A tin solder removing device for PCB processing

Abstract

The application relates to the field of PCB processing, in particular to a tin solder removing device for PCB processing, which comprises a tin removing table, a moving frame arranged on the tin removing table, sliding seats slidingly connected to the side edges of the moving frame, mounting plates fixedly connected to the front and back sides of the sliding seats, a rotating handle slidingly and rotatably connected to one of the mounting plates, a disc being arranged on the rotating handle, a fixing ring fixedly connected to the outer ring of the disc of the rotating handle, a rotating rod slidingly and rotatably connected to the other mounting plate, a winding wheel being detachably sleeved on the rotating handle, a tin suction belt being wound on the winding wheel, and a through slot being arranged in the lower part of each sliding seat, and the tin suction belt passes through the through slot. By arranging the winding wheel to wind and unwind the tin suction belt, the waste tin suction belt can be more regular and convenient to wind, the influence of the tin suction belt on the tin removing process is reduced, and the tin removing efficiency of the device is improved.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing, specifically to a solder removal device for PCB board processing. Background Technology

[0002] When mounting electronic components on a PCB, soldering is generally used for connection. However, during the soldering process, excess solder may be left on the PCB, affecting the PCB production quality. Therefore, this waste solder needs to be treated during the PCB manufacturing process.

[0003] Currently, the common method for desoldering is to use desoldering wick to adhere to and remove waste solder. Its advantages are that desoldering wick is convenient to use; simply pull out a section of wick, place it on the waste solder, and heat it with a soldering iron to remove the solder. No additional energy source is required, making it simple and easy to operate. However, after use, the waste solder needs to be disposed of. Either it needs to be cut off after the entire desoldering process is complete, but this can lead to the waste solder running around and affecting the desoldering process, or it can be cut off after each use, but this requires frequent cutting, reducing desoldering efficiency. Therefore, the current use of desoldering wick is cumbersome and inconvenient. Summary of the Invention

[0004] This invention provides a solder removal device for PCB board processing, which aims to solve the technical problems mentioned in the background art.

[0005] Includes: a desoldering table; a movable frame set on the desoldering table, the movable frame having a hollow center; a sliding seat slidably connected to the side of the movable frame; a mounting plate fixedly connected to the front and rear sides of the sliding seat; a handle slidably and rotatably connected to one of the mounting plates, the handle having a disc; a fixing ring fixedly connected to the outer ring of the disc on the handle; a rotating rod slidably and rotatably connected to the other mounting plate, the rotation axes of the rotating rod and the handle being on the same straight line, the rotating rod and the handle being detachably fixedly connected; a winding wheel detachably sleeved onto the handle, the desoldering tape being wound on the winding wheel; and slots formed in the lower part of the two sliding seats, through which the desoldering tape passes.

[0006] In some embodiments, it further includes a connecting ring fixedly connected to the sliding seat.

[0007] In some embodiments, it further includes: an adjustment column slidably connected to the desoldering table, the adjustment column being slidably connected to the movable frame; adjustment slots b formed on the front and rear sides of the adjustment column, the number of adjustment slots b being at least four; a locking block slidably connected to the movable frame; and a compression spring sleeved on the sliding shaft of the locking block, the two ends of the compression spring being fixed to the locking block and the movable frame respectively.

[0008] In some embodiments, the inner contact surface of the adjustment groove b is an arc surface, and the outer contact surface of the locking block is an arc surface, so that when the locking block is locked into the adjustment groove b, the locking block can slide up and down relative to the adjustment groove b after overcoming the force of the compression spring.

[0009] In some embodiments, the device further includes: a sliding rod slidably connected within the desoldering station, with threads at both the upper and lower ends of the sliding rod; a stop block fixedly connected to the sliding rod, the stop block being located above the desoldering station; an adjusting block threadedly connected to the thread at the upper end of the sliding rod; and a fixing block threadedly connected to the thread at the lower end of the sliding rod, the fixing block being located below the desoldering station.

[0010] In some embodiments, the system further includes: a sliding frame slidably connected to a sliding base; a push rod slidably connected to the sliding base, the push rod being fixedly connected to the sliding frame, the end of the push rod being located inside the ring of a connecting ring, and its end being able to contact a soldering iron placed inside the connecting ring; a tension spring fitted on the push rod, the two ends of the tension spring being fixedly fixed to the push rod and the sliding base respectively; a rack slidably connected to the sliding base, the rack being fixedly connected to the sliding frame; a notched gear rotatably connected to the sliding base, the notched gear meshing with the rack; a support arm fixedly connected to the notched gear, and a stop foot rotatably connected to the support arm, the stop foot contacting the movable frame.

[0011] In some embodiments, it further includes: a mounting plate fixedly connected to the desoldering table; a motor fixedly connected to the mounting plate; and a cleaning wheel rotatably connected to the mounting plate, wherein the output shaft of the motor is fixed to the rotation shaft of the cleaning wheel.

[0012] In some embodiments, it also includes a placement mesh fixedly connected to the desoldering table.

[0013] The beneficial effects are as follows: Using this device, the winding wheel allows for more organized and convenient collection of waste solder tape, reducing the impact of the solder tape on the desoldering process and improving the device's desoldering efficiency. The rotating handle, used in conjunction with the rotating rod, allows for quick and easy assembly and disassembly of the winding wheel and solder tape, simplifying the device's use. The abutment and adjusting block fix the PCB position, while the top rod, positioned to fix the position between the sliding base and the moving frame, ensures more stable desoldering of the PCB, improving the device's desoldering effect. The sliding rod, used in conjunction with the fixing block, allows for adaptive changes in the position of the abutment and adjusting block according to the PCB size, expanding the device's applicability. The cleaning wheel polishes the oxide layer and impurities on the soldering iron tip, improving soldering quality and extending the tip's lifespan. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0015] Figure 2 This is a schematic diagram showing the position of the desoldering strip placed on the winding wheel and passing between the mounting plates in this invention.

[0016] Figure 3 This is an exploded view showing the positional structure of the mounting plate, winding wheel, handle, and rod in this invention.

[0017] Figure 4 This is an exploded view showing the position and structure of the movable frame, adjusting column, and locking block in this invention.

[0018] Figure 5 This is a schematic diagram showing the position and structure of the sliding rod, the stop block, and the adjusting block on the desoldering platform in this invention.

[0019] Figure 6 This is an exploded view of the structure of the sliding rod, the stop block, the fixing block, and the adjusting block in this invention.

[0020] Figure 7 This is a schematic diagram of the position and structure of the sliding frame in this invention.

[0021] Figure 8 This is a schematic diagram of the connection structure of the sliding frame, rack, missing gear and stop in this invention.

[0022] Figure 9 This is a schematic diagram of the connection structure of the cleaning wheel in this invention.

[0023] The attached diagram is labeled as follows: 00-Desoldering strip, 1-Desoldering table, 1a-Sliding groove, 1b-Adjusting groove a, 2-Moving frame, 3-Sliding seat, 3a-Through groove, 3b-Adjusting groove, 4-Mounting plate, 5-Wrapping wheel, 6-Rotating handle, 6a-Magnetic block, 7-Fixing ring, 8-Rotating rod, 8a-Adsorption groove, 9-Connecting ring, 10-Adjusting column, 10a-Adjusting groove b, 11-Clamping block, 12-Compression spring, 13-Sliding rod, 14-Abutting block, 15-Adjusting block, 16-Fixing block, 17-Sliding frame, 17a-Top rod, 18-Tension spring, 19-Rack and pinion, 20-Missing gear, 20a-Support arm, 21-Abutting foot, 22-Mounting plate, 23-Motor, 24-Cleaning wheel, 25-Placement mesh. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Example: A solder removal device for PCB board processing, such as Figures 1-3 As shown, it includes: a desoldering table 1; a movable frame 2 mounted on the desoldering table 1, the movable frame 2 being able to move left and right, with a hollow center to allow for unobstructed vertical movement; sliding seats 3 respectively slidably mounted on the left and right sides of the movable frame 2, the two sliding seats 3 moving back and forth; mounting plates 4 respectively fixedly mounted on the front and rear sides of the two sliding seats 3; a rotating handle 6 slidably and rotatably mounted on the two mounting plates 4 on the front side, the rear end of the rotating handle 6 having a disc; a magnetic block 6a fixedly mounted on the rear side of the disc of the rotating handle 6; a fixing ring 7 fixedly mounted on the outer ring of the disc of the rotating handle 6, the fixing ring 7 being made of rubber and deforming under force; and a rotating rod 8 slidably and rotatably mounted on the two mounting plates 4 on the rear side, the rotation axes of the rotating rod 8 and the rotating handle 6 being on the same straight line, the rear end of the rotating handle 6 having a protrusion. The rotating rod 8 has a limited range of forward movement. A magnetic groove 8a is provided at the front of the rotating rod 8. When the rotating rod 8 and the handle 6 come into close contact, the magnetic block 6a will be attracted into the magnetic groove 8a, fixing the position between the rotating rod 8 and the handle 6. A detachable winding wheel 5 is fitted onto the handle 6. The winding wheel 5 covers the rotating rod 8, the handle 6, and the fixing ring 7. The fixing ring 7 rubs against the winding wheel 5, fixing the position between the winding wheel 5 and the handle 6, thus allowing the winding wheel 5 to be mounted on the mounting plate 4. Solder wicking tape 00 is wound around the winding wheel 5. A through groove 3a is provided at the lower part of the two sliding seats 3, through which the solder wicking tape 00 can pass. A connecting ring 9 is fixedly installed between the two sliding seats 3, through which the soldering iron can pass. The connecting ring 9 restricts the position of the soldering iron handle and fixes the soldering iron.

[0026] Slide the left handle 6 forward. The left rotating rod 8 is held against the mounting plate 4, causing the magnetic block 6a to detach from the adsorption groove 8a. At this point, the winding wheel 5 containing the desoldering tape 00 can be passed through the left handle 6, allowing the retaining ring 7 to engage with the winding wheel 5. After completion, slide the handle 6 backward. The handle 6 and the rotating rod 8 are connected and fixed by the magnetic block 6a and the adsorption groove 8a. Similarly, fix the empty winding wheel 5 onto the right rotating rod 8 handle 6. Pull out the end of the desoldering tape 00 and pass it through the left and right through slots 3a in sequence, so that the desoldering tape 00 spans the lower part of the moving frame 2. After the desoldering tape 00 exits from the right through slot 3a, fix it onto the empty winding wheel 5 on the right. Then, place the PCB on the desoldering table 1. The soldering iron passes through the connecting ring 9 and through the hollow part of the moving frame 2 to contact the desoldering strip 00. Then, it moves the desoldering strip 00 down to contact the waste solder on the PCB for desoldering. At this time, the soldering iron is fixed and supported by the connecting ring 9. In this way, the desoldering process can be carried out. The waste solder comes into contact with the desoldering strip 00 heated by the soldering iron and is attracted to the desoldering strip 00. When the desoldering strip 00 is saturated and no longer has the ability to absorb solder, it becomes waste strip. Then, the left handle 6 can be rotated to release the desoldering strip 00. The right handle 6 can be rotated to neatly collect the waste desoldering strip 00 on the right winding wheel 5, so that the next stage of desoldering can be carried out, reducing the impact of the waste desoldering strip 00 on the subsequent desoldering process.

[0027] like Figure 1 and Figure 4 As shown, it also includes: a sliding groove 1a arranged horizontally on both the front and rear sides of the desoldering platform 1, and adjusting columns 10 slidably installed in the two sliding grooves 1a respectively. The two adjusting columns 10 are slidably connected to the front and rear sides of the movable frame 2 respectively; adjusting grooves b10a are opened on the front and rear sides of the adjusting columns 10, and eight adjusting grooves b10a are provided on one side of each adjusting column 10. The adjusting grooves b10a of the two adjusting columns 10 are aligned with each other; four locking blocks 11 are slidably installed on the movable frame 2, corresponding to the front and rear sides of the two adjusting columns 10; compression springs 12 are sleeved on the sliding shaft of the locking blocks 11, and the two ends of the compression springs 12 are fixed on the locking blocks 11 and the movable frame 2 respectively; the inner contact surface of the adjusting groove b10a is an arc surface, and the outer contact surface of the locking block 11 is an arc surface, so that when the locking block 11 is locked into the adjusting groove b10a, the locking block 11 can slide up and down relative to the adjusting groove b10a after overcoming the force of the compression spring 12.

[0028] like Figure 5 and Figure 6As shown, it also includes: an adjustment groove a1b provided on the desoldering table 1, the adjustment groove a1b having four grooves, the arrangement direction being from the middle of the desoldering table 1 to the four corners; sliding rods 13 respectively slidably installed in the four adjustment grooves a1b, each sliding rod 13 having threads at both the upper and lower ends; a stop block 14 fixedly installed on each sliding rod 13, the stop block 14 being located above the desoldering table 1; an adjustment block 15 threadedly installed on the threads at the upper end of each sliding rod 13; and a fixing block 16 threadedly installed on the threads at the lower end of each sliding rod 13, the fixing block 16 being located below the desoldering table 1.

[0029] Rotate the fixing block 16 to increase the distance between the fixing block 16 and the abutment block 14, allowing the sliding rod 13 to slide freely within the adjustment groove a1b. Place the PCB between the four sliding rods 13, positioning the abutment block 14 below the PCB and supporting it by contacting its lower side. After determining the position of the sliding rod 13, reverse the fixing block 16 to decrease the distance between the fixing block 16 and the abutment block 14, fixing the sliding rod 13 onto the desoldering station 1. Then rotate the adjustment block 15 to decrease the distance between the adjustment block 15 and the abutment block 14, making the adjustment block 15 contact the upper side of the PCB and fixing its position, thus making the PCB more stable during desoldering. Finally, place the soldering iron on the connecting ring. On 9, a soldering iron and desoldering wick 00 are used for desoldering. When it is necessary to change the desoldering position on the PCB, the left and right position of the soldering iron can be changed by moving the adjusting column 10 left and right, the front and back position of the soldering iron can be changed by moving the sliding seat 3 back and forth, and the up and down position of the soldering iron can be changed by sliding the moving frame 2 up and down. When changing the position of the moving frame 2, it is only necessary to apply force to the moving frame 2 to overcome the force of the compression spring 12 and control the moving frame 2 to move up and down. The arc-shaped contact surface allows the locking block 11 to automatically disengage from the adjusting groove b10a. After the moving frame 2 loses the force, the compression spring 12 causes the locking block 11 to return to its original position and remain in close contact with the adjusting groove b110a, thereby fixing the moving frame 2 on the adjusting column 10.

[0030] like Figure 7 and Figure 8As shown, it also includes: an adjustment groove 3b is provided on the sliding seat 3, and a sliding frame 17 is slidably installed in the adjustment groove 3b, which slides left and right; a push rod 17a is slidably installed on the sliding seat 3, and the push rod 17a is fixed to the sliding frame 17. After passing through the sliding seat 3, the push rod 17a is slidably connected in the connecting ring 9, and the end of the push rod 17a is located inside the ring of the connecting ring 9. When the soldering iron is placed in the connecting ring 9, it will contact the push rod 17a and push the two push rods 17a to slide away from the connecting ring 9 respectively; a tensioning rod fitted on the push rod 17a. Spring 18, the two ends of the tension spring 18 are fixed on the top rod 17a and the sliding seat 3 respectively; rack 19 is slidably installed in the adjustment groove 3b, rack 19 is fixed to the sliding frame 17, rack 19 is a double rack 19; missing gear 20 is rotatably installed in the adjustment groove 3b, there are two missing gears 20, located on both sides of rack 19 respectively, and meshing with the teeth on both sides of rack 19 respectively; each of the two missing gears 20 is fixedly installed with support arm 20a, and abutment 21 is rotatably installed on the two support arms 20a respectively, the abutment 21 is in contact with the movable frame 2.

[0031] When the soldering iron is inserted into the connecting ring 9, taking the push rod 17a on the right sliding seat 3 as an example, the handle of the soldering iron will push the right sliding frame 17 to the right through the push rod 17a. The tension spring 18 is stretched, the rack 19 slides to the right, and the support arm 20a is rotated through the gear 20, so that the end of the support arm 20a is close to the moving frame 2, so that the foot 21 contacts the moving frame 2. Then the support arm 20a rotates relative to the foot 21, so that the foot 21 presses against the moving frame 2. In this way, the position between the sliding seat 3 and the moving frame 2 can be fixed by the placement of the soldering iron, that is, the front and back position of the soldering iron can be fixed.

[0032] like Figure 9 As shown, it also includes: a mounting plate 22 fixedly installed on the right side of the desoldering table 1; a motor 23 fixedly installed on the rear side of the mounting plate 22; a cleaning wheel 24 rotatably installed on the mounting plate 22, with the output shaft of the motor 23 fixed to the rotation of the cleaning wheel 24; and a placement net 25 fixedly installed on the right side of the desoldering table 1.

[0033] After using the soldering iron, start the motor 23 to rotate the cleaning wheel 24. Use the cleaning wheel 24 to polish the oxide layer and impurities on the soldering iron tip to improve the soldering quality and extend the service life of the soldering iron tip. Finally, place the soldering iron on the placement net 25 for easy access and use. It also helps to fix the soldering iron in place, preventing damage or accidental injury from high temperatures.

[0034] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention. The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the protection scope of the present invention.

Claims

1. A solder removal device for PCB board processing, characterized in that, include: Desoldering table (1); a movable frame (2) set on the desoldering table (1), the movable frame (2) being hollowed out in the middle; a sliding seat (3) slidably connected to the side of the movable frame (2); a mounting plate (4) fixedly connected to the front and rear sides of the sliding seat (3); a rotating handle (6) slidably and rotatably connected to one of the mounting plates (4), a disc being provided on the rotating handle (6); a fixing ring (7) fixedly connected to the outer ring of the disc on the rotating handle (6); a rotating rod (8) slidably and rotatably connected to the other mounting plate (4). The rotation axes of the rotating rod (8) and the rotating handle (6) are on the same straight line, and the rotating rod (8) and the rotating handle (6) are detachably fixedly connected; the winding wheel (5) is detachably sleeved on the rotating handle (6), the fixing ring (7) is used to fix the position between the winding wheel (5) and the rotating handle (6), and the desoldering strip (00) is wound on the winding wheel (5); the through groove (3a) is opened at the lower part of the two sliding seats (3), and the desoldering strip (00) passes through the through groove (3a); it also includes: a fixed connection sliding The base (3) includes a connecting ring (9) that supports and fixes the soldering iron; it also includes: a sliding frame (17) that is slidably connected to the sliding base (3); a push rod (17a) that is slidably connected to the sliding base (3), the push rod (17a) being fixedly connected to the sliding frame (17), the end of the push rod (17a) being located inside the ring of the connecting ring (9), and its end being able to contact the soldering iron placed inside the connecting ring (9); and a tension spring (18) fitted on the push rod (17a). The two ends of the spring (18) are fixed to the top rod (17a) and the sliding seat (3) respectively; the rack (19) is slidably connected in the sliding seat (3), and the rack (19) is fixed to the sliding frame (17); the gear (20) is rotatably connected in the sliding seat (3), and the gear (20) meshes with the rack (19); the gear (20) is fixedly connected to the support arm (20a), and the foot (21) is rotatably connected to the support arm (20a), and the foot (21) contacts the moving frame (2).

2. The solder removal device for PCB board processing according to claim 1, characterized in that, Also includes: An adjusting column (10) is slidably connected to the desoldering station (1), and the adjusting column (10) is slidably connected to the moving frame (2); adjusting grooves b (10a) are opened on the front and rear sides of the adjusting column (10), and the number of adjusting grooves b (10a) is at least four; a locking block (11) is slidably connected to the moving frame (2); a compression spring (12) is sleeved on the sliding shaft of the locking block (11), and the two ends of the compression spring (12) are fixed on the locking block (11) and the moving frame (2) respectively. The compression spring (12) acts on the locking block (11), and the position between the adjusting column (10) and the moving frame (2) is fixed by the locking block (11) cooperating with the adjusting grooves b (10a).

3. The solder removal device for PCB board processing according to claim 2, characterized in that, Also includes: The inner contact surface of the adjustment groove b (10a) is an arc surface, and the outer contact surface of the locking block (11) is an arc surface. When the locking block (11) is inserted into the adjustment groove b (10a), the locking block (11) can slide up and down relative to the adjustment groove b (10a) after overcoming the force of the compression spring (12).

4. The solder removal device for PCB board processing according to claim 3, characterized in that, Also includes: A sliding rod (13) is slidably connected inside the desoldering station (1), and both the upper and lower ends of the sliding rod (13) are threaded; a stop block (14) is fixedly connected to the sliding rod (13), and the stop block (14) is located above the desoldering station (1); an adjusting block (15) is threadedly connected to the thread at the upper end of the sliding rod (13); and a fixing block (16) is threadedly connected to the thread at the lower end of the sliding rod (13), and the fixing block (16) is located below the desoldering station (1).

5. The solder removal device for PCB board processing according to claim 4, characterized in that, Also includes: A mounting plate (22) is fixedly connected to the desoldering station (1); a motor (23) is fixedly connected to the mounting plate (22); a cleaning wheel (24) is rotatably connected to the mounting plate (22), and the output shaft of the motor (23) is fixed to the rotation shaft of the cleaning wheel (24).

6. The solder removal device for PCB board processing according to claim 5, characterized in that, Also includes: A placement net (25) for placing an electric soldering iron is fixedly connected to the desoldering station (1).

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