Seal for optical components

Abstract

An electronic device can have optical components each having a first transparent layer and a second transparent layer, such as first and second glass layers. The glass layers can have outer surfaces facing away from each other and inner surfaces facing each other. A polymer layer is formed between the inner surfaces of the glass layers. Along a periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal can have a moisture barrier layer attached to the first and second glass layers. The moisture barrier layer can be supported by an elastomeric cushioning member. The moisture barrier layer can be formed of a metal film or a polymer layer or other substrate coated with a moisture-impermeable coating. The moisture-impermeable coating can be formed of one or more thin film metal layers and / or one or more thin film dielectric layers.

Description

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 303,864, filed January 27, 2022, and U.S. Provisional Patent Application No. 63 / 244,181, filed September 14, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates generally to electronic devices, and more specifically to electronic devices having optical components. Background Technology

[0003] Electronic devices may have optical components. For example, electronic devices may have waveguides and other structures formed of transparent materials. These materials may be sensitive to chemical or moisture-induced degradation if exposed to excessive moisture. In addition, these materials may contain volatile substances that can cause degradation if they leave the system. Summary of the Invention

[0004] An electronic device may have a support structure supporting one or more optical components. Each optical component may have a first transparent layer and a second transparent layer, such as a first glass layer and a second glass layer. The glass layers may have outer surfaces facing away from each other and inner surfaces facing each other. A moisture-sensitive polymer layer (e.g., an organic polymer layer) may be formed between the inner surfaces of the glass layers.

[0005] A moisture barrier can be formed along the periphery of each optical component to protect the polymer material of the polymer layer. The moisture barrier can provide an airtight seal extending between the first and second glass layers. The seal can include a moisture barrier layer, such as a metal foil layer or a polymer layer coated with a moisture-resistant coating, such as a metallic or inorganic dielectric film coating. Attached Figure Description

[0006] Figure 1 It is a cross-sectional side view of an exemplary electronic device according to one implementation scheme.

[0007] Figure 2 This is a front view of an exemplary optical component with a peripheral seal according to an embodiment.

[0008] Figure 3 This is a cross-sectional view of an exemplary peripheral seal for an optical component according to the implementation scheme.

[0009] Figure 4A , Figure 4B , Figure 5 , Figure 6 , Figure 7 and Figure 8 This is a view of another exemplary peripheral seal for an optical component according to the implementation scheme.

[0010] Figure 9 This is a cross-sectional side view of an exemplary peripheral seal having a polymer substrate layer with a moisture-proof coating, according to an embodiment.

[0011] Figure 10 This is a cross-sectional side view of an exemplary peripheral seal with a solder-sealed joint according to the implementation plan.

[0012] Figure 11 This is a cross-sectional side view of an exemplary peripheral seal with a mesh-sealed joint according to the implementation plan.

[0013] Figure 12 This is a diagram of an illustrative conveyor belt based on the implementation plan.

[0014] Figure 13 This is a cross-sectional side view of an exemplary mesh belt according to the implementation plan.

[0015] Figure 14 and Figure 15 This is a cross-sectional side view of an exemplary peripheral seal with an electroplated moisture-proof coating according to the implementation scheme.

[0016] Figure 16 and Figure 17 This is a cross-sectional side view of an exemplary peripheral seal with a multi-layered coating according to the implementation scheme. Detailed Implementation

[0017] Electronic devices may have a housing structure. This housing structure, sometimes referred to as a support structure, can be used to support and / or enclose device components such as batteries, displays, integrated circuits, sensors, other circuitry, and optical components. Examples of optical components that can be used in electronic devices include lenses and lenses with embedded waveguides, optical devices with sensitive coatings, displays such as liquid crystal displays (e.g., displays in which an array of liquid crystal pixels is sandwiched between an inner glass layer and an outer glass layer and a polarizer), organic light-emitting diode displays (e.g., displays with organic light-emitting diode pixels sandwiched between glass layers or other layers), and / or other optical elements. The housing structure of the device can be configured to be mounted on a stand or frame, can be configured to rest on a desktop or other surface, or can be configured to be worn on a user's body part (e.g., wrist, arm, head, or other body part). During operation, the electronic device can use sensors and other circuitry to collect user input and other data, and can use displays and other output devices to provide output to the user.

[0018] Figure 1 The image shows a cross-sectional view of a portion of an exemplary electronic device. Figure 1As shown, electronic device 10 may have one or more optical components (sometimes referred to as optical elements), such as optical components 20. Each optical component 20 may be supported by a housing 18. Housing 18 may be a wearable housing or other suitable housing. Housing 18 may be formed of polymer, metal, and / or other suitable materials. Housing 18 may have one or more portions attached to the optical component 20 to support the optical component 20 during user use of device 10.

[0019] exist Figure 1 In one example, optical component 20 has a polymer layer (e.g., a polyurethane-based polymer or other polymer), such as polymer layer 14. Layer 14 may be sandwiched between a first transparent substrate (layer) 12 and an opposing second transparent substrate (layer) 12. Substrate 12 may be transparent layers, each having an outward-facing surface and an inward-facing surface. The outward-facing surfaces of substrate 12 may face away from each other. The inward-facing surfaces of substrate 12 may face each other. In some embodiments, pixels or other structures may be sandwiched between substrates 12. Exemplary configurations in which polymer layers (such as layer 14) are sandwiched between substrates 12 are sometimes described as examples.

[0020] Substrate 12 may be formed of glass (e.g., tempered glass, ceramic glass, high-refractive-index glass, and / or other glass layers), transparent crystalline materials (such as sapphire), transparent ceramics, transparent polymers, and / or other transparent substrate materials. In the exemplary configurations sometimes described herein as examples, substrate 12 is a glass substrate (sometimes referred to as a glass layer or glass member). The inner and outer surfaces of each substrate 12 may have planar regions (e.g., located on...). Figure 1 The substrates 12 may have regions in the XY plane and / or regions characterized by curved cross-sectional profiles (e.g., protruding and / or recessed regions). In an exemplary configuration, the outward-facing surface of one substrate 12 may be wholly or partially protruding, while the outward-facing surface of the other substrate 12 may be wholly or partially recessed. The substrates 12 may be coated with one or more optical coatings to alter their reflection, absorption, and / or transmission spectra.

[0021] Optical component 20 can be used to make light (e.g., along) Figure 1 The light traveling along the Z-axis passes through the lens. The lens can form a waveguide for transmitting image light from the display (e.g., image light can travel along a path located at the Z-axis). Figure 1 (In the example, the direction in the XY plane propagates within the waveguide). During the fabrication of optical component 20, polymer layer 14 can be processed to form a structure for a display or other optical structure such as optical structure 16.

[0022] Polymer layer 14 may be sensitive to water. To prevent degradation of polymer layer 14 and structure 16 due to exposure to moisture in the environment, layer 14 may be hermetically sealed. In particular, hermetically sealed elements may be provided around the periphery of optical component 20. Hermetically sealed elements prevent environmental contaminants from entering layer 14 and prevent volatile compounds and / or moisture from escaping from layer 14 to the external area surrounding component 20, thereby helping to prevent degradation of layer 14.

[0023] Figure 2 This is a front view of an exemplary optical component 20, showing how the seal 22 extends along the periphery of the component 20, thereby preventing moisture from entering at any point on the edge of the component 20. Figure 2 Element 20 has an elliptical coverage area, but may generally have any suitable shape (e.g., rectangular profile, circular profile, teardrop profile, profile with a combination of straight and curved outer edges, and / or other suitable shapes). Seal 22, sometimes referred to as a moisture-proof seal or damp seal, may be formed of one or more moisture-proof barrier layers and / or other structures that provide structural support, adhesion, joint sealing, etc.

[0024] As an example, consider Figure 3 A cross-sectional side view of the optical component 20. (See image.) Figure 3 As shown, the optical component 20 may have a first substrate and a second substrate 12. A polymer layer 14 may be formed between the substrates 12. When unprotected, moisture can enter the polymer layer 14 at the peripheral edge E of the component 20. To hermetically seal the component 20 and thereby protect the layer 14 from moisture ingress, a seal 22 may be formed along the edge E and may extend around the entire periphery of the component 20, such as... Figure 2 As shown.

[0025] exist Figure 3 In the example, seal 22 includes an elastomeric cushioning member, such as cushioning member 28, that supports moisture barrier 24 (sometimes referred to as airtight barrier, environmental barrier, or barrier). Figure 3 In the example, barrier layer 24 includes a first portion formed by barrier layer 24A and a second portion formed by barrier layer 24B. Layers 24A and 24B are joined at joint 26 (e.g., using solder, laser welding or other welding, adhesive, and / or other joining mechanisms that bond the mating surfaces of layers 24A and 24B together). By attaching layers 24A and 24B together in this manner, layers 24A and 24B form an integral moisture barrier layer (layer 24) for seam 22.

[0026] To seal edge E, layer 24 is bonded to edge E by attaching a first edge of layer 24 to a first substrate in substrate 12 (as shown in the joint 30 between layer 24A and the outer surface of the first substrate 12) and by attaching a opposing second edge of layer 24 to a second substrate in substrate 12 (as shown in the joint 30 between layer 24B and the outer surface of the second substrate 12). Joint 30 may be formed of an adhesive, solder, or other material used to form a hermetically sealed joint between layer 24 and the glass or other material of substrate 12. For example, joint 30 may be formed using adhesives exhibiting low water vapor permeability (such as polyisobutylene, epoxy resin, acrylic core tape, silver-based adhesive, fluorosilicone) or other adhesives, may be formed by metal solder based on indium tin alloy or other metals, and / or may be formed by direct bonding, in which the metal foil or other material of layer 24 is directly soldered to the glass or other material of substrate 12. If desired, layer 24 may be formed of solder foil, allowing solder joints to be formed directly between foil surfaces (e.g., soldered foil-to-foil joints and soldered foil-to-glass joints). In some configurations, a metal layer (e.g., a metal strip extending along the periphery of component 20) is formed on the surface of substrate 12 to help allow the formation of solder joints (e.g., to enhance solder adhesion to substrate 12).

[0027] The thicknesses T1 and T3 of substrate 12 can be equal, or the values ​​of T1 and T2 can be different from each other. Thicknesses T1 and T3 can have values ​​from 50 micrometers to 1000 micrometers or from 100 micrometers to 400 micrometers, or other suitable substrate thicknesses can be used to form the substrate 12 of element 20 (e.g., T1 and / or T3 can be at least 50 micrometers, at least 200 micrometers, at least 250 micrometers, less than 1000 micrometers, less than 700 micrometers, less than 350 micrometers, etc.). The thickness T2 of polymer layer 14 can be from 400 micrometers to 800 micrometers, at least 200 micrometers, at least 300 micrometers, at least 450 micrometers, less than 1200 micrometers, less than 750 micrometers, less than 600 micrometers, etc.

[0028] Layer 24 may be formed from materials such as metal foil (e.g., foil formed of aluminum, stainless steel, copper, nickel, and / or other metals), low water vapor transmission rate plastics (such as polychlorotrifluoroethylene (PCTFE)), or high water vapor transmission rate plastics coated with a barrier film to reduce their water transmission rate, or other moisture-proof materials. The thickness of layer 24 may be 5-45 micrometers, at least 5 micrometers, at least 10 micrometers, at least 15 micrometers, at least 20 micrometers, at least 40 micrometers, less than 100 micrometers, less than 75 micrometers, less than 60 micrometers, less than 30 micrometers, or other suitable thicknesses. Layer 24 is preferably thin enough to bend into the desired shape of the seal 22, while being thick enough to exhibit the desired strength while serving as a moisture barrier. Thinner foils tend to provide less resistance to thermal motion. Thicker foils tend to provide better handling and moisture-proof properties. Layer 24 preferably has a thickness and composition that allows layer 24 (e.g., under heat and / or pressure) to form the desired shape. As an example, layer 24 may have a thickness of less than 100 micrometers or less than 50 micrometers, allowing the desired three-dimensional shape to be imprinted and / or otherwise molded (pressed) into layer 24.

[0029] The buffer element 28, sometimes referred to as a cushioning member, support member, moisture barrier support, or support structure, may be formed of an elastomeric material or other compliant material. This allows the buffer element 28 to expand and contract to accommodate temperature-induced changes in the thickness of the element 20 (e.g., the compliant nature of the buffer element 28 helps to avoid stress caused by a possible mismatch between the coefficients of thermal expansion of each layer of the element 20 and the coefficient of thermal expansion of the buffer element 28).

[0030] Examples of suitable materials for the buffer 28 include silicone, polyisobutylene, polyvinylidene fluoride, chloroprene rubber, and nitrile rubber. These materials may exhibit desired properties such as the ability to match temperature-induced expansion in layer 14 (e.g., if the coefficient of thermal expansion of layer 14 is greater than 200 ppm / °C, then the buffer 28 may exhibit an approximately matching coefficient of thermal expansion of 100 ppm / °C to 300 ppm / °C), low elastic modulus (e.g., less than 10 MPa), chemical compatibility with layer 14, low solubility for the liquid components in layer 14, low water vapor transmission rate, satisfactory adhesion to the edges of component 20, minimal permanent deformation under applied stress (e.g., in a temperature range of -40°C to 85°C or other suitable temperature ranges), a glass transition temperature outside the intended operating range of device 10 (e.g., a glass transition temperature less than -40°C or >85°C in an exemplary configuration), and a black appearance or other optically opaque appearance (e.g., less than 0.5% reflectivity) to help suppress stray light. The buffer 28 may have the following characteristics: Figure 3 The C-shaped profile shown in the example or any other suitable cross-sectional shape.

[0031] Layers 24A and 24B of seal 22 may have the same shape and size (e.g., such that layer 24 is symmetrical about joint 26), or layers 24A and 24B may have different shapes and / or sizes (e.g., such that the shape of layer 24 is asymmetrical). The portions of layers 24A and 24B that join at joint 26 may be bent upward or downward to help reduce the lateral size of seal 22.

[0032] The lateral dimension (width W) of the buffer 28 can be at least 400 micrometers, at least 800 micrometers, at least 1600 micrometers, less than 4000 micrometers, less than 2000 micrometers, less than 1100 micrometers, less than 550 micrometers, less than 350 micrometers, or other suitable widths. The support provided by the buffer 28 to the layer 24 helps prevent damage to the layer 24 during the assembly and use of the device 10. If necessary, the buffer 28 can be omitted (e.g., to create an air gap between the inner surface of the layer 24 and the edge E of the element 20). This facilitates the assembly of the structure.

[0033] A portion of the support element 20 of housing 18 can be mounted on the edge portion of layer 24 (see example). Figure 3 The housing 18A) and / or the element 20 may be supported at the portion of the element 20 that does not overlap with the layer 24 (see, for example) Figure 3 (The housing 18B).

[0034] use Figure 3 In the type of hermetically sealed arrangement shown or other hermetically sealed arrangements, layer 14 can be hermetically sealed (e.g., preventing moisture, including damp substances such as sunscreens and sweat and / or other environmental contaminants, from entering layer 14 from the external area surrounding layer 14 and / or preventing mobile compounds (e.g., moisture and / or small molecules and / or other mobile substances) from escaping from within layer 14 to the external area surrounding layer 14). This helps maintain the integrity of layer 14 and prevents degradation of layer 14's performance. For example, hermetically sealing layer 14 can help maintain the structure within layer 14.

[0035] Optical performance can also be maintained by configuring hermetic seals to preserve the shape of element 20 within the operating temperature range (e.g., by ensuring that the edges do not become excessively compressed or expanded relative to the center of element 20 during temperature fluctuations). For example, consider a case where element 20 has planar layers 12 and 14, or other layers 12 and 14 characterized by a center thickness (e.g., a first thickness CT1 measured at the center of element 20) and an edge thickness (e.g., a second thickness CT2 measured adjacent to the periphery of element 20). By configuring the hermetic seals of element 20 such that changes in CT1 within a given temperature range are not significantly different from changes in CT2 within the same given temperature range, the optical performance of element 20 can be maintained.

[0036] For the exemplary configuration, the buffer 28 is formed of a low-modulus (e.g., less than 10 MPa) elastomeric polymer, such as silicone exhibiting a coefficient of thermal expansion of 100 ppm / °C to 300 ppm / °C; layer 12 is a glass layer; and layer 14 is a polymer having a thickness of about 600 micrometers and a lateral dimension of about 4 cm to 6 cm. Layer 24 is a single or multiple barrier film having a metal layer (e.g., 10 micrometers of aluminum) on a polymer substrate (e.g., a 40-micrometer-thick polypropylene film). Using this exemplary configuration, the seal 22 helps ensure that the difference between the changes in CT1 and CT2 within a temperature range of 0°C to 45°C is less than 0.5% and preferably less than 0.1%.

[0037] Figure 3 The configuration of seal 22 shown is illustrative. Other configurations may be used if desired (e.g., configurations exhibiting a thickness change of less than 0.5% or less than 0.1% between CT1 and CT2 when the temperature changes from 0°C to 45°C). Figure 4A As shown, layer 24 can be formed from a single layer extending from a first substrate in substrate 12 to a second substrate in substrate 12. This type of arrangement allows layer 24 to exhibit the characteristics of... Figure 4A The C-shaped profile shown is intended to help reduce buckling of the metal foil or other material used to form layer 24 when the seam 22 bends around the periphery of element 20, and to facilitate attachment of layer 24 around the entire periphery of element 20. Figure 4A Layer 24 can be formed from multiple non-intersecting segments located at different corresponding positions along the periphery of element 20. The ends of these segments can overlap and interlock to help ensure an airtight seal, such as... Figure 4B The figure shows an overlapping foil segment of layer 24 that constitutes the peripheral seal 22. This figure is a front view of an exemplary portion of component 22 and seal 22.

[0038] like Figure 5 As shown, the buffer 28 may have a non-C-shaped profile, such as a P-shaped profile. Figure 5 It also shows how layer 24 needs to be bonded to more than just the outer surface of substrate 12. Figure 5 In the example, the first edge of layer 24 is attached to the outer surface 40 of the first substrate in substrate 12 via a first bonding portion 30, and the opposite second edge of layer 24 is attached to the peripheral edge surface 42 of the second substrate in substrate 12 via a second bonding portion 30. Typically, layer 24 (whether formed as a single piece spanning the first and second substrates, or formed using...) Figure 3 The first and second pieces (formed by the joint 26 shown) can be attached to the inner surface, outer surface and / or edge surface of each substrate 12.

[0039] exist Figure 6 In the example, the buffer 28 has a rectangular shape with a pair of right-angled corners adjacent to the substrate 12 and a pair of rounded corners of the corresponding curved portion of the support layer 24. This type of shape of the buffer 28 can help reduce the width of the buffer 28.

[0040] exist Figure 7 In the exemplary arrangement, substrates 12 have different sizes (e.g., different lateral dimensions). This causes one substrate of substrate 12 to laterally protrude relative to the other substrate, thereby forming a flange 44. The buffer 28 may have one surface covering the peripheral edge of one substrate and the peripheral edge of layer 14, and another surface resting on the flange 44. Layer 42 may be coupled to the outer surface 40 of the first substrate in substrate 12 and the peripheral edge 42 of the second substrate (e.g., a protruding substrate) in substrate 12 using a coupling 30. This type of arrangement of the seal 22 (where layer 24 is coupled using both substrate surface coupling and substrate edge coupling) helps ensure that a glass substrate surface does not contact the seal 22 (e.g., to provide space for attaching the housing 18).

[0041] Figure 8 This illustrates how layer 24 is bonded to the inner surface 46 of substrate 12. Gap 48 can be an air-filled gap or can be filled with a cushioning material to form a cushioning element, such as... Figure 3 Buffer element 28. In Figure 8 In the arrangement shown, neither of the two outer substrate surfaces of the substrate 12 contacts the layer 24, providing an additional area for attachment of the housing 18.

[0042] Layer 24 may be formed of one or more materials (organic materials, inorganic materials, elemental metals and / or metal alloys forming the metal foil, thin-film metal coatings or other metal layers, low water vapor permeability polymers, organic / inorganic hybrid materials and / or other materials). For example... Figure 9 As shown, for example, layer 24 can be a moisture-proof layer having a substrate layer, such as substrate layer 24 (e.g., a polymer layer), which is covered by a moisture-impermeable layer, such as a moisture-proof coating 24'. The moisture-proof coating 24' can be formed of one or more moisture-impermeable materials. For example, coating 24' can be a thin-film metal layer, such as a thin-film layer of aluminum, nickel, chromium, or other metals, or it can be a dielectric thin-film layer formed of inorganic materials (such as silicon nitride or other nitrides, aluminum oxide, or other oxides). Coating 24' can be formed from a single thin-film coating layer or can be formed from a stack of multiple thin-film coating layers (e.g., layers of different materials).

[0043] Typically, layer 24 may be formed entirely of metal (e.g., layer 24 may be a metal foil), and may include one or more polymer layers (e.g., for providing strength to layer 24) and / or may include one or more metal thin film layers and / or dielectric thin film layers (e.g., for providing a moisture-proof coating to layer 24). If desired, layer 24 may include sufficient opaque material (e.g., opaque polymer, metal, etc.) to make layer 24 opaque, such that layer 24 can function as a light seal in addition to its function as a moisture-proof seal.

[0044] If needed, a planar joint sealing arrangement can be used to hermetically seal the structure of seal 22 to component 20. As an example, consider... Figure 10 The arrangement. For example... Figure 10 As shown, a buffer 28 can be formed on the peripheral edge of component 20 (e.g., using polymer thermoforming). An adhesive layer, such as polymer layer 50, can then be formed on the buffer 28. A moisture barrier, such as a metal layer 52 (e.g., metal foil), can be attached to the exposed outer surface of the adhesive layer, such that layers 50 and 52 serve as a moisture barrier. The metal can also be formed as a thin strip extending along the periphery of component 20 (see, for example, metal layer 56 on the outer surface of substrate 12). These strip-shaped metal layers can provide a surface to which solder can be attached by soldering. In an illustrative arrangement, each strip is a pad formed by a sputtered metal layer that provides adhesion, mechanical integrity, and oxidation resistance. The foil layer or other metal layer 52 in the seal 22 serves as a moisture barrier for the seal 22. To hermetically seal layer 52 to component 20, a seam sealing layer 54 (e.g., a strip of solder, other metal, or other sealing material extending along the peripheral edge of component 20) can be used to bridge the interface between the metal of foil 52 and the metal of strip 56, thereby bonding metal layer 52 to substrate 12 (e.g., sealing the seam formed between the metal strips of metal layer 52 and layer 56). In an exemplary configuration, each seam sealing layer 54 is formed from a solder strip deposited by a laser-based cryogenic solder ball spraying process, followed by flattening using a hot roller coated with PTFE or other non-stick coating material. Other seam sealing techniques can be used if desired. Figure 10 The sealing structure is attached to the periphery of element 20.

[0045] exist Figure 11 , Figure 12 and Figure 13 In the example, a mesh belt arrangement is used to form seal 22. For example... Figure 11 As shown, a mesh-based sealing strip 58 is used to form a mesh seal on opposite sides of the peripheral edge of the component 20. Each strip of the strip 58 extends along the periphery of the component 20 and attaches the outer surface of one of the substrates 12 to the corresponding exposed sealing surface (e.g., the adjacent exposed surface of the moisture barrier formed by the metal layer 52).

[0046] like Figure 11 As shown, each strip 58 may include a carrier substrate, such as a tape carrier 58A (e.g., a polymer tape substrate layer), a moisture barrier layer, such as a moisture barrier layer 58B (e.g., a metal film layer, such as a thin film layer of copper and nickel or other metals), and an adhesive layer 58C. The adhesive layer 58C may have an embedded mesh to prevent lateral moisture ingress. The mesh may form solder joints with the metals of layers 52 and 56, respectively.

[0047] Figure 12 A top view of layer 58C is shown. (As shown) Figure 12 As shown, layer 58C may include adhesive 60 (e.g., polymeric adhesive) and mesh 62. Mesh 62 may be formed from a grid of moisture-proof strands or other structures forming an open two-dimensional array to receive adhesive 60. As an example, each strand may be formed from wire or polymer core coated with one or more metal layers.

[0048] Figure 13 For along Figure 12 Line 64 is cut off and observed along direction 66. Figure 12 A cross-sectional side view of the strands of mesh 62. In this exemplary configuration, mesh 62 has strands of material formed from a core 62A (e.g., a core material formed of polymer, glass, and / or metal) coated with a first coating layer 62B and a second coating layer 62C. Coating layer 62B can be, for example, a nickel shell or other metal shell deposited without electroplating. Coating layer 62C can be, for example, a low-temperature solder coating deposited by electroplating. Coating layer 62C can be melted to form solder joints (e.g., solder joint 68 between mesh 62 and the metal of layer 58B, and solder joint 70 between mesh 62 and the metal of layer 56). In this way, strip 58 can be bonded to the metal of layer 56 and the metal of layer 52, thereby hermetically attaching (bonding) seal 22 to the edge of component 20.

[0049] exist Figure 14 and Figure 15 An alternative using an adhesive with an embedded mesh coated with a barrier layer is shown.

[0050] exist Figure 14In an exemplary sealing arrangement, elongated solder strips (such as solder beads 72) are used to form a solder joint and an hermetic seal between metal layers 52 and 56. In this type of arrangement, layer 50 can be an adhesive tape layer supported by buffer 28. Layer 50 may have a first layer (adhesive layer 50A) covered with a second layer (e.g., a catalyst-supported layer, such as a palladium-supported layer) to facilitate electroless growth of the subsequently formed metal layer 52. After layer 50 is attached to layer 56 using adhesive layer 50A (while exposing a portion of layer 56), layer 52 can be grown on layer 50B by electroless plating. Solder 72 can then be used to form a solder seal along the interface between layers 52 and 56. This forms an hermetic seal for seal 22.

[0051] exist Figure 15 In the exemplary sealing arrangement, electroless plating is used to form the seal. Layer 50 may be a homogeneous composite adhesive tape, the exposed surface of which is suitable for use as an electroless catalyst. Layer 50 may be formed from a polymer having a bulk catalyst dopant (such as a palladium catalyst). It can be formed by attaching the adhesive of layer 50 to the outer surface of substrate 12 and then electroless plating the metal layer 52 onto the exposed surface of layer 50. Figure 15 The sealing element 22. During the electroless plating operation, a portion 52' of layer 52 contacts the outer surface of substrate 12, and the joint formed between portion 52' and substrate 12 (and / or peripheral metal strip on substrate 12) hermetically seals layer 52 to element 20.

[0052] If necessary, a multi-layer coating can be used to form the seal 22. For example, consider... Figure 16 and Figure 17 Exemplary seals.

[0053] like Figure 16 As shown, the seal 22 may have a first (innermost) layer 80, a second (middle) layer 82, and a third (outermost) layer 84. These layers may be formed around the entire peripheral edge of the component 20 and may cover the buffer 28. If desired, the seal 22 may have additional layers (e.g., one or more coatings on layer 84). The seal 22 thus has three layers. Figure 16 The arrangement is illustrative.

[0054] The innermost layer 80 may be a polymer layer at the edge of component 20, preparing for a subsequent hermetic sealing layer. Layer 80 may be deposited using low injection pressure overmolding (LIPO) deposition techniques, needle dispensing techniques, three-dimensional dispensing techniques, or other suitable deposition techniques. The polymer material forming layer 80 may be epoxy resin, acrylic resin, or composite material, such as a polymer with embedded particles (e.g., epoxy resin with embedded silica particles or other filler particles, acrylic resin with embedded silica particles or other filler particles, etc.). The thickness of layer 80 may be from 0.05 micrometers to 1 mm, from 0.1 micrometers to 500 micrometers, at least 0.1 micrometers, at least 1 micrometer, at least 10 micrometers, less than 2000 micrometers, less than 1000 micrometers, less than 500 micrometers, less than 200 micrometers, or other suitable thicknesses. The coefficient of thermal expansion of layer 80 may be less than 100 ppm or other suitable values. The elastic modulus of layer 80 can be 10 MPa-2000 MPa, at least 1 MPa, at least 10 MPa, at least 100 MPa, less than 10,000 MPa, less than 3000 MPa, less than 1000 MPa, less than 300 MPa, less than 50 MPa, or other suitable values. Layer 80 can exhibit at least 5% critical strain.

[0055] The intermediate layer 82 forming the moisture barrier may contain one or more sublayers of material that contributes to enhancing the hermetic sealing properties of the seal 22. Each sublayer may be a metal oxide layer, a ceramic layer, a polymer layer, or other suitable hermetic sealing layer. In an exemplary single-layer configuration, layer 82 comprises a single layer of metal oxide or ceramic deposited by plasma-enhanced atomic layer deposition. In an exemplary double-layer configuration, the first sublayer of the two sublayers in layer 82 may be a metal oxide or ceramic layer deposited by plasma-enhanced atomic layer deposition, and the second sublayer of the two sublayers in layer 82 may be another metal oxide or ceramic layer deposited by plasma-enhanced atomic layer deposition (e.g., a different material from the first sublayer in the double layer). In exemplary configurations involving more than two sublayers, layer 82 may be formed using a stack of two or more pairs of sublayers. Each pair of sublayers may have a first sublayer formed of metal oxide, ceramic, or polymer, and may have a second sublayer formed of metal oxide or ceramic. These materials may be deposited by plasma-enhanced atomic layer deposition (as an example). Examples of metal oxides and ceramic materials (inorganic materials) that can be used to form layer 82 include alumina, titanium oxide, zinc oxide, zirconium oxide, silicon oxide, silicon nitride, and aluminum nitride. (For example, when forming a stack of sublayer pairs) Examples of multilayer inorganic and / or organic hybrid films that can be deposited include films based on sublayer pairs, such as alumina / titanium oxide pairs, alumina / silicon oxide pairs, alumina / novel aluminum-based organic-inorganic composite films (alucone) pairs, alumina / polymer pairs, etc. The thickness of layer 82 is typically less than the thickness of layer 80 and less than the thickness of layer 84. As an example, the thickness of layer 82 can be 0.05 nm to 1 micrometer, 0.1 nm to 500 nm, at least 0.1 nm, at least 1 nm, at least 10 nm, less than 2000 nm, less than 1000 nm, less than 500 nm, less than 200 nm, or other suitable thicknesses.

[0056] Optionally, the outermost layer 84 of the seal 22 may be a polymer protective layer applied using a three-dimensional dispersion deposition technique or other suitable deposition technique. Layer 84 may be formed of a polymer, such as silicone, acrylate, or other polymers that help protect the underlying layers (such as layers 80 and 82) in the seal 22. The thickness of layer 84 may be from 0.05 micrometers to 1 mm, from 0.1 micrometers to 500 micrometers, at least 0.1 micrometers, at least 1 micrometer, at least 10 micrometers, less than 2000 micrometers, less than 1000 micrometers, less than 500 micrometers, less than 200 micrometers, or other suitable thicknesses. The coefficient of thermal expansion of layer 84 may be less than 500 ppm or other suitable values. The elastic modulus of layer 84 may be from 0.1 MPa to 100 MPa, at least 0.01 MPa, at least 0.1 MPa, at least 1 MPa, less than 1000 MPa, less than 300 MPa, less than 100 MPa, less than 30 MPa, less than 5 MPa, or other suitable values. In the exemplary configuration, the elastic modulus of layer 84 is less than that of layer 80 (e.g., layer 80 may be a rigid polymer, while layer 84 may be formed from an elastomeric polymer). Layer 80 may exhibit at least 100% of its critical strain.

[0057] like Figure 16 and 17 As shown, buffer 28 can be inserted between the outer edges of layer 80 and layer 14. Buffer 28 can be omitted if necessary.

[0058] If required, the layers of seal 22 can have, for example... Figure 17 The tapered profile shown. Seals (such as...) Figure 16 The seal 22 and Figure 17 The seal 22) can exhibit low moisture vapor permeability (e.g., about 10). -4 g / m 2 / day or less of water vapor transmission rate) can exhibit satisfactory resistance to seal breakage and leakage, can exhibit uniform conformal layer deposition characteristics that help make the seal 22 insensitive to changes in shape and profile at the edge of the component 20, can exhibit satisfactory low boundary underweight and weight, can exhibit low stress and no air gap, and can help avoid overly complex manufacturing techniques while exhibiting the desired appearance.

[0059] According to one embodiment, an optical component is provided, the optical component comprising: a first glass layer and a second glass layer; a polymer layer located between the first glass layer and the second glass layer; and a seal formed of a barrier layer that hermetically seals the peripheral edge of the polymer layer, the barrier layer including a metal layer, and the barrier layer being attached to the first glass layer and the second glass layer.

[0060] According to another embodiment, the optical component includes a barrier layer attached to a first surface of the first glass layer and a second surface of the second glass layer, the seal includes an elastomeric buffer configured to support the barrier layer, and the metal layer has a first portion and a second portion, the first portion having a first edge and a second edge bonded to the first surface, and the second portion having a third edge bonded to the second surface and a fourth edge bonded to the second edge.

[0061] According to another embodiment, the metal layer is attached to a first surface of the first glass layer and to a second surface of the second glass layer.

[0062] According to another embodiment, the seal includes an adhesive that bonds the metal layer to the first surface and the second surface.

[0063] According to another embodiment, the seal includes a solder that bonds the metal layer to the first surface and the second surface.

[0064] According to another embodiment, the metal layer is welded to the first surface and the second surface using a welding section.

[0065] According to another embodiment, the barrier layer has a polymer substrate covered with the metal layer.

[0066] According to another embodiment, the seal includes an adhesive.

[0067] According to another embodiment, the adhesive bonds the metal layer to the first glass layer and the second glass layer.

[0068] According to another embodiment, the barrier layer includes a polymer layer, and the metal layer includes a plated metal layer located on the polymer layer.

[0069] According to another embodiment, the barrier layer includes a polymer layer coated with the metal layer, and the seal includes: a first metal strip located on a first surface of the first glass layer; a first solder that seals a first edge of the metal layer to the first metal strip; a second metal strip located on a second surface of the second glass layer; and a second solder that seals a second edge of the metal layer to the second metal strip.

[0070] According to another embodiment, the first glass layer and the second glass layer each have an outer surface and an opposing inner surface, and the inner surfaces of the first glass layer and the second glass layer face each other.

[0071] According to another embodiment, the barrier layer is bonded to the outer surface of the first glass layer and the outer surface of the second glass layer.

[0072] According to another embodiment, the barrier layer has a first edge bonded to the outer surface of the first glass layer and a second edge bonded to the peripheral edge surface of the second glass layer, and the peripheral edge surface extends between the inner surface and the outer surface of the second glass layer.

[0073] According to another embodiment, the barrier layer has opposing first and second surfaces, a first region of the first surface being bonded to the inner surface of the first glass layer, and a second region of the first surface being bonded to the inner surface of the second glass layer.

[0074] According to another embodiment, the metal layer is attached to the first glass layer and the second glass layer using the first sealing strip and the second sealing strip, each sealing strip comprising a substrate layer, a mesh embedded in an adhesive layer, and a metal layer located between the substrate layer and the adhesive layer.

[0075] According to another embodiment, the optical component includes metal strips located on the first glass layer and the second glass layer, and the metal mesh of the first sealing strip and the second sealing strip includes a solder coating that forms a solder joint with the metal strip.

[0076] According to one embodiment, an optical component is provided, the optical component comprising: a first glass layer and a second glass layer; a first polymer layer located between the first glass layer and the second glass layer; and a sealant formed along a peripheral edge of the first polymer layer, the sealant including a barrier layer having a second polymer layer coated with a barrier coating, the barrier layer having a first edge attached to the first glass layer and a second edge attached to the second glass layer.

[0077] According to another embodiment, the barrier coating includes a moisture-proof coating selected from the group consisting of: a metal thin film layer and an inorganic dielectric thin film layer.

[0078] According to one embodiment, an electronic device is provided, comprising: a support structure; an optical component supported by the support structure, the optical component having a first glass layer and a second glass layer, and having a polymer layer located between the first glass layer and the second glass layer; and an airtight seal formed along a peripheral edge of the optical component, the airtight seal including a first metal layer portion attached to the first glass layer and a second metal layer portion attached to the second glass layer, and forming a joint between the first metal layer portion and the second metal layer portion.

[0079] According to one embodiment, an optical component having a periphery and a center is provided, the optical component comprising: a first glass layer and a second glass layer; a polymer layer located between the first glass layer and the second glass layer; and an hermetically sealed element formed along the peripheral edge of the polymer layer, the hermetically sealed element comprising a barrier layer having a polymer film coated with a barrier coating, the barrier layer having a first edge attached to the first glass layer and a second edge attached to the second glass layer, an edge thickness at the periphery associated with a distance through the first glass layer, the second glass layer and the polymer layer, and a center thickness at the center associated with a distance through the first glass layer, the second glass layer and the polymer layer, the hermetically sealed element being configured such that, in a temperature range of 0°C to 45°C, the edge thickness exhibits a first thickness variation, the center thickness exhibits a second thickness variation, and the difference between the first thickness variation and the second thickness variation is less than 0.05%.

[0080] According to one embodiment, an optical component is provided, the optical component comprising: a first transparent layer and a second transparent layer; a polymer layer located between the first transparent layer and the second transparent layer; and a sealant that hermetically seals the peripheral edge of the polymer layer, the sealant comprising a first layer, a second layer and a third layer, the second layer located between the first layer and the third layer, the first layer comprising a polymer, the second layer comprising a barrier layer and comprising at least one inorganic material, and the third layer comprising a polymer.

[0081] According to another embodiment, the first layer includes a polymer layer selected from the group consisting of: an epoxy resin layer, an epoxy resin layer with embedded particles, an acrylic layer, and an acrylic layer with embedded particles.

[0082] According to another embodiment, the first layer has a coefficient of thermal expansion of less than 100 ppm.

[0083] According to another implementation, the first layer has an elastic modulus of 10MPa-2000MPa.

[0084] According to another embodiment, the first layer includes a polymer layer selected from the group consisting of silicone and acrylate.

[0085] According to another embodiment, the first layer has a first elastic modulus, and the third layer has a second elastic modulus that is less than the first elastic modulus.

[0086] According to another embodiment, the third layer has a coefficient of thermal expansion of less than 500 ppm.

[0087] According to another embodiment, the third layer has an elastic modulus of 0.1 MPa-100 MPa.

[0088] According to another embodiment, the second layer is a metal oxide or ceramic layer.

[0089] According to another embodiment, the second layer includes a first sublayer and a second sublayer, and the first sublayer and the second sublayer each include a material selected from the group consisting of metal oxides and ceramics.

[0090] According to another embodiment, the second layer includes a stack of multiple sublayer pairs, each sublayer pair having a first sublayer and a second sublayer.

[0091] According to another embodiment, each of the first sublayers comprises a metal oxide or a ceramic.

[0092] According to another embodiment, each of the second sublayers comprises a material selected from the group consisting of metal oxides, ceramics, and polymers.

[0093] According to another implementation, the second layer is thinner than the first and third layers.

[0094] According to another embodiment, the first layer, the second layer, and the third layer have a tapered profile.

[0095] According to another embodiment, the optical component includes a buffer located between the outer edge of the polymer layer and the first layer.

[0096] The foregoing is merely illustrative and various modifications can be made to the described implementation scheme. The aforementioned implementation scheme can be implemented independently or in any combination.

Claims

1. An optical component, the optical component comprising: First glass layer and second glass layer; A polymer layer, wherein the polymer layer is located between the first glass layer and the second glass layer; and A seal formed of a barrier layer that hermetically seals the outer edge of a polymer layer, wherein the barrier layer includes a metal layer, wherein the barrier layer is attached to a first glass layer and a second glass layer, and wherein the seal includes an elastomeric buffer configured to support the barrier layer.

2. The optical component of claim 1, wherein the blocking layer is attached to a first surface of the first glass layer and to a second surface of the second glass layer, wherein the metal layer includes a first portion having a first edge bonded to the first surface, wherein the first portion has a second edge, wherein the metal layer includes a second portion having a third edge bonded to the second surface, and wherein the second portion has a fourth edge bonded to the second edge.

3. The optical component of claim 1, wherein the metal layer is attached to a first surface of the first glass layer and to a second surface of the second glass layer.

4. The optical component of claim 3, wherein the seal comprises an adhesive for bonding the metal layer to the first surface and the second surface.

5. The optical component of claim 3, wherein the seal comprises solder bonding the metal layer to the first surface and the second surface.

6. The optical component of claim 3, wherein the metal layer is welded to the first surface and the second surface using a welding portion.

7. The optical component of claim 1, wherein the blocking layer has a polymer substrate covered with the metal layer.

8. The optical component of claim 7, wherein the seal comprises an adhesive for bonding the metal layer to the first glass layer and the second glass layer.

9. The optical component of claim 8, wherein the elastomeric buffer is inserted between the blocking layer and the polymer layer.

10. The optical component of claim 1, wherein the blocking layer comprises a polymer layer, and wherein the metal layer comprises a plated metal layer located on the polymer layer.

11. The optical component of claim 1, wherein the blocking layer comprises a polymer layer coated with the metal layer, and wherein the seal comprises: A first metal strip, the first metal strip being located on a first surface of the first glass layer; A first solder, the first solder sealing a first edge of the metal layer to the first metal strip; The second metal strip is located on the second surface of the second glass layer; and The second solder seals the second edge of the metal layer to the second metal strip.

12. The optical component of claim 1, wherein the first glass layer and the second glass layer each have an outer surface and an opposing inner surface, and wherein the inner surface of the first glass layer and the inner surface of the second glass layer face each other.

13. The optical component of claim 12, wherein the blocking layer is bonded to the outer surface of the first glass layer and the outer surface of the second glass layer.

14. The optical component of claim 12, wherein the blocking layer has a first edge bonded to the outer surface of the first glass layer and a second edge bonded to a peripheral edge surface of the second glass layer, and wherein the peripheral edge surface extends between the inner surface of the second glass layer and the outer surface of the second glass layer.

15. The optical component of claim 12, wherein the blocking layer has opposing first and second surfaces, wherein a first region of the first surface is bonded to the inner surface of the first glass layer, and wherein a second region of the first surface is bonded to the inner surface of the second glass layer.

16. The optical component of claim 1, wherein the metal layer is attached to the first glass layer and the second glass layer using a first sealing strip and a second sealing strip, wherein each sealing strip comprises a substrate layer, a mesh embedded in an adhesive layer, and a metal layer located between the substrate layer and the adhesive layer.

17. The optical component of claim 16, further comprising a metal strip located on the first glass layer and the second glass layer, wherein the metal mesh of the first sealing strip and the second sealing strip comprises a solder coating, the solder coating forming a solder joint with the metal strip.

18. An optical component, the optical component comprising: First glass layer and second glass layer; A first polymer layer is located between the first glass layer and the second glass layer; and A seal formed along the peripheral edge of a first polymer layer, wherein the seal includes a barrier layer having a second polymer layer coated with a barrier coating, wherein the barrier layer has a first edge attached to the first glass layer and a second edge attached to the second glass layer, and wherein the seal includes an elastomeric buffer configured to support the barrier layer.

19. The optical component of claim 18, wherein the barrier coating comprises a moisture-proof coating selected from the group consisting of: a metal thin film layer and an inorganic dielectric thin film layer.

20. An electronic device, the electronic device comprising: Support structure; An optical component supported by the support structure, wherein the optical component has a first glass layer and a second glass layer, and has a polymer layer located between the first glass layer and the second glass layer; and An airtight seal is formed along the peripheral edge of the optical component, wherein the airtight seal includes a first metal layer portion attached to a first glass layer and a second metal layer portion attached to a second glass layer, wherein a joint is formed between the first metal layer portion and the second metal layer portion, and wherein the airtight seal includes an elastomeric buffer configured to support the first metal layer portion and the second metal layer portion.

21. An optical component having a periphery and a center, the optical component comprising: First glass layer and second glass layer; A polymer layer, wherein the polymer layer is located between the first glass layer and the second glass layer; and An airtight seal is formed along the outer edge of the polymer layer. The seal includes a barrier layer having a polymer film coated with a barrier coating, wherein the barrier layer has a first edge attached to the first glass layer and a second edge attached to the second glass layer, wherein there is an edge thickness at the periphery associated with a distance through the first glass layer, the second glass layer, and the polymer layer, wherein there is a center thickness at the center associated with a distance through the first glass layer, the second glass layer, and the polymer layer, and wherein the hermetic seal is configured such that, in a temperature range of 0°C to 45°C, the edge thickness exhibits a first thickness variation, the center thickness exhibits a second thickness variation, and the difference between the first thickness variation and the second thickness variation is less than 0.05%.

22. An optical component, the optical component comprising: First transparent layer and second transparent layer; A polymer layer, wherein the polymer layer is located between the first transparent layer and the second transparent layer; A seal that hermetically seals the outer edge of the polymer layer, wherein the seal comprises a first layer, a second layer, and a third layer, wherein the second layer is located between the first layer and the third layer, wherein the first layer comprises a polymer, wherein the second layer comprises a barrier layer and comprises at least one inorganic material, and wherein the third layer comprises a polymer; and An elastomeric buffer is inserted between the outer edge of the polymer layer and the first layer.

23. The optical component of claim 22, wherein the first layer comprises a polymer layer selected from the group consisting of: an epoxy resin layer, an epoxy resin layer having embedded particles, an acrylic layer, and an acrylic layer having embedded particles.

24. The optical component of claim 22, wherein the first layer has a coefficient of thermal expansion of less than 100 ppm.

25. The optical component according to claim 22, wherein the first layer has an elastic modulus of 10 MPa-2000 MPa.

26. The optical component of claim 22, wherein the first layer comprises a polymer layer selected from the group consisting of silicone and acrylate.

27. The optical component of claim 22, wherein the first layer has a first elastic modulus, and wherein the third layer has a second elastic modulus less than the first elastic modulus.

28. The optical component of claim 22, wherein the third layer has a coefficient of thermal expansion of less than 500 ppm.

29. The optical component according to claim 22, wherein the third layer has an elastic modulus of 0.1 MPa to 100 MPa.

30. The optical component of claim 22, wherein the second layer is a metal oxide or ceramic layer.

31. The optical component of claim 22, wherein the second layer comprises a first sublayer and a second sublayer, and wherein each of the first sublayer and the second sublayer comprises a material selected from the group consisting of metal oxides and ceramics.

32. The optical component of claim 22, wherein the second layer comprises a stack of a plurality of sublayer pairs, each sublayer pair having a first sublayer and a second sublayer.

33. The optical component of claim 32, wherein each of the first sublayers comprises a metal oxide or a ceramic.

34. The optical component of claim 33, wherein each of the second sublayers comprises a material selected from the group consisting of metal oxides, ceramics, and polymers.

35. The optical component of claim 22, wherein the second layer is thinner than the first layer and the third layer.

36. The optical component of claim 22, wherein the first layer, the second layer and the third layer have a tapered profile.

37. The optical component of claim 22, wherein the second layer comprises a first sublayer and a second sublayer, wherein the first sublayer comprises a first material, and wherein the second sublayer comprises a second material different from the first material.

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