to the PCB board.

[0003] PCB embedded stud technology refers to the use of stud components pre-embedded in a PCB board for connection. These studs are typically used to connect electronic components on the PCB board to external structural components. These studs are usually made of metal, such as stainless steel or copper, and possess high hardness and wear resistance. During PCB manufacturing, after the studs are embedded in the PCB board and fixed to it by soldering or other methods, they can be used to connect electronic components to external structural components. One end of the stud is usually threaded, allowing the threaded interface of the electronic component to match the threaded interface of the external structural component, thus achieving a secure connection.

[0004] Embedded studs in PCBs are a specific application of SMT (Surface Mount Technology). Currently, reflow soldering is commonly used to connect the PCB to the studs. To ensure the studs are securely placed within the PCB, they can be designed with specific structures. For example, Chinese patent CN201354791Y discloses a stud structure for PCB soldering, comprising a stud and a base. The stud structure is soldered onto the PCB board, and the base has notches; specifically, three notches are evenly distributed around the circumference of the base. This stud soldering structure increases the soldering area between the stud and the PCB board, improves the soldering strength, and prevents slippage.

[0005] However, the stud structure disclosed above cannot solve the technical problem of uneven soldering. Specifically, in current stud-PCB board soldering applications, reflow soldering is often used to connect the two. In the reflow soldering process, workers currently apply solder resist manually and place the solder wire manually. The amount of solder applied during manual placement directly affects material costs. Furthermore, manual placement of the solder wire makes it difficult to control the amount of solder placed and incurs additional labor costs. Summary of the Invention

[0006] Therefore, it is necessary to provide a stud welding fixture and a stud welding process to address the technical problem of how to achieve quantitative and automatic tinning between the PCB and the stud during stud welding.

[0007] A stud welding fixture includes: a frame, a clamping power mechanism, a clamping action structure, a material storage structure, a rotary feeding mechanism, and a rotary motion drive mechanism; the clamping power mechanism is disposed on one side of the frame and is drivenly connected to the clamping action structure, which is movably disposed on the side of the frame; the material storage structure is disposed at the bottom of the side of the frame, below the clamping action structure; the rotary feeding mechanism is movably disposed on the side of the frame and is movably connected to the material storage structure and the clamping action structure; the rotary motion drive mechanism is disposed on the other side of the frame opposite to the rotary feeding mechanism and is drivenly connected to the rotary feeding mechanism.

[0008] Furthermore, the frame has a slide groove, a platform, a slide rail, and a rotating mounting part; the slide groove is disposed on one side of the platform, the slide rail is disposed adjacent to the slide groove on the side of the platform, and the rotating mounting part is disposed opposite the slide groove on the other side of the platform.

[0009] Furthermore, the clamping power mechanism includes a clamping connecting frame, a clamping drive motor, and a clamping drive screw; the clamping connecting frame is disposed on the side of the frame, the clamping drive motor is fixedly connected to the clamping connecting frame, the clamping drive motor is drivenly connected to the clamping drive screw, and the clamping drive screw is movably disposed within the clamping connecting frame.

[0010] Furthermore, the clamping action structure includes a first connecting wire mother block, a second connecting wire mother block, an opening and closing moving seat, and a clamp; the first connecting wire mother block and the second connecting wire mother block are movably disposed on the clamping drive screw, the two opening and closing moving seats are respectively movably disposed on the slide rail, and one of the opening and closing moving seats passes through the slide groove and is connected to the first connecting wire mother block or the second connecting wire mother block; each of the opening and closing moving seats is connected to one clamp.

[0011] Furthermore, the storage structure includes a storage base, a solder hopper structure, an additive hopper structure, a solder scraping structure, and a solder scraping drive structure; the storage base is disposed on the adjacent side of the frame, the solder hopper structure and the additive hopper structure are respectively disposed adjacent to each other on the storage base, the solder scraping structure is movably connected to the solder hopper structure, and the solder scraping drive structure is drivenly connected to the solder scraping structure.

[0012] Furthermore, the solder scraping drive structure includes a solder scraping lifting frame, a solder scraping lifting drive cylinder, a solder scraping transverse drive rod, and a solder scraping transverse drive cylinder; the solder scraping lifting frame is connected to the solder scraping structure, and the solder scraping lifting drive cylinder is drivenly connected to the solder scraping lifting frame; the solder scraping transverse drive rod is connected to the solder scraping transverse drive cylinder, and the solder scraping transverse drive cylinder is drivenly connected to the solder scraping transverse drive rod.

[0013] Furthermore, the rotary motion drive mechanism includes a rotary base, a feeding slide rail, a rotary rod, a rotary drive motor, a double gear sleeve structure, a drive gear structure, and a feeding drive motor.

[0014] Furthermore, the feeding slide rail is provided on the side of the rotating seat, the feeding slide rail is movably connected to the sliding seat structure, the rotating rod is poweredly connected to the rotating seat, and the rotating drive motor is drivenly connected to the rotating rod.

[0015] Furthermore, the double-gear sleeve structure is movably sleeved outside the rotating rod body, and the double-gear sleeve structure connects the rack structure and the drive gear structure respectively, and the feeding drive motor is drivenly connected to the drive gear structure.

[0016] Furthermore, a process for using the aforementioned stud welding fixture includes the following steps: S: The clamping power mechanism drives the clamping action structure to limit and clamp the PCB board to be tinned and the stud. The storage structure contains a preset amount of solder resist such as rosin and solder. S: The rotary motion drive mechanism drives the rotary feeding mechanism to rotate to switch between carrying solder resist or tin in the storage structure; S: The rotary motion drive mechanism drives the rotary feeding mechanism to add solder resist or tin material quantitatively to the connection between the stud and the PCB board; S: The clamping action structure releases the limiting clamping of the PCB board and the stud.

[0017] In summary, the stud welding fixture of the present invention comprises a frame, a clamping power mechanism, a clamping action structure, a material storage structure, a rotary feeding mechanism, and a rotary action drive mechanism. The clamping power mechanism is disposed on one side of the frame and is drivenly connected to the clamping action structure, which is movably disposed on the side of the frame. The material storage structure is disposed at the bottom of the side of the frame and below the clamping action structure. The rotary feeding mechanism is movably disposed on the side of the frame and is movably connected to the material storage structure and the clamping action structure. The rotary action drive mechanism is disposed on the other side of the frame opposite to the rotary feeding mechanism and is drivenly connected to the rotary feeding mechanism. With the cooperation of the rotary motion drive mechanism and the rotary feeding mechanism, solder and solder resist are automatically and quantitatively added between the stud and the PCB board, and then the stud is fed into the SMT equipment along with other materials for reflow soldering and other processes. This process does not require manual intervention from the operator. Therefore, the stud welding fixture of the present invention solves the technical problem of how to achieve quantitative and automatic soldering between the PCB and the stud during stud welding. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a stud welding fixture according to the present invention; Figure 2 This is a schematic diagram of the structure of a stud welding fixture of the present invention from another direction; Figure 3 This is a schematic diagram of the structure of a stud welding fixture of the present invention from another direction; Figure 4 This is a schematic diagram of the structure of a stud welding fixture of the present invention from another direction; Figure 5 This is a schematic diagram of the structure of a stud welding fixture according to the present invention. Detailed Implementation

[0019] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0020] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] Please refer to the following: Figures 1 to 5 The present invention discloses a stud welding fixture comprising: a frame 1, a clamping power mechanism 2, a clamping action structure 3, a material storage structure 4, a rotary feeding mechanism 5, and a rotary action drive mechanism 6; the clamping power mechanism 2 is disposed on one side of the frame 1, and the clamping power mechanism 2 is drivenly connected to the clamping action structure 3, the clamping action structure 3 being movably disposed on the side of the frame 1; the material storage structure 4 is disposed at the bottom of the side of the frame 1, and is disposed below the clamping action structure 3; the rotary feeding mechanism 5 is movably disposed on the side of the frame 1, and the rotary feeding mechanism 5 is movably connected to the material storage structure 4 and the clamping action structure 3; the rotary action drive mechanism 6 is disposed on the other side of the frame 1 opposite to the rotary feeding mechanism 5, and the rotary action drive mechanism 6 is drivenly connected to the rotary feeding mechanism 5.

[0026] Specifically, when the stud welding fixture of the present invention is in operation, the clamping power mechanism 2 can drive the clamping action structure 3 to pre-position and clamp the PCB board to be soldered and the stud. Then, the clamping power mechanism 2 acts as the driving mechanism for the clamping action structure 3 to clamp or release the material. Then, a preset amount of solder resist such as rosin and solder is pre-placed in the material storage structure 4. The rotation drive mechanism 6 can drive the rotation feeding mechanism 5 to add the solder resist and solder to the connection between the stud and the PCB board in sequence, so that each stud and the PCB board can be automatically and quantitatively added with solder and solder resist. Then, the clamping action structure 3 is released from the limiting clamping of the PCB board and the stud, so that other electronic components can be added, and then they are sent into the SMT equipment for reflow soldering and other processes. It can be seen that the stud welding fixture of the present invention can achieve quantitative and automatic soldering of the PCB and the stud during stud welding.

[0027] Furthermore, the frame 1 has a slide groove 101, a platform 102, a slide rail 103, and a rotating mounting part 104; the slide groove 101 is disposed on one side of the platform 102, the slide rail 103 is disposed adjacent to the slide groove 101 on the side of the platform 102, and the rotating mounting part 104 is disposed opposite to the slide groove 101 on the other side of the platform 102.

[0028] Furthermore, the clamping power mechanism 2 includes a clamping connecting frame 201, a clamping drive motor 202, and a clamping drive screw 203; the clamping connecting frame 201 is disposed on the side of the frame 1, the clamping drive motor 202 is fixedly connected to the clamping connecting frame 201, the clamping drive motor 202 is drivenly connected to the clamping drive screw 203, and the clamping drive screw 203 is movably disposed within the clamping connecting frame 201. Specifically, the clamping connection frame 201 is disposed on the other side of the platform 102 relative to the slide rail 103. After the clamping drive motor 202 is energized, it can drive the clamping drive screw 203 to rotate forward or backward in the clamping connection mechanism 201. Several bearings are respectively provided at both ends of the clamping connection frame 201 so that both ends of the clamping drive screw 203 are connected to the clamping connection frame 201 through the bearings, and one end of the clamping drive screw 203 is connected to the clamping drive motor 202.

[0029] Furthermore, the clamping action structure 3 includes a first connecting wire mother block 301, a second connecting wire mother block 302, an opening and closing moving seat 303, and a clamp 304; the first connecting wire mother block 301 and the second connecting wire mother block 302 are movably disposed on the clamping drive screw 203, and the two opening and closing moving seats 303 are respectively movably disposed on the slide rail 103. After passing through the slide groove 101, one opening and closing moving seat 303 is connected to the first connecting wire mother block 301 or the second connecting wire mother block 302; each opening and closing moving seat 303 is connected to one clamp 304. Specifically, the first connecting thread nut 301 and the second connecting thread nut 302 have internal threads in different directions. Therefore, when the clamping drive screw 203 rotates forward or reverse under the drive of the clamping drive motor 202, the first connecting thread nut 301 and the second connecting thread nut 302 can simultaneously move closer to each other or further away from each other along the limiting direction of the clamping drive screw 203. When the first connecting thread nut 301 and the second connecting thread nut 302 are relatively close, the opening and closing moving seat 303 drives the clamp 304 to clamp materials such as PCBs.

[0030] Furthermore, the storage structure 4 includes a storage base 401, a solder container structure 402, an additive container structure 403, a solder scraping structure 404, and a solder scraping drive structure 405. The storage base 401 is disposed on the adjacent side of the frame 1. The solder container structure 402 and the additive container structure 403 are respectively disposed adjacent to each other on the storage base 401. The solder scraping structure 404 is movably connected to the solder container structure 402, and the solder scraping drive structure 405 is drivenly connected to the solder scraping structure 404. Furthermore, the solder scraping drive structure 405 includes a solder scraping lifting frame 405a, a solder scraping lifting drive cylinder 405b, a solder scraping horizontal drive rod 405c, and a solder scraping horizontal drive cylinder 405d. The solder scraping lifting frame 405a is connected to the solder scraping structure 404, and the solder scraping lifting drive cylinder 405b is drivenly connected to the solder scraping lifting frame 405a. The solder scraping horizontal drive rod 405c is connected to the solder scraping horizontal drive cylinder 405d, and the solder scraping horizontal drive cylinder 405d is drivenly connected to the solder scraping horizontal drive rod 405c. Specifically, the solder scraping drive structure 405 can drive the solder scraping structure 404 to move up, down, left, and right, thereby performing a solder scraping operation on the liquid surface of the solder in the solder tank structure 402. Moreover, the solder tank structure 402 can be connected to an external heating device, thereby maintaining the solder in the solder tank structure 402 in a liquid state. The additive chamber structure 403 can hold materials such as grease, so that soldering additives can be added while soldering the stud.

[0031] Furthermore, the rotary feeding mechanism 5 has a feeding arm structure 501, a feeding base 502, a rack structure 503, and a sliding seat structure 504; the feeding arm structure 501 is disposed on the feeding base 502, the rack structure 503 is disposed on the other side of the feeding base 502 relative to the feeding arm structure 501, and the sliding seat structure 504 is adjacent to the rack structure 503 and connected to the feeding base 502.

[0032] Furthermore, the rotary motion drive mechanism 6 includes a rotary base 601, a feeding slide rail 602, a rotary rod 603, a rotary drive motor 604, a double gear sleeve structure 605, a drive gear structure 606, and a feeding drive motor 607. The feeding slide rail 602 is provided on the side of the rotary base 601. The feeding slide rail 602 is movably connected to the sliding base structure 504. The rotary rod 603 is poweredly connected to the rotary base 601. The rotary drive motor 604 is drivenly connected to the rotary rod 603. The double gear sleeve structure 605 is movably sleeved outside the rotary rod 603. The double gear sleeve structure 605 connects the rack structure 503 and the drive gear structure 606 respectively. The feeding drive motor 607 is drivenly connected to the drive gear structure 606.

[0033] Specifically, the rotary motion drive mechanism 6 has two power mechanisms: a feeding drive motor 607 and a rotary drive motor 604. The rotary drive motor 604 drives the rotary seat 601 to rotate, thereby driving the feeding arm structure 501 to connect to the solder tank structure 402 and the additive tank structure 403 respectively, and feeding the solder and additive into the structure of the feeding arm structure 501. The feeding drive motor 607 can drive the double gear sleeve structure 605 to make the sliding seat structure 504 move linearly along the limit of the feeding slide rail 602, thereby driving the feeding arm structure 501 to move closer to or away from the clamp 304, thus enabling the feeding arm structure 501 to achieve the automatic feeding function.

[0034] Furthermore, a process using the aforementioned stud welding fixture includes the following steps: S1: The clamping power mechanism 2 drives the clamping action structure 3 to limit and clamp the PCB board to be tinned and the stud. The material storage structure 4 is pre-filled with a preset amount of solder resist such as rosin and solder. S2: The rotary motion drive mechanism 6 drives the rotary feeding mechanism 5 to rotate to switch between carrying solder resist or tin in the storage structure 4. S3: The rotary motion drive mechanism 6 drives the rotary feeding mechanism 5 to add solder resist or tin material quantitatively to the connection between the stud and the PCB board. S4: The clamping action structure 3 releases the limiting clamping of the PCB board and the stud.

[0035] In summary, the stud welding fixture of the present invention comprises a frame 1, a clamping power mechanism 2, a clamping action structure 3, a material storage structure 4, a rotary feeding mechanism 5, and a rotary action drive mechanism 6. The clamping power mechanism 2 is disposed on one side of the frame 1 and is drivenly connected to the clamping action structure 3. The clamping action structure 3 is movably disposed on the side of the frame 1. The material storage structure 4 is disposed at the bottom of the side of the frame 1 and is located below the clamping action structure 3. The rotary feeding mechanism 5 is movably disposed on the side of the frame 1 and is movably connected to the material storage structure 4 and the clamping action structure 3. The rotary action drive mechanism 6 is disposed on the other side of the frame 1 opposite to the rotary feeding mechanism 5 and is drivenly connected to the rotary feeding mechanism 5. With the cooperation of the rotary motion drive mechanism 6 and the rotary feeding mechanism 5, solder and solder resist are automatically and quantitatively added between the stud and the PCB board, and then the stud is fed into the SMT equipment along with other materials for reflow soldering and other processes. This process does not require manual intervention from the operator. Therefore, the stud welding fixture of the present invention solves the technical problem of how to achieve quantitative and automatic soldering between the PCB and the stud during stud welding.

[0036] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A stud welding fixture, characterized in that, It includes: a frame (1), a clamping power mechanism (2), a clamping action structure (3), a material storage structure (4), a rotary feeding mechanism (5), and a rotary action drive mechanism (6); The frame (1) has a slide groove (101), a platform (102), a slide rail (103), and a rotating mounting part (104); the slide groove (101) is disposed on one side of the platform (102), the slide rail (103) is disposed adjacent to the slide groove (101) on the side of the platform (102), and the rotating mounting part (104) is disposed opposite to the slide groove (101) on the other side of the platform (102); The clamping power mechanism (2) has a clamping connecting frame (201), a clamping drive motor (202), and a clamping drive screw (203); the clamping connecting frame (201) is disposed on the side of the frame (1), the clamping drive motor (202) is fixedly connected to the clamping connecting frame (201), the clamping drive motor (202) is drivenly connected to the clamping drive screw (203), and the clamping drive screw (203) is movably disposed in the clamping connecting frame (201); The clamping action structure (3) includes a first connecting thread block (301), a second connecting thread block (302), an opening and closing moving seat (303), and a clamp (304); the first connecting thread block (301) and the second connecting thread block (302) are movably disposed on the clamping drive screw (203), and the two opening and closing moving seats (303) are respectively movably disposed on the slide rail (103). One of the opening and closing moving seats (303) passes through the slide groove (101) and is connected to the first connecting thread block (301) or the second connecting thread block (302); each of the opening and closing moving seats (303) is connected to one of the clamps (304). The storage structure (4) includes a storage frame (401), a solder container structure (402), an additive container structure (403), a solder scraping structure (404), and a solder scraping drive structure (405). The storage frame (401) is located on the adjacent side of the frame (1). The solder container structure (402) and the additive container structure (403) are respectively located adjacent to each other on the storage frame (401). The solder scraping structure (404) is movably connected to the solder container structure (402). The solder scraping drive structure (405) is drivenly connected to the solder scraping structure (404). The rotary feeding mechanism (5) has a feeding arm structure (501), a feeding base (502), a rack structure (503), and a sliding seat structure (504); the feeding arm structure (501) is disposed on the feeding base (502), the rack structure (503) is disposed on the other side of the feeding base (502) relative to the feeding arm structure (501), and the sliding seat structure (504) is adjacent to the rack structure (503) and connected to the feeding base (502); The rotary motion drive mechanism (6) includes a rotary base (601), a feeding slide rail (602), a rotary rod (603), a rotary drive motor (604), a double gear sleeve structure (605), a drive gear structure (606), and a feeding drive motor (607). The clamping power mechanism (2) is provided on one side of the frame (1), and the clamping power mechanism (2) is driven to be connected to the clamping action structure (3). The clamping action structure (3) is movably disposed on the side of the frame (1). The storage structure (4) is disposed at the bottom of the side of the frame (1) and is disposed below the clamping action structure (3). The rotary feeding mechanism (5) is movably disposed on the side of the frame (1) and is movably connected to the storage structure (4) and the clamping action structure (3). The rotary action drive mechanism (6) is disposed on the other side of the frame (1) relative to the rotary feeding mechanism (5), and is driven to be connected to the rotary feeding mechanism (5).

2. The stud welding fixture according to claim 1, characterized in that: The solder scraping drive structure (405) includes a solder scraping lifting frame (405a), a solder scraping lifting drive cylinder (405b), a solder scraping transverse drive rod (405c), and a solder scraping transverse drive cylinder (405d). The solder scraping lifting frame (405a) is connected to the solder scraping structure (404), and the solder scraping lifting drive cylinder (405b) is drivenly connected to the solder scraping lifting frame (405a). The solder scraping transverse drive rod (405c) is connected to the solder scraping transverse drive cylinder (405d), and the solder scraping transverse drive cylinder (405d) is drivenly connected to the solder scraping transverse drive rod (405c).

3. The stud welding fixture according to claim 1, characterized in that: The feeding slide rail (602) is provided on the side of the rotating seat (601). The feeding slide rail (602) is movably connected to the sliding seat structure (504). The rotating rod (603) is poweredly connected to the rotating seat (601). The rotating drive motor (604) is drivenly connected to the rotating rod (603).

4. The stud welding fixture according to claim 3, characterized in that: The double gear sleeve structure (605) is movably sleeved outside the rotating rod body (603). The double gear sleeve structure (605) connects the rack structure (503) and the drive gear structure (606) respectively. The feeding drive motor (607) is drivenly connected to the drive gear structure (606).

5. A process for using a stud welding fixture as described in any one of claims 1-4, characterized in that, Includes the following steps: S1: The clamping power mechanism (2) drives the clamping action structure (3) to limit and clamp the PCB board to be tinned and the stud. The material storage structure (4) contains a preset amount of flux and solder. S2: The rotary motion drive mechanism (6) drives the rotary feeding mechanism (5) to rotate to switch the flux or solder carried in the storage structure (4); S3: The rotary motion drive mechanism (6) drives the rotary feeding mechanism (5) to add flux or solder to the connection between the stud and the PCB board in a measured amount; S4: The clamping action structure (3) releases the limiting clamping of the PCB board and the stud.

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