Deformation monitoring device and method for PCB board

Abstract

The application discloses a deformation monitoring device and method for a PCB (Printed Circuit Board), and belongs to the technical field of electronic device monitoring.The device comprises a bearing shell, a plurality of plug-in sockets are installed in the bearing shell, and a plurality of warning lights are connected to the bearing shell; wherein, an inner recessed placing seat is integrally formed in the plug-in socket, an extrusion positioning structure is connected to the inner recessed placing seat, a micro air pump is fixedly connected to the plug-in socket, a first micro electromagnetic valve is connected to the outside of a gas storage shell, a semi-hard movable bearing seat is fixedly connected to the plug-in socket, and the monitoring plate is pushed to lift the connecting block up and down through the telescopic expansion pipe during transportation, so that the monitoring plate moves up and down in the inner recessed placing seat; when the PCB has been deformed or some positions have been deformed, the monitoring plate is blocked by the deformed PCB, so that the two conductive stickers cannot be attached, and the warning light is used for alarm processing.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment monitoring technology, and more specifically, to a device and method for monitoring the deformation of PCB boards. Background Technology

[0002] PCB, or Printed Circuit Board, is a crucial electronic component. It serves as the support for electronic components and the carrier for their electrical connections. Because it is manufactured using electronic printing techniques, it is called a "printed" circuit board. To ensure the assembly reliability and other quality performance of PCBs, there are specific requirements for flatness and warpage control. This is especially true for thin boards with high-density designs, where flatness and warpage requirements are even stricter and require 100% inspection. Traditionally, flatness is checked immediately after production; if bending is found, rework is performed. However, during stacking and transportation, PCBs may experience slight bending deformation due to overlapping. While this slight bending deformation does not affect the normal use of the product, PCBs with significant bending deformation are unusable. Therefore, flatness monitoring is necessary before transportation and before galvanizing to prevent bent PCBs from becoming unusable after galvanizing.

[0003] The patent titled "A Novel PCB Board Inspection Equipment and Inspection Method," patent number CN116625212B, proposes that the flatness of PCB boards needs to be inspected before galvanizing. However, traditional inspection equipment can only detect whether the bending radius of the PCB board is qualified and cannot correct the straightening of the PCB board. This new method works by using a sliding column that is squeezed by the workpiece and retracts towards the slider when the bending deformation of the workpiece exceeds the error range during the inspection process. As the slider continues to slide upward, the inclined surface separates from the side wall of the workpiece. At this time, the compression spring squeezes the sliding column outward, and the side wall of the slide groove is adapted to push the connecting column to flip downward around the hinge point until the connecting column retracts into the slide groove. When the slider moves to the top, the metal sheet cannot be inserted into the corresponding station at the top of the fixed frame, and the workpiece is a defective product.

[0004] Although it can detect the bending of PCBs that have already bent and identify PCBs that have been bent and deformed, it can detect or straighten PCBs that have slightly bent in the middle during the detection process. When there is slight deformation in other parts of the PCB, it cannot detect whether deformation has occurred in real time. Therefore, a deformation monitoring device and method for PCBs is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a deformation monitoring device and method for PCB boards to solve the problems mentioned in the background art.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a deformation monitoring device and method for PCB boards, including a bearing housing, wherein multiple plug-in sockets are installed inside the bearing housing, and multiple warning lights are connected to the bearing housing;

[0007] The connector has an integrally formed recessed placement seat inside, which is connected to a compression positioning structure. A micro air pump is fixedly connected inside the connector, and the outlet of the micro air pump is connected to a gas storage shell. A first micro solenoid valve is connected to the outside of the gas storage shell. A semi-rigid movable support is fixedly connected inside the connector. Multiple rubber slide rods are fixedly connected inside the semi-rigid movable support. A connecting block is movably connected to the outside of the rubber slide rods. A push monitoring plate is fixedly connected to the outside of the connecting block. The outer walls of both the semi-rigid movable support and the recessed placement seat are provided with movable grooves. The push monitoring plate is located inside the movable grooves. Multiple telescopic expansion tubes are fixedly connected to the bottom of the connecting block. The end of the first micro solenoid valve away from the gas storage shell is connected to the multiple telescopic expansion tubes through a gas supply pipe.

[0008] The external surface of the push monitoring plate and the internal top wall of the recessed placement seat are both connected to conductive structures, which are electrically connected to the warning light.

[0009] Preferably, the conductive structure includes two conductive stickers, which are respectively attached to the inner top wall of the recessed placement seat and the upper surface of the push monitoring plate. The conductive sticker located on the inner top wall of the recessed placement seat is electrically connected to the warning light.

[0010] Preferably, the compression positioning structure includes a bottom compression bladder, which is integrally formed on the inner wall of the concave placement seat. A second solenoid valve is connected to the outside of the gas storage shell, and the end of the second solenoid valve away from the gas storage shell is connected to the bottom compression bladder.

[0011] Preferably, the plug-in socket has an integrally formed inner expansion body, which is located outside the concave placement seat and the micro air pump. The gas storage shell is connected to a third solenoid valve and a fourth solenoid valve. The ends of the third and fourth solenoid valves away from the gas storage shell are connected to the inner expansion body through pipes.

[0012] Preferably, a fourth solenoid valve is connected to the outside of the gas storage shell, and the end of the fourth solenoid valve away from the gas storage shell is connected to a semi-rigid movable support.

[0013] Preferably, the inner expansion body is composed of multiple soft connecting layers and soft iron layers, the soft connecting layers are made of soft rubber, and an electromagnet is fixedly connected inside the inner expansion body.

[0014] Preferably, a heating wire is fixedly connected inside the inner expansion body.

[0015] Preferably, the connecting block has an inlet / outlet through hole on its exterior, the rubber slide rod is located inside the inlet / outlet through hole, and multiple ball bearings are installed inside the inlet / outlet through hole and on the exterior of the connecting block.

[0016] Preferably, the inner expansion body, the semi-rigid movable support, and the telescopic expansion tube are all externally connected to a miniature exhaust valve.

[0017] Preferably, the distance between the outer bottom wall of the connector and the inner bottom wall of the supporting shell is 5-8cm, and the distance between multiple connectors is 2-4cm.

[0018] This invention also provides a method for monitoring the deformation of a PCB board, comprising the following steps:

[0019] S1. PCB board placement and positioning: The PCB board to be transported and monitored is placed inside the recessed placement seat, and gas is delivered into the bottom squeezing bladder by starting the micro air pump to position the PCB board placed inside the recessed placement seat.

[0020] S2. Timed monitoring: During transportation or after transportation to the designated location, the micro air pump is activated to deliver gas into the telescopic expansion tube, causing the monitoring board to move up and down inside the concave placement seat. The up and down movement of the monitoring board is used to monitor whether the PCB board is in a flat state.

[0021] S3, Bending Repair: When the PCB board is detected to be bent, the inner expansion body is attracted by an electromagnet to squeeze and position the PCB board inside the concave placement seat, and the bending state of the PCB board is adjusted by continuous squeezing and positioning.

[0022] The beneficial effects of this invention are as follows: In this invention, the PCB board located inside the recessed placement seat can be monitored in real time by moving the strip-shaped push monitoring plate up and down, avoiding the phenomenon that the PCB board bends during transportation and stacking without the staff's knowledge. Inside the recessed placement seat, the bottom of the PCB board can be pressed against the side wall of the recessed placement seat by the expanding bottom compression bladder, which makes the PCB board stable during transportation. At the same time, during transportation, the push monitoring plate moves up and down inside the recessed placement seat by pushing the connecting block through the telescopic expansion tube. When the PCB board is deformed or deformed in certain positions, the push monitoring plate will be blocked by the deformed PCB board, making it impossible for the two conductive stickers to stick together, thereby triggering an alarm through the warning light. Attached Figure Description

[0023] Figure 1 This is one of the three-dimensional structural schematic diagrams of an embodiment of the present invention;

[0024] Figure 2 This is a second three-dimensional structural schematic diagram of an embodiment of the present invention;

[0025] Figure 3 This is a partial cross-sectional view of the connector in an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of the inner expansion body and the micro exhaust valve in an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the semi-rigid movable support and rubber slide rod in an embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram of the internal structure of the semi-rigid movable bearing seat in an embodiment of the present invention;

[0029] Figure 7 This is a schematic diagram of the connecting block and the ball bearing in an embodiment of the present invention;

[0030] Figure 8 This is a cross-sectional view of the connector in an embodiment of the present invention;

[0031] Figure 9 This is a schematic diagram of the structure of the soft connecting layer and the soft iron layer in an embodiment of the present invention;

[0032] Figure 10 This is an embodiment of the present invention. Figure 2 A magnified structural diagram of area A in the diagram;

[0033] Figure 11 This is an embodiment of the present invention. Figure 3 A magnified structural diagram of region B in the diagram;

[0034] Figure 12 This is an embodiment of the present invention. Figure 6 A magnified schematic diagram of region C in the diagram;

[0035] Figure 13 This is an embodiment of the present invention. Figure 8 A magnified schematic diagram of region D in the diagram.

[0036] The attached diagram lists the components represented by each number as follows:

[0037] 100. Support housing; 101. Plug-in socket; 102. Warning light; 103. Recessed placement seat; 104. Miniature air pump; 105. Gas storage shell; 106. First miniature solenoid valve; 107. Semi-rigid movable support seat; 108. Rubber slide rod; 109. Connecting block; 110. Push monitoring plate; 111. Telescopic expansion tube; 112. Conductive sticker; 113. Second solenoid valve; 114. Bottom compression bladder; 200. Inner expansion body; 201. Third solenoid valve; 202. Fourth solenoid valve; 300. Soft connecting layer; 301. Soft iron layer; 302. Electromagnet; 400. Heating wire; 500. Ball bearing; 600. Miniature exhaust valve. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0040] In the description of this application, the term "for example" is used to mean "used as an example, illustration, or description." Any embodiment described as "for example" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use the invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the invention can be made without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the invention with unnecessary detail. Therefore, the invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0041] In use, the PCB board is placed in the recessed placement seat 103. After placement, the micro air pump 104 is activated to inject gas into the first micro solenoid valve 106, causing the telescopic expansion tube 111 to expand. This causes the connecting block 109 and the push monitoring plate 110 to move upward inside the recessed placement seat 103. If the PCB board inside the recessed placement seat 103 deforms during the upward movement of the push monitoring plate 110, the push monitoring plate 110 will be blocked from moving upward by the deformed PCB board. When the push monitoring plate 110 is blocked, the two conductive stickers 112 cannot stick together for a long time, and the warning light 102 will be activated to sound an alarm, indicating that the PCB board is bent. After the PCB board is bent, the micro air pump 104 is continuously activated to inject gas into the inner expansion body 200, and the electromagnet 302 is activated. This causes the side walls of the expanded inner expansion body 200 to attract and squeeze the recessed placement seat 103, thereby squeezing and correcting the PCB board inside the recessed placement seat 103.

[0042] Example 1

[0043] like Figure 1 As shown, the PCB board deformation monitoring device and method of this application includes a carrier housing 100, a plurality of plug-in sockets 101 are installed inside the carrier housing 100, and a plurality of warning lights 102 are connected to the carrier housing 100.

[0044] The connector 101 has an integrally formed recessed placement seat 103 inside, which is connected to a compression positioning structure. A miniature air pump 104 is fixedly connected inside the connector 101. The air outlet of the miniature air pump 104 is connected to a gas storage shell 105. A first miniature solenoid valve 106 is connected to the outside of the gas storage shell 105. A semi-rigid movable support seat 107 is fixedly connected inside the connector 101. Multiple rubber slide rods are fixedly connected inside the semi-rigid movable support seat 107. 108, the rubber slide rod 108 is externally connected to a connecting block 109, the connecting block 109 is externally fixedly connected to a push monitoring plate 110, the outer walls of the semi-rigid movable bearing seat 107 and the concave placement seat 103 are both provided with movable sliding grooves, the push monitoring plate 110 is located inside the movable sliding groove, the bottom of the connecting block 109 is fixedly connected to multiple telescopic expansion tubes 111, and the end of the first micro solenoid valve 106 away from the gas storage shell 105 is connected to multiple telescopic expansion tubes 111 through a gas transmission pipe;

[0045] The external surface of the push monitoring plate 110 and the internal top wall of the recessed placement seat 103 are both connected to conductive structures, which are electrically connected to the warning light 102.

[0046] Specifically, during use, the operator can place the PCB board inside the connector 101 and inject gas into the gas storage shell 105 by activating the micro air pump 104. After the gas enters the gas storage shell 105, the first micro solenoid valve 106 is opened to transport the gas inside the gas storage shell 105 through the first micro solenoid valve 106 and the pipeline to the telescopic expansion tube 111. After the gas enters the telescopic expansion tube 111, the telescopic expansion tube 111 will expand upward. After the telescopic expansion tube 111 continues to expand upward, it will push up the connecting block 109. The connecting block 109 is movably connected to the rubber slide rod 108 through the rubber slide rod 108, so that the connecting block 109 is subjected to telescopic expansion. After the expansion tube 111 is pressed down, it will move up and down inside the semi-rigid movable support 107 following the guidance of the rubber slide rod 108. During the up and down movement of the connecting block 109, it will drive the push monitoring plate 110 to move up and down. During the up and down movement of the push monitoring plate 110, the PCB board located inside the recessed placement seat 103 can be bent. When the PCB board is bent, the bent PCB board will block the up and down movement of the push monitoring plate 110, thus causing the push monitoring plate 110 to stop at the bent position. When the push monitoring plate 110 does not move to the top of the recessed placement seat 103 for a long time, the conductive structure will alarm through the electrically connected warning light 102, determining that the PCB board has undergone unusable deformation.

[0047] Furthermore, the monitoring plate 110 is made of semi-rigid rubber.

[0048] Furthermore, before conducting the monitoring process, the entire system needs to be debugged. A good PCB board is placed inside the recessed placement seat 103 to test the air pressure required for the monitoring board 110 to move smoothly up and down inside the recessed placement seat 103. The current air pressure value is set as the standard value. An air pressure sensor is installed inside the telescopic expansion tube 111. When the monitoring board 110 is blocked during the monitoring process, and the air pressure inside the telescopic expansion tube 111 has reached or exceeded the standard value, an alarm is triggered by the warning light 102.

[0049] like Figure 10 As shown, the conductive structure includes two conductive stickers 112, which are respectively attached to the inner top wall of the recessed placement seat 103 and the upper surface of the push monitoring plate 110. The conductive sticker 112 located on the inner top wall of the recessed placement seat 103 is electrically connected to the warning light 102.

[0050] Specifically, in the conductive structure, when the PCB board does not deform, the push monitoring board 110 can smoothly move upward inside the recessed placement seat 103 to the inner top wall of the recessed placement seat 103, so that the conductive sticker 112 on the upper surface of the push monitoring board 110 and the conductive sticker 112 on the inner top wall of the recessed placement seat 103 will adhere together. After the two conductive stickers 112 adhere together, the PCB board can be determined to be in good condition.

[0051] like Figures 11-13 As shown, the extrusion positioning structure ensures that the PCB board remains upright and stable inside the recessed placement seat 103. The extrusion positioning structure includes a bottom extrusion bladder 114, which is integrally formed on the inner wall of the recessed placement seat 103. A second solenoid valve 113 is connected to the outside of the gas storage shell 105. The end of the second solenoid valve 113 away from the gas storage shell 105 is connected to the bottom extrusion bladder 114.

[0052] Specifically, by opening the second solenoid valve 113, the gas inside the gas storage shell 105 can be transported through a pipeline to the bottom compression bladder 114. As gas continues to enter the bottom compression bladder 114, it will continuously expand laterally, thereby positioning the top pressure inside the concave placement seat 103. This allows the PCB board inside the concave placement seat 103 to fit properly against the side wall of the concave placement seat 103 and remain upright, preventing the PCB board from being tilted inside the concave placement seat 103 and thus blocking the movement of the monitoring board 110.

[0053] Furthermore, when the bottom extrusion bladder 114 expands and presses against the bottom of the PCB board, if the PCB board has already deformed, the bottom extrusion bladder 114 pressing against the PCB board will cause the bottom of the PCB board to adhere to the side wall of the recessed placement seat 103, resulting in the deformed part contacting the side wall of the recessed placement seat 103, thereby exposing the deformed position more quickly.

[0054] The technical solutions in the above embodiments of this application have at least the following technical effects or advantages: In this embodiment, the PCB board is placed inside the recessed placement seat 103, and the PCB board is kept upright inside the recessed placement seat 103 by the expanding bottom compression bladder 114. The PCB board is monitored by the up-and-down moving push monitoring plate 110. When the PCB board deforms, the push monitoring plate 110 will be blocked by the deformed position and will not be able to continue to move up and down. When the push monitoring plate 110 cannot move up and down, the warning light 102 will issue a prompt and alarm, thereby reducing the phenomenon of PCB board deformation during transportation.

[0055] Example 2

[0056] Considering that PCBs vary in size and model during use, the limited internal space of the recessed mounting base 103 cannot support larger PCBs during transport, hindering the monitoring of PCBs with different deformations during transport. To address these technical problems, the following technical solution is proposed:

[0057] like Figures 3-13 As shown, an inner expansion body 200 is integrally formed inside the plug-in socket 101. The inner expansion body 200 is located outside the recessed placement seat 103 and the micro air pump 104. A third solenoid valve 201 and a fourth solenoid valve 202 are connected to the outside of the gas storage shell 105. The ends of the third solenoid valve 201 and the fourth solenoid valve 202 away from the gas storage shell 105 are connected to the inner expansion body 200 through pipes.

[0058] Specifically, when it is necessary to transport and monitor a large PCB board, the internal space of the recessed placement base 103 needs to be expanded as a whole. By opening the third solenoid valve 201 and the fourth solenoid valve 202, the gas injected into the gas storage shell 105 by the micro air pump 104 is delivered to the interior of the inner expansion body 200. When the gas is delivered to the interior of the inner expansion body 200, it will cause the inner expansion body 200 to expand vertically, thereby causing the entire plug-in base 101 to expand vertically. The inner expansion body 200 is divided into a left expansion body and a right expansion body, and the middle part is connected to the bottom of the recessed placement base 103. When the left expansion body and the right expansion body expand vertically at the same time, the vertical storage space inside the recessed placement base 103 will be expanded vertically, which is convenient for supporting larger PCB boards.

[0059] Furthermore, the inner expansion body 200, the semi-rigid movable support 107, and the telescopic expansion tube 111 are all externally connected to a miniature exhaust valve 600, which allows the gas inside the inner expansion body 200, the semi-rigid movable support 107, and the telescopic expansion tube 111 to be discharged.

[0060] Furthermore, the distance between the outer bottom wall of the connector 101 and the inner bottom wall of the supporting housing 100 is 5cm, and the distance between multiple connectors 101 is 4cm. The distance between the connector 101 and the supporting housing 100 can ensure that the connector 101 has a telescopic space.

[0061] like Figure 6-11 As shown, a fourth solenoid valve 202 is connected to the outside of the gas storage shell 105, and the end of the fourth solenoid valve 202 away from the gas storage shell 105 is connected to the semi-rigid movable support 107.

[0062] Furthermore, the connecting block 109 has an inlet and outlet through hole on its exterior, and the rubber slide rod 108 is located inside the inlet and outlet through hole. Multiple ball bearings 500 are installed inside the inlet and outlet through hole and on the exterior of the connecting block 109.

[0063] Specifically, when the internal space of the concave placement seat 103 expands vertically, gas is injected into the semi-rigid movable support seat 107 by opening the fourth solenoid valve 202, causing the semi-rigid movable support seat 107 and the rubber slide rod 108 to expand vertically together with the concave placement seat 103, thereby expanding the movable position of the monitoring plate 110. At the same time, when the semi-rigid movable support seat 107 and the rubber slide rod 108 extend vertically, multiple ball bearings 500 ensure the stability of the connecting block 109 moving inside the semi-rigid movable support seat 107.

[0064] Furthermore, in order to ensure the stability of the semi-rigid movable support 107 and the rubber slide rod 108 after expansion, electrorheological fluid can be injected into the interior of the semi-rigid movable support 107 and the rubber slide rod 108, and the electrorheological fluid can be energized to harden the fluid, thereby ensuring the stability of the semi-rigid movable support 107 and the rubber slide rod 108.

[0065] The technical solutions in the above embodiments of this application have at least the following technical effects or advantages: In this embodiment, the expansion of the inner expansion body 200 causes the plug-in seat 101 to expand, thereby expanding the internal space of the recessed placement seat 103, which facilitates the storage of PCBs of different sizes and realizes the transportation monitoring of PCBs of different sizes.

[0066] Example 3

[0067] Considering that PCB boards that have already undergone bending deformation will continue to deform during transportation, this application proposes the following technical solution to address the aforementioned technical problem:

[0068] like Figures 8-13 As shown, the inner expansion body 200 is composed of multiple soft connecting layers 300 and soft iron layers 301. The soft connecting layers 300 are made of soft rubber. An electromagnet 302 is fixedly connected inside the inner expansion body 200.

[0069] Specifically, the inner expansion body 200 is divided into a left expansion body and a right expansion body. When the deformation of the PCB board is detected, gas can be injected into the left expansion body to make it expand. At the same time, the electromagnet 302 is turned on. After the electromagnet 302 is turned on, the inner expansion body 200 on the left, which is composed of multiple soft connecting layers 300 and soft iron layers 301, will actively move closer to the electromagnet 302, thereby squeezing the concave placement seat 103. Through the active squeezing of the concave placement seat 103, the PCB board located inside the concave placement seat 103 is squeezed and shaped.

[0070] Furthermore, the left-side expansion body is attracted from top to bottom by the electromagnet 302, and the magnetic force at the bottom is weaker, so that the expanded left-side expansion body attracted by the electromagnet 302 will not squeeze the push monitoring plate 110 and the bottom compression bladder 114 located below.

[0071] Furthermore, a heating wire 400 is fixedly connected inside the inner expansion body 200. By turning on the heating wire 400, heat can be generated to soften the PCB board and enhance its plasticity. The inner expansion body 200 is located in the left expansion body. The heat generated will cause the air inside the left expansion body to expand further, thereby enhancing the compression and positioning performance of the PCB board.

[0072] The technical solutions in the above embodiments of this application have at least the following technical effects or advantages: In this embodiment, when a bending phenomenon is detected in the PCB board, the electromagnet 302 located in the right expansion body attracts the inner expansion body 200 of the left expansion body, and the inner expansion body 200 of the left expansion body squeezes the concave placement seat 103 and the PCB board located inside the concave placement seat 103, thereby correcting the gradually bending PCB board by squeezing and avoiding continuous deformation.

[0073] This invention also provides a method for monitoring the deformation of a PCB board, comprising the following steps:

[0074] S1. PCB board placement and positioning: The PCB board to be transported and monitored is placed inside the recessed placement seat 103, and gas is delivered to the bottom squeezing bladder 114 by starting the micro air pump 104 to position the PCB board placed inside the recessed placement seat 103.

[0075] S2. Timed monitoring: During transportation or after transportation to a designated location, the micro air pump 104 is activated to deliver gas into the telescopic expansion tube 111, causing the monitoring plate 110 to move up and down inside the recessed placement seat 103. The up and down movement of the monitoring plate 110 is used to monitor whether the PCB board is in a flat state.

[0076] S3, Bending Repair: When the PCB board is detected to be bent, the electromagnet 302 is used to attract the inner expansion body 200 to squeeze and position the PCB board inside the concave placement seat 103, and the bending state of the PCB board is adjusted by continuous squeezing and positioning.

[0077] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0078] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A PCB board deformation monitoring device, comprising a supporting housing (100), characterized in that: The interior of the carrier housing (100) is equipped with multiple plug-in sockets (101), and multiple warning lights (102) are connected to the carrier housing (100). The connector (101) has an integrally formed recessed placement seat (103) inside, which is connected to a compression positioning structure. A miniature air pump (104) is fixedly connected inside the connector (101). The air outlet of the miniature air pump (104) is connected to a gas storage shell (105). A first miniature solenoid valve (106) is connected to the outside of the gas storage shell (105). A semi-rigid movable support seat (107) is fixedly connected inside the connector (101). Multiple rubber sliding rods are fixedly connected inside the semi-rigid movable support seat (107). (108), the rubber slide rod (108) is movably connected to a connecting block (109), the connecting block (109) is fixedly connected to a push monitoring plate (110), the outer walls of the semi-rigid movable bearing seat (107) and the concave placement seat (103) are both provided with moving grooves, the push monitoring plate (110) is located inside the moving groove, the bottom of the connecting block (109) is fixedly connected to multiple telescopic expansion tubes (111), the end of the first micro solenoid valve (106) away from the gas storage shell (105) is connected to multiple telescopic expansion tubes (111) through a gas transmission pipe; The external side of the push monitoring plate (110) and the internal top wall of the recessed placement seat (103) are both connected to conductive structures, which are electrically connected to the warning light (102).

2. The PCB board deformation monitoring device according to claim 1, characterized in that: The conductive structure includes two conductive stickers (112), which are respectively attached to the inner top wall of the recessed placement seat (103) and the upper surface of the push monitoring plate (110). The conductive sticker (112) located on the inner top wall of the recessed placement seat (103) is electrically connected to the warning light (102).

3. The PCB board deformation monitoring device according to claim 1, characterized in that: The compression positioning structure includes a bottom compression bladder (114), which is integrally formed on the inner wall of the concave placement seat (103). The gas storage shell (105) is externally connected to a second solenoid valve (113), and the end of the second solenoid valve (113) away from the gas storage shell (105) is connected to the bottom compression bladder (114).

4. The PCB board deformation monitoring device according to claim 3, characterized in that: The plug-in socket (101) has an integrally formed inner expansion body (200) inside. The inner expansion body (200) is located outside the concave placement seat (103) and the micro air pump (104). The gas storage shell (105) is connected to a third solenoid valve (201) and a fourth solenoid valve (202). The end of the third solenoid valve (201) and the fourth solenoid valve (202) away from the gas storage shell (105) is connected to the inner expansion body (200) through a pipe.

5. The PCB board deformation monitoring device according to claim 4, characterized in that: The gas storage shell (105) is externally connected to a fourth solenoid valve (202), and the end of the fourth solenoid valve (202) away from the gas storage shell (105) is connected to a semi-rigid movable support (107).

6. The PCB board deformation monitoring device according to claim 5, characterized in that: The inner expansion body (200) is composed of multiple soft connecting layers (300) and soft iron layers (301). The soft connecting layers (300) are made of soft rubber. An electromagnet (302) is fixedly connected inside the inner expansion body (200).

7. The PCB board deformation monitoring device according to claim 4, characterized in that: A heating wire (400) is fixedly connected inside the inner expansion body (200).

8. The PCB board deformation monitoring device according to claim 1, characterized in that: The connecting block (109) has an inlet and outlet through hole on its exterior. The rubber slide rod (108) is located inside the inlet and outlet through hole. Multiple balls (500) are installed inside the inlet and outlet through hole and on the exterior of the connecting block (109).

9. The PCB board deformation monitoring device according to claim 4, characterized in that: The inner expansion body (200), the semi-rigid movable support (107), and the telescopic expansion tube (111) are all externally connected to a miniature exhaust valve (600).

10. A method for monitoring the deformation of a PCB board, comprising the PCB board deformation monitoring device according to any one of claims 1-9, characterized in that, Includes the following steps: S1, PCB board placement and positioning: The PCB board to be transported and monitored is placed inside the recessed placement seat (103), and gas is delivered to the bottom squeezing bladder (114) by starting the micro air pump (104) to position the PCB board placed inside the recessed placement seat (103). S2. Timed monitoring: During transportation or after transportation to a designated location, the micro air pump (104) is activated to deliver gas into the telescopic expansion tube (111), causing the push monitoring plate (110) to move up and down inside the concave placement seat (103). The PCB board is monitored for flatness by monitoring the up and down movement of the push monitoring plate (110). S3, Bending Repair: When the PCB board is detected to be in a bent state, the inner expansion body (200) is attracted by the electromagnet (302) to squeeze and position the PCB board inside the concave placement seat (103), and the bending state of the PCB board is adjusted by continuous squeezing and positioning.

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