一种复合材料结构界面强化方法

By introducing interlayer links into composite material structures to form a mortise and tenon joint, the problem of weak interlayer interfaces is solved, improving interlayer performance and impact resistance. This method is applicable to interface strengthening of both homogeneous and heterogeneous materials.

CN118003664BActive Publication Date: 2026-07-17AEROSPACE RES INST OF MATERIAL & PROCESSING TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
Filing Date
2024-02-01
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Composite laminate structures have weak interlaminar properties, are prone to delamination, and have low impact damage tolerance. Existing toughening technologies suffer from complex processes and insufficient optimization of interface layup design.

Method used

By introducing interlayer links into the composite material structure to form an interlocking structure between the layers, optimizing the layer design and sequence, and using interlayer fiber/fabric links for bonding and locking, interface strengthening is achieved.

Benefits of technology

It improves the interlaminar properties of composite materials, slows crack propagation, and enhances resistance to impact damage and fatigue crack propagation. It is suitable for dissimilar material systems with large differences in material modulus.

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Abstract

本发明公开了一种复合材料结构界面强化方法,其中设有蒙皮的复合材料结构界面强化方法包括:完成蒙皮加强结构预浸料的铺放;将蒙皮铺层中第一层的预浸料带间隔铺放;在蒙皮加强结构预浸料表面铺放加强结构预浸料;将蒙皮铺层中第一层的预浸料带铺放于上述间隔处,直至蒙皮铺层第一层完全铺满;异种复合材料结构界面强化方法包括:完成第一种材料的第1~n‑1层铺层,将第n层的预浸料分切成预浸带,间隔铺放;将第二种材料第1层的预浸料分切成预浸带,铺放于上述间隔;将第一种材料第n层剩余的预浸带紧邻已铺放的预浸带铺放;将第二种材料第1层剩余的预浸带紧邻已铺放的预浸带铺放。本发明形成了铺层间的嵌合结构,能够有效提升复合材料的层间性能。
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