一种大尺寸碳化硅晶片抛光方法
By improving the design of the diamond dressing block and ceramic disk in the silicon carbide wafer polishing device, and combining it with segmented polishing parameters, the problems of reduced polishing rate and uneven quality in the polishing of large-size silicon carbide wafers were solved, achieving efficient and low-cost polishing processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JIANGXI ZHAO CHI SEMICON CO LTD
- Filing Date
- 2024-01-09
- Publication Date
- 2026-07-17
AI Technical Summary
Existing silicon carbide wafer polishing technology suffers from problems such as polishing pad deformation, decreased polishing rate, low equipment utilization, high material cost, frequent equipment failures, and uneven polishing quality, which are particularly pronounced in the processing of large-size wafers.
The design employs a distributed diamond dressing block and a single ceramic disc, combined with segmented polishing parameters, to improve the structure and process of the polishing device. This includes a ring-shaped distribution of diamond dressing blocks and ceramic uniform liquid blocks, reducing downtime for dressing and improving polishing efficiency and quality.
It improves the polishing removal rate, reduces polishing pad wear and material costs, shortens the production cycle, and enhances the consistency of polishing quality and equipment efficiency.
Smart Images
Figure CN118003235B_ABST